JP2008508739A - フリップチップ構造の電気素子 - Google Patents
フリップチップ構造の電気素子 Download PDFInfo
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- JP2008508739A JP2008508739A JP2007524192A JP2007524192A JP2008508739A JP 2008508739 A JP2008508739 A JP 2008508739A JP 2007524192 A JP2007524192 A JP 2007524192A JP 2007524192 A JP2007524192 A JP 2007524192A JP 2008508739 A JP2008508739 A JP 2008508739A
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10135—Alignment aids
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
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- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (15)
- 熱拡散係数αpを有する支持体基板(1)および該支持体基板上にバンプ(31〜34)を介して固定されたフリップチップ構造のチップ(2)を有する
電気素子において、
チップ(2)は第1の方向x1において熱拡散係数α1を有し、ここで第1の拡散差はΔα1=|αp−α1|であり、さらに第2の方向x2において熱拡散係数α2を有し、ここで第2の拡散差はΔα2=|αp−α2|であり、素子は第1の方向x1に最大拡散差Δα1を有し、第2の方向x2に最小拡散差Δα2を有し、Δx1は第1の方向x1の各端部バンプ(31,32)の中心(310,320)の接続線(41)を平行に延在するx1軸線上に正射影したものに相応する第1の距離であり、Δx2は第2の方向x2の各端部バンプ(33,34)の中心(330,340)の接続線(42)を平行に延在するx2軸線上に正射影したものに相応する第2の距離であり、各バンプはΔx1<Δx2が相当するように配置されている
ことを特徴とする電気素子。 - Δα2=0,Δα1>0が相当する、請求項1記載の素子。
- 各バンプ(31〜34)は第2の方向x2に沿った1個のバンプ列として配置されており、Δx1=0である、請求項2記載の素子。
- バンプ列は第1の方向x1で見てチップ下方面の中央に配置されている、請求項3記載の素子。
- チップ(2)は支持体基板(1)に対して第1の方向x1で安定化されており、チップ下方面は支持体基板(1)の表面に対してほぼ平行に延在する、請求項3または4記載の素子。
- チップ(2)と支持体基板(1)とのあいだにスペーサ(81,82)が設けられている、請求項5記載の素子。
- スペーサ(81,82)は第1の方向x1に沿ってチップ(2)の縁領域(21,22)に配置されている、請求項6記載の素子。
- 支持体基板(1)の材料はα1≧αp≧α2が相当するように選定されている、請求項1記載の素子。
- 支持体基板(1)の材料は基本材料および混合される充填物質であり、混合物の熱拡散係数は基本材料の熱拡散係数よりも大きい、請求項8記載の素子。
- 少なくとも2つのバンプ(31,32)は第1の方向x1に沿った線上に配置されている、請求項1,2,8または9記載の素子。
- 少なくとも2つのバンプ(31,33)は第2の方向x2に沿った線上に配置されている、請求項1,2,8または9記載の素子。
- チップ下方面は中央領域と縁領域(21,22)とに分割されており、各縁領域(21,22)の幅(c)はバンプの断面積を上回り、ここでチップ(2)は縁領域にバンプを有さない、請求項1から11までのいずれか1項記載の素子。
- チップ(2)は第1の方向x1で中央領域と縁領域(21,22)とに分割されており、各縁領域(21,22)の幅(c)はバンプの断面積を上回り、ここでチップ(2)は縁領域にはバンプを有さない、請求項1から11までのいずれか1項記載の素子。
- 各縁領域(21,22)の幅(c)はバンプの断面積を少なくとも係数2だけ上回る、請求項12または13記載の素子。
- チップ下方面には各バンプ(31〜36)に固定に接続されたコンタクト面(91〜96)が設けられており、ここで端部バンプ(31〜34)に対しては大きなコンタクト面(91〜94)が設けられており、通常のバンプ(35,36)に対しては小さなコンタクト面が設けられている、請求項1から14までのいずれか1項記載の素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004037817.7A DE102004037817B4 (de) | 2004-08-04 | 2004-08-04 | Elektrisches Bauelement in Flip-Chip-Bauweise |
PCT/EP2005/006165 WO2006015642A2 (de) | 2004-08-04 | 2005-06-08 | Elektrisches bauelement in flip-chip-bauweise |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008508739A true JP2008508739A (ja) | 2008-03-21 |
Family
ID=34971557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007524192A Pending JP2008508739A (ja) | 2004-08-04 | 2005-06-08 | フリップチップ構造の電気素子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7518249B2 (ja) |
JP (1) | JP2008508739A (ja) |
KR (1) | KR101148542B1 (ja) |
DE (1) | DE102004037817B4 (ja) |
WO (1) | WO2006015642A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013123020A (ja) * | 2011-12-12 | 2013-06-20 | Samsung Yokohama Research Institute Co Ltd | バンプ付きicチップの回路基板上への実装装置及び実装方法 |
JP2019054067A (ja) * | 2017-09-13 | 2019-04-04 | 太陽誘電株式会社 | 電子部品 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10301934A1 (de) * | 2003-01-20 | 2004-07-29 | Epcos Ag | Elektrisches Bauelement mit verringerter Substratfläche |
US7608789B2 (en) * | 2004-08-12 | 2009-10-27 | Epcos Ag | Component arrangement provided with a carrier substrate |
DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
DE102005053765B4 (de) * | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
US7858438B2 (en) * | 2007-06-13 | 2010-12-28 | Himax Technologies Limited | Semiconductor device, chip package and method of fabricating the same |
DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
TWI681524B (zh) * | 2017-01-27 | 2020-01-01 | 日商村田製作所股份有限公司 | 半導體晶片 |
US11244876B2 (en) | 2019-10-09 | 2022-02-08 | Microchip Technology Inc. | Packaged semiconductor die with micro-cavity |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000070671A1 (en) * | 1999-05-17 | 2000-11-23 | Telefonaktiebolaget Lm Ericsson | Mounting arrangement for a semiconductor element |
JP2002124848A (ja) * | 2000-10-17 | 2002-04-26 | Tdk Corp | 表面弾性波素子、電子部品及びその搭載方法 |
JP2002299996A (ja) * | 2001-03-30 | 2002-10-11 | Kyocera Corp | 電子部品装置 |
JP2002344284A (ja) * | 2001-03-14 | 2002-11-29 | Murata Mfg Co Ltd | 弾性表面波装置、および、これを搭載した通信装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000114916A (ja) * | 1998-09-29 | 2000-04-21 | Nec Corp | 表面弾性波デバイス及びその製造方法 |
US6225206B1 (en) * | 1999-05-10 | 2001-05-01 | International Business Machines Corporation | Flip chip C4 extension structure and process |
JP2001267881A (ja) * | 2000-03-17 | 2001-09-28 | Fujitsu Media Device Kk | 弾性表面波デバイス及びこれを用いた通信装置、並びにアンテナデュプレクサ |
US6914332B2 (en) | 2002-01-25 | 2005-07-05 | Texas Instruments Incorporated | Flip-chip without bumps and polymer for board assembly |
-
2004
- 2004-08-04 DE DE102004037817.7A patent/DE102004037817B4/de not_active Expired - Fee Related
-
2005
- 2005-06-08 JP JP2007524192A patent/JP2008508739A/ja active Pending
- 2005-06-08 KR KR1020077002497A patent/KR101148542B1/ko not_active IP Right Cessation
- 2005-06-08 US US11/659,146 patent/US7518249B2/en not_active Expired - Fee Related
- 2005-06-08 WO PCT/EP2005/006165 patent/WO2006015642A2/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000070671A1 (en) * | 1999-05-17 | 2000-11-23 | Telefonaktiebolaget Lm Ericsson | Mounting arrangement for a semiconductor element |
JP2002124848A (ja) * | 2000-10-17 | 2002-04-26 | Tdk Corp | 表面弾性波素子、電子部品及びその搭載方法 |
JP2002344284A (ja) * | 2001-03-14 | 2002-11-29 | Murata Mfg Co Ltd | 弾性表面波装置、および、これを搭載した通信装置 |
JP2002299996A (ja) * | 2001-03-30 | 2002-10-11 | Kyocera Corp | 電子部品装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013123020A (ja) * | 2011-12-12 | 2013-06-20 | Samsung Yokohama Research Institute Co Ltd | バンプ付きicチップの回路基板上への実装装置及び実装方法 |
JP2019054067A (ja) * | 2017-09-13 | 2019-04-04 | 太陽誘電株式会社 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US7518249B2 (en) | 2009-04-14 |
WO2006015642A3 (de) | 2006-09-08 |
DE102004037817A1 (de) | 2006-03-16 |
WO2006015642A2 (de) | 2006-02-16 |
US20080048317A1 (en) | 2008-02-28 |
KR20070040382A (ko) | 2007-04-16 |
KR101148542B1 (ko) | 2012-05-29 |
DE102004037817B4 (de) | 2014-08-07 |
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