JP2008307724A - ラミネート装置 - Google Patents
ラミネート装置 Download PDFInfo
- Publication number
- JP2008307724A JP2008307724A JP2007155801A JP2007155801A JP2008307724A JP 2008307724 A JP2008307724 A JP 2008307724A JP 2007155801 A JP2007155801 A JP 2007155801A JP 2007155801 A JP2007155801 A JP 2007155801A JP 2008307724 A JP2008307724 A JP 2008307724A
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- upper chamber
- chamber
- clamp
- laminating apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010030 laminating Methods 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 10
- 239000000945 filler Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/18—Surface bonding means and/or assembly means with handle or handgrip
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Reciprocating Pumps (AREA)
- Bipolar Transistors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 本発明のラミネート装置100は、下面にダイヤフラム140を取り付けた上チャンバ110と、上チャンバ110が重ねられ、ラミネート加工される被加工物Aが載置される支持台130を内部に備えた下チャンバ120と、を有するラミネート装置において、前記ダイヤフラム140を上チャンバより大きくして、上チャンバからはみ出た部分を折り曲げ、折り曲げた部分を複数のクランプで上チャンバの側面に押圧することで前記ダイヤフラムを前記上チャンバに固定した。
【選択図】 図2
Description
110 上チャンバ
112 側面
113 下面
120 下チャンバ
130 支持台
140 ダイヤフラム
160 クランプ
Claims (4)
- 下面にダイヤフラムを取り付けた上チャンバと、該上チャンバが重ねられ、ラミネート加工される被加工物が載置される支持台を内部に備えた下チャンバと、を有するラミネート装置において、前記ダイヤフラムを上チャンバより大きくして、上チャンバからはみ出た部分を折り曲げ、折り曲げた部分を複数のクランプで前記上チャンバの側面に押圧することで前記ダイヤフラムを前記上チャンバに固定したことを特徴とするラミネート装置。
- 前記クランプが操作レバーを有し、該操作レバーを操作することで、ワンタッチで、クランプ状態とアンクランプ状態とに切替可能であることを特徴とする請求項1に記載のラミネート装置。
- 前記上チャンバが矩形で、前記クランプが矩形の対向する長辺にのみ設けられていることを特徴とする請求項1又は2に記載のラミネート装置。
- 請求項1から3のいずれかに記載のラミネート装置において、前記ダイヤフラムの上チャンバからはみ出た部分を折り曲げ、折り曲げた部分を複数のクランプで前記チャンバの側面に押圧する際に、前記クランプと前記ダイヤフラムの間に板材を挿入することを特徴とするラミネート装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007155801A JP2008307724A (ja) | 2007-06-13 | 2007-06-13 | ラミネート装置 |
US12/155,493 US7726375B2 (en) | 2007-06-13 | 2008-06-05 | Laminator |
KR1020080054015A KR20080109628A (ko) | 2007-06-13 | 2008-06-10 | 라미네이트장치 |
TW097121801A TW200908362A (en) | 2007-06-13 | 2008-06-11 | Laminator |
EP08158174A EP2014454B1 (en) | 2007-06-13 | 2008-06-12 | Laminator |
DE602008005673T DE602008005673D1 (de) | 2007-06-13 | 2008-06-12 | Beschichter |
AT08158174T ATE502763T1 (de) | 2007-06-13 | 2008-06-12 | Beschichter |
ES08158174T ES2363742T3 (es) | 2007-06-13 | 2008-06-12 | Laminador. |
CNA2008101254461A CN101323196A (zh) | 2007-06-13 | 2008-06-13 | 层叠装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007155801A JP2008307724A (ja) | 2007-06-13 | 2007-06-13 | ラミネート装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008307724A true JP2008307724A (ja) | 2008-12-25 |
Family
ID=39744766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007155801A Pending JP2008307724A (ja) | 2007-06-13 | 2007-06-13 | ラミネート装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7726375B2 (ja) |
EP (1) | EP2014454B1 (ja) |
JP (1) | JP2008307724A (ja) |
KR (1) | KR20080109628A (ja) |
CN (1) | CN101323196A (ja) |
AT (1) | ATE502763T1 (ja) |
DE (1) | DE602008005673D1 (ja) |
ES (1) | ES2363742T3 (ja) |
TW (1) | TW200908362A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010052387A (ja) * | 2008-08-29 | 2010-03-11 | Npc Inc | ラミネート装置とラミネート装置におけるダイヤフラムの取り付け方法 |
CN102069627A (zh) * | 2010-11-14 | 2011-05-25 | 嘉友联精密机械工程(无锡)有限公司 | 太阳能电池组件全自动层压机 |
JP2015188107A (ja) * | 2008-01-18 | 2015-10-29 | ロックウェル・コリンズ・インコーポレーテッド | 基板積層システムおよび方法 |
JP2021017030A (ja) * | 2019-07-23 | 2021-02-15 | 新光エンジニアリング株式会社 | ワーク貼合装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011019886A1 (en) | 2009-08-13 | 2011-02-17 | Dow Global Technologies, Inc. | A multi-layer laminate structure and manufacturing method |
KR101146916B1 (ko) * | 2010-09-17 | 2012-05-23 | (주)와이에스썸텍 | 다이어프램 설치를 위한 라미네이트 장치 |
EP2652799A2 (en) | 2010-12-17 | 2013-10-23 | Dow Global Technologies LLC | Improved photovoltaic device |
CN102179987A (zh) * | 2011-03-04 | 2011-09-14 | 浙江长兴亚金机械有限公司 | 一种太阳能层压机密封结构 |
CN105015130B (zh) * | 2015-08-04 | 2019-04-02 | 四川杰邦科技有限公司 | 一种正负压真空覆膜机 |
KR102215257B1 (ko) * | 2020-09-11 | 2021-02-15 | 한화솔루션 주식회사 | 태양전지모듈 라미네이팅 공정을 위한 다이어프램 시트 및 이를 포함하는 라미네이팅 장치 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3017273A1 (de) * | 1980-05-06 | 1981-11-12 | Helmut Friz Gmbh & Co, 7102 Weinsberg | Membranformpresse |
JPH0531743A (ja) * | 1991-08-02 | 1993-02-09 | Dainippon Printing Co Ltd | 真空プレス積層成形方法および装置 |
JPH05293895A (ja) * | 1992-04-20 | 1993-11-09 | Dainippon Printing Co Ltd | 真空プレス積層成形装置及び方法 |
JPH05293896A (ja) * | 1992-04-20 | 1993-11-09 | Dainippon Printing Co Ltd | 真空プレス積層成形装置 |
JP3025078U (ja) * | 1995-11-22 | 1996-06-07 | 博 村上 | 掴み搬送装置 |
JPH091664A (ja) * | 1995-06-19 | 1997-01-07 | Gr Syst | 互いに重ね合わされた熱可塑性シート材を接合する装置及び方法 |
JP2000254852A (ja) * | 1999-03-08 | 2000-09-19 | Ryobi Ltd | サンダーのクランプ装置 |
JP2002347115A (ja) * | 2001-05-22 | 2002-12-04 | Nisshinbo Ind Inc | ラミネート装置におけるダイヤフラムの取付方法とこの方法を用いたラミネート装置 |
JP2007054888A (ja) * | 2005-07-04 | 2007-03-08 | Meier Vakuumtechnik Gmbh | メンブランプレス |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2575734A (en) | 1947-12-30 | 1951-11-20 | Westinghouse Electric Corp | Press |
JPS5810182B2 (ja) | 1979-06-04 | 1983-02-24 | 日立精機株式会社 | 工具交換装置付工作機械 |
DE3322877A1 (de) | 1983-06-24 | 1985-01-10 | Maho Werkzeugmaschinenbau Babel & Co, 8962 Pfronten | Bearbeitungszentrum fuer fraes- und bohrarbeiten |
JPS62176723A (ja) | 1986-01-30 | 1987-08-03 | Yamazaki Mazak Corp | フレキシブル工具マガジン |
DE3607391A1 (de) | 1986-03-06 | 1987-09-10 | Maho Ag | Werkzeugwagen zur beschickung von werkzeugmaschinen |
US4699276A (en) | 1986-07-31 | 1987-10-13 | Kearney & Trecker Corporation | Chain-type tool storage magazine |
JPH0337201A (ja) | 1989-07-04 | 1991-02-18 | Sekisui Plastics Co Ltd | アクリル系弾性微粒子の製造方法 |
JPH09141743A (ja) | 1995-11-24 | 1997-06-03 | N P C:Kk | ラミネート装置 |
JP3037201U (ja) | 1996-10-25 | 1997-05-16 | 株式会社エヌ・ピー・シー | ラミネート装置 |
JP3655076B2 (ja) | 1998-01-07 | 2005-06-02 | 株式会社エヌ・ピー・シー | ラミネート装置 |
DE10163294B4 (de) | 2001-12-21 | 2010-09-09 | Deckel Maho Geretsried Gmbh | Werkzeugwechselsystem für programmgesteuerte Fräs- und Bohrmaschinen |
JP3964851B2 (ja) | 2003-10-21 | 2007-08-22 | ヤマザキマザック株式会社 | 横形マシニングセンタ |
US7488242B2 (en) * | 2005-03-14 | 2009-02-10 | Allway Tools, Inc. | Sanding apparatus with molded elastomeric pad |
JP2007155801A (ja) | 2005-11-30 | 2007-06-21 | Mitsumi Electric Co Ltd | カメラモジュール |
-
2007
- 2007-06-13 JP JP2007155801A patent/JP2008307724A/ja active Pending
-
2008
- 2008-06-05 US US12/155,493 patent/US7726375B2/en not_active Expired - Fee Related
- 2008-06-10 KR KR1020080054015A patent/KR20080109628A/ko not_active Application Discontinuation
- 2008-06-11 TW TW097121801A patent/TW200908362A/zh unknown
- 2008-06-12 ES ES08158174T patent/ES2363742T3/es active Active
- 2008-06-12 EP EP08158174A patent/EP2014454B1/en not_active Not-in-force
- 2008-06-12 AT AT08158174T patent/ATE502763T1/de not_active IP Right Cessation
- 2008-06-12 DE DE602008005673T patent/DE602008005673D1/de active Active
- 2008-06-13 CN CNA2008101254461A patent/CN101323196A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3017273A1 (de) * | 1980-05-06 | 1981-11-12 | Helmut Friz Gmbh & Co, 7102 Weinsberg | Membranformpresse |
JPH0531743A (ja) * | 1991-08-02 | 1993-02-09 | Dainippon Printing Co Ltd | 真空プレス積層成形方法および装置 |
JPH05293895A (ja) * | 1992-04-20 | 1993-11-09 | Dainippon Printing Co Ltd | 真空プレス積層成形装置及び方法 |
JPH05293896A (ja) * | 1992-04-20 | 1993-11-09 | Dainippon Printing Co Ltd | 真空プレス積層成形装置 |
JPH091664A (ja) * | 1995-06-19 | 1997-01-07 | Gr Syst | 互いに重ね合わされた熱可塑性シート材を接合する装置及び方法 |
JP3025078U (ja) * | 1995-11-22 | 1996-06-07 | 博 村上 | 掴み搬送装置 |
JP2000254852A (ja) * | 1999-03-08 | 2000-09-19 | Ryobi Ltd | サンダーのクランプ装置 |
JP2002347115A (ja) * | 2001-05-22 | 2002-12-04 | Nisshinbo Ind Inc | ラミネート装置におけるダイヤフラムの取付方法とこの方法を用いたラミネート装置 |
JP2007054888A (ja) * | 2005-07-04 | 2007-03-08 | Meier Vakuumtechnik Gmbh | メンブランプレス |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015188107A (ja) * | 2008-01-18 | 2015-10-29 | ロックウェル・コリンズ・インコーポレーテッド | 基板積層システムおよび方法 |
JP2010052387A (ja) * | 2008-08-29 | 2010-03-11 | Npc Inc | ラミネート装置とラミネート装置におけるダイヤフラムの取り付け方法 |
CN102069627A (zh) * | 2010-11-14 | 2011-05-25 | 嘉友联精密机械工程(无锡)有限公司 | 太阳能电池组件全自动层压机 |
JP2021017030A (ja) * | 2019-07-23 | 2021-02-15 | 新光エンジニアリング株式会社 | ワーク貼合装置 |
JP7341457B2 (ja) | 2019-07-23 | 2023-09-11 | 新光エンジニアリング株式会社 | ワーク貼合装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20080109628A (ko) | 2008-12-17 |
US20090000747A1 (en) | 2009-01-01 |
ATE502763T1 (de) | 2011-04-15 |
ES2363742T3 (es) | 2011-08-12 |
US7726375B2 (en) | 2010-06-01 |
CN101323196A (zh) | 2008-12-17 |
TW200908362A (en) | 2009-02-16 |
DE602008005673D1 (de) | 2011-05-05 |
EP2014454B1 (en) | 2011-03-23 |
EP2014454A1 (en) | 2009-01-14 |
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