JP2008304266A - プローブピン - Google Patents
プローブピン Download PDFInfo
- Publication number
- JP2008304266A JP2008304266A JP2007150737A JP2007150737A JP2008304266A JP 2008304266 A JP2008304266 A JP 2008304266A JP 2007150737 A JP2007150737 A JP 2007150737A JP 2007150737 A JP2007150737 A JP 2007150737A JP 2008304266 A JP2008304266 A JP 2008304266A
- Authority
- JP
- Japan
- Prior art keywords
- hardness
- probe pin
- concentration
- heat treatment
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 28
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 229910052737 gold Inorganic materials 0.000 claims abstract description 7
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 238000004881 precipitation hardening Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 24
- 239000000956 alloy Substances 0.000 abstract description 14
- 229910045601 alloy Inorganic materials 0.000 abstract description 9
- 230000003647 oxidation Effects 0.000 abstract description 8
- 238000007254 oxidation reaction Methods 0.000 abstract description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 13
- 239000010931 gold Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007542 hardness measurement Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】本発明は、Au、Ag、Pd、Cuからなり、Au濃度:40〜55重量%、Ag濃度:15〜30重量%、及び、PdとCuとの合計濃度:15〜40重量%であるプローブピン用の材料である。この材料は、更に、Ni、Zn、Coの少なくともいずれか1つの元素を0.6〜5重量%含むことができる。また、これらの合金は、300〜500℃で加熱することにより析出硬化させることができ、より硬度の高い材料とすることができる。
【選択図】 図1
Description
Claims (4)
- Au、Ag、Pd、Cuからなり、Au濃度:40〜55重量%、Ag濃度:15〜30重量%、及び、PdとCuとの合計濃度:15〜40重量%であるプローブピン用の材料。
- 更に、Ni、Zn、Coの少なくともいずれか1つの元素を0.6〜5重量%含む請求項1記載のプローブピン用の材料。
- 請求項1又は請求項2記載の材料を、300〜500℃で加熱することにより析出硬化させてなるプローブピン用の材料。
- 請求項1〜請求項3のいずれか1項に記載の材料からなるプローブピン。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150737A JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
EP08765081A EP2159581B1 (en) | 2007-06-06 | 2008-06-04 | Method of manufacturing probe pins |
CN2008800191603A CN101715559B (zh) | 2007-06-06 | 2008-06-04 | 探针 |
KR1020097025628A KR101323027B1 (ko) | 2007-06-06 | 2008-06-04 | 프루브 핀 |
PCT/JP2008/060268 WO2008149886A1 (ja) | 2007-06-06 | 2008-06-04 | プローブピン用材料 |
US12/602,899 US8310254B2 (en) | 2007-06-06 | 2008-06-04 | Probe pin |
TW097120907A TWI375801B (en) | 2007-06-06 | 2008-06-05 | Probe pin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007150737A JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP4176133B1 JP4176133B1 (ja) | 2008-11-05 |
JP2008304266A true JP2008304266A (ja) | 2008-12-18 |
Family
ID=40056068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007150737A Expired - Fee Related JP4176133B1 (ja) | 2007-06-06 | 2007-06-06 | プローブピン |
Country Status (7)
Country | Link |
---|---|
US (1) | US8310254B2 (ja) |
EP (1) | EP2159581B1 (ja) |
JP (1) | JP4176133B1 (ja) |
KR (1) | KR101323027B1 (ja) |
CN (1) | CN101715559B (ja) |
TW (1) | TWI375801B (ja) |
WO (1) | WO2008149886A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011158329A (ja) * | 2010-01-29 | 2011-08-18 | Citizen Tohoku Kk | コンタクトプローブ及びこれを用いた電子回路試験装置 |
JP4878401B1 (ja) * | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | プローブピン用材料、プローブピン及びその製造方法 |
WO2012077378A1 (ja) * | 2010-12-09 | 2012-06-14 | 株式会社徳力本店 | 電気・電子用材 |
KR101260135B1 (ko) * | 2009-05-29 | 2013-05-02 | 다나카 기킨조쿠 고교 가부시키가이샤 | 접촉저항, 방오특성이 우수한 프로브 핀 |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013101043A (ja) * | 2011-11-08 | 2013-05-23 | Renesas Electronics Corp | 半導体装置の製造方法 |
MY184937A (en) | 2012-08-03 | 2021-04-30 | Yamamoto Precious Metal Co Ltd | Alloy material, contact probe, and connection terminal |
MY190360A (en) | 2012-11-30 | 2022-04-17 | Honda Motor Co Ltd | Additional light structure of projector light assembly for motorcycle |
JP6372952B2 (ja) * | 2013-10-25 | 2018-08-15 | 石福金属興業株式会社 | Pt基合金で構成されるプローブピン用材料、プローブピンの製造方法 |
TWI787302B (zh) * | 2017-07-10 | 2022-12-21 | 日商聯合精密科技股份有限公司 | 一種二元銅銀合金體的製造方法、觸頭引腳以及使用二元銅銀合金的裝置 |
JP6850365B2 (ja) * | 2017-12-27 | 2021-03-31 | 株式会社徳力本店 | 析出硬化型Ag−Pd−Cu−In−B系合金 |
JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ag-Pd-Cu系合金からなるプローブピン用材料 |
EP4325227A1 (de) * | 2022-08-16 | 2024-02-21 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
CN117310234B (zh) * | 2023-11-30 | 2024-03-01 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试用钯合金探针套筒及其制造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767391A (en) * | 1969-05-19 | 1973-10-23 | Pennwalt Corp | Tarnish resistant alloy |
SE368050B (ja) | 1972-08-25 | 1974-06-17 | Electrolux Ab | |
US5378971A (en) * | 1990-11-30 | 1995-01-03 | Tokyo Electron Limited | Probe and a method of manufacturing the same |
JPH05154719A (ja) * | 1991-11-29 | 1993-06-22 | Tanaka Kikinzoku Kogyo Kk | プローブピンの製造装置 |
JP3090389B2 (ja) * | 1993-11-24 | 2000-09-18 | 田中貴金属工業株式会社 | マルチワイヤープローブの製造方法 |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
US5919320A (en) * | 1997-11-17 | 1999-07-06 | Leach & Garner Company | Nickel-free white gold alloy with reversible hardness characteristics |
CN1073637C (zh) * | 1998-03-04 | 2001-10-24 | 贵研铂业股份有限公司 | 电接触材料金基合金 |
DE69930291T2 (de) * | 1999-02-22 | 2006-12-21 | Nippon Steel Corp. | Hochfestes feuerverzinktes Stahlblech mit ausgezeichneter Plattierungshaftung und Preßformbarkeit sowie Verfahren zu seiner Herstellung |
AU2001264297A1 (en) * | 2000-06-16 | 2001-12-24 | Nhk Spring Co. Ltd. | Microcontactor probe and electric probe unit |
WO2003031668A1 (fr) * | 2001-10-09 | 2003-04-17 | Kabushiki Kaisha Toshiba | Fil de tungstene, element de chauffage de cathode et filament pour lampe anti-vibrations |
JP2004093355A (ja) | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd合金系プローブピンおよびそれを用いたプローブピン装置 |
JP2004179327A (ja) * | 2002-11-26 | 2004-06-24 | Sharp Corp | 半導体用合金材料、該合金材料を用いた半導体チップ及びその製造方法 |
US7135078B1 (en) * | 2005-12-05 | 2006-11-14 | Leach & Garner Company | Nickel-free white gold alloy compositions with reversible hardness characteristics |
-
2007
- 2007-06-06 JP JP2007150737A patent/JP4176133B1/ja not_active Expired - Fee Related
-
2008
- 2008-06-04 KR KR1020097025628A patent/KR101323027B1/ko active IP Right Grant
- 2008-06-04 EP EP08765081A patent/EP2159581B1/en not_active Not-in-force
- 2008-06-04 US US12/602,899 patent/US8310254B2/en active Active
- 2008-06-04 CN CN2008800191603A patent/CN101715559B/zh not_active Expired - Fee Related
- 2008-06-04 WO PCT/JP2008/060268 patent/WO2008149886A1/ja active Application Filing
- 2008-06-05 TW TW097120907A patent/TWI375801B/zh active
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101260135B1 (ko) * | 2009-05-29 | 2013-05-02 | 다나카 기킨조쿠 고교 가부시키가이샤 | 접촉저항, 방오특성이 우수한 프로브 핀 |
US8591805B2 (en) * | 2009-05-29 | 2013-11-26 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy having excellent contact resistance and antifouling property and suitable for use in probe pin |
JP2011158329A (ja) * | 2010-01-29 | 2011-08-18 | Citizen Tohoku Kk | コンタクトプローブ及びこれを用いた電子回路試験装置 |
WO2012077378A1 (ja) * | 2010-12-09 | 2012-06-14 | 株式会社徳力本店 | 電気・電子用材 |
JP4878401B1 (ja) * | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | プローブピン用材料、プローブピン及びその製造方法 |
WO2014049874A1 (ja) * | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
JPWO2014049874A1 (ja) * | 2012-09-28 | 2016-08-22 | 株式会社徳力本店 | 電気・電子機器用途のAg‐Pd‐Cu‐Co合金 |
Also Published As
Publication number | Publication date |
---|---|
TWI375801B (en) | 2012-11-01 |
EP2159581B1 (en) | 2012-10-31 |
CN101715559A (zh) | 2010-05-26 |
WO2008149886A1 (ja) | 2008-12-11 |
EP2159581A4 (en) | 2011-06-29 |
CN101715559B (zh) | 2012-09-26 |
JP4176133B1 (ja) | 2008-11-05 |
TW200916788A (en) | 2009-04-16 |
US8310254B2 (en) | 2012-11-13 |
KR20100010506A (ko) | 2010-02-01 |
US20100176833A1 (en) | 2010-07-15 |
KR101323027B1 (ko) | 2013-10-29 |
EP2159581A1 (en) | 2010-03-03 |
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