JP2008270521A - 電界効果トランジスタ - Google Patents
電界効果トランジスタ Download PDFInfo
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- JP2008270521A JP2008270521A JP2007111451A JP2007111451A JP2008270521A JP 2008270521 A JP2008270521 A JP 2008270521A JP 2007111451 A JP2007111451 A JP 2007111451A JP 2007111451 A JP2007111451 A JP 2007111451A JP 2008270521 A JP2008270521 A JP 2008270521A
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- 230000005669 field effect Effects 0.000 title claims abstract description 67
- 239000004065 semiconductor Substances 0.000 claims abstract description 47
- 150000004767 nitrides Chemical class 0.000 claims abstract description 41
- 230000000694 effects Effects 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 3
- 229910004140 HfO Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 14
- 229910004541 SiN Inorganic materials 0.000 claims 1
- 230000005684 electric field Effects 0.000 claims 1
- 239000002356 single layer Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 19
- 229910021140 PdSi Inorganic materials 0.000 abstract description 12
- 229910002704 AlGaN Inorganic materials 0.000 description 67
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000002955 isolation Methods 0.000 description 14
- 229910052594 sapphire Inorganic materials 0.000 description 13
- 239000010980 sapphire Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 230000005533 two-dimensional electron gas Effects 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000002269 spontaneous effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910007991 Si-N Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H01L29/2003—Nitride compounds
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- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
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- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
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- Junction Field-Effect Transistors (AREA)
Abstract
【解決手段】基板上に(1 1 -2 0)面を主面とするアンドープのGaNが3mm、その上に、AlNが1nm、n型Al0.25Ga0.75Nが25nm、n型GaNが50nm形成されている。n型GaN上にTi/Alソース・ドレイン電極が形成され、ソース電極とドレイン電極の間にn型Al0.25Ga0.75Nの一部が露出した凹部が形成されている。この凹部の上に絶縁膜が形成され、絶縁膜に接する形でゲート電極としてPdSiが形成されている。このような構造にすることにより、ゲートリーク電流が小さいノーマリオフ型の窒化物半導体電界効果トランジスタを作製できる。
【選択図】図1
Description
以下、本発明の第1の実施形態おける電界効果トランジスタについて図面を参照しながら説明する。以下特に断りのない限りa面は(1 1 -2 0)面、r面は(1 -1 0 2)面、c面は(0 0 0 1)面に相当するものとする。
図1に示す電界効果トランジスタを作製する方法として、さらに以下に示す製造方法が考えられる。
102 a面AlNバッファ層
103 a面GaN層
104 a面AlN層
105 a面n型AlGaN層
106 a面n型GaNキャップ層
107 SiN膜
108 PdSi電極
109 Ti/Al電極
110 素子分離層
701 サファイアr面基板
702 a面AlNバッファ層
703 a面GaN層
704 a面AlN層
705 a面n型AlGaN層
706 a面n型GaNキャップ層
707 SiN膜
708 PdSi電極
709 Ti/Al電極
710 素子分離層
801 サファイアr面基板
802 a面AlNバッファ層
803 a面GaN層
804 a面AlN層
805 a面n型AlGaN層
806 a面n型GaNキャップ層
807 SiN膜
808 PdSi電極
809 Ti/Al電極
810 素子分離層
811 SiO2膜
Claims (7)
- (0 0 0 1)面に垂直あるいは傾斜して位置する面方位を主面として形成される第1の窒化物半導体層と、
その上に形成された前記第1の窒化物半導体層よりバンドギャップの大きい第2の窒化物半導体層と、
その上に形成された第3の窒化物半導体層と、
前記第2あるいは第3の窒化物半導体層の少なくとも一部に接する形で形成されたソース電極及びドレイン電極と、
前記ソース電極とドレイン電極との間に前記第2の窒化物半導体層の表面の一部が露出される形で形成された凹部と、
前記凹部の上方に形成されたゲート電極と、
前記ゲート電極と前記凹部の間に位置する形で絶縁膜を備えることを特徴とする電界効果トランジスタ。 - 前記第2の窒化物半導体層あるいは前記第3の窒化物半導体層あるいはその両方にn型を供する不純物が添加されていることを特徴とする請求項1記載の電界効果トランジスタ。
- 前記絶縁膜が前記ソース電極及びドレイン電極の表面を覆う形で形成されていることを特徴とする請求項1記載の電界効果トランジスタ。
- 前記電界効果トランジスタがノーマリオフ特性を有することを特徴とする請求項1記載の電界効果トランジスタ。
- 前記絶縁膜はSiN、SiO2、Al2O3、HfO2、AlNのいずれかよりなる単層膜あるいは多層膜であることを特徴とする請求項1から3のいずれか1つに記載の電界効果トランジスタ。
- 前記(0 0 0 1)面に垂直あるいは傾斜して位置する面は(1 1 -2 0)面または(1 -1 0 0)面または(1 -1 0 1)面または(1 -1 0 2)面または(1 1 -2 2)面または(1 1 -2 4)面であることを特徴とする請求項1から5のいずれか1つに記載の電界効果トランジスタ。
- 前記第1の窒化物半導体層がGaN層からなり、前記第2の窒化物半導体層がAlxGa1-xN(0<x<1)層からなり、前記第3の窒化物半導体層がGaN層からなることを特徴とする請求項1から6のいずれか1つに記載の電界効果トランジスタ。
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JP2007111451A JP2008270521A (ja) | 2007-04-20 | 2007-04-20 | 電界効果トランジスタ |
US12/060,505 US7956383B2 (en) | 2007-04-20 | 2008-04-01 | Field effect transistor |
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JP2007111451A JP2008270521A (ja) | 2007-04-20 | 2007-04-20 | 電界効果トランジスタ |
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JP2008270521A true JP2008270521A (ja) | 2008-11-06 |
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JP2007111451A Pending JP2008270521A (ja) | 2007-04-20 | 2007-04-20 | 電界効果トランジスタ |
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US (1) | US7956383B2 (ja) |
JP (1) | JP2008270521A (ja) |
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