JP2008235410A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

Info

Publication number
JP2008235410A
JP2008235410A JP2007070162A JP2007070162A JP2008235410A JP 2008235410 A JP2008235410 A JP 2008235410A JP 2007070162 A JP2007070162 A JP 2007070162A JP 2007070162 A JP2007070162 A JP 2007070162A JP 2008235410 A JP2008235410 A JP 2008235410A
Authority
JP
Japan
Prior art keywords
anode
electrolytic capacitor
solid electrolytic
anode electrode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007070162A
Other languages
Japanese (ja)
Other versions
JP4930124B2 (en
Inventor
Masato Ozawa
正人 小澤
Katsuhisa Ishizaki
勝久 石崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2007070162A priority Critical patent/JP4930124B2/en
Priority to TW097109308A priority patent/TW200839820A/en
Priority to US12/050,388 priority patent/US7835139B2/en
Priority to CN2008101258392A priority patent/CN101290832B/en
Publication of JP2008235410A publication Critical patent/JP2008235410A/en
Application granted granted Critical
Publication of JP4930124B2 publication Critical patent/JP4930124B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To reduce ESR in a solid electrolytic capacitor used for each kind of electronic equipment. <P>SOLUTION: The solid electrolytic capacitor comprises: a flat element 1; an anode comb terminal 6 and a cathode comb terminal 7 where an anode electrode 4 and a cathode electrode 5 provided at the element 1 are joined to an upper surface; and a packaging resin 8 for covering them. A pair of junctions 6b for wrapping the anode electrode 4 from both sides is provided at an element mount section 6a of the anode comb terminal 6 where the anode electrode 4 of the element 1 is mounted. The tip of the junction 6b and the anode electrode 4 are joined by laser welding. By this configuration where a relationship (A/B) between the width (A) of the tip of the junction 6b to be joined and the diameter (B) of a welded trace ranges from 0.5 to 1.5, an amount of heat in welding does not escape and is concentrated at the welded part 6c, thus obtaining a stable welded state, thus improving and reducing ESR. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は各種電子機器に使用されるコンデンサの中で、特に、低インピーダンス特性の固体電解コンデンサに関するものである。   The present invention relates to a solid electrolytic capacitor having a low impedance characteristic among capacitors used in various electronic devices.

電子機器の高周波化に伴って電子部品の一つであるコンデンサにも従来よりも高周波領域でのインピーダンス特性に優れたコンデンサが求められてきており、このような要求に応えるために電気伝導度の高い導電性高分子を固体電解質に用いた固体電解コンデンサが種々検討されている。   Along with the increase in frequency of electronic equipment, capacitors that are one of the electronic components have been required to have better impedance characteristics in the high frequency range than before. Various solid electrolytic capacitors using a highly conductive polymer as a solid electrolyte have been studied.

また、近年、パーソナルコンピュータのCPU周り等に使用される固体電解コンデンサには小型大容量化が強く望まれており、更に高周波化に対応して低ESR(等価直列抵抗)化や、ノイズ除去や過渡応答性に優れた低ESL(等価直列インダクタンス)化が要求されており、このような要求に応えるために種々の検討がなされている。   In recent years, a solid electrolytic capacitor used around a CPU of a personal computer has been strongly desired to be small in size and large in capacity. Further, in response to higher frequencies, lower ESR (equivalent series resistance), noise removal, There is a demand for low ESL (equivalent series inductance) excellent in transient response, and various studies have been made to meet such a demand.

図5(a)、(b)はこの種の従来の固体電解コンデンサの構成を示した正面断面図とA−A線における側面断面図、図6は同固体電解コンデンサの外装前の平面図であり、図5と図6において、11は素子を示し、この素子11は弁作用金属であるアルミニウム箔からなる陽極体12の表面を粗面化して誘電体酸化皮膜層を形成した後に絶縁性のレジスト部13を設けて陽極電極部14と陰極形成部(図示せず)に分離し、この陰極形成部の誘電体酸化皮膜層上に導電性高分子からなる固体電解質層、カーボン層と銀ペースト層からなる陰極層を順次積層形成することにより陰極電極部15を形成し、これにより長手方向に陽極電極部14と陰極電極部15が設けられた平板状の素子11が構成されているものである。   5 (a) and 5 (b) are a front sectional view and a side sectional view taken along line AA showing the configuration of this type of conventional solid electrolytic capacitor, and FIG. 6 is a plan view before the exterior of the solid electrolytic capacitor. 5 and FIG. 6, reference numeral 11 denotes an element. The element 11 is an insulating material after the surface of the anode body 12 made of an aluminum foil as a valve metal is roughened to form a dielectric oxide film layer. A resist portion 13 is provided to be separated into an anode electrode portion 14 and a cathode forming portion (not shown), and a solid electrolyte layer made of a conductive polymer, a carbon layer, and a silver paste are formed on the dielectric oxide film layer of the cathode forming portion. A cathode electrode portion 15 is formed by sequentially laminating a cathode layer composed of layers, thereby forming a flat element 11 provided with an anode electrode portion 14 and a cathode electrode portion 15 in the longitudinal direction. is there.

16は上記素子11の陽極電極部14に接続された陽極コム端子、16aはこの陽極コム端子16に設けられ、陽極電極部14が搭載される平面部、16bはこの平面部16aの両端を曲げ起こすことにより形成された接続部であり、複数枚積層した素子11の陽極電極部14を上記平面部16a上に搭載し、接続部16bを折り曲げて陽極電極部14に密着するように包み込み、この接続部16bの先端部分と素子11の陽極電極部14とを溶接部16cでレーザー溶接することによって接合しているものである。   16 is an anode comb terminal connected to the anode electrode portion 14 of the element 11, 16a is a plane portion provided on the anode comb terminal 16 and on which the anode electrode portion 14 is mounted, and 16b is bent at both ends of the plane portion 16a. A connecting portion formed by waking up, mounting the anode electrode portion 14 of the stacked element 11 on the plane portion 16a, folding the connecting portion 16b so as to be in close contact with the anode electrode portion 14, The distal end portion of the connection portion 16b and the anode electrode portion 14 of the element 11 are joined by laser welding at the welding portion 16c.

17は上記素子11の陰極電極部15に接続された陰極コム端子、17aはこの陰極コム端子17に設けられ、陰極電極部15が搭載される平面部であり、この平面部17aと陰極電極部15間、ならびに各素子11の陰極電極部15間の接合は導電性接着剤18を用いて行われているものである。   Reference numeral 17 denotes a cathode comb terminal connected to the cathode electrode portion 15 of the element 11, and 17a denotes a flat portion provided on the cathode comb terminal 17 on which the cathode electrode portion 15 is mounted. The flat portion 17a and the cathode electrode portion 15 and the cathode electrode part 15 of each element 11 are joined using the conductive adhesive 18.

19は上記陽極コム端子16と陰極コム端子17の一部が夫々外表面に露呈する状態で上記複数枚の素子11を一体に被覆した絶縁性の外装樹脂であり、この外装樹脂19から表出した陽極コム端子16と陰極コム端子17の一部を外装樹脂19に沿って底面へと折り曲げることにより、底面部に陽極端子部16dと陰極端子部17bを形成した面実装型の固体電解コンデンサが構成されているものである。   Reference numeral 19 denotes an insulating exterior resin that integrally covers the plurality of elements 11 in a state where parts of the anode comb terminal 16 and the cathode comb terminal 17 are exposed on the outer surface. A surface mount type solid electrolytic capacitor in which the anode terminal portion 16d and the cathode terminal portion 17b are formed on the bottom surface portion by bending a part of the anode comb terminal 16 and the cathode comb terminal 17 along the exterior resin 19 to the bottom surface. It is configured.

このように構成された従来の固体電解コンデンサは、陽極コム端子16に設けた接続部16bの先端と素子11の陽極電極部14に同時にレーザー光を照射してレーザー溶接を行うことにより、安定した溶接作業を行うことができるようになるというものであった。   The conventional solid electrolytic capacitor configured as described above is stabilized by performing laser welding by simultaneously irradiating the tip of the connection portion 16b provided on the anode comb terminal 16 and the anode electrode portion 14 of the element 11 with laser light. The welding work can be performed.

なお、この出願の発明に関連する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2003−289023号公報
As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2003-289023 A

しかしながら上記従来の固体電解コンデンサでは、素子11の陽極電極部14と陽極コム端子16の接合を、陽極コム端子16に設けた接続部16bの端面と素子11の陽極電極部14に同時にレーザー光を照射してレーザー溶接を行うようにしているものであるが、溶接時の熱量の一部が接続部16bを介して逃げ易くなり、積層された複数枚の素子11全てに均一な熱量を与えて溶接作業を行うことが難しいという問題があった。   However, in the above-described conventional solid electrolytic capacitor, the anode electrode portion 14 of the element 11 and the anode comb terminal 16 are joined, and laser light is simultaneously applied to the end surface of the connection portion 16b provided on the anode comb terminal 16 and the anode electrode portion 14 of the element 11. Although laser irradiation is performed by irradiation, a part of the heat quantity at the time of welding becomes easy to escape through the connecting portion 16b, and a uniform amount of heat is given to all the stacked multiple elements 11 There was a problem that it was difficult to perform the welding operation.

従って、溶接強度は確保できても溶接状態にバラツキが発生し、必要以上に溶融した部分や十分に溶融されない部分が混在することに起因してESRが悪化するという課題があった。   Therefore, there is a problem that even if the welding strength can be ensured, the welding state varies, and the ESR deteriorates due to the presence of a part melted more than necessary or a part that is not sufficiently melted.

本発明はこのような従来の課題を解決し、安定した溶接状態が容易に得られ、これによりESRの悪化を抑制して低ESR化を実現することが可能な固体電解コンデンサを提供することを目的とするものである。   The present invention solves such conventional problems, and provides a solid electrolytic capacitor capable of easily obtaining a stable welded state, thereby suppressing the deterioration of ESR and realizing low ESR. It is the purpose.

上記課題を解決するために本発明は、平板状の素子と、この素子に設けられた陽極電極部と陰極電極部を上面に接合した陽極コム端子ならびに陰極コム端子と、これらを被覆した外装樹脂からなり、上記素子の陽極電極部の平坦部と接合される接合部を陽極コム端子に設け、この接合部の先端と陽極電極部をレーザー溶接により接合し、かつ、上記接合部の先端の幅(A)とレーザー溶接部における溶接痕の直径(B)の関係(A/B)が、0.5〜1.5となるようにした構成のものである。   In order to solve the above-described problems, the present invention relates to a flat element, an anode comb terminal and a cathode comb terminal in which an anode electrode part and a cathode electrode part provided on the element are bonded to the upper surface, and an exterior resin covering them. A joint portion to be joined to the flat portion of the anode electrode portion of the element is provided on the anode comb terminal, the tip of the joint portion and the anode electrode portion are joined by laser welding, and the width of the tip of the joint portion The relationship (A / B) between (A) and the diameter (B) of the weld mark in the laser weld is 0.5 to 1.5.

以上のように本発明による固体電解コンデンサは、溶接により素子の陽極電極部と接合される陽極コム端子の接合部の先端の幅(A)と溶接痕の直径(B)の関係(A/B)を0.5〜1.5とした構成により、レーザー溶接時の熱量が接合部を介して拡散することを低減し、溶接部に集中するために安定した溶接状態が得られ、これによりESRを良化させて低ESR化を図ることができるという効果が得られるものである。   As described above, the solid electrolytic capacitor according to the present invention has a relationship (A / B) between the width (A) of the tip of the joined portion of the anode comb terminal joined to the anode electrode portion of the element by welding and the diameter (B) of the welding mark. ) Is set to 0.5 to 1.5, the amount of heat during laser welding is reduced from diffusing through the joint, and a stable welding state is obtained to concentrate on the weld. As a result, it is possible to obtain an effect that the ESR can be improved and the ESR can be reduced.

(実施の形態1)
以下、実施の形態1を用いて、本発明の特に全請求項に記載の発明について説明する。
(Embodiment 1)
Hereinafter, the invention described in the entire claims of the present invention will be described using the first embodiment.

図1(a)、(b)は本発明の実施の形態1による固体電解コンデンサの構成を示した正面断面図とA−A線における側面断面図、図2は同固体電解コンデンサの外装前の平面図、図3は同固体電解コンデンサに使用される素子の構成を示した断面図である。   1 (a) and 1 (b) are a front sectional view showing a configuration of the solid electrolytic capacitor according to the first embodiment of the present invention and a side sectional view taken along line AA, and FIG. 2 is a diagram before the exterior of the solid electrolytic capacitor. FIG. 3 is a cross-sectional view showing a configuration of an element used in the solid electrolytic capacitor.

図1〜図3において、1は素子を示し、この素子1は弁作用金属であるアルミニウム箔からなる陽極体2の表面を粗面化して誘電体酸化皮膜層2aを形成した後に絶縁性のレジスト部3を設けて陽極電極部4と陰極形成部(図示せず)に分離し、この陰極形成部の誘電体酸化皮膜層2a上に導電性高分子からなる固体電解質層5a、カーボン層5bと銀ペースト層5cからなる陰極層を順次積層形成することにより陰極電極部5を形成し、これにより長手方向に陽極電極部4と陰極電極部5が設けられた平板状の素子1を構成しているものである。   1 to 3, reference numeral 1 denotes an element. The element 1 is an insulating resist after the surface of an anode body 2 made of an aluminum foil as a valve metal is roughened to form a dielectric oxide film layer 2a. A portion 3 is provided to be separated into an anode electrode portion 4 and a cathode forming portion (not shown), and a solid electrolyte layer 5a made of a conductive polymer, a carbon layer 5b on the dielectric oxide film layer 2a of the cathode forming portion, A cathode electrode part 5 is formed by sequentially laminating a cathode layer composed of a silver paste layer 5c, thereby forming a flat element 1 having an anode electrode part 4 and a cathode electrode part 5 provided in the longitudinal direction. It is what.

6は上記素子1の陽極電極部4に接続された陽極コム端子、6aはこの陽極コム端子6に設けられ、陽極電極部4が搭載される素子搭載部、6bはこの素子搭載部6aの両端を曲げ起こすことにより形成された一対の接合部であり、この接合部6bは先端部分のみが狭幅になるように先細り形状に形成されているものである。   6 is an anode comb terminal connected to the anode electrode portion 4 of the element 1, 6a is an element mounting portion provided on the anode comb terminal 6 and on which the anode electrode portion 4 is mounted, and 6b is both ends of the element mounting portion 6a. The joint 6b is formed in a tapered shape so that only the tip portion becomes narrow.

そして、このように構成された陽極コム端子6の素子搭載部6a上に素子1の陽極電極部4を複数枚(本実施の形態においては4枚)積層して搭載し、この素子搭載部6aの両端に設けられた接合部6bを夫々折り曲げて陽極電極部4に密着するように両側面から相対して包み込むことによって積層した複数の陽極電極部4を結束し、この接合部6bの狭幅に形成された先端部分と素子1の陽極電極部4の上面の平坦部にYAGレーザーを用いてレーザー光を同時に照射して、溶接部6cでレーザー溶接することによって接合しているものである。   A plurality of (4 in the present embodiment) anode electrode portions 4 of the element 1 are stacked and mounted on the element mounting portion 6a of the anode comb terminal 6 thus configured, and the element mounting portion 6a. A plurality of laminated anode electrode parts 4 are bundled by bending each of the joint parts 6b provided at both ends of the metal plate so as to be in close contact with the anode electrode part 4 so as to be in close contact with the anode electrode part 4, and the narrow width of the joint part 6b. The front end portion formed in the step 1 and the flat portion of the upper surface of the anode electrode portion 4 of the element 1 are joined by simultaneously irradiating a laser beam using a YAG laser and performing laser welding at the welding portion 6c.

なお、上記接合部6bによって積層した複数の陽極電極部4を結束することにより、積層した複数の陽極電極部4どうしの接合強度を向上させ、接合抵抗を低減することができるものである。   In addition, by bonding the plurality of anode electrode portions 4 stacked by the bonding portion 6b, the bonding strength between the plurality of stacked anode electrode portions 4 can be improved, and the bonding resistance can be reduced.

7は上記素子1の陰極電極部5に接続された陰極コム端子、7aはこの陰極コム端子7に設けられ、陰極電極部5が搭載される素子搭載部であり、この素子搭載部7aと陰極電極部5間、ならびに各素子1の陰極電極部5間の接合は導電性接着剤8を用いて行われているものである。   Reference numeral 7 denotes a cathode comb terminal connected to the cathode electrode portion 5 of the element 1, and 7a denotes an element mounting portion provided on the cathode comb terminal 7 on which the cathode electrode portion 5 is mounted. Bonding between the electrode parts 5 and between the cathode electrode parts 5 of each element 1 is performed using a conductive adhesive 8.

9は上記陽極コム端子6と陰極コム端子7の一部が夫々外表面に露呈する状態で上記複数枚の素子1と陽極コム端子6と陰極コム端子7を一体に被覆した絶縁性の外装樹脂であり、この外装樹脂9から表出した陽極コム端子6と陰極コム端子7の一部を外装樹脂9に沿って側面から底面へと折り曲げることにより、底面部に陽極端子部6dと陰極端子部7bを形成した面実装型の固体電解コンデンサを構成したものである。   9 is an insulating exterior resin in which the plurality of elements 1, the anode comb terminal 6 and the cathode comb terminal 7 are integrally coated with the anode comb terminal 6 and the cathode comb terminal 7 partially exposed to the outer surface. A part of the anode comb terminal 6 and the cathode comb terminal 7 exposed from the exterior resin 9 is bent from the side surface to the bottom surface along the exterior resin 9, so that the anode terminal portion 6d and the cathode terminal portion are formed on the bottom surface portion. This is a surface mount type solid electrolytic capacitor in which 7b is formed.

このように構成された本実施の形態による固体電解コンデンサは、レーザー溶接により素子1の陽極電極部4と接合される陽極コム端子6の接合部6bの先端部分が狭幅になるように先細り形状にした構成により、溶接時の熱量が接合部6bを介して逃げることがなく、溶接部6cに集中するようになるために陽極電極部4どうし、ならびに陽極電極部4と溶接部6c間で安定した溶接状態が得られ、これによりESRの悪化を抑制して低ESR化を図ることができるようになるという格別の効果を奏するものであり、このような効果を確認する目的で、上記陽極コム端子6に設けた接合部6bの先端部分の幅寸法を変化させて溶接を行った場合の特性を確認した結果を(表1)に示す。   The solid electrolytic capacitor according to the present embodiment configured as described above has a tapered shape so that the tip portion of the joint portion 6b of the anode comb terminal 6 joined to the anode electrode portion 4 of the element 1 by laser welding becomes narrow. With this configuration, the amount of heat during welding does not escape via the joint 6b, but concentrates on the weld 6c, so that the anode electrodes 4 and the anode electrode 4 and the weld 6c are stable. In order to confirm such an effect, the above-described anode comb can be obtained. Table 1 shows the results of confirming the characteristics when welding was performed by changing the width of the tip of the joint 6b provided on the terminal 6.

なお、(表1)に示す固体電解コンデンサは、定格電圧2.0V、静電容量220μFであり、素子1を4枚積層し、アルミニウム箔は厚み0.1mm、陽極コム端子6及び陰極コム端子7は厚み0.1mmの銅合金を用いたものである。固体電解コンデンサの周波数100kHzでのESRは、接合部6bの先端の幅(A)が0.7mmの場合において、4mΩ〜10mΩである。   The solid electrolytic capacitor shown in (Table 1) has a rated voltage of 2.0 V and a capacitance of 220 μF, four elements 1 are laminated, the aluminum foil has a thickness of 0.1 mm, an anode comb terminal 6 and a cathode comb terminal. 7 is a copper alloy having a thickness of 0.1 mm. The ESR of the solid electrolytic capacitor at a frequency of 100 kHz is 4 mΩ to 10 mΩ when the width (A) of the tip of the joint 6b is 0.7 mm.

レーザー溶接は出力2KWで行い、溶接部6cにおける溶接痕の直径(B)は0.4mmで一定とした。   Laser welding was performed at an output of 2 KW, and the diameter (B) of the weld mark at the weld 6c was constant at 0.4 mm.

また、各接合部6bの先端の幅(A)での接続抵抗値指数は、先端の幅(A)が0.7mmのときの積層された陽極電極部4の最下層から接合部6bの溶接部6cまでの間の接続抵抗値を100とした場合の接続抵抗値の割合を示したものである。   In addition, the connection resistance value index at the tip width (A) of each joint portion 6b is determined by welding the joint portion 6b from the lowest layer of the laminated anode electrode portion 4 when the tip width (A) is 0.7 mm. The ratio of the connection resistance value when the connection resistance value up to the portion 6c is 100 is shown.

また、漏れ電流値は、定格電圧2.0V印加での1分値を示す。   Further, the leakage current value indicates a one-minute value when a rated voltage of 2.0 V is applied.

Figure 2008235410
Figure 2008235410

(表1)から明らかなように、本実施の形態による固体電解コンデンサは、接合部6bの先端部分の幅(A)と溶接部6bにおける溶接痕の直径(B)の関係(A/B)が、0.50〜1.50の範囲内において、接続抵抗値が低い値を示し、この範囲から外れると接続抵抗値が悪化することから、低ESR化が実現できていることが分かるものである。   As is clear from Table 1, the solid electrolytic capacitor according to the present embodiment has a relationship (A / B) between the width (A) of the tip portion of the joint 6b and the diameter (B) of the weld mark in the weld 6b. However, in the range of 0.50 to 1.50, the connection resistance value shows a low value, and when it is out of this range, the connection resistance value deteriorates, so it can be seen that low ESR can be realized. is there.

また、上記関係(A/B)が、0.25〜1.50の範囲において、レーザー溶接による漏れ電流値が良化しており、特に(A/B)が0.25〜1.25の範囲で漏れ電流値を更に小さくすることができていることから、素子1の損傷を防止することができるという効果が現れているものと思われる。   Moreover, when the relationship (A / B) is in the range of 0.25 to 1.50, the leakage current value by laser welding is improved, and in particular, the range of (A / B) is in the range of 0.25 to 1.25. Since the leakage current value can be further reduced, it is considered that the effect of preventing damage to the element 1 appears.

(実施の形態2)
以下、実施の形態2を用いて、本発明の特に全請求項に記載の発明について説明する。
(Embodiment 2)
Hereinafter, the second embodiment will be used to describe the invention described in the entire claims.

本実施の形態は、上記実施の形態1で図1、図2を用いて説明した固体電解コンデンサの陽極コム端子の構成が一部異なるようにしたものであり、これ以外の構成は実施の形態1と同様であるために同一部分には同一の符号を付与してその詳細な説明は省略し、異なる部分についてのみ以下に図面を用いて説明する。   In the present embodiment, the configuration of the anode comb terminal of the solid electrolytic capacitor described in the first embodiment with reference to FIGS. 1 and 2 is partially different, and other configurations are the same as in the first embodiment. The same reference numerals are given to the same parts and the detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

図4は本発明の実施の形態2による固体電解コンデンサの外装前の平面図であり、図4において、10は陽極コム端子、10aはこの陽極コム端子10に設けられ、素子1の陽極電極部4が搭載される素子搭載部、10bはこの素子搭載部10aの両端を曲げ起こすことにより形成された一対の接合部であり、この接合部10bは先端部分に切り欠きを設けることによって先端部分の幅を狭くするように形成されているものである。   FIG. 4 is a plan view of the solid electrolytic capacitor according to the second embodiment of the present invention before packaging. In FIG. 4, 10 is an anode comb terminal, 10a is provided on the anode comb terminal 10, and the anode electrode portion of the element 1 is shown. An element mounting portion 10b on which 4 is mounted is a pair of joint portions formed by bending both ends of the element mounting portion 10a. It is formed so as to narrow the width.

そして、このように構成された陽極コム端子10の素子搭載部10a上に素子1の陽極電極部4を複数枚積層して搭載し、接合部10bを折り曲げて陽極電極部4に密着するように両側面から相対して包み込むことによって積層した複数の陽極電極部4を結束し、この接合部10bの狭幅に形成された先端部分と素子1の陽極電極部4の上面の平坦部にYAGレーザーを用いてレーザー光を同時に照射して、溶接部10cでレーザー溶接することによって接合するようにしたものである。   Then, a plurality of anode electrode portions 4 of the element 1 are stacked and mounted on the element mounting portion 10a of the anode comb terminal 10 configured as described above, and the bonding portion 10b is bent to be in close contact with the anode electrode portion 4. A plurality of laminated anode electrode parts 4 are bundled by wrapping relative to each other from both sides, and a YAG laser is applied to the tip part formed in a narrow width of the joint part 10b and the flat part on the upper surface of the anode electrode part 4 of the element 1. Are jointed by simultaneously irradiating a laser beam with laser and performing laser welding at the welded portion 10c.

このように構成された本実施の形態による固体電解コンデンサは、上記実施の形態1による固体電解コンデンサと同様に、レーザー溶接により素子1の陽極電極部4と接合される陽極コム端子10の接合部10bの先端部分のみが狭幅になるように切り欠きを設けた構成により、溶接時の熱量が接合部10bを介して拡散することを防止し、溶接部10cに集中するようになるために安定した溶接状態が得られ、これによりESRの悪化を抑制して低ESR化を図ることができるようになるという格別の効果を奏するものである。   The solid electrolytic capacitor according to the present embodiment configured as described above is a joint portion of the anode comb terminal 10 that is joined to the anode electrode portion 4 of the element 1 by laser welding, similarly to the solid electrolytic capacitor according to the first embodiment. The structure in which the notch is provided so that only the front end portion of 10b is narrowed so that the amount of heat at the time of welding is prevented from diffusing through the joint portion 10b and is stable because it concentrates on the weld portion 10c. As a result, it is possible to obtain a special welded state, whereby it is possible to reduce the ESR by suppressing the deterioration of the ESR.

本発明による固体電解コンデンサは、安定した溶接状態を得て低ESR化を図ることができるという効果を有し、特に高周波領域でのインピーダンス特性に優れたものが要求される分野等として有用である。   The solid electrolytic capacitor according to the present invention has an effect that a stable welding state can be obtained and low ESR can be achieved, and is particularly useful as a field where excellent impedance characteristics in a high frequency region are required. .

(a)本発明の実施の形態1による固体電解コンデンサの構成を示した正面断面図、(b)同A−A線における側面断面図(A) Front sectional drawing which showed the structure of the solid electrolytic capacitor by Embodiment 1 of this invention, (b) Side surface sectional drawing in the AA line 同固体電解コンデンサの外装前の平面図Plan view of the solid electrolytic capacitor before exterior 同固体電解コンデンサに使用される素子の構成を示した断面図Sectional drawing which showed the structure of the element used for the solid electrolytic capacitor 本発明の実施の形態2による固体電解コンデンサの外装前の平面図The top view before the exterior of the solid electrolytic capacitor by Embodiment 2 of this invention (a)従来の固体電解コンデンサの構成を示した正面断面図、(b)同A−A線における側面断面図(A) Front sectional view showing the configuration of a conventional solid electrolytic capacitor, (b) Side sectional view taken along the line AA. 同固体電解コンデンサの外装前の平面図Plan view of the solid electrolytic capacitor before exterior

符号の説明Explanation of symbols

1 素子
2 陽極体
2a 誘電体酸化皮膜層
3 レジスト部
4 陽極電極部
5 陰極電極部
5a 固体電解質層
5b カーボン層
5c 銀ペースト層
6、10 陽極コム端子
6a、7a、10a 素子搭載部
6b、10b 接合部
6c、10c 溶接部
6d 陽極端子部
7 陰極コム端子
7b 陰極端子部
8 導電性接着剤
9 外装樹脂
DESCRIPTION OF SYMBOLS 1 Element 2 Anode body 2a Dielectric oxide film layer 3 Resist part 4 Anode electrode part 5 Cathode electrode part 5a Solid electrolyte layer 5b Carbon layer 5c Silver paste layer 6, 10 Anode comb terminal 6a, 7a, 10a Element mounting part 6b, 10b Joining part 6c, 10c Welding part 6d Anode terminal part 7 Cathode comb terminal 7b Cathode terminal part 8 Conductive adhesive 9 Exterior resin

Claims (4)

陽極電極部と陰極電極部が設けられた平板状の素子と、この素子に設けられた陽極電極部と陰極電極部を夫々接合した陽極コム端子ならびに陰極コム端子と、この陽極コム端子ならびに陰極コム端子の一部が夫々露呈する状態で上記素子と陽極コム端子と陰極コム端子を一体に被覆した外装樹脂からなる固体電解コンデンサにおいて、上記素子の陽極電極部の平坦部と接合される接合部を陽極コム端子に設け、この接合部の先端と陽極電極部をレーザー溶接により接合し、かつ、上記接合部の先端の幅(A)とレーザー溶接部における溶接痕の直径(B)の関係(A/B)が、0.5〜1.5となるようにした固体電解コンデンサ。 A flat element provided with an anode electrode part and a cathode electrode part, an anode comb terminal and a cathode comb terminal obtained by joining the anode electrode part and the cathode electrode part provided on the element, and the anode comb terminal and the cathode comb In a solid electrolytic capacitor made of an exterior resin that integrally covers the element, the anode comb terminal, and the cathode comb terminal in a state where a part of each terminal is exposed, a joint portion that is joined to the flat portion of the anode electrode portion of the element Provided on the anode comb terminal, the tip of the joint and the anode electrode are joined by laser welding, and the relationship between the width (A) of the tip of the joint and the diameter (B) of the welding mark in the laser weld (A / B) is a solid electrolytic capacitor having a value of 0.5 to 1.5. 接合部の先端の幅(A)とレーザー溶接部における溶接痕の直径(B)の関係(A/B)が、0.5〜1.25となるようにした請求項1に記載の固体電解コンデンサ。 Solid electrolysis according to claim 1, wherein the relationship (A / B) between the width (A) of the tip of the joint and the diameter (B) of the weld mark in the laser weld is 0.5 to 1.25. Capacitor. 接合部の先端を狭幅とした請求項1に記載の固体電解コンデンサ。 The solid electrolytic capacitor according to claim 1, wherein a tip of the joint portion is narrow. 陽極コム端子に設けた接合部が、素子の陽極電極部を両側面から相対して包み込むことによって結束するようにしたものである請求項1に記載の固体電解コンデンサ。 The solid electrolytic capacitor according to claim 1, wherein the joint provided on the anode comb terminal is bound by wrapping the anode electrode portion of the element relative to both sides.
JP2007070162A 2007-03-19 2007-03-19 Solid electrolytic capacitor Active JP4930124B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007070162A JP4930124B2 (en) 2007-03-19 2007-03-19 Solid electrolytic capacitor
TW097109308A TW200839820A (en) 2007-03-19 2008-03-17 Solid electrolytic capacitor
US12/050,388 US7835139B2 (en) 2007-03-19 2008-03-18 Solid electrolytic capacitor
CN2008101258392A CN101290832B (en) 2007-03-19 2008-03-19 Solid electrolytic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007070162A JP4930124B2 (en) 2007-03-19 2007-03-19 Solid electrolytic capacitor

Publications (2)

Publication Number Publication Date
JP2008235410A true JP2008235410A (en) 2008-10-02
JP4930124B2 JP4930124B2 (en) 2012-05-16

Family

ID=39907895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007070162A Active JP4930124B2 (en) 2007-03-19 2007-03-19 Solid electrolytic capacitor

Country Status (2)

Country Link
JP (1) JP4930124B2 (en)
CN (1) CN101290832B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022009799A1 (en) * 2020-07-07 2022-01-13 パナソニックIpマネジメント株式会社 Solid electrolytic capacitor element, solid electrolytic capacitor and method for producing same
WO2023037913A1 (en) * 2021-09-13 2023-03-16 ルビコン株式会社 Capacitor device
WO2023053811A1 (en) * 2021-10-01 2023-04-06 ルビコン株式会社 Capacitor device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101996774B (en) * 2010-11-09 2016-01-27 钰邦电子(无锡)有限公司 There is stack-type solid electrolytic capacitor and the manufacture method thereof of multi-spot welding structure
JP5879491B2 (en) * 2012-02-28 2016-03-08 パナソニックIpマネジメント株式会社 Solid electrolytic capacitor
TWI626670B (en) * 2016-05-20 2018-06-11 鈺邦科技股份有限公司 Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same
JP6729179B2 (en) * 2016-08-25 2020-07-22 株式会社村田製作所 Solid electrolytic capacitor element, solid electrolytic capacitor, method of manufacturing solid electrolytic capacitor element, and method of manufacturing solid electrolytic capacitor
CN111048320B (en) * 2018-10-12 2021-09-28 钰冠科技股份有限公司 Stacked solid electrolytic capacitor packaging structure and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289023A (en) * 2002-03-28 2003-10-10 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor and method for manufacturing the same
JP2005072465A (en) * 2003-08-27 2005-03-17 Kyocera Corp Ceramic vessel and tantalum electrolytic capacitor using the same
JP2006190929A (en) * 2004-12-06 2006-07-20 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003289023A (en) * 2002-03-28 2003-10-10 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor and method for manufacturing the same
JP2005072465A (en) * 2003-08-27 2005-03-17 Kyocera Corp Ceramic vessel and tantalum electrolytic capacitor using the same
JP2006190929A (en) * 2004-12-06 2006-07-20 Matsushita Electric Ind Co Ltd Solid electrolytic capacitor and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022009799A1 (en) * 2020-07-07 2022-01-13 パナソニックIpマネジメント株式会社 Solid electrolytic capacitor element, solid electrolytic capacitor and method for producing same
WO2023037913A1 (en) * 2021-09-13 2023-03-16 ルビコン株式会社 Capacitor device
WO2023053811A1 (en) * 2021-10-01 2023-04-06 ルビコン株式会社 Capacitor device

Also Published As

Publication number Publication date
CN101290832A (en) 2008-10-22
JP4930124B2 (en) 2012-05-16
CN101290832B (en) 2011-02-16

Similar Documents

Publication Publication Date Title
JP4930124B2 (en) Solid electrolytic capacitor
CN1866428B (en) Stacked capacitor and method of fabricating the same
JP4872365B2 (en) Chip type solid electrolytic capacitor
US20090073638A1 (en) Chip type solid electrolytic capacitor
JP4662368B2 (en) Manufacturing method of solid electrolytic capacitor
JPH05205984A (en) Laminated solid electrolytic capacitor
TW200405370A (en) Solid electrolytic capacitor and its manufacturing method
US7835139B2 (en) Solid electrolytic capacitor
JP5879491B2 (en) Solid electrolytic capacitor
JP4802550B2 (en) Solid electrolytic capacitor
JP4613699B2 (en) Solid electrolytic capacitor, method for manufacturing the same, and digital signal processing board using the same
WO2012140836A1 (en) Electrolytic capacitor
JP4613669B2 (en) Solid electrolytic capacitor
JP4924128B2 (en) Solid electrolytic capacitor
JP2003289023A (en) Solid electrolytic capacitor and method for manufacturing the same
JP4930125B2 (en) Solid electrolytic capacitor
JP4352802B2 (en) Solid electrolytic capacitor and manufacturing method thereof
JP4654929B2 (en) Chip type solid electrolytic capacitor
JP2008235412A (en) Solid electrolytic capacitor
JP2006352059A (en) Digital signal processing board
JP2007059854A (en) Solid electrolytic capacitor
JP2005236171A (en) Solid electrolytic capacitor and manufacturing method thereof
JP2008135424A (en) Chip-type solid electrolytic capacitor
JP2008053416A (en) Chip-type solid electrolytic capacitor
JP5546919B2 (en) Solid electrolytic capacitor

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091228

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20100113

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110526

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110531

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110706

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110823

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111110

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111117

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120117

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120130

R151 Written notification of patent or utility model registration

Ref document number: 4930124

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150224

Year of fee payment: 3