JP2008235198A5 - - Google Patents

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Publication number
JP2008235198A5
JP2008235198A5 JP2007076945A JP2007076945A JP2008235198A5 JP 2008235198 A5 JP2008235198 A5 JP 2008235198A5 JP 2007076945 A JP2007076945 A JP 2007076945A JP 2007076945 A JP2007076945 A JP 2007076945A JP 2008235198 A5 JP2008235198 A5 JP 2008235198A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007076945A
Other languages
Japanese (ja)
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JP2008235198A (en
JP5059458B2 (en
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Publication date
Application filed filed Critical
Priority to JP2007076945A priority Critical patent/JP5059458B2/en
Priority claimed from JP2007076945A external-priority patent/JP5059458B2/en
Publication of JP2008235198A publication Critical patent/JP2008235198A/en
Publication of JP2008235198A5 publication Critical patent/JP2008235198A5/ja
Application granted granted Critical
Publication of JP5059458B2 publication Critical patent/JP5059458B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007076945A 2007-03-23 2007-03-23 Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board Expired - Fee Related JP5059458B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007076945A JP5059458B2 (en) 2007-03-23 2007-03-23 Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007076945A JP5059458B2 (en) 2007-03-23 2007-03-23 Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board

Publications (3)

Publication Number Publication Date
JP2008235198A JP2008235198A (en) 2008-10-02
JP2008235198A5 true JP2008235198A5 (en) 2010-04-15
JP5059458B2 JP5059458B2 (en) 2012-10-24

Family

ID=39907752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007076945A Expired - Fee Related JP5059458B2 (en) 2007-03-23 2007-03-23 Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board

Country Status (1)

Country Link
JP (1) JP5059458B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5632176B2 (en) * 2009-09-30 2014-11-26 三ツ星ベルト株式会社 Laminated body, conductive substrate using the laminated body, and method for producing the same
WO2011065271A1 (en) * 2009-11-24 2011-06-03 独立行政法人産業技術総合研究所 Conductive substrate and process for producing same
WO2012061511A2 (en) * 2010-11-03 2012-05-10 Fry's Metals, Inc. Sintering materials and attachment methods using same
CN102994797A (en) * 2012-12-10 2013-03-27 大连创达技术交易市场有限公司 Alloy powder
JP6389628B2 (en) * 2014-03-31 2018-09-12 三井金属鉱業株式会社 Copper powder, method for producing the same, and conductive composition containing the same
CN108565042B (en) * 2018-04-24 2020-02-07 河南省豫星微钻有限公司 Electric-conduction and heat-conduction electronic paste containing nano diamond alkene and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111204A (en) * 1999-10-07 2001-04-20 Aisin Seiki Co Ltd Method of bonding metal component and conductive resin component and bonded product thereof
JP2003331648A (en) * 2002-05-10 2003-11-21 Tsuchiya Co Ltd Conductive paste and manufacturing method for electric circuit
WO2005031760A1 (en) * 2003-09-26 2005-04-07 Hitachi Chemical Co., Ltd. Mixed conductive powder and use thereof
JP2006111807A (en) * 2004-10-18 2006-04-27 Hitachi Chem Co Ltd Electronic part and method for producing the same

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