JP2008235198A5 - - Google Patents
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- Publication number
- JP2008235198A5 JP2008235198A5 JP2007076945A JP2007076945A JP2008235198A5 JP 2008235198 A5 JP2008235198 A5 JP 2008235198A5 JP 2007076945 A JP2007076945 A JP 2007076945A JP 2007076945 A JP2007076945 A JP 2007076945A JP 2008235198 A5 JP2008235198 A5 JP 2008235198A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007076945A JP5059458B2 (en) | 2007-03-23 | 2007-03-23 | Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007076945A JP5059458B2 (en) | 2007-03-23 | 2007-03-23 | Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008235198A JP2008235198A (en) | 2008-10-02 |
JP2008235198A5 true JP2008235198A5 (en) | 2010-04-15 |
JP5059458B2 JP5059458B2 (en) | 2012-10-24 |
Family
ID=39907752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007076945A Expired - Fee Related JP5059458B2 (en) | 2007-03-23 | 2007-03-23 | Conductive powder, conductive paste, conductive sheet, circuit board and electronic component mounting circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5059458B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5632176B2 (en) * | 2009-09-30 | 2014-11-26 | 三ツ星ベルト株式会社 | Laminated body, conductive substrate using the laminated body, and method for producing the same |
WO2011065271A1 (en) * | 2009-11-24 | 2011-06-03 | 独立行政法人産業技術総合研究所 | Conductive substrate and process for producing same |
WO2012061511A2 (en) * | 2010-11-03 | 2012-05-10 | Fry's Metals, Inc. | Sintering materials and attachment methods using same |
CN102994797A (en) * | 2012-12-10 | 2013-03-27 | 大连创达技术交易市场有限公司 | Alloy powder |
JP6389628B2 (en) * | 2014-03-31 | 2018-09-12 | 三井金属鉱業株式会社 | Copper powder, method for producing the same, and conductive composition containing the same |
CN108565042B (en) * | 2018-04-24 | 2020-02-07 | 河南省豫星微钻有限公司 | Electric-conduction and heat-conduction electronic paste containing nano diamond alkene and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001111204A (en) * | 1999-10-07 | 2001-04-20 | Aisin Seiki Co Ltd | Method of bonding metal component and conductive resin component and bonded product thereof |
JP2003331648A (en) * | 2002-05-10 | 2003-11-21 | Tsuchiya Co Ltd | Conductive paste and manufacturing method for electric circuit |
WO2005031760A1 (en) * | 2003-09-26 | 2005-04-07 | Hitachi Chemical Co., Ltd. | Mixed conductive powder and use thereof |
JP2006111807A (en) * | 2004-10-18 | 2006-04-27 | Hitachi Chem Co Ltd | Electronic part and method for producing the same |
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2007
- 2007-03-23 JP JP2007076945A patent/JP5059458B2/en not_active Expired - Fee Related
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