CN102994797A - Alloy powder - Google Patents
Alloy powder Download PDFInfo
- Publication number
- CN102994797A CN102994797A CN201210526613XA CN201210526613A CN102994797A CN 102994797 A CN102994797 A CN 102994797A CN 201210526613X A CN201210526613X A CN 201210526613XA CN 201210526613 A CN201210526613 A CN 201210526613A CN 102994797 A CN102994797 A CN 102994797A
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- CN
- China
- Prior art keywords
- alloy powder
- alloy
- oxidation
- powdered alloy
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention provides alloy powder, and belongs to the field of alloys. The alloy powder comprises the following components in percentage by mass: 15 to 85% of silver, 25 to 75% of nickel, 5 to 30% of copper, and 1 to 5% of oxidation-resistant material. The alloy powder has the beneficial effects that the alloy prepared by the alloy powder is free from clearance, compact and uniform, and hardly oxidized.
Description
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Technical fieldA kind of powdered alloy belongs to the alloy field.
Background technologyPowdered alloy is by two or more constituent elements alloying and the metal-powder that makes is mainly used in Powder Metallurgy Industry partially or completely; Conventional alloys has the space because defective workmanship causes the fine and close inhomogeneous of finished product alloy, and easily oxidation.
Summary of the inventionDefective in view of prior art exists the purpose of this invention is to provide the powdered alloy that a kind of densification is even, oxidation-resistance is strong.
For achieving the above object, the technology used in the present invention solution is: a kind of powdered alloy comprises: silver-colored 15-85%, and nickel 25-75%, copper 5-30%, oxidation-resistant material 1-5%, described per-cent are mass percent.
A kind of powdered alloy, its beneficial effect is: this powdered alloy prepare the alloy tight, fine and close evenly, be difficult for oxidation.
Embodiment
A kind of powdered alloy comprises: silver-colored 15-85%, and nickel 25-75%, copper 5-30%, oxidation-resistant material 1-5%, described per-cent are mass percent.
Claims (1)
1. powdered alloy is characterized in that comprising: silver-colored 15-85%, and nickel 25-75%, copper 5-30%, oxidation-resistant material 1-5%, described per-cent are mass percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526613XA CN102994797A (en) | 2012-12-10 | 2012-12-10 | Alloy powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526613XA CN102994797A (en) | 2012-12-10 | 2012-12-10 | Alloy powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102994797A true CN102994797A (en) | 2013-03-27 |
Family
ID=47923902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210526613XA Pending CN102994797A (en) | 2012-12-10 | 2012-12-10 | Alloy powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102994797A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1356189A (en) * | 2000-12-02 | 2002-07-03 | 王有林 | Antioxidizing agent for metal powder |
| CN1599653A (en) * | 2001-12-04 | 2005-03-23 | 川铁矿业株式会社 | Copper alloy powder for electroconductive paste |
| JP2008235198A (en) * | 2007-03-23 | 2008-10-02 | Alpha Scientific Kk | Conductive powder, conductive paste, conductive sheet, circuit board, and electronic component mounting circuit board |
| CN101778684A (en) * | 2007-09-07 | 2010-07-14 | E.I.内穆尔杜邦公司 | Multi-element alloy powder containing silver and at least two non-silver containing elements |
-
2012
- 2012-12-10 CN CN201210526613XA patent/CN102994797A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1356189A (en) * | 2000-12-02 | 2002-07-03 | 王有林 | Antioxidizing agent for metal powder |
| CN1599653A (en) * | 2001-12-04 | 2005-03-23 | 川铁矿业株式会社 | Copper alloy powder for electroconductive paste |
| JP2008235198A (en) * | 2007-03-23 | 2008-10-02 | Alpha Scientific Kk | Conductive powder, conductive paste, conductive sheet, circuit board, and electronic component mounting circuit board |
| CN101778684A (en) * | 2007-09-07 | 2010-07-14 | E.I.内穆尔杜邦公司 | Multi-element alloy powder containing silver and at least two non-silver containing elements |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130327 |