JP2008166457A - Structure of lead terminal of electronic component - Google Patents

Structure of lead terminal of electronic component Download PDF

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JP2008166457A
JP2008166457A JP2006353605A JP2006353605A JP2008166457A JP 2008166457 A JP2008166457 A JP 2008166457A JP 2006353605 A JP2006353605 A JP 2006353605A JP 2006353605 A JP2006353605 A JP 2006353605A JP 2008166457 A JP2008166457 A JP 2008166457A
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electronic component
lead wire
metallicon
lead
capacitor
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Hiroshi Totsuka
寛 戸塚
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Showa Denki Co Ltd
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Showa Denki Co Ltd
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Priority to JP2006353605A priority Critical patent/JP2008166457A/en
Priority to TW096128355A priority patent/TW200828365A/en
Priority to CNA2007101477357A priority patent/CN101211694A/en
Priority to KR1020070088324A priority patent/KR20080063040A/en
Publication of JP2008166457A publication Critical patent/JP2008166457A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/242—Terminals the capacitive element surrounding the terminal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Details Of Resistors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for eliminating a connection failure induced in a cooling test or during use of an element mounted in a vehicle or the like and reducing a dielectric loss or the like in the structure of a lead wire fixed to each of metallikon electrodes formed on both ends of the element included in various electronic components such as a film capacitor. <P>SOLUTION: A film capacitor 17 includes a capacitor element 18, metallikon electrodes 19, 19 formed on end faces 18a, 18a of the capacitor element by spraying molten metal such as lead or tin, and one and the other lead wires 20 fixed to the metallikon electrodes 19, 19, with use of an electric welder or the like. Any of metallikon junction surfaces 20a of the lead wires 20 is continuously formed to have a nearly mountain shape or a nearly saw tooth shape 20b in a vertical direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、フィルムコンデンサ等各種電子部品に於ける素子の両端面に形成したメタリコン電極に接続・固定したリード線の構成に於いて、その冷熱試験や車両等搭載使用時に誘起される接続不良をなくしかつ誘電損失等を少なくした高品質でなる電子部品のリード端子の構造に関する。 In the present invention, in the configuration of the lead wire connected and fixed to the metallicon electrodes formed on both end faces of the elements in various electronic parts such as film capacitors, the connection failure induced when using the cold test or mounting on the vehicle etc. The present invention relates to a structure of a lead terminal of a high quality electronic component that eliminates loss and reduces dielectric loss.

この種、従来の技術の第１の例によれば、特開２００４−２３５４８５の公開特許公報に開示されたコンデンサに係る技術がある。これについて説明すれば、図９に示すように、コンデンサ１は、金属化フィルムが巻回されたコンデンサ素子２を有し、コンデンサ素子２の両端面に形成されたメタリコン電極３、３にリード線４、４が接続されている。リード線４、４は、導線（より線又は単線）を絶縁被覆したものであり、リード線４、４の一端部において、導線４ａ、4ａが露出され、露出された導線４ａ、4ａの下端４ｂ、４ｂがスポット溶接又ははんだ付けによりメタリコン電極３、３に接続されている。そして、このような構成物が、ケース５に収納され、ケース５にエポキシ等の樹脂（図示せず）が充填され封止されて、コンデンサ１が構成されている。このように構成されたコンデンサ１は、さまざまな環境で使用されるが、高温で高湿度の周囲環境で使用される場合も多い。コンデンサ素子２は、ケース５内で樹脂封止されており、高湿度でも水分が直接にコンデンサ素子２に付着することはないが、リード線４、４がケース５の開口５ａ側から樹脂内に入りこんでいるため、リード線４、４の絶縁被覆と導線４ａ、4ａの間、又は導線４ａ、4ａがより線である場合は線の間を伝わって湿気が浸入する可能性がある。この浸入した湿気は、メタリコン電極３、３を介してコンデンサ素子２の内部に入りこみ、コンデンサ素子２を劣化させ、性能低下の要因となる場合がある。 According to this type of first example of the conventional technique, there is a technique related to a capacitor disclosed in Japanese Patent Application Laid-Open No. 2004-235485. If this is demonstrated, as shown in FIG. 9, the capacitor | condenser 1 has the capacitor | condenser element 2 by which the metallized film was wound, and lead wire is connected to the metallicon electrodes 3 and 3 formed in the both end surfaces of the capacitor | condenser element 2. FIG. 4 and 4 are connected. The lead wires 4 and 4 are obtained by insulatingly covering a lead wire (stranded wire or single wire). The lead wires 4a and 4a are exposed at one end of the lead wires 4 and 4, and the exposed lower ends 4b of the lead wires 4a and 4a. 4b are connected to the metallicon electrodes 3 and 3 by spot welding or soldering. Such a component is housed in the case 5, and the case 5 is filled with a resin such as epoxy (not shown) and sealed to form the capacitor 1. The capacitor 1 configured as described above is used in various environments, but is often used in a high temperature and high humidity ambient environment. The capacitor element 2 is resin-sealed in the case 5, and moisture does not directly adhere to the capacitor element 2 even at high humidity, but the lead wires 4 and 4 are inserted into the resin from the opening 5 a side of the case 5. Since it penetrates, moisture may enter between the insulation coating of the lead wires 4 and 4 and the conducting wires 4a and 4a or when the conducting wires 4a and 4a are stranded wires. The infiltrated moisture may enter the inside of the capacitor element 2 through the metallicon electrodes 3 and 3 to deteriorate the capacitor element 2 and cause a decrease in performance.

この種、従来の技術の第２の例によれば、特開２００１−３３２４４４の公開特許公報に開示された電子部品すなわちフィルムコンデンサに係る技術がある。これについて説明すれば、図１０に示すように、コンデンサ６は両端面にメタリコン電極７、７を形成し、このメタリコン電極７、７に引出線としてのリード線８、８を取着したフィルムコンデンサ素子９を、一方端部を開口した樹脂又は金属からなるケース１０の所望の位置に収納し、このケース１０内の空隙部に液状樹脂を注入し、この液状樹脂が硬化する前に液状樹脂面に、例えば前記液状樹脂と同一材質からなる樹脂板１１を配設し、前記液状樹脂を硬化させ、ケース１０内の空隙部に上面に樹脂板１１を固着した樹脂層１２を形成してなるものである。なお、本構造において樹脂板１１は、図１０に示すようにケース１０に収納するフィルムコンデンサ素子９から導出するリード線８、８の引出部として適宜な位置にリード線挿通孔１１ａ、１１ａを設け、ケース１０の内径寸法より若干小さめに設定している。フィルムコンデンサ６によれば、樹脂層１２上に樹脂板１１を固着した構成とすることにより、樹脂層１２を構成する液状樹脂の硬化過程で発生する気泡及び空気抜けによって起こるこの部分への貫通型のピンホール（図示せず）が直接外気に通ずることはなく、コンデンサの特性の劣化要因は解消される。 According to a second example of this type of conventional technique, there is a technique related to an electronic component, that is, a film capacitor disclosed in Japanese Patent Application Laid-Open No. 2001-332444. Describing this, as shown in FIG. 10, a capacitor 6 is formed with metallicon electrodes 7 and 7 on both end faces, and film capacitors having lead wires 8 and 8 as lead lines attached to the metallicon electrodes 7 and 7. The element 9 is housed in a desired position of a case 10 made of a resin or metal having one end opened, and a liquid resin is injected into the gap in the case 10 before the liquid resin is cured. In addition, for example, a resin plate 11 made of the same material as the liquid resin is disposed, the liquid resin is cured, and a resin layer 12 having the resin plate 11 fixed on the upper surface is formed in a gap in the case 10. It is. In this structure, the resin plate 11 is provided with lead wire insertion holes 11a and 11a at appropriate positions as lead portions for the lead wires 8 and 8 led out from the film capacitor element 9 housed in the case 10 as shown in FIG. The inner diameter of the case 10 is set slightly smaller. According to the film capacitor 6, the resin plate 11 is fixed on the resin layer 12, thereby penetrating into this portion caused by air bubbles and air escape generated in the curing process of the liquid resin constituting the resin layer 12. This pinhole (not shown) does not directly lead to the outside air, and the deterioration factor of the capacitor characteristics is eliminated.

次に、従来の技術に於ける電子部品としてのフィルムコンデンサのリード端子の構造は、その要部を切断した図１１に示す断面図に示すとおりである。該フィルムコンデンサ１３は、鉛や錫等の材料でなる溶液を吹付け機でフィルムコンデンサ素子１４の両端面１４ａ、１４ａ（図面は一方の端面を省略している）に溶射してメタリコン電極１５、１５を形成する。そして、この両端面１４ａ、１４ａにリード端子としての例えば、単線の真円ワイヤーでなる両リード線１６、１６の下端部分１６ａ、１６ａを電気溶接機（図示せず）等のリード溶接電極で圧着しかつ溶解させ、該メタリコン電極１５、１５に前記両リード線１６、１６の下端部分１６ａ、１６ａを固定する。
特開２００４−２３５４８５公開特許公報 特開２００１−３３２４４４公開特許公報 Next, the structure of a lead terminal of a film capacitor as an electronic component in the prior art is as shown in a sectional view shown in FIG. The film capacitor 13 is formed by spraying a solution made of a material such as lead or tin onto both end faces 14a and 14a of the film capacitor element 14 with a spraying machine (one end face is omitted in the drawing). 15 is formed. Then, the lower end portions 16a, 16a of both the lead wires 16, 16 made of, for example, a single round wire as lead terminals are crimped to the both end faces 14a, 14a with lead welding electrodes such as an electric welding machine (not shown). And the lower end portions 16a and 16a of the lead wires 16 and 16 are fixed to the metallicon electrodes 15 and 15, respectively.
Japanese Patent Laid-Open No. 2004-235485 Japanese Patent Laid-Open No. 2001-332444

従来の技術に於ける第１の例によれば、コンデンサ１の導出された真円形状でなる導線４ａ、４ａの下端４ｂ、４ｂの表面が円周面で滑らかであり、この下端４ｂ、４ｂがメタリコン電極３、３に溶接又は半田付けにより固定されている。而して、このコンデンサ１はあらゆる寒暖の地域にも適用できるように例えば、車両に搭載される前に通例として冷熱試験が実施され、この温度変化を伴う試験の際に該コンデンサ１のリード線４の導線４ａ、４ａの下端４ｂ、４ｂが上、下に膨張・収縮作用を奏し、該導線４ａ、４ａの下端４ｂ、４ｂがメタリコン電極３、３から接触不良や長期の使用で離脱することがあり、このため該コンデンサ１の誘電正接（ｔａｎδ）が大きくかつ誘電損失が増大し、生産段階での不良のものや量産化仕様に適さないコンデンサ１が製作されるという問題点があった。 According to the first example in the prior art, the surfaces of the lower ends 4b, 4b of the lead wires 4a, 4a, which are derived from the perfect circle of the capacitor 1, are smooth on the circumferential surface, and the lower ends 4b, 4b. Is fixed to the metallicon electrodes 3 and 3 by welding or soldering. Thus, for example, a cold test is usually performed before the capacitor 1 is mounted on a vehicle so that the capacitor 1 can be applied to any cold and warm regions. The lower ends 4b and 4b of the fourth conductors 4a and 4a expand and contract upward and downward, and the lower ends 4b and 4b of the conductors 4a and 4a are detached from the metallicon electrodes 3 and 3 due to poor contact or long-term use. For this reason, there is a problem that the dielectric loss tangent (tan δ) of the capacitor 1 is large and the dielectric loss is increased, so that a defective capacitor in the production stage or a capacitor 1 not suitable for mass production specification is manufactured.

従来の技術に於ける第２の例によれば、フィルムコンデンサ６のコンデンサ素子９のメタリコン電極７、７にリード線８、８の下端部分を取着した構成であり、前述した従来の技術に於ける第１の例と同様にメタリコン電極７、７の取着部分に於ける該リード線８、８の下端部分の表面がフラット又は円周面に形成されている。そこで、前記従来の技術の第１の例と同様な理由によりリード線８、８の下端部分がメタリコン電極７、７から接触不良や長期の使用で離脱することがあり、このため該フィルムコンデンサ６の誘電正接（ｔａｎδ）が大きくかつ誘電損失が増大し、生産段階での不良が惹起され、量産化仕様に適さないフィルムコンデンサ６が製作されるという問題点があった。 According to the second example in the prior art, the lower end portion of the lead wires 8 and 8 is attached to the metallicon electrodes 7 and 7 of the capacitor element 9 of the film capacitor 6. As in the first example, the surfaces of the lower end portions of the lead wires 8 and 8 at the attachment portions of the metallicon electrodes 7 and 7 are formed flat or circumferentially. Therefore, for the same reason as in the first example of the prior art, the lower end portions of the lead wires 8 and 8 may be detached from the metallicon electrodes 7 and 7 due to poor contact or long-term use. Has a large dielectric loss tangent (tan δ) and increased dielectric loss, causing a defect in the production stage, and producing a film capacitor 6 that is not suitable for mass production.

従来の技術に於ける電子部品としてのフィルムコンデンサ１３はあらゆる寒暖の地域にも適用できるように例えば、−４０（℃）から＋１５０（℃）の条件下で各１時間毎に繰返して冷熱試験を実施する。この冷熱試験により該フィルムコンデンサ１３のリード線１６、１６の下端部分１６ａ、１６ａは図１１に示す矢印Ａ方向及び矢印Ｂ方向にメタリコン電極１５、１５の中を下降・上昇作用や収縮・膨張作用を行ない、該リード線１６、１６の下端部分１６ａ、１６ａとメタリコン電極１５、１５の接触部分に空隙Ｓが発生すると共に接合・連結の不良状態を誘起し、フィルムコンデンサ１３の誘電正接（ｔａｎδ）を大きくし、誘電損失が増大するという弊害があった。
本発明が解決しようとする課題は、背景技術で述べた問題点を解決することにある。 In order to apply the film capacitor 13 as an electronic component in the prior art to any cold and warm area, for example, a cold test is repeatedly performed every hour under the condition of −40 (° C.) to +150 (° C.). carry out. By this thermal test, the lower end portions 16a and 16a of the lead wires 16 and 16 of the film capacitor 13 are lowered and raised and contracted and expanded in the metallicon electrodes 15 and 15 in the directions of arrows A and B shown in FIG. And a gap S is generated at the contact portion between the lower end portions 16a and 16a of the lead wires 16 and 16 and the metallicon electrodes 15 and 15 and a poor connection / connection state is induced, and the dielectric loss tangent (tan δ) of the film capacitor 13 is generated. There is a negative effect that the dielectric loss increases.
The problem to be solved by the present invention is to solve the problems described in the background art.

本発明に係る電子部品のリード線端子の構造は叙上した課題を解決すべくしたことを目的とし、フィルムコンデンサ等各種電子部品に於ける素子の両端面に形成したメタリコン電極に接続・固定したリード線の構成に於いて、その冷熱試験や車両等搭載使用時に誘起される接続不良をなくし、誘電正接（ｔａｎδ）等を小さく設定できると共に誘電損失等を少なくして高品質の電子部品を提供するものであって、次の構成、手段から成立する。 The structure of the lead terminal of the electronic component according to the present invention is intended to solve the above-described problems, and is connected and fixed to the metallicon electrodes formed on both end faces of the elements in various electronic components such as a film capacitor. In the configuration of the lead wire, high-quality electronic components can be provided by eliminating the connection failure induced by using the thermal test or mounting on vehicles, reducing the dielectric loss tangent (tan δ), and reducing dielectric loss. It consists of the following constitution and means.

すなわち、請求項１記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面のいずれかの面を略凹陥状又は略山形状若しくは略鋸歯状に垂直方向に一連に形成したことを特徴とする。 That is, according to the first aspect of the present invention, the metallicon electrodes formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powdered. In the coated electronic component, any one of the metallicon electrode bonding surfaces of the lead wire is formed in a series of vertical shapes in a substantially concave shape, a substantially mountain shape, or a substantially serrated shape.

請求項２記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の一方面及び／又は他方面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に形成したことを特徴とする。 According to the second aspect of the present invention, the metallicon electrodes formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powder-coated. In the electronic component according to the present invention, one surface and / or the other surface of the metallicon electrode bonding surface of the lead wire are formed in a series in a vertical direction in a substantially concave shape, a substantially mountain shape, or a sawtooth shape.

請求項３記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の周面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に周設したことを特徴とする。 According to the third aspect of the present invention, the metallicon electrode formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powder-coated. In the electronic component as described above, the peripheral surface of the metallicon electrode bonding surface of the lead wire is continuously arranged in a vertical direction in a substantially concave shape, a substantially mountain shape, or a sawtooth shape.

請求項４記載の発明によれば、請求項１、２又は３記載の発明に於いて、前記電子部品はフィルムコンデンサ、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器又はバリスタでなることを特徴とする。 According to a fourth aspect of the present invention, in the first, second, or third aspect, the electronic component is a film capacitor, a ceramic capacitor, a variable capacitor, a resistor, a variable resistor, or a varistor. And

請求項５記載の発明によれば、請求項１、２又は３記載の発明に於いて、前記一方、他方のリード線は単線又は撚線でなることを特徴とする。 According to a fifth aspect of the present invention, in the first, second, or third aspect of the invention, the one or the other lead wire is a single wire or a stranded wire.

本発明に係る電子部品のリード端子の構造は叙上の構成を有するので次の効果がある。
すなわち、請求項１記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面のいずれかの面を略凹陥状又は略山形状若しくは略鋸歯状に垂直方向に一連に形成したことを特徴とする電子部品のリード端子の構造を提供する。
このような構成としたので、電子部品の素子の両端面に形成したメタリコン電極に一方、他方のリード線が確実に接続・固定され、温度変化を伴う冷熱試験に際し又は寒暖地域での車載等使用に於いて、該一方、他方のリード線の接続不良又は接合不良を生じることが全くなく該電子部品の誘電正接（ｔａｎδ）等を常に小さく設定・保持でき、誘電損失等を大幅に減少させ高品質かつ耐久性の高い各種の電子部品を提供できることができるという効果がある。 Since the structure of the lead terminal of the electronic component according to the present invention has the above configuration, the following effects are obtained.
That is, according to the first aspect of the present invention, the metallicon electrodes formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powdered. A lead of an electronic component, wherein any one of the metallicon electrode bonding surfaces of the lead wire is formed in a series of vertical shapes in a substantially concave shape, a substantially mountain shape, or a substantially saw-tooth shape in a coated electronic component. Provide the structure of the terminal.
Because of this structure, the lead wire on the other side is securely connected and fixed to the metallicon electrodes formed on both end faces of the electronic component element. In this case, it is possible to always set and maintain the dielectric loss tangent (tan δ) etc. of the electronic component without any connection failure or bonding failure of the other lead wire, greatly reducing dielectric loss, etc. There is an effect that various kinds of electronic parts having high quality and high durability can be provided.

請求項２記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の一方面及び／又は他方面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に形成したことを特徴とする電子部品のリード端子の構造を提供する。
このような構成としたので、電子部品の素子の両端面に形成したメタリコン電極に一方、他方のリード線の下端部、つまりメタリコン電極接合面の両側面つまり一方面及び／又は他方面を略凹凸状又は略山形状に一連に形成し確実に接続・固定され、温度変化を伴う冷熱試験に際し又は寒暖地域での車載等使用に於いて、該一方、他方のリード線の接続不良又は接合不良を生じることが全くなく該電子部品の誘電正接（ｔａｎδ）等を常に小さく設定・保持でき、誘電損失等を大幅に減少させ高品質かつ耐久性の高い各種の電子部品を提供し、併せて前記一方、他方のリード線のメタリコン電極接合面は例えば、自動リード溶接機のリードフォーミング機構等簡単なプレス金型で簡易・迅速に製作でき該電子部品の量産性を高めるという効果がある。 According to the second aspect of the present invention, the metallicon electrodes formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powder-coated. An electronic component lead comprising: a metallicon electrode joint surface of the lead wire, wherein one surface and / or the other surface of the lead wire are formed in series in a vertical direction in a substantially concave shape, a substantially mountain shape, or a sawtooth shape. Provide the structure of the terminal.
Because of this structure, the lower end of the other lead wire, that is, both side surfaces of the metallicon electrode bonding surface, that is, one surface and / or the other surface is substantially uneven on the metallicon electrodes formed on both end surfaces of the electronic component element. In the case of a cold test with temperature change or when used in a vehicle such as in a cold or warm area, the other lead wire is poorly connected or poorly connected. The dielectric loss tangent (tan δ) etc. of the electronic component can be always set and kept small, and various electronic components with high quality and high durability can be provided by greatly reducing dielectric loss, etc. The metal lead electrode joint surface of the other lead wire can be easily and quickly manufactured with a simple press mold such as a lead forming mechanism of an automatic lead welding machine, and the effect of increasing the mass productivity of the electronic component A.

請求項３記載の発明によれば、電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の周面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に周設したことを特徴とする電子部品のリード端子の構造を提供する。
このような構成としたので、電子部品の素子の両端面に形成したメタリコン電極に一方、他方のリード線の下端部、つまりメタリコン電極接合面に略凹陥状を一連に形成し、確実に接続・固定され、温度変化を伴う冷熱試験に際し又は寒暖地域での車載等使用に於いて、該一方、他方のリード線の接続不良又は接合不良を生じることが全くなく該電子部品の誘電正接（ｔａｎδ）等を常に小さく設定・保持でき、誘電損失等を大幅に減少させ高品質かつ耐久性の高い各種の電子部品を提供し、併せて前記一方、他方のリード線のメタリコン電極接合面は例えば、自動リード溶接機のリードフォーミング機構等簡単なプレス金型で簡易・迅速に製作でき該電子部品の量産性を高めるという効果がある。 According to the third aspect of the present invention, the metallicon electrode formed on both end faces of the element of the electronic component, the other lead wire connected to and fixed to the metallicon electrode, and the element of the electronic component are powder-coated. An electronic component comprising: a lead terminal structure for an electronic component, wherein the peripheral surface of the metallicon electrode joint surface of the lead wire is continuously arranged in a vertical direction in a substantially concave shape, a substantially mountain shape, or a sawtooth shape. provide.
Because of this structure, a series of substantially concave shapes are formed in the lower end of the other lead wire, that is, the metallicon electrode joint surface on the metallicon electrode formed on both end faces of the element of the electronic component. Fixed and tangent of the electronic component (tan δ) of the electronic component without causing any connection failure or connection failure of the other lead wire during a cold test with temperature change or when used in a vehicle in a cold or warm area Etc. can always be set and kept small, and dielectric loss etc. can be greatly reduced to provide various electronic parts with high quality and high durability. A simple press die such as a lead forming mechanism of a lead welding machine can be manufactured easily and quickly, and the mass productivity of the electronic parts is improved.

請求項４記載の発明によれば、前記電子部品はフィルムコンデンサ、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器又はバリスタでなることを特徴とする請求項１、２又は３記載の電子部品のリード端子の構造を提供する。
このような構成としたので、フィルムコンデンサ、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器、バリスタ等各種の電子部品の素子の両端面に形成したメタリコン電極に一方、他方のリード線が確実に接続・固定され、温度変化を伴う冷熱試験に際し又は寒暖地域での車載等使用に於いて、該一方、他方のリード線の接続不良又は接合不良を生じることが全くなく該フィルムコンデンサ、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器、バリスタ等各種の電子部品の誘電正接（ｔａｎδ）等を常に小さく設定・保持でき、誘電損失等を大幅に減少させ高品質かつ耐久性の高い広範囲の電子部品に適用できるという効果がある。 According to a fourth aspect of the present invention, the electronic component is a film capacitor, a ceramic capacitor, a variable capacitor, a resistor, a variable resistor, or a varistor. Provide lead terminal structure.
Because of this configuration, the other lead wire is securely attached to the metallicon electrode formed on both end faces of various electronic components such as film capacitors, ceramic capacitors, variable capacitors, resistors, variable resistors, and varistors. The film capacitor, the ceramic capacitor, and the like, without any connection failure or bonding failure of the other lead wire, in connection with the fixed / fixed temperature test with temperature change or in vehicle use etc. A wide range of high-quality, high-durability electronic components that can always set and maintain the dielectric loss tangent (tan δ), etc. of various electronic components such as variable capacitors, resistors, variable resistors, and varistors. There is an effect that can be applied to.

請求項５記載の発明によれば、前記一方、他方のリード線は単線又は撚線でなることを特徴とする請求項１、２又は３記載の電子部品のリード端子の構造を提供する。
このような構成としたので、一方、他方のリード線は汎用ＣＰ線等の単線等に適用でき、本発明の実施・実現を容易にできるという効果がある。 According to a fifth aspect of the invention, there is provided the structure of the lead terminal of the electronic component according to the first, second or third aspect, wherein the one and the other lead wires are single wires or stranded wires.
Since such a configuration is adopted, the other lead wire can be applied to a single wire such as a general-purpose CP wire, and the present invention can be easily implemented and realized.

以下、本発明に係る電子部品のリード端子の構造に於ける実施の形態について添付図面に基づき詳細に説明する。 Embodiments of the structure of a lead terminal for an electronic component according to the present invention will be described below in detail with reference to the accompanying drawings.

図１は、本発明に係る電子部品としてのフィルムコンデンサのリード線接続部分の要部を示す一部切欠した側面図である。
図２は、本発明に係るフィルムコンデンサのコンデンサ素子の両端面に形成したメタリコン電極にリード線を接続・固定した状態を示す一部切欠した斜視図である。
図３は、本発明に係る電子部品としてのフィルムコンデンサに適用するリード線の構造を示すものでその要部を拡大した斜視図である。 FIG. 1 is a partially cutaway side view showing a main part of a lead wire connecting portion of a film capacitor as an electronic component according to the present invention.
FIG. 2 is a partially cutaway perspective view showing a state in which a lead wire is connected and fixed to metallicon electrodes formed on both end faces of the capacitor element of the film capacitor according to the present invention.
FIG. 3 is an enlarged perspective view showing the structure of a lead wire applied to a film capacitor as an electronic component according to the present invention.

１７は電子部品の一種であって、車両に搭載される定電圧装置やその他電装品のパーツとしてのフィルムコンデンサである。該フィルムコンデンサ１７は大概してコンデンサ素子１８と、その端面１８ａ、１８ａの両方に鉛や錫等の溶融金属を溶射して形成されるメタリコン電極１９、１９と、このメタリコン電極１９、１９に電気溶接機等により接続・固定する一方、他方のリード線２０とで構成される。
尚、図１に於いては一方のリード線２０は省略している。 Reference numeral 17 denotes a kind of electronic component, which is a film capacitor as a part of a constant voltage device or other electrical component mounted on a vehicle. The film capacitor 17 is generally composed of a capacitor element 18, metallicon electrodes 19, 19 formed by spraying molten metal such as lead or tin on both end faces 18 a, 18 a, and electric welding to the metallicon electrodes 19, 19. It is composed of the other lead wire 20 that is connected and fixed by a machine or the like.
In FIG. 1, one lead wire 20 is omitted.

以下はフィルムコンデンサ１７に於ける一方側のメタリコン電極１９、一方側のリード線２０等について説明する。
前記リード線２０はフィルムコンデンサ１７のリード端子としての機能を有し例えば、ＣＰ線であって、鉄（Ｆｅ）や銅（Ｃｕ）等の導電材料で通電機能を有し、その断面形状が真円状、矩形状等であり全体として丸棒状、角棒状若しくはいわゆるワイヤーで構成される。このリード線２０は上端部２０Ａと下端部２０Ｂで構成され、この下端部２０Ｂにメタリコン接合面２０ａが存在する。該リード線２０は本実施の形態では被覆部材等で被覆されておらず、被覆部材でリード線２０を被覆するときはその上端部２０Ａ等の一部が被覆される。該リード線２０の下端部２０Ｂは裸線となる。 The following will describe the metallicon electrode 19 on one side, the lead wire 20 on one side, etc. in the film capacitor 17.
The lead wire 20 has a function as a lead terminal of the film capacitor 17 and is, for example, a CP wire having a current-carrying function with a conductive material such as iron (Fe) or copper (Cu), and its sectional shape is true. It has a circular shape, a rectangular shape or the like, and is composed of a round bar shape, a square bar shape, or a so-called wire as a whole. The lead wire 20 is composed of an upper end portion 20A and a lower end portion 20B, and a metallicon joint surface 20a exists at the lower end portion 20B. In this embodiment, the lead wire 20 is not covered with a covering member or the like, and when the lead wire 20 is covered with the covering member, a part of the upper end portion 20A or the like is covered. The lower end portion 20B of the lead wire 20 is a bare wire.

該リード線２０のメタリコン接合面２０ａは該リード線２０の表面であって、前・後面又は左・右面のうち少なくとも２面又は１面で構成するときやその全周面で構成するときがある。そして、該リード線２０のメタリコン接合面２０ａのいずれかの面を略山形状又は略鋸歯状２０ｂに垂直方向に一連に形成する。図１及び図３に示すメタリコン接合面２０ａはリード線２０の表面のうちの左・右面に略山形状若しくは略鋸歯状２０ｂを垂直方向に一連に形成している。図２に示すメタリコン接合面２０ａはリード線２０の表面のうち前（Ｆ）・後（Ｒ）面に略山形状若しくは略鋸歯状２０ｂを形成している。而して、図１ないし図３に示すメタリコン接合面２０ａに於いては該リード線２０の表面のうち２つの面に前記略山形状若しくは略鋸歯状２０ｂを垂直方向に一連に形成した構成である。 The metallicon bonding surface 20a of the lead wire 20 is the surface of the lead wire 20, and may be constituted by at least two or one of the front / rear surface or the left / right surface, or may be constituted by the entire circumferential surface thereof. . Then, any surface of the metallicon joint surface 20a of the lead wire 20 is formed in a series in a vertical direction in a substantially mountain shape or a substantially serrated shape 20b. The metallicon joint surface 20a shown in FIG. 1 and FIG. 3 has a series of substantially mountain shapes or substantially serrated shapes 20b formed in a vertical direction on the left and right surfaces of the surface of the lead wire 20. The metallicon joint surface 20a shown in FIG. 2 forms a substantially mountain shape or a substantially serrated shape 20b on the front (F) / rear (R) surface of the surface of the lead wire 20. Accordingly, the metallicon joint surface 20a shown in FIGS. 1 to 3 has a configuration in which the above-mentioned substantially mountain shape or substantially saw-tooth shape 20b is formed in a series in the vertical direction on two surfaces of the surface of the lead wire 20. is there.

かくて、図１ないし図３に示すように、前記リード線２０の表面に於けるメタリコン接合面２０ａは略山形状又は略鋸歯状２０ｂを形成する。この形成方法は後述するように、例えば自動リード溶接機を使用し、このリードフォーミング機構の金型で該リード線２０の下端部２０Ｂの左・右面又は前（Ｆ）・後（Ｒ）面をプレス加工する。またほかの形成方法としては切削機械等で該リード線２０の表面を切削する。 Thus, as shown in FIGS. 1 to 3, the metallicon joint surface 20a on the surface of the lead wire 20 forms a substantially mountain shape or a substantially serrated shape 20b. As will be described later, this forming method uses, for example, an automatic lead welding machine, and the left / right side or the front (F) / rear (R) side of the lower end portion 20B of the lead wire 20 with the die of this lead forming mechanism. Press work. As another forming method, the surface of the lead wire 20 is cut with a cutting machine or the like.

そして、上述から略山形状又は略鋸歯状２０ｂに形成した一方、他方のリード線２０のメタリコン接合面２０ａは前記コンデンサ素子１８の両端面１８ａ、１８ａに形成したメタリコン電極１９に当接すると共に該一方、他方のリード線２０の下端部２０Ｂに後述する例えば、電気溶接機のリード溶接正・負電極２２ａ、２２ｂで通電することにより、該メタリコン電極１９部位が加熱され、該メタリコン電極１９が溶融されて、該リード線２０のメタリコン接合面２０ａが該メタリコン電極１９に接続・固定する。 From the above, the metal lead contact surface 20a of the other lead wire 20 is formed in a substantially mountain shape or a substantially sawtooth shape 20b, while being in contact with the metallicon electrodes 19 formed on both end surfaces 18a, 18a of the capacitor element 18. When the lower end portion 20B of the other lead wire 20 is energized by, for example, lead welding positive / negative electrodes 22a and 22b of an electric welding machine, the metallicon electrode 19 is heated and the metallicon electrode 19 is melted. Thus, the metallicon joint surface 20 a of the lead wire 20 is connected and fixed to the metallicon electrode 19.

次に、本発明に係る電子部品のリード端子の構造の実施の形態について作用等を説明する。
当該電子部品、例えば、フィルムコンデンサ１７を工場で生産し、出荷する前には、一般的に電子部品等の品質保証を行なう意図で、冷熱試験を行なう。この冷熱試験は、例えば、当該電子部品等があらゆる寒暖地域にも適用できるように−４０（℃）から＋１５０（℃）の範囲内で１時間毎に繰返す試験であり、この冷熱試験下で一方、他方のリード線２０の接続不良等が発生しないことが必要である。また、当該電子部品等フィルムコンデンサ１７を出荷した後にも該フィルムコンデンサ１７等は車両等に搭載されて長時間の使用に際して一方、他方のリード線２０の接続不良等が無く安定した良品質を確保する必要がある。 Next, the operation and the like of the embodiment of the lead terminal structure of the electronic component according to the present invention will be described.
Before the electronic component, for example, the film capacitor 17 is produced at the factory and shipped, a cooling test is generally performed with the intention of quality assurance of the electronic component. This cold test is, for example, a test that is repeated every hour within a range of −40 (° C.) to +150 (° C.) so that the electronic component can be applied to all cold and warm regions. It is necessary that the connection failure of the other lead wire 20 does not occur. Further, even after the film capacitor 17 such as the electronic component is shipped, the film capacitor 17 is mounted on a vehicle or the like so that it can be used for a long time while the other lead wire 20 is not poorly connected and the like, and a stable good quality is ensured. There is a need to.

そこで、本発明に係る電子部品のリード端子の構造による電子部品等のフィルムコンデンサ１７は一方、他方のリード線２０のメタリコン接合面２０ａの垂直方向に一連に略山形状又は略鋸歯状２０ｂを形成しており、この一連の略山形状又は略鋸歯状２０ｂの面にメタリコン電極１９の鉛材料や錫材料が一方、他方のリード線２０を接続・固定するとき充分に溶融して這り込み、本発明では、従来の技術に比べてメタリコン接合面２０ａが略山形状又は略鋸歯状２０ｂによりその面積が拡大される。そして、前記冷熱試験等を行なっても一方、他方のリード線２０が図１１の従来の技術に示すような矢印Ａ方向及び矢印Ｂ方向への収縮・膨張作用を誘発することがなく、また、空隙Ｓも発生しない。そこで、該一方、他方のリード線２０のメタリコン接合面２０ａが常にメタリコン電極１９、１９に緊締状態に接続・固定する。そして、当該電子部品としてのフィルムコンデンサ１３の誘電正接（ｔａｎδ）を小さく設定でき、誘電損失を少なくし生産のときや出荷後に車載した製品としても安定した良品質を確保したフィルムコンデンサを提供できた。 Therefore, the film capacitor 17 such as an electronic component having the structure of the lead terminal of the electronic component according to the present invention forms a substantially mountain shape or a substantially serrated shape 20b in series in the direction perpendicular to the metallicon joint surface 20a of the other lead wire 20. The lead material or the tin material of the metallicon electrode 19 is melted sufficiently when the other lead wire 20 is connected and fixed to the surface of the series of substantially mountain shapes or substantially serrated shapes 20b. In the present invention, the area of the metallicon joint surface 20a is enlarged by a substantially mountain shape or a substantially serrated shape 20b as compared with the conventional technique. And even if the cold test etc. are performed, the other lead wire 20 does not induce contraction / expansion action in the direction of arrow A and arrow B as shown in the prior art of FIG. No gap S is generated. Therefore, the metallicon joint surface 20a of the other lead wire 20 is always connected and fixed to the metallicon electrodes 19 and 19 in a tightened state. In addition, the dielectric loss tangent (tan δ) of the film capacitor 13 as the electronic component can be set to be small, and the film capacitor can be provided in which the dielectric loss is reduced and the stable quality is ensured as a product mounted on the vehicle at the time of production or after shipment. .

次に、本発明に係る電子部品のリード端子の構造に於ける実施例について図４に基づき説明する。 Next, an embodiment in the structure of the lead terminal of the electronic component according to the present invention will be described with reference to FIG.

図４は、本発明に係る電子部品としてのフィルムコンデンサに適用するリード線の構造の実施例を示すものでその要部を拡大した斜視図である。 FIG. 4 is an enlarged perspective view showing an embodiment of a lead wire structure applied to a film capacitor as an electronic component according to the present invention.

本実施例ではこのリード線２０は上端部２０Ａと下端部２０Ｂで構成され、この下端部２０Ｂにメタリコン接合面２０ａが存在する。該リード線２０は本実施の形態では被覆部材等で被覆されておらず、被覆部材でリード線２０を被覆するときはその上端部２０Ａ等の一部が被覆される。該リード線２０の下端部２０Ｂは裸線となる。該リード線２０のメタリコン接合面２０ａは該リード線２０の表面であって、前・後面又は左・右面のうち少なくとも２面又は１面で構成するときや本実施例で示すようにその全周面に構成する。そして、該リード線２０のメタリコン接合面２０ａのいずれかの面を図４に示すように凹陥状２０ｃに垂直方向に一連に形成する。図４に示すメタリコン接合面２０ａはリード線の表面の全周面に渉り、該凹陥状２０ｃを垂直方向に周設している。 In this embodiment, the lead wire 20 is composed of an upper end portion 20A and a lower end portion 20B, and a metallicon joint surface 20a exists at the lower end portion 20B. In this embodiment, the lead wire 20 is not covered with a covering member or the like, and when the lead wire 20 is covered with the covering member, a part of the upper end portion 20A or the like is covered. The lower end portion 20B of the lead wire 20 is a bare wire. The metallicon joint surface 20a of the lead wire 20 is the surface of the lead wire 20, and when it is composed of at least two or one of the front / rear surface or the left / right surface, or as shown in this embodiment, the entire circumference thereof Configure on the surface. Then, any one of the metallicon joint surfaces 20a of the lead wire 20 is formed in a series in the vertical direction in the recessed shape 20c as shown in FIG. The metallicon joint surface 20a shown in FIG. 4 extends around the entire circumference of the surface of the lead wire, and the recess 20c is provided in the vertical direction.

本実施例に於けるリード線２０の加工方法やフィルムコンデンサ１７に備えるほかの構成部品等の構成及びその作用等は前述した本発明の実施の形態のものと略同一であり、その説明を省略する。 In this embodiment, the processing method of the lead wire 20 and the structure and operation of other components provided in the film capacitor 17 are substantially the same as those of the above-described embodiment of the present invention, and the description thereof is omitted. To do.

また、本発発明は、上述したフィルムコンデンサ１７に限定されず、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器又はバリスタ等の広範囲に於ける電子部品に適用することができる。さらに、前記リード線２０は単一線のみに限定されず、撚線で構成してもよい。 The present invention is not limited to the film capacitor 17 described above, but can be applied to a wide range of electronic components such as a ceramic capacitor, a variable capacitor, a resistor, a variable resistor, or a varistor. Furthermore, the lead wire 20 is not limited to a single wire, and may be formed of a stranded wire.

次に、本発明に係る電子部品としてのフィルムコンデンサ１７の製造手順について図５ないし図８に基づいて説明する。 Next, the manufacturing procedure of the film capacitor 17 as the electronic component according to the present invention will be described with reference to FIGS.

先づ、フィルムコンデンサ１７のコンデンサ素子１８を作製する。該コンデンサ素子１８のフィルム材料１８Ａは、図５（ａ）に示すように例えばＡｌ（アルミニウム）箔１８ｂとＰＥＴ（ポリエチレンテレフタレート）材料でなる誘電体フィルム１８ｃを蒸着・重合せて電極を構成する。このコンデンサ素子１８のフィルム材料１８Ａを汎用のフィルム巻取機（図示せず）で図５（ｂ）に示すように巻装し、コンデンサエレメント１８Ｂを構成する。そして、プレス機械を使用し、図５（ｃ）の矢印Ｐに示す方向に熱と加重を掛けて前記コンデンサエレメント１８Ｂ（１８）を偏平に成形する。ここで、コンデンサ素子１８が製作される。 First, the capacitor element 18 of the film capacitor 17 is produced. As shown in FIG. 5A, the film material 18A of the capacitor element 18 comprises an electrode by depositing and polymerizing a dielectric film 18c made of, for example, an Al (aluminum) foil 18b and a PET (polyethylene terephthalate) material. The film material 18A of the capacitor element 18 is wound with a general-purpose film winder (not shown) as shown in FIG. 5B to constitute a capacitor element 18B. Then, using a press machine, the capacitor element 18B (18) is formed flat by applying heat and load in the direction indicated by the arrow P in FIG. Here, the capacitor element 18 is manufactured.

次に、図６に示すように、コンデンサ素子１８の端面１８ａの両方にメタリコン電極１９を形成する。このメタリコン電極１９の形成方法は例えば、金属としての鉛や錫の溶液を汎用の吹付機（図示せず）で、そのノズルから該コンデンサ素子１８の端面１８ａに向かって溶射して形成する。該メタリコン電極１９の厚さｔはコンデンサ容量が２．７（μＦ）の場合、設計例として、例えば約０．５（ｍｍ）〜０．８（ｍｍ）程度であり、そのとき、このメタリコン電極１９に接続・固定するリード線２０の直径は約０．８（ｍｍ）から１（ｍｍ）程度である。
この設計例では、該メタリコン電極１９にリード線２０を接続・固定するとそのリード線２０の一方側面は該メタリコン電極１９の外側面から露出することとなり、該リード線２０のメタリコン接合面２０ａは一方面を形成することで本発明の目的を達成できる。 Next, as shown in FIG. 6, metallicon electrodes 19 are formed on both end surfaces 18 a of the capacitor element 18. The metallicon electrode 19 is formed, for example, by spraying a solution of lead or tin as a metal from its nozzle toward the end face 18a of the capacitor element 18 with a general-purpose sprayer (not shown). When the capacitor capacity is 2.7 (μF), the thickness t of the metallicon electrode 19 is, for example, about 0.5 (mm) to 0.8 (mm) as a design example. The diameter of the lead wire 20 connected and fixed to 19 is about 0.8 (mm) to 1 (mm).
In this design example, when the lead wire 20 is connected and fixed to the metallicon electrode 19, one side surface of the lead wire 20 is exposed from the outer surface of the metallicon electrode 19, and the metallicon joint surface 20a of the lead wire 20 is one. The object of the present invention can be achieved by forming the direction.

また、前記リード線２０の下端２０Ｂはメタリコン接合面２０ａを形成する必要がある。このメタリコン接合面２０ａの形成方法又は加工方法としては、図７（ａ）に示すように、例えば、自動リード溶接機（図示せず）のリードフォーミング機構で、一方金型２１ａ、他方金型２１ｂにより該リード線２０の下端部２０Ｂのメタリコン接合面２０ａを矢印Ｃ方向、矢印Ｄ方向にプレスし挟圧する。
ここで、前記一方金型２１ａ及び他方金型２１ｂは、前述した略山形状若しくは鋸歯状２０ｂ又は略凹陥状２０ｃの型形状を備えており、該メタリコン接合面２０ａには、図３又は図４に示すように略山形状若しくは略鋸歯状２０ｂ又は略凹陥状２０ｃに垂直方向に一連に形成される。 Further, the lower end 20B of the lead wire 20 needs to form a metallicon joint surface 20a. As a method of forming or processing the metallicon joint surface 20a, as shown in FIG. 7 (a), for example, a lead forming mechanism of an automatic lead welding machine (not shown) is used, one mold 21a and the other mold 21b. Thus, the metallicon joint surface 20a of the lower end portion 20B of the lead wire 20 is pressed in the direction of arrow C and the direction of arrow D and pinched.
Here, the one metal mold 21a and the other metal mold 21b are provided with the above-described substantially mountain shape, sawtooth shape 20b, or substantially recessed shape 20c, and the metallicon joint surface 20a has the shape shown in FIG. As shown in FIG. 4, the ridges are formed in a series in a vertical direction into a substantially mountain shape, a substantially serrated shape 20b or a substantially recessed shape 20c.

次に、前段の工程でリード線２０の下端部２０Ｂに略山形状若しくは略鋸歯状２０ｂ又は略凹陥状２０ｃを形成したメタリコン接合面２０ａの一面をメタリコン電極１９に当接すると共に例えば、電気溶接機（図示せず）の図７（ｂ）に示すようなリード溶接正・負電極２２ａ、２２ｂを該リード線２０の下端部２０Ｂのメタリコン接合面２０ａに押圧・接触する。これにより該リード線２０の下端部２０Ｂは通電作用を奏し、放熱現象を招来する。而して、この放熱現象によりリード線２０の下端部２０Ｂはメタリコン電極１９に溶着・固定する。
尚、図中、２２ｃはリード溶接正・負電極２２ａ、２２ｂに接続するリード線である。そして、メタリコン電極１９を含むこのコンデンサ素子１８をエポキシ樹脂材料でアンダーコート仕上げを行ない、最後に外装用のエポキシ樹脂材料を使用して粉体塗装機でコンデンサ素子１８やメタリコン電極１９及びリード線２０で構成されるフィルムコンデンサ１７に於けるメタリコン電極１９の接続部分等を含み該フィルムコンデンサ１７の全体について図８に示すように粉体塗装２３を行ない電子部品としてのフィルムコンデンサ１７が製作される。 Next, one surface of the metallicon joint surface 20a in which the lower end portion 20B of the lead wire 20 is formed with a substantially mountain shape, a substantially serrated shape 20b, or a substantially recessed shape 20c in the preceding step is brought into contact with the metallicon electrode 19 and, for example, Lead welding positive / negative electrodes 22a and 22b as shown in FIG. 7B (not shown) are pressed and brought into contact with the metallicon joint surface 20a of the lower end portion 20B of the lead wire 20. As a result, the lower end portion 20B of the lead wire 20 has an energizing action, causing a heat dissipation phenomenon. Thus, the lower end portion 20B of the lead wire 20 is welded and fixed to the metallicon electrode 19 by this heat dissipation phenomenon.
In the figure, reference numeral 22c denotes a lead wire connected to the lead welding positive / negative electrodes 22a, 22b. Then, the capacitor element 18 including the metallicon electrode 19 is undercoated with an epoxy resin material, and finally the capacitor element 18, the metallicon electrode 19 and the lead wire 20 are used with a powder coating machine using an exterior epoxy resin material. A film capacitor 17 as an electronic component is manufactured by performing powder coating 23 on the entire film capacitor 17 including the connection portion of the metallicon electrode 19 in the film capacitor 17 constituted as shown in FIG.

本発明に係る電子部品は小容量のものに限定されず、大容量のものにも適用できるが、特に小容量のフィルムコンデンサ１７に効果的である。すなわち、２．７（μＦ）程度の小量量のフィルムコンデンサ１７の設計基準は図６に示すように、横幅長Ｌが約１２（ｍｍ）、縦幅長Ｗが約８（ｍｍ）であり、そのメタリコン電極１９、１９の面積ＥはＥ＝Ｌ×Ｗで計算され、約９６（ｍｍ２）となる。
また、メタリコン電極１９の面積Ｅが特に、それ以下の小容量のフィルムコンデンサ１７では図１１に示す従来の技術によれば、冷熱試験中でリード線１６の膨張・収縮作用で該リード線１６がメタリコン電極１５との接続・固定状態が不安定化し、接続不良等を惹起し、誘電正接（ｔａｎδ）を大きくかつ誘電損失を惹起せしめた。然るに、本発明に係る電子部品のリード端子の構造によれば、これらの問題点が解決できた。 The electronic component according to the present invention is not limited to one having a small capacity, and can be applied to one having a large capacity, but is particularly effective for a film capacitor 17 having a small capacity. That is, as shown in FIG. 6, the design standard of the film capacitor 17 having a small amount of about 2.7 (μF) is such that the width L is about 12 (mm) and the length W is about 8 (mm). The area E of the metallicon electrodes 19 and 19 is calculated by E = L × W, and is about 96 (mm 2 ).
Further, in the case of a small-capacity film capacitor 17 in which the area E of the metallicon electrode 19 is particularly small, according to the conventional technology shown in FIG. The connection / fixed state with the metallicon electrode 15 became unstable, causing connection failure and the like, increasing the dielectric loss tangent (tan δ) and causing dielectric loss. However, according to the structure of the lead terminal of the electronic component according to the present invention, these problems can be solved.

本発明に係る電子部品としてのフィルムコンデンサのリード線接続部分の要部を示す一部切欠した側面図である。1 is a partially cutaway side view showing a main part of a lead wire connecting portion of a film capacitor as an electronic component according to the present invention. 本発明に係るフィルムコンデンサのコンデンサ素子の端面に形成したメタリコン電極にリード線を接続・固定した状態を示す一部切欠した斜視図であるFIG. 4 is a partially cutaway perspective view showing a state in which a lead wire is connected and fixed to a metallicon electrode formed on an end face of a capacitor element of a film capacitor according to the present invention. 本発明に係る電子部品としてのフィルムコンデンサに適用するリード線の構造を示すものでその要部を拡大した斜視図である。It is the perspective view which expanded the principal part by showing the structure of the lead wire applied to the film capacitor as an electronic component which concerns on this invention. 本発明に係る電子部品としてのフィルムコンデンサに適用するリード線の構造の実施例を示すものでその要部を拡大した斜視図である。It is the perspective view which expanded the principal part by showing the Example of the structure of the lead wire applied to the film capacitor as an electronic component which concerns on this invention. 本発明に係る電子部品としてのフィルムコンデンサのコンデンサ素子を製造する手順を示す図であり、（ａ）はフィルム材料を示す垂直断面図、（ｂ）は該フィルム材料をフィルム巻取機で巻装して構成したコンデンサエレメントの斜視図、（ｃ）は該コンデンサエレメントをプレス機械で偏平に構成した斜視図である。It is a figure which shows the procedure which manufactures the capacitor | condenser element of the film capacitor as an electronic component which concerns on this invention, (a) is a vertical sectional view which shows film material, (b) is winding this film material with a film winder FIG. 4C is a perspective view of the capacitor element configured as described above, and FIG. 本発明に係る電子部品としてのフィルムコンデンサのコンデンサ素子の両端面にメタリコン電極を形成した斜視図である。It is the perspective view which formed the metallicon electrode in the both end surfaces of the capacitor | condenser element of the film capacitor as an electronic component which concerns on this invention. 本発明に係る電子部品としてのフィルムコンデンサのコンデンサ素子の両端面にメタリコン電極に接続・固定するリード線の製作手順を示す図であって、（ａ）はリード線のメタリコン接合面の形状を製作する状態を示す側面図、（ｂ）は該リード線のメタリコン接合面をコンデンサ素子のメタリコン電極に固着する状態を示す側面図である。It is a figure which shows the manufacture procedure of the lead wire connected and fixed to a metallicon electrode on both end surfaces of the capacitor element of the film capacitor as the electronic component according to the present invention, and (a) manufactures the shape of the metallicon joint surface of the lead wire. FIG. 4B is a side view showing a state in which the metallicon joint surface of the lead wire is fixed to the metallicon electrode of the capacitor element. 本発明に係る電子部品としてのフィルムコンデンサに於ける製造完了時のときの状態を示す斜視図である。It is a perspective view which shows the state at the time of completion of manufacture in the film capacitor as an electronic component which concerns on this invention. 従来の技術に於けるコンデンサの第１の例を示す斜視図である。It is a perspective view which shows the 1st example of the capacitor | condenser in a prior art. 従来の技術に於けるフィルムコンデンサの第２の例を示す垂直断面図である。It is a vertical sectional view showing a second example of a film capacitor in the prior art. 従来の技術に於ける電子部品としてのフィルムコンデンサのリード端子の要部を切断した断面図である。It is sectional drawing which cut | disconnected the principal part of the lead terminal of the film capacitor as an electronic component in the prior art.

符号の説明Explanation of symbols

１７ フィルムコンデンサ（電子部品）
１８ コンデンサ素子
１８Ａ コンデンサ素子のフィルム材料
１８Ｂ コンデンサ素子のコンデンサエレメント
１８ａ コンデンサ素子の端面
１８ｂ コンデンサ素子のフィルム材料のＡｌ（アルミニウム）箔
１８ｃ コンデンサ素子のフィルム材料の誘電体フィルム
１９ メタリコン電極
２０ リード線
２０Ａ リード線の上端部
２０Ｂ リード線の下端部
２０ａ リード線のメタリコン接合面
２０ｂ リード線のメタリコン接合面に形成した略山形状（略鋸歯状）
２０ｃ リード線のメタリコン接合面に形成した略凹陥状
２１ａ 自動リード溶接機の一方金型
２１ｂ 自動リード溶接機の他方金型
２２ａ リード溶接正電極
２２ｂ リード溶接負電極
２３ 粉体塗装
17 Film capacitors (electronic parts)
18 Capacitor element 18A Capacitor element film material 18B Capacitor element capacitor element 18a Capacitor element film end face 18b Capacitor element film material Al (aluminum) foil 18c Capacitor element film material dielectric film 19 Metallicon electrode 20 Lead wire 20A Lead Upper end portion 20B of lead wire Lower end portion 20a of lead wire Metallicon joint surface 20b of lead wire A substantially mountain shape (substantially serrated) formed on the metallicon joint surface of the lead wire
20c A substantially concave 21a formed on the metallicon joint surface of the lead wire One die 21b of the automatic lead welding machine The other die 22a of the automatic lead welding machine Lead welding positive electrode 22b Lead welding negative electrode 23 Powder coating

Claims (5)

電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面のいずれかの面を略凹陥状又は略山形状若しくは略鋸歯状に垂直方向に一連に形成したことを特徴とする電子部品のリード端子の構造。 Metallicon electrodes formed on both end faces of an electronic component element, and the other lead wire connected to and fixed to the metallicon electrode, and an electronic component formed by powder coating the electronic component element, the lead wire A structure of a lead terminal of an electronic component, wherein any surface of the metallicon electrode joint surface is formed in a series of vertical shapes in a substantially concave shape, a substantially mountain shape, or a substantially sawtooth shape. 電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の一方面及び／又は他方面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に形成したことを特徴とする電子部品のリード端子の構造。 Metallicon electrodes formed on both end faces of an electronic component element, and the other lead wire connected to and fixed to the metallicon electrode, and an electronic component formed by powder coating the electronic component element, the lead wire A structure of a lead terminal of an electronic component, wherein one surface and / or the other surface of a metallicon electrode bonding surface are formed in a series of vertical shapes in a substantially concave shape, a substantially mountain shape, or a sawtooth shape. 電子部品の素子の両端面に形成したメタリコン電極と、該メタリコン電極に接続・固定する一方、他方のリード線と、前記電子部品の素子を粉体塗装してなる電子部品において、前記リード線のメタリコン電極接合面の周面を略凹陥状又は略山形状若しくは鋸歯状に垂直方向に一連に周設したことを特徴とする電子部品のリード端子の構造。 Metallicon electrodes formed on both end faces of an electronic component element, and the other lead wire connected to and fixed to the metallicon electrode, and an electronic component formed by powder coating the electronic component element, the lead wire A structure of a lead terminal of an electronic component, wherein a peripheral surface of a metallicon electrode joining surface is continuously arranged in a vertical direction in a substantially concave shape, a substantially mountain shape, or a sawtooth shape. 前記電子部品はフィルムコンデンサ、セラミックコンデンサ、可変コンデンサ、抵抗器、可変抵抗器又はバリスタでなることを特徴とする請求項１、２又は３記載の電子部品のリード端子の構造。 4. The lead terminal structure of an electronic component according to claim 1, wherein the electronic component is a film capacitor, a ceramic capacitor, a variable capacitor, a resistor, a variable resistor, or a varistor. 前記一方、他方のリード線は単線又は撚線でなることを特徴とする請求項１、２又は３記載の電子部品のリード端子の構造。 4. The structure of a lead terminal for an electronic component according to claim 1, wherein the other lead wire is a single wire or a stranded wire.
JP2006353605A 2006-12-28 2006-12-28 Structure of lead terminal of electronic component Pending JP2008166457A (en)

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JP2006353605A JP2008166457A (en) 2006-12-28 2006-12-28 Structure of lead terminal of electronic component
TW096128355A TW200828365A (en) 2006-12-28 2007-08-02 Construction of lead terminal of an electronic part
CNA2007101477357A CN101211694A (en) 2006-12-28 2007-08-27 Structure for lead wire terminal of electronic parts
KR1020070088324A KR20080063040A (en) 2006-12-28 2007-08-31 Structure for lead terminals of electronic parts

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JP2016082128A (en) * 2014-10-20 2016-05-16 ニチコン株式会社 Bus bar welding structure in metalized film capacitor
US20220084750A1 (en) * 2020-09-17 2022-03-17 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component
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