JPH0950934A - Plastic film capacitor - Google Patents
Plastic film capacitorInfo
- Publication number
- JPH0950934A JPH0950934A JP7219438A JP21943895A JPH0950934A JP H0950934 A JPH0950934 A JP H0950934A JP 7219438 A JP7219438 A JP 7219438A JP 21943895 A JP21943895 A JP 21943895A JP H0950934 A JPH0950934 A JP H0950934A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- capacitor
- case
- plastic film
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、配線基板への実装時に
おいて、コンデンサへの熱による劣化を防止し、信頼性
の高いプラスチックフィルムコンデンサを提供する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a highly reliable plastic film capacitor which prevents deterioration of the capacitor due to heat when mounted on a wiring board.
【０００２】[0002]
【従来の技術】従来のコンデンサは、図３、４に示す如
く、耐熱性樹脂ケース４にコンデンサ素子１を板状外部
端子８が耐熱性樹脂ケース開口部端面９から突出した状
態で収納し、密封樹脂５を充填しているが、この密封樹
脂５は、耐熱性樹脂ケース開口部端面９と同一平面かも
しくは、耐熱性樹脂ケース開口部端面９より盛り上った
状態で注型している。2. Description of the Related Art As shown in FIGS. 3 and 4, a conventional capacitor accommodates a capacitor element 1 in a heat-resistant resin case 4 with a plate-shaped external terminal 8 protruding from an end surface 9 of a heat-resistant resin case opening. Although the sealing resin 5 is filled, the sealing resin 5 is cast in the same plane as the end surface 9 of the heat-resistant resin case opening or in a state of being raised from the end surface 9 of the heat-resistant resin case opening. .
【０００３】また板状外部端子８は、耐熱性樹脂ケース
開口部端面９に沿う様にして、外部に導出してプラスチ
ックフィルムコンデンサと構成している。The plate-shaped external terminal 8 is led out to form a plastic film capacitor along the end surface 9 of the heat-resistant resin case opening.
【０００４】[0004]
【発明が解決しようとする課題】従来のプラスチックフ
ィルムコンデンサは、定格電圧が高くなったり、静電容
量が大きくなると、コンデンサの体積が大となり、コン
デンサをリフロー半田付で配線基板に実装する際、熱容
量の大きなコンデンサに配線基板の熱が吸収され、クリ
ーム半田が溶融しにくくなる。In the conventional plastic film capacitor, when the rated voltage becomes high or the capacitance becomes large, the volume of the capacitor becomes large, and when the capacitor is mounted on the wiring board by reflow soldering, The heat of the wiring board is absorbed by the capacitor having a large heat capacity, and the cream solder is less likely to melt.
【０００５】このクリーム半田が溶融しにくくなると、
半田付の信頼性が低下し、断線等の問題が起ることがあ
るため、クリーム半田の溶融を容易ならしめるためリフ
ロー温度を上げる。このため周囲温度が高くなり、コン
デンサ素子１に高い温度が加わり、特性が劣化する原因
になっていた。When the cream solder becomes difficult to melt,
Since the reliability of soldering decreases and problems such as wire breakage may occur, the reflow temperature is raised to facilitate melting of the cream solder. For this reason, the ambient temperature becomes high, and a high temperature is applied to the capacitor element 1, causing deterioration of the characteristics.
【０００６】[0006]
【課題を解決するための手段】本発明では、かかる問題
点を解決するため、コンデンサに加わるリフロー半田付
の際の熱を熱容量の大きな、コンデンサに吸収されるこ
となく、必要最低限度の温度で、リフロー半田付を行う
ことの出来る信頼性の高いコンデンサを提供する。SUMMARY OF THE INVENTION In order to solve the above problems, in the present invention, heat at the time of reflow soldering applied to a capacitor is not absorbed by the capacitor having a large heat capacity, and the temperature is kept at the minimum necessary temperature. Provide a highly reliable capacitor that can be reflow soldered.
【０００７】その技術的手段として図１，２に示す如
く、 本発明のプラスチックフィルムコンデンサは、ポリ
エチレンテレフタレートフィルムまたはポリフェニレン
スルフィドを誘電体として用い、この誘電体の表面にア
ルミニウムを蒸着し、これを金属化フィルムとし、この
金属化フィルムを複数枚重ね巻面あるいは、積層してコ
ンデンサ素子１とする。As a technical means thereof, as shown in FIGS. 1 and 2, the plastic film capacitor of the present invention uses a polyethylene terephthalate film or polyphenylene sulfide as a dielectric, aluminum is vapor-deposited on the surface of the dielectric, and this is used as a metal. A plurality of metallized films are stacked on the winding surface or laminated to form the capacitor element 1.
【０００８】 このコンデンサ素子１にＣＰ線（鉄線
に銅メッキを施しその上に半田メッキを施した線）を使
用した外部端子２を半田付または溶接３により取り付け
る。この素子がガラス繊維で強化されたポリエチレンテ
レフタレート樹脂あるいは、ポリフェニレンスルフィド
樹脂を用いた耐熱性ケース内に収納し、エポキシ樹脂か
らなる密封樹脂５の上面５Ａがケースの上端面４Ａとに
空隙６を設けて密封する。External terminals 2 using CP wires (iron wires plated with copper and solder plated thereon) are attached to the capacitor element 1 by soldering or welding 3. This element is housed in a heat-resistant case made of polyethylene terephthalate resin reinforced with glass fiber or polyphenylene sulfide resin, and an upper surface 5A of the sealing resin 5 made of epoxy resin is provided with a space 6 in the upper end surface 4A of the case. And seal.
【０００９】この樹脂５で密封した後、ＣＰ線を使用し
た外部端子２の突出部２Ａが耐熱性樹脂ケース４の脚端
面１２より突出しないよう外部端子２の突出部２Ａとケ
ース４の脚端面１２との間に空隙１３を設けてなるプラ
スチックフィルムコンデンサを提供する。After sealing with the resin 5, the protruding portion 2A of the external terminal 2 and the leg end surface of the case 4 are prevented from protruding from the leg end surface 12 of the heat-resistant resin case 4 by using the CP wire. Provided is a plastic film capacitor having a space 13 provided between the plastic film capacitor and the plastic film capacitor 12.
【００１０】[0010]
【作用】本発明は、コンデンサを配線基板にリフロー半
田付にて実装する際、配線基板の熱を熱容量の大きなコ
ンデンサに吸収される割合を出来るだけ少なくするた
め、配線基板とコンデンサの間に空隙を設けて配線基板
からの熱の伝導を阻止するとともに、 熱電導の悪いＣＰ線を用いる。 このＣＰ線を耐熱性樹脂ケースに接触することなく
ケース外部に導出する。According to the present invention, when the capacitor is mounted on the wiring board by reflow soldering, the heat of the wiring board is absorbed by the capacitor having a large heat capacity as much as possible. Is provided to prevent conduction of heat from the wiring board, and a CP wire having poor thermal conductivity is used. The CP wire is led out of the case without contacting the heat resistant resin case.
【００１１】このことにより、コンデンサ素子へのリフ
ロー半田付の際の熱を低く押えコンデンサ素子の熱に対
する影響を少なくできる。また耐熱性樹脂ケースの材質
にガラス繊維で強化されたポリエチレンテレフタレート
樹脂あるいはポリフェニレンスルフィド樹脂を用いるこ
とによりリフロー半田付の熱によるケースの変形、軟化
などによるストレスでコンデンサの特性の劣化の少いプ
ラスチックフィルムコンデンサを製造する。As a result, the heat at the time of reflow soldering to the capacitor element can be kept low, and the influence on the heat of the capacitor element can be reduced. In addition, by using polyethylene terephthalate resin or polyphenylene sulfide resin reinforced with glass fiber as the material of the heat-resistant resin case, plastic film with less deterioration of capacitor characteristics due to stress due to case deformation and softening due to heat of reflow soldering. Manufacture capacitors.
【００１２】[0012]
【実施例】本発明の実施例を図１，２に基き説明する。
ポリエチレンテレフタレートフィルムまたはポリフェニ
レンスルフィドを誘電体として用い、その表面にアルミ
ニウムを蒸着しこれを金属化フィルムとする。Embodiments of the present invention will be described with reference to FIGS.
A polyethylene terephthalate film or polyphenylene sulfide is used as a dielectric, and aluminum is vapor-deposited on the surface of the dielectric to form a metallized film.
【００１３】この金属化フィルムを複数枚重ね合せ巻回
し、１２０〜１５０℃で約３〜５分間加熱しながら５０
〜７０kg／cm2 の圧力で加圧成形し、コンデンサ素子１
とする。この加圧成形したコンデンサ素子１の必要箇所
以外に金属溶射によりメタリコン１０を形成する際金属
の微粒子がコンデンサ素子１の周囲に付着しない様に粘
着テープでコンデンサ素子１の外周部分を被覆する。A plurality of these metallized films are wound in a superposed manner and heated at 120 to 150 ° C. for about 3 to 5 minutes while being heated for 50 minutes.
Capacitor element 1 is formed by pressure molding at a pressure of ~ 70 kg / cm 2.
And In addition to the necessary parts of the pressure-molded capacitor element 1, when the metallikon 10 is formed by metal spraying, the outer peripheral portion of the capacitor element 1 is covered with an adhesive tape so that fine metal particles do not adhere to the periphery of the capacitor element 1.
【００１４】半田、亜鉛あるいは鉛を溶射しメタリコン
１０を形成する。この後コンデンサ素子１の周囲の粘着
テープを除去し、メタリコン１０のバリ等の不要な部分
を除去した後、誘電体の欠陥部を除くため直流電圧を印
加する。The metallikon 10 is formed by spraying solder, zinc or lead. After that, the adhesive tape around the capacitor element 1 is removed, unnecessary portions such as burrs of the metallikon 10 are removed, and then a DC voltage is applied to remove defective portions of the dielectric.
【００１５】直径０．６mmのＣＰ線を使用した外部端子
を半田付あるいは溶接３によりメタリコン１０に取り付
ける。この後ガラス繊維強化ポリエチレンテレフタレー
ト樹脂で成形した耐熱性樹脂ケース４内にコンデンサ素
子１を収納する。この際ケース側面内壁１１にコンデン
サ素子１が接触することがない様にする。An external terminal using a CP wire having a diameter of 0.6 mm is attached to the metallikon 10 by soldering or welding 3. After that, the capacitor element 1 is housed in a heat resistant resin case 4 formed of glass fiber reinforced polyethylene terephthalate resin. At this time, the capacitor element 1 is prevented from coming into contact with the inner wall 11 of the case side surface.
【００１６】この後、エポキシ樹脂からなる密封樹脂５
の上面５Ａが耐熱樹脂ケース４の上端面４Ａの間に空隙
６が残るよう充填し、１００〜１２０℃の温度で約５時
間かけて硬化する。この密封樹脂５を充填する際、耐熱
性樹脂ケース開口部端面９と溶接樹脂５との空隙６を１
mm以上取る。After that, the sealing resin 5 made of epoxy resin 5
The upper surface 5A is filled so that the voids 6 remain between the upper end surfaces 4A of the heat resistant resin case 4, and the resin is cured at a temperature of 100 to 120 ° C. for about 5 hours. When the sealing resin 5 is filled, the gap 6 between the heat-resistant resin case opening end surface 9 and the welding resin 5 is reduced to 1
Take more than mm.
【００１７】捺印、特性検査、外観検査を経た後、耐熱
性樹脂ケース４の脚端面１２より突出しないように、外
部端子２の突出２Ａとケース４の脚端面１２との間に空
隙１３を設けてフォーミング耐熱性樹脂ケース４の外に
導出士手プラスチックフィルムコンデンサとする。After the marking, the characteristic inspection and the appearance inspection, a gap 13 is provided between the protrusion 2A of the external terminal 2 and the leg end face 12 of the case 4 so as not to protrude from the leg end face 12 of the heat resistant resin case 4. In addition to the forming heat-resistant resin case 4, a derivation man-made plastic film capacitor is used.
【００１８】[0018]
【発明の効果】本発明は、以上説明した様に構成される
ので以下に記載される様な効果を奏する。 配線基板にコンデンサをリフロー半田付する際熱容
量の大きなコンデンサに半田付の際の熱を吸収されるこ
とが少ないため、図５に示す如く従来のリフロー温度に
比較して低い温度で半田付可能である。 このためコンデンサに加わる熱の影響が少なく図６
に示す様にリフロー半田付後でも電気的特性の劣化が極
めて少い。 また大形のコンデンサも配線基板の熱がコンデンサ
に吸収されることが少いため、リフロー半田付温度を変
更することがなく、コンデンサに対する熱の影響が極め
て少い。 リフロー半田付作業がコンデンサの外形の大小によ
っても変更することがなくなったので作業条件設定の手
間が省ける。Since the present invention is configured as described above, it has the following effects. When reflow soldering a capacitor to a wiring board, the heat generated during soldering is less likely to be absorbed by the capacitor having a large heat capacity, so it is possible to solder at a lower temperature than the conventional reflow temperature as shown in FIG. is there. For this reason, the influence of heat applied to the capacitor is small
As shown in, deterioration of electrical characteristics is extremely small even after reflow soldering. Further, even in a large-sized capacitor, the heat of the wiring board is hardly absorbed by the capacitor, so that the reflow soldering temperature is not changed and the influence of heat on the capacitor is extremely small. Since the reflow soldering work does not have to be changed depending on the size of the external shape of the capacitor, it is possible to save the trouble of setting the working conditions.
【図１】本発明の側面断面図である。FIG. 1 is a side sectional view of the present invention.
【図２】本発明の斜視図である。FIG. 2 is a perspective view of the present invention.
【図３】従来品の側面断面図である。FIG. 3 is a side sectional view of a conventional product.
【図４】従来品の正面断面図である。FIG. 4 is a front sectional view of a conventional product.
【図５】リフロー半田付の温度時間の関係を示す曲線図
である。FIG. 5 is a curve diagram showing a relationship between temperature and time of reflow soldering.
【図６】リフロー半田付後の静電容量変化率を示す。FIG. 6 shows a rate of change in capacitance after reflow soldering.
１…コンデンサ素子、 ２…外部端子、２Ａ…外部端子
突出部、３…半田または溶接、 ４…耐熱性樹脂ケー
ス、 ４Ａ…ケース上端面、４Ｂ…密封樹脂の上面、
５…密封樹脂、 ６…空隙、７…プラスチックフィルム
コンデンサ、 ８…板状外部端子、９…耐熱性樹脂ケー
ス開口部端面、 １０…メタリコン、１１…ケース側面
内壁、 １２…ケース脚端面、１３…ケース脚端面とＣ
Ｐ線との空隙。DESCRIPTION OF SYMBOLS 1 ... Capacitor element, 2 ... External terminal, 2A ... External terminal protrusion, 3 ... Solder or welding, 4 ... Heat-resistant resin case, 4A ... Case upper end surface, 4B ... Sealing resin upper surface,
5 ... Sealing resin, 6 ... Void, 7 ... Plastic film capacitor, 8 ... Plate-shaped external terminal, 9 ... Heat-resistant resin case opening end surface, 10 ... Metallicon, 11 ... Case side inner wall, 12 ... Case leg end surface, 13 ... Case leg end face and C
Void with P line.
Claims (2)
たはポリフェニレンスルフィドにアルミニウムを蒸着
し、この金属化フィルムを複数枚重ね巻回あるいは、積
層した後、ＣＰ線を用いた外部端子を取り付けコンデン
サ素子とし、このコンデンサ素子を耐熱性樹脂で製作し
たケースに収納し密封樹脂を充填したコンデンサにおい
て、前記密封樹脂の上面とケースの上端面との間に空隙
を設けかつ前記外部端子の突出部を前記ケースの脚端面
より突出しないよう外部端子を導出してなるプラスチッ
クフィルムコンデンサ。1. A polyethylene terephthalate film or polyphenylene sulfide is vapor-deposited with aluminum, and a plurality of the metallized films are wound or laminated, and external terminals using CP wires are attached to form capacitor elements. In a capacitor housed in a case made of heat-resistant resin and filled with sealing resin, a gap is provided between the upper surface of the sealing resin and the upper end surface of the case, and the projecting portion of the external terminal projects from the leg end surface of the case. A plastic film capacitor that has external terminals led out so as not to.
材質が、ガラス繊維で強化されたポリエチレンテレフタ
レート樹脂あるいは、ポリフェニレンスルフィド樹脂を
用いたプラスチックフィルムコンデンサ。2. The plastic film capacitor according to claim 1, wherein the heat-resistant resin case is made of glass fiber reinforced polyethylene terephthalate resin or polyphenylene sulfide resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7219438A JPH0950934A (en) | 1995-08-07 | 1995-08-07 | Plastic film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7219438A JPH0950934A (en) | 1995-08-07 | 1995-08-07 | Plastic film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0950934A true JPH0950934A (en) | 1997-02-18 |
Family
ID=16735414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7219438A Pending JPH0950934A (en) | 1995-08-07 | 1995-08-07 | Plastic film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0950934A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183288A (en) * | 2003-12-22 | 2005-07-07 | Matsushita Electric Works Ltd | Discharge lamp lighting apparatus and lighting equipment |
| JP2019201152A (en) * | 2018-05-18 | 2019-11-21 | 株式会社デンソー | Capacitor and power conversion device with the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57169225A (en) * | 1981-04-13 | 1982-10-18 | Matsushita Electric Ind Co Ltd | Method of producing reisn-filled capacitor |
| JPS61190122U (en) * | 1985-05-20 | 1986-11-27 | ||
| JPH0385619U (en) * | 1989-12-21 | 1991-08-29 |
-
1995
- 1995-08-07 JP JP7219438A patent/JPH0950934A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57169225A (en) * | 1981-04-13 | 1982-10-18 | Matsushita Electric Ind Co Ltd | Method of producing reisn-filled capacitor |
| JPS61190122U (en) * | 1985-05-20 | 1986-11-27 | ||
| JPH0385619U (en) * | 1989-12-21 | 1991-08-29 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183288A (en) * | 2003-12-22 | 2005-07-07 | Matsushita Electric Works Ltd | Discharge lamp lighting apparatus and lighting equipment |
| US7667975B2 (en) | 2003-12-22 | 2010-02-23 | Matsushita Electric Works, Ltd. | Lighting device of discharge lamp, illumination apparatus and illumination system |
| JP2019201152A (en) * | 2018-05-18 | 2019-11-21 | 株式会社デンソー | Capacitor and power conversion device with the same |
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