JPH02229417A - Chip-type solid electrolytic capacitor and its manufacture - Google Patents
Chip-type solid electrolytic capacitor and its manufactureInfo
- Publication number
- JPH02229417A JPH02229417A JP5086089A JP5086089A JPH02229417A JP H02229417 A JPH02229417 A JP H02229417A JP 5086089 A JP5086089 A JP 5086089A JP 5086089 A JP5086089 A JP 5086089A JP H02229417 A JPH02229417 A JP H02229417A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- fuse
- cathode
- electrically insulating
- fuse wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 53
- 239000007787 solid Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 230000002265 prevention Effects 0.000 claims description 10
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はタンタルもしくはアルミニウムなどのチップ
型固体電解コンデンサに関し，さらに詳しく言えば，ヒ
ューズを備えたチップ型固体電解コンデンサおよびその
製造方法に関するものである．
〔従来の技術〕
固体電解コンデンサは、陽極に粉末金属焼結体を用いる
ため小形であり，また、漏液などがないという点では液
体電解コンデンサよりも優れているが、サージ電圧、逆
電圧などに対する持久性がなく、短絡故障時には大きな
短絡電流が流れ、発熱・燃焼事故を起こすおそれがある
．
そこで、従来では第６図に示されているように．陰極リ
ード線２を固体電解コンデンサ素子１の陰極面１ａに接
続するにあたって、それらの間にヒューズ線３を介在さ
せるようにしている．なお、４は陽極リード線で，これ
はコンデンサ素子１の陽極リード１ｂに溶接される．ま
た、各リード線２，４の接続後、図示のようにコンデン
サ素子１のまわりには電気絶縁性合成樹脂の外装体５が
モールド成形される．
〔発明が解決しようとする課題〕
このヒューズ付きコンデンサによると，過電流が流れた
場合、抵抗熱によりヒューズ線３が断線して電流が遮断
されるのであるが、成形機にて外装体５をモールド成形
する際、その成形圧力にてヒューズ線３がコンデンサ素
子１の側面に接触し、実質的にヒューズとして作用する
部分が短くなるため、溶断のバラツキが大きくなり、信
頼性が損なわれるという欠点がある，
〔課題を解決するための手段〕
上記課題を解決するため，この発明においては、タンタ
ルなどの粉末金属焼結体からなるコンデンサ素子の陽極
リードに陽極リード線を溶接するとともに、同コンデン
サ素子の陰極面にヒューズ線を介して陰極リード線を接
続し、同コンデンサ素子のまわりに樹脂モールドよりな
る電気絶縁性の外装体を形成したチップ型固体電解コン
デンサにおいて、陰極リード線の端部を電気絶縁性の接
着手段を介してコンデンサ素子の陰極面に取付け条とと
もに、同陰極リード線と陰極面との間に、両端部を除い
た中間部分に電気絶縁被覆を形成したヒューズ線を接続
した構成としている．そして、この固体電解コンデンサ
は次の工程■〜■を経て製造される．
■テープもしくはフープ材などの支持体にヒューズ線の
一端部を取り付け，同ヒューズ線の他端部に樹脂付着防
止剤を塗布する工程．
■上記ヒューズ線の他端部側を電気絶縁樹脂液中に浸漬
してその所定長さ範囲にかけて電気絶縁被覆を形成する
工程．
■上記樹脂付着防止剤を除去して上記ヒューズ線の他端
部を露出させる工程．
■リード〜クレームに形成されている陽極リード線をタ
ンタルなどの粉末金属焼結体からなるコンデンサ素子の
陽極リードに溶接するとともに、同リードフレームの陰
極リード線を電気絶縁性接着手段を介して上記コンデン
サ素子の陰極面に取付ける工程．
■上記コンデンサ素子の陰極面と上記陰極リード線との
間に上記工程■にて得られたヒューズ線を接続する工程
．
■上記ヒューズ線を含むように上記コンデンサ素子のま
わりに電気絶縁性合成樹脂の外装体を形成する工程．
なお，上記■の電気絶縁被覆を形成する工程後において
，樹脂付着防止剤が自然に除去されるような場合には、
特に上記■の工程は不要となる。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a chip-type solid electrolytic capacitor made of tantalum or aluminum, and more specifically, to a chip-type solid electrolytic capacitor equipped with a fuse and a method for manufacturing the same. be. [Prior art] Solid electrolytic capacitors are compact because they use a powdered metal sintered body for the anode, and are superior to liquid electrolytic capacitors in that there is no leakage, but they are susceptible to surge voltage, reverse voltage, etc. However, in the event of a short-circuit failure, a large short-circuit current flows, potentially causing heat generation and combustion accidents. Therefore, in the past, as shown in Figure 6. When connecting the cathode lead wire 2 to the cathode surface 1a of the solid electrolytic capacitor element 1, a fuse wire 3 is interposed between them. Note that 4 is an anode lead wire, which is welded to the anode lead 1b of the capacitor element 1. Further, after connecting the lead wires 2 and 4, an exterior body 5 made of electrically insulating synthetic resin is molded around the capacitor element 1 as shown in the figure. [Problems to be Solved by the Invention] According to this capacitor with a fuse, when an overcurrent flows, the fuse wire 3 is disconnected due to resistance heat and the current is cut off. When molding, the fuse wire 3 comes into contact with the side surface of the capacitor element 1 due to the molding pressure, and the portion that actually functions as a fuse becomes shorter, which increases the variation in blowout and impairs reliability. [Means for Solving the Problems] In order to solve the above problems, in the present invention, an anode lead wire is welded to the anode lead of a capacitor element made of a sintered powder metal such as tantalum, and In chip-type solid electrolytic capacitors, in which a cathode lead wire is connected to the cathode surface of the element via a fuse wire, and an electrically insulating exterior body made of resin mold is formed around the capacitor element, the end of the cathode lead wire is A fuse wire with an electrically insulating coating formed on the intermediate portion excluding both ends is connected between the cathode lead wire and the cathode surface along with the mounting strip on the cathode surface of the capacitor element via electrically insulating adhesive means. It is structured as follows. This solid electrolytic capacitor is manufactured through the following steps ① to ②. ■The process of attaching one end of the fuse wire to a support such as tape or hoop material, and applying a resin adhesion prevention agent to the other end of the fuse wire. ■The process of immersing the other end of the fuse wire in an electrically insulating resin liquid to form an electrically insulating coating over a predetermined length. (2) Step of removing the resin adhesion prevention agent and exposing the other end of the fuse wire. ■Lead - The anode lead wire formed in the claim is welded to the anode lead of the capacitor element made of sintered powder metal such as tantalum, and the cathode lead wire of the same lead frame is connected to the above through an electrically insulating bonding means. The process of attaching to the cathode surface of a capacitor element. ■A step of connecting the fuse wire obtained in step (2) above between the cathode surface of the capacitor element and the cathode lead wire. ■Process of forming an electrically insulating synthetic resin exterior body around the capacitor element so as to include the fuse wire. In addition, if the resin anti-adhesion agent is naturally removed after the process of forming the electrically insulating coating in item (1) above,
In particular, the step ① above becomes unnecessary.
ヒューズ線の端部以外は電気絶縁被覆によって固体電解
コンデンサ素子の側面（陰極面）に対して電気的に絶縁
されるため、そのほぼ全長が本来のヒューズとして作用
することになる．また，外形もヒューズなしのものとほ
ぼ同じにすることができる．
〔実 施 例〕
以下，この発明の実施例を第１図ないし第５図を参照し
ながら詳細に説明する．
第１図に示されているように、このチップ型固体電解コ
ンデンサは先に説明の従来例と同様，例えばタンタルや
アルミニウムなどの粉末金属焼結体からなり，二酸化マ
ンガンなどの半導体層、カーボン，導電性銀ベーストな
どの陰極層を形成した固体電解コンデンサ索子１１を備
えている．このコンデンサ素子１０の陽極リード１０ａ
には，リードフレームの陽極リード線１１が溶接により
固定される。同コンデンサ素子ｌＯの陰極面１０ｂには
、リードフレームの陰極リード線１２が電気絶縁性接着
手段、この実施例ではエボキシ樹脂１３を介して取付け
られている．なお，陰極リード線１２の端部１２ａはＬ
字状に折り曲げられ、この部分にコンデンサ素子ＩＯの
陰極面１０ｂが載置される．コンデンサ素子１０の陰極
面１０ｂと陰極リード線１２との間にヒューズ線１４が
接続されるのであるが、この場合、ヒューズ線ｌ４には
その両端部を除いて電気絶縁被覆２２が形成されている
．
コンデンサ索子１０のまわりには，ヒューズ線１４をも
覆うように樹脂モールドよりなる外装体ｌ７が形成され
る．
このように、このチップ型固体電解コンデンサにおいて
は，ヒューズ線ｌ４にはその両端部を除いて電気絶縁被
覆２２が形成され、これによりコンデンサ素子１０の側
面（陰極面１０ｂ）に対して電気的に絶縁されるため，
その殆どの部分が本来のヒューズとして作用する．した
がって、溶断のバラツキが少なく、過電流保護の信頼性
がより高められる。The fuse wire, except for the end, is electrically insulated from the side surface (cathode surface) of the solid electrolytic capacitor element by an electrically insulating coating, so almost its entire length acts as an original fuse. Additionally, the external shape can be made almost the same as the one without a fuse. [Embodiments] Hereinafter, embodiments of the present invention will be explained in detail with reference to FIGS. 1 to 5. As shown in Fig. 1, this chip-type solid electrolytic capacitor is made of a sintered powder metal such as tantalum or aluminum, and has a semiconductor layer such as manganese dioxide, carbon, It is equipped with a solid electrolytic capacitor wire 11 on which a cathode layer such as a conductive silver base is formed. Anode lead 10a of this capacitor element 10
The anode lead wire 11 of the lead frame is fixed by welding. A cathode lead wire 12 of a lead frame is attached to the cathode surface 10b of the capacitor element 10 via electrically insulating adhesive means, in this embodiment epoxy resin 13. Note that the end 12a of the cathode lead wire 12 is
It is bent into a letter shape, and the cathode surface 10b of the capacitor element IO is placed on this portion. A fuse wire 14 is connected between the cathode surface 10b of the capacitor element 10 and the cathode lead wire 12. In this case, an electrically insulating coating 22 is formed on the fuse wire l4 except for both ends thereof. ．． An exterior body 17 made of a resin mold is formed around the capacitor cord 10 so as to also cover the fuse wire 14. In this chip-type solid electrolytic capacitor, the electrically insulating coating 22 is formed on the fuse wire l4 except for its both ends, thereby making it electrically conductive to the side surface (cathode surface 10b) of the capacitor element 10. Because it is insulated,
Most of the parts act as original fuses. Therefore, there is less variation in blowout, and the reliability of overcurrent protection is further improved.
次に、このチップ型固体電解コンデンサの製造方法につ
いて説明する．まず，第２図に示されているように、複
数のヒューズ線１４・・・を用意し、その各一端部１４
ａをテープもしくはフープ材などの支持体２０に取付け
る．
そして、ヒューズ線１４・・・の各他端部１４ｂを樹脂
付着防止剤液２１′中に浸漬して、その各端部１４ｂに
樹脂付着防止剤２ｌを塗布する。この樹脂付着防止剤２
１としては、例えば旭硝子■製のサーフロン（商品名）
もしくはダイキン工業■製のダイフリ−（商品名）など
がある．なお、塗布は刷毛塗りによってもよい．
さらに、第３図に示されているように，ヒューズ線１４
・・・の各他端部１４ｂ側をエポキシ樹脂液２２′中に
浸漬して、その端部１４ｂから所定長さ範囲にわたって
電気絶縁被覆２２を形成する．次に、例えばフロン系の
溶剤を用いて樹脂付着防止剤２１を除去し、ヒューズ線
１４の他端部１４ｂを露出させ、第４図に示されている
ように，好ましくは逆様にして乾燥する．もっとも、電
気絶縁被覆２２の硬化後に樹脂付着防止剤２１が無くな
っていれば、特にこの除去工程を行う必要はなく、乾燥
工程のみを行えばよい．
一方、第５図に示されているように、コンデンサ素子１
０の陽極リード１０ａにリードフレームの陽極リード線
ｌ１を溶接するとともに、同コンデンサ素子１０の陰極
面ｔａｂに電気絶縁性接着手段としての例えば電気絶縁
性エボキシ樹脂ｌ３を介してリードフレームの陰極リー
ド線１２を取付ける．その場合，陰極リード線１２の端
部１２ａを図示のように予めＬ字状に折り曲げ、その上
にコンデンサ素子１０の陰極面１０ｂを載置するように
するとよい．しかるのち，コンデンサ素子１０の陰極面
１０ｂと陰極リード線１２との間にヒューズ線１４を接
続する。Next, we will explain the manufacturing method of this chip-type solid electrolytic capacitor. First, as shown in FIG. 2, a plurality of fuse wires 14 are prepared, and one end of each
Attach a to a support 20 such as tape or hoop material. Then, the other ends 14b of the fuse wires 14... are immersed in the resin adhesion prevention agent liquid 21', and the resin adhesion prevention agent 2L is applied to each end 14b. This resin adhesion prevention agent 2
1, for example, Surflon (product name) manufactured by Asahi Glass ■
Alternatively, there is Dai-free (product name) manufactured by Daikin Industries. The application may also be done by brushing. Furthermore, as shown in FIG.
The other end 14b side of each of the wires is immersed in an epoxy resin liquid 22' to form an electrically insulating coating 22 over a predetermined length range from the end 14b. Next, the resin adhesion prevention agent 21 is removed using, for example, a fluorocarbon-based solvent, the other end 14b of the fuse wire 14 is exposed, and as shown in FIG. 4, it is preferably dried upside down. do. However, if the resin adhesion prevention agent 21 is gone after the electrical insulating coating 22 is cured, there is no need to perform this removal process, and only a drying process is required. On the other hand, as shown in FIG.
The anode lead wire l1 of the lead frame is welded to the anode lead 10a of the capacitor element 10, and the cathode lead wire l1 of the lead frame is welded to the cathode surface tab of the same capacitor element 10 via electrically insulating adhesive means such as electrically insulating epoxy resin l3. Install 12. In that case, it is preferable to bend the end 12a of the cathode lead wire 12 into an L-shape as shown in the figure, and place the cathode surface 10b of the capacitor element 10 on top of it. Thereafter, a fuse wire 14 is connected between the cathode surface 10b of the capacitor element 10 and the cathode lead wire 12.
実際には、リードフレームの各リード線１１． １２に
上記のようにして複数のコンデンサ素子１０が取付けら
れている状態において、各ヒューズ線１４を支持体２０
に取付けられている状態で，例えばその各他端部１４ｂ
を先に陰極面１０ｂ側にハンダもしくは銀ペーストなど
にて接続し，次にその各一端部１４ａ側を支持体２０か
ら剥がして陰極リード線１２にハンダもし．＜．は銀ペ
ーストなどにて接続する．もっとも，先に他端部１４ｂ
を陰極リード線１２側に接続し、その後一端部１４ａを
陰極而１０ｂ側に接続するようにしてもよい．
しかるのち，第１図に示されているように，コンデンサ
素子１０のまわりにヒューズ線ｌ４をも覆うように樹脂
外装体１７を形成する。そして、陽極リード線１１およ
び陰極リード線１２をリードフレームから切り離し、そ
の外装体１７に沿って例えば蟹足状に折り曲げることに
より，ヒューズ付きのチップ型固体電解コンデンサが得
られる．
〔発明の効果〕
以上説明したように、この発明によれば，ヒューズ線の
端部以外の部分に電気絶縁被覆を形成し、それによって
ヒューズ線をコンデンサ素子の側面（陰極面）に対して
電気的に絶縁するようにしたことにより、そのほぼ全長
が本来のヒューズとして作用することになり、信頼性が
高められる．また、外形もヒューズなしのものとほぼ同
じにすることができるなどの効果が奏される．Actually, each lead wire 11. of the lead frame. With a plurality of capacitor elements 10 attached to the fuse wire 12 as described above, each fuse wire 14 is attached to the support member 20.
For example, each other end 14b
is first connected to the cathode surface 10b side with solder or silver paste, and then each end 14a side is peeled off from the support 20 and soldered to the cathode lead wire 12. <． Connect with silver paste, etc. However, first the other end 14b
may be connected to the cathode lead wire 12 side, and then one end portion 14a may be connected to the cathode lead wire 10b side. Thereafter, as shown in FIG. 1, a resin sheath 17 is formed around the capacitor element 10 so as to also cover the fuse wire l4. Then, by cutting the anode lead wire 11 and the cathode lead wire 12 from the lead frame and bending them along the exterior body 17 into, for example, a crab-like shape, a chip-type solid electrolytic capacitor with a fuse is obtained. [Effects of the Invention] As explained above, according to the present invention, an electrically insulating coating is formed on the parts other than the ends of the fuse wire, thereby preventing the fuse wire from being electrically connected to the side surface (cathode surface) of the capacitor element. By insulating the fuse, almost its entire length acts as an original fuse, increasing reliability. In addition, the external shape can be made almost the same as that without a fuse.
第ｌｕｌｌほこの発明によるチップ型固体電解コンデン
サの一実施例を示した断面図、第２図ないし第５図は同
固体電解コンデンサの製造工程を説明するための模式図
，第６図は従来例を示した第１図と同様の模式図である
．
図中，１０はコンデンサ素子、１０ａは陽極リード、１
０ｂは陰極面． １１は陽極リード線，１２は陰極リー
ド線、ｌ４はヒューズ線、２０は支持体、２ｌは樹脂付
着防止剤，２２は電気絶縁被覆である．特許出願人
エルナー株式会社Fig. 6 is a cross-sectional view showing an embodiment of a chip-type solid electrolytic capacitor according to the invention of Lull Hoko, Fig. 2 to Fig. 5 are schematic diagrams for explaining the manufacturing process of the solid electrolytic capacitor, and Fig. 6 is a conventional example. This is a schematic diagram similar to Figure 1, which shows the In the figure, 10 is a capacitor element, 10a is an anode lead, 1
0b is the cathode surface. 11 is an anode lead wire, 12 is a cathode lead wire, 14 is a fuse wire, 20 is a support, 2l is a resin adhesion prevention agent, and 22 is an electrical insulation coating. patent applicant
Elna Co., Ltd.
Claims (2)
サ素子の陽極リードに陽極リード線を溶接するとともに
、同コンデンサ素子の陰極面にヒューズ線を介して陰極
リード線を接続し、同コンデンサ素子のまわりに樹脂モ
ールドよりなる電気絶縁性の外装体を形成したチップ型
固体電解コンデンサにおいて、 上記陰極リード線の端部を電気絶縁性の接着手段を介し
て上記コンデンサ素子の陰極面に取付けるとともに、同
陰極リード線と上記陰極面との間に、両端部を除いた中
間部分に電気絶縁被覆を形成したヒューズ線を接続した
ことを特徴とするチップ型固体電解コンデンサ。(1) Weld the anode lead wire to the anode lead of a capacitor element made of sintered powder metal such as tantalum, and connect the cathode lead wire to the cathode surface of the capacitor element via a fuse wire. In a chip type solid electrolytic capacitor having an electrically insulating exterior body made of resin molded around the chip type solid electrolytic capacitor, the end of the cathode lead wire is attached to the cathode surface of the capacitor element via electrically insulating adhesive means, and A chip-type solid electrolytic capacitor characterized in that a fuse wire having an electrically insulating coating formed on the intermediate portion excluding both ends is connected between the cathode lead wire and the cathode surface.
線の一端部を取り付け、同ヒューズ線の他端部に樹脂付
着防止剤を塗布する工程と、 上記ヒューズ線の他端部側を電気絶縁樹脂液中に浸漬し
てその所定長さ範囲にかけて電気絶縁被覆を形成する工
程と、 上記樹脂付着防止剤を除去して上記ヒューズ線の他端部
を露出させる工程と、 リードフレームに形成されている陽極リード線をタンタ
ルなどの粉末金属焼結体からなるコンデンサ素子の陽極
リードに溶接するとともに、同リードフレームの陰極リ
ード線を電気絶縁性接着手段を介して上記コンデンサ素
子の陰極面に取付ける工程と、 上記コンデンサ素子の陰極面と上記陰極リード線との間
に上記工程にて得られたヒューズ線を接続する工程と、 上記ヒューズ線を含むように上記コンデンサ素子のまわ
りに電気絶縁性合成樹脂の外装体を形成する工程とを備
えているチップ型固体電解コンデンサの製造方法。(2) A process of attaching one end of the fuse wire to a support such as tape or hoop material, and applying a resin adhesion prevention agent to the other end of the fuse wire, and applying an electrically insulating resin to the other end of the fuse wire. forming an electrically insulating coating over a predetermined length range of the fuse wire by immersing it in a liquid; and removing the resin adhesion prevention agent to expose the other end of the fuse wire. Welding an anode lead wire to the anode lead of a capacitor element made of sintered powder metal such as tantalum, and attaching a cathode lead wire of the same lead frame to the cathode surface of the capacitor element via electrically insulating adhesive means. , connecting the fuse wire obtained in the above step between the cathode surface of the capacitor element and the cathode lead wire, and forming an electrically insulating synthetic resin around the capacitor element so as to include the fuse wire. A method for manufacturing a chip-type solid electrolytic capacitor, comprising a step of forming an exterior body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1050860A JPH0756859B2 (en) | 1989-03-02 | 1989-03-02 | Manufacturing method of chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1050860A JPH0756859B2 (en) | 1989-03-02 | 1989-03-02 | Manufacturing method of chip type solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02229417A true JPH02229417A (en) | 1990-09-12 |
| JPH0756859B2 JPH0756859B2 (en) | 1995-06-14 |
Family
ID=12870478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1050860A Expired - Lifetime JPH0756859B2 (en) | 1989-03-02 | 1989-03-02 | Manufacturing method of chip type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756859B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1070831A (en) * | 1996-06-20 | 1998-03-10 | Yamaha Corp | Power-supply stabilization circuit and capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62150817A (en) * | 1985-12-25 | 1987-07-04 | 松下電器産業株式会社 | Solid state electrolytic capacitor with built-in fuse mechanism |
| JPS62291113A (en) * | 1986-06-11 | 1987-12-17 | 日本電気株式会社 | Chip type solid electrolytic capacitor |
-
1989
- 1989-03-02 JP JP1050860A patent/JPH0756859B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62150817A (en) * | 1985-12-25 | 1987-07-04 | 松下電器産業株式会社 | Solid state electrolytic capacitor with built-in fuse mechanism |
| JPS62291113A (en) * | 1986-06-11 | 1987-12-17 | 日本電気株式会社 | Chip type solid electrolytic capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1070831A (en) * | 1996-06-20 | 1998-03-10 | Yamaha Corp | Power-supply stabilization circuit and capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0756859B2 (en) | 1995-06-14 |
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