JP2008159705A - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
JP2008159705A
JP2008159705A JP2006344870A JP2006344870A JP2008159705A JP 2008159705 A JP2008159705 A JP 2008159705A JP 2006344870 A JP2006344870 A JP 2006344870A JP 2006344870 A JP2006344870 A JP 2006344870A JP 2008159705 A JP2008159705 A JP 2008159705A
Authority
JP
Japan
Prior art keywords
optical member
light
led chip
phosphor particles
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006344870A
Other languages
Japanese (ja)
Inventor
Naoko Takei
尚子 竹井
Keiichi Yamazaki
圭一 山崎
Takao Hayashi
隆夫 林
Kenichiro Tanaka
健一郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2006344870A priority Critical patent/JP2008159705A/en
Publication of JP2008159705A publication Critical patent/JP2008159705A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing temperature rise and color variation of phosphor particles. <P>SOLUTION: The light-emitting device is provided with an LED chip 10 for emitting a visible light (blue light); a mounting substrate 20 having the LED chip 10 mounted thereon; a dome-like optical member 40 disposed in a manner of surrounding the LED chip 10 between itself and the mounting substrate 20 on the mounting surface side of the LED chip 10 in the mounting substrate 20; a gel-like sealing section 50 filled in a space surrounded by the optical member 40 and the mounting substrate 20 so as to seal the LED chip 10. The optical member 40 is made of a molded body of a light-transmissive material, and the sealing section 50 is formed in such a way that a sealing resin containing the dispersed phosphor particles excited with a visible light emitted from the LED chip 10 to emit a visible light (yellow light) different from the color of the LED chip 10 is injected into the inside of the optical member 40, the optical member 40 is positioned for the mounting substrate 20 and the sealing resin is cured. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ＬＥＤチップ（発光ダイオードチップ）を利用した発光装置に関するものである。   The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

従来から、ＬＥＤチップとＬＥＤチップから放射された光によって励起されてＬＥＤチップとは異なる発光色の光を放射する蛍光体とを組み合わせ所望の混色光（例えば、白色光）を得るようにした発光装置の研究開発が各所で行われている（例えば、特許文献１参照）。   Conventionally, light emission in which a desired mixed color light (for example, white light) is obtained by combining an LED chip and a phosphor that emits light of a light emission color different from that of the LED chip when excited by light emitted from the LED chip. Research and development of the apparatus is performed in various places (for example, refer to Patent Document 1).

ここにおいて、上記特許文献１には、図６に示すように、ＬＥＤチップ１０’と、ＬＥＤチップ１０’が実装された平板状の実装基板２０’と、実装基板２０’におけるＬＥＤチップ１０’の実装面側でＬＥＤチップ１０’および当該ＬＥＤチップ１０’に電気的に接続されたボンディングワイヤ１４’を封止した封止部５０’と、封止部５０’の表面に積層された透光性樹脂層１６０’とを備え、封止部５０’が波長変換材（蛍光体粒子）を混入したモールド樹脂（封止樹脂）により形成されてなる発光装置１’が記載されている。
特開２００４−８７８１２号公報 Here, in Patent Document 1, as shown in FIG. 6, an LED chip 10 ′, a flat mounting board 20 ′ on which the LED chip 10 ′ is mounted, and the LED chip 10 ′ on the mounting board 20 ′ A sealing part 50 ′ that seals the LED chip 10 ′ and the bonding wire 14 ′ that is electrically connected to the LED chip 10 ′ on the mounting surface side, and a light-transmitting property that is laminated on the surface of the sealing part 50 ′ There is described a light emitting device 1 ′ including a resin layer 160 ′ and a sealing portion 50 ′ formed of a mold resin (sealing resin) mixed with a wavelength conversion material (phosphor particles).
JP 2004-87812 A

ところで、図６に示した構成の発光装置１’では、ＬＥＤチップ１０’から放射された光によって励起されてＬＥＤチップ１０’とは異なる色の可視光を放射する蛍光体粒子を封止部５０’に混入させてあるので、蛍光体粒子で発生した熱が実装基板２０’を通して放熱されやすくなって蛍光体粒子の温度上昇を抑制でき、また、封止部５０’を半球状の形状としてあるので、指向性を広くすることができる。   By the way, in the light emitting device 1 ′ having the configuration shown in FIG. 6, the phosphor particles that are excited by the light emitted from the LED chip 10 ′ and emit visible light having a different color from the LED chip 10 ′ are sealed 50. Since the heat generated in the phosphor particles is easily dissipated through the mounting substrate 20 ′, the temperature rise of the phosphor particles can be suppressed, and the sealing portion 50 ′ has a hemispherical shape. Therefore, the directivity can be widened.

しかしながら、上述の発光装置１’の製造にあたっては、ＬＥＤチップ１０’を実装基板２０’に実装するとともに、実装基板２０’におけるＬＥＤチップ１０’の実装面側に封止部５０’の形状に応じてパターン設計した第１撥油性皮膜１２５’および透光性樹脂層１６０’の形状に応じてパターン設計した第２撥油性皮膜１２６’をスクリーン印刷法などにより形成し、その後、蛍光体粒子を混入した封止樹脂を実装基板２０’の上記実装面側へポッティングして硬化させることにより半球状の封止部５０’を形成し、続いて、封止部５０’の表面に透光性樹脂を塗布して硬化させることにより透光性樹脂層１６０’を形成しているので、封止部５０’の形状がばらつきやすく、色むらが起こりやすかった。   However, in manufacturing the light emitting device 1 ′ described above, the LED chip 10 ′ is mounted on the mounting substrate 20 ′, and the mounting surface side of the LED chip 10 ′ on the mounting substrate 20 ′ is set according to the shape of the sealing portion 50 ′. The pattern-designed first oil-repellent film 125 'and the second oil-repellent film 126' designed according to the shape of the translucent resin layer 160 'are formed by screen printing or the like, and then phosphor particles are mixed. The hemispherical sealing portion 50 'is formed by potting the cured sealing resin onto the mounting surface side of the mounting substrate 20' and curing it, and then a translucent resin is applied to the surface of the sealing portion 50 '. Since the translucent resin layer 160 ′ is formed by applying and curing, the shape of the sealing portion 50 ′ tends to vary, and uneven color tends to occur.

本発明は上記事由に鑑みて為されたものであり、その目的は、蛍光体粒子の温度上昇を抑制でき且つ色むらを抑制できる発光装置を提供することにある。   This invention is made | formed in view of the said reason, The objective is to provide the light-emitting device which can suppress the temperature rise of a fluorescent substance particle and can suppress color nonuniformity.

請求項１の発明は、可視光を放射するＬＥＤチップと、当該ＬＥＤチップが実装された実装基板と、実装基板におけるＬＥＤチップの実装面側において実装基板との間にＬＥＤチップを囲む形で配設されたドーム状の光学部材と、光学部材と実装基板とで囲まれた空間に充実されＬＥＤチップを封止した封止部とを備え、光学部材は、透光性材料の成形品からなり、封止部は、ＬＥＤチップから放射される可視光によって励起されてＬＥＤチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする。   According to the first aspect of the present invention, an LED chip that emits visible light, a mounting board on which the LED chip is mounted, and a mounting board on the mounting surface side of the LED chip on the mounting board are disposed so as to surround the LED chip. The dome-shaped optical member is provided, and a sealing portion that is filled in a space surrounded by the optical member and the mounting substrate and seals the LED chip. The optical member is made of a molded product of a translucent material. The sealing portion is optically injected by injecting a sealing resin in which phosphor particles, which are excited by visible light emitted from the LED chip and emit visible light of a color different from the LED chip, are dispersed inside the optical member. It is formed by curing the sealing resin after positioning the member with respect to the mounting substrate.

この発明によれば、光学部材が、透光性材料の成形品からなり、封止部が、ＬＥＤチップから放射される可視光によって励起されてＬＥＤチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されているので、蛍光体粒子で発生した熱を実装基板側へ放熱させることができて蛍光体粒子の温度上昇を抑制できるとともに、封止部の形状が光学部材の形状により規定されるから、封止部の形状ばらつきが起こりにくくなり、色むらを抑制できる。   According to this invention, the optical member is formed of a molded product of a translucent material, and the sealing portion is excited by visible light emitted from the LED chip and emits visible light having a color different from that of the LED chip. Since the sealing resin in which the body particles are dispersed is injected into the inside of the optical member and then the optical member is positioned with respect to the mounting substrate and then the sealing resin is cured, the phosphor particles are generated. Since heat can be dissipated to the mounting substrate side and the temperature rise of the phosphor particles can be suppressed, and the shape of the sealing portion is defined by the shape of the optical member, the shape variation of the sealing portion is less likely to occur, Color unevenness can be suppressed.

請求項２の発明は、請求項１の発明において、前記光学部材の光出射面との間に空気層が形成される形で配設された色度調整用部材を備え、色度調整用部材は、前記封止部の蛍光体粒子である第１の蛍光体粒子と同一色の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする。   A second aspect of the invention is the chromaticity adjustment member according to the first aspect of the invention, further comprising a chromaticity adjustment member disposed in a form in which an air layer is formed between the light emitting surface of the optical member. Comprises a molded product of a translucent material in which second phosphor particles that emit visible light of the same color as the first phosphor particles that are phosphor particles of the sealing portion are dispersed. .

この発明によれば、前記光学部材の出射面から出射した混色光が色度調整用部材で色度調整されて出射されることとなるので、製造時に、あらかじめ第２の蛍光体粒子の濃度の異なる複数種の色度調整用部材を用意しておき、前記光学部材から出射される混色光の色度と目標とする混色光との色度のずれに応じて適宜濃度の色度調整用部材を採用することにより、発光装置ごとの色度のばらつきを低減できる。   According to the present invention, since the mixed color light emitted from the emission surface of the optical member is emitted after being adjusted in chromaticity by the chromaticity adjusting member, the concentration of the second phosphor particles is previously set at the time of manufacture. A plurality of different types of chromaticity adjusting members are prepared, and a chromaticity adjusting member having an appropriate density according to the chromaticity difference between the chromaticity of the mixed color light emitted from the optical member and the target mixed color light By adopting, variation in chromaticity for each light emitting device can be reduced.

請求項３の発明は、請求項１の発明において、前記光学部材は、前記透光性材料としてＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料を用いてなることを特徴とする。   According to a third aspect of the present invention, in the first aspect of the invention, the optical member has a longer wavelength than the LED chip as the translucent material and is more phosphor than the first phosphor particles that are phosphor particles in the sealing portion. It is characterized by using a translucent material in which second phosphor particles that emit visible light having a short wavelength are dispersed.

この発明によれば、ＬＥＤチップと１種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第１の蛍光体粒子および第２の蛍光体粒子のうち発光ピーク波長が低波長側にある第２の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第１の蛍光体粒子に二次吸収されるのを抑制することが可能となる。   According to the present invention, it is possible to obtain mixed color light having high color rendering properties as compared with the case where desired color mixture light is obtained by the combination of the LED chip and one kind of phosphor particles, and the light emission color is different. Visible light emitted from the second phosphor particles having the emission peak wavelength on the lower wavelength side among the first phosphor particles and the second phosphor particles is the first fluorescence having the emission peak wavelength on the longer wavelength side. Secondary absorption by body particles can be suppressed.

請求項４の発明は、請求項１の発明において、前記光学部材である第１の光学部材を囲む形で配設されたドーム状の第２の光学部材と、前記ＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した封止樹脂により形成され第１の光学部材と第２の光学部材との間の空間に充実された色変換部とを備え、色変換部は、第２の蛍光体粒子を分散した封止樹脂を第２の光学部材の内側に注入してから第２の光学部材を第１の光学部材および実装基板に対し位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする。   According to a fourth aspect of the present invention, in the first aspect of the present invention, the dome-shaped second optical member disposed so as to surround the first optical member, which is the optical member, and a longer wavelength than the LED chip, The first optical member and the second optical member are formed of a sealing resin in which second fluorescent particles that emit visible light having a shorter wavelength than the first fluorescent particles that are the fluorescent particles of the sealing portion are dispersed. And a color conversion unit filled in a space between the optical member, the color conversion unit injecting a sealing resin in which the second phosphor particles are dispersed into the second optical member and then the second The optical member is formed by positioning the sealing member with respect to the first optical member and the mounting substrate, and then curing the sealing resin.

この発明によれば、ＬＥＤチップと１種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第１の蛍光体粒子および第２の蛍光体粒子のうち発光ピーク波長が低波長側にある第２の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第１の蛍光体粒子に二次吸収されるのを抑制することが可能となる。   According to the present invention, it is possible to obtain mixed color light having high color rendering properties as compared with the case where desired color mixture light is obtained by the combination of the LED chip and one kind of phosphor particles, and the light emission color is different. Visible light emitted from the second phosphor particles having the emission peak wavelength on the lower wavelength side among the first phosphor particles and the second phosphor particles is the first fluorescence having the emission peak wavelength on the longer wavelength side. Secondary absorption by body particles can be suppressed.

請求項５の発明は、請求項１の発明において、前記光学部材である第１の光学部材の光出射面との間に空気層が形成される形で配設されたドーム状の第２の光学部材を備え、第２の光学部材は、前記ＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする。   According to a fifth aspect of the present invention, in the first aspect of the invention, the second dome-shaped second member disposed in such a manner that an air layer is formed between the first optical member and the light emitting surface of the first optical member. The second optical member includes an optical member, and the second optical member emits visible light having a wavelength longer than that of the LED chip and a wavelength shorter than that of the first phosphor particles that are phosphor particles of the sealing portion. It consists of a molded product of a translucent material in which body particles are dispersed.

この発明によれば、ＬＥＤチップと１種類の蛍光体粒子との組み合わせにより所望の混色光を得る場合に比べて、演色性の高い混色光を得ることが可能となり、しかも、発光色の異なる第１の蛍光体粒子および第２の蛍光体粒子のうち発光ピーク波長が低波長側にある第２の蛍光体粒子から放射された可視光が、発光ピーク波長が長波長側にある第１の蛍光体粒子に二次吸収されるのを抑制することが可能となる。   According to the present invention, it is possible to obtain mixed color light having high color rendering properties as compared with the case where desired color mixture light is obtained by the combination of the LED chip and one kind of phosphor particles, and the light emission color is different. Visible light emitted from the second phosphor particles having the emission peak wavelength on the lower wavelength side among the first phosphor particles and the second phosphor particles is the first fluorescence having the emission peak wavelength on the longer wavelength side. Secondary absorption by body particles can be suppressed.

請求項１の発明では、蛍光体粒子の温度上昇を抑制でき且つ色むらを抑制できるという効果がある。   In invention of Claim 1, there exists an effect that the temperature rise of fluorescent substance particle can be suppressed and color nonuniformity can be suppressed.

（実施形態１）
本実施形態の発光装置１は、図１に示すように、可視光を放射するＬＥＤチップ１０と、当該ＬＥＤチップ１０が実装された実装基板２０と、実装基板２０におけるＬＥＤチップ１０の実装面側において実装基板２０との間にＬＥＤチップ１０を囲む形で配設されたドーム状の光学部材４０と、光学部材４０と実装基板２０とで囲まれた空間に充実されＬＥＤチップを封止したゲル状の封止部５０とを備え、光学部材４０が、透光性材料により形成され、封止部５０が、ＬＥＤチップ１０から放射される可視光によって励起されてＬＥＤチップ１０とは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂により形成されている。 (Embodiment 1)
As shown in FIG. 1, the light emitting device 1 of the present embodiment includes an LED chip 10 that emits visible light, a mounting substrate 20 on which the LED chip 10 is mounted, and a mounting surface side of the LED chip 10 on the mounting substrate 20. The dome-shaped optical member 40 disposed so as to surround the LED chip 10 between the mounting substrate 20 and the gel enclosed in the space surrounded by the optical member 40 and the mounting substrate 20 to seal the LED chip The optical member 40 is formed of a light-transmitting material, and the sealing portion 50 is excited by visible light emitted from the LED chip 10 and has a color different from that of the LED chip 10. It is formed of a sealing resin in which phosphor particles that emit visible light are dispersed.

本実施形態の発光装置１では、ＬＥＤチップ１０として、青色光を放射するＧａＮ系青色ＬＥＤチップを用い、封止部５０における蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されてブロードな黄色系の光を放射する黄色蛍光体粒子を用いており、ＬＥＤチップ１０へ通電することにより、ＬＥＤチップ１０から放射され封止部５０を透過した青色光と、封止部５０の黄色蛍光体粒子から放射される黄色光との混色光からなる白色光を得ることができる。   In the light emitting device 1 of the present embodiment, a GaN-based blue LED chip that emits blue light is used as the LED chip 10 and is excited by the blue light emitted from the LED chip 10 as phosphor particles in the sealing unit 50. Yellow phosphor particles that emit broad yellow light are used, and when the LED chip 10 is energized, the blue light emitted from the LED chip 10 and transmitted through the sealing portion 50 and the yellow color of the sealing portion 50 are used. White light composed of mixed color light with yellow light emitted from the phosphor particles can be obtained.

ＬＥＤチップ１０は、厚み方向の一表面側（図１における下面側）にアノード電極（図示せず）が形成されるとともに、厚み方向の他表面側（図１における上面側）にカソード電極（図示せず）が形成されており、上記他表面側を光取り出し面１１側としているが、側面からも青色光が放射される。ここにおいて、アノード電極およびカソード電極は、下層側のＮｉ膜と上層側のＡｕ膜との積層膜により構成されている。   The LED chip 10 has an anode electrode (not shown) formed on one surface side (the lower surface side in FIG. 1) in the thickness direction and a cathode electrode (shown on the upper surface side in FIG. 1) in the other thickness direction. The other surface side is the light extraction surface 11 side, but blue light is also emitted from the side surface. Here, the anode electrode and the cathode electrode are formed of a laminated film of a lower layer Ni film and an upper layer Au film.

実装基板２０は、ＬＥＤチップ１０が一表面側に搭載される矩形板状のサブマウント部材３０と、熱伝導性材料により形成されサブマウント部材３０が一面側の中央部に固着される矩形板状の伝熱板２１と、伝熱板２１の一面側（図１における上面側）に例えばポリオレフィン系の固着シート（図示せず）を介して固着される矩形板状のフレキシブルプリント配線板により形成され中央部にサブマウント部材３０を露出させる矩形状の窓孔２４を有する配線基板２２とで構成されている。したがって、ＬＥＤチップ１０で発生した熱が配線基板２２を介さずにサブマウント部材３０および伝熱板２１に伝熱されるようになっている。なお、実装基板２０は、全体として平板状の形状に形成されている。   The mounting substrate 20 includes a rectangular plate-shaped submount member 30 on which the LED chip 10 is mounted on one surface side, and a rectangular plate shape on which the submount member 30 is fixed to the central portion on the one surface side. The heat transfer plate 21 and a flexible printed wiring board having a rectangular plate shape that is fixed to one surface side (the upper surface side in FIG. 1) of the heat transfer plate 21 via, for example, a polyolefin-based fixing sheet (not shown). The wiring board 22 has a rectangular window hole 24 that exposes the submount member 30 at the center. Therefore, the heat generated in the LED chip 10 is transferred to the submount member 30 and the heat transfer plate 21 without passing through the wiring board 22. The mounting substrate 20 is formed in a flat plate shape as a whole.

上述の伝熱板２１は、Ｃｕからなる金属板２１ａを基礎とし、当該金属板２１ａの厚み方向の両面にＡｕ膜からなるコーティング膜２１ｂが形成されている。   The heat transfer plate 21 is based on a metal plate 21a made of Cu, and a coating film 21b made of an Au film is formed on both surfaces in the thickness direction of the metal plate 21a.

一方、配線基板２２は、ポリイミドフィルムからなる絶縁性基材２２ａの一表面側に、ＬＥＤチップ１０への給電用の一対の配線パターン２３，２３が設けられるとともに、各配線パターン２３，２３および絶縁性基材２２ａにおいて配線パターン２３，２３が形成されていない部位を覆う白色系の樹脂からなるレジスト層２６が積層されている。ここにおいて、ＬＥＤチップ１０は、上記カソード電極がボンディングワイヤ１４を介して一方の配線パターン２３と電気的に接続され、上記アノード電極がサブマウント部材３０の電極パターン３１およびボンディングワイヤ１４を介して他方の配線パターン２３と電気的に接続されている。なお、各配線パターン２３，２３は、絶縁性基材２２ａの外周形状の半分よりもやや小さな外周形状に形成されている。また、絶縁性基材２２ａの材料としては、ＦＲ４、ＦＲ５、紙フェノールなどを採用してもよい。   On the other hand, the wiring substrate 22 is provided with a pair of wiring patterns 23 and 23 for feeding power to the LED chip 10 on one surface side of an insulating base material 22a made of a polyimide film. A resist layer 26 made of a white resin covering a portion where the wiring patterns 23, 23 are not formed in the conductive base material 22a is laminated. Here, in the LED chip 10, the cathode electrode is electrically connected to one wiring pattern 23 via the bonding wire 14, and the anode electrode is connected to the other via the electrode pattern 31 of the submount member 30 and the bonding wire 14. The wiring pattern 23 is electrically connected. Each of the wiring patterns 23 and 23 is formed in an outer peripheral shape slightly smaller than half of the outer peripheral shape of the insulating base material 22a. Further, FR4, FR5, paper phenol or the like may be employed as the material of the insulating base material 22a.

レジスト層２６は、配線基板２２の窓孔２４の近傍において各配線パターン２３，２３の２箇所が露出し、配線基板２２の周部において各配線パターン２３，２３の１箇所が露出するようにパターニングされており、各配線パターン２３，２３は、配線基板２２の窓孔２４近傍において露出した部位が、ボンディングワイヤ１４が接続される端子部２３ａを構成し、配線基板２２の周部において露出した円形状の部位が外部接続用の電極部２３ｂを構成している。なお、配線基板２２の配線パターン２３，２３は、Ｃｕ膜とＮｉ膜とＡｕ膜との積層膜により構成され、最上層がＡｕ膜となっている。   The resist layer 26 is patterned so that two portions of each wiring pattern 23, 23 are exposed in the vicinity of the window hole 24 of the wiring substrate 22 and one portion of each wiring pattern 23, 23 is exposed in the peripheral portion of the wiring substrate 22. In each wiring pattern 23, 23, a portion exposed in the vicinity of the window hole 24 of the wiring substrate 22 constitutes a terminal portion 23 a to which the bonding wire 14 is connected, and a circle exposed at the peripheral portion of the wiring substrate 22. The part of the shape constitutes an electrode part 23b for external connection. In addition, the wiring patterns 23 and 23 of the wiring board 22 are comprised by the laminated film of Cu film | membrane, Ni film | membrane, and Au film | membrane, and the uppermost layer is Au film | membrane.

また、サブマウント部材３０は、熱伝導率が比較的高く且つ電気絶縁性を有するＡｌＮにより形成されており、平面サイズをＬＥＤチップ１０のチップサイズよりも大きく設定してあり、伝熱板２１とＬＥＤチップ１０との線膨張率差に起因してＬＥＤチップ１０に働く応力を緩和する応力緩和機能と、ＬＥＤチップ１０で発生した熱を伝熱板２１においてＬＥＤチップ１０のチップサイズよりも広い範囲に伝熱させる熱伝導機能とを有している。したがって、本実施形態の発光装置１では、ＬＥＤチップ１０と伝熱板２１との線膨張率差に起因してＬＥＤチップ１０に働く応力を緩和することができるとともに、ＬＥＤチップ１０で発生した熱をサブマウント部材３０および伝熱板２１を介して効率良く放熱させることができる。なお、サブマウント部材３０の材料はＡｌＮに限らず、例えば、複合ＳｉＣ、Ｓｉなどを採用してもよい。   The submount member 30 is made of AlN having a relatively high thermal conductivity and electrical insulation, and has a planar size larger than the chip size of the LED chip 10. A stress relieving function that relieves stress acting on the LED chip 10 due to a difference in linear expansion coefficient with the LED chip 10, and heat generated in the LED chip 10 in a range wider than the chip size of the LED chip 10 in the heat transfer plate 21 It has a heat conduction function to transfer heat to the. Therefore, in the light emitting device 1 of the present embodiment, the stress acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21 can be relieved, and the heat generated in the LED chip 10 can be reduced. Can be efficiently radiated through the submount member 30 and the heat transfer plate 21. The material of the submount member 30 is not limited to AlN, and for example, composite SiC, Si, or the like may be employed.

また、サブマウント部材３０の一表面側には、ＬＥＤチップ１０におけるサブマウント部材３０側の電極である上記アノード電極と接合される上述の電極パターン３１が形成され、当該電極パターン３１の周囲にＬＥＤチップ１０の側面から放射された光を反射する反射膜３２が形成されている。したがって、ＬＥＤチップ１０の側面から放射された可視光がサブマウント部材３０に吸収されるのを防止することができ、外部への光取出し効率をさらに高めることが可能となる。ここにおいて、電極パターン３１は、Ａｕを主成分とするＡｕとＳｎとの合金（例えば、８０Ａｕ−２０Ｓｎ、７０Ａｕ−３０Ｓｎなど）により形成されている。また、反射膜３２は、Ａｌにより形成されているが、Ａｌに限らず、Ａｇ，Ｎｉ，Ａｕなどにより形成してもよい。   Further, the electrode pattern 31 is formed on one surface side of the submount member 30 to be joined to the anode electrode that is an electrode on the submount member 30 side of the LED chip 10, and the LED pattern 31 is surrounded by the LED pattern 31. A reflective film 32 that reflects light emitted from the side surface of the chip 10 is formed. Therefore, visible light radiated from the side surface of the LED chip 10 can be prevented from being absorbed by the submount member 30, and the light extraction efficiency to the outside can be further increased. Here, the electrode pattern 31 is formed of an alloy of Au and Sn containing Au as a main component (for example, 80Au-20Sn, 70Au-30Sn, etc.). The reflective film 32 is made of Al, but is not limited to Al, and may be made of Ag, Ni, Au, or the like.

また、本実施形態の発光装置１では、サブマウント部材３０の厚み寸法を、当該サブマウント部材３０の表面が配線基板２２のレジスト層２６の表面よりも伝熱板２１から離れるように設定してあり、ＬＥＤチップ１０から側方に放射された光が配線基板２２の窓孔２４の内周面を通して配線基板２２に吸収されるのを防止することができる。   In the light emitting device 1 of the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the resist layer 26 of the wiring board 22. In addition, light emitted from the LED chip 10 to the side can be prevented from being absorbed by the wiring board 22 through the inner peripheral surface of the window hole 24 of the wiring board 22.

上述の封止部５０の材料である封止樹脂としては、黄色蛍光体粒子を分散させたシリコーン樹脂を用いているが、黄色蛍光体粒子を分散させたエポキシ樹脂などを用いてもよい。   As the sealing resin that is the material of the sealing portion 50 described above, a silicone resin in which yellow phosphor particles are dispersed is used, but an epoxy resin in which yellow phosphor particles are dispersed may be used.

光学部材４０は、透光性材料（例えば、シリコーン樹脂など）の成形品であってドーム状に形成されている。ここで、本実施形態では、光学部材４０をシリコーン樹脂により形成してあるので、光学部材４０と封止部５０との屈折率差および線膨張率差を小さくすることができる。なお、光学部材４０の材料として用いる透光性材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラス、有機成分と無機成分とがｎｍレベルもしくは分子レベルで混合、結合した有機・無機ハイブリッド材料などを採用してもよい。また、光学部材４０は、肉厚が一様となるように形成されている。また、光学部材４０は、実装基板２０側の端縁（開口部の周縁）を実装基板２０に対して、例えば接着剤（例えば、シリコーン樹脂、エポキシ樹脂など）を用いて固着すればよい。   The optical member 40 is a molded product of a translucent material (for example, silicone resin) and is formed in a dome shape. Here, in this embodiment, since the optical member 40 is formed of silicone resin, the difference in refractive index and the linear expansion coefficient between the optical member 40 and the sealing portion 50 can be reduced. The translucent material used as the material of the optical member 40 is not limited to a silicone resin. For example, an acrylic resin, an epoxy resin, glass, an organic / inorganic component mixed and bonded at the nm level or molecular level, and organic / An inorganic hybrid material or the like may be employed. Moreover, the optical member 40 is formed so that thickness may become uniform. In addition, the optical member 40 may be fixed to the mounting substrate 20 with an end edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, silicone resin, epoxy resin).

ところで、本実施形態の発光装置１の製造にあたっては、例えば、ＬＥＤチップ１０を実装基板２０に実装した後、ＬＥＤチップ１０を封止部５０の一部となる液状の第１の封止樹脂（本実施形態では、黄色蛍光体粒子を分散させたシリコーン樹脂）により覆ってから硬化させ、その後、ドーム状の光学部材４０の内側に上述の封止部５０の残りの部分の基礎となる液状の第２の封止樹脂（本実施形態では、黄色蛍光体粒子を分散させたシリコーン樹脂）を注入してから、光学部材４０を実装基板２０に対して位置決めして第２の封止樹脂を硬化させることによりゲル状の封止部５０を形成するのと同時に光学部材４０を実装基板２０に固着する製造方法を採用すればよく、このような製造方法を採用することで封止部５０にボイドが発生するのを抑制することが可能となる。   By the way, in manufacturing the light emitting device 1 according to the present embodiment, for example, after the LED chip 10 is mounted on the mounting substrate 20, the liquid first sealing resin (part of the sealing portion 50 becomes the LED chip 10). In the present embodiment, it is covered with a silicone resin in which yellow phosphor particles are dispersed, and then cured, and then a liquid that forms the basis of the remaining portion of the sealing portion 50 is formed inside the dome-shaped optical member 40. After injecting a second sealing resin (in this embodiment, a silicone resin in which yellow phosphor particles are dispersed), the optical member 40 is positioned with respect to the mounting substrate 20 to cure the second sealing resin. It is sufficient to adopt a manufacturing method in which the optical member 40 is fixed to the mounting substrate 20 at the same time as the gel-like sealing portion 50 is formed. By adopting such a manufacturing method, voids are formed in the sealing portion 50. Occur It is possible to prevent the.

以上説明した本実施形態の発光装置１では、光学部材４０が、透光性材料の成形品からなり、封止部５０が、ＬＥＤチップ１０から放射される可視光によって励起されてＬＥＤチップ１０とは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材４０の内側に注入してから光学部材４０を実装基板２０に対して位置決めした後に当該封止樹脂を硬化させることにより形成されているので、蛍光体粒子で発生した熱を実装基板２０側へ放熱させることができて蛍光体粒子の温度上昇を抑制できるとともに、封止部５０の形状が光学部材４０の形状により規定されるから、封止部５０の形状ばらつきが起こりにくくなり、色むらを抑制できる。なお、本実施形態の発光装置１では、実装基板２０に光学部材４０を位置決めする位置決め用の凹部や凸部などを設けて光学部材４０の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。   In the light emitting device 1 of the present embodiment described above, the optical member 40 is made of a molded product of a translucent material, and the sealing portion 50 is excited by visible light emitted from the LED chip 10 to be connected to the LED chip 10. Injecting a sealing resin in which phosphor particles emitting different colors of visible light are dispersed inside the optical member 40 and then positioning the optical member 40 with respect to the mounting substrate 20 and then curing the sealing resin Therefore, the heat generated in the phosphor particles can be dissipated to the mounting substrate 20 side, the temperature rise of the phosphor particles can be suppressed, and the shape of the sealing portion 50 depends on the shape of the optical member 40. Since it is prescribed | regulated, the shape dispersion | variation of the sealing part 50 becomes difficult to occur and color irregularity can be suppressed. In the light emitting device 1 according to the present embodiment, the positioning accuracy of the optical member 40 is improved by providing the mounting substrate 20 with a positioning concave portion or convex portion for positioning the optical member 40, thereby causing variations in chromaticity and color unevenness. Can be further suppressed.

（実施形態２）
本実施形態の発光装置１の基本構成は実施形態１と略同じであって、図２に示すように、光学部材４０の光出射面との間に空気層７０が形成される形で配設された色度調整用部材６０を備え、色度調整用部材６０が、封止部５０の蛍光体粒子である第１の蛍光体粒子と同一色の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品により構成されている点が相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 2)
The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and is arranged in such a manner that an air layer 70 is formed between the light emitting surface of the optical member 40 as shown in FIG. Second chromaticity adjusting member 60, and the chromaticity adjusting member 60 emits visible light of the same color as the first phosphor particles that are the phosphor particles of the sealing portion 50. It is different in that it is formed of a molded product of a light-transmitting material in which is dispersed. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

本実施形態の発光装置１では、実施形態１と同様に、ＬＥＤチップ１０として、青色光を放射するＧａＮ系青色ＬＥＤチップを用い、封止部５０における第１の蛍光体粒子として、黄色蛍光体粒子を用いているので、色度調整用部材６０における第２の蛍光体粒子として、黄色蛍光体粒子を用いている。なお、第１の蛍光体粒子と第２の蛍光体粒子とは同一材料の黄色蛍光体粒子でもよいし、異種材料の黄色蛍光体粒子でもよい。   In the light emitting device 1 of the present embodiment, as in the first embodiment, a GaN blue LED chip that emits blue light is used as the LED chip 10, and the yellow phosphor is used as the first phosphor particles in the sealing unit 50. Since the particles are used, yellow phosphor particles are used as the second phosphor particles in the chromaticity adjusting member 60. The first phosphor particles and the second phosphor particles may be the same material yellow phosphor particles or different materials yellow phosphor particles.

しかして、本実施形態の発光装置１では、光学部材４０の出射面から出射した混色光が色度調整用部材６０で色度調整されて出射されることとなるので、製造時に、あらかじめ第２の蛍光体粒子の濃度の異なる複数種の色度調整用部材６０を用意しておき、光学部材４０から出射される混色光の色度と目標とする混色光との色度のずれに応じて適宜濃度の色度調整用部材６０を採用することにより、発光装置１ごとの色度のばらつきを低減できる。なお、本実施形態の発光装置１では、色度調整用部材６０における黄色蛍光体粒子の濃度が封止部５０における黄色蛍光体粒子の濃度に比べて低濃度なので、比較例として封止部５０に黄色蛍光体粒子を分散させずに色度調整用部材６０のみに黄色蛍光体粒子を分散させてなる発光装置に比べて、黄色蛍光体粒子の温度上昇を抑制することができる。   Therefore, in the light emitting device 1 of the present embodiment, the mixed color light emitted from the emission surface of the optical member 40 is emitted after being adjusted in chromaticity by the chromaticity adjusting member 60, so that the second color is previously obtained at the time of manufacture. A plurality of types of chromaticity adjusting members 60 having different phosphor particle concentrations are prepared, and the chromaticity of the mixed color light emitted from the optical member 40 and the chromaticity difference between the target mixed color light are adjusted. By adopting the chromaticity adjusting member 60 having an appropriate density, variation in chromaticity for each light emitting device 1 can be reduced. In the light emitting device 1 of the present embodiment, the concentration of the yellow phosphor particles in the chromaticity adjusting member 60 is lower than the concentration of the yellow phosphor particles in the sealing portion 50. In comparison with a light emitting device in which yellow phosphor particles are dispersed only in the chromaticity adjusting member 60 without dispersing the yellow phosphor particles, the temperature increase of the yellow phosphor particles can be suppressed.

（実施形態３）
図３に示す本実施形態の発光装置１の基本構成は実施形態１と略同じであって、光学部材４０の透光性材料として、ＬＥＤチップ１０よりも長波長かつ封止部５０の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料を用いている点などが相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 3)
The basic configuration of the light emitting device 1 of the present embodiment shown in FIG. 3 is substantially the same as that of the first embodiment, and the phosphor of the sealing member 50 having a longer wavelength than the LED chip 10 is used as the translucent material of the optical member 40. The difference is that a translucent material in which second phosphor particles that emit visible light having a shorter wavelength than the first phosphor particles that are particles are dispersed is used. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

本実施形態の発光装置１では、ＬＥＤチップ１０として、青色光を放射するＧａＮ系青色ＬＥＤチップを用い、封止部５０における第１の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、光学部材４０における第２の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、ＬＥＤチップ１０から放射され封止部５０および光学部材４０を透過した青色光と、封止部５０の赤色蛍光体粒子から放射され光学部材４０を透過した赤色光と、光学部材４０の緑色蛍光体粒子から放射された緑色光との混色光からなる白色光を得ることができる。   In the light emitting device 1 of the present embodiment, a GaN-based blue LED chip that emits blue light is used as the LED chip 10, and the first phosphor particles in the sealing unit 50 are emitted from the blue light emitted from the LED chip 10. The red phosphor particles that emit red light when excited are used, and the second phosphor particles in the optical member 40 are green phosphor particles that are excited by the blue light emitted from the LED chip 10 and emit green light. The blue light emitted from the LED chip 10 and transmitted through the sealing portion 50 and the optical member 40, the red light emitted from the red phosphor particles of the sealing portion 50 and transmitted through the optical member 40, and the optical member 40 are used. White light consisting of mixed color light with green light emitted from the green phosphor particles can be obtained.

しかして、本実施形態の発光装置１では、実施形態１のようにＬＥＤチップ１０と１種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。   Therefore, in the light emitting device 1 according to the present embodiment, the color rendering property of the light emitting device 1 is higher than that in the case of obtaining white light which is a desired color mixture light by combining the LED chip 10 and one kind of phosphor particles as in the first embodiment. It is possible to obtain high white light, and among the red phosphor particles and green phosphor particles having different emission colors, the green light emitted from the green phosphor particles whose emission peak wavelength is on the lower wavelength side is the emission peak. It is possible to suppress secondary absorption by the red phosphor particles having the longer wavelength side.

（実施形態４）
本実施形態の発光装置１の基本構成は実施形態１と略同じであって、図４に示すように、封止部５０に密着している光学部材４０（以下、第１の光学部材４０と称す）を囲む形で実装基板２０の上記実装面側に配設されたドーム状の第２の光学部材８０と、ＬＥＤチップ１０よりも長波長かつ封止部５０の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した封止樹脂により形成され第１の光学部材４０と第２の光学部材８０との間の空間に充実された色変換部９０とを備えている点が相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 4)
The basic configuration of the light emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 4, an optical member 40 (hereinafter referred to as the first optical member 40) that is in close contact with the sealing portion 50. Dome-shaped second optical member 80 disposed on the mounting surface side of the mounting substrate 20 so as to surround the first and second phosphor particles having a wavelength longer than that of the LED chip 10 and the sealing portion 50. Formed of a sealing resin in which second phosphor particles that emit visible light having a shorter wavelength than the phosphor particles are dispersed in the space between the first optical member 40 and the second optical member 80. The color conversion unit 90 is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

上述の第２の光学部材８０は、第１の光学部材４０と同様に、透光性材料（例えば、シリコーン樹脂など）の成形品であってドーム状に形成されている。ここにおいて、第２の光学部材８０は、第１の光学部材４０との間の距離が一定となるようなドーム状で且つ肉厚が一様となるように形成されている。なお、第２の光学部材８０は、実装基板２０側の端縁（開口部の周縁）を実装基板２０に対して、例えば接着剤（例えば、シリコーン樹脂、エポキシ樹脂など）を用いて固着すればよい。   Similar to the first optical member 40, the second optical member 80 described above is a molded product of a translucent material (for example, silicone resin) and is formed in a dome shape. Here, the second optical member 80 is formed in a dome shape and a uniform thickness so that the distance from the first optical member 40 is constant. If the second optical member 80 is fixed to the mounting substrate 20 with an edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, silicone resin, epoxy resin). Good.

また、色変換部９０の材料として用いる封止樹脂は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂などでもよい。   Further, the sealing resin used as the material of the color conversion unit 90 is not limited to a silicone resin, and may be, for example, an acrylic resin or an epoxy resin.

本実施形態の発光装置１では、ＬＥＤチップ１０として、青色光を放射するＧａＮ系青色ＬＥＤチップを用い、封止部５０における第１の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、色変換部９０における第２の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、ＬＥＤチップ１０から放射され封止部５０および第１の光学部材４０および色変換部９０および第２の光学部材８０を透過した青色光と、封止部５０の赤色蛍光体粒子から放射され第１の光学部材４０および色変換部９０および第２の光学部材８０を透過した赤色光と、色変換部９０の緑色蛍光体粒子から放射され第２の光学部材８０を透過した緑色光との混色光からなる白色光を得ることができる。   In the light emitting device 1 of the present embodiment, a GaN-based blue LED chip that emits blue light is used as the LED chip 10, and the first phosphor particles in the sealing unit 50 are emitted from the blue light emitted from the LED chip 10. Green phosphor particles that emit red light when excited by the blue light emitted from the LED chip 10 are used as the second phosphor particles in the color conversion unit 90 using red phosphor particles that are excited to emit red light. Blue light emitted from the LED chip 10 and transmitted through the sealing unit 50, the first optical member 40, the color conversion unit 90, and the second optical member 80, and red phosphor particles of the sealing unit 50 The red light emitted from the first optical member 40 and the color conversion unit 90 and the second optical member 80, and the second light emitted from the green phosphor particles of the color conversion unit 90 It is possible to obtain white light composed of mixed color light of the green light transmitted through the member 80.

ところで、本実施形態の発光装置１の製造にあたっては、例えば、実施形態１にて説明した製造方法と同様の工程を経ることで、ゲル状の封止部５０を形成するのと同時に第１の光学部材４０を実装基板２０に固着した後、第２の蛍光体粒子を分散した封止樹脂を第２の光学部材８０の内側に注入してから第２の光学部材８０を第１の光学部材４０および実装基板２０に対し位置決めした後に当該封止樹脂を硬化させることにより色変換部９０を形成するのと同時に第２の光学部材８０を実装基板２０に固着すればよい。   By the way, in manufacturing the light emitting device 1 of the present embodiment, for example, the first process is performed simultaneously with the formation of the gel-like sealing portion 50 through the same process as the manufacturing method described in the first embodiment. After the optical member 40 is fixed to the mounting substrate 20, a sealing resin in which the second phosphor particles are dispersed is injected into the second optical member 80 and then the second optical member 80 is replaced with the first optical member. The second optical member 80 may be fixed to the mounting substrate 20 at the same time as the color conversion unit 90 is formed by curing the sealing resin after positioning with respect to the mounting substrate 20 and the mounting substrate 20.

しかして、本実施形態の発光装置１では、実施形態１のようにＬＥＤチップ１０と１種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。なお、本実施形態の発光装置１では、実装基板２０に第２の光学部材８０を位置決めする位置決め用の凹部や凸部などを設けて第２の光学部材８０の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。   Therefore, in the light emitting device 1 according to the present embodiment, the color rendering property of the light emitting device 1 is higher than that in the case of obtaining white light which is a desired color mixture light by combining the LED chip 10 and one kind of phosphor particles as in the first embodiment. It is possible to obtain high white light, and among the red phosphor particles and green phosphor particles having different emission colors, the green light emitted from the green phosphor particles whose emission peak wavelength is on the lower wavelength side is the emission peak. It is possible to suppress secondary absorption by the red phosphor particles having the longer wavelength side. In the light emitting device 1 of the present embodiment, the mounting substrate 20 is provided with a positioning concave portion or convex portion for positioning the second optical member 80 to increase the positional accuracy of the second optical member 80. The variation in the degree and the color unevenness can be further suppressed.

（実施形態５）
本実施形態の発光装置１の基本構成は実施形態１と略同じであって、図５に示すように、封止部５０に密着している光学部材４０（以下、第１の光学部材４０と称す）の光出射面との間に空気層７０が形成される形で配設されたドーム状の第２の光学部材８０を備え、第２の光学部材８０が、ＬＥＤチップ１０よりも長波長かつ封止部５０の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品により構成されている点などが相違する。なお、実施形態１と同様の構成要素には同一の符号を付して説明を省略する。 (Embodiment 5)
The basic configuration of the light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 5, an optical member 40 (hereinafter referred to as the first optical member 40) that is in close contact with the sealing portion 50. A dome-shaped second optical member 80 disposed in such a manner that an air layer 70 is formed between the second optical member 80 and the light emitting surface of the LED chip 10, and the second optical member 80 has a longer wavelength than the LED chip 10. And the point etc. which are comprised with the molded article of the translucent material which disperse | distributed the 2nd fluorescent substance particle | grains which radiate | emit visible light of shorter wavelength than the 1st fluorescent substance particle which is the fluorescent substance particle of the sealing part 50, etc. Is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

上述の第２の光学部材８０は、第１の光学部材４０との間の距離が一定となるようなドーム状で且つ肉厚が一様となるように形成されている。なお、第２の光学部材８０は、実装基板２０側の端縁（開口部の周縁）を実装基板２０に対して、例えば接着剤（例えば、シリコーン樹脂、エポキシ樹脂など）を用いて固着すればよい。   The second optical member 80 described above is formed in a dome shape and a uniform thickness so that the distance from the first optical member 40 is constant. If the second optical member 80 is fixed to the mounting substrate 20 with an edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, silicone resin, epoxy resin). Good.

本実施形態の発光装置１では、ＬＥＤチップ１０として、青色光を放射するＧａＮ系青色ＬＥＤチップを用い、封止部５０における第１の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて赤色光を放射する赤色蛍光体粒子を用い、第２の光学部材８０における第２の蛍光体粒子として、ＬＥＤチップ１０から放射された青色光によって励起されて緑色光を放射する緑色蛍光体粒子を用いており、ＬＥＤチップ１０から放射され封止部５０および第１の光学部材４０および空気層７０および第２の光学部材８０を透過した青色光と、封止部５０の赤色蛍光体粒子から放射され第１の光学部材４０および空気層７０および第２の光学部材８０を透過した赤色光と、第２の光学部材８０の緑色蛍光体粒子から放射された緑色光との混色光からなる白色光を得ることができる。   In the light emitting device 1 of the present embodiment, a GaN-based blue LED chip that emits blue light is used as the LED chip 10, and the first phosphor particles in the sealing unit 50 are emitted from the blue light emitted from the LED chip 10. Red fluorescent particles that emit red light when excited are used, and the second fluorescent particles in the second optical member 80 are green fluorescent light that is excited by blue light emitted from the LED chip 10 and emits green light. Blue light emitted from the LED chip 10 and transmitted through the sealing portion 50, the first optical member 40, the air layer 70, and the second optical member 80, and the red phosphor of the sealing portion 50. Red light emitted from the particles and transmitted through the first optical member 40, the air layer 70 and the second optical member 80, and emitted from the green phosphor particles of the second optical member 80. It is possible to obtain white light composed of mixed light with the green light.

しかして、本実施形態の発光装置１では、実施形態１のようにＬＥＤチップ１０と１種類の蛍光体粒子との組み合わせにより所望の混色光である白色光を得る場合に比べて、演色性の高い白色光を得ることが可能となり、しかも、発光色の異なる赤色蛍光体粒子および緑色蛍光体粒子のうち発光ピーク波長が低波長側にある緑色蛍光体粒子から放射された緑色光が、発光ピーク波長が長波長側にある赤色蛍光体粒子に二次吸収されるのを抑制することが可能となる。なお、本実施形態の発光装置１では、実装基板２０に第２の光学部材８０を位置決めする位置決め用の凹部や凸部などを設けて第２の光学部材８０の位置精度を高めることで、色度のばらつきや色むらをさらに抑制することができる。   Therefore, in the light emitting device 1 according to the present embodiment, the color rendering property of the light emitting device 1 is higher than that in the case of obtaining white light which is a desired color mixture light by combining the LED chip 10 and one kind of phosphor particles as in the first embodiment. It is possible to obtain high white light, and among the red phosphor particles and green phosphor particles having different emission colors, the green light emitted from the green phosphor particles whose emission peak wavelength is on the lower wavelength side is the emission peak. It is possible to suppress secondary absorption by the red phosphor particles having the longer wavelength side. In the light emitting device 1 of the present embodiment, the mounting substrate 20 is provided with a positioning concave portion or convex portion for positioning the second optical member 80 to increase the positional accuracy of the second optical member 80. The variation in the degree and the color unevenness can be further suppressed.

また、本実施形態の発光装置１では、第２の光学部材８０と第１の光学部材４０との間に空気層７０が形成されているので、第２の光学部材８０の緑色蛍光体粒子から放射された緑色光が封止部５０の赤色蛍光体に二次吸収されるのをより確実に抑制することが可能となる。   Further, in the light emitting device 1 of the present embodiment, since the air layer 70 is formed between the second optical member 80 and the first optical member 40, the green phosphor particles of the second optical member 80 are used. It is possible to more reliably suppress the emitted green light from being secondarily absorbed by the red phosphor of the sealing unit 50.

実施形態１の発光装置の概略断面図である。1 is a schematic cross-sectional view of a light emitting device according to Embodiment 1. FIG. 実施形態２の発光装置の概略断面図である。6 is a schematic cross-sectional view of a light emitting device according to Embodiment 2. FIG. 実施形態３の発光装置の概略断面図である。6 is a schematic cross-sectional view of a light emitting device according to Embodiment 3. FIG. 実施形態４の発光装置の概略断面図である。6 is a schematic cross-sectional view of a light emitting device according to Embodiment 4. FIG. 実施形態５の発光装置の概略断面図である。6 is a schematic cross-sectional view of a light emitting device according to Embodiment 5. FIG. 従来例の発光装置の概略断面図である。It is a schematic sectional drawing of the light-emitting device of a prior art example.

符号の説明Explanation of symbols

１ 発光装置
１０ ＬＥＤチップ
１１ 光取り出し面
２０ 実装基板
４０ 光学部材（第１の光学部材）
５０ 封止部
６０ 色度調整用部材
７０ 空気層
８０ 第２の光学部材
９０ 色変換部 DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 LED chip 11 Light extraction surface 20 Mounting board 40 Optical member (1st optical member)
DESCRIPTION OF SYMBOLS 50 Sealing part 60 Chromaticity adjustment member 70 Air layer 80 2nd optical member 90 Color conversion part

Claims (5)

可視光を放射するＬＥＤチップと、当該ＬＥＤチップが実装された実装基板と、実装基板におけるＬＥＤチップの実装面側において実装基板との間にＬＥＤチップを囲む形で配設されたドーム状の光学部材と、光学部材と実装基板とで囲まれた空間に充実されＬＥＤチップを封止した封止部とを備え、光学部材は、透光性材料の成形品からなり、封止部は、ＬＥＤチップから放射される可視光によって励起されてＬＥＤチップとは異なる色の可視光を放射する蛍光体粒子を分散した封止樹脂を光学部材の内側に注入してから光学部材を実装基板に対して位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする発光装置。   An LED chip that emits visible light, a mounting substrate on which the LED chip is mounted, and a dome-shaped optical device that is disposed between the mounting substrate and the mounting substrate on the mounting surface side of the LED chip. A member and a sealing portion that is filled in a space surrounded by the optical member and the mounting substrate and seals the LED chip. The optical member is made of a molded product of a translucent material, and the sealing portion is an LED. A sealing resin in which phosphor particles that are excited by visible light emitted from the chip and emit visible light of a color different from that of the LED chip is injected inside the optical member, and then the optical member is mounted on the mounting substrate. A light-emitting device formed by curing the sealing resin after positioning. 前記光学部材の光出射面との間に空気層が形成される形で配設された色度調整用部材を備え、色度調整用部材は、前記封止部の蛍光体粒子である第１の蛍光体粒子と同一色の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする請求項１記載の発光装置。   A chromaticity adjusting member disposed in a form in which an air layer is formed between the light emitting surface of the optical member, and the chromaticity adjusting member is a phosphor particle of the sealing portion; The light-emitting device according to claim 1, wherein the light-emitting device comprises a molded product of a translucent material in which second phosphor particles that emit visible light of the same color as the phosphor particles are dispersed. 前記光学部材は、前記透光性材料としてＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料を用いてなることを特徴とする請求項１記載の発光装置。   The optical member is a second phosphor particle that emits visible light having a longer wavelength than the LED chip and a shorter wavelength than the first phosphor particle of the sealing portion as the light-transmitting material. The light-emitting device according to claim 1, wherein a light-transmitting material in which is dispersed is used. 前記光学部材である第１の光学部材を囲む形で配設されたドーム状の第２の光学部材と、前記ＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した封止樹脂により形成され第１の光学部材と第２の光学部材との間の空間に充実された色変換部とを備え、色変換部は、第２の蛍光体粒子を分散した封止樹脂を第２の光学部材の内側に注入してから第２の光学部材を第１の光学部材および実装基板に対し位置決めした後に当該封止樹脂を硬化させることにより形成されてなることを特徴とする請求項１記載の発光装置。   A dome-shaped second optical member disposed so as to surround the first optical member, which is the optical member, and a first fluorescence that is longer than the LED chip and is a phosphor particle in the sealing portion A color conversion section formed of a sealing resin in which second phosphor particles that emit visible light having a shorter wavelength than the body particles are dispersed and filled in a space between the first optical member and the second optical member The color conversion unit injects a sealing resin in which the second phosphor particles are dispersed into the second optical member and then attaches the second optical member to the first optical member and the mounting substrate. The light emitting device according to claim 1, wherein the light emitting device is formed by curing the sealing resin after positioning. 前記光学部材である第１の光学部材の光出射面との間に空気層が形成される形で配設されたドーム状の第２の光学部材を備え、第２の光学部材は、前記ＬＥＤチップよりも長波長かつ前記封止部の蛍光体粒子である第１の蛍光体粒子よりも短波長の可視光を放射する第２の蛍光体粒子を分散した透光性材料の成形品からなることを特徴とする請求項１記載の発光装置。   A second optical member having a dome shape disposed in a form in which an air layer is formed between the light emitting surface of the first optical member as the optical member, and the second optical member includes the LED It consists of a molded product of a translucent material in which second phosphor particles that emit visible light having a longer wavelength than the chip and a shorter wavelength than the first phosphor particles that are phosphor particles in the sealing portion are dispersed. The light-emitting device according to claim 1.
JP2006344870A 2006-12-21 2006-12-21 Light-emitting device Pending JP2008159705A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006344870A JP2008159705A (en) 2006-12-21 2006-12-21 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006344870A JP2008159705A (en) 2006-12-21 2006-12-21 Light-emitting device

Publications (1)

Publication Number Publication Date
JP2008159705A true JP2008159705A (en) 2008-07-10

Family

ID=39660318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006344870A Pending JP2008159705A (en) 2006-12-21 2006-12-21 Light-emitting device

Country Status (1)

Country Link
JP (1) JP2008159705A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101807654A (en) * 2009-02-13 2010-08-18 夏普株式会社 The manufacture method of light-emitting device and light-emitting device
KR20110055554A (en) * 2008-09-01 2011-05-25 오스람 옵토 세미컨덕터스 게엠베하 Optoelectronic component
EP2355195A2 (en) 2010-02-02 2011-08-10 Nitto Denko Corporation Semiconductor light-emitting device, its encapsulation sheet and method for producing said device
JP2013012536A (en) * 2011-06-28 2013-01-17 Koito Mfg Co Ltd Plane light-emitting module
JP2014060328A (en) * 2012-09-19 2014-04-03 Nichia Chem Ind Ltd Light-emitting device
JP2015079917A (en) * 2013-10-18 2015-04-23 スタンレー電気株式会社 Semiconductor light emitting device
JP2015115506A (en) * 2013-12-12 2015-06-22 パナソニックＩｐマネジメント株式会社 Illumination light source
EP3147956A1 (en) * 2015-09-22 2017-03-29 Samsung Electronics Co., Ltd. Led package, backlight unit and illumination device including same, and liquid crystal display device
US10627672B2 (en) 2015-09-22 2020-04-21 Samsung Electronics Co., Ltd. LED package, backlight unit and illumination device including same, and liquid crystal display including backlight unit
CN117497667A (en) * 2023-12-29 2024-02-02 江西省兆驰光电有限公司 Luminous LED packaging method and luminous LED packaging structure

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293584A (en) * 1987-05-27 1988-11-30 岩崎電気株式会社 Light emitting display body
JP2003110146A (en) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd Light-emitting device
JP2004071357A (en) * 2002-08-06 2004-03-04 Shigeo Fujita Lighting device
JP2004071771A (en) * 2002-08-05 2004-03-04 Okaya Electric Ind Co Ltd Light emitting diode
JP2004087812A (en) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd Light emitting device
JP2004266148A (en) * 2003-03-03 2004-09-24 Toyoda Gosei Co Ltd Light emitting device and manufacturing method thereof
JP2005158949A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
JP2005268431A (en) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd Light emitting device and method for manufacturing the same
JP2005340472A (en) * 2004-05-26 2005-12-08 Kyocera Corp Light-emitting device and illuminator
JP2006049857A (en) * 2004-06-29 2006-02-16 Fuji Photo Film Co Ltd Light source, light source manufacturing method and color thermal printer
WO2006067885A1 (en) * 2004-12-24 2006-06-29 Kyocera Corporation Light-emitting device and illuminating device
JP2006237609A (en) * 2005-02-22 2006-09-07 Agilent Technol Inc Semiconductor light emitting device and method for manufacturing same
JP2006525682A (en) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293584A (en) * 1987-05-27 1988-11-30 岩崎電気株式会社 Light emitting display body
JP2003110146A (en) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd Light-emitting device
JP2004071771A (en) * 2002-08-05 2004-03-04 Okaya Electric Ind Co Ltd Light emitting diode
JP2004071357A (en) * 2002-08-06 2004-03-04 Shigeo Fujita Lighting device
JP2004087812A (en) * 2002-08-27 2004-03-18 Sanyo Electric Co Ltd Light emitting device
JP2004266148A (en) * 2003-03-03 2004-09-24 Toyoda Gosei Co Ltd Light emitting device and manufacturing method thereof
JP2006525682A (en) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package
JP2005158949A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
JP2005268431A (en) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd Light emitting device and method for manufacturing the same
JP2005340472A (en) * 2004-05-26 2005-12-08 Kyocera Corp Light-emitting device and illuminator
JP2006049857A (en) * 2004-06-29 2006-02-16 Fuji Photo Film Co Ltd Light source, light source manufacturing method and color thermal printer
WO2006067885A1 (en) * 2004-12-24 2006-06-29 Kyocera Corporation Light-emitting device and illuminating device
JP2006237609A (en) * 2005-02-22 2006-09-07 Agilent Technol Inc Semiconductor light emitting device and method for manufacturing same

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110055554A (en) * 2008-09-01 2011-05-25 오스람 옵토 세미컨덕터스 게엠베하 Optoelectronic component
JP2012501529A (en) * 2008-09-01 2012-01-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Optoelectronic parts
KR101591551B1 (en) 2008-09-01 2016-02-18 오스람 옵토 세미컨덕터스 게엠베하 Optoelectronic component
US8785951B2 (en) 2008-09-01 2014-07-22 Osram Opto Semiconductors Gmbh Optoelectric component
US9175818B2 (en) 2009-02-13 2015-11-03 Sharp Kabushiki Kaisha Light-emitting apparatus and method for manufacturing same
JP2010186968A (en) * 2009-02-13 2010-08-26 Sharp Corp Light-emitting device and method of manufacturing the same
US8736160B2 (en) 2009-02-13 2014-05-27 Sharp Kabushiki Kaisha Light-emitting apparatus and method for manufacturing same
CN101807654A (en) * 2009-02-13 2010-08-18 夏普株式会社 The manufacture method of light-emitting device and light-emitting device
EP2355195A2 (en) 2010-02-02 2011-08-10 Nitto Denko Corporation Semiconductor light-emitting device, its encapsulation sheet and method for producing said device
US9190584B2 (en) 2010-02-02 2015-11-17 Nitto Denko Corporation Optical-semiconductor device
JP2013012536A (en) * 2011-06-28 2013-01-17 Koito Mfg Co Ltd Plane light-emitting module
JP2014060328A (en) * 2012-09-19 2014-04-03 Nichia Chem Ind Ltd Light-emitting device
JP2015079917A (en) * 2013-10-18 2015-04-23 スタンレー電気株式会社 Semiconductor light emitting device
US10014453B2 (en) 2013-10-18 2018-07-03 Stanley Electric Co., Ltd. Semiconductor light-emitting device emitting light mixtures with substantially white tone
JP2015115506A (en) * 2013-12-12 2015-06-22 パナソニックＩｐマネジメント株式会社 Illumination light source
CN107017323A (en) * 2015-09-22 2017-08-04 三星电子株式会社 LED package including its back light unit and light-emitting device and the LCD device including back light unit
EP3147956A1 (en) * 2015-09-22 2017-03-29 Samsung Electronics Co., Ltd. Led package, backlight unit and illumination device including same, and liquid crystal display device
US10627672B2 (en) 2015-09-22 2020-04-21 Samsung Electronics Co., Ltd. LED package, backlight unit and illumination device including same, and liquid crystal display including backlight unit
CN107017323B (en) * 2015-09-22 2021-09-24 三星电子株式会社 LED package, backlight unit and light emitting device including the same, and liquid crystal display device including the backlight unit
CN117497667A (en) * 2023-12-29 2024-02-02 江西省兆驰光电有限公司 Luminous LED packaging method and luminous LED packaging structure
CN117497667B (en) * 2023-12-29 2024-03-19 江西省兆驰光电有限公司 Luminous LED packaging method and luminous LED packaging structure

Similar Documents

Publication Publication Date Title
JP2008159705A (en) Light-emitting device
JP5665160B2 (en) Light emitting device and lighting apparatus
JP4706085B2 (en) Semiconductor light emitting module and manufacturing method thereof
JP4678388B2 (en) Light emitting device
JP5149601B2 (en) Light emitting device
JP5199623B2 (en) Light emitting device
US9385288B2 (en) Light-emitting device
WO2011016433A1 (en) Method for manufacturing led light emitting device
JP2010074117A (en) Light emitting device
JP2008159708A (en) Light-emitting device
US8845143B2 (en) Photoelectronic device
JP2008235827A (en) Light-emitting device
JP2008159707A (en) Light-emitting device
JP2007116095A (en) Light-emitting apparatus
JP5302533B2 (en) Light emitting device
US20190355783A1 (en) Led module
CN110383510B (en) Substrate for light emitting diode and related method
JP4001178B2 (en) Light emitting device
US20160233401A1 (en) Substrate for light emitting device, light emitting device, and method for manufacturing substrate for light emitting device
KR101701738B1 (en) Fabricaing method of led module
JP4976895B2 (en) Light emitting device
JP2011176054A (en) Light emitting device
JP2008159706A (en) Light-emitting device
JP4678389B2 (en) Light emitting device
JP2009076803A (en) Light emitting module and light emitting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090825

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100902

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20111111

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111122

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120112

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120123

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121113