JP2008028368A - 印刷回路基板の製造方法 - Google Patents
印刷回路基板の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
【解決手段】印刷回路基板の製造方法において、インプリント方式で加工した溝に導電性インクを注入することで、所望する厚みの回路パターンを具現することができ、金属の含有された導電性インクの焼成過程でのインクの滲み及びパターン形状の歪みを防止することができる。また、インプリンティングスタンパの製作に使用された回路パターンのCADデータをインクジェットプリンティング工程で再活用することができる。
【選択図】図3a
Description
12 凸状パターン
20 絶縁層
22 基板
24 凹状パターン
26 回路パターン
30 インクジェットヘッド
32 導電性インク
Claims (15)
- (a)回路パターンデータを用いて前記回路パターンデータに応ずる凸状パターンの形成されたインプリンティングスタンパ(imprinting stamper)を提供する段階と、
(b)絶縁層に前記インプリンティングスタンパを加圧して、前記凸状パターンに応ずる凹状パターンを形成する段階と、及び
(c)前記回路パターンデータを用いて前記凹状パターンにインクジェット方式で導電性インクをプリンティングして回路パターンを形成する段階と、
を含む印刷回路基板の製造方法。 - 前記段階(a)は、
(d)前記回路パターンデータに応ずるマスタパターンが凹状で形成されたマスタモールド(master mold)を製作する段階と、
(e)モールディング材が前記マスタパターンに充填されるように前記モールディング材を前記マスタモールドに積層させる段階と、及び
(f)前記モールディング材を前記マスタモールドから分離する段階と、
を含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。 - 前記段階(d)は、
(d1)マスクフィルムに前記回路パターンデータを印刷する段階と、及び
(d2)シリコンウェハまたはガラス基板に前記マスクフィルムを積層し、選択的にエッチングして前記マスタモールドを形成する段階と、
を含むことを特徴とする請求項2に記載の印刷回路基板の製造方法。 - 前記モールディング材は単量体(monomer)及びポリマー前駆体のうち、いずれか一つ以上を含み、
前記段階(e)は、
(e1)前記モールディング材を前記マスタモールドに塗布する段階と、
(e2)前記モールディング材に前記マスタパターンに応ずるパターンが凸状で形成されるように前記モールディング材を重合(polymerization)させる段階と、
を含むことを特徴とする請求項2に記載の印刷回路基板の製造方法。 - 前記モールディング材はポリマー(polymer)を含み、
前記段階(e)は、
(e3)前記モールディング材を前記マスタモールドに積層する段階と、
(e4)前記モールディング材を加熱して前記モールディング材に前記マスタパターンに応ずるパターンが凸状で形成されるように前記モールディング材を変形させる段階と、
を含むことを特徴とする請求項2に記載の印刷回路基板の製造方法。 - 前記段階(f)の以後に、前記インプリンティングスタンパの表面にメッキ層を形成する段階をさらに含むことを特徴とする請求項4または5に記載の印刷回路基板の製造方法。
- 前記メッキ層は、ニッケル(Ni)を含むことを特徴とする請求項6に記載の印刷回路基板の製造方法。
- 前記段階(e)は、
前記マスタパターンにメッキ層が充填されるように前記マスタモールドの表面をメッキする段階を含むことを特徴とする請求項2に記載の印刷回路基板の製造方法。 - 前記メッキ層は、ニッケル(Ni)を含むことを特徴とする請求項8に記載の印刷回路基板の製造方法。
- 前記段階(b)は、
(b1)基板に前記絶縁層を積層し、前記インプリンティングスタンパを加圧する段階と、及び
(b2)前記インプリンティングスタンパを離型(demold)する段階と、
を含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。 - 前記段階(b2)の以後に、前記絶縁層を熱処理して硬化させる段階をさらに含むことを特徴とする請求項10に記載の印刷回路基板の製造方法。
- 前記段階(c)は、前記導電性インクを焼成させる段階を含むことを特徴とする請求項1に記載の印刷回路基板の製造方法。
- 絶縁層と、
回路パターンの形成される位置に応じて前記絶縁層の一部が陥入されるように形成される凹状パターンと、
前記凹状パターン内に充填されて前記回路パターンを成す導電性インクと、
を含む印刷回路基板。 - 前記凹状パターンは、前記回路パターンに応ずる凸状パターンの形成されたインプリンティングスタンパを前記絶縁層に加圧して形成されることを特徴とする請求項13に記載の印刷回路基板。
- 前記導電性インクは、前記凹状パターンにインクジェット方式でプリンティングされることを特徴とする請求項13に記載の印刷回路基板。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060066946A KR100763837B1 (ko) | 2006-07-18 | 2006-07-18 | 인쇄회로기판 제조방법 |
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JP2008028368A true JP2008028368A (ja) | 2008-02-07 |
JP4486660B2 JP4486660B2 (ja) | 2010-06-23 |
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JP2007107915A Expired - Fee Related JP4486660B2 (ja) | 2006-07-18 | 2007-04-17 | 印刷回路基板の製造方法 |
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US (2) | US7653990B2 (ja) |
JP (1) | JP4486660B2 (ja) |
KR (1) | KR100763837B1 (ja) |
CN (1) | CN101111129B (ja) |
Cited By (7)
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JP2009272486A (ja) * | 2008-05-08 | 2009-11-19 | Nitto Denko Corp | 配線回路基板の製造方法 |
KR20120000803A (ko) * | 2010-06-28 | 2012-01-04 | 삼성전자주식회사 | 반도체 패키지 및 그 반도체 패키지 제조방법 |
JP2012084896A (ja) * | 2011-11-04 | 2012-04-26 | Shinko Electric Ind Co Ltd | 配線基板の製造方法及び半導体パッケージの製造方法 |
JP2014027200A (ja) * | 2012-07-30 | 2014-02-06 | Process Lab Micron Co Ltd | 紫外線硬化型導電性インクとその製造方法、及び回路製造方法 |
JP2014093351A (ja) * | 2012-11-01 | 2014-05-19 | Fujikura Ltd | プリント基板及びその製造方法 |
JP2015504547A (ja) * | 2011-12-23 | 2015-02-12 | コリア インスティチュート オブ インダストリアル テクノロジー | マルチタッチ用タッチスクリーンパネル及びその製造方法 |
JP2015088516A (ja) * | 2013-10-28 | 2015-05-07 | 東レエンジニアリング株式会社 | 配線基板の製造方法及びそれに使用されるインクジェット塗布装置 |
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Also Published As
Publication number | Publication date |
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US20090183903A1 (en) | 2009-07-23 |
US7653990B2 (en) | 2010-02-02 |
JP4486660B2 (ja) | 2010-06-23 |
CN101111129A (zh) | 2008-01-23 |
KR100763837B1 (ko) | 2007-10-05 |
US20080016686A1 (en) | 2008-01-24 |
CN101111129B (zh) | 2013-08-07 |
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