GB1196201A - A method of Printing Electrical Circuits onto Substrates - Google Patents

A method of Printing Electrical Circuits onto Substrates

Info

Publication number
GB1196201A
GB1196201A GB18049/68A GB1804968A GB1196201A GB 1196201 A GB1196201 A GB 1196201A GB 18049/68 A GB18049/68 A GB 18049/68A GB 1804968 A GB1804968 A GB 1804968A GB 1196201 A GB1196201 A GB 1196201A
Authority
GB
United Kingdom
Prior art keywords
resins
ethyl
ink
diethylene glycol
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18049/68A
Inventor
Hiroshi Miyamoto
Tsuyoshi Isojima
Osamu Minowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB1196201A publication Critical patent/GB1196201A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member

Abstract

1,196,201. Printing processes. TOKYO SHIBAURA ELECTRIC CO. Ltd. 17 April, 1968 [19 Sept., 1967; 30 Sept., 1967; 28 Oct., 1967], No. 18049/68. Heading B6C. A printed circuit is formed by inking an intaglio plate 1 with a particular ink, wiping the plate with a known blade device, pressing an elastic offset surface into contact with the inked plate and finally pressing the imaged offset surface against an insulating base on which the circuit is to be printed. The ink, which is in a pasty form of adequate viscosity, may comprise suitable conductive materials such as silver, copper, aluminium or carbon in a solution of synthetic resin or resins. Instead of conductive materials, dielectric materials such as barium titanate, strontium titanate or insulating materials such as aluminium oxide or silica may be used. Suitable synthetic resins include phenol resins, alkyd resins, melamine resins and silicon resin. Suitable solvents for the ink are ethylene, diethylene, propylene, dipropylene, hexylene and polyethylene glycols and diethylene glycol monomethyl, diethylene glycol mono-ethyl, diethylene glycol monobutyl, triethylene glycol mono-ethyl and tripropylene glycol monomethyl ethers and ethyl cellosolve and n-butyl cellosolve.
GB18049/68A 1967-09-19 1968-04-17 A method of Printing Electrical Circuits onto Substrates Expired GB1196201A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5961467 1967-09-19
JP6275167 1967-09-30
JP6901167 1967-10-28

Publications (1)

Publication Number Publication Date
GB1196201A true GB1196201A (en) 1970-06-24

Family

ID=27296941

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18049/68A Expired GB1196201A (en) 1967-09-19 1968-04-17 A method of Printing Electrical Circuits onto Substrates

Country Status (5)

Country Link
US (1) US3701317A (en)
DE (1) DE1771551B1 (en)
FR (1) FR1566978A (en)
GB (1) GB1196201A (en)
NL (1) NL6806779A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177262A (en) * 1985-06-28 1987-01-14 Gen Electric Co Plc Making printed circuits

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US4060031A (en) * 1969-08-02 1977-11-29 Wilfried Philipp Printing method and apparatus for performing the printing method
US3992212A (en) * 1972-08-18 1976-11-16 Universal Oil Products Company Electrical resistor inks
US4143179A (en) * 1974-12-16 1979-03-06 Fuji Polymer Industries, Co., Ltd. Method of manufacturing a keyboard
US4019436A (en) * 1976-06-16 1977-04-26 Martin Handweiler Technique for producing a pre-distorted design format for use in transfer printing
US4209551A (en) * 1977-12-28 1980-06-24 Toppan Printing Co., Ltd. Method of fabricating a phosphor screen of a color television picture tube
US4240344A (en) * 1979-09-06 1980-12-23 Equipment Technology Incorporated High speed unit printer and inker therefor
US4479432A (en) * 1980-05-15 1984-10-30 Toppan Printing Co., Ltd. Thick film printing method
CA1173295A (en) * 1981-07-31 1984-08-28 Reinhold Chmielnik Printing process
DE3145585A1 (en) * 1981-11-17 1983-05-26 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE AREAS
DE3145584C2 (en) * 1981-11-17 1984-03-08 Robert Bosch Gmbh, 7000 Stuttgart Method for through-hole plating a printed circuit board
DE3207585C2 (en) * 1982-03-03 1984-03-08 Robert Bosch Gmbh, 7000 Stuttgart Process for making electrical connections between the two surfaces of a printed circuit board
DE3305687A1 (en) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Method for producing complex micro-circuit boards, micro-circuit substrates and micro-circuits, and substrates and micro-circuits produced according to the method
US4508755A (en) * 1983-03-30 1985-04-02 Northern Telecom Limited Method of applying a layer of conductive ink
IL72112A (en) * 1983-06-24 1990-04-29 Amoco Corp Printed circuits
DE3432909A1 (en) * 1984-09-07 1986-03-20 Brown, Boveri & Cie Ag, 6800 Mannheim Printing on surfaces
US5054390A (en) * 1985-04-05 1991-10-08 British Ceramic Research Association Ltd. Off-set printing by silk screening an intermediate surface and transferring the image to an article by an off-set pad
FR2628592B1 (en) * 1988-03-11 1990-11-09 Thomson Csf METHOD FOR PRODUCING CIRCUITS PRINTED ON A THREE-DIMENSIONAL MEDIUM, AND MEDIUM THUS EQUIPPED
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
JPH02117193A (en) * 1988-09-30 1990-05-01 Molex Inc Manufacture of base body for printed wiring by pad printing
US4896598A (en) * 1989-02-27 1990-01-30 Automated Industrial Systems Pad printing process using thixotropic ink
US5151386A (en) * 1990-08-01 1992-09-29 Mobil Solar Energy Corporation Method of applying metallized contacts to a solar cell
US5066360A (en) * 1990-09-24 1991-11-19 International Business Machines Corp. Pad printing of resist over via holes
US5228858A (en) * 1992-04-23 1993-07-20 Fromm Wayne G Children's pad printing kit
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
US5334411A (en) * 1993-01-11 1994-08-02 E. I. Du Pont De Nemours And Company Multilayer ceramic capacitor manufacturing process
US5609704A (en) 1993-09-21 1997-03-11 Matsushita Electric Industrial Co., Ltd. Method for fabricating an electronic part by intaglio printing
GB9400259D0 (en) * 1994-01-07 1994-03-02 Pilkington Plc Substrate for a magnetic disc and manufacture thereof
US5452658A (en) * 1994-07-20 1995-09-26 Diversified Decorating Sales, Inc. Pad transfer printing pads for use with contact lenses
WO1997034768A1 (en) * 1996-03-18 1997-09-25 Microprint Lc Gmbh Printing tampon
US5832835A (en) * 1996-07-12 1998-11-10 Markem Corporation Soft doctoring cup
US5966157A (en) * 1996-11-18 1999-10-12 Pitney Bowes Inc. Method for cleaning residual ink from a transfer roller in an ink jet printing apparatus
US5979310A (en) * 1996-11-18 1999-11-09 Pitney Bowes Inc. Apparatus and method for printing images
US5862753A (en) * 1996-11-18 1999-01-26 Pitney Bowes, Inc. Ink jet printing apparatus with handheld applicator
US5899615A (en) * 1996-12-16 1999-05-04 Pitney Bowes Inc. Apparatus and method for two-sided printing
US5837609A (en) * 1997-01-16 1998-11-17 Ford Motor Company Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part
JP3173410B2 (en) * 1997-03-14 2001-06-04 松下電器産業株式会社 Package substrate and method of manufacturing the same
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
US6339385B1 (en) * 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
SE9703410D0 (en) * 1997-09-22 1997-09-22 Ericsson Telefon Ab L M Ways to transfer an image to irregular surfaces
US20030146019A1 (en) * 2001-11-22 2003-08-07 Hiroyuki Hirai Board and ink used for forming conductive pattern, and method using thereof
US7569153B2 (en) * 2002-05-23 2009-08-04 Lg Display Co., Ltd. Fabrication method of liquid crystal display device
US20040003734A1 (en) * 2002-07-02 2004-01-08 Shively J. Thomas Method and apparatus for printing using an electrically conductive ink
DE102004056492B3 (en) * 2004-11-23 2006-08-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metal contained thermoplastic paste structured application method for thick film technologies, involves exhibiting one of temperatures by substrate, at which paste is transferred from medium to substrate and paste remains stable
JP2006319280A (en) * 2005-05-16 2006-11-24 Fujifilm Holdings Corp Wiring board and manufacturing method thereof
KR100763837B1 (en) * 2006-07-18 2007-10-05 삼성전기주식회사 Manufacturing method of printed circuit board
US20080105145A1 (en) * 2006-11-06 2008-05-08 Christopher Schaafsma Composite printing pad
US7870823B1 (en) * 2008-08-11 2011-01-18 Robert Cameron Multilayer print pad
EP2230890A1 (en) * 2009-03-20 2010-09-22 Laird Technologies AB Method for providing a conductive material structure on a carrier
CA2856380C (en) * 2011-11-22 2020-05-12 Siemens Healthcare Diagnostics Inc. Interdigitated array and method of manufacture
KR20180120241A (en) * 2016-04-28 2018-11-05 가부시키가이샤 슈호 Printing blanket, process for producing printing blanket and printing process using printing blanket
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate

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DE130685C (en) *
US3305814A (en) * 1967-02-21 Hybrid solid state device
US1657237A (en) * 1926-11-18 1928-01-24 Western Clock Co Printing luminous dials
US2518607A (en) * 1946-01-16 1950-08-15 Erickson Donald Robert Printing ink and method of printing
US2437908A (en) * 1946-05-22 1948-03-16 Fred K H Levey Co Inc Printing inks
US2748696A (en) * 1951-06-13 1956-06-05 Murray Lilian Printing or decoration of ceramic or other ware
GB736312A (en) * 1951-08-04 1955-09-07 Guy Leslie Murray Means for printing or decorating ceramic ware
GB837481A (en) * 1955-10-21 1960-06-15 British United Shoe Machinery Improvements in or relating to printing
US3074801A (en) * 1959-03-23 1963-01-22 Interchem Corp Metallic inks and pigment for use therein
US3093071A (en) * 1961-08-01 1963-06-11 Continental Can Co Gravure printing surface
BE679454A (en) * 1965-04-26 1966-09-16
US3436234A (en) * 1965-04-29 1969-04-01 Xerox Corp Duplicating ink
US3380835A (en) * 1965-06-29 1968-04-30 Du Pont Metalizing compositions
US3537892A (en) * 1966-11-29 1970-11-03 Ibm Metallizing composition conductor and method
US3484654A (en) * 1967-03-24 1969-12-16 American Can Co High-speed printing of electronic components and articles produced thereby
US3497384A (en) * 1967-08-31 1970-02-24 Du Pont Process of metalizing ceramic substrates with noble metals
US3554836A (en) * 1968-07-19 1971-01-12 Minnesota Mining & Mfg Transfer process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177262A (en) * 1985-06-28 1987-01-14 Gen Electric Co Plc Making printed circuits

Also Published As

Publication number Publication date
DE1771551B1 (en) 1971-10-07
US3701317A (en) 1972-10-31
NL6806779A (en) 1969-03-21
FR1566978A (en) 1969-05-09

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PCNP Patent ceased through non-payment of renewal fee