JP2007537588A - 組込方法及びこの方法により製造されたアセンブリ - Google Patents
組込方法及びこの方法により製造されたアセンブリ Download PDFInfo
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Abstract
Description
前記第1のチップの表面にアンダーバンプメタライゼーションを有する複数のはんだ組成の接合パッドを与えるステップと、
メタライゼーションが存在し、表面に複数の接合パッドを有する第2のチップを与えるステップと、
前記第1のチップの少なくとも一部の接合パッドと前記第2のチップの対応する接合パッドとが互いに対向するように前記第1のチップ及び前記第2のチップを組み込むステップと、
加熱により前記第1のチップの接合パッドと及び前記第2のチップの接合パッドの間に電気的接続を形成するステップと、を備える。
本発明の方法はアンダーバンプメタライゼーションと第2のチップのメタライゼーションとの間に挟まれた極めて薄いはんだ層を用いる。安定した相互接続を与えるため、はんだ組成及び第2のチップのメタライゼーションは、金属間化合物が両者の接合部に形成されるように選ばれる。これは最終製品と製造途中の両方に良好な信頼性をもたらす。より大きい金バンプを用いると2つの隣接するバンプが拡がり、ついには合流するという問題が起こる。はんだが少量であるという本発明の方法における長所により、このリスクは大幅に低減される。
Claims (12)
- 第1のチップを第2のチップへ組み込む方法であって、
前記第1のチップの表面にアンダーバンプメタライゼーションを備える複数のはんだ組成の接合パッドを与えるステップと、
メタライゼーションがある複数の接合パッドを表面に備える前記第2のチップを与えるステップと、
前記第1のチップの接合パッドの少なくとも一部とそれに対応する前記第2のチップの接合パッドが互いに対向するように前記第1のチップ及び前記第2のチップを組み合わせるステップと、
加熱により前記第1及び第2のチップの接合パッド間に電気的相互接続部を形成するステップと、
を備え、
前記はんだ組成は前記アンダーバンプメタライゼーションに90°未満の接触角をなす流体層として与えられ、前記第2のチップのメタライゼーション及び前記はんだ組成の少なくとも1つの元素に基づいて金属間化合物が形成されることを特徴とする方法。 - 前記第2のチップのメタライゼーションは平らな表面を有することを特徴とする請求項1に記載の方法。
- 前記第1のチップは前記はんだ組成の上部に高さの大きいバンプをさらに備え、前記第1のチップは前記第2のチップを越えて側方に延びることを特徴とする請求項1に記載の方法。
- 前記はんだ組成の合金化元素はSn,In及びGeの中から選択され、前記第2のチップのメタライゼーションはAu,Cu,Ni,Pd,Pt及びCoの中から選択される元素を有することを特徴とする請求項1に記載の方法。
- 前記はんだ組成の合金化元素はSnであり、前記第2のチップのメタライゼーションはAu,Cu及びNiの中から選択される元素を有することを特徴とする請求項4に記載の方法。
- 前記第1のチップの接合パッドのアンダーバンプメタライゼーションはニッケルを有し、前記バンプは前記第1のチップを低融点Sn合金浴に浸漬することで与えられることを特徴とする請求項5に記載の方法。
- 前記第1のチップの接合パッドのアンダーバンプメタライゼーションは銅を有することを特徴とする請求項3又は5に記載の方法。
- 前記加熱ステップは熱接着ステップであり、前記第1のチップは50℃と200℃の間の温度まで加熱され、前記第2のチップは金属間化合物の形成に適した温度まで加熱されることを特徴とする請求項1に記載の方法。
- 第1のチップと第2のチップのアセンブリであって、両チップは半導体基板と保護層内の開口にて露出された接合パッドを有する表面とを備え、前記表面は互いに対向し、前記第1のチップの複数の接合パッドははんだ相互接続部を介して前記第2のチップの対応する接合パッドに電気的に接続され、
前記はんだ相互接続部は第1のアンダーバンプメタライゼーションと第2のメタライゼーションとの間に挟まれ、前記メタライゼーションより厚さが小さい層であり、前記層と前記第2のメタライゼーションとの接合部に金属間化合物が存在することを特徴とするアセンブリ。 - 前記はんだ相互接続部の長さは50μm未満であることを特徴とする請求項9に記載のアセンブリ。
- 前記金属間化合物はAuSn及びCuSnの中から選択されることを特徴とする請求項9に記載のアセンブリ。
- 前記第1のチップは前記第2のチップを越えて側方に延び、前記はんだ相互接続層の上にあるバンプを備えることを特徴とする請求項9に記載のアセンブリ。
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PCT/IB2005/051397 WO2005109503A2 (en) | 2004-05-06 | 2005-04-28 | A method of assembly and assembly thus made |
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