JP2007301416A - Treatment method for pcb waste and its treatment facility - Google Patents

Treatment method for pcb waste and its treatment facility Download PDF

Info

Publication number
JP2007301416A
JP2007301416A JP2006011493A JP2006011493A JP2007301416A JP 2007301416 A JP2007301416 A JP 2007301416A JP 2006011493 A JP2006011493 A JP 2006011493A JP 2006011493 A JP2006011493 A JP 2006011493A JP 2007301416 A JP2007301416 A JP 2007301416A
Authority
JP
Japan
Prior art keywords
pcb
container
plasma
waste
decomposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006011493A
Other languages
Japanese (ja)
Other versions
JP4733525B2 (en
Inventor
Masaki Oota
将樹 太田
Nobuyuki Mikata
信行 三方
Shigeyoshi Tagashira
成能 田頭
Akihiko Kiyohiro
明彦 浄弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Pantec Co Ltd
Nippon Steel Engineering Co Ltd
Original Assignee
Nippon Steel Engineering Co Ltd
Kobelco Eco Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Engineering Co Ltd, Kobelco Eco Solutions Co Ltd filed Critical Nippon Steel Engineering Co Ltd
Priority to JP2006011493A priority Critical patent/JP4733525B2/en
Publication of JP2007301416A publication Critical patent/JP2007301416A/en
Application granted granted Critical
Publication of JP4733525B2 publication Critical patent/JP4733525B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment method for a PCB waste capable of accomplishing volume-reduction and recycling of an object to be treated while accomplishing simplification of an apparatus for dismantling/sorting the PCB waste or miniaturization of a scale of a liquid treatment apparatus for treating PCB and safely treating the PCB, and to provide its treatment facility. <P>SOLUTION: The treatment method for PCB waste has a pre-treatment step for removing the PCB from a vessel of the PCB waste, taking out the content stored in the vessel and washing/treating the vessel by a solvent, a plasma treatment step for melting/treating the content by a plasma melting decomposition furnace 17 and decomposing/treating the PCB remained/deposited on the content, and a liquid treatment step for decomposing the PCB removed from the vessel in the pre-treatment step and the PCB recovered in the washing treatment of the vessel. The treatment facility for the PCB waste has a pre-treatment apparatus for performing the pre-treatment step, a plasma treatment apparatus 10 for performing the plasma treatment step, and a liquid treatment apparatus for performing the liquid treatment step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、ＰＣＢ廃棄物、特にＰＣＢ含有電気機器（例えば、トランス又はコンデンサ）を無害化処理して資源化することに適したＰＣＢ廃棄物の処理方法及びその処理設備に関する。 The present invention relates to a PCB waste processing method and processing equipment suitable for detoxifying PCB waste, in particular, PCB-containing electrical equipment (for example, a transformer or a capacitor) for recycling.

ＰＣＢ（ポリ塩化ビフェニル）は、化学的に極めて安定な不燃性の物質であり、耐熱性、熱的安定性、及び絶縁性に優れた特性を有するため、主として、トランス（変圧器）又はコンデンサ（蓄電器）のような電気機器の絶縁油、更には化学プロセスにおける熱媒として広く用いられてきた。
しかし、ＰＣＢは生体環境への影響があることが明らかになり、現在ではその使用が禁止されている。このため、従前から使用されてきたＰＣＢ廃棄物であるトランス又はコンデンサを無害化処理する必要があった。 PCB (polychlorinated biphenyl) is a non-flammable substance that is extremely stable chemically, and has excellent heat resistance, thermal stability, and insulating properties. Therefore, it is mainly used as a transformer (transformer) or a capacitor ( It has been widely used as an insulating oil for electric devices such as electric storage devices, and as a heat medium in chemical processes.
However, it has become clear that PCB has an impact on the living environment, and its use is now prohibited. For this reason, it has been necessary to detoxify a transformer or a capacitor, which is a PCB waste that has been used in the past.

そこで、このようなＰＣＢ廃棄物の処理方法として、例えば、特許文献１には、ＰＣＢ廃棄物からＰＣＢを抜油し、ＰＣＢ含浸性部材は真空加熱分離装置で処理し、またＰＣＢ非含浸性部材は溶剤洗浄装置で洗浄処理し、抜油したＰＣＢと、真空加熱分離装置及び溶剤洗浄装置で分離されたＰＣＢを、既存の液処理装置で処理する方法が開示されている。 Therefore, as such a method for treating PCB waste, for example, in Patent Document 1, PCB is deoiled from PCB waste, the PCB-impregnating member is processed by a vacuum heating separation apparatus, and the PCB non-impregnating member is A method is disclosed in which a PCB that has been cleaned by a solvent cleaning apparatus and deoiled, and a PCB that has been separated by a vacuum heating separation apparatus and a solvent cleaning apparatus are processed by an existing liquid processing apparatus.

特開２００３−１１７５１７号公報JP 2003-117517 A

しかしながら、上記したＰＣＢ廃棄物の処理方法では、未だ解決すべき以下のような問題があった。
液処理装置は、ＰＣＢ廃棄物から抜油したＰＣＢと、真空加熱分離装置及び溶剤洗浄装置で分離したＰＣＢとを処理しなければならず、処理するＰＣＢ廃棄物中の全ＰＣＢ量に対応した処理能力とする必要がある。
また、真空加熱分離装置に投入され処理された処理物は、分別が困難な金属類と可燃物の混合物であり、また例え金属分を分離したとしても、残りの残渣はそのまま産業廃棄物として埋立処分されることになり、広大な処分場の確保が必要になる。
そして、液処理装置での生成物（固形物及び処理剤油）は、真空加熱分離装置で処理できないため、例えばそのまま焼却又は埋立のような産廃処分がなされることになる。
更に、ＰＣＢ廃棄物を処理する際に発生する二次汚染物（例えば、廃活性炭、マスク、手袋、又はウエス）は、その無害化処理が行われるまで、封入容器（例えば、ドラム缶又はペール缶）に収納され保管されるが、真空加熱分離装置は、二次汚染物を封入容器と共に処理できない。このため、二次汚染物の処理の際、作業員が汚染物を封入容器から取り出し真空加熱分離装置に投入する必要があるので、その際にＰＣＢに暴露する恐れがある。 However, the above PCB waste processing method still has the following problems to be solved.
The liquid processing equipment must process the PCB drained from the PCB waste and the PCB separated by the vacuum heating separation device and the solvent cleaning device, and the processing capacity corresponding to the total amount of PCB in the PCB waste to be processed It is necessary to.
In addition, the processed material that has been put into the vacuum heating separation device and processed is a mixture of metals and combustible materials that are difficult to separate, and even if the metal components are separated, the remaining residue is landfilled as industrial waste as it is. It will be disposed of and it will be necessary to secure a vast disposal site.
And since the product (solid substance and processing agent oil) in a liquid processing apparatus cannot be processed with a vacuum heating separation apparatus, industrial waste disposal, such as incineration or landfill, will be made as it is.
In addition, secondary contaminants (eg, waste activated carbon, masks, gloves, or waste) generated when processing PCB waste are sealed until they are detoxified (eg, drums or pail cans). However, the vacuum heating separation apparatus cannot process the secondary contaminants together with the enclosing container. For this reason, when processing the secondary contaminants, it is necessary for an operator to take out the contaminants from the sealed container and put them into the vacuum heating separation apparatus, which may be exposed to the PCB.

本発明はかかる事情に鑑みてなされたもので、例えば、ＰＣＢ廃棄物を解体し分別する装置の簡素化、又はＰＣＢを処理する液処理装置の規模の極小化を果たしつつ、処理対象物の減容化及び資源化を図ることができ、しかもＰＣＢを安全に処理可能なＰＣＢ廃棄物の処理方法及びその処理設備を提供することを目的とする。 The present invention has been made in view of such circumstances. For example, while simplifying an apparatus for disassembling and separating PCB waste, or minimizing the scale of a liquid processing apparatus for processing PCB, the number of processing objects can be reduced. It is an object of the present invention to provide a PCB waste processing method and processing equipment that can increase the volume and resources, and can safely process PCBs.

前記目的に沿う第１の発明に係るＰＣＢ廃棄物の処理方法は、ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該容器を溶剤で洗浄処理する前処理工程と、
前記内容物をプラズマ溶融分解炉で溶融処理し、該内容物に残存付着したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記容器から抜油したＰＣＢと該容器の洗浄処理で回収したＰＣＢを分解する液処理工程とを有する。 The PCB waste processing method according to the first invention that meets the above-mentioned object is a pretreatment in which the PCB is deoiled from the PCB waste container, the contents stored in the container are taken out, and the container is washed with a solvent. Process,
A plasma treatment step of melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
In the pretreatment step, there is a PCB that has been deoiled from the container and a liquid treatment step that decomposes the PCB that has been recovered by the washing process of the container.

前記目的に沿う第２の発明に係るＰＣＢ廃棄物の処理方法は、ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離し、前記容器と前記非含浸物を溶剤で洗浄処理する前処理工程と、
前記含浸物をプラズマ溶融分解炉で溶融処理し、該含浸物に浸透したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記容器から抜油したＰＣＢと、該容器及び前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理工程とを有する。 The PCB waste processing method according to the second aspect of the present invention, wherein the PCB is deoiled from the PCB waste container, the contents stored in the container are taken out, and the impregnated material in which the PCB has permeated the contents And a non-impregnated material that remains adhered, and a pretreatment step of washing the container and the non-impregnated material with a solvent,
A plasma treatment step of melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
In the pretreatment step, there is a PCB that has been deoiled from the container, and a liquid treatment step that decomposes the PCB that has been recovered by the washing treatment of the container and the non-impregnated material.

前記目的に沿う第３の発明に係るＰＣＢ廃棄物の処理方法は、ＰＣＢ廃棄物であるコンデンサとトランスの各容器からＰＣＢを抜油し、該各容器に収納された内容物をそれぞれ取り出し、更に前記トランスの内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離して、前記コンデンサと前記トランスの各容器、及び前記トランスの前記非含浸物を、溶剤で洗浄処理する前処理工程と、
前記コンデンサの前記内容物と前記トランスの前記含浸物をプラズマ溶融分解炉で溶融処理し、前記コンデンサの前記内容物に残存付着したＰＣＢと前記含浸物に浸透したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記各容器から抜油したＰＣＢと、該各容器及び前記トランスの前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理工程とを有する。 According to a third aspect of the present invention, there is provided a method for treating PCB waste, wherein the PCB is drained from each container of a capacitor and a transformer, and the contents stored in the containers are respectively taken out. A pretreatment for separating the contents of the transformer into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue, and washing the capacitor, each transformer container, and the non-impregnated material in the transformer with a solvent. Process,
A plasma treatment step of melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB that remains on the contents of the capacitor and the PCB that has penetrated the impregnation; ,
The pre-treatment step includes a PCB that has been deoiled from each of the containers, and a liquid treatment step of decomposing the PCBs that have been collected by the washing treatment of the non-impregnated materials of the containers and the transformer.

第１〜第３の発明に係るＰＣＢ廃棄物の処理方法において、前記プラズマ処理工程で処理するものは、予め封入容器に入れられ、該封入容器と共に前記プラズマ溶融分解炉で処理されることが好ましい。
第１〜第３の発明に係るＰＣＢ廃棄物の処理方法において、前記ＰＣＢ廃棄物の処理の際に発生する二次汚染物を、前記プラズマ処理工程で処理することが好ましい。
第１〜第３の発明に係るＰＣＢ廃棄物の処理方法において、前記液処理工程でＰＣＢを無害化処理して生成する処理済み油及び固形物を、前記プラズマ処理工程で処理することが好ましい。
第１〜第３の発明に係るＰＣＢ廃棄物の処理方法において、前記液処理工程でＰＣＢを処理して生成する処理済み油を、前記プラズマ溶融分解炉の立上げ時の昇温用熱源、及び該プラズマ溶融分解炉の下流側に配置された恒温チャンバ内の温度保定用バーナ燃料のいずれか１又は２に使用し、前記液処理工程でＰＣＢを処理して生成する固形物を、前記プラズマ溶融分解炉の立上げ時の昇温用補助熱源として使用することが好ましい。 In the PCB waste processing method according to the first to third inventions, the material to be processed in the plasma processing step is preferably placed in a sealed container in advance and processed in the plasma melting decomposition furnace together with the sealed container. .
In the PCB waste processing methods according to the first to third aspects of the present invention, it is preferable that secondary contaminants generated during the processing of the PCB waste are processed in the plasma processing step.
In the method for treating PCB waste according to the first to third inventions, it is preferable that the treated oil and solids produced by detoxifying PCB in the liquid treatment step are treated in the plasma treatment step.
In the method for treating PCB waste according to the first to third inventions, treated oil produced by treating PCB in the liquid treatment step is used as a heat source for raising temperature when starting up the plasma melting cracking furnace, and The solid material generated by processing PCB in the liquid processing step is used for either 1 or 2 of temperature maintaining burner fuel in a constant temperature chamber disposed downstream of the plasma melting cracking furnace. It is preferably used as an auxiliary heat source for raising the temperature when the cracking furnace is started up.

前記目的に沿う第１の発明に係るＰＣＢ廃棄物の処理設備は、ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該容器を溶剤で洗浄処理する前処理装置と、
前記内容物をプラズマ溶融分解炉で溶融処理し、該内容物に残存付着したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記容器から抜油したＰＣＢと該容器の洗浄処理で回収したＰＣＢを分解する液処理装置とを有する。 The PCB waste treatment facility according to the first invention that meets the above object is a pretreatment in which PCB is deoiled from a PCB waste container, the contents stored in the container are taken out, and the container is washed with a solvent. Equipment,
A plasma processing apparatus for melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
The pretreatment device includes a PCB that has been deoiled from the container and a liquid treatment device that decomposes the PCB recovered by the washing process of the container.

前記目的に沿う第２の発明に係るＰＣＢ廃棄物の処理設備は、ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離し、前記容器と前記非含浸物を溶剤で洗浄処理する前処理装置と、
前記含浸物をプラズマ溶融分解炉で溶融処理し、該含浸物に浸透したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記容器から抜油したＰＣＢと、該容器及び前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理装置とを有する。 The PCB waste treatment facility according to the second aspect of the present invention, wherein the PCB waste is drained from the PCB waste container, the contents stored in the container are taken out, and the impregnated material into which the PCB has permeated. And a pretreatment device for cleaning the container and the non-impregnated material with a solvent.
A plasma processing apparatus for melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
The pretreatment device includes a PCB that has been deoiled from the container, and a liquid treatment device that decomposes the PCB collected by the washing treatment of the container and the non-impregnated material.

前記目的に沿う第３の発明に係るＰＣＢ廃棄物の処理設備は、ＰＣＢ廃棄物であるコンデンサとトランスの各容器からＰＣＢを抜油し、該各容器に収納された内容物をそれぞれ取り出し、更に前記トランスの内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離して、前記コンデンサと前記トランスの各容器、及び前記トランスの前記非含浸物を、溶剤で洗浄処理する前処理装置と、
前記コンデンサの前記内容物と前記トランスの前記含浸物をプラズマ溶融分解炉で溶融処理し、前記コンデンサの前記内容物に残存付着したＰＣＢと前記含浸物に浸透したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記各容器から抜油したＰＣＢと、該各容器及び前記トランスの前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理装置とを有する。 The PCB waste treatment facility according to the third invention in accordance with the above object is to drain the PCB from each capacitor and transformer container, which is PCB waste, to take out the contents stored in each container, A pretreatment for separating the contents of the transformer into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue, and washing the capacitor, each transformer container, and the non-impregnated material in the transformer with a solvent. Equipment,
A plasma processing apparatus for melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB remaining on the contents of the capacitor and the PCB permeating the impregnation; ,
The pretreatment device includes a PCB that has been deoiled from the containers, and a liquid treatment device that decomposes the PCBs recovered by the cleaning treatment of the non-impregnated materials of the containers and the transformer.

請求項１〜７記載のＰＣＢ廃棄物の処理方法、及び請求項８〜１０記載のＰＣＢ廃棄物の処理設備は、ＰＣＢ廃棄物の容器に収納された内容物の一部又は全部をプラズマ処理するので、従来のように、内容物からＰＣＢを分離することなく、ＰＣＢを分解処理できる。これにより、例えば、液処理工程へ送られるＰＣＢ量はプラズマ処理する分を削減でき、液処理工程で使用する装置の処理容量を極小化できる。
また、内容物の一部又は全部をプラズマ処理するので、この内容物中の灰分は溶融してスラグ化し、資源化又は埋立処分する際でも大幅な減容化を図ることができる。 The PCB waste processing method according to claim 1 and the PCB waste processing facility according to claims 8 to 10 perform plasma processing on a part or all of the contents stored in the PCB waste container. Therefore, the PCB can be decomposed without separating the PCB from the contents as in the prior art. Thereby, for example, the amount of PCB sent to the liquid processing step can be reduced by plasma processing, and the processing capacity of the apparatus used in the liquid processing step can be minimized.
Moreover, since a part or all of the contents are plasma-treated, the ash content in the contents is melted to form slag, so that a significant volume reduction can be achieved even when it is recycled or landfilled.

特に、請求項２、３及びこれらに従属する請求項４〜７記載のＰＣＢ廃棄物の処理方法、及び請求項９、１０記載のＰＣＢ廃棄物の処理設備は、ＰＣＢ廃棄物の容器に収納された内容物を細分化するので、例えば、鉄又は銅のような非含浸物を最大限資源化し、プラズマ処理する量を抑制すれば、スラグを埋立処分する場合、その量を極小化できる。
請求項４記載のＰＣＢ廃棄物の処理方法は、プラズマ処理工程で処理するものは、予め封入容器に入れられ、封入容器と共にプラズマ溶融分解炉で処理するので、従来のように、封入容器に入れたものを取り出して処理することなくそのまま処理でき、作業員のＰＣＢ暴露の極小化を図ることができる。 In particular, the PCB waste processing method according to claims 2 and 3 and claims 4 to 7 dependent thereon and the PCB waste processing facility according to claims 9 and 10 are accommodated in a PCB waste container. Therefore, if the amount of non-impregnated material such as iron or copper is maximized and the amount of plasma treatment is suppressed, the amount of slag can be minimized when landfilled.
In the method for treating PCB waste according to claim 4, since the material to be treated in the plasma treatment step is put in a sealed container in advance and processed in a plasma melting decomposition furnace together with the sealed container, it is put in the sealed container as in the conventional case. The waste can be processed as it is without being processed, and the worker's PCB exposure can be minimized.

請求項５記載のＰＣＢ廃棄物の処理方法は、二次汚染物もプラズマ処理工程で処理できるので、例えば、液処理工程へ送られるＰＣＢ量の増大を防止できる。
請求項６記載のＰＣＢ廃棄物の処理方法は、液処理工程で生成する処理済み油及び固形物をプラズマ処理工程で処理するので、産廃処分量の更なる極小化を図ることができる。
請求項７記載のＰＣＢ廃棄物の処理方法は、液処理工程で生成する処理済み油及び固形物を、プラズマ処理工程の熱源として有効利用できるので、産廃処分量の極小化を図ると共に、燃料費を低減することができる。 In the method for treating PCB waste according to claim 5, since secondary contaminants can also be treated in the plasma treatment process, for example, an increase in the amount of PCB sent to the liquid treatment process can be prevented.
Since the processing method of the PCB waste of Claim 6 processes the processed oil and solid which are produced | generated at a liquid processing process at a plasma processing process, the further industrial waste disposal amount can be further minimized.
In the method for treating PCB waste according to claim 7, since the treated oil and solids produced in the liquid treatment process can be effectively used as a heat source for the plasma treatment process, the amount of industrial waste disposal can be minimized and the fuel cost can be reduced. Can be reduced.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態につき説明し、本発明の理解に供する。
ここで、図１は本発明の一実施の形態に係るＰＣＢ廃棄物の処理方法の説明図、図２は同ＰＣＢ廃棄物の処理方法に使用するプラズマ処理装置の説明図、図３は変形例に係るＰＣＢ廃棄物の処理方法の説明図である。 Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
Here, FIG. 1 is an explanatory diagram of a PCB waste processing method according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a plasma processing apparatus used in the PCB waste processing method, and FIG. 3 is a modified example. It is explanatory drawing of the processing method of the PCB waste concerning.

図１に示すように、本発明の一実施の形態に係るＰＣＢ廃棄物の処理方法は、ＰＣＢ廃棄物の一例であるＰＣＢ含有電気機器（例えば、トランス、リアクトル、又はコンデンサ）の容器からＰＣＢを抜油し、この容器に収納された内容物（例えば、ＰＣＢ廃棄物がトランスの場合はそのコア、コンデンサの場合はその素子）を取り出し、容器を溶剤で洗浄処理する前処理工程と、内容物をプラズマ溶融分解炉１７で溶融処理し、ＰＣＢを分解処理するプラズマ処理工程と、前処理工程で、容器から抜油したＰＣＢと容器の洗浄処理で回収したＰＣＢを、それぞれ分解し無害化処理する液処理工程とを有する。なお、ＰＣＢ廃棄物の容器から抜油されるＰＣＢとは、ＰＣＢのみ、又はＰＣＢを含む油を意味する。
この前処理工程は前処理装置で、プラズマ処理工程はプラズマ処理装置１０で、液処理工程は液処理装置でそれぞれ行われる。なお、前処理装置、プラズマ処理装置１０、及び液処理装置が、ＰＣＢ廃棄物の処理設備を構成する。以下、詳しく説明する。 As shown in FIG. 1, a PCB waste processing method according to an embodiment of the present invention is a method of processing PCB from a container of PCB-containing electrical equipment (for example, a transformer, a reactor, or a capacitor) that is an example of PCB waste. Remove the oil and take out the contents stored in this container (for example, if the PCB waste is a transformer, its core, if it is a capacitor, its element), and clean the container with a solvent. A plasma processing step in which the PCB is melted in the plasma melting and decomposing furnace 17 and the PCB is decomposed, and in the pre-processing step, the PCB that has been deoiled from the container and the PCB that has been recovered by cleaning the container are decomposed and detoxified. Process. In addition, the PCB withdrawn from the PCB waste container means only PCB or oil containing PCB.
The pretreatment process is performed by a pretreatment apparatus, the plasma treatment process is performed by the plasma treatment apparatus 10, and the liquid treatment process is performed by the liquid treatment apparatus. The pretreatment device, the plasma treatment device 10, and the liquid treatment device constitute a PCB waste treatment facility. This will be described in detail below.

図１に示すように、ＰＣＢ含有電気機器であるトランス（又はリアクトル）を、例えば、運搬車両を使用してＰＣＢ処理場へ搬入し、一時的に保管した後、前処理装置へ払い出す。以下、前処理装置で行う前処理工程について説明する。
トランスの容器を例えば穿孔し、抜油管にて真空吸引で抜油する。このように、容器内のＰＣＢを抜油した後、例えば抜油管を使用して容器内に洗浄溶剤を流し込み、粗洗浄を行う。そして、容器の上蓋を取り外し、容器内に収納されたトランスのコア（内容物の一例）を取り出して、容器とコアとを分離する。この容器は、洗浄溶剤により、更に洗浄処理される。
ここで、溶剤を使用して洗浄処理した容器は、その卒業判定（ＰＣＢ残存濃度が基準値以下か否かの判定）後、合格であれば払い出される。しかし、卒業判定の結果が不合格の場合には、合格判定がなされるまで再洗浄を繰り返す。 As shown in FIG. 1, a transformer (or reactor), which is a PCB-containing electrical device, is carried into a PCB processing plant using, for example, a transport vehicle, temporarily stored, and then paid out to a preprocessing device. Hereinafter, the pretreatment process performed by the pretreatment apparatus will be described.
The transformer container is, for example, perforated and drained by vacuum suction through an oil draining tube. As described above, after the PCB in the container is drained, a cleaning solvent is poured into the container using, for example, an oil drain pipe to perform rough cleaning. And the upper cover of a container is removed, the core (an example of the contents) of the transformer accommodated in the container is taken out, and the container and the core are separated. This container is further cleaned with a cleaning solvent.
Here, the container cleaned with the solvent is dispensed if it passes after its graduation determination (determination of whether the PCB residual concentration is below the reference value). However, when the graduation determination result is unacceptable, the re-washing is repeated until the determination of acceptance is made.

また、ＰＣＢ含有電気機器であるコンデンサを前処理工程で処理する場合は、まず、コンデンサの容器を例えば穿孔し、容器内のＰＣＢを抜油する。そして、容器の上部を切断し、容器内に収納されたコンデンサの素子（内容物の一例）を取り出して、容器と素子とを分離する。分離された容器、蓋、及び素子は、それぞれ洗浄溶剤にて粗洗浄を行う。更に、容器と蓋は、洗浄溶剤にて精密洗浄される。一方、取り出された素子は、必要に応じて破砕又は裁断してもよい。 Moreover, when processing the capacitor | condenser which is a PCB containing electrical equipment at a pre-processing process, the container of a capacitor | condenser is first punctured and the PCB in a container is deoiled. And the upper part of a container is cut | disconnected, the element (an example of the content) of the capacitor | condenser accommodated in the container is taken out, and a container and an element are isolate | separated. The separated container, lid, and element are each roughly cleaned with a cleaning solvent. Furthermore, the container and the lid are precisely cleaned with a cleaning solvent. On the other hand, the extracted element may be crushed or cut as necessary.

次に、前処理工程で分離したトランスのコア（又は、コンデンサの素子）を、封入容器に投入してプラズマ処理装置１０へ送り、プラズマ処理を行う。以下、プラズマ処理装置１０について説明した後、これを使用するプラズマ処理工程について説明する。
図２に示すように、プラズマ処理装置１０は、プラズマ溶融分解手段１１、恒温チャンバ１２、減温塔１３、バグフィルタ１４、触媒反応塔１５、及び活性炭槽１６を有している。このプラズマ溶融分解手段１１は、プラズマ溶融分解炉（以下、単に溶融分解炉ともいう）１７と処理物投入室１８を有している。
処理物投入室１８は、処理物を封入した封入容器（例えば、ドラム缶又はペール缶）１９を溶融分解炉１７へ移送するため、溶融分解炉１７に隣接して設けられており、ＰＣＢ廃棄物の容器から取り出した内容物、又は二次汚染物のＰＣＢ汚染物を充填した状態の封入容器１９を、そのままの状態で投入する部屋である。 Next, the transformer core (or capacitor element) separated in the pretreatment step is put into a sealed container and sent to the plasma processing apparatus 10 to perform plasma processing. Hereinafter, after describing the plasma processing apparatus 10, a plasma processing process using the plasma processing apparatus 10 will be described.
As shown in FIG. 2, the plasma processing apparatus 10 includes a plasma melting and decomposing means 11, a constant temperature chamber 12, a temperature reducing tower 13, a bag filter 14, a catalytic reaction tower 15, and an activated carbon tank 16. This plasma melting and decomposing means 11 has a plasma melting and decomposing furnace (hereinafter also simply referred to as “melting and decomposing furnace”) 17 and a processed material input chamber 18.
The processed material input chamber 18 is provided adjacent to the melting / disassembling furnace 17 in order to transfer a sealed container (for example, a drum can or a pail can) 19 enclosing the processed object to the melting / disassembling furnace 17. This is a room in which the enclosed container 19 filled with the contents taken out from the container or the PCB contaminant of the secondary contaminant is charged as it is.

溶融分解炉１７は、プラズマアークを発生させるための炉であり、その溶融分解炉１７の天井部には、外部から炉内に装入されるプラズマトーチ２０が装着されている。このプラズマトーチ２０に連続的にガス（例えば、空気）を送り、これに電気的エネルギーを加えることで、非常に活性度が高く、中心温度が１万℃以上となるような高い温度のプラズマアークを発生させることができる。
また、溶融分解炉１７には、必要に応じて炉内を観察するためのカメラを設けることも可能であり、炉内のＰＣＢ汚染物の処理状況に応じて、プラズマトーチ２０を移動可能な構成にすることも可能である。
これによって、ＰＣＢ汚染物に効率的にプラズマアークを照射し、ＰＣＢ汚染物を処理できる。 The melting cracking furnace 17 is a furnace for generating a plasma arc, and a plasma torch 20 that is inserted into the furnace from the outside is mounted on the ceiling of the melting cracking furnace 17. A gas arc (for example, air) is continuously sent to the plasma torch 20 and electric energy is added to the plasma torch 20 so that the plasma arc has a high temperature and a center temperature of 10,000 ° C. or higher. Can be generated.
In addition, the melting cracking furnace 17 can be provided with a camera for observing the inside of the furnace as necessary, and the plasma torch 20 can be moved according to the processing state of PCB contaminants in the furnace. It is also possible to make it.
Thereby, the PCB contaminant can be efficiently irradiated with the plasma arc and the PCB contaminant can be treated.

使用に際しては、溶融分解炉１７の炉内温度が、例えば、約１４００℃程度に維持され、ＰＣＢはこの溶融分解炉１７で分解されることになる。
溶融分解炉１７の下部には、１個又は複数個のスラグ排出容器２１が設けられており、生成したスラグが、スラグ排出容器２１の中へ排出されるように構成されている。なお、符号３３、３４はそれぞれ、プッシャ、スラグ浴を表す。
恒温チャンバ１２は、プラズマ溶融分解手段１１の溶融分解炉１７からの排気が供給されるチャンバである。この恒温チャンバ１２内は、バーナ２２によって、例えば、約１２００℃程度に維持されており、恒温チャンバ１２内に供給されたガスを、例えば数秒間滞留させるように構成されている。そのため、万一ダイオキシン類が排気中に存在していても、恒温チャンバ１２により分解できる。
なお、ここでは、恒温チャンバ１２の熱源として、バーナ２２を例示したが、バーナの代わりにプラズマトーチを熱源として利用することも可能である。
減温塔１３は、恒温チャンバ１２から供給される排気を、例えば水又は空気により冷却するものであり、この冷却によって、ダイオキシン類が再合成することを防止できる。 In use, the in-furnace temperature of the melt cracking furnace 17 is maintained at about 1400 ° C., for example, and the PCB is decomposed in the melt cracking furnace 17.
One or a plurality of slag discharge containers 21 are provided in the lower part of the melting cracking furnace 17, and the generated slag is configured to be discharged into the slag discharge containers 21. Reference numerals 33 and 34 denote a pusher and a slag bath, respectively.
The constant temperature chamber 12 is a chamber to which exhaust gas from the melting cracking furnace 17 of the plasma melting cracking means 11 is supplied. The constant temperature chamber 12 is maintained at, for example, about 1200 ° C. by the burner 22, and the gas supplied into the constant temperature chamber 12 is configured to stay for several seconds, for example. Therefore, even if dioxins are present in the exhaust gas, they can be decomposed by the constant temperature chamber 12.
Here, the burner 22 is exemplified as the heat source of the constant temperature chamber 12, but a plasma torch may be used as a heat source instead of the burner.
The temperature-decreasing tower 13 cools the exhaust gas supplied from the thermostatic chamber 12 with, for example, water or air, and this cooling can prevent dioxins from being re-synthesized.

バグフィルタ１４は、排気中のダストを除去すると共に、その入口に粉末の活性炭を吹き込むことで、微量の有害有機物質を吸着し除去でき、また、消石灰も同様に吹き込むことで、排気中の例えばＨＣｌのような酸性成分を吸着させて除去できる。このように、バグフィルタ１４は、排気中のダストの除去のみならず、有害有機物質及び酸性成分を除去する機能も備えている。
触媒反応塔１５は、内部に触媒を備えており、排気中のダイオキシン類を分解すると共に、その入口にアンモニアガスを加えることで、ＮＯｘも分解できる。
活性炭槽１６は、その内部に活性炭が充填されたものであり、プラズマ処理装置１０の最終段階で、排気中に万一有害有機物質が残存していた場合、それを吸着するいわゆるセーフティネットとしての機能を有するものである。 The bag filter 14 removes dust in the exhaust, and blows powdered activated carbon into its inlet, thereby adsorbing and removing a trace amount of harmful organic substances. Acidic components such as HCl can be adsorbed and removed. Thus, the bag filter 14 has not only the removal of dust in the exhaust gas but also a function of removing harmful organic substances and acidic components.
The catalytic reaction tower 15 includes a catalyst inside, and decomposes dioxins in the exhaust gas, and can also decompose NOx by adding ammonia gas to the inlet thereof.
The activated carbon tank 16 is filled with activated carbon, and if a harmful organic substance remains in the exhaust gas at the final stage of the plasma processing apparatus 10, it is a so-called safety net that adsorbs it. It has a function.

また、バグフィルタ１４と触媒反応塔１５の間の流路２６には、第一誘引ファン２７が設けられており、活性炭槽１６の下流側の流路２８には、第二誘引ファン２９が設けられている。更に、第一誘引ファン２７と触媒反応塔１５との間の流路から、減温塔１３とバグフィルタ１４との間の流路には、排気ガスを返送して循環させる循環流路３０が設けられ、この循環流路３０に循環ファン３１が設けられている。
なお、ＰＣＢ廃棄物の処理方法に使用するプラズマ処理装置は、以上に示した装置構成に限定されるものではなく、プラズマ溶融分解炉を備えていれば、他の構成のプラズマ処理装置を使用することも勿論可能である。 A first induction fan 27 is provided in the flow path 26 between the bag filter 14 and the catalytic reaction tower 15, and a second induction fan 29 is provided in the flow path 28 on the downstream side of the activated carbon tank 16. It has been. Further, a circulation passage 30 for returning exhaust gas to circulate from the passage between the first induction fan 27 and the catalytic reaction tower 15 to the passage between the temperature reducing tower 13 and the bag filter 14 is provided. A circulation fan 31 is provided in the circulation channel 30.
Note that the plasma processing apparatus used in the PCB waste processing method is not limited to the above-described apparatus configuration, and a plasma processing apparatus having another configuration is used as long as a plasma melting decomposition furnace is provided. Of course it is also possible.

このプラズマ処理装置１０では、例えば、ウエス、汚泥、又は小型の電気機器（例えば、安定器）のようなＰＣＢ汚染物を処理してもよい。そして、ＰＣＢ廃棄物の処理の際に発生する二次汚染物、例えば、ＰＣＢが付着した廃活性炭、マスク、手袋、ウエス、布、紙、又は砂があれば、プラズマ処理工程で処理することが好ましい。これらの処理に際しては、ＰＣＢ汚染物を封入している封入容器ごとプラズマ処理装置１０で処理する。
また、このプラズマ処理装置１０で発生したスラグ及び飛灰は、前記した容器の場合と同様の方法により卒業判定が行われる。その結果、合格すれば、搬出されて資源化したり、又は廃棄物として適正に処分でき、また不合格であれば、再びプラズマ処理を行う。なお、卒業判定で合格と判定された飛灰は、更に薬剤処理を行って固化し、廃棄処理する。 The plasma processing apparatus 10 may process PCB contaminants such as waste, sludge, or small electrical equipment (eg, ballast). And, if there are secondary pollutants generated during the treatment of PCB waste, for example, waste activated carbon, mask, gloves, waste, cloth, paper, or sand with PCB attached, it can be treated in the plasma treatment process. preferable. In these processes, the entire sealed container in which PCB contaminants are sealed is processed by the plasma processing apparatus 10.
Moreover, graduation determination is performed for the slag and fly ash generated in the plasma processing apparatus 10 by the same method as in the case of the container described above. As a result, if it passes, it can be taken out and turned into resources, or can be properly disposed of as waste, and if it fails, plasma treatment is performed again. In addition, the fly ash determined to be acceptable in the graduation determination is further solidified by chemical treatment and discarded.

また、図１に示すように、前処理工程で、トランスの容器から抜油したＰＣＢと、この容器の洗浄処理で回収したＰＣＢは、それぞれ既存の液処理装置で処理される。以下、液処理装置で行う液処理工程について説明する。
回収されたＰＣＢを、処理容器内で撹拌しながら、常圧のもと温度を例えば１６０℃以上１７０℃以下程度に調整し、脱塩素剤を添加して脱塩素分解する。この処理液中のＰＣＢ濃度を測定し、ＰＣＢの分解が完了したことを確認した後、更に、処理槽内へ送る。そして、処理槽内で撹拌しながら、常圧のもと温度を例えば８０℃以上９０℃以下程度に調整し、例えばフィルタープレスにより固液分離を行う。 Further, as shown in FIG. 1, the PCB drained from the transformer container in the pretreatment step and the PCB recovered by the cleaning process of the container are each processed by an existing liquid processing apparatus. Hereinafter, the liquid treatment process performed by the liquid treatment apparatus will be described.
While the collected PCB is stirred in the processing container, the temperature is adjusted to, for example, 160 ° C. or more and about 170 ° C. or less under normal pressure, and a dechlorinating agent is added to dechlorinate and decompose. After measuring the PCB concentration in the processing liquid and confirming that the decomposition of the PCB is completed, the PCB is further sent into the processing tank. Then, while stirring in the treatment tank, the temperature is adjusted to, for example, about 80 ° C. to 90 ° C. under normal pressure, and solid-liquid separation is performed using, for example, a filter press.

このようにして回収した固形物である固形残渣と、液体である処理済み油は、前記した容器の場合と同様の方法により卒業判定が行われる。
その結果、合格すれば、ＰＣＢを無害化処理できたと判定し、固形残渣を産業廃棄物として処分し、また処理済み油をリサイクル品として資源化する。一方、不合格であれば、前記した方法と同様の方法で再度処理する。
なお、この液処理工程でＰＣＢを無害化処理して生成する処理済み油及び固形物は、プラズマ処理工程で処理してもよい。特に、生成した処理済み油を、プラズマ溶融分解炉１７の立上げ時の昇温用熱源、及びプラズマ溶融分解炉１７の下流側に配置された恒温チャンバ１２内の温度保定用バーナ２２の燃料のいずれか１又は２に使用し、また、生成した固形物を、プラズマ溶融分解炉１７の立上げ時の昇温用補助熱源として使用することもできる。 Graduation determination is performed for the solid residue, which is a solid substance collected in this manner, and the processed oil, which is a liquid, by the same method as that for the container described above.
As a result, if it passes, it is determined that the PCB can be rendered harmless, the solid residue is disposed as industrial waste, and the treated oil is recycled as a recycled product. On the other hand, if it fails, it processes again by the method similar to the above-mentioned method.
In addition, you may process the processed oil and solid which produce | generate by detoxifying PCB in this liquid processing process at a plasma processing process. In particular, the generated processed oil is used as a heat source for raising the temperature of the plasma melting cracking furnace 17 and the fuel for the temperature maintaining burner 22 in the constant temperature chamber 12 arranged downstream of the plasma melting cracking furnace 17. It can be used for either 1 or 2, and the generated solid can also be used as an auxiliary heat source for raising the temperature when the plasma melting cracking furnace 17 is started up.

なお、別の前処理装置を使用して、容器から取り出したトランスのコアを、更にＰＣＢが浸透した含浸物と残存付着した非含浸物とに解体し分別してもよい（図１の点線参照）。この場合、例えば、トランスのコアを構成するコイルの紙が含浸物となり、鉄心とコイルの銅が非含浸物となる。
そして、上記した非含浸物は、トランスの容器と共に洗浄溶剤で洗浄処理し、前記した卒業判定を行う。また、含浸物は、プラズマ処理装置１０へ送られ、前記したように、含浸物をプラズマ溶融分解炉１７で溶融処理し、この含浸物に浸透したＰＣＢを分解処理する。
この場合、非含浸物の洗浄処理で回収したＰＣＢは、容器から抜油したＰＣＢ、及び容器の洗浄処理で回収したＰＣＢと共に、液処理工程で分解し無害化処理する。 In addition, the transformer core taken out from the container may be further disassembled into an impregnated material infiltrated with PCB and a non-impregnated material adhering to the residue by using another pretreatment device (see the dotted line in FIG. 1). . In this case, for example, the paper of the coil constituting the core of the transformer becomes the impregnated material, and the iron core and the copper of the coil become the non-impregnated material.
The non-impregnated material described above is cleaned with a cleaning solvent together with the transformer container, and the above-described graduation determination is performed. Further, the impregnated product is sent to the plasma processing apparatus 10, and as described above, the impregnated product is melted in the plasma melting and decomposing furnace 17, and the PCB that has penetrated the impregnated product is decomposed.
In this case, the PCB recovered by the non-impregnated cleaning process is decomposed and detoxified in the liquid processing step together with the PCB drained from the container and the PCB recovered by the container cleaning process.

また、図３に示すように、別の前処理装置を使用し、前記した方法で、トランスとコンデンサの各容器からＰＣＢをそれぞれ抜油し、各容器内を粗洗浄した後、トランスとコンデンサをそれぞれ粗解体して、次のように処理してもよい。
コンデンサの容器から分離されたコンデンサの素子は、そのままプラズマ処理装置１０へ送られる。また、トランスの容器から分離されたトランスのコアは、更にＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離される。前記したように、含浸物はコアを構成するコイルの紙であり、非含浸物は鉄心とコイルの銅である。
非含浸物は、トランスとコンデンサの各容器と共に洗浄溶剤で洗浄処理し、前記した卒業判定を行う。また、含浸物は、プラズマ処理装置１０へ送られ、コンデンサの素子と共に、前記したように、含浸物と素子をプラズマ溶融分解炉１７で溶融処理し、この含浸物に浸透したＰＣＢと、素子に残存付着したＰＣＢを分解処理する。
なお、非含浸物の洗浄処理で回収したＰＣＢは、各容器から抜油したＰＣＢ、及び各容器の洗浄処理で回収したＰＣＢと共に、液処理工程で分解し無害化処理する。 Also, as shown in FIG. 3, using a different pretreatment device, the PCB was drained from each transformer and condenser container by the above-described method, and each container was roughly cleaned, and then the transformer and condenser were each removed. Rough disassembly may be performed as follows.
The capacitor element separated from the capacitor container is sent to the plasma processing apparatus 10 as it is. Further, the core of the transformer separated from the transformer container is further separated into an impregnated material into which PCB has permeated and a non-impregnated material adhering to the residue. As described above, the impregnated material is the paper of the coil constituting the core, and the non-impregnated material is the iron core and the copper of the coil.
The non-impregnated material is cleaned with a cleaning solvent together with the transformer and capacitor containers, and the above-described graduation determination is performed. Further, the impregnated material is sent to the plasma processing apparatus 10, and as described above, the impregnated material and the element are melt-processed in the plasma melting decomposition furnace 17 together with the capacitor element, and the PCB that has penetrated the impregnated material and the element Decompose the remaining PCB.
The PCB recovered by the non-impregnated cleaning process is decomposed and detoxified in the liquid processing step together with the PCB drained from each container and the PCB recovered by the cleaning process of each container.

以上、本発明を、実施の形態を参照して説明してきたが、本発明は何ら上記した実施の形態に記載の構成に限定されるものではなく、特許請求の範囲に記載されている事項の範囲内で考えられるその他の実施の形態や変形例も含むものである。例えば、前記したそれぞれの実施の形態や変形例の一部又は全部を組合せて本発明のＰＣＢ廃棄物の処理方法及びその処理設備を構成する場合も本発明の権利範囲に含まれる。 As described above, the present invention has been described with reference to the embodiment. However, the present invention is not limited to the configuration described in the above embodiment, and the matters described in the scope of claims. Other embodiments and modifications conceivable within the scope are also included. For example, the case where the PCB waste processing method and the processing equipment of the present invention are configured by combining a part or all of the above-described embodiments and modifications is also included in the scope of the present invention.

本発明の一実施の形態に係るＰＣＢ廃棄物の処理方法の説明図である。It is explanatory drawing of the processing method of the PCB waste which concerns on one embodiment of this invention. 同ＰＣＢ廃棄物の処理方法に使用するプラズマ処理装置の説明図である。It is explanatory drawing of the plasma processing apparatus used for the processing method of the same PCB waste. 変形例に係るＰＣＢ廃棄物の処理方法の説明図である。It is explanatory drawing of the processing method of the PCB waste which concerns on a modification.

符号の説明Explanation of symbols

１０：プラズマ処理装置、１１：プラズマ溶融分解手段、１２：恒温チャンバ、１３：減温塔、１４：バグフィルタ、１５：触媒反応塔、１６：活性炭槽、１７：プラズマ溶融分解炉、１８：処理物投入室、１９：封入容器、２０：プラズマトーチ、２１：スラグ排出容器、２２：バーナ、２６：流路、２７：第一誘引ファン、２８：流路、２９：第二誘引ファン、３０：循環流路、３１：循環ファン、３３：プッシャ、３４：スラグ浴 10: Plasma processing apparatus, 11: Plasma melting and decomposing means, 12: Constant temperature chamber, 13: Temperature reducing tower, 14: Bag filter, 15: Catalytic reaction tower, 16: Activated carbon tank, 17: Plasma melting decomposition furnace, 18: Processing Material input chamber, 19: sealed container, 20: plasma torch, 21: slag discharge container, 22: burner, 26: flow path, 27: first induction fan, 28: flow path, 29: second induction fan, 30: Circulation flow path, 31: Circulation fan, 33: Pusher, 34: Slag bath

Claims (10)

ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該容器を溶剤で洗浄処理する前処理工程と、
前記内容物をプラズマ溶融分解炉で溶融処理し、該内容物に残存付着したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記容器から抜油したＰＣＢと該容器の洗浄処理で回収したＰＣＢを分解する液処理工程とを有することを特徴とするＰＣＢ廃棄物の処理方法。 A pre-treatment step of draining the PCB from the PCB waste container, taking out the contents stored in the container, and washing the container with a solvent;
A plasma treatment step of melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
A PCB waste treatment method comprising: a PCB drained from the container in the pretreatment step; and a liquid treatment step for decomposing the PCB recovered by the washing treatment of the container. ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離し、前記容器と前記非含浸物を溶剤で洗浄処理する前処理工程と、
前記含浸物をプラズマ溶融分解炉で溶融処理し、該含浸物に浸透したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記容器から抜油したＰＣＢと、該容器及び前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理工程とを有することを特徴とするＰＣＢ廃棄物の処理方法。 PCB is drained from the PCB waste container, the contents stored in the container are taken out, the contents are separated into the impregnated material infiltrated with PCB and the non-impregnated material remaining on the PCB, and the container and the non-impregnated material are separated. A pre-treatment step of washing the product with a solvent;
A plasma treatment step of melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
A method for treating PCB waste, comprising: removing the PCB from the container in the pretreatment step; and a liquid treatment step for decomposing the PCB collected by the washing treatment of the container and the non-impregnated material. ＰＣＢ廃棄物であるコンデンサとトランスの各容器からＰＣＢを抜油し、該各容器に収納された内容物をそれぞれ取り出し、更に前記トランスの内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離して、前記コンデンサと前記トランスの各容器、及び前記トランスの前記非含浸物を、溶剤で洗浄処理する前処理工程と、
前記コンデンサの前記内容物と前記トランスの前記含浸物をプラズマ溶融分解炉で溶融処理し、前記コンデンサの前記内容物に残存付着したＰＣＢと前記含浸物に浸透したＰＣＢを分解処理するプラズマ処理工程と、
前記前処理工程で、前記各容器から抜油したＰＣＢと、該各容器及び前記トランスの前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理工程とを有することを特徴とするＰＣＢ廃棄物の処理方法。 The PCB is drained from each container of the capacitor and the transformer, and the contents stored in the containers are respectively taken out. Further, the contents of the transformer are impregnated with the PCB and the non-impregnated substance which remains adhered to the transformer. And a pretreatment step of washing the capacitor and each container of the transformer and the non-impregnated product of the transformer with a solvent,
A plasma treatment step of melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB that remains on the contents of the capacitor and the PCB that has penetrated the impregnation; ,
PCB disposal characterized by comprising: a PCB drained from each container in the pre-treatment step; and a liquid treatment step for decomposing the PCB collected by the washing treatment of the non-impregnated material of each container and the transformer. How to handle things. 請求項１〜３のいずれか１項に記載のＰＣＢ廃棄物の処理方法において、前記プラズマ処理工程で処理するものは、予め封入容器に入れられ、該封入容器と共に前記プラズマ溶融分解炉で処理されることを特徴とするＰＣＢ廃棄物の処理方法。 The method for treating PCB waste according to any one of claims 1 to 3, wherein the material to be treated in the plasma treatment step is previously placed in a sealed container and processed in the plasma melting and decomposition furnace together with the sealed container. A method for treating PCB waste. 請求項１〜４のいずれか１項に記載のＰＣＢ廃棄物の処理方法において、前記ＰＣＢ廃棄物の処理の際に発生する二次汚染物を、前記プラズマ処理工程で処理することを特徴とするＰＣＢ廃棄物の処理方法。 The method for treating PCB waste according to any one of claims 1 to 4, wherein secondary contaminants generated during the treatment of the PCB waste are treated in the plasma treatment step. PCB waste disposal method. 請求項１〜５のいずれか１項に記載のＰＣＢ廃棄物の処理方法において、前記液処理工程でＰＣＢを無害化処理して生成する処理済み油及び固形物を、前記プラズマ処理工程で処理することを特徴とするＰＣＢ廃棄物の処理方法。 The method for treating PCB waste according to any one of claims 1 to 5, wherein treated oil and solids produced by detoxifying PCB in the liquid treatment step are treated in the plasma treatment step. A method for treating PCB waste. 請求項１〜５のいずれか１項に記載のＰＣＢ廃棄物の処理方法において、前記液処理工程でＰＣＢを処理して生成する処理済み油を、前記プラズマ溶融分解炉の立上げ時の昇温用熱源、及び該プラズマ溶融分解炉の下流側に配置された恒温チャンバ内の温度保定用バーナ燃料のいずれか１又は２に使用し、前記液処理工程でＰＣＢを処理して生成する固形物を、前記プラズマ溶融分解炉の立上げ時の昇温用補助熱源として使用することを特徴とするＰＣＢ廃棄物の処理方法。 The method for treating PCB waste according to any one of claims 1 to 5, wherein the treated oil produced by treating the PCB in the liquid treatment step is heated when the plasma melting cracking furnace is started up. Used for either 1 or 2 of a heat source for heating and a temperature maintaining burner fuel in a constant temperature chamber disposed on the downstream side of the plasma melting and cracking furnace, and a solid material generated by processing PCB in the liquid processing step A method for treating PCB waste, which is used as an auxiliary heat source for raising temperature when starting up the plasma melting cracking furnace. ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該容器を溶剤で洗浄処理する前処理装置と、
前記内容物をプラズマ溶融分解炉で溶融処理し、該内容物に残存付着したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記容器から抜油したＰＣＢと該容器の洗浄処理で回収したＰＣＢを分解する液処理装置とを有することを特徴とするＰＣＢ廃棄物の処理設備。 A pretreatment device that drains PCB from a container of PCB waste, takes out the contents stored in the container, and cleans the container with a solvent;
A plasma processing apparatus for melting the content in a plasma melting and decomposing furnace and decomposing the PCB remaining on the content;
A PCB waste treatment facility comprising: a PCB drained from the container by the pretreatment device; and a liquid treatment device for decomposing the PCB recovered by the washing treatment of the container. ＰＣＢ廃棄物の容器からＰＣＢを抜油し、該容器に収納された内容物を取り出し、該内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離し、前記容器と前記非含浸物を溶剤で洗浄処理する前処理装置と、
前記含浸物をプラズマ溶融分解炉で溶融処理し、該含浸物に浸透したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記容器から抜油したＰＣＢと、該容器及び前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理装置とを有することを特徴とするＰＣＢ廃棄物の処理設備。 PCB is drained from the PCB waste container, the contents stored in the container are taken out, the contents are separated into the impregnated material infiltrated with PCB and the non-impregnated material remaining on the PCB, and the container and the non-impregnated material are separated. A pre-treatment device for washing an object with a solvent;
A plasma processing apparatus for melting the impregnated material in a plasma melting and decomposing furnace and decomposing the PCB that has penetrated the impregnated material;
A PCB waste treatment facility, comprising: a PCB drained from the container by the pretreatment device; and a liquid treatment device for decomposing the PCB recovered by the washing treatment of the container and the non-impregnated material. ＰＣＢ廃棄物であるコンデンサとトランスの各容器からＰＣＢを抜油し、該各容器に収納された内容物をそれぞれ取り出し、更に前記トランスの内容物をＰＣＢが浸透した含浸物と残存付着した非含浸物とに分離して、前記コンデンサと前記トランスの各容器、及び前記トランスの前記非含浸物を、溶剤で洗浄処理する前処理装置と、
前記コンデンサの前記内容物と前記トランスの前記含浸物をプラズマ溶融分解炉で溶融処理し、前記コンデンサの前記内容物に残存付着したＰＣＢと前記含浸物に浸透したＰＣＢを分解処理するプラズマ処理装置と、
前記前処理装置で、前記各容器から抜油したＰＣＢと、該各容器及び前記トランスの前記非含浸物の洗浄処理で回収したＰＣＢを、分解する液処理装置とを有することを特徴とするＰＣＢ廃棄物の処理設備。 The PCB is drained from each container of the capacitor and the transformer, and the contents stored in the containers are respectively taken out. Further, the contents of the transformer are impregnated with the PCB and the non-impregnated substance which remains adhered to the transformer. And a pre-processing device for washing the capacitor and each transformer container, and the non-impregnated product of the transformer with a solvent,
A plasma processing apparatus for melting the contents of the capacitor and the impregnation of the transformer in a plasma melting and decomposing furnace, and decomposing the PCB remaining on the contents of the capacitor and the PCB permeating the impregnation; ,
A PCB disposal comprising: a PCB drained from each container in the pretreatment device; and a liquid treatment device for decomposing the PCB collected by the washing treatment of the non-impregnated material in each container and the transformer. Material processing equipment.
JP2006011493A 2006-01-19 2006-01-19 PCB waste disposal method Active JP4733525B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006011493A JP4733525B2 (en) 2006-01-19 2006-01-19 PCB waste disposal method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006011493A JP4733525B2 (en) 2006-01-19 2006-01-19 PCB waste disposal method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011052080A Division JP2011143406A (en) 2011-03-09 2011-03-09 Method for treating pcb waste

Publications (2)

Publication Number Publication Date
JP2007301416A true JP2007301416A (en) 2007-11-22
JP4733525B2 JP4733525B2 (en) 2011-07-27

Family

ID=38835822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006011493A Active JP4733525B2 (en) 2006-01-19 2006-01-19 PCB waste disposal method

Country Status (1)

Country Link
JP (1) JP4733525B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010149080A (en) * 2008-12-26 2010-07-08 Kubota Matsushitadenko Exterior Works Ltd Detoxification treatment method of asbestos
JP2010179239A (en) * 2009-02-05 2010-08-19 Nippon Steel Engineering Co Ltd Pretreatment method and pretreatment equipment in plasma melting decomposition treatment of material to be treated
JP2017006850A (en) * 2015-06-19 2017-01-12 株式会社神鋼環境ソリューション Pcb treatment method
JP2017164745A (en) * 2017-05-16 2017-09-21 株式会社神鋼環境ソリューション Stabilizer refilling method

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299228A (en) * 1999-04-12 2000-10-24 Mitsubishi Heavy Ind Ltd Method and apparatus for removing pcb from pcb-adhered equipment
JP2001246014A (en) * 2000-03-03 2001-09-11 Kansai Tech Corp Method and device for detoxifying pole transformer for distribution
JP2002248455A (en) * 2000-11-27 2002-09-03 Mitsubishi Heavy Ind Ltd Harmful substance treating system and pcb treating method
JP2003053305A (en) * 2001-08-21 2003-02-25 Mitsubishi Heavy Ind Ltd Method and apparatus for treating pcb oil containing vessel
JP2003117517A (en) * 2001-10-11 2003-04-22 Nippon Steel Corp Method for treating material polluted with pcb
JP2004154666A (en) * 2002-11-06 2004-06-03 Kangen Yoyu Gijutsu Kenkyusho:Kk Treatment method of waste product
JP2005058868A (en) * 2003-08-08 2005-03-10 Japan Organo Co Ltd Detoxifying treatment system and method
JP2005220421A (en) * 2004-02-06 2005-08-18 Kobelco Eco-Solutions Co Ltd Alkali metal dispersion, and method for decomposing persistent halogen compound by using the dispersion
JP2005262196A (en) * 2004-03-19 2005-09-29 Kobelco Eco-Solutions Co Ltd Method and apparatus for treating contaminated matter contaminated with polychlorinated biphenyl
JP2005262099A (en) * 2004-03-18 2005-09-29 Nippon Steel Corp Treating method for making organic contaminated waste material harmless and treating apparatus
JP2005324176A (en) * 2004-05-12 2005-11-24 Katsuhiro Ito Method and apparatus for melting/decomposing pcb-containing waste at ultra-high temperature
JP2006021165A (en) * 2004-07-09 2006-01-26 Kobelco Eco-Solutions Co Ltd Treatment method of car-loaded transformer

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299228A (en) * 1999-04-12 2000-10-24 Mitsubishi Heavy Ind Ltd Method and apparatus for removing pcb from pcb-adhered equipment
JP2001246014A (en) * 2000-03-03 2001-09-11 Kansai Tech Corp Method and device for detoxifying pole transformer for distribution
JP2002248455A (en) * 2000-11-27 2002-09-03 Mitsubishi Heavy Ind Ltd Harmful substance treating system and pcb treating method
JP2003053305A (en) * 2001-08-21 2003-02-25 Mitsubishi Heavy Ind Ltd Method and apparatus for treating pcb oil containing vessel
JP2003117517A (en) * 2001-10-11 2003-04-22 Nippon Steel Corp Method for treating material polluted with pcb
JP2004154666A (en) * 2002-11-06 2004-06-03 Kangen Yoyu Gijutsu Kenkyusho:Kk Treatment method of waste product
JP2005058868A (en) * 2003-08-08 2005-03-10 Japan Organo Co Ltd Detoxifying treatment system and method
JP2005220421A (en) * 2004-02-06 2005-08-18 Kobelco Eco-Solutions Co Ltd Alkali metal dispersion, and method for decomposing persistent halogen compound by using the dispersion
JP2005262099A (en) * 2004-03-18 2005-09-29 Nippon Steel Corp Treating method for making organic contaminated waste material harmless and treating apparatus
JP2005262196A (en) * 2004-03-19 2005-09-29 Kobelco Eco-Solutions Co Ltd Method and apparatus for treating contaminated matter contaminated with polychlorinated biphenyl
JP2005324176A (en) * 2004-05-12 2005-11-24 Katsuhiro Ito Method and apparatus for melting/decomposing pcb-containing waste at ultra-high temperature
JP2006021165A (en) * 2004-07-09 2006-01-26 Kobelco Eco-Solutions Co Ltd Treatment method of car-loaded transformer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010149080A (en) * 2008-12-26 2010-07-08 Kubota Matsushitadenko Exterior Works Ltd Detoxification treatment method of asbestos
JP2010179239A (en) * 2009-02-05 2010-08-19 Nippon Steel Engineering Co Ltd Pretreatment method and pretreatment equipment in plasma melting decomposition treatment of material to be treated
JP2017006850A (en) * 2015-06-19 2017-01-12 株式会社神鋼環境ソリューション Pcb treatment method
JP2017164745A (en) * 2017-05-16 2017-09-21 株式会社神鋼環境ソリューション Stabilizer refilling method

Also Published As

Publication number Publication date
JP4733525B2 (en) 2011-07-27

Similar Documents

Publication Publication Date Title
JP4733525B2 (en) PCB waste disposal method
JP2012106182A (en) Method for treating pcb inclusion
JP2010137156A (en) Device for removing isopropyl alcohol from paper element
JP2003230638A (en) System for detoxifying harmful organochlorine compound and method for recycling product and waste produced by the same
JP2002248455A (en) Harmful substance treating system and pcb treating method
JP4675804B2 (en) Polychlorinated biphenyl contaminant treatment facility
JP2011143406A (en) Method for treating pcb waste
JP2000288510A (en) Method and apparatus for decomposing hazardous substance
JP2004041343A (en) Detoxication processing method and its system for pcb-containing electric appliance
JP2000299228A (en) Method and apparatus for removing pcb from pcb-adhered equipment
JP2003311231A (en) Cleaning method and cleaning apparatus
RU2221614C2 (en) Decontamination method for materials including hazardous substances of without combustion thereof (variants)
JP5324798B2 (en) Method for treating processing residue containing contaminants, and container used therefor
JP4507468B2 (en) Powder plasma processing method and processing apparatus therefor
JP2006116482A (en) Soil purifying facility
JP6573587B2 (en) PCB processing method
JP2003094013A (en) Treating method for rendering capacitor for fluorescent lamp ballast harmless and system therefor
JP4209175B2 (en) Waste disposal method
JP3872748B2 (en) Cleaning method and apparatus
JP6618501B2 (en) Method for reducing the volume of PCB contaminants
JP2004261767A (en) Recycling system of contaminated soil and storing device of contaminated soil
JP2001269654A (en) Treating method of material to which pcb adheres
JP2005058868A (en) Detoxifying treatment system and method
KR101082795B1 (en) The treating apparatus of solid waste with polychlorinated biphenyls and the treating method thereof
JP2008272571A (en) Treatment apparatus of exhaust gas containing hazardous organic substance

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080307

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090522

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110309

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110405

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110422

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4733525

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 3

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313117

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250