JP2007281396A - Light emitting device, and its fabrication method - Google Patents

Light emitting device, and its fabrication method Download PDF

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JP2007281396A
JP2007281396A JP2006109519A JP2006109519A JP2007281396A JP 2007281396 A JP2007281396 A JP 2007281396A JP 2006109519 A JP2006109519 A JP 2006109519A JP 2006109519 A JP2006109519 A JP 2006109519A JP 2007281396 A JP2007281396 A JP 2007281396A
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light emitting
emitting element
resist film
hole
emitting device
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Masami Obara
正美 小原
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2006109519A priority Critical patent/JP2007281396A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device and the light emitting device capable of a miniaturization of a mounted device by making further thinner possible. <P>SOLUTION: A resist film 15 is arranged so as to seal a via hole 14 which is formed on a printed wiring board 1 having a connection electrode 11 at the both edges of an insulation board 10 and a wiring pattern 12 to which a wire bonding is carried out. A light emitting element 18 is mounted in a bottom of a recess 16 formed by the via hole 14 and the resist film 15. A connection wiring which connects the light emitting element 18 and the wiring pattern 12 with a wire 19 is carried out. A sealing part 20 is formed by sealing the light emitting element 18 with a resin. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プリント配線基板に発光素子を設けた発光装置およびその製造方法に関するものである。   The present invention relates to a light emitting device in which a light emitting element is provided on a printed wiring board and a method for manufacturing the same.

両端部に電極が設けられた絶縁性基板と、それぞれの電極に接続する発光素子と、その発光素子を封止する樹脂封止部とが設けられた発光装置が特許文献１に記載されている。   Patent Document 1 discloses a light-emitting device provided with an insulating substrate provided with electrodes at both ends, a light-emitting element connected to each electrode, and a resin sealing portion that seals the light-emitting element. .

この特許文献１に記載のチップ部品型ＬＥＤは、貫通孔が形成された絶縁基板の裏面に、一方の配線パターンを形成する金属薄板を添設し、貫通孔内の金属薄板上にＬＥＤチップを実装し、このＬＥＤチップと絶縁基板の表面に形成された他方の配線パターンとを金属細線で接続して透明樹脂により封止したものである。
特開平７−２３５６９６号公報 In the chip component type LED described in Patent Document 1, a thin metal plate for forming one wiring pattern is attached to the back surface of an insulating substrate in which a through hole is formed, and the LED chip is mounted on the thin metal plate in the through hole. The LED chip and the other wiring pattern formed on the surface of the insulating substrate are connected by a thin metal wire and sealed with a transparent resin.
JP-A-7-235696

特許文献１に記載のチップ部品型ＬＥＤは、絶縁基板に貫通孔を形成して貫通孔を塞ぐように金属薄板を設けることでできる凹部にＬＥＤチップを配置することで薄型化が図られているように、薄型化の要求は高まっている。例えば、発光装置が搭載される携帯電話などは、携帯性の向上を図ると共に、デザイン性の向上を図るために、全ての部品に対して小型化が求められている。従って、発光装置においても更なる薄型化が要求され、益々その傾向は高まる一方である。   The chip component type LED described in Patent Document 1 is thinned by disposing an LED chip in a recess that can be formed by forming a through-hole in an insulating substrate and closing a through-hole. Thus, the demand for thinning is increasing. For example, a mobile phone or the like on which a light emitting device is mounted is required to be miniaturized for all components in order to improve portability and to improve design. Accordingly, the light emitting device is required to be further thinned, and the tendency is increasing more and more.

そこで本発明は、更なる薄型化を可能とすることで、搭載される装置の小型化が可能な発光装置の製造方法および発光装置を提供することを目的とする。   Accordingly, an object of the present invention is to provide a method for manufacturing a light-emitting device and a light-emitting device capable of reducing the size of the mounted device by further reducing the thickness.

本発明は、絶縁基板に電極が設けられると共に貫通孔が設けられ、前記貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板と、前記貫通孔と前記レジスト膜とで形成された凹部の底部に搭載され、前記電極にワイヤが配線された発光素子と、前記発光素子と前記ワイヤとを封止した封止部とを備えたことを特徴とする。   The present invention provides a printed wiring board in which an electrode is provided on an insulating substrate and a through hole is provided, and a resist film is provided so as to close the through hole, and a recess formed by the through hole and the resist film. A light-emitting element mounted on the bottom and having a wire wired on the electrode, and a sealing portion that seals the light-emitting element and the wire are provided.

本発明の発光装置は、貫通孔とレジスト膜とで形成される凹部の底部に搭載されているので、発光素子はプリント配線基板の板厚分ほど低い位置に搭載される。従って、その分、封止部の厚みも薄くすることができるので、更なる薄型化を可能とすることで、搭載される装置の小型化が可能である。   Since the light emitting device of the present invention is mounted on the bottom of the recess formed by the through hole and the resist film, the light emitting element is mounted at a position as low as the thickness of the printed wiring board. Accordingly, since the thickness of the sealing portion can be reduced accordingly, it is possible to reduce the size of the mounted device by enabling further reduction in thickness.

本願の第１の発明は、絶縁基板に電極が設けられると共に貫通孔が設けられ、貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板と、貫通孔とレジスト膜とで形成された凹部の底部に搭載され、電極にワイヤが配線された発光素子と、発光素子とワイヤとを封止した封止部とを備えたことを特徴としたものである。   A first invention of the present application is a printed wiring board in which an electrode is provided on an insulating substrate and a through hole is provided, and a resist film is provided so as to close the through hole, and a recess formed by the through hole and the resist film The light-emitting element is mounted on the bottom of the light-emitting diode, and a wire is wired to the electrode, and a sealing portion that seals the light-emitting element and the wire.

プリント配線基板は、絶縁基板に電極が設けられると共に、貫通孔が形成され、この貫通孔を塞ぐようにレジスト膜が設けられている。そして発光素子が、貫通孔とレジスト膜とで形成される凹部の底部に搭載されている。従って、発光素子はプリント配線基板の板厚分ほど低い位置に搭載されるので、その分、封止部の厚みも薄くすることができる。また、レジスト膜をプリント配線基板の裏面に配置しても、膜厚は金属薄板と比較すれば遙かに薄い。従って、レジスト膜を設けたとしても、発光装置全体の厚みには影響は少ない。   In the printed wiring board, an electrode is provided on an insulating substrate, a through hole is formed, and a resist film is provided so as to close the through hole. The light emitting element is mounted on the bottom of the recess formed by the through hole and the resist film. Accordingly, since the light emitting element is mounted at a position as low as the thickness of the printed wiring board, the thickness of the sealing portion can be reduced accordingly. Even if the resist film is disposed on the back surface of the printed circuit board, the film thickness is much thinner than that of the metal thin plate. Therefore, even if a resist film is provided, there is little influence on the thickness of the entire light emitting device.

本願の第２の発明は、発光素子は、レジスト膜に硬化性ペーストを硬化させたペースト層を介在させて搭載されていることを特徴としたものである。   The second invention of the present application is characterized in that the light emitting element is mounted on a resist film with a paste layer obtained by curing a curable paste interposed therebetween.

凹部の底部に硬化性ペーストを塗布して発光素子を搭載し、その硬化性ペーストを硬化させることで、封止部を形成するために凹部に樹脂が圧入されても、ペースト層が発光素子を固定しているので、発光素子が凹部内で移動してしまうことが防止できる。   By applying a curable paste to the bottom of the recess and mounting the light emitting element, and curing the curable paste, even if resin is pressed into the recess in order to form a sealing portion, the paste layer is not attached to the light emitting element. Since it is fixing, it can prevent that a light emitting element moves within a recessed part.

本願の第３の発明は、ワイヤは、発光素子側から電極側へ配線されていることを特徴としたものである。   The third invention of the present application is characterized in that the wire is wired from the light emitting element side to the electrode side.

発光素子がプリント配線基板の上面に搭載されている場合では、電極側から発光素子側へワイヤを配線した方が、電極側をファーストボンドしてプリント配線基板の上面からワイヤを垂直に立ち上げることになるので、発光素子側から電極側へワイヤを配線するよりも低く配線ができる。しかし、発光素子が凹部の底面に搭載されているため、ワイヤを発光素子から垂直に立ち上げても、プリント配線基板の板厚分ほど発光素子が搭載される位置が低くなっているので、電極側にファーストボンドするより配線高さを低くすることができる。従って、ファーストボンドを発光素子側とし、セカンドボンドを電極側とすることで、より発光装置の厚みを薄くすることができる。   When the light emitting element is mounted on the upper surface of the printed wiring board, the wire is wired from the electrode side to the light emitting element side, and the wire is first bonded to the electrode side, and the wire is raised vertically from the upper surface of the printed wiring board. Therefore, wiring can be made lower than wiring from the light emitting element side to the electrode side. However, since the light emitting element is mounted on the bottom surface of the recess, even if the wire is raised vertically from the light emitting element, the position where the light emitting element is mounted is as low as the thickness of the printed wiring board. The wiring height can be made lower than the first bonding on the side. Therefore, the thickness of the light emitting device can be further reduced by setting the first bond as the light emitting element side and the second bond as the electrode side.

本願の第４の発明は、絶縁基板に電極が設けられると共に貫通孔が設けられ、この貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板を用意する準備工程と、貫通孔とレジスト膜とで形成された凹部の底部に発光素子を搭載する搭載工程と、発光素子と電極とをそれぞれワイヤで接続する配線工程と、発光素子とワイヤとを樹脂で封止して封止部を形成する封止工程とを含むことを特徴としたものである。   According to a fourth aspect of the present invention, there is provided a preparatory step of preparing a printed wiring board in which an electrode is provided on an insulating substrate and a through hole is provided, and a resist film is provided so as to close the through hole, and the through hole and the resist film A mounting step of mounting the light emitting element on the bottom of the recess formed by the step, a wiring step of connecting the light emitting element and the electrode with wires, and sealing the light emitting element and the wire with a resin to form a sealing portion And a sealing step to be performed.

まず準備工程にて、絶縁基板に電極が設けられると共に、貫通孔が設けられ、この貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板を用意する。そして搭載工程にて、発光素子を貫通孔とレジスト膜とで形成される凹部の底部に搭載する。そして配線工程にてワイヤで配線し、封止工程で封止部を形成する。このように発光装置を製造することで、発光素子はプリント配線基板の板厚分ほど低い位置に搭載されるので、その分、封止部の厚みも薄くすることができる。また、レジスト膜をプリント配線基板の裏面に配置しても、膜厚は金属薄板と比較すれば遙かに薄い。従って、レジスト膜を設けたとしても、発光装置全体の厚みには影響は少ない。   First, in a preparation step, a printed wiring board is prepared in which an electrode is provided on an insulating substrate, a through hole is provided, and a resist film is provided so as to close the through hole. In the mounting step, the light emitting element is mounted on the bottom of the recess formed by the through hole and the resist film. And it wire | wires with a wire at a wiring process, and forms a sealing part at a sealing process. By manufacturing the light emitting device in this manner, the light emitting element is mounted at a position as low as the plate thickness of the printed wiring board, so that the thickness of the sealing portion can be reduced accordingly. Even if the resist film is disposed on the back surface of the printed circuit board, the film thickness is much thinner than that of the metal thin plate. Therefore, even if a resist film is provided, there is little influence on the thickness of the entire light emitting device.

本願の第５の発明は、絶縁基板に貫通孔を形成した後に、この貫通孔にレジストシートを接着してレジスト膜とすることで、プリント配線基板を形成することを特徴としたものである。   According to a fifth aspect of the present invention, a printed wiring board is formed by forming a through hole in an insulating substrate and then bonding a resist sheet to the through hole to form a resist film.

プリント配線基板を形成するにあたって、まず貫通孔を形成し、次にこの貫通孔を覆うようにレジストシートを接着して凹部を形成することで、この凹部の底部が平面に形成できる。従って、この底部に発光素子を搭載しても、水平が維持できるので、傾いて光軸がずれたり、搭載不良となったりすることが防止できる。   In forming the printed wiring board, first, a through hole is formed, and then a resist sheet is adhered to form a recess so as to cover the through hole, whereby the bottom of the recess can be formed in a flat surface. Therefore, even if a light emitting element is mounted on the bottom, the level can be maintained, so that the optical axis can be prevented from being tilted and mounting failure can be prevented.

本願の第６の発明は、絶縁基板に貫通孔を形成した後に、この貫通孔にレジスト液を塗布し硬化させてレジスト膜とすることで、プリント配線基板を形成することを特徴としたものである。   The sixth invention of the present application is characterized in that a printed wiring board is formed by forming a through hole in an insulating substrate and then applying a resist solution to the through hole and curing it to form a resist film. is there.

プリント配線基板を形成するにあたって、まず貫通孔を形成し、次にプリント配線基板にレジスト液を塗布し、そしてレジスト液を硬化させて凹部を形成する。従って貫通孔を設けた絶縁基板を並べてレジスト液を塗布すれば、一度に大量のプリント配線基板を作製することができる。   In forming a printed wiring board, first, a through hole is formed, then a resist solution is applied to the printed wiring board, and the resist solution is cured to form a recess. Therefore, a large number of printed wiring boards can be manufactured at a time by arranging the insulating substrates provided with through holes and applying the resist solution.

本願の第７の発明は、絶縁基板にレジスト膜を形成した後に、このレジスト膜を突き抜けないように絶縁基板を穿孔することで、プリント配線基板を形成することを特徴としたものである。   The seventh invention of the present application is characterized in that after a resist film is formed on the insulating substrate, the insulating substrate is perforated so as not to penetrate the resist film, thereby forming a printed wiring board.

プリント配線基板を形成するにあたって、まずレジスト膜を形成し、次にレジスト膜を突き抜けないように、プリント配線基板に貫通孔を穿孔して凹部を形成する。このように絶縁性基板を形成することで、この凹部の底部はレジスト膜が露出した平面になる。従って、この底部に発光素子を搭載しても、水平が維持できるので、傾いて光軸がずれたり、搭載不良となったりすることが防止できる。   In forming the printed wiring board, first, a resist film is formed, and then a through hole is drilled in the printed wiring board to form a recess so as not to penetrate the resist film. By forming the insulating substrate in this way, the bottom of the recess becomes a flat surface where the resist film is exposed. Therefore, even if a light emitting element is mounted on the bottom, the level can be maintained, so that the optical axis can be prevented from being tilted and mounting failure can be prevented.

本願の第８の発明は、配線工程において、発光素子側から電極側へワイヤを配線することを特徴としたものである。   The eighth invention of the present application is characterized in that in the wiring step, a wire is wired from the light emitting element side to the electrode side.

発光素子がプリント配線基板の上面に搭載されている場合では、電極側から発光素子側へワイヤを配線した方が、電極側をファーストボンドしてプリント配線基板の上面からワイヤを垂直に立ち上げることになるので、発光素子側から電極側へワイヤを配線するよりも低く配線ができる。しかし、発光素子が凹部の底面に搭載されているため、ワイヤを発光素子から垂直に立ち上げても、プリント配線基板の板厚分ほど発光素子が搭載される位置が低くなっているので、電極側にファーストボンドするより配線高さを低くすることができる。従って、ファーストボンドを発光素子側とし、セカンドボンドを電極側とすることで、より発光装置の厚みを薄くすることができる。   When the light emitting element is mounted on the upper surface of the printed wiring board, the wire is wired from the electrode side to the light emitting element side, and the wire is first bonded to the electrode side, and the wire is raised vertically from the upper surface of the printed wiring board. Therefore, wiring can be made lower than wiring from the light emitting element side to the electrode side. However, since the light emitting element is mounted on the bottom surface of the recess, even if the wire is raised vertically from the light emitting element, the position where the light emitting element is mounted is as low as the thickness of the printed wiring board. The wiring height can be made lower than the first bonding on the side. Therefore, the thickness of the light emitting device can be further reduced by setting the first bond as the light emitting element side and the second bond as the electrode side.

（実施の形態）
本発明の実施の形態に係る発光装置を図１に基づいて説明する。図１は、本発明の実施の形態に係る発光装置を示す図であり、（Ａ）は断面図、（Ｂ）は平面図、（Ｃ）は底面図である。 (Embodiment)
A light emitting device according to an embodiment of the present invention will be described with reference to FIG. 1A and 1B are diagrams illustrating a light-emitting device according to an embodiment of the present invention, in which FIG. 1A is a cross-sectional view, FIG. 1B is a plan view, and FIG.

図１（Ａ）から同図（Ｃ）に示すように、発光装置は、プリント配線基板１と、発光素子１８と、封止部２０とを備えている。プリント配線基板１は、絶縁基板１０の両端部に接続電極１１が設けられていると共に、接続電極１１に接続される配線パターン１２が設けられている。絶縁基板１０は、ガラスエポキシ樹脂またはＢＴレジンで形成され、平面視して略矩形状に形成され、厚みが０．２ｍｍに形成されている。接続電極１１は、絶縁基板１０の長手方向の両端部に設けられ、垂直断面コ字状に形成されている。また配線パターン１２は、略Ｌ字状に形成されており、先端部がワイヤボンディングされるボンディング部１２ａとなっている。この接続電極１１と配線パターン１２との接続部分には、後述する封止部２０を形成する際の金型を型締めしたときの樹脂漏れを防止するためにレジスト部１３が形成されている。そして絶縁基板１０の中央部には、直径が０．３ｍｍ〜０．８ｍｍの円形状に形成された貫通孔１４が設けられている。   As shown in FIG. 1A to FIG. 1C, the light emitting device includes a printed wiring board 1, a light emitting element 18, and a sealing portion 20. The printed wiring board 1 is provided with connection electrodes 11 at both ends of the insulating substrate 10 and wiring patterns 12 connected to the connection electrodes 11. The insulating substrate 10 is made of glass epoxy resin or BT resin, is formed in a substantially rectangular shape in plan view, and has a thickness of 0.2 mm. The connection electrodes 11 are provided at both ends in the longitudinal direction of the insulating substrate 10 and are formed in a U-shaped vertical section. Further, the wiring pattern 12 is formed in a substantially L shape, and a tip portion is a bonding portion 12a to which wire bonding is performed. A resist portion 13 is formed at a connection portion between the connection electrode 11 and the wiring pattern 12 in order to prevent resin leakage when a mold is clamped when a sealing portion 20 to be described later is formed. A through-hole 14 formed in a circular shape with a diameter of 0.3 mm to 0.8 mm is provided in the central portion of the insulating substrate 10.

またプリント配線基板１には、絶縁基板１０に設けられた貫通孔１４を覆うように裏面にレジスト膜１５が設けられている。レジスト膜１５は、液状のソルダレジストを硬化させて形成されている。このレジスト膜１５の材質は、レジスト部１３と同じものを使用することができ、液状のソルダレジストを硬化させて形成することができる。このレジスト膜１５には、極性表示の切り欠き部が形成されている。   The printed wiring board 1 is provided with a resist film 15 on the back surface so as to cover the through hole 14 provided in the insulating substrate 10. The resist film 15 is formed by curing a liquid solder resist. The material of the resist film 15 can be the same as that of the resist portion 13, and can be formed by curing a liquid solder resist. The resist film 15 is provided with a notch for polarity display.

絶縁基板１０に設けられた貫通孔１４とレジスト膜１５とで形成された凹部１６の底部には、異方性導電ペースト（Ａｎｉｓｏｔｒｏｐｉｃ Ｃｏｎｄｕｃｔｉｖｅ Ｐａｓｔｅ：ＡＣＰ）または非導電性ペースト（Ｎｏｎ Ｃｏｎｄｕｃｔｉｖｅ Ｒｅｓｉｎ Ｐａｓｔｅ：ＮＣＰ）などの紫外線硬化または熱硬化する硬化性ペーストを硬化させて形成されたペースト層１７が設けられている。そしてペースト層１７上には発光素子１８が搭載されている。   An anisotropic conductive paste (ACP) or non-conductive paste (NCP) is formed at the bottom of the recess 16 formed of the through hole 14 and the resist film 15 provided in the insulating substrate 10. The paste layer 17 is formed by curing a curable paste that is cured by ultraviolet rays or heat. A light emitting element 18 is mounted on the paste layer 17.

ペースト層１７は、発光素子１８からの光を凹部１６の開口方向へ反射させることができ、光取り出し効率が向上するので、異方性導電ペーストまたは非導電性ペーストとしたときには白色ペーストとし、他の硬化性ペーストを採用するときには銀ペーストとするのが望ましい。   The paste layer 17 can reflect the light from the light emitting element 18 in the opening direction of the recess 16 and improves the light extraction efficiency. Therefore, when the anisotropic conductive paste or the non-conductive paste is used, the paste layer 17 is a white paste. When using this curable paste, a silver paste is desirable.

発光素子１８は、配線パターン１２のボンディング部１２ａと導通するためにワイヤ１９が接続されている。このワイヤ１９は、発光素子１８側がファーストボンドで接続され、ボンディング部１２ａがセカンドボンドで接続されている。   A wire 19 is connected to the light emitting element 18 so as to be electrically connected to the bonding portion 12 a of the wiring pattern 12. The light emitting element 18 side of the wire 19 is connected by a first bond, and the bonding portion 12a is connected by a second bond.

そして、凹部１６の底部に搭載された発光素子１８とワイヤ１９とを封止する封止部２０がプリント配線基板１上に形成されている。この封止部２０はエポキシ樹脂で形成されている。   A sealing portion 20 that seals the light emitting element 18 and the wire 19 mounted on the bottom of the recess 16 is formed on the printed wiring board 1. This sealing part 20 is formed of an epoxy resin.

以上のように構成される本発明の実施の形態に係る発光装置の製造方法について、図面に基づいて説明する。図２は、プリント配線基板を示す図であり、（Ａ）は断面図、同図（Ｂ）は平面図である。図３から図５は、プリント配線基板の製造方法を説明する図であり、（Ａ），（Ｃ）および（Ｅ）は平面図、（Ｂ），（Ｄ）および（Ｆ）は底面図である。図６から図８は、本発明の実施の形態に係る発光装置の製造方法を説明する図であり、（Ａ）は断面図、（Ｂ）は平面図である。   A method for manufacturing a light emitting device according to an embodiment of the present invention configured as described above will be described with reference to the drawings. 2A and 2B are diagrams showing a printed wiring board, where FIG. 2A is a cross-sectional view and FIG. 2B is a plan view. 3 to 5 are diagrams for explaining a method of manufacturing a printed wiring board, in which (A), (C), and (E) are plan views, and (B), (D), and (F) are bottom views. is there. 6 to 8 are views for explaining a method of manufacturing a light emitting device according to an embodiment of the present invention, where (A) is a cross-sectional view and (B) is a plan view.

最初に、図２に示されるプリント配線基板１を用意する（準備工程）。プリント配線基板１は、絶縁基板１０に、貫通孔１４が設けられていると共に、この貫通孔１４を覆うようにレジスト膜１５が設けられている。ここで、このプリント配線基板１の製造方法を図３から図５に基づいて説明する。   First, the printed wiring board 1 shown in FIG. 2 is prepared (preparation process). In the printed wiring board 1, a through hole 14 is provided in the insulating substrate 10, and a resist film 15 is provided so as to cover the through hole 14. Here, the manufacturing method of this printed wiring board 1 is demonstrated based on FIGS.

まず図３（Ａ）から同図（Ｆ）で示されるプリント配線基板１の製造方法を説明する。図３（Ａ）および同図（Ｂ）に示すように絶縁基板１０に、接続電極１１および配線パターン１２を形成したものに、図３（Ｃ）および同図（Ｄ）に示すように予め貫通孔１４を穿孔する。この貫通孔１４は、絶縁基板１０を複数枚重ねて形成することができるので、ドリルなどで容易に形成することができる。なお、この貫通孔１４の内周面に発光素子１８からの光を反射するメッキ層を設けてもよい。そして、図３（Ｅ）および同図（Ｆ）に示すように、液状のソルダレジストをシート状に硬化させたレジストシート１５ａを接着剤で貼着して貫通孔１４を塞ぐレジスト膜１５とする。このように貫通孔１４とレジストシート１５ａで凹部１６を形成することで、凹部１６の底部を平面に形成できる。従って、この底部に発光素子１８を搭載しても、水平が維持できるので、傾いて光軸がずれたり、搭載不良となったりすることが防止できる。   First, a method for manufacturing the printed wiring board 1 shown in FIGS. 3A to 3F will be described. As shown in FIG. 3 (A) and FIG. 3 (B), the insulating substrate 10 is provided with the connection electrode 11 and the wiring pattern 12 formed in advance, as shown in FIG. 3 (C) and FIG. 3 (D). Hole 14 is drilled. Since the through holes 14 can be formed by stacking a plurality of insulating substrates 10, they can be easily formed by a drill or the like. A plating layer that reflects light from the light emitting element 18 may be provided on the inner peripheral surface of the through hole 14. Then, as shown in FIGS. 3E and 3F, a resist sheet 15a obtained by curing a liquid solder resist into a sheet is pasted with an adhesive to form a resist film 15 that closes the through hole 14. . Thus, the bottom part of the recessed part 16 can be formed in a plane by forming the recessed part 16 with the through-hole 14 and the resist sheet 15a. Therefore, even if the light emitting element 18 is mounted on the bottom, the level can be maintained, so that it is possible to prevent the optical axis from being tilted and mounting failure.

次に、図４（Ａ）から同図（Ｆ）で示されるプリント配線基板１の他の製造方法を説明する。図４（Ａ）および同図（Ｂ）に示すように絶縁基板１０に、接続電極１１および配線パターン１２を形成したものに、図４（Ｃ）および同図（Ｄ）に示すように貫通孔１４を穿孔する。そして、図４（Ｅ）および同図（Ｆ）に示すようにレジスト液１５ｂを絶縁基板１０の裏面に塗布する。そして塗布したレジスト液１５ｂを硬化させてレジスト膜１５を形成する。貫通孔１４が形成された絶縁基板１０にレジスト液１５ｂを塗布して硬化させることでレジスト膜１５を形成すると、貫通孔１４の直径が０．３ｍｍ〜０．８ｍｍと極めて小さいため、凹部１６の底面となる部分がレジスト液１５ｂの粘性により貫通孔１４の内側に向かって中央が盛り上がるように形成される。従って、レジスト膜１５が塞いだ貫通孔１４の反対側の開口から平面を形成する形成装置のツール先端を挿入して、凹部１６の底面を研削して平面とするのが望ましい。このようにしてプリント配線基板１を製造することもできる。貫通孔１４にレジスト液１５ｂを塗布して硬化させて凹部１６を形成することができるので、貫通孔１４が形成された絶縁基板１０を複数並べてレジスト液１５ｂを塗布すれば、一度に大量のプリント配線基板１を作製することができる。   Next, another method for manufacturing the printed wiring board 1 shown in FIGS. 4A to 4F will be described. As shown in FIGS. 4A and 4B, through-holes are formed in the insulating substrate 10 in which the connection electrodes 11 and the wiring pattern 12 are formed, as shown in FIGS. 4C and 4D. 14 is perforated. Then, a resist solution 15b is applied to the back surface of the insulating substrate 10 as shown in FIGS. Then, the applied resist solution 15b is cured to form a resist film 15. When the resist film 15 is formed by applying and curing the resist solution 15b on the insulating substrate 10 in which the through holes 14 are formed, the diameter of the through holes 14 is as small as 0.3 mm to 0.8 mm. The bottom portion is formed so that the center rises toward the inside of the through hole 14 due to the viscosity of the resist solution 15b. Therefore, it is desirable to insert the tool tip of a forming apparatus that forms a flat surface from the opening on the opposite side of the through hole 14 covered with the resist film 15, and to grind the bottom surface of the concave portion 16 into a flat surface. In this way, the printed wiring board 1 can be manufactured. Since the recess 16 can be formed by applying the resist solution 15b to the through hole 14 and curing it, if a plurality of insulating substrates 10 having the through holes 14 are arranged and the resist solution 15b is applied, a large amount of printing is performed at once. The wiring board 1 can be manufactured.

次に、図５（Ａ）および同図（Ｆ）で示されるプリント配線基板１の他の製造方法を説明する。図５（Ａ）および同図（Ｂ）に示すように、絶縁基板１０に、接続電極１１および配線パターン１２を形成したものに、図５（Ｃ）および同図（Ｄ）に示すように、液状のソルダレジストをシート状に硬化させたレジストシート１５ａを接着剤で貼着してレジスト膜１５を形成する。そして図５（Ｅ）および同図（Ｆ）に示すように、レジスト膜１５を突き抜けないように絶縁基板１０を貫通する貫通孔１４を穿孔する。このように貫通孔１４とレジストシート１５ａで凹部１６を形成することで、凹部１６の底部を平面に形成できる。従って、この底部に発光素子１８を搭載しても、水平が維持できるので、傾いて光軸がずれたり、搭載不良となったりすることが防止できる。   Next, another method for manufacturing the printed wiring board 1 shown in FIGS. 5A and 5F will be described. As shown in FIG. 5A and FIG. 5B, the connection electrode 11 and the wiring pattern 12 are formed on the insulating substrate 10 as shown in FIG. A resist sheet 15a obtained by curing a liquid solder resist into a sheet is pasted with an adhesive to form a resist film 15. Then, as shown in FIGS. 5E and 5F, a through hole 14 penetrating the insulating substrate 10 is drilled so as not to penetrate the resist film 15. Thus, the bottom part of the recessed part 16 can be formed in a plane by forming the recessed part 16 with the through-hole 14 and the resist sheet 15a. Therefore, even if the light emitting element 18 is mounted on the bottom, the level can be maintained, so that it is possible to prevent the optical axis from being tilted and mounting failure.

プリント配線基板１を用意できれば、次に搭載工程を行う。図６（Ａ）および同図（Ｂ）に示すように搭載工程は、まず凹部１６に異方性導電ペーストまたは非導電性ペーストをポッティングまたはスタンピングにより塗布する。この異方性導電ペーストまたは非導電性ペーストは、紫外線または熱により硬化する硬化性ペーストであるので、塗布した状態では硬化前であるため糊状のペースト層１７である。次に硬化前のペースト層１７上に発光素子１８を載置する。異方性導電ペーストまたは非導電性ペーストが、熱硬化性を有するものであれば、発光素子１８を載置した状態の絶縁基板１０を加熱してペースト層１７を硬化させる。また紫外線硬化性を有するものであれば、紫外線を照射してペースト層１７を硬化させる。このようにして発光素子１８を凹部１６の底部に搭載する。   If the printed wiring board 1 can be prepared, a mounting process is performed next. As shown in FIGS. 6A and 6B, in the mounting step, first, an anisotropic conductive paste or non-conductive paste is applied to the recess 16 by potting or stamping. Since this anisotropic conductive paste or non-conductive paste is a curable paste that is cured by ultraviolet rays or heat, it is a paste-like paste layer 17 because it is not cured when applied. Next, the light emitting element 18 is placed on the paste layer 17 before curing. If the anisotropic conductive paste or the non-conductive paste is thermosetting, the insulating substrate 10 on which the light emitting element 18 is placed is heated to cure the paste layer 17. Moreover, if it has ultraviolet curing property, the paste layer 17 is hardened by irradiating ultraviolet rays. In this way, the light emitting element 18 is mounted on the bottom of the recess 16.

図７（Ａ）および同図（Ｂ）に示すように発光素子１８を凹部１６の底部に搭載すると次に配線工程を行う。配線工程は、発光素子１８と、配線パターン１２のボンディング部１２ａとをワイヤ１９で接続する。このときに発光素子１８側からボンディング部１２ａ側に向かってワイヤ１９を配線する。そうすることで発光素子１８からワイヤ１９を垂直に立ち上げ、ボンディング部１２ａに配線するようにしても、発光素子１８が凹部１６の底部に搭載されているので、絶縁基板１０の板厚分ほどワイヤ１９の配線高さを低く抑えることができる。   When the light emitting element 18 is mounted on the bottom of the recess 16 as shown in FIGS. 7A and 7B, a wiring process is performed. In the wiring process, the light emitting element 18 and the bonding portion 12 a of the wiring pattern 12 are connected by the wire 19. At this time, the wire 19 is wired from the light emitting element 18 side to the bonding portion 12a side. By doing so, even if the wire 19 is raised vertically from the light emitting element 18 and wired to the bonding portion 12a, the light emitting element 18 is mounted on the bottom of the recess 16, so that the thickness of the insulating substrate 10 is about The wiring height of the wire 19 can be kept low.

図８（Ａ）および同図（Ｂ）に示すようにワイヤ１９の配線が完了すると封止工程を行う。封止工程は、発光素子１８とワイヤ１９とを封止する封止部２０を形成するキャビティを有する金型を、絶縁基板１０を挟んで型締めして、エポキシ樹脂を金型に注入して封止部２０を形成する。封止部２０を形成するために、凹部１６に樹脂が圧入されても、ペースト層１７が発光素子１８を固定しているので、発光素子１８が凹部１６内で移動してしまうことが防止できる。   As shown in FIGS. 8A and 8B, when the wiring of the wire 19 is completed, a sealing process is performed. In the sealing step, a mold having a cavity for forming a sealing portion 20 for sealing the light emitting element 18 and the wire 19 is clamped with the insulating substrate 10 interposed therebetween, and epoxy resin is injected into the mold. The sealing part 20 is formed. Even if resin is pressed into the recess 16 to form the sealing portion 20, the paste layer 17 fixes the light emitting element 18, so that the light emitting element 18 can be prevented from moving in the recess 16. .

このようにして本発明の実施の形態に係る発光装置を製造することができる。このように製造された発光装置は、発光素子１８がプリント配線基板１の板厚分ほど低い位置に搭載されるので、その分、封止部２０の厚みも薄くすることができる。また、レジスト膜１５をプリント配線基板１の裏面に配置しても、膜厚は金属薄板と比較すれば遙かに薄い。従って、レジスト膜１５を設けたとしても、発光装置全体の厚みには影響は少ない。   In this manner, the light emitting device according to the embodiment of the present invention can be manufactured. In the light-emitting device manufactured in this way, the light-emitting element 18 is mounted at a position as low as the plate thickness of the printed wiring board 1, so that the thickness of the sealing portion 20 can be reduced accordingly. Even if the resist film 15 is disposed on the back surface of the printed wiring board 1, the film thickness is much thinner than that of a metal thin plate. Therefore, even if the resist film 15 is provided, there is little influence on the thickness of the entire light emitting device.

以上、本発明の実施の形態について説明してきたが、本発明は前記実施の形態に限定されるものではなく、例えば、本実施の形態では、両方の電極と配線パターン１２とは、２本のワイヤ１９により接続される発光素子１８としたが、一方の電極はワイヤで配線パターンと接続し、他方の電極はダイボンドにより配線パターンと接続する発光素子としてもよい。そのときには、発光素子をダイボンドして配線パターンと接続できるよう、貫通孔１４の周壁面にメッキなどにより配線パターンを形成することで導通させることが可能である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments. For example, in the present embodiment, both electrodes and the wiring pattern 12 are two. Although the light emitting element 18 connected by the wire 19 is used, one electrode may be connected to the wiring pattern by a wire, and the other electrode may be a light emitting element connected to the wiring pattern by die bonding. At that time, the wiring pattern can be formed by plating or the like on the peripheral wall surface of the through hole 14 so that the light emitting element can be die-bonded and connected to the wiring pattern.

本発明は、更なる薄型化を可能とすることで、搭載される装置の小型化が可能なので、絶縁基板に発光素子を設けた発光装置およびその製造方法に好適である。   The present invention is suitable for a light-emitting device in which a light-emitting element is provided on an insulating substrate and a method for manufacturing the same because the device to be mounted can be reduced in size by further reducing the thickness.

本発明の実施の形態に係る発光装置を示す図であり、（Ａ）は断面図、（Ｂ）は平面図、（Ｃ）は底面図BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the light-emitting device which concerns on embodiment of this invention, (A) is sectional drawing, (B) is a top view, (C) is a bottom view. プリント配線基板を示す図であり、（Ａ）は断面図、（Ｂ）は平面図It is a figure which shows a printed wiring board, (A) is sectional drawing, (B) is a top view プリント配線基板の製造方法を説明する図であり、（Ａ），（Ｃ）および（Ｅ）は平面図、（Ｂ），（Ｄ）および（Ｆ）は底面図It is a figure explaining the manufacturing method of a printed wiring board, (A), (C) and (E) are top views, (B), (D) and (F) are bottom views プリント配線基板の製造方法を説明する図であり、（Ａ），（Ｃ）および（Ｅ）は平面図、（Ｂ），（Ｄ）および（Ｆ）は底面図It is a figure explaining the manufacturing method of a printed wiring board, (A), (C) and (E) are top views, (B), (D) and (F) are bottom views プリント配線基板の製造方法を説明する図であり、（Ａ），（Ｃ）および（Ｅ）は平面図、（Ｂ），（Ｄ）および（Ｆ）は底面図It is a figure explaining the manufacturing method of a printed wiring board, (A), (C) and (E) are top views, (B), (D) and (F) are bottom views 本発明の実施の形態に係る発光装置の製造方法を説明する図であり、（Ａ）は断面図、（Ｂ）は平面図It is a figure explaining the manufacturing method of the light-emitting device which concerns on embodiment of this invention, (A) is sectional drawing, (B) is a top view 本発明の実施の形態に係る発光装置の製造方法を説明する図であり、（Ａ）は断面図、（Ｂ）は平面図It is a figure explaining the manufacturing method of the light-emitting device which concerns on embodiment of this invention, (A) is sectional drawing, (B) is a top view 本発明の実施の形態に係る発光装置の製造方法を説明する図であり、（Ａ）は断面図、（Ｂ）は平面図It is a figure explaining the manufacturing method of the light-emitting device which concerns on embodiment of this invention, (A) is sectional drawing, (B) is a top view

符号の説明Explanation of symbols

１ プリント配線基板
１０ 絶縁基板
１１ 接続電極
１２ 配線パターン
１２ａ ボンディング部
１３ レジスト部
１４ 貫通孔
１５ レジスト膜
１５ａ レジストシート
１５ｂ レジスト液
１６ 凹部
１７ ペースト層
１８ 発光素子
１９ ワイヤ
２０ 封止部 DESCRIPTION OF SYMBOLS 1 Printed wiring board 10 Insulating board 11 Connection electrode 12 Wiring pattern 12a Bonding part 13 Resist part 14 Through-hole 15 Resist film 15a Resist sheet 15b Resist liquid 16 Recess 17 Paste layer 18 Light emitting element 19 Wire 20 Sealing part

Claims (8)

絶縁基板に電極が設けられると共に貫通孔が設けられ、前記貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板と、
前記貫通孔と前記レジスト膜とで形成された凹部の底部に搭載され、前記電極にワイヤが配線された発光素子と、
前記発光素子と前記ワイヤとを封止した封止部とを備えたことを特徴とする発光装置。 An insulating substrate is provided with electrodes and through holes are provided, and a printed wiring board is provided with a resist film so as to close the through holes,
A light emitting device mounted on the bottom of a recess formed by the through hole and the resist film, and a wire is wired to the electrode;
A light emitting device comprising: a sealing portion that seals the light emitting element and the wire. 前記発光素子は、前記レジスト膜に硬化性ペーストを硬化させたペースト層を介在させて搭載されていることを特徴とする請求項１記載の発光装置。 The light emitting device according to claim 1, wherein the light emitting element is mounted on the resist film with a paste layer obtained by curing a curable paste interposed therebetween. 前記ワイヤは、前記発光素子側から前記電極側へ配線されていることを特徴とする請求項１または２記載の発光装置。 The light emitting device according to claim 1, wherein the wire is wired from the light emitting element side to the electrode side. 絶縁基板に電極が設けられると共に貫通孔が設けられ、この貫通孔を塞ぐようにレジスト膜が設けられたプリント配線基板を用意する準備工程と、
前記貫通孔と前記レジスト膜とで形成された凹部の底部に発光素子を搭載する搭載工程と、
前記発光素子と前記電極とをそれぞれワイヤで接続する配線工程と、
前記発光素子とワイヤとを樹脂で封止して封止部を形成する封止工程とを含むことを特徴とする発光装置の製造方法。 A preparatory step of preparing a printed wiring board provided with a resist film so that an electrode is provided on the insulating substrate and a through hole is provided, and the through hole is blocked,
A mounting step of mounting a light emitting element on the bottom of a recess formed by the through hole and the resist film;
A wiring step of connecting the light emitting element and the electrode with wires,
A method of manufacturing a light emitting device, comprising: a sealing step of sealing the light emitting element and the wire with a resin to form a sealing portion. 前記絶縁基板に貫通孔を形成した後に、この貫通孔にレジストシートを接着して前記レジスト膜とすることで、前記プリント配線基板を形成することを特徴とする請求項４記載の発光装置の製造方法。 5. The light-emitting device according to claim 4, wherein the printed wiring board is formed by forming a through hole in the insulating substrate and then bonding a resist sheet to the through hole to form the resist film. Method. 前記絶縁基板に貫通孔を形成した後に、この貫通孔にレジスト液を塗布し硬化させて前記レジスト膜とすることで、前記プリント配線基板を形成することを特徴とする請求項４記載の発光装置の製造方法。 5. The light emitting device according to claim 4, wherein the printed wiring board is formed by forming a through hole in the insulating substrate, and then applying a resist solution to the through hole and curing to form the resist film. Manufacturing method. 前記絶縁基板にレジスト膜を形成した後に、このレジスト膜を突き抜けないように絶縁基板を穿孔することで、前記プリント配線基板を形成することを特徴とする請求項４記載の発光装置の製造方法。 5. The method of manufacturing a light emitting device according to claim 4, wherein after forming a resist film on the insulating substrate, the printed wiring board is formed by perforating the insulating substrate so as not to penetrate the resist film. 前記配線工程において、前記発光素子側から前記電極側へ前記ワイヤを配線することを特徴とする請求項４から７のいずれかの項に記載の発光装置の製造方法。 The method for manufacturing a light emitting device according to claim 4, wherein in the wiring step, the wire is wired from the light emitting element side to the electrode side.
JP2006109519A 2006-04-12 2006-04-12 Light emitting device, and its fabrication method Pending JP2007281396A (en)

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