JP7011148B2 - A method for manufacturing a light emitting element mounting substrate and a method for manufacturing a light emitting device using the same, and a light emitting element mounting substrate and a light emitting device using the same. - Google Patents

A method for manufacturing a light emitting element mounting substrate and a method for manufacturing a light emitting device using the same, and a light emitting element mounting substrate and a light emitting device using the same. Download PDF

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JP7011148B2
JP7011148B2 JP2017061242A JP2017061242A JP7011148B2 JP 7011148 B2 JP7011148 B2 JP 7011148B2 JP 2017061242 A JP2017061242 A JP 2017061242A JP 2017061242 A JP2017061242 A JP 2017061242A JP 7011148 B2 JP7011148 B2 JP 7011148B2
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light emitting
emitting element
light
insulating member
core
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JP2017188673A (en
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幸利 丸谷
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Description

本開示は、発光素子載置用基体の製造方法及びそれを用いた発光装置の製造方法並びに発光素子載置用基体及びそれを用いた発光装置に関する。 The present disclosure relates to a method for manufacturing a light emitting element mounting substrate and a method for manufacturing a light emitting device using the same, and a light emitting element mounting substrate and a light emitting device using the same.

種々の光源として、ＬＥＤ（発光ダイオード）チップのような発光素子を備える発光装置が利用されている。このような発光装置には、発光素子及び発光素子が搭載される基体を有するものがある。例えば、特許文献１及び２に記載の発光装置は、金属シートを打ち抜きやエッチング等で加工したリードフレームを、インサートモールディング技術により樹脂と一体化した発光装置筐体の集合体に、発光素子が載置されている。 As various light sources, a light emitting device including a light emitting element such as an LED (light emitting diode) chip is used. Some such light emitting devices have a light emitting element and a substrate on which the light emitting element is mounted. For example, in the light emitting devices described in Patent Documents 1 and 2, a light emitting element is mounted on an aggregate of a light emitting device housing in which a lead frame obtained by punching or etching a metal sheet is integrated with a resin by an insert molding technique. It is placed.

特開２００８－２３５４６９号公報Japanese Unexamined Patent Publication No. 2008-235469 特開２０１０－１３５７１８号公報Japanese Unexamined Patent Publication No. 2010-135718

このような発光装置筐体の集合体を製造する際のリードフレーム加工工程においては、打ち抜きやエッチング加工等が必要になり、廃棄物や廃液が多く発生してリードフレームのコストが上昇し、これにより最終的に製造される発光装置のコストが上昇するという課題があった。
本実施形態はこのような事情に鑑みてなされたものであり、コストを低減した発光素子載置用基体の製造方法及びそれを用いた発光装置の製造方法並びに発光素子載置用基体及びそれを用いた発光装置を提供することを目的とする。 In the lead frame processing process when manufacturing an aggregate of such a light emitting device housing, punching and etching processing are required, and a large amount of waste and liquid is generated, which increases the cost of the lead frame. Therefore, there is a problem that the cost of the light emitting device finally manufactured increases.
This embodiment has been made in view of such circumstances, and is a method for manufacturing a light emitting element mounting substrate with reduced cost, a method for manufacturing a light emitting device using the same, a light emitting element mounting substrate, and the like. It is an object of the present invention to provide a light emitting device used.

本発明の一実施形態に係る発光素子載置用基体の製造方法は、凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備える。
また、本発明の一実施形態に係る発光素子載置用基体は、発光素子載置用基体であって、複数の導電体コアと、前記それぞれの導電体コアの側面を被覆する光反射性の第２絶縁部材と、前記第２絶縁部材同士を接合する遮光性樹脂と、前記遮光性樹脂と接する第１絶縁部材と、を備え、前記導電体コアの上面及び前記導電体コアの下面は、前記遮光性樹脂から露出されている。 The method for manufacturing a light-emitting element mounting substrate according to an embodiment of the present invention includes a first step of preparing a plate-shaped first insulating member having a recess or a through hole, and a light-shielding property in the recess or the through hole. The conductor is provided by a second step of arranging the resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core, and by removing a part of the second insulating member. A third step of exposing the surface of the core from the second insulating member is provided.
Further, the substrate for mounting a light emitting element according to an embodiment of the present invention is a substrate for mounting a light emitting element, and has a plurality of conductor cores and light reflectivity that covers the side surfaces of the respective conductor cores. A second insulating member, a light-shielding resin for joining the second insulating members to each other, and a first insulating member in contact with the light-shielding resin are provided, and the upper surface of the conductor core and the lower surface of the conductor core are formed on the lower surface of the conductor core. It is exposed from the light-shielding resin.

これにより、コストを低減した発光素子載置用基体の製造方法及びそれを用いた発光装置の製造方法並びに発光素子載置用基体及びそれを用いた発光装置を提供することができる。 Thereby, it is possible to provide a method for manufacturing a light emitting element mounting substrate and a method for manufacturing a light emitting device using the same, and a light emitting element mounting substrate and a light emitting device using the same, with reduced cost.

コア部を示す模式断面図である。It is a schematic cross-sectional view which shows the core part. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の変形例に係る製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method which concerns on the modification of one Embodiment of this invention. 本発明の一実施形態の製造方法を説明する模式図である。It is a schematic diagram explaining the manufacturing method of one Embodiment of this invention. 本発明の一実施形態の発光装置を説明する模式図である。It is a schematic diagram explaining the light emitting device of one Embodiment of this invention. 図４のＡ－Ａ断面図である。FIG. 4 is a cross-sectional view taken along the line AA of FIG. 図６の下面図である。It is a bottom view of FIG. 図１４Ａは図７の上面図、図１４Ｂは図１４ＡのＡ－Ａ断面図、図１４Ｃは図１４ＡのＢ－Ｂ断面図、図１４Ｄは図７の下面図である。14A is a top view of FIG. 7, FIG. 14B is a sectional view taken along the line AA of FIG. 14A, FIG. 14C is a sectional view taken along the line BB of FIG. 14A, and FIG. 14D is a bottom view of FIG. 7.

以下、発明の実施の形態について適宜図面を参照して説明する。ただし、以下に説明する発光素子載置用基体及び発光素子載置用基体の製造方法は、本開示の技術思想を具体化するためのものであって、特定的な記載がない限り、本開示を以下のものに限定しない。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。他の実施形態において説明した構成のうち同一の名称については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。各図面が示す部材の大きさや位置関係等は、説明を容易にするため、誇張していることがある。 Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the method for manufacturing the light emitting element mounting substrate and the light emitting element mounting substrate described below is for embodying the technical idea of the present disclosure, and unless otherwise specified, the present disclosure is made. Is not limited to the following. Further, the contents described in one embodiment and the embodiment can be applied to other embodiments and the embodiments. Of the configurations described in the other embodiments, the same names indicate the same or the same quality members, and detailed description thereof will be omitted as appropriate. The size and positional relationship of the members shown in each drawing may be exaggerated for ease of explanation.

本発明の一実施形態に係る発光素子載置用基体１００の製造方法は、凹部又は貫通孔を有する板状の第１絶縁部材を準備する工程と、凹部又は貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の絶縁部材を有する複数のコア部と、を配置する第２工程と、第２絶縁部材の一部を除去することにより、導電体コアの表面を第２絶縁部材から露出させる工程と、を備える。以下、図１～８を参照しながら、本実施の形態に係る発光素子載置用基体の製造方法について説明する。 The method for manufacturing the light emitting element mounting substrate 100 according to the embodiment of the present invention includes a step of preparing a plate-shaped first insulating member having a recess or a through hole, and a light-shielding resin in the recess or the through hole. The surface of the conductor core is secondly insulated by the second step of arranging a plurality of core portions having a light-reflecting insulating member on the surface of the conductor core and by removing a part of the second insulating member. It includes a process of exposing from a member. Hereinafter, a method for manufacturing a light emitting element mounting substrate according to the present embodiment will be described with reference to FIGS. 1 to 8.

（第１絶縁部材準備工程）
本実施形態においては、第１絶縁部材１８として、図２に示すような貫通孔３７を有する絶縁性シートを準備する。絶縁性シートは例えば樹脂シートを用いることができる。貫通孔３７はコア部１６を配置するための孔である。貫通孔３７の上面視の形状や深さ方向の形状はコア部１６の個数や大きさに応じて適宜設計することができ、コア部１６を配置する箇所に形成される。 (First insulation member preparation process)
In the present embodiment, as the first insulating member 18, an insulating sheet having a through hole 37 as shown in FIG. 2 is prepared. As the insulating sheet, for example, a resin sheet can be used. The through hole 37 is a hole for arranging the core portion 16. The shape of the through hole 37 in the top view and the shape in the depth direction can be appropriately designed according to the number and size of the core portions 16, and are formed at the locations where the core portions 16 are arranged.

第１絶縁部材１８となる絶縁性シートは、単一素材からなるものでもよいし、複数の樹脂シートを貼り合せたものや上下面に所定厚の絶縁性膜を設けた金属薄板のように複数素材からなるものでもよい。第１絶縁部材１８の厚みは、コア部１６を保持することができる厚み以上であればよい。好ましくは、コア部１６の高さの半分以上コアの高さ以下の厚みである。 The insulating sheet to be the first insulating member 18 may be made of a single material, or may be a plurality of sheets such as those obtained by laminating a plurality of resin sheets or metal thin plates having insulating films having a predetermined thickness on the upper and lower surfaces. It may be made of a material. The thickness of the first insulating member 18 may be greater than or equal to the thickness capable of holding the core portion 16. Preferably, the thickness is at least half the height of the core portion 16 and at least the height of the core.

コア部を配置するために、第１絶縁部材１８には貫通孔ではなく、凹部が形成されていてもよい。凹部の底は平坦でもよいし、または、コア部の配置を制御するために所定の位置に貫通孔若しくは凸部、あるいは貫通孔と凸部の組合せが設けられてもよい。凹部を有する絶縁性シートは、例えば１ｍｍ厚の樹脂シートに貫通孔３７を設けたものと０．１ｍｍ厚の樹脂シートを貼り合せたものを用いることができる。凹部の上面視の形状や深さ方向の形状はコア部１６の個数や大きさに応じて適宜設計することができ、コア部１６を配置する箇所に形成される。 In order to arrange the core portion, the first insulating member 18 may be formed with a recess instead of a through hole. The bottom of the recess may be flat, or a through hole or convex portion, or a combination of the through hole and the convex portion may be provided at a predetermined position in order to control the arrangement of the core portion. As the insulating sheet having a recess, for example, a 1 mm thick resin sheet provided with a through hole 37 and a 0.1 mm thick resin sheet bonded together can be used. The shape of the concave portion in the top view and the shape in the depth direction can be appropriately designed according to the number and size of the core portions 16, and are formed at the locations where the core portions 16 are arranged.

（遮光性樹脂及びコア部配置工程）
次に、第１絶縁部材１８の貫通孔３７に、複数のコア部１６及び遮光性樹脂２０を配置する。
図１に示すように、コア部１６は球状の導電体コア１２の表面全体に、光反射性の第２絶縁部材１４を有する。導電体コア１２の形状は、球状以外の形状であってもよく、表面に絶縁部材を形成しやすい形状であることが好ましい。導電体コア１２の大きさは、搭載される発光素子２４のサイズや本実施形態により得られる発光装置２００のサイズによって適宜選択可能であるが、例えば、球の場合で直径０．１～２．０ｍｍ程度とすることができる。 (Light-shielding resin and core placement process)
Next, the plurality of core portions 16 and the light-shielding resin 20 are arranged in the through holes 37 of the first insulating member 18.
As shown in FIG. 1, the core portion 16 has a light-reflecting second insulating member 14 on the entire surface of the spherical conductor core 12. The shape of the conductor core 12 may be a shape other than a spherical shape, and it is preferable that the conductor core 12 has a shape in which an insulating member can be easily formed on the surface. The size of the conductor core 12 can be appropriately selected depending on the size of the light emitting element 24 mounted and the size of the light emitting device 200 obtained by the present embodiment. For example, in the case of a sphere, the diameter is 0.1 to 2. It can be about 0 mm.

光反射性の第２絶縁部材１４は、例えば導電体コア１２の表面全体に、光反射性の第２絶縁部材１４をスプレー塗布し、焼付するという工程を必要回数繰り返すことで導電体コア１２の表面全体に形成してもよい。光反射性の第２絶縁部材１４の厚みは、例えば０．０１～０．１ｍｍ程度とすることができる。 The light-reflecting second insulating member 14 is formed by repeating the process of spray-coating the light-reflecting second insulating member 14 on the entire surface of the conductor core 12 and baking the light-reflecting second insulating member 14 as many times as necessary. It may be formed on the entire surface. The thickness of the light-reflecting second insulating member 14 can be, for example, about 0.01 to 0.1 mm.

図３に示すように、第１絶縁部材１８に形成された貫通孔３７内にて複数の略球状のコア部１６を配列する。本実施形態では６個のコア部１６を１つの貫通孔内に配列している。なお、コア部１６の位置を調整するために複数のコア部１６のうちの一部を、コア部と略同じ大きさ及び形状からなる絶縁性スペーサ部材に置き換えてもよい。 As shown in FIG. 3, a plurality of substantially spherical core portions 16 are arranged in the through holes 37 formed in the first insulating member 18. In this embodiment, six core portions 16 are arranged in one through hole. In order to adjust the position of the core portion 16, a part of the plurality of core portions 16 may be replaced with an insulating spacer member having substantially the same size and shape as the core portion.

貫通孔内で配列された、隣接するコア部１６同士は接着剤により接着されていてもよい。また、第１絶縁部材１８の貫通孔３７の内壁とコア部１６の側面が接着されていてもよい。第１絶縁部材１８とコア部１６の隙間及び隣接するコア部の隙間には、遮光性樹脂２０が配置されるため、接着は仮固定程度のものであってもよいし、貫通孔３７の内壁により仮固定されている状態であってもよい。 Adjacent core portions 16 arranged in the through hole may be adhered to each other by an adhesive. Further, the inner wall of the through hole 37 of the first insulating member 18 and the side surface of the core portion 16 may be adhered to each other. Since the light-shielding resin 20 is arranged in the gap between the first insulating member 18 and the core portion 16 and the gap between the adjacent core portions, the adhesion may be such that it is temporarily fixed, or the inner wall of the through hole 37. It may be in a state of being temporarily fixed by.

遮光性樹脂２０は、コア部１６を配列した後、第１絶縁部材１８とコア部１６の隙間及び隣接するコア部の隙間に埋め込んで配置してもよいし、遮光性樹脂２０を貫通孔内に配置した後でコア部１６を配置してもよい。 After arranging the core portions 16, the light-shielding resin 20 may be embedded in the gap between the first insulating member 18 and the core portion 16 and the gap between the adjacent core portions, or the light-shielding resin 20 may be placed in the through hole. The core portion 16 may be arranged after being arranged in.

第１絶縁部材１８の厚みよりも大きな直径のコア部１６を用い、コア部１６を貫通孔３７内に配列した後、第１絶縁部材１８の上面及び／または下面よりも厚み方向に突出しているコア部の一部をプレス等で押しつぶす等して第１絶縁部材１８の面方向にコア部１６を広げ、隣接するコア部同士又は第１絶縁部材との接触面積を増やすことで貫通孔３７からコア部１６が脱落しないようにしてもよい。これにより、接着剤を用いることなくコア部１６の脱落を抑制することができる。 After using the core portion 16 having a diameter larger than the thickness of the first insulating member 18 and arranging the core portions 16 in the through hole 37, the core portions 16 project in the thickness direction from the upper surface and / or the lower surface of the first insulating member 18. The core portion 16 is expanded in the surface direction of the first insulating member 18 by crushing a part of the core portion with a press or the like, and the contact area between the adjacent core portions or the first insulating member is increased to increase the contact area from the through hole 37. The core portion 16 may be prevented from falling off. This makes it possible to prevent the core portion 16 from falling off without using an adhesive.

コア部１６の押しつぶしは、例えばインサート成型技術でコア部１６が貫通孔３７に嵌め込まれた第１絶縁部材１８を金型で挟み込み、プレスしてコア部１６の上面及び下面を所定量つぶし、図４及び図１２に示すようにコア部の上下に平坦面１７を設けることにより形成される。この平坦面１７は、第１絶縁部材１８の上面及び下面と略面一になるように形成することができる。コア部１６を押しつぶす場合は、押しつぶし後に遮光性樹脂を配置することが好ましい。例えば、コア部の平坦面１７及び第１絶縁部材１８の上面を金型で押さえ、隙間に遮光性樹脂組成物を流入し硬化させて、図５に示すような上下面にコア部の平坦面１７が露出した平板状の基体準備体１２０を得る。 For crushing the core portion 16, for example, the first insulating member 18 in which the core portion 16 is fitted into the through hole 37 is sandwiched by a mold and pressed to crush the upper surface and the lower surface of the core portion 16 by a predetermined amount. As shown in 4 and FIG. 12, it is formed by providing flat surfaces 17 above and below the core portion. The flat surface 17 can be formed so as to be substantially flush with the upper surface and the lower surface of the first insulating member 18. When the core portion 16 is crushed, it is preferable to dispose a light-shielding resin after crushing. For example, the flat surface 17 of the core portion and the upper surface of the first insulating member 18 are pressed by a mold, the light-shielding resin composition is poured into the gap and cured, and the flat surface of the core portion is formed on the upper and lower surfaces as shown in FIG. A flat plate-shaped substrate preparation body 120 in which 17 is exposed is obtained.

（導電体コア露出工程）
次に、得られた基体準備体１２０の上下面に露出されたコア部の平坦面１７を構成する光反射性の第２絶縁部材１４を除去して、図６及び図１３に示すように導電体コア１２を基体準備体１２０の外表面（発光素子が載置される側の面（上面）及び／または下面）に露出させる。（図６では、導電体コア１２と遮光性樹脂２０の間の第２絶縁部材１４は図示省略。）
第２絶縁部材１４の除去は切削等の機械的除去あるいはエッチング等の化学的除去を用いた任意の方法で行うことができる。例えば、平坦面１７を構成する絶縁部材１４を溶剤により溶解除去し、上下面に導電体コア１２を露出させることができる。このとき、コア部１６同士が接触する領域の第２絶縁部材１４は除去せずに、平坦面１７を構成する絶縁部材１４及びコア部同士が接触しない箇所を覆う絶縁部材１４のみを除去するようにする。これにより、上下方向に導通し横方向には導通しない異方性導電体を形成する導電体コア１２が所定領域に配置された発光素子載置用基体１００を得ることができる。 (Conductor core exposure process)
Next, the light-reflecting second insulating member 14 constituting the flat surface 17 of the core portion exposed on the upper and lower surfaces of the obtained substrate preparation 120 was removed, and as shown in FIGS. 6 and 13, conductivity was obtained. The body core 12 is exposed on the outer surface of the substrate preparation body 120 (the surface (upper surface) and / or lower surface on the side on which the light emitting element is placed). (In FIG. 6, the second insulating member 14 between the conductor core 12 and the light-shielding resin 20 is not shown.)
The removal of the second insulating member 14 can be performed by any method using mechanical removal such as cutting or chemical removal such as etching. For example, the insulating member 14 constituting the flat surface 17 can be dissolved and removed with a solvent to expose the conductor core 12 on the upper and lower surfaces. At this time, the second insulating member 14 in the region where the core portions 16 contact each other is not removed, but only the insulating member 14 constituting the flat surface 17 and the insulating member 14 covering the portion where the core portions do not contact each other are removed. To. As a result, it is possible to obtain the light emitting device mounting substrate 100 in which the conductor core 12 forming the anisotropic conductor that conducts in the vertical direction and does not conduct in the lateral direction is arranged in a predetermined region.

なお、発光素子との接続領域となる領域を除く第２絶縁部材１４が除去された領域に、光反射性の高い部材を埋め込むことで、発光素子載置用基体表面の反射率を向上させることができるため好ましい。この光反射性の高い部材は前述した遮光性樹脂２０であってもよいし、遮光性樹脂２０とは別に、光反射性の高い絶縁部材を配置してもよい。 It should be noted that the reflectance of the surface of the substrate for mounting the light emitting element is improved by embedding a member having high light reflectivity in the region where the second insulating member 14 excluding the region to be the connection region with the light emitting element is removed. It is preferable because it can be used. The member having high light reflectivity may be the light-shielding resin 20 described above, or an insulating member having high light reflectivity may be arranged separately from the light-shielding resin 20.

第２絶縁部材１４を溶剤により溶解除去する場合は、第２絶縁部材１４と遮光性樹脂２０は、異なる材料または異なる樹脂であることが好ましい。第２絶縁部材１４の溶解除去により、遮光性樹脂２０を溶解しないようにするためである。 When the second insulating member 14 is dissolved and removed with a solvent, it is preferable that the second insulating member 14 and the light-shielding resin 20 are made of different materials or different resins. This is to prevent the light-shielding resin 20 from being dissolved by dissolving and removing the second insulating member 14.

以上のように形成された発光素子載置用基体１００は、その上面及び下面に、導電体コア１２、遮光性樹脂２０が露出されている。言い換えると、発光素子載置用基体１００の上面及び下面は、導電体コア１２、遮光性樹脂２０、第１絶縁部材１８によって形成されている。また、本実施形態においては、遮光性樹脂２０は第１絶縁部材１８によって囲まれている。 In the light emitting element mounting substrate 100 formed as described above, the conductor core 12 and the light-shielding resin 20 are exposed on the upper surface and the lower surface thereof. In other words, the upper surface and the lower surface of the light emitting element mounting substrate 100 are formed of the conductor core 12, the light-shielding resin 20, and the first insulating member 18. Further, in the present embodiment, the light-shielding resin 20 is surrounded by the first insulating member 18.

（金属膜形成工程）
発光素子載置用基体１００の外表面の導電体コア１２が露出された部分の所定の領域に、メッキやスパッタ等によって金属膜２２を形成して配置してもよい。例えば、上面の所定の領域に、メタルマスクやフォトレジストマスクを用いスパッタにより金属膜２２を形成する。その後、下面の所定の領域に、メタルマスクやフォトレジストマスクを用いスパッタにより金属膜２２を形成することができる。本実施形態においては、図７及び図１４Ａ～図１４Ｄに示すように複数の導電体コア１２の露出面をつなげるように、導電体コア１２の露出面、遮光性樹脂２０の表面に金属膜２２を形成している。具体的には、上述の複数のコア部１６が直線状に配列された２つのコア部１６からなるコア部の組を繋ぐように、１つの金属膜２２が配置されている。金属膜２２の材料としては、金属膜２２が発光素子２４又は発光装置の外部と接続端子（コネクタ）等を介して接続されることから、導電性の高いものや、機械的及び電気的な接続性が高いものが好ましい。また、発光素子２４が載置される面となる上面側の金属膜２２には、光反射性の高い材料（例えばＡｇ等）を用いることが好ましい。金属膜は全ての導電体コアの露出面に形成しなくてもよく、必要な箇所に形成されていればよい。 (Metal film forming process)
A metal film 22 may be formed and arranged by plating, sputtering, or the like in a predetermined region of a portion where the conductor core 12 on the outer surface of the light emitting element mounting substrate 100 is exposed. For example, a metal film 22 is formed by sputtering using a metal mask or a photoresist mask in a predetermined region on the upper surface. After that, the metal film 22 can be formed in a predetermined region on the lower surface by sputtering using a metal mask or a photoresist mask. In the present embodiment, as shown in FIGS. 7 and 14A to 14D, a metal film 22 is formed on the exposed surface of the conductor core 12 and the surface of the light-shielding resin 20 so as to connect the exposed surfaces of the plurality of conductor cores 12. Is forming. Specifically, one metal film 22 is arranged so as to connect a set of core portions composed of two core portions 16 in which the plurality of core portions 16 described above are linearly arranged. As the material of the metal film 22, since the metal film 22 is connected to the outside of the light emitting element 24 or the light emitting device via a connection terminal (connector) or the like, a highly conductive material or mechanical and electrical connection is made. Those with high properties are preferable. Further, it is preferable to use a material having high light reflectivity (for example, Ag or the like) for the metal film 22 on the upper surface side on which the light emitting element 24 is placed. The metal film does not have to be formed on the exposed surface of all the conductor cores, and may be formed at a necessary place.

（発光素子載置工程）
このようにして得られた金属膜付発光素子載置用基体の上面に、図８に示すように複数の発光素子２４を載置する。本実施形態においては、正負一対の電極を一つの面に備える発光素子２４を、その電極が配置された面を発光素子載置用基体１００の側に向け発光素子載置用基体１００の上面にフリップチップ実装する。この時、一つの金属膜２２と一つの発光素子２４の正または負の電極がそれぞれ電気的に接続される。発光素子載置用基体１００と発光素子２４との間の導電接続手段としては、半田や異方性導電ペースト等を用いることができる。これにより発光装置集合体１２２とする。 (Light emitting element mounting process)
As shown in FIG. 8, a plurality of light emitting elements 24 are mounted on the upper surface of the light emitting element mounting substrate with a metal film thus obtained. In the present embodiment, the light emitting element 24 having a pair of positive and negative electrodes on one surface is placed on the upper surface of the light emitting element mounting substrate 100 with the surface on which the electrodes are arranged facing toward the light emitting element mounting substrate 100. Flip chip mounting. At this time, the positive or negative electrodes of one metal film 22 and one light emitting element 24 are electrically connected to each other. As the conductive connection means between the light emitting element mounting substrate 100 and the light emitting element 24, solder, an anisotropic conductive paste, or the like can be used. As a result, the light emitting device aggregate 122 is obtained.

発光素子２４を複数有する発光装置２００とする場合は、並列、直列等所望の接続方法になるように金属膜２２を配置する。図８では３つの発光素子２４が直列接続になるように金属膜２２が配置され、その上に発光素子２４が実装されている。個片化後の発光装置２００の外部電極端子とするため、金属膜付発光素子載置用基体の下面の所定領域で導電体コア１２又は導電体コア１２に導通する金属膜２２が露出する。 In the case of a light emitting device 200 having a plurality of light emitting elements 24, the metal film 22 is arranged so as to have a desired connection method such as parallel or series. In FIG. 8, the metal film 22 is arranged so that the three light emitting elements 24 are connected in series, and the light emitting element 24 is mounted on the metal film 22. The metal film 22 conductive to the conductor core 12 or the conductor core 12 is exposed in a predetermined region on the lower surface of the light emitting element mounting substrate with a metal film so as to serve as an external electrode terminal of the light emitting device 200 after being individualized.

発光装置集合体１２２は、発光素子２４を被覆する封止材を有していてもよい。例えば、図１０に示すように、封止材２６で、発光素子２４と発光素子載置用基体１００の上面（発光素子を載置した面）を被覆して封止する。
本実施形態では、発光素子載置用基体を大面積化することにより、一括して発光素子の載置や封止等の処理ができる発光装置数を増やし、これにより製造コストを抑制することができる。 The light emitting device assembly 122 may have a sealing material for covering the light emitting element 24. For example, as shown in FIG. 10, the sealing material 26 covers and seals the upper surface (the surface on which the light emitting element is mounted) of the light emitting element 24 and the light emitting element mounting substrate 100.
In the present embodiment, by increasing the area of the light emitting element mounting substrate, the number of light emitting devices capable of collectively mounting and sealing the light emitting element can be increased, thereby suppressing the manufacturing cost. can.

（個片化工程）
そして、発光装置集合体１２２を所定の切断線に沿って少なくとも２以上のコア部を含むように切断／分割し、個片化して、図１１で示すような発光装置２００とする。切断／分割線は、導電体コア１２を切断／分割しない位置に設けられることが好ましい。例えば、第１絶縁部材１８のみ又は第１絶縁部材１８および封止材２６を切断する位置に設けられることが好ましい。発光装置集合体１２２を切断／分割して個片化する切断／分割線上の金属部材の割合が高いと、個片化コストの増大を引き起こす。例えば、金型で打抜く方法又はダイサーで切断する方法などでは、刃物の消耗が樹脂の場合より速くなるし、第１絶縁部材を例えばガラエポのような素材とするとブレーキングができるが、切断／分割領域に金属部材があるとブレーキングが難しい。本実施形態では、あらかじめ分離された導電体コア１２を一体に固定して発光素子載置用基体１００として用いることで、金属材料を切断しないように個片化を行うことができる。これにより、切断が高速にでき、また切断刃の消耗が少ないので生産性を高くできる。 (Individualization process)
Then, the light emitting device aggregate 122 is cut / divided along a predetermined cutting line so as to include at least two or more core portions, and is separated into individual pieces to obtain a light emitting device 200 as shown in FIG. The cutting / dividing line is preferably provided at a position where the conductor core 12 is not cut / divided. For example, it is preferable that it is provided at a position where only the first insulating member 18 or the first insulating member 18 and the sealing material 26 are cut. A high proportion of metal members on the cutting / dividing line that cuts / divides the light emitting device assembly 122 into individual pieces causes an increase in the cost of individualizing. For example, in the method of punching with a die or the method of cutting with a dicer, the blade wears faster than in the case of resin, and if the first insulating member is made of a material such as Gala Epo, braking can be performed, but cutting / Braking is difficult if there is a metal member in the divided area. In the present embodiment, by integrally fixing the conductor core 12 separated in advance and using it as the light emitting element mounting substrate 100, it is possible to perform individualization without cutting the metal material. As a result, cutting can be performed at high speed, and the cutting blade is less consumed, so that productivity can be increased.

このようにして製造された発光素子載置用基体１００は、あらかじめ分離された球状の導電体コア１２を用いることにより、大面積の発光素子載置用基体を容易に作製可能となる。
また、発光素子２４直下の導電体コア１２が光反射性の絶縁部材１４で被覆され、その上に金属膜２２を形成することで、放熱経路（発光素子２４直下の導電体コア１２）と通電経路（発光素子２４の外側で金属膜２２と電気的に接続される導電体コア１２）の分離設計が容易になるため好ましい。 The light emitting element mounting substrate 100 manufactured in this manner can easily produce a large area light emitting element mounting substrate by using the spherical conductor core 12 separated in advance.
Further, the conductor core 12 directly under the light emitting element 24 is covered with a light-reflecting insulating member 14, and a metal film 22 is formed on the conductor core 12 to energize the heat radiation path (conductor core 12 directly under the light emitting element 24). It is preferable because it facilitates the separation design of the path (conductor core 12 electrically connected to the metal film 22 on the outside of the light emitting element 24).

（変形例）
コア部１６及び遮光性樹脂２０の配置後、発光素子の封止工程の前までの任意の工程で封止材２６を配置するための凹部を形成するための枠体形成工程を有していてもよい。
例えば、金属膜２２の形成後に、図９に示すように枠体４０を形成してもよい。枠体４０は、図７で示すような発光素子載置用基体１００の上面に形成され、枠体４０と発光素子載置用基体１００の上面とで構成される凹部の底面に、コア部１６が配置されるように形成される。枠体４０は図９に示すように、１つ１つが隣接した枠体と接さないように離間して形成されていてもよいし、凹部の上面が隣接する凹部の上面と連結されていてもよい。そして枠体４０の形成後に、導電体コア露出工程、金属膜形成工程、発光素子載置工程を経て、枠体４０内に封止材を配置し、個片化して発光装置を得る。個片化の際は、枠体４０を切断しないように、隣接する枠体４０間の第１絶縁部材１８を切断することが好ましい。 (Modification example)
It has a frame forming step for forming a recess for arranging the sealing material 26 in an arbitrary step after the arrangement of the core portion 16 and the light-shielding resin 20 and before the sealing step of the light emitting element. May be good.
For example, after the metal film 22 is formed, the frame 40 may be formed as shown in FIG. The frame body 40 is formed on the upper surface of the light emitting element mounting base 100 as shown in FIG. 7, and the core portion 16 is formed on the bottom surface of the recess formed by the frame body 40 and the upper surface of the light emitting element mounting base 100. Is formed so as to be arranged. As shown in FIG. 9, the frame bodies 40 may be formed so as to be separated from each other so as not to come into contact with the adjacent frame bodies, or the upper surface of the recess is connected to the upper surface of the adjacent recess. May be good. Then, after the frame body 40 is formed, a sealing material is arranged in the frame body 40 through a conductor core exposure step, a metal film forming step, and a light emitting element mounting step, and the frame body 40 is individualized to obtain a light emitting device. At the time of individualization, it is preferable to cut the first insulating member 18 between the adjacent frame bodies 40 so as not to cut the frame body 40.

以下に、実施の形態の発光装置の各構成部材に適した材料等について説明する。
（コア部）
コア部は少なくとも、導電体コアと、光反射性の絶縁部材を備える。例えば、光反射性の絶縁皮膜付金属コア、光反射性の絶縁皮膜付金属球、あるいは、光反射性の絶縁皮膜付グラファイト球などである。コア部の表面は、遮光性樹脂との接合力を高めるため、細かな凹凸形状を有してもよい。 Hereinafter, materials and the like suitable for each component of the light emitting device of the embodiment will be described.
(Core part)
The core portion includes at least a conductor core and a light-reflecting insulating member. For example, a metal core with a light-reflecting insulating film, a metal ball with a light-reflecting insulating film, a graphite ball with a light-reflecting insulating film, and the like. The surface of the core portion may have a fine uneven shape in order to enhance the bonding force with the light-shielding resin.

（導電体コア）
導電体コアは、発光装置の電極および／または放熱経路として用いられる部材である。そのため、材料は、電気良導体の金属等を用いることができる。例えば、Ｃｕ、Ａｌ、Ａｇ、Ａｕ、Ｐｔ、Ｐｄ、Ｒｈ等の金属又はそれらの合金、あるいはグラファイト等の炭素素材を用いることができる。導電体コアは、発光素子載置用基体に搭載される発光素子から発せられる光を、例えば７０％、好ましくは８０％以上反射するものが好ましい。例えば、発光素子が青色系の発光をする場合には、Ａｌ、Ａｇ等を用いることが好ましい。 (Conductor core)
The conductor core is a member used as an electrode of a light emitting device and / or a heat dissipation path. Therefore, as the material, a metal or the like having a good electric conductor can be used. For example, a metal such as Cu, Al, Ag, Au, Pt, Pd, Rh or an alloy thereof, or a carbon material such as graphite can be used. The conductor core preferably reflects, for example, 70%, preferably 80% or more of the light emitted from the light emitting element mounted on the light emitting element mounting substrate. For example, when the light emitting element emits blue light, it is preferable to use Al, Ag, or the like.

導電体コアは、その全体が同じ組成であってもよいし、組成の異なる複数の領域を有していてもよい。例えば、第１の金属部を覆うように第２の金属部をメッキ等により成膜することで２種以上の材料からなる多層構造としてもよい。また、内部に空孔など絶縁材を有してもよいし、撚り線やリッツ線のような異方性導電体でもよい。 The conductor core may have the same composition as a whole, or may have a plurality of regions having different compositions. For example, a multilayer structure made of two or more kinds of materials may be formed by forming a film on the second metal portion by plating or the like so as to cover the first metal portion. Further, an insulating material such as a hole may be provided inside, or an anisotropic conductor such as a stranded wire or a litz wire may be used.

導電体コアの形状は、例えば、円柱、角柱（多面体）、球（楕円体含む）、円管（円筒）、またはこれらに近似した立体形状があげられる。スルーホールやキャスタレーション等の発光素子載置用基体に設ける構造に応じ、適宜導電体コアの形状は選択される。 Examples of the shape of the conductor core include a cylinder, a prism (polyhedron), a sphere (including an ellipsoid), a circular tube (cylinder), or a three-dimensional shape similar thereto. The shape of the conductor core is appropriately selected according to the structure provided on the light emitting element mounting substrate such as through holes and castings.

導電体コアは、その一部が発光素子載置用基体の表面に露出しており、その露出された部分において、ワイヤや半田などの接合部材を用いて発光素子と電気的に接続される。そのため、導電体コアの大きさや形状は、露出部が発光素子との接続に適切な面積及び形であることが好ましい。例えば、発光素子載置用基体の上面及び下面と略面一になるように、導電体コアが露出されていることが好ましい。導電体コアの露出部分を覆うように、後述する金属膜が設けられる場合は、接合部材を介して金属膜と発光素子とが接続される。 A part of the conductor core is exposed on the surface of the light emitting element mounting substrate, and the exposed portion is electrically connected to the light emitting element by using a bonding member such as a wire or solder. Therefore, the size and shape of the conductor core are preferably such that the exposed portion has an area and shape suitable for connection with the light emitting element. For example, it is preferable that the conductor core is exposed so as to be substantially flush with the upper surface and the lower surface of the light emitting element mounting substrate. When a metal film described later is provided so as to cover the exposed portion of the conductor core, the metal film and the light emitting element are connected via a joining member.

発光素子載置用基体に載置される発光素子は、導電体コア、光反射性の絶縁部材、遮光性樹脂のいずれと接していてもよい。発光素子が導電体コア上に載置されることにより、発光素子が生じる熱の放熱性を高めることができる。また、半田等の導電性の接合部材を介して導電体コアと発光素子の電極を直接接続することで、ワイヤを必要とせずに発光装置を小型にすることが可能となる。 The light emitting element mounted on the light emitting element mounting substrate may be in contact with any of a conductor core, a light-reflecting insulating member, and a light-shielding resin. By placing the light emitting element on the conductor core, it is possible to enhance the heat dissipation of the heat generated by the light emitting element. Further, by directly connecting the conductor core and the electrode of the light emitting element via a conductive bonding member such as solder, it is possible to reduce the size of the light emitting device without requiring a wire.

導電体コアを発光装置の電極として用いるために、１つの発光素子載置用基体に対してコア部が複数設けられる。発光装置の電極として用いるためには最小で２つの導電体コアを発光装置の基体が有していればよい。また、複数の導電体コアを発光装置の電極の一つとして用いてもよい。例えば、隣接して配置された導電体コアの上にわたって発光素子の電極を導電性の接合部材を介して載置してもよい。導電体コアを備えたコア部の並び方を変更することで、発光素子載置用基体内の導電部の配置を適宜変更することができるため、発光素子載置用基体の設計の自由度を高めることができる。 In order to use the conductor core as an electrode of the light emitting device, a plurality of core portions are provided for one light emitting element mounting substrate. In order to use it as an electrode of a light emitting device, it is sufficient that the substrate of the light emitting device has at least two conductor cores. Further, a plurality of conductor cores may be used as one of the electrodes of the light emitting device. For example, the electrodes of the light emitting element may be placed on the conductor cores arranged adjacent to each other via the conductive bonding member. By changing the arrangement of the core portions provided with the conductor cores, the arrangement of the conductive portions in the light emitting element mounting substrate can be appropriately changed, thus increasing the degree of freedom in designing the light emitting element mounting substrate. be able to.

導電体コアは、発光素子載置用基体の上面及び下面に露出される。１つの導電体コアが、上面及び下面の２箇所において露出されていてもよく、上面と下面で別々の導電体コアが露出されていてもよい。発光素子が接合されている導電体コアを基体の外部端子として用いることで、放熱特性を向上させることができる。 The conductor core is exposed on the upper surface and the lower surface of the light emitting element mounting substrate. One conductor core may be exposed at two locations on the upper surface and the lower surface, or different conductor cores may be exposed on the upper surface and the lower surface. By using the conductor core to which the light emitting element is bonded as the external terminal of the substrate, the heat dissipation characteristics can be improved.

導電体コアを電極として用いずに放熱経路として用いる場合には、導電体コアと発光素子とが電気的に接続されていなくてもよく、導電体コアが発光素子載置用基体の表面に露出されていることも必ずしも必要ではない。導電体コアは、発光素子からの熱を外部に放出しやすいように、熱源となる発光素子近傍から発光素子載置用基体の表面近傍まで繋がって配置されていることが好ましい。 When the conductor core is used as a heat dissipation path without using it as an electrode, the conductor core and the light emitting element do not have to be electrically connected, and the conductor core is exposed on the surface of the light emitting element mounting substrate. It is not always necessary to be done. The conductor core is preferably arranged so as to be connected from the vicinity of the light emitting element, which is a heat source, to the vicinity of the surface of the light emitting element mounting substrate so that the heat from the light emitting element can be easily released to the outside.

（第１絶縁部材）
第１絶縁部材の材料としては、コストや製造容易性から、樹脂を母材とした材料が好ましい。母材となる樹脂としては、熱硬化性樹脂、熱可塑性樹脂などが挙げられる。具体的には、エポキシ樹脂組成物、シリコーン樹脂組成物、シリコーン変性エポキシ樹脂などの変性エポキシ樹脂組成物；エポキシ変性シリコーン樹脂などの変性シリコーン樹脂組成物；ポリイミド樹脂組成物、変性ポリイミド樹脂組成物；ポリフタルアミド（ＰＰＡ）；ポリカーボネート樹脂；ポリフェニレンサルファイド（ＰＰＳ）；液晶ポリマー（ＬＣＰ）；ＡＢＳ樹脂；フェノール樹脂；アクリル樹脂；ＰＢＴ樹脂；ポリプロピレン樹脂（ＰＰ）；ポリアミド（ＰＡ）６、ＰＡ６６；ポリフェニレンスルファイド樹脂（ＰＰＳ）；ポリエーテルエーテルケトン樹脂（ＰＥＥＫ）等の樹脂が挙げられる。なお、母材の材料は樹脂に限られず、ガラス、ガラエポ、セラミックグリーンシート等の他の材料を用いてもよい。 (First insulating member)
As the material of the first insulating member, a material using a resin as a base material is preferable from the viewpoint of cost and ease of manufacture. Examples of the resin used as the base material include thermosetting resins and thermoplastic resins. Specifically, modified epoxy resin compositions such as epoxy resin compositions, silicone resin compositions, and silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); polycarbonate resin; polyphenylene sulfide (PPS); liquid crystal polymer (LCP); ABS resin; phenol resin; acrylic resin; PBT resin; polypropylene resin (PP); polyamide (PA) 6, PA66; polyphenylene sulfide Examples thereof include resins such as Fido resin (PPS); polyether ether ketone resin (PEEK). The material of the base material is not limited to resin, and other materials such as glass, glass epoxy, and ceramic green sheet may be used.

光反射性を付与するために、これらの母材等に、例えば、二酸化チタン、二酸化ケイ素、二酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライト、酸化ニオブ、各種希土類酸化物（例えば、酸化イットリウム、酸化ガドリニウム）などの光反射材（粒子状、繊維状など）が添加されてもよい。搭載する発光素子の発光波長に対して反射率が高いことが好ましく、例えば搭載する発光素子からの出射光に対する反射率が４４０ｎｍ～６３０ｎｍの領域で平均７０％以上となるように設定されることが好ましい。また、４４０ｎｍ～６３０ｎｍの領域で、用いる導電体コアよりも平均反射率が高いことが好ましい。 In order to impart light reflectivity, for example, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, and various rare earth oxides (for example) are added to these base materials and the like. , Yttrium oxide, gadolinium oxide) and other light reflective materials (particulate, fibrous, etc.) may be added. It is preferable that the reflectance is high with respect to the emission wavelength of the mounted light emitting element. For example, the reflectance with respect to the emitted light from the mounted light emitting element may be set to be 70% or more on average in the region of 440 nm to 630 nm. preferable. Further, it is preferable that the average reflectance is higher than that of the conductor core used in the region of 440 nm to 630 nm.

（光反射性の第２絶縁部材）
本実施形態において、光反射性の第２絶縁部材は、導電体コアの側面を被覆する。光反射性の第２絶縁部材は、単層でもよいし複数の層が積層された構造であってもよい。複数の層が積層される場合には、導電体コアに近い側に熱硬化性樹脂の膜、最外周に接着層を備えると、コア部の集合体を作る際に接着材が不要となるか、または少量で済むため、生産性が良い。 (Light-reflecting second insulating member)
In the present embodiment, the light-reflecting second insulating member covers the side surface of the conductor core. The light-reflecting second insulating member may have a single layer or a structure in which a plurality of layers are laminated. When a plurality of layers are laminated, if a thermosetting resin film is provided on the side close to the conductor core and an adhesive layer is provided on the outermost periphery, does the adhesive material become unnecessary when forming the aggregate of the core portion? , Or a small amount, so productivity is good.

光反射性の第２絶縁部材は例えば導電体コアの側面に、単層膜状あるいは多層膜状で略均一な厚みで形成される。光反射性の第２絶縁部材の膜厚は、例えば、数μｍ～数百μｍがあげられる。数十μｍ程度であれば、絶縁性の確保と、発光装置（発光素子載置用基体）の小型化を両立することができ、好ましい。光反射性の第２絶縁部材は、導電体コアの側面に略均一な厚みで形成されていてもよく、一部の厚みが他の箇所よりも厚く形成されていてもよい。 The light-reflecting second insulating member is formed, for example, on the side surface of the conductor core in the form of a single-layer film or a multilayer film with a substantially uniform thickness. The film thickness of the light-reflecting second insulating member may be, for example, several μm to several hundred μm. When it is about several tens of μm, it is possible to secure the insulating property and to reduce the size of the light emitting device (base for mounting the light emitting element), which is preferable. The light-reflecting second insulating member may be formed on the side surface of the conductor core with a substantially uniform thickness, or a part of the second insulating member may be formed to be thicker than other parts.

発光素子載置用基体の上面及び下面に位置し、外部に露出される導電体コアは、光反射性の第２絶縁部材からも露出されており、基体の上面及び下面において、光反射性の第２絶縁部材は導電体コアの周囲に配置されている。複数の導電体コアの間に光反射性の第２絶縁部材を有することで、複数の導電体コアが互いに絶縁された状態で配置される。 The conductor core, which is located on the upper surface and the lower surface of the light emitting element mounting substrate and is exposed to the outside, is also exposed from the light-reflecting second insulating member, and is light-reflecting on the upper surface and the lower surface of the substrate. The second insulating member is arranged around the conductor core. By having the light-reflecting second insulating member between the plurality of conductor cores, the plurality of conductor cores are arranged in a state of being insulated from each other.

光反射性の第２絶縁部材の材料としては、コストや製造容易性から、樹脂を母材とした材料が好ましい。母材となる樹脂としては、熱硬化性樹脂、熱可塑性樹脂などが挙げられる。具体的には、エポキシ樹脂組成物、シリコーン樹脂組成物、シリコーン変性エポキシ樹脂などの変性エポキシ樹脂組成物；エポキシ変性シリコーン樹脂などの変性シリコーン樹脂組成物；ポリイミド樹脂組成物、変性ポリイミド樹脂組成物；ポリフタルアミド（ＰＰＡ）；ポリカーボネート樹脂；ポリフェニレンサルファイド（ＰＰＳ）；液晶ポリマー（ＬＣＰ）；ＡＢＳ樹脂；フェノール樹脂；アクリル樹脂；ＰＢＴ樹脂；ポリプロピレン樹脂（ＰＰ）；ポリアミド（ＰＡ）６、ＰＡ６６；ポリフェニレンスルファイド樹脂（ＰＰＳ）；ポリエーテルエーテルケトン樹脂（ＰＥＥＫ）等の樹脂が挙げられる。なお、母材の材料は樹脂に限られず、ガラス等の他の材料を用いてもよい。 As the material of the light-reflecting second insulating member, a material using a resin as a base material is preferable from the viewpoint of cost and ease of manufacture. Examples of the resin used as the base material include thermosetting resins and thermoplastic resins. Specifically, modified epoxy resin compositions such as epoxy resin compositions, silicone resin compositions, and silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); polycarbonate resin; polyphenylene sulfide (PPS); liquid crystal polymer (LCP); ABS resin; phenol resin; acrylic resin; PBT resin; polypropylene resin (PP); polyamide (PA) 6, PA66; polyphenylene sulfide Examples thereof include resins such as Fido resin (PPS); polyether ether ketone resin (PEEK). The material of the base material is not limited to resin, and other materials such as glass may be used.

光反射性を付与するために、これらの母材等に、例えば、二酸化チタン、二酸化ケイ素、二酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライト、酸化ニオブ、各種希土類酸化物（例えば、酸化イットリウム、酸化ガドリニウム）などの光反射材（粒子状、繊維状など）が添加されてもよい。搭載する発光素子の発光波長に対して反射率が高いことが好ましく、例えば搭載する発光素子からの出射光に対する反射率が４４０ｎｍ～６３０ｎｍの領域で平均７０％以上となるように設定されることが好ましい。また、４４０ｎｍ～６３０ｎｍの領域で、用いる導電体コアよりも平均反射率が高いことが好ましい。 In order to impart light reflectivity, for example, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, and various rare earth oxides (for example) are added to these base materials and the like. , Yttrium oxide, gadolinium oxide) and other light reflective materials (particulate, fibrous, etc.) may be added. It is preferable that the reflectance is high with respect to the emission wavelength of the mounted light emitting element. For example, the reflectance with respect to the emitted light from the mounted light emitting element may be set to be 70% or more on average in the region of 440 nm to 630 nm. preferable. Further, it is preferable that the average reflectance is higher than that of the conductor core used in the region of 440 nm to 630 nm.

光反射性の第２絶縁部材は、あらかじめ導電体コアの一部を露出するように形成してもよいし、導電体コアの周囲全面を光反射性の第２絶縁部材で覆い、その後、光反射性の第２絶縁部材の一部を除去することで導電体コアの表面を第２絶縁部材から露出させてもよい。後で除去する場合、例えば、光反射性の第２絶縁部材の母材として熱硬化性樹脂を、遮光性樹脂として熱可塑性樹脂を用いると、薬剤による溶解速度の差を利用し、光反射性の絶縁部材を選択的に薬剤で溶解させることができるので、切削除去のみならず溶解除去が可能となる。薬剤としては、例えばEPOTHROUGH、KSR、DYNASOLVEなどがあげられる。 The light-reflecting second insulating member may be formed so as to expose a part of the conductor core in advance, or the entire periphery of the conductor core is covered with the light-reflecting second insulating member, and then light is emitted. The surface of the conductor core may be exposed from the second insulating member by removing a part of the reflective second insulating member. When it is removed later, for example, if a thermosetting resin is used as the base material of the light-reflecting second insulating member and a thermoplastic resin is used as the light-shielding resin, the difference in the dissolution rate due to the chemicals is used to utilize the light-reflecting property. Since the insulating member of the above can be selectively dissolved with a chemical, not only cutting removal but also dissolution removal is possible. Examples of the drug include EPOTHROUGH, KSR, DYNASOLVE and the like.

（遮光性樹脂）
遮光性樹脂は、複数のコア部を一体に固定する絶縁部材である。
遮光性とは、発光素子からの光（主として可視光）の例えば７０％を遮光可能であり、好ましくは９０％、さらに好ましくは９５％以上を遮光可能であることを意味する。光を反射するものであってもよく、光を吸収するものであってもよい。例えば白色または黒色である。これにより、樹脂母材の光劣化を抑制することができる。
遮光性樹脂としては、熱硬化性樹脂、熱可塑性樹脂などが挙げられる。これらの樹脂には、搭載される発光素子の光に対して遮光性を有するために、光反射材、光吸収材等が添加される。これら添加材は粒子状、繊維状等であってもよい。遮光性樹脂は単一の材料から構成されてもよいし複数の異なる材料から構成されてもよく、また、複数のコア部の間のみならず上部あるいは下部に突出していてもよい。 (Light-shielding resin)
The light-shielding resin is an insulating member that integrally fixes a plurality of core portions.
The light-shielding property means that, for example, 70% of the light (mainly visible light) from the light emitting element can be shielded, preferably 90%, and more preferably 95% or more can be shielded. It may be one that reflects light or one that absorbs light. For example, white or black. This makes it possible to suppress photodegradation of the resin base material.
Examples of the light-shielding resin include thermosetting resins and thermoplastic resins. A light reflecting material, a light absorbing material, or the like is added to these resins in order to have a light blocking effect with respect to the light of the mounted light emitting element. These additives may be in the form of particles, fibers, or the like. The light-shielding resin may be composed of a single material, a plurality of different materials, and may project not only between the plurality of core portions but also in the upper portion or the lower portion.

発光素子の近傍（特に発光素子に接する、または対向する箇所）に位置する樹脂に照射される光密度は非常に高く、発光装置の駆動とともに樹脂の劣化や変色を引き起こして発光装置の発光効率を低下させるおそれがある。発光素子直下に位置する樹脂を遮光性とすることで、当該樹脂の光劣化を抑制し、発光装置の発光効率を維持することができる。 The light density applied to the resin located in the vicinity of the light emitting element (particularly the location in contact with or facing the light emitting element) is extremely high, and the light emitting device is driven, causing deterioration and discoloration of the resin to improve the luminous efficiency of the light emitting device. May reduce. By making the resin located directly under the light emitting element light-shielding, it is possible to suppress photodegradation of the resin and maintain the luminous efficiency of the light emitting device.

遮光性樹脂の母材となる樹脂としては、熱硬化性樹脂、熱可塑性樹脂などが挙げられる。具体的には、エポキシ樹脂組成物、シリコーン樹脂組成物、シリコーン変性エポキシ樹脂などの変性エポキシ樹脂組成物；エポキシ変性シリコーン樹脂などの変性シリコーン樹脂組成物；ポリイミド樹脂組成物、変性ポリイミド樹脂組成物；ポリフタルアミド（ＰＰＡ）；ポリカーボネート樹脂；ポリフェニレンサルファイド（ＰＰＳ）；液晶ポリマー（ＬＣＰ）；ＡＢＳ樹脂；フェノール樹脂；アクリル樹脂；ＰＢＴ樹脂；ポリプロピレン樹脂（ＰＰ）；ポリアミド（ＰＡ）６、ＰＡ６６；ポリフェニレンスルファイド樹脂（ＰＰＳ）；ポリエーテルエーテルケトン樹脂（ＰＥＥＫ）等の樹脂が挙げられる。 Examples of the resin used as the base material of the light-shielding resin include thermosetting resins and thermoplastic resins. Specifically, modified epoxy resin compositions such as epoxy resin compositions, silicone resin compositions, and silicone-modified epoxy resins; modified silicone resin compositions such as epoxy-modified silicone resins; polyimide resin compositions, modified polyimide resin compositions; Polyphthalamide (PPA); polycarbonate resin; polyphenylene sulfide (PPS); liquid crystal polymer (LCP); ABS resin; phenol resin; acrylic resin; PBT resin; polypropylene resin (PP); polyamide (PA) 6, PA66; polyphenylene sulfide Examples thereof include resins such as Fido resin (PPS); polyether ether ketone resin (PEEK).

これらの樹脂中に、光反射材が添加されることが好ましく、光反射材としては、発光素子からの光を吸収しにくく、かつ母材となる樹脂に対する屈折率差の大きい反射部材（例えばＴｉＯ2，Ａｌ2Ｏ3，ＺｒＯ2，ＭｇＯ）等の粉末を分散することで、効率よく光を反射させることができる。 It is preferable to add a light-reflecting material to these resins, and the light-reflecting material is a reflective member (for example, TIO) that is difficult to absorb light from a light emitting element and has a large difference in refractive index with respect to the resin as a base material. 2 , Al 2 O 3 , ZrO 2 , MgO) and other powders can be dispersed to efficiently reflect light.

（枠体）
枠体としては、前述した遮光性樹脂と同様の材料を用いることができる。また、遮光性樹脂と同様に光反射材を含有していることが好ましい。また、誘電体多層膜や絶縁膜と金属膜からなる多層膜を用いることもできる。 (Frame body)
As the frame, the same material as the light-shielding resin described above can be used. Further, it is preferable that the light reflecting material is contained as in the light-shielding resin. Further, a dielectric multilayer film or a multilayer film composed of an insulating film and a metal film can also be used.

（金属膜）
発光素子載置用基体の上面及び下面に露出された導電体コアの表面には、メッキ等により金属膜が形成されていてもよい。発光素子が載置される側となる発光素子載置用基体の上面側の金属膜は、発光素子からの光に対する反射率が高い金属を用いることが好ましい。また、発光装置の外部電極となる発光素子載置用基体の下面側の金属膜は、半田との濡れ性が良好な金属を用いることが好ましい。最表面の金属膜と導電体コアとの密着性を考慮して下地層となる金属膜を有していてもよく、金属膜は多層構造を有していてもよい。 (Metal film)
A metal film may be formed on the surface of the conductor core exposed on the upper surface and the lower surface of the light emitting element mounting substrate by plating or the like. It is preferable to use a metal having a high reflectance with respect to the light from the light emitting element for the metal film on the upper surface side of the light emitting element mounting substrate on which the light emitting element is mounted. Further, it is preferable to use a metal having good wettability with solder for the metal film on the lower surface side of the light emitting element mounting substrate which is the external electrode of the light emitting device. The metal film as the base layer may be provided in consideration of the adhesion between the metal film on the outermost surface and the conductor core, and the metal film may have a multilayer structure.

金属膜は、導電体コアの表面のみならず、光反射性の絶縁部材や遮光性部材の表面に形成されていてもよい。例えば、発光素子の載置部となる少なくとも一つの導電体コアの上に、発光素子載置用基体の表面に露出された導電体コアの表面と、その外側の絶縁部材及び遮光性部材の表面にわたって金属膜を設ける。このような金属膜を設けることにより、発光素子からの熱を発光装置の基部の水平方向へ広げることができる。 The metal film may be formed not only on the surface of the conductor core but also on the surface of the light-reflecting insulating member or the light-shielding member. For example, the surface of the conductor core exposed on the surface of the light emitting element mounting substrate on the at least one conductor core serving as the mounting portion of the light emitting element, and the surface of the insulating member and the light shielding member outside the surface of the conductor core. A metal film is provided over the area. By providing such a metal film, the heat from the light emitting element can be spread in the horizontal direction at the base of the light emitting device.

また、金属膜は２以上の導電体コアを電気的に接続する配線層として機能していてもよい。例えば、隣接する導電体コアを繋ぐようにそれぞれの導電体コアの表面と、導電体コアと導電体コアの間に位置する絶縁部材及び遮光性部材を金属膜で被覆する。これにより、直列または並列の配線を形成することが可能となり、発光装置の基体の設計自由度が向上する。例えば、複数の発光素子を直列に接続し、駆動電圧を高めて駆動電流を下げることで、電圧低下（電力損失）を抑制し、光源としてのエネルギー効率を高めることができる。
金属膜は、後述する遮光性樹脂の形成後に設けられてもよく、遮光性樹脂の形成前に導電体コアに設けてもよい。 Further, the metal film may function as a wiring layer for electrically connecting two or more conductor cores. For example, the surface of each conductor core and the insulating member and the light-shielding member located between the conductor core and the conductor core are covered with a metal film so as to connect the adjacent conductor cores. This makes it possible to form series or parallel wiring, and the degree of freedom in designing the substrate of the light emitting device is improved. For example, by connecting a plurality of light emitting elements in series to increase the drive voltage and decrease the drive current, it is possible to suppress a voltage decrease (power loss) and improve energy efficiency as a light source.
The metal film may be provided after the formation of the light-shielding resin described later, or may be provided on the conductor core before the formation of the light-shielding resin.

（発光素子）
発光素子載置用基体に搭載可能な発光素子としては、発光ダイオード、レーザダイオード、発光トランジスタ、発光サイリスタなどが挙げられる。
発光素子は、導電体コアの露出面に載置されることが放熱性の面で好ましい。発光素子と導電体コアの間に熱伝導性が良好な絶縁部材あるいは薄い絶縁膜を設けることもある。例えば、サファイヤ基板等の絶縁性基板を用いた発光素子は、導電体コアの露出面にジャンクションアップマウントすることができる。 (Light emitting element)
Examples of the light emitting element that can be mounted on the light emitting element mounting substrate include a light emitting diode, a laser diode, a light emitting transistor, and a light emitting thyristor.
It is preferable that the light emitting element is placed on the exposed surface of the conductor core in terms of heat dissipation. An insulating member or a thin insulating film having good thermal conductivity may be provided between the light emitting element and the conductor core. For example, a light emitting element using an insulating substrate such as a sapphire substrate can be junction-up mounted on the exposed surface of the conductor core.

フリップチップ実装（ジャンクションダウンマウントともいう）の場合、発光素子の少なくとも一対の電極のそれぞれが、２以上の導電体コアと電気的に接続されていることが好ましい。発光装置の基部に曲げ応力が加えられた場合、曲げ応力は金属部分ではなく、金属部分より変形しやすい樹脂部分に集中しやすい。よって、フリップチップ実装において、発光素子付近に存在する絶縁部に曲げ応力が集中し、発光素子割れや半田やバンプなどの導電性接続部材の剥離若しくはき裂を引き起こし、ひいては発光素子の不灯を引き起こしやすい。発光素子付近に複数の導電体コアを配置することで、発光装置の基部の発光素子載置部およびその周辺が、複数の光反射性の絶縁部材または遮光性樹脂から成るのでこれらの樹脂部で曲げ応力が分散され、発光素子付近に曲げ応力が集中せず、発光装置の基部への外部からの応力による不灯等の故障の抑制を図ることができる。 In the case of flip-chip mounting (also referred to as junction down mount), it is preferable that each of at least a pair of electrodes of the light emitting element is electrically connected to two or more conductor cores. When bending stress is applied to the base of the light emitting device, the bending stress tends to concentrate not on the metal part but on the resin part which is more easily deformed than the metal part. Therefore, in flip-chip mounting, bending stress concentrates on the insulating part existing near the light-emitting element, causing cracking of the light-emitting element and peeling or cracking of conductive connecting members such as solder and bumps, which in turn causes the light-emitting element to be unlit. Easy to cause. By arranging a plurality of conductor cores in the vicinity of the light emitting element, the light emitting element mounting portion at the base of the light emitting device and its surroundings are made of a plurality of light-reflecting insulating members or light-shielding resins. The bending stress is dispersed, the bending stress is not concentrated in the vicinity of the light emitting element, and it is possible to suppress failures such as non-lighting due to external stress on the base of the light emitting device.

また、フレームインサートタイプの発光素子載置用基体と比較して、隣接する発光装置筐体間隔が狭いため、発光装置筐体の集合体において、発光素子載置部間隔を狭めることができ、チップマウンターの処理能力を高くして、組立コストを抑制することができる。 Further, since the space between adjacent light emitting device housings is narrower than that of the frame insert type light emitting element mounting substrate, the space between the light emitting device mounting portions can be narrowed in the aggregate of the light emitting device housings, and the chip. The processing capacity of the mounter can be increased and the assembly cost can be suppressed.

（絶縁性スペーサ部材）
本実施形態の発光素子載置用基体は、さらに、絶縁性のスペーサ部材を備えてもよい。スペーサ部材をコア部とコア部の間に配置することで、コア部間の距離を設定することができる。これにより、発光素子載置用基体または発光装置の設計の自由度を高めることができる。
絶縁性スペーサ部材の材料としては、例えば、上述の光反射性の絶縁部材と同様の材料を用いることができる。樹脂を用いることで、切削、切断（個片化）などを容易に行うことができる。また、形状は、得られる発光素子載置用基体の設計によって適宜定めることができ、例えば、円柱、角柱（多面体）、球（楕円体含む）、円管（円筒）、またはこれらに近似したものがあげられる。また、最外周に接着層を備えてもよい。絶縁性スペーサ部材の表面は、遮光性樹脂との接合力を高めるため、細かな凹凸形状を有してもよい。
絶縁性スペーサ部材は調整したい距離に応じて、球状のほか、角棒や丸棒などの線状であってもよく、フィルム状や、ある程度の厚みを持ったシート状であってもよい。 (Insulating spacer member)
The light-emitting element mounting substrate of the present embodiment may further include an insulating spacer member. By arranging the spacer member between the core portions, the distance between the core portions can be set. This makes it possible to increase the degree of freedom in designing the light emitting element mounting substrate or the light emitting device.
As the material of the insulating spacer member, for example, the same material as the above-mentioned light-reflecting insulating member can be used. By using a resin, cutting, cutting (individualization) and the like can be easily performed. The shape can be appropriately determined by the design of the obtained base for mounting the light emitting element, for example, a cylinder, a prism (polyhedron), a sphere (including an ellipsoid), a circular tube (cylinder), or an approximation thereof. Can be given. Further, an adhesive layer may be provided on the outermost periphery. The surface of the insulating spacer member may have a fine uneven shape in order to enhance the bonding force with the light-shielding resin.
The insulating spacer member may be spherical, linear such as a square bar or a round bar, film-shaped, or a sheet having a certain thickness, depending on the distance to be adjusted.

（保護素子）
発光装置は、発光素子を過電流による破壊から保護する保護素子を備えることができる。保護素子としては、例えば、ツェナーダイオードやコンデンサなどを用いることができる。片面電極のものであれば、ワイヤレスでフェイスダウン実装できるため好ましい。 (Protective element)
The light emitting device can include a protective element that protects the light emitting element from destruction due to overcurrent. As the protection element, for example, a Zener diode or a capacitor can be used. If it is a single-sided electrode, it is preferable because it can be mounted face-down wirelessly.

（封止材）
発光装置は、発光素子を外部からの物理的、化学的な劣化要因から保護するための封止材を有していてもよい。封止材は、発光素子を直接的にまたは間接的に被覆するように形成されていればよく、例えばシリコーン樹脂やエポキシ樹脂などを好適に用いることができる。ＵＶ－ＬＥＤでは、光学ガラスを用いてもよい。 (Encapsulant)
The light emitting device may have a sealing material for protecting the light emitting element from external physical and chemical deterioration factors. The encapsulant may be formed so as to directly or indirectly cover the light emitting element, and for example, a silicone resin or an epoxy resin can be preferably used. For UV-LED, optical glass may be used.

（その他の部材）
発光装置は、発光素子からの光の一部を異なる波長の光に変換する波長変換部材や光散乱部材を有していてもよい。例えば、封止材に蛍光体等の波長変換物質を含有させていてもよい。また、遮光性樹脂等の樹脂部材は熱伝導性や熱膨張率などの特性を調節するために適宜材質のフィラーを含有してもよい。 (Other parts)
The light emitting device may include a wavelength conversion member or a light scattering member that converts a part of the light from the light emitting element into light having a different wavelength. For example, the encapsulant may contain a wavelength conversion substance such as a phosphor. Further, the resin member such as a light-shielding resin may contain a filler of an appropriate material in order to adjust characteristics such as thermal conductivity and thermal expansion rate.

まず、図１に示すように、Ｃｕからなる直径０．９ｍｍの球に、Ｃｕの側からＮｉ、Ａｕ、Ａｇを０．０２ｍｍの膜厚で積層し、光沢銀メッキを施した導電体コア１２を形成する。次に、これらの導電体コア１２の表面全体に、酸化チタンを含有したシリコーン樹脂である光反射性の絶縁部材１４を０．０６ｍｍの厚みで形成する。これにより、直径が１．０６ｍｍのコア部１６を得る。 First, as shown in FIG. 1, a conductor core 12 made of Cu and having a diameter of 0.9 mm is laminated with Ni, Au, and Ag from the Cu side to a thickness of 0.02 mm and plated with bright silver. To form. Next, a light-reflecting insulating member 14 which is a silicone resin containing titanium oxide is formed on the entire surface of these conductor cores 12 with a thickness of 0.06 mm. As a result, the core portion 16 having a diameter of 1.06 mm is obtained.

次に、所定の形状の貫通孔を有する０．６ｍｍ厚の樹脂シートからなる第１絶縁部材１８を準備し、その貫通孔に、図３に示すように、コア部１６を所定位置に整列し、接着する。インサート成形技術で、平面配列金属集合体を金型で挟み込み、プレスしてコア部１６を所定量つぶし、図４に示すように上下に平坦面１７を設け、遮光性樹脂２０として光反射性熱可塑性樹脂を用いて成型し、図５に示すような平面配列導電体コア集合体を内包する基体準備体１２０とする。この際、コア部とコア部との間の隙間が、樹脂の流入経路となり、アンカーともなる。 Next, a first insulating member 18 made of a resin sheet having a thickness of 0.6 mm having a through hole having a predetermined shape is prepared, and the core portion 16 is arranged at a predetermined position in the through hole as shown in FIG. , Glue. With the insert molding technology, the planar array metal aggregate is sandwiched between dies and pressed to crush a predetermined amount of the core portion 16, flat surfaces 17 are provided on the upper and lower surfaces as shown in FIG. 4, and light-reflecting heat is used as the light-shielding resin 20. It is molded using a plastic resin to obtain a substrate preparatory body 120 containing a planar array conductor core aggregate as shown in FIG. At this time, the gap between the core portion and the core portion serves as an inflow path for the resin and also serves as an anchor.

基体準備体１２０の上下面の一部を形成するコア部１６をつぶした平坦面１７の熱硬化性樹脂を溶剤により溶解除去し、図６に示すように上下面につぶした銅球の導電体コア１２の光沢銀メッキを露出させ、異方性導電体である発光素子載置用基体１００を形成する。さらにメッキを施し、図７に示すように金属膜２２を形成する。複数の導電体コアをメッキで繋いで金属膜２２により配線パターンを形成してもよい。その場合、上面（発光素子載置側）は光反射性メッキ（たとえばＡｇメッキ）とする。このようにして作られた発光素子載置用基体１００は、導電体コア１２に予め光沢銀メッキ等の光反射性導電膜を形成し絶縁被膜を溶剤により溶解除去することにより、光反射性の良い発光素子載置面を備える発光素子載置用基体が作製可能となる。 The thermosetting resin on the flat surface 17 in which the core portion 16 forming a part of the upper and lower surfaces of the substrate preparation body 120 is crushed is dissolved and removed with a solvent, and the conductor of the copper ball crushed on the upper and lower surfaces as shown in FIG. The glossy silver plating of the core 12 is exposed to form a base 100 for mounting a light emitting element, which is an anisotropic conductor. Further plating is applied to form the metal film 22 as shown in FIG. A plurality of conductor cores may be connected by plating to form a wiring pattern by the metal film 22. In that case, the upper surface (light emitting element mounting side) is light-reflecting plating (for example, Ag plating). The light-emitting element mounting substrate 100 thus produced is light-reflecting by forming a light-reflecting conductive film such as glossy silver plating in advance on the conductor core 12 and dissolving and removing the insulating film with a solvent. It is possible to fabricate a light emitting element mounting substrate having a good light emitting element mounting surface.

ＬＥＤチップのような発光素子を備える発光装置の基体として、各種光源に利用できる。 It can be used for various light sources as a substrate of a light emitting device provided with a light emitting element such as an LED chip.

１２ 導電体コア
１４ 第２絶縁部材
１６ コア部
１７ 平坦面
１８ 第１絶縁部材
２０ 遮光性樹脂
２２ 金属膜
２４ 発光素子
２６ 封止材
３７ 貫通孔
４０ 枠体
１００ 発光素子載置用基体
１２０ 基体準備体
１２２ 発光装置集合体
２００ 発光装置 12 Conductor core 14 2nd insulating member 16 Core part 17 Flat surface 18 1st insulating member 20 Light-shielding resin 22 Metal film 24 Light emitting element 26 Encapsulant 37 Through hole 40 Frame body 100 Light emitting element mounting base 120 Base preparation Body 122 Luminescent device aggregate 200 Luminescent device

Claims (15)

凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、
前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、
前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備える発光素子載置用基体の製造方法。 The first step of preparing a plate-shaped first insulating member having a recess or a through hole, and
A second step of arranging a light-shielding resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core in the recess or the through hole.
A method for manufacturing a substrate for mounting a light emitting element, comprising a third step of exposing the surface of the conductor core from the second insulating member by removing a part of the second insulating member. 凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、
前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、
前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備え、
前記第３工程は、前記第２絶縁部材が除去された領域を前記遮光性樹脂により被覆することを含む発光素子載置用基体の製造方法。 The first step of preparing a plate-shaped first insulating member having a recess or a through hole, and
A second step of arranging a light-shielding resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core in the recess or the through hole.
A third step of exposing the surface of the conductor core from the second insulating member by removing a part of the second insulating member is provided.
The third step is a method for manufacturing a light emitting element mounting substrate, which comprises covering a region from which the second insulating member has been removed with the light-shielding resin. 凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、
前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、
前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備え、
前記第３工程において、溶剤を用いて前記第２絶縁部材を除去し、
前記第３工程は、前記第２絶縁部材が除去された領域を前記遮光性樹脂により被覆することを含む発光素子載置用基体の製造方法。 The first step of preparing a plate-shaped first insulating member having a recess or a through hole, and
A second step of arranging a light-shielding resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core in the recess or the through hole.
A third step of exposing the surface of the conductor core from the second insulating member by removing a part of the second insulating member is provided.
In the third step, the second insulating member is removed using a solvent.
The third step is a method for manufacturing a light emitting element mounting substrate, which comprises covering a region from which the second insulating member has been removed with the light-shielding resin. 凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、
前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、
前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備え、
前記第３工程において、溶剤を用いて前記第２絶縁部材を除去する発光素子載置用基体の製造方法。 The first step of preparing a plate-shaped first insulating member having a recess or a through hole, and
A second step of arranging a light-shielding resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core in the recess or the through hole.
A third step of exposing the surface of the conductor core from the second insulating member by removing a part of the second insulating member is provided.
A method for manufacturing a light emitting element mounting substrate from which the second insulating member is removed by using a solvent in the third step. 凹部又は貫通孔を有する板状の第１絶縁部材を準備する第１工程と、
前記凹部又は前記貫通孔に、遮光性樹脂と、導電体コアの表面に光反射性の第２絶縁部材を有する複数のコア部と、を配置する第２工程と、
前記第２絶縁部材の一部を除去することにより、前記導電体コアの表面を前記第２絶縁部材から露出させる第３工程と、を備え、
前記第３工程において、切削することにより前記第２絶縁部材を除去する発光素子載置用基体の製造方法。 The first step of preparing a plate-shaped first insulating member having a recess or a through hole, and
A second step of arranging a light-shielding resin and a plurality of core portions having a light-reflecting second insulating member on the surface of the conductor core in the recess or the through hole.
A third step of exposing the surface of the conductor core from the second insulating member by removing a part of the second insulating member is provided.
A method for manufacturing a light emitting element mounting substrate from which the second insulating member is removed by cutting in the third step. 前記第２絶縁部材から露出された前記導電体コアの表面に金属膜を配置する工程を有する請求項１～５のいずれか１項に記載の発光素子載置用基体の製造方法。 The method for manufacturing a substrate for mounting a light emitting element according to any one of claims 1 to 5, further comprising a step of arranging a metal film on the surface of the conductor core exposed from the second insulating member. 前記第３工程の前に、前記コア部の上面及び／または下面を押しつぶす工程を有する請求項１～６のいずれか１項に記載の発光素子載置用基体の製造方法。 The method for manufacturing a substrate for mounting a light emitting element according to any one of claims 1 to 6, further comprising a step of crushing the upper surface and / or the lower surface of the core portion before the third step. 前記第３工程の前に、前記コア部の上面及び／または下面を押しつぶす工程で形成された前記コア部の平坦面の前記第２絶縁部材を除去する請求項７に記載の発光素子載置用基体の製造方法。 The light emitting element for mounting according to claim 7, wherein the second insulating member on the flat surface of the core portion formed in the step of crushing the upper surface and / or the lower surface of the core portion is removed before the third step. Method of manufacturing a substrate. 前記第１絶縁部材を切断する工程を有する請求項１～８のいずれか１項に記載の発光素子載置用基体の製造方法。 The method for manufacturing a substrate for mounting a light emitting element according to any one of claims 1 to 8, which comprises a step of cutting the first insulating member. 請求項１～９のいずれか１項に記載の製造方法により製造された発光素子載置用基体に、発光素子を載置する工程を有する発光装置の製造方法。 A method for manufacturing a light emitting device, which comprises a step of mounting a light emitting element on a light emitting element mounting substrate manufactured by the manufacturing method according to any one of claims 1 to 9. 発光素子載置用基体であって、
貫通孔を有する第１絶縁部材と、
前記貫通孔内に配置された複数の導電体コアと、
前記それぞれの導電体コアの側面を被覆する光反射性の第２絶縁部材と、
前記貫通孔内に配置され、前記第２絶縁部材同士を接合する遮光性樹脂と、を備え、
前記導電体コアの上面及び前記導電体コアの下面は、前記遮光性樹脂から露出されている発光素子載置用基体。 A substrate for mounting a light emitting element,
The first insulating member having a through hole and
A plurality of conductor cores arranged in the through hole,
A light-reflecting second insulating member that covers the side surface of each of the conductor cores,
A light-shielding resin, which is arranged in the through hole and joins the second insulating members to each other, is provided.
The upper surface of the conductor core and the lower surface of the conductor core are substrates for mounting a light emitting element exposed from the light-shielding resin. 前記導電体コアの表面に金属膜を有する請求項１１に記載の発光装置載置用基体。 The substrate for mounting a light emitting device according to claim 11, which has a metal film on the surface of the conductor core. 前記複数の導電体コアのうち、少なくとも２以上が、前記金属膜によって電気的に接続される、請求項１２に記載の発光素子載置用基体。 The substrate for mounting a light emitting element according to claim 12 , wherein at least two or more of the plurality of conductor cores are electrically connected by the metal film. 請求項１１～１３に記載の発光素子載置用基体と、
前記発光素子載置用基体上に載置され、前記複数の導電体コアと電気的に接続された発光素子と、を有する発光装置。 The substrate for mounting a light emitting element according to claims 11 to 13, and the substrate for mounting the light emitting element.
A light emitting device having a light emitting element mounted on the light emitting element mounting substrate and electrically connected to the plurality of conductor cores. 前記発光素子は、前記発光素子載置用基体に近い側の面に正負の電極を有しており、前記複数の導電体コアと前記発光素子の正負の電極とがそれぞれ電気的に接続される、請求項１４に記載の発光装置。 The light emitting element has positive and negative electrodes on the surface close to the light emitting element mounting substrate, and the plurality of conductor cores and the positive and negative electrodes of the light emitting element are electrically connected to each other. The light emitting device according to claim 14.
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