JP2007207921A - 表面実装型光半導体デバイスの製造方法 - Google Patents
表面実装型光半導体デバイスの製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
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- 229920005989 resin Polymers 0.000 claims abstract description 109
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- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
【解決手段】絶縁基材16に回路パターン17が形成されたプリント回路基板1に所定の間隔で複数の窓孔2を設けた粘着シート3を貼付け、同様に所定の間隔で複数の窓孔4を設けた貼り合わせ用基板5を粘着シート3に貼付ける。そして、窓孔の底面に位置するプリント回路基板1上にLEDチップ8を載設してボンディングワイヤ9をワイヤボンディングし、窓孔内に熱硬化性樹脂10を充填、加熱硬化してLEDチップ8およびボンディングワイヤ9を樹脂封止する。これを、ダイシングシートに貼付けてダイシング装置のステージ上に保持し、裁断・分離して表面実装型半導体デバイスの作製を完了する。
【選択図】図2
Description
前記貼り合わせ基板の窓孔の底面に位置する前記回路基板上に少なくとも1つの光半導体素子を配置し、回路パターンに電気的に接続する工程と、
前記窓孔内に樹脂を充填、加熱硬化させて前記光半導体素子を樹脂封止する工程と、
前記光半導体素子が樹脂封止された回路基板を個々の光半導体デバイスに裁断・分離する工程とを備えることを特徴とするものである。
前記貼り合わせ基板の窓孔の底面に位置する前期回路基板上に複数の光半導体素子を配置し、回路パターンに電気的に接続する工程と、
前記窓孔内に樹脂を充填、加熱硬化させて前記光半導体素子を樹脂封止する工程と、
前記光半導体素子が樹脂封止された回路基板を個々の表面実装型光半導体デバイスに裁断・分離する工程とを備えることを特徴とするものである。
2 窓孔
3 粘着シート
4 窓孔
5 貼り合わせ用基板
6 内周面
7 露出部
8 LEDチップ
9 ボンディングワイヤ
10 熱硬化性樹脂
11 ダイシングシート
12 ステージ
13 壁部
14 切削溝
15 表面実装型半導体デバイス
16 絶縁基材
17 回路パターン
18 長窓孔
19 長窓孔
Claims (10)
- 回路パターンが形成された回路基板上に、所定の間隔で複数の窓孔が設けられた貼り合わせ用基板を、接合材を介して貼付ける工程と、
前記貼り合わせ基板の窓孔の底面に位置する前記回路基板上に少なくとも1つの光半導体素子を配置し、回路パターンに電気的に接続する工程と、
前記窓孔内に樹脂を充填、加熱硬化させて前記光半導体素子を樹脂封止する工程と、
前記光半導体素子が樹脂封止された回路基板を個々の光半導体デバイスに裁断・分離する工程とを備えることを特徴とする表面実装型光半導体デバイスの製造方法。 - 前記回路基板は、0.35mm〜0.1mmの厚みであることを特徴とする請求項1に記載の光半導体デバイスの製造方法。
- 前記回路基板に用いられる絶縁基材は、0.2mm〜から0.03mmの厚みであることを特徴とする請求項1または2のいずれか1項に記載の光半導体デバイスの製造方法。
- 前記封止樹脂は透光性樹脂、あるいは、透光性樹脂に散乱材、蛍光体、波長選択吸収性顔料のうちの1つ、または複数組み合わせて混入したものであることを特徴とする請求項1〜3のいずれか1項に記載の光半導体デバイスの製造方法。
- 前記貼り合わせ用基板は透光性材料、あるいは、透光性材料に散乱材、蛍光体、波長選択吸収性顔料のうちの1つ、または複数組み合わせて混入したものであることを特徴とする請求項1〜4のいずれか1項に記載の光半導体デバイスの製造方法。
- 回路パターンが形成された回路基板上に、1つの窓孔が設けられた貼り合わせ用基板を、接合材を介して貼付ける工程と、
前記貼り合わせ基板の窓孔の底面に位置する前期回路基板上に複数の光半導体素子を配置し、回路パターンに電気的に接続する工程と、
前記窓孔内に樹脂を充填、加熱硬化させて前記光半導体素子を樹脂封止する工程と、
前記光半導体素子が樹脂封止された回路基板を個々の表面実装型光半導体デバイスに裁断・分離する工程とを備えることを特徴とする表面実装型光半導体デバイスの製造方法。 - 前記回路基板は、0.35mm〜0.1mmの厚みであることを特徴とする請求項6に記載の光半導体デバイスの製造方法。
- 前記回路基板に用いられる絶縁基材は、0.2mm〜から0.03mmの厚みであることを特徴とする請求項6または7のいずれか1項に記載の光半導体デバイスの製造方法。
- 前記封止樹脂は透光性樹脂、あるいは、透光性樹脂に散乱材、蛍光体、波長選択吸収性顔料のうちの1つ、または複数組み合わせて混入したものであることを特徴とする請求項6〜8のいずれか1項に記載の光半導体デバイスの製造方法。
- 前記貼り合わせ用基板は透光性材料、あるいは、透光性材料に散乱材、蛍光体、波長選択吸収性顔料のうちの1つ、または複数組み合わせて混入したものであることを特徴とする請求項6〜9のいずれか1項に記載の光半導体デバイスの製造方法。
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JP2006023365A JP2007207921A (ja) | 2006-01-31 | 2006-01-31 | 表面実装型光半導体デバイスの製造方法 |
US11/557,163 US7534663B2 (en) | 2006-01-31 | 2006-11-07 | Method for manufacturing a surface mount device |
EP07002141.5A EP1814151B1 (en) | 2006-01-31 | 2007-01-31 | Method for manufacturing a surface mount semiconductor device |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009054610A (ja) * | 2007-08-23 | 2009-03-12 | Tera Autotech Corp | 高効率ledのパッケージング |
JP2009094323A (ja) * | 2007-10-10 | 2009-04-30 | Nichia Corp | 発光装置用パッケージの集合構造体およびその製造方法、ならびに発光装置の製造方法 |
US8115106B2 (en) | 2007-11-26 | 2012-02-14 | Stanley Electric Co., Ltd. | Surface mount device |
KR101262915B1 (ko) * | 2012-02-07 | 2013-05-09 | 삼성전자주식회사 | 발광장치 및 발광장치의 제조방법 |
KR101271225B1 (ko) | 2006-10-31 | 2013-06-03 | 삼성디스플레이 주식회사 | 발광 다이오드 칩 및 발광 다이오드 광원 모듈의 제조 방법 |
JP2019160862A (ja) * | 2018-03-08 | 2019-09-19 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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JP6252302B2 (ja) * | 2014-03-28 | 2017-12-27 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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Also Published As
Publication number | Publication date |
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EP1814151B1 (en) | 2019-01-30 |
EP1814151A1 (en) | 2007-08-01 |
US7534663B2 (en) | 2009-05-19 |
US20070178629A1 (en) | 2007-08-02 |
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