JP2007203442A - Metal coated abrasive grain, method of producing metal coated abrasive grain, and grindstone using the metal coated abrasive grain - Google Patents
Metal coated abrasive grain, method of producing metal coated abrasive grain, and grindstone using the metal coated abrasive grain Download PDFInfo
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- JP2007203442A JP2007203442A JP2006028813A JP2006028813A JP2007203442A JP 2007203442 A JP2007203442 A JP 2007203442A JP 2006028813 A JP2006028813 A JP 2006028813A JP 2006028813 A JP2006028813 A JP 2006028813A JP 2007203442 A JP2007203442 A JP 2007203442A
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- metal
- silane coupling
- abrasive grain
- abrasive grains
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 134
- 239000002184 metal Substances 0.000 title claims abstract description 134
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 116
- 238000000034 method Methods 0.000 title abstract description 12
- 238000010168 coupling process Methods 0.000 claims abstract description 65
- 229910000077 silane Inorganic materials 0.000 claims abstract description 65
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 64
- 230000008878 coupling Effects 0.000 claims abstract description 60
- 238000005859 coupling reaction Methods 0.000 claims abstract description 60
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 34
- 239000011247 coating layer Substances 0.000 claims abstract description 32
- 239000010410 layer Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims description 44
- 239000003054 catalyst Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 125000000524 functional group Chemical group 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000003277 amino group Chemical group 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 92
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 37
- 239000002994 raw material Substances 0.000 description 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000004070 electrodeposition Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical group NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 7
- 238000005553 drilling Methods 0.000 description 7
- 238000001878 scanning electron micrograph Methods 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000001235 sensitizing effect Effects 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- ODIRBFFBCSTPTO-UHFFFAOYSA-N 1,3-selenazole Chemical compound C1=C[se]C=N1 ODIRBFFBCSTPTO-UHFFFAOYSA-N 0.000 description 2
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 2
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 241000080590 Niso Species 0.000 description 2
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 2
- 101150003085 Pdcl gene Proteins 0.000 description 2
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 2
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- YTLQFZVCLXFFRK-UHFFFAOYSA-N bendazol Chemical compound N=1C2=CC=CC=C2NC=1CC1=CC=CC=C1 YTLQFZVCLXFFRK-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- GICLSALZHXCILJ-UHFFFAOYSA-N ctk5a5089 Chemical compound NCC(O)=O.NCC(O)=O GICLSALZHXCILJ-UHFFFAOYSA-N 0.000 description 2
- PWPGWRIGYKWLEV-UHFFFAOYSA-N dimethoxy-methyl-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](C)(OC)CCOCC1CO1 PWPGWRIGYKWLEV-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- ZLTPDFXIESTBQG-UHFFFAOYSA-N isothiazole Chemical compound C=1C=NSC=1 ZLTPDFXIESTBQG-UHFFFAOYSA-N 0.000 description 2
- CTAPFRYPJLPFDF-UHFFFAOYSA-N isoxazole Chemical compound C=1C=NOC=1 CTAPFRYPJLPFDF-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 2
- CQDAMYNQINDRQC-UHFFFAOYSA-N oxatriazole Chemical compound C1=NN=NO1 CQDAMYNQINDRQC-UHFFFAOYSA-N 0.000 description 2
- SIGUVTURIMRFDD-UHFFFAOYSA-M sodium dioxidophosphanium Chemical compound [Na+].[O-][PH2]=O SIGUVTURIMRFDD-UHFFFAOYSA-M 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 150000003536 tetrazoles Chemical class 0.000 description 2
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 2
- YGNGABUJMXJPIJ-UHFFFAOYSA-N thiatriazole Chemical compound C1=NN=NS1 YGNGABUJMXJPIJ-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 150000003852 triazoles Chemical class 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- PLXLQGPXPXIVKM-UHFFFAOYSA-N 3-chloropropyl(tripropoxy)silane Chemical compound CCCO[Si](CCCCl)(OCCC)OCCC PLXLQGPXPXIVKM-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- HOLVDVSATQLJNW-UHFFFAOYSA-N diethoxy-ethyl-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](CC)(OCC)CC(C)OCC1CO1 HOLVDVSATQLJNW-UHFFFAOYSA-N 0.000 description 1
- ODADONMDNZJQMW-UHFFFAOYSA-N diethoxy-ethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](CC)(OCC)CCCOCC1CO1 ODADONMDNZJQMW-UHFFFAOYSA-N 0.000 description 1
- FUXUUPOAQMPKOK-UHFFFAOYSA-N diethoxy-methyl-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](C)(OCC)CCOCC1CO1 FUXUUPOAQMPKOK-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- LQJYZOSQIDYKOM-UHFFFAOYSA-N dimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]-propylsilane Chemical compound CCC[Si](OC)(OC)CCOCC1CO1 LQJYZOSQIDYKOM-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- GYLXWHLPLTVIOP-UHFFFAOYSA-N ethenyl(2,2,2-trimethoxyethoxy)silane Chemical compound COC(OC)(OC)CO[SiH2]C=C GYLXWHLPLTVIOP-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CSJWBNAOYWNTBI-UHFFFAOYSA-N ethyl-dimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CC[Si](OC)(OC)CCOCC1CO1 CSJWBNAOYWNTBI-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- OOPKJVYUAXPGHS-UHFFFAOYSA-N tributoxy(3-chloropropyl)silane Chemical compound CCCCO[Si](CCCCl)(OCCCC)OCCCC OOPKJVYUAXPGHS-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ZNXDCSVNCSSUNB-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)CCOCC1CO1 ZNXDCSVNCSSUNB-UHFFFAOYSA-N 0.000 description 1
- HTVULPNMIHOVRU-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CC(C)OCC1CO1 HTVULPNMIHOVRU-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
本発明は，金属被覆砥粒，金属被覆砥粒の製造方法，およびその金属被覆砥粒を使用した砥石に関する。 The present invention relates to a metal-coated abrasive grain, a method for producing a metal-coated abrasive grain, and a grindstone using the metal-coated abrasive grain.
ガラス，シリコン，セラミックスなどの硬質材料からなる板状物に小孔を穿設するための孔開け装置がある。この種の孔開け装置として，ダイヤモンドやＣＢＮなどの超砥粒を電着ボンドを用いてドリルの先端部に付着させた構成のものが公知である。 There is a drilling device for drilling small holes in a plate-like object made of a hard material such as glass, silicon, or ceramics. As this type of drilling device, a configuration in which superabrasive grains such as diamond and CBN are attached to the tip of a drill using an electrodeposition bond is known.
このようなドリルの中で，例えば特許文献１に記載されているように，ＰＤＰ（プラズマディスプレーパネル）ガラスなどのガラス板に孔を形成するときに，ドリルの先端面（刃先）が進行することにより孔開け形成された内壁面に，ダイヤモンド砥粒層の側面が接する結果，内壁面に欠けやひび割れ等が生じるおそれがある。このため，図４に記載されているようにドリルの先端部のダイヤモンド砥粒層を単層または２層からなる薄層に形成する必要がある。このようなドリルでは，砥粒が電着ボンドに保持される保持力を向上させることが，砥粒の脱落を防ぎ，ドリルの切削能力や寿命を向上させるために重要であると考えられる。 In such a drill, as described in Patent Document 1, for example, when a hole is formed in a glass plate such as PDP (plasma display panel) glass, the tip surface (blade edge) of the drill advances. As a result of the contact of the side surface of the diamond abrasive grain layer with the inner wall surface formed by perforation, the inner wall surface may be chipped or cracked. For this reason, as shown in FIG. 4, it is necessary to form the diamond abrasive grain layer at the tip of the drill into a single layer or a thin layer consisting of two layers. In such a drill, it is considered that improving the holding force by which the abrasive grains are held by the electrodeposition bond is important in order to prevent the abrasive grains from dropping and to improve the cutting ability and life of the drill.
このような電着ボンドを使用した電着砥石は，例えば砥粒を電気めっき浴中に落下させて攪拌し，この砥粒が台金表面の砥粒層生成面に接触した際に，電気めっきにより固着して砥粒層を形成することによって製造される。この際に，砥粒の表面に金属層を被覆させた金属被覆砥粒を使用して，砥粒が電着ボンドに保持される保持力を向上させることが試みられている。 An electrodeposition grindstone using such an electrodeposition bond is prepared by, for example, electroplating when abrasive grains are dropped into an electroplating bath and agitated, and when the abrasive grains come into contact with the abrasive layer forming surface of the base metal surface. It is manufactured by adhering to form an abrasive layer. At this time, an attempt has been made to improve the holding force of the abrasive grains held by the electrodeposition bond by using metal-coated abrasive grains in which the surface of the abrasive grains is coated with a metal layer.
しかしながら，本発明者らが検討した結果，超砥粒の表面に金属を均一に被覆することは困難であり，その結果，金属被覆にむらが生じて金属が被覆されてない場所が生じ，当該金属が被覆されてない場所から砥粒が脱落してしまうので，金属被覆した効果を発揮できないという問題があった。 However, as a result of investigations by the present inventors, it is difficult to uniformly coat the surface of the superabrasive grain with metal, and as a result, unevenness occurs in the metal coating, resulting in a place where the metal is not coated. Since the abrasive grains fall off from the place where the metal is not coated, there is a problem that the effect of metal coating cannot be exhibited.
超砥粒は，他の物質との濡れ性が悪いことで知られており，他の物質との複合化が難しい。したがって，超砥粒の表面に金属を無電解めっき等によって被覆したときに，超砥粒の表面と金属被覆層との密着性が低いため，金属被覆層が不均一に付着してしまい，金属被覆層が存在しない場所が発生してしまう，という問題があった。 Superabrasive grains are known for their poor wettability with other materials, making it difficult to combine them with other materials. Therefore, when metal is coated on the surface of superabrasive grains by electroless plating or the like, the adhesion between the surface of the superabrasive grains and the metal coating layer is low, so that the metal coating layer adheres unevenly and the metal There was a problem that a place where no coating layer was present occurred.
かかる問題を解決するため，超砥粒の表面と金属被覆層との密着性を高めることにより，金属被覆層を均一に被覆させることが考えられるが，金属を被覆する前に超砥粒の表面をパラジウムなどの触媒を含有する溶液に浸漬させてから金属被覆層を形成し，金属被覆層との密着性を高めても十分な密着性を得られず，金属膜を超砥粒の表面に均一に被覆することができなかった。 In order to solve this problem, it is conceivable to uniformly coat the metal coating layer by increasing the adhesion between the surface of the superabrasive grain and the metal coating layer. A metal coating layer is formed after immersing in a solution containing a catalyst such as palladium, and sufficient adhesion cannot be obtained even if the adhesion to the metal coating layer is increased. It was not possible to coat uniformly.
そこで，本発明は，このような問題に鑑みてなされたもので，その目的は，金属被覆砥粒とその製造方法およびその金属被覆砥粒を使用した砥石において，砥粒の表面と金属被覆層との密着性を向上させて，砥粒表面に金属を均一に被覆させることにある。 Accordingly, the present invention has been made in view of such problems, and an object thereof is to provide a metal-coated abrasive grain, a method for producing the same, and a grindstone using the metal-coated abrasive grain. In other words, the metal surface is uniformly coated with the abrasive grains.
上記課題を解決するために，本発明の第１の観点によれば，砥粒の表面に金属被覆層が被覆されてなる金属被覆砥粒が提供される。かかる金属被覆砥粒は，砥粒の表面の全部又は一部に形成されたシランカップリング剤を含むシランカップリング層と，このシランカップリング層の表面の全部又は一部を被覆する金属被覆層とを有することを特徴とする。 In order to solve the above problems, according to a first aspect of the present invention, there is provided a metal-coated abrasive grain in which a metal coating layer is coated on the surface of the abrasive grain. Such metal-coated abrasive grains include a silane coupling layer containing a silane coupling agent formed on the whole or part of the surface of the abrasive grain, and a metal coating layer covering all or part of the surface of the silane coupling layer. It is characterized by having.
このように，砥粒などの表面にシランカップリング処理を施した後に，金属で被覆した砥粒を使用すると，結合材に対する保持力を向上させることができる。このため，砥石部を薄層形態に形成する場合には，砥粒の結合材に対する保持力が特に要求されることから，特に好適である。すなわち，本発明に係る金属被覆砥粒を使用し，例えば，電気めっきを行って穿孔手段（ドリル）等の先端部に砥粒を電着させた砥石を製造すると，電着ボンドに対する砥粒の保持力が向上しているので，高い切削能力や長寿命を有することができる。 As described above, when the abrasive grains coated with metal are used after the surface of the abrasive grains or the like is subjected to the silane coupling treatment, the holding power to the binder can be improved. For this reason, when the grinding wheel portion is formed in a thin layer form, the holding force of the abrasive grains to the binder is particularly required, which is particularly preferable. That is, using the metal-coated abrasive grains according to the present invention, for example, when a grindstone is produced by electroplating and electrodepositing abrasive grains on the tip of a drilling means (drill) or the like, Because the holding power is improved, it can have high cutting ability and long life.
ここで，本発明においてシランカップリング処理を行う目的は，無電解金属めっきによりめっきされる金属（例えば，Ｎｉ）が，砥粒の表面に付着しやすくすること，言い換えると，砥粒の表面と金属被覆層との密着性を向上させることである。この点で，特許文献２及び３に記載された発明とは大きく異なる。すなわち，特許文献２及び３に記載された発明においてもシランカップリング処理が行われているが，この処理の目的は，砥粒と金属被覆層との密着性の向上を目的としたものではなく，砥粒と結合材との密着性を高めることである。したがって，例えば，特許文献２に記載の金属被覆砥粒においては，金属被覆層の上にシランカップリング層が形成されている。 Here, the purpose of the silane coupling treatment in the present invention is to make the metal (for example, Ni) plated by electroless metal plating easily adhere to the surface of the abrasive grains, in other words, the surface of the abrasive grains. It is to improve the adhesion with the metal coating layer. In this respect, it differs greatly from the inventions described in Patent Documents 2 and 3. That is, the silane coupling process is also performed in the inventions described in Patent Documents 2 and 3, but the purpose of this process is not to improve the adhesion between the abrasive grains and the metal coating layer. It is to improve the adhesion between the abrasive grains and the binder. Therefore, for example, in the metal-coated abrasive grain described in Patent Document 2, a silane coupling layer is formed on the metal-coated layer.
また，上記課題を解決するために，本発明の第２の観点によれば，砥粒の表面の全部又は一部にシランカップリング剤を付着させるシランカップリング処理を行い，シランカップリング処理が行われた砥粒の表面に，めっきの化学反応を促進させる触媒を付与する触媒付与処理を行い，触媒付与処理が行われた砥粒に対して無電解めっきを行うことにより，シランカップリング剤が付着した砥粒の表面の全部又は一部に金属被覆層を形成する金属被覆砥粒の製造方法が提供される。 In order to solve the above-mentioned problem, according to the second aspect of the present invention, a silane coupling treatment for attaching a silane coupling agent to all or a part of the surface of the abrasive grains is performed, and the silane coupling treatment is performed. A silane coupling agent is applied to the surface of the abrasive grains that has been subjected to a catalyst application treatment that imparts a catalyst that promotes the chemical reaction of the plating, and electroless plating is applied to the abrasive grains that have undergone the catalyst application treatment. There is provided a method for producing metal-coated abrasive grains, in which a metal coating layer is formed on all or a part of the surface of the abrasive grains to which is adhered.
このように，砥粒などの表面にシランカップリング処理を施した後に，金属で被覆した砥粒を使用すると，結合材に対する保持力を向上させることができる。このため，砥石部を薄層形態に形成する場合には，砥粒の結合材に対する保持力が特に要求されることから，特に好適である。すなわち，本発明に係る製造方法により得られる金属被覆砥粒を使用し，例えば，電気めっきを行って穿孔手段（ドリル）等の先端部に砥粒を電着させた砥石を製造すると，電着ボンドに対する砥粒の保持力が向上しているので，高い切削能力や長寿命を有することができる。 As described above, when the abrasive grains coated with metal are used after the surface of the abrasive grains or the like is subjected to the silane coupling treatment, the holding power to the binder can be improved. For this reason, when the grinding wheel portion is formed in a thin layer form, the holding force of the abrasive grains to the binder is particularly required, which is particularly preferable. That is, when a metal-coated abrasive grain obtained by the production method according to the present invention is used and a grindstone in which abrasive grains are electrodeposited on the tip of a drilling means (drill) or the like by electroplating is produced, for example, Since the holding power of the abrasive grains against the bond is improved, it can have high cutting ability and long life.
ここで，本発明においてシランカップリング処理を行う目的が，砥粒の表面と金属被覆層との密着性を向上させることにあることは上記と同様である。 Here, the purpose of performing the silane coupling treatment in the present invention is to improve the adhesion between the surface of the abrasive grains and the metal coating layer, as described above.
上記金属被覆砥粒及びその製造方法において，上記シランカップリング剤は，アミノ基，カルボキシル基，アゾール基，水酸基，またはメルカプト基の少なくとも１つの官能基を含むことが好ましい。これらの官能基は金属捕捉能を有するため，金属との密着性を高めることができるためである。 In the metal-coated abrasive grains and the production method thereof, the silane coupling agent preferably contains at least one functional group of an amino group, a carboxyl group, an azole group, a hydroxyl group, or a mercapto group. This is because these functional groups have a metal-capturing ability and thus can improve the adhesion to the metal.
また，上記課題を解決するために，本発明の第３の観点によれば，上記第１の観点による金属被覆砥粒を使用して形成される砥石，あるいは，上記第２の観点による製造方法により得られた金属被覆砥粒を使用して形成される砥石が提供される。 In order to solve the above problem, according to a third aspect of the present invention, a grindstone formed using the metal-coated abrasive grain according to the first aspect, or a manufacturing method according to the second aspect The grindstone formed using the metal-coated abrasive grain obtained by the above is provided.
このように，シランカップリング処理がなされた金属被覆砥粒を使用することにより，電着ボンドに対する砥粒の保持力を向上させる砥石を製造することができ，砥石の切削能力や寿命を向上させることが可能となる。特に，砥粒を先端部に電着させた薄層の砥粒層を形成するドリル等に対して有効である。 In this way, by using metal-coated abrasive grains that have been subjected to silane coupling treatment, it is possible to manufacture a grindstone that improves the holding power of the abrasive grains against the electrodeposition bond, thereby improving the cutting ability and life of the grindstone. It becomes possible. In particular, this is effective for a drill or the like that forms a thin abrasive layer in which abrasive grains are electrodeposited on the tip.
本発明によれば，砥粒の表面に化学結合によってシランカップリング剤を強く結合させ表面を改質することにより，砥粒の表面と金属被覆層との密着性を向上させ，砥粒表面に金属を均一に被覆させることができる。したがって，このシランカップリング処理された金属被覆砥粒を使用することによって，電着ボンドに対する砥粒の保持力を向上させる砥石を製造することができ，砥石の切削能力や寿命を向上させることが可能となる。特に，砥粒を先端部に電着させた薄層の砥粒層を形成する孔開け装置（ドリル等）に有効である。 According to the present invention, the adhesiveness between the surface of the abrasive grain and the metal coating layer is improved by strongly bonding the silane coupling agent to the surface of the abrasive grain by chemical bonding, thereby improving the surface. A metal can be uniformly coated. Therefore, by using this metal-coated abrasive grain treated with silane coupling, it is possible to produce a grindstone that improves the holding power of the abrasive grain against the electrodeposition bond, and to improve the cutting ability and life of the grindstone. It becomes possible. In particular, it is effective for a drilling device (such as a drill) for forming a thin abrasive layer in which abrasive grains are electrodeposited on the tip.
以下に添付図面を参照しながら，本発明の好適な実施の形態について詳細に説明する。なお，本明細書及び図面において，実質的に同一の機能構成を有する構成要素については，同一の符号を付することにより重複説明を省略する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.
まず，図１に基づいて，本発明の一実施形態に係る金属被覆砥粒の構成について説明する。なお，図１は，本実施形態に係る金属被覆砥粒の構成を示す説明図である。 First, based on FIG. 1, the structure of the metal-coated abrasive grain which concerns on one Embodiment of this invention is demonstrated. In addition, FIG. 1 is explanatory drawing which shows the structure of the metal-coated abrasive grain which concerns on this embodiment.
図１に示すように，本実施形態に係る金属被覆砥粒は，砥粒の表面に金属被覆層が被覆されてなる金属被覆砥粒であって，砥粒の表面の全部又は一部に形成されたシランカップリング剤を含むシランカップリング層と，このシランカップリング層の表面の全部又は一部を被覆する金属被覆層と，を有する。 As shown in FIG. 1, the metal-coated abrasive according to the present embodiment is a metal-coated abrasive formed by coating the surface of the abrasive with a metal coating layer, and is formed on all or part of the surface of the abrasive. A silane coupling layer containing the prepared silane coupling agent, and a metal coating layer covering all or part of the surface of the silane coupling layer.
砥粒は，その種類が限定されるものではないが，加工能力を高くするためには，ダイヤモンド，ＣＢＮおよびＳｉＣなどの超砥粒であることが好ましい。また，砥粒の表面を被覆する金属としては，主に，Ｎｉを使用することができるが，これには限られず，ニッケル−リン合金，ニッケル−ほう素合金，銅，金，白金，コバルト，チタンなどを使用することができる。 The type of abrasive grains is not limited, but superabrasive grains such as diamond, CBN, and SiC are preferable in order to increase the processing capability. Moreover, as a metal which coat | covers the surface of an abrasive grain, although Ni can mainly be used, it is not restricted to this, Nickel-phosphorus alloy, nickel-boron alloy, copper, gold | metal | money, platinum, cobalt, Titanium or the like can be used.
また，本実施形態に係る金属被覆砥粒は，シランカップリング処理が施されているが，シランカップリング処理とは，本来なじみにくい無機成分と有機成分を結びつける仲立ちをするための処理で，無機物と相性のいい加水分解基（例えば，アルコン基）を一方の結合手に有し，他方の結合手には有機成分と反応しやすい有機官能基を有するシランカップリング剤を使用して行われる。 In addition, the metal-coated abrasive grains according to this embodiment are subjected to silane coupling treatment. The silane coupling treatment is a treatment for linking the inorganic component and the organic component, which are inherently unfamiliar with each other. A silane coupling agent having an organic functional group that has a hydrolyzable group (for example, an alkone group) that is compatible with an organic component and has an organic functional group that easily reacts with an organic component is used for the other bond.
本実施形態に係るシランカップリング剤は，下記一般式（１）で表すことができる。 The silane coupling agent according to this embodiment can be represented by the following general formula (1).
Ｙ−（ＣＨ２）ｎ−ＳｉＸ３ ・・・（１） Y- (CH 2) n -SiX 3 ··· (1)
ここで，Ｙ及びＸは，それぞれ有機官能基及び加水分解基である。 Here, Y and X are an organic functional group and a hydrolysis group, respectively.
このようなシランカップリング剤は，有機官能基Ｙが有機物と化学結合し，加水分解基Ｘが無機物又はシランカップリング剤同士と化学結合するように反応する。ここで，加水分解基ＸをＲＯ（Ｒはアルコキシシリル基）とすると，シランカップリング剤の加水分解は，下記反応式（２）で表すことができる。 Such a silane coupling agent reacts so that the organic functional group Y is chemically bonded to the organic substance and the hydrolyzable group X is chemically bonded to the inorganic substance or the silane coupling agent. Here, when the hydrolyzable group X is RO (R is an alkoxysilyl group), the hydrolysis of the silane coupling agent can be represented by the following reaction formula (2).
Ｙ−（ＣＨ２）ｎ−Ｓｉ（ＯＲ）３＋３Ｈ２Ｏ
→Ｙ−（ＣＨ２）ｎ−Ｓｉ（ＯＨ）３＋３ＲＯＨ ・・・（２）
Y- (CH 2) n -Si ( OR) 3 + 3H 2 O
→ Y- (CH 2) n -Si (OH) 3 + 3ROH ··· (2)
上記反応式（２）に示すように，水の存在下で加水分解基Ｘは分解されて，アルコキシシリル基からシラノール（ＳｉＯＨ）に変わり，加水分解物としてアルコールを生成する。また，反応式（２）により生成されたＯＨ基と無機物表面のＯＨとが脱水反応し，Ｙは有機物と反応する。このように，シランカップリング剤は無機物と有機物との橋渡しの役目をする。 As shown in the above reaction formula (2), the hydrolyzable group X is decomposed in the presence of water to change from an alkoxysilyl group to silanol (SiOH), and generate an alcohol as a hydrolyzate. Further, the OH group generated by the reaction formula (2) and the OH on the inorganic surface undergo a dehydration reaction, and Y reacts with the organic matter. Thus, the silane coupling agent serves as a bridge between inorganic and organic substances.
本実施形態に有用なシランカップリング剤としては，金属被覆層との密着性を高めるという観点から，金属捕捉能を持つ官能基を有するシランカップリング剤が好ましい。このような金属捕捉能を持つ官能基としては，これらに制限されるものではないが，例えば，アミノ基，カルボキシル基，アゾール基，水酸基，メルカプト基などが挙げられる。これらの中でもアゾール基が特に好ましい。アゾール基としては，例えば，イミダゾール，オキサゾール，チアゾール，セレナゾール，ピラゾール，イソオキサゾール，イソチアゾール，トリアゾール，オキサジアゾール，チアジアゾール，テトラゾール，オキサトリアゾール，チアトリアゾール，ベンダゾール，インダゾール，ベンズイミダゾール，ベンゾトリアゾールなどが挙げられる。 As a silane coupling agent useful in the present embodiment, a silane coupling agent having a functional group having a metal-trapping ability is preferable from the viewpoint of improving the adhesion with the metal coating layer. Such functional groups having a metal-capturing ability are not limited to these, but examples include amino groups, carboxyl groups, azole groups, hydroxyl groups, mercapto groups, and the like. Among these, an azole group is particularly preferable. Examples of the azole group include imidazole, oxazole, thiazole, selenazole, pyrazole, isoxazole, isothiazole, triazole, oxadiazole, thiadiazole, tetrazole, oxatriazole, thiatriazole, bendazole, indazole, benzimidazole, and benzotriazole. Can be mentioned.
また，一般式（１）で表されるシランカップリング剤又はその加水分解物としては，例えば，３−アミノプロピルトリメトキシシラン，γ−アミノプロピルトリメトキシシラン，Ｎ−β（アミノエチル）γ−アミノプロピルトリメトキシシラン，Ｎ−β（アミノエチル）γ−アミノプロピルトリエトキシシラン，γ−メルカプトプロピルトリメトキシシラン，β−グリシドキシエチルトリメトキシシラン，β−グリシドキシエチルメチルジメトキシシラン，γ−グリシドキシプロピルトリエトキシシラン，β−グリシドキシプロピルトリメトキシシラン，β−グリシドキシエチルメチルジメトキシシラン，β−グリシドキシエチルメチルジエトキシシラン，γ−グリシドキシプロピルメチルジメトキシシラン，γ−グリシドキシプロピルメチルジメトキシシラン，β−グリシドキシエチルエチルジメトキシシラン，γ−グリシドキシエチルメチルジメトキシシラン，γ−グリシドキシプロピルエチルジエトキシシラン，β−グリシドキシプロピルエチルジエトキシシラン，β−グリシドキシエチルプロピルジメトキシシラン，β−（３，４エポキシシクロヘキシル）エチルトリメトキシシラン，β−（３，４エポキシシクロヘキシル）エチルトリエトキシシラン，メチルトリメトキシシラン，メチルトリエトキシシラン，ビニルトリメトキシシラン，ビニルトリエトキシシラン，ビニルトリアセトキシシラン，ビニルトリメトキシエトキシシラン，γ−クロロプロピルトリメトキシシラン，γ−クロロプロピルトリエトキシシラン，γ−クロロプロピルトリプロポキシシラン，γ−クロロプロピルトリブトキシシラン，フェニルトリメトキシシラン，フェニルトリエトキシシラン，３，３，３−トリフロロプロピルトリメトキシシラン，γ−メタクリロキシプロピルトリメトキシシラン，ジメチルジメトキシシラン，γ−クロロプロピルメチルジメトキシシラン，γ−メタクリロキシプロピルメチルジメトキシシラン等がある。これらのシランカップリング剤又はその加水分解物は，単独または２種類以上を混合して用いることができる。 Examples of the silane coupling agent represented by the general formula (1) or a hydrolyzate thereof include 3-aminopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ- Aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, β-glycidoxyethyltrimethoxysilane, β-glycidoxyethylmethyldimethoxysilane, γ -Glycidoxypropyltriethoxysilane, β-glycidoxypropyltrimethoxysilane, β-glycidoxyethylmethyldimethoxysilane, β-glycidoxyethylmethyldiethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-Glycidoxypropylmethyl dimethoxy Sisilane, β-glycidoxyethylethyldimethoxysilane, γ-glycidoxyethylmethyldimethoxysilane, γ-glycidoxypropylethyldiethoxysilane, β-glycidoxypropylethyldiethoxysilane, β-glycidoxyethyl Propyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxy Silane, vinyltriacetoxysilane, vinyltrimethoxyethoxysilane, γ-chloropropyltrimethoxysilane, γ-chloropropyltriethoxysilane, γ-chloropropyltripropoxysilane, γ-chloropropyltri Butoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, dimethyldimethoxysilane, γ-chloropropylmethyldimethoxysilane, γ-methacrylic Examples include loxypropylmethyldimethoxysilane. These silane coupling agents or their hydrolysates can be used alone or in admixture of two or more.
このように，超砥粒などの原料粒子に対しシランカップリング処理を行うことによって，ＳｉＣ粒子等の原料粒子の表面を改質して，表面に被覆された金属被覆層との間を強い化学的結合で結びつけることができるため，砥粒と金属被覆層との密着性を格段に向上させることができる。 In this way, by performing silane coupling treatment on raw particles such as superabrasive grains, the surface of the raw material particles such as SiC particles is modified, and a strong chemical layer is formed between the surface and the metal coating layer coated on the surface. Therefore, the adhesiveness between the abrasive grains and the metal coating layer can be significantly improved.
次に，図２に基づいて，本実施形態に係る砥石の形成に使用される金属被覆砥粒の製造方法について説明する。なお，図２は，本実施形態に係る金属被覆砥粒の製造方法を示すフローチャートである。 Next, based on FIG. 2, the manufacturing method of the metal-coated abrasive grain used for formation of the grindstone concerning this embodiment is explained. In addition, FIG. 2 is a flowchart which shows the manufacturing method of the metal-coated abrasive grain which concerns on this embodiment.
本実施形態においては，ＳｉＣ粒子などの超砥粒にシランカップリング処理を施した金属（例えば，Ｎｉ）を被覆した金属被覆砥粒を形成する。具体的には，図２に示すように，まず，金属被覆砥粒の原料粒子，例えばＳｉＣ粒子などの超砥粒を用意する（ステップＳ１０２）。なお，原料である超砥粒は，粒径が＃２０００（４〜６μｍ）程度のものを使用することができる。 In the present embodiment, metal-coated abrasive grains in which superabrasive grains such as SiC particles are coated with a metal (for example, Ni) subjected to silane coupling treatment are formed. Specifically, as shown in FIG. 2, first, raw material particles of metal-coated abrasive grains, for example, superabrasive grains such as SiC particles are prepared (step S102). In addition, the superabrasive grain which is a raw material can use a thing with a particle size of about # 2000 (4-6 micrometers).
次いで，用意した原料粒子に対してシランカップリング処理を行う（ステップＳ１０４）。本実施形態において，このシランカップリング処理の目的は，超砥粒は，一般に，他の物質の濡れ性が悪いことから，超砥粒の表面に金属を被覆したときに，超砥粒の表面と金属被覆層との密着性が低くなり，金属被覆層が存在しない場所が発生してしまうことを防止することである。なお，「濡れ」とは，次のような現象をいう。すなわち，固体の表面は通常空気と接触しているが，固体は，その表面に気体分子を吸着しており，固体表面には，固体／気体間の界面が形成されている。この場合に，固体が液体と直接に接触するためには，液体が固体／気体間の界面を押しのけなければならない。このようにして，固体／気体間の界面が消失して新たに固体／液体間の界面が生じる現象を「濡れ」という。 Next, a silane coupling process is performed on the prepared raw material particles (step S104). In this embodiment, the purpose of this silane coupling treatment is that the superabrasive grains generally have poor wettability with other substances, and therefore the surface of the superabrasive grains is coated when the surface of the superabrasive grains is coated with metal. It is to prevent the occurrence of a place where the metal coating layer does not exist by reducing the adhesion between the metal coating layer and the metal coating layer. “Wet” refers to the following phenomenon. That is, the surface of the solid is normally in contact with air, but the solid adsorbs gas molecules on the surface, and a solid / gas interface is formed on the solid surface. In this case, in order for the solid to come into direct contact with the liquid, the liquid must push the solid / gas interface. The phenomenon in which the solid / gas interface disappears and a new solid / liquid interface is generated in this way is called “wetting”.
このように，超砥粒などの原料粒子に対しシランカップリング処理を行うことによって，ＳｉＣ粒子等の原料粒子の表面を改質して，表面に被覆された金属被覆層との間を強い化学的結合で結びつけることができるため，砥粒と金属被覆層との密着性を格段に向上させることができる。 In this way, by performing silane coupling treatment on the raw particles such as superabrasive grains, the surface of the raw material particles such as SiC particles is modified, and a strong chemical reaction with the metal coating layer coated on the surface is performed. Therefore, the adhesiveness between the abrasive grains and the metal coating layer can be significantly improved.
また，本実施形態に係る金属被覆砥粒の製造方法に使用するシランカップリング剤は，上述したように，上記一般式（１）で表される化合物であり，金属被覆層との密着性を高めるという観点から，金属捕捉能を持つ官能基を有するシランカップリング剤が好ましい。このような金属捕捉能を持つ官能基としては，これらに制限されるものではないが，例えば，アミノ基，カルボキシル基，アゾール基，水酸基，メルカプト基などが挙げられる。これらの中でもアゾール基が特に好ましい。アゾール基としては，例えば，イミダゾール，オキサゾール，チアゾール，セレナゾール，ピラゾール，イソオキサゾール，イソチアゾール，トリアゾール，オキサジアゾール，チアジアゾール，テトラゾール，オキサトリアゾール，チアトリアゾール，ベンダゾール，インダゾール，ベンズイミダゾール，ベンゾトリアゾールなどが挙げられる。 Moreover, as described above, the silane coupling agent used in the method for producing a metal-coated abrasive grain according to the present embodiment is a compound represented by the above general formula (1), and has an adhesive property with the metal coating layer. From the viewpoint of enhancing, a silane coupling agent having a functional group having a metal capturing ability is preferable. Such functional groups having a metal-capturing ability are not limited to these, but examples include amino groups, carboxyl groups, azole groups, hydroxyl groups, mercapto groups, and the like. Among these, an azole group is particularly preferable. Examples of the azole group include imidazole, oxazole, thiazole, selenazole, pyrazole, isoxazole, isothiazole, triazole, oxadiazole, thiadiazole, tetrazole, oxatriazole, thiatriazole, bendazole, indazole, benzimidazole, and benzotriazole. Can be mentioned.
次に，原料粒子（砥粒）がシランカップリング剤と混合された溶液を濾過して，砥粒の表面に付着しなかったシランカップリング剤を取り除く（ステップＳ１０６）。次いで，水や有機溶媒（アルコールなど）にシランカップリング剤が被覆された砥粒を入れて，その表面を洗浄し（ステップＳ１０８），さらに，洗浄後のシランカップリング剤が被覆された砥粒を乾燥させる（ステップＳ１１０）。なお，この後，原料粒子（砥粒）が凝集していた場合には，原料粒子を細かく粉砕してもよい。 Next, the solution in which the raw material particles (abrasive grains) are mixed with the silane coupling agent is filtered to remove the silane coupling agent that has not adhered to the surface of the abrasive grains (step S106). Next, the abrasive grains coated with the silane coupling agent are put in water or an organic solvent (alcohol, etc.), the surface is washed (step S108), and the abrasive grains coated with the washed silane coupling agent are then applied. Is dried (step S110). After that, if the raw material particles (abrasive grains) are aggregated, the raw material particles may be finely pulverized.
次いで，上記原料粒子の表面に無電解金属めっきを行う前に，めっきの化学反応を促進させるために触媒付与処理を行う（ステップＳ１１２）。触媒付与処理は，センシタイジング工程とアクチベイティング工程と呼ばれる工程からなる。センシタイジング工程は，化学めっき析出核となる触媒金属の微粒を基材表面に一様に還元析出分布させるため，触媒金属の微粒析出（触媒核付与）前に，基材表面を還元剤溶液で濡らす処理である。また，アクチベイティング工程は，化学めっきの析出核となる触媒の微粒を，溶液，コロイド分散液，気相等から沈析させたり，触媒を含むペイント，インク，接着剤の塗布等により，基材表面に付与したりするものである。 Next, before performing electroless metal plating on the surface of the raw material particles, a catalyst application treatment is performed in order to promote the chemical reaction of the plating (step S112). The catalyst application treatment includes steps called a sensitizing step and an activating step. In the sensitizing process, the fine particles of the catalyst metal, which are the chemical plating nuclei, are uniformly reduced and distributed on the surface of the substrate. It is a process of wetting with. In the activation process, catalyst fine particles, which are the precipitation nuclei of chemical plating, are precipitated from a solution, colloidal dispersion, gas phase, etc., or paint, ink, or adhesive containing the catalyst is applied to the substrate. It is given to the surface.
上記のような触媒能をもつ金属としては，周期律表第８族金属（Ｆｅ，Ｃｏ，Ｎｉ，Ｒｕ，Ｒｈ，Ｐｄ，Ｏｓ，Ｉｒ，Ｐｔ）や，第１Ｂ族金属（Ｃｕ，Ａｇ，Ａｕ）であり，特に，Ｐｄ，Ｐｔが好ましい。 Examples of the metal having catalytic ability as described above include Group 8 metals (Fe, Co, Ni, Ru, Rh, Pd, Os, Ir, Pt) and Group 1 B metals (Cu, Ag, Au). In particular, Pd and Pt are preferable.
次に，触媒付与処理（ステップＳ１１２）を行った原料粒子に対して無電解金属（例えば，Ｎｉ）めっきを行う（ステップＳ１１４）。ここで，無電解めっきとは，析出させる金属を含む溶剤（一般的には水）に溶ける化合物と還元剤をめっき液に溶解させた後に，基体をめっき液に浸漬させ，基体表面で金属を析出させることである。 Next, electroless metal (for example, Ni) plating is performed on the raw material particles subjected to the catalyst application process (step S112) (step S114). Here, electroless plating is a method in which a compound that dissolves in a solvent (generally water) containing a metal to be deposited and a reducing agent are dissolved in a plating solution, and then the substrate is immersed in the plating solution so that the metal is deposited on the surface of the substrate. It is to deposit.
このような無電解めっきを行う金属としては，主に，Ｎｉを使用することができるが，これには限られず，無電解めっきの種類としては，無電解ニッケル−リンめっき，無電解ニッケル−ほう素めっき，無電解銅めっき，無電解金めっき，無電解白金めっき，無電解コバルトめっき，無電解チタンめっきなどを使用することができる。 Ni can be mainly used as a metal for such electroless plating, but is not limited to this, and electroless plating types include electroless nickel-phosphorous plating and electroless nickel-method. Elemental plating, electroless copper plating, electroless gold plating, electroless platinum plating, electroless cobalt plating, electroless titanium plating, and the like can be used.
以上のような工程（ステップＳ１０２〜Ｓ１１４）によって，図１に示すような，原料粒子にシランカップリング処理を施した後に金属（Ｎｉ等）を被覆した金属被覆粒子を形成することができる。 Through the above-described steps (steps S102 to S114), metal-coated particles in which the raw material particles are coated with a metal (Ni or the like) after being subjected to silane coupling treatment as shown in FIG. 1 can be formed.
ここで，図３に基づいて，シランカップリング処理により，どのようにして原料粒子と金属との密着性を向上させるかについて説明する。なお，図３は，シランカップリング処理による砥粒と金属との密着性の向上効果を説明するための説明図である。また，図３は，原料粒子としてＳｉＣ粒子を使用し，触媒金属としてＰｄを使用し，めっきする金属としてＮｉを使用した例を示している。 Here, based on FIG. 3, how to improve the adhesion between the raw material particles and the metal by the silane coupling treatment will be described. In addition, FIG. 3 is explanatory drawing for demonstrating the improvement effect of the adhesiveness of the abrasive grain and metal by a silane coupling process. FIG. 3 shows an example in which SiC particles are used as raw material particles, Pd is used as a catalyst metal, and Ni is used as a metal to be plated.
図３に示すように，原料粒子であるＳｉＣ粒子の前処理が未処理のもの（シランカップリング処理を施していないもの）に対して，触媒付与処理を行うと，原料粒子表面に存在する水酸基に対して，触媒のＰｄが吸着（または付着）するだけであるので，ＰｄはＳｉＣ粒子に対して弱く付与されることになる。したがって，このようなＳｉＣ粒子に対し無電解Ｎｉめっきを行ったとしても，ＳｉＣ粒子とめっき金属であるＮｉとの密着性は悪い。 As shown in FIG. 3, when the pretreatment of the SiC particles as raw material particles is untreated (not subjected to silane coupling treatment), the hydroxyl group present on the surface of the raw material particles is obtained by applying a catalyst. On the other hand, since Pd of the catalyst only adsorbs (or adheres), Pd is weakly applied to the SiC particles. Therefore, even if electroless Ni plating is performed on such SiC particles, the adhesion between the SiC particles and the plating metal Ni is poor.
これに対して，ＳｉＣ粒子に対し，シランカップリング処理を行った場合には，ＳｉＣ粒子の表面にシランカップリング材の層が形成される。この場合，シランカップリング層に含まれる有機官能基（図３ではアミノ基）が，触媒金属のＰｄと錯体を形成するため，ＰｄがＳｉＣ粒子に対して強く付与される。したがって，このようなＳｉＣ粒子に対し無電解Ｎｉめっきを行うと，ＳｉＣ粒子とＮｉとの密着性が良好となる。 On the other hand, when the silane coupling treatment is performed on the SiC particles, a layer of a silane coupling material is formed on the surface of the SiC particles. In this case, since the organic functional group (amino group in FIG. 3) contained in the silane coupling layer forms a complex with Pd of the catalytic metal, Pd is strongly imparted to the SiC particles. Therefore, when electroless Ni plating is performed on such SiC particles, the adhesion between the SiC particles and Ni is improved.
このように，超砥粒などの表面にシランカップリング処理を施した後に，金属で被覆した砥粒を使用すると，結合材に対する保持力を向上させることができる。このため，例えば，図４に示すような穿孔手段（ドリル）１０の先端部１０ａ等に砥粒を電着させた砥石２０を製造する場合のように，砥石部を薄層形態に形成する場合には，砥粒の結合材に対する保持力が特に要求されることから，特に好適である。すなわち，上述のようにして製造した金属被覆砥粒を使用し，例えば，電気めっきを行って，基台部に砥粒を電着させた砥石を製造すると，電着ボンドに対する砥粒の保持力が向上しているので，高い切削能力や長寿命を有することができる。 As described above, when the abrasive grains coated with metal are used after the surface of superabrasive grains or the like is subjected to silane coupling treatment, the holding power to the binder can be improved. Therefore, for example, when the grindstone portion is formed in a thin layer form, as in the case of manufacturing the grindstone 20 in which the abrasive grains are electrodeposited on the tip portion 10a of the drilling means (drill) 10 as shown in FIG. Is particularly suitable because it requires a holding force of the abrasive grains to the binder. That is, using the metal-coated abrasive grains produced as described above, for example, when electroplating is performed to produce a grindstone in which abrasive grains are electrodeposited on the base part, the holding power of the abrasive grains against the electrodeposition bond Therefore, it can have high cutting ability and long life.
以下，実施例により本発明をさらに詳細に説明するが，本発明は，下記実施例により限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by the following Example.
（金属被覆砥粒の製造）
本実施例においては，原料粒子として粒径が♯２０００の範囲（４〜６μｍ）のＳｉＣ粒子を使用した。このＳｉＣ粒子にシランカップリング処理を施した。具体的には，シランカップリング処理は，３％超純水と６％のシランカップリング剤３−アミノプロピルトリメトキシシラン［Ｈ２Ｎ（ＣＨ２）３Ｓｉ（ＯＣＨ３）３］を１００ｃｍ３のメタノール溶媒液中に混合し，３０ｇの粒径が♯２０００の範囲のＳｉＣ粒子を加えて，１時間攪拌することによって行った。
(Manufacture of metal-coated abrasive grains)
In this example, SiC particles having a particle size in the range of # 2000 (4 to 6 μm) were used as raw material particles. The SiC particles were subjected to silane coupling treatment. Specifically, the silane coupling treatment is performed by adding 3% ultrapure water and 6% silane coupling agent 3-aminopropyltrimethoxysilane [H 2 N (CH 2 ) 3 Si (OCH 3 ) 3 ] to 100 cm 3. In a methanol solvent solution, 30 g of SiC particles having a particle size in the range of # 2000 were added and stirred for 1 hour.
次に，上記のＳｉＣ粒子がシランカップリング剤と混合された溶液を濾過して，ＳｉＣ粒子の表面に付着しなかったシランカップリング剤を取り除いた。次いで，メタノール→超純水→メタノールの順番で，それぞれの溶液中にシランカップリング剤が被覆されたＳｉＣ粒子を入れて，その表面を洗浄した。その後，７０℃の乾燥機で１０時間以上乾燥させた。 Next, the solution in which the SiC particles were mixed with the silane coupling agent was filtered to remove the silane coupling agent that did not adhere to the surface of the SiC particles. Next, SiC particles coated with a silane coupling agent were put into each solution in the order of methanol → ultra pure water → methanol, and the surface was washed. Then, it dried for 10 hours or more with a 70 degreeC dryer.
次に，上記ＳｉＣ粒子の表面に無電解Ｎｉめっきを行う前に，めっきの化学反応を促進させるために触媒付与処理を行った。触媒溶液としては，センシタイジング工程ではＳｎＣｌ２（塩化すず）を，アクチベイティング工程ではＰｄＣｌ２（塩化パラジウム）をそれぞれ純水に溶かした溶液を使用した。ＳｎＣｌ２の濃度とＰｄＣｌ２の濃度は，それぞれ１０ｐｐｍとし，粒子１０ｇを触媒溶液１００ｃｍ３中で２分間攪拌し，Ｓｎ，Ｐｄの順で触媒を付与した。Ｓｎによる触媒付与処理と，Ｐｄによる触媒付与処理との間には，超純水で洗浄して吸引濾過する工程を挟んだ。 Next, before the electroless Ni plating was performed on the surface of the SiC particles, a catalyst application treatment was performed in order to promote the chemical reaction of the plating. As the catalyst solution, a solution in which SnCl 2 (tin chloride) was dissolved in pure water in the sensitizing step and PdCl 2 (palladium chloride) in the activating step was used. The concentration of SnCl 2 and the concentration of PdCl 2 were 10 ppm each, and 10 g of particles were stirred in 100 cm 3 of the catalyst solution for 2 minutes, and the catalyst was applied in the order of Sn and Pd. Between the catalyst application treatment with Sn and the catalyst application treatment with Pd, a process of washing with ultrapure water and suction filtration was sandwiched.
次に，触媒付与処理を行ったＳｉＣ粒子に対して無電解Ｎｉめっきを行った。めっき浴組成を，アミノ酢酸（グリシン）（Ｈ２ＮＣＨ２ＣＯＯＨ）０．４ｍｏｌ／ｄｍ３，ホスフィン酸ナトリウム（ＮａＨ２ＰＯ２・Ｈ２Ｏ）０．３ｍｏｌ／ｄｍ３，硫酸ニッケル（ＮｉＳＯ４・６Ｈ２Ｏ）０．１ｍｏｌ／ｄｍ３の割合でそれぞれを純水に溶かしたものとした。また，めっき条件を，ｐＨ４．５（ＮａＯＨで調整），浴槽温度６０℃，浸漬時間２０分とした。上記の組成と条件で，めっき浴１００ｃｍ２に１０ｇの触媒付与処理をしたＳｉＣ粒子を加えてめっきを行った。 Next, electroless Ni plating was performed on the SiC particles subjected to the catalyst application treatment. The plating bath composition was aminoacetic acid (glycine) (H 2 NCH 2 COOH) 0.4 mol / dm 3 , sodium phosphinate (NaH 2 PO 2 .H 2 O) 0.3 mol / dm 3 , nickel sulfate (NiSO 4. 6H 2 O) was dissolved in pure water at a rate of 0.1 mol / dm 3 . The plating conditions were pH 4.5 (adjusted with NaOH), bath temperature 60 ° C., and immersion time 20 minutes. With the above composition and conditions, plating was performed by adding 10 g of catalyst-treated SiC particles to 100 cm 2 of the plating bath.
Ｎｉ金属は，浸漬時間が５〜２０分で，粒子の表面に平均２〜７ｎｍの厚さで付着すると考えられ，上記では約７ｎｍ程度付着すると推定される。 Ni metal is considered to adhere to the surface of the particles with an average thickness of 2 to 7 nm with an immersion time of 5 to 20 minutes, and is estimated to adhere to about 7 nm in the above.
また，無電解Ｎｉめっきは上述した方法に限られず，次のような方法でも行った。 Further, the electroless Ni plating is not limited to the method described above, and was also performed by the following method.
すなわち，めっき浴組成を，アミノ酢酸（グリシン）（Ｈ２ＮＣＨ２ＣＯＯＨ）０．４ｍｏｌ／ｄｍ３（モル濃度：溶液 １ ｄｍ３（１０００ｃｍ３）中に溶けている溶質の物質量（ｍｏｌ）で表す。），硫酸ニッケル（ＮｉＳＯ４・６Ｈ２Ｏ）０．１ｍｏｌ／ｄｍ３の割合でそれぞれを純水に溶かしたものとした。また，めっき条件を，ｐＨ４．５（ＮａＯＨで調整），浴槽温度６０℃，浸漬時間２０分とした。上記の組成と条件で，めっき浴１００ｃｍ２に１０ｇの触媒付与処理をしたＳｉＣ粒子を加えてホスフィン酸ナトリウム（ＮａＨ２ＰＯ２・Ｈ２Ｏ）０．３ｍｏｌ／ｄｍ３を滴下しながら，めっきを行った。 That is, the plating bath composition is expressed as the amount of solute dissolved in aminoacetic acid (glycine) (H 2 NCH 2 COOH) 0.4 mol / dm 3 (molar concentration: solution 1 dm 3 (1000 cm 3 )). Each of which was dissolved in pure water at a rate of 0.1 mol / dm 3 of nickel sulfate (NiSO 4 .6H 2 O). The plating conditions were pH 4.5 (adjusted with NaOH), bath temperature 60 ° C., and immersion time 20 minutes. With the above composition and conditions, plating was performed while adding 10 g of catalyst-treated SiC particles to 100 cm 2 of the plating bath and dropping 0.3 mol / dm 3 of sodium phosphinate (NaH 2 PO 2 .H 2 O). went.
以上の工程によって，ＳｉＣ粒子にシランカップリング処理を施したＮｉ金属を被覆した金属被覆砥粒を形成した。 Through the above steps, metal-coated abrasive grains in which SiC particles were coated with Ni metal obtained by performing silane coupling treatment on SiC particles were formed.
（比較実験）
次に，シランカップリング処理の有無によって砥粒（ＳｉＣ粒子）の表面にめっき金属（Ｎｉ）が付着する量がどの程度異なるかを比較した実験の結果について説明する。
(Comparative experiment)
Next, the results of an experiment comparing how much the amount of plating metal (Ni) attached to the surface of abrasive grains (SiC particles) varies depending on the presence or absence of silane coupling treatment will be described.
具体的には，本発明に係るシランカップリング処理を施したＳｉＣ粒子（Ａ）と，シランカップリング処理を施さなかったＳｉＣ粒子（Ｂ）とを用意し，無電解Ｎｉめっき時において単位時間当たりのＳｉＣ粒子の表面に付着するＮｉ金属の付着量を比較したものである。ＳｉＣ粒子（Ｂ）にはシランカップリング処理を施さなかったこと以外，ＳｉＣ粒子（Ａ）とＳｉＣ粒子（Ｂ）とは全く同じ条件で製造した。 Specifically, SiC particles (A) subjected to silane coupling treatment according to the present invention and SiC particles (B) not subjected to silane coupling treatment are prepared, and per unit time during electroless Ni plating. This compares the amount of Ni metal adhering to the surface of the SiC particles. The SiC particles (A) and the SiC particles (B) were produced under exactly the same conditions except that the SiC particles (B) were not subjected to silane coupling treatment.
また，ＳｉＣ粒子の表面に付着するＮｉ金属の付着量は，Ｎｉ金属を付着する前の質量とＮｉ金属を付着させた後の質量とを比較して，それらの質量の差を算出し，対象となったＳｉＣ粒子の個数と１個あたりの表面積とを掛け合せた総合面積で割った数値となっている。このようにして算出された実験結果を図５に示した。なお，図５は，本実施例におけるＳｉＣ粒子上のＮｉ金属付着量とめっき時間との関係を示したグラフであり，未処理粒子とシランカップリング処理を施した粒子とを比較したものである。 In addition, the amount of Ni metal adhering to the surface of the SiC particles is calculated by comparing the mass before adhering the Ni metal and the mass after adhering the Ni metal, and calculating the difference between the masses. The value is obtained by dividing the total area obtained by multiplying the number of the resulting SiC particles by the surface area per one. The experimental results calculated in this way are shown in FIG. FIG. 5 is a graph showing the relationship between the Ni metal adhesion amount on the SiC particles and the plating time in this example, and compares untreated particles with particles subjected to silane coupling treatment. .
図５に示したように，めっき時間の経過と共に，シランカップリング処理を施さなかったＳｉＣ粒子（Ｂ）より，シランカップリング処理を施したＳｉＣ粒子（Ａ）の上に付着するＮｉ金属が顕著に増加していることが分かった。 As shown in FIG. 5, as the plating time elapses, the Ni metal adhering to the SiC particles (A) subjected to the silane coupling treatment becomes more prominent than the SiC particles (B) not subjected to the silane coupling treatment. It has been found that it has increased.
また，図６に，未処理のＳｉＣ粒子に対して無電解Ｎｉめっきを行ったものと，シランカップリング処理を行ったＳｉＣ粒子に対して無電解Ｎｉめっきを行ったものの走査型電子顕微鏡写真を示した。ここで，図６において，Ｐ，Ｑは２．００μｍスケールの走査型電子顕微鏡写真，ｐ，ｑは５００ｎｍスケールの走査型電子顕微鏡写真を示している。また，Ｐ，ｐは，未処理のＳｉＣ粒子に対し無電解Ｎｉめっきを行った場合を示し，Ｑ，ｑは，シランカップリング処理を行ったＳｉＣ粒子に無電解Ｎｉめっきを行った場合を示している。 FIG. 6 shows scanning electron micrographs of the electroless Ni-plated untreated SiC particles and the electroless Ni-plated SiC particles subjected to silane coupling treatment. Indicated. Here, in FIG. 6, P and Q are scanning electron micrographs of 2.00 μm scale, and p and q are scanning electron micrographs of 500 nm scale. Moreover, P and p show the case where electroless Ni plating is performed on untreated SiC particles, and Q and q show the case where electroless Ni plating is performed on SiC particles subjected to silane coupling treatment. ing.
図６からわかるように，シランカップリング処理を施さなかったＳｉＣ粒子（Ｂ）より，シランカップリング処理を施したＳｉＣ粒子（Ａ）の上に付着したＮｉ粒子の量が多く，かつ，Ｎｉ粒子がＳｉＣ粒子に均一に付着していることがわかった。 As can be seen from FIG. 6, the amount of Ni particles adhering to the SiC particles (A) subjected to the silane coupling treatment is larger than the SiC particles (B) not subjected to the silane coupling treatment, and the Ni particles Was found to adhere uniformly to the SiC particles.
すなわち，これらの結果より，シランカップリング処理を行うことによってＳｉＣ粒子の表面にＮｉ金属が付着し易い状態となることが示唆された。この要因は，シランカップリング処理された砥粒の表面は濡れ性が高く，化学的結合がされ易いので，触媒が付着し易い状態となっているからであると考えられる。この結果，化学反応を促進させる触媒がシランカップリング処理されたＳｉＣ粒子（Ａ）の表面に十分に塗布されることとなり，無電解めっきを行うとＮｉ金属を多く付着させることができる。 That is, from these results, it was suggested that Ni metal tends to adhere to the surface of the SiC particles by performing the silane coupling treatment. This is presumably because the surface of the silane coupling-treated abrasive grains has high wettability and is easily chemically bonded, so that the catalyst is easily attached. As a result, the catalyst for promoting the chemical reaction is sufficiently applied to the surface of the SiC particles (A) subjected to the silane coupling treatment, and a large amount of Ni metal can be adhered by performing electroless plating.
このように，シランカップリング処理されたＳｉＣ粒子（Ａ）では，被覆された金属との密着力が高められていると考えられる。 As described above, it is considered that the SiC particles (A) subjected to the silane coupling treatment have enhanced adhesion with the coated metal.
また，シランカップリング処理されたＳｉＣ粒子（Ａ）によって結合材に対する保持力が向上することは，シランカップリング処理を施さないＳｉＣ粒子（Ｂ）と，シランカップリング処理されたＳｉＣ粒子（Ａ）とをそれぞれに基台に電解めっきさせた後に，その表面に対して同じテープを貼り付けて，その後にテープを剥離させることにより確認することができる。このテープ剥離試験は，ＪＩＳ Ｈ ８５０４−１９９９に準じた方法で行った。この結果を図７に示した。なお，図７において，Ｒ〜Ｔは，シランカップリング処理を施さなかったＳｉＣ粒子に無電解Ｎｉめっきを施した粒子を基台にめっきした場合を示し，ｒ〜ｔは，シランカップリング処理を施したＳｉＣ粒子に無電解Ｎｉめっきを施した粒子を基台にめっきした場合を示している。また，Ｒ，ｒは，テープを剥がした後のめっき表面の状態を示した走査型電子顕微鏡写真であり，Ｓ，ｓは，テープの粘着物（網目状のもの）の内部の状態を示した拡大像であり，Ｔ，ｔは，剥がされた後のテープの表面の状態を示した走査型電子顕微鏡写真である。 Further, the retention of the binding material by the SiC particles (A) subjected to the silane coupling treatment is improved by the SiC particles (B) not subjected to the silane coupling treatment and the SiC particles (A) subjected to the silane coupling treatment. After each is electroplated on the base, the same tape is applied to the surface, and then the tape is peeled off. This tape peeling test was performed by a method according to JIS H 8504-1999. The results are shown in FIG. In FIG. 7, R to T indicate cases where SiC particles that have not been subjected to silane coupling treatment are plated on particles that have been subjected to electroless Ni plating, and rt represents silane coupling treatment. This shows a case where particles obtained by applying electroless Ni plating to applied SiC particles are plated on a base. R and r are scanning electron micrographs showing the state of the plating surface after the tape is peeled off, and S and s are states inside the tape adhesive (mesh). It is an enlarged image, and T and t are scanning electron micrographs showing the state of the surface of the tape after peeling.
図７からわかるように，シランカップリング処理されたＳｉＣ粒子は基台に残留していたが，シランカップリング処理を施さなかったＳｉＣ粒子は除去され，剥がされたテープに付着していた。 As can be seen from FIG. 7, the SiC particles subjected to the silane coupling treatment remained on the base, but the SiC particles not subjected to the silane coupling treatment were removed and adhered to the peeled tape.
以上の結果から，本発明では，シランカップリング剤を介して，砥粒と被覆される金属とを化学的に結合させるので砥粒との密着性を向上させることができることが示唆された。 From the above results, in the present invention, it was suggested that the adhesiveness to the abrasive grains can be improved because the abrasive grains and the metal to be coated are chemically bonded via the silane coupling agent.
なお，被覆した金属によって切削力が低下してしまうことが憂慮されるが，砥粒と被覆された金属は，その硬さが大きく異なるため，被覆された金属は砥粒の表面に削られてしまうので，被覆した金属によって切削力が低下してしまうことはないと考えられる。 Although it is feared that the cutting force is reduced by the coated metal, the hardness of the abrasive grains and the coated metal differ greatly, so the coated metal is scraped to the surface of the abrasive grains. Therefore, it is considered that the cutting force is not reduced by the coated metal.
また，本発明の砥粒を使用して砥石を製造するときに使用される結合材については，電着ボンドに限らず，どのような結合材に対しても効果がある。さらに，被覆される金属の表面にさらにシランカップリング剤を形成することによって，結合材と砥粒との密着性を高めることができると考えられる。 In addition, the binder used when manufacturing the grindstone using the abrasive grains of the present invention is not limited to the electrodeposition bond, and is effective for any binder. Furthermore, it is considered that the adhesion between the binder and the abrasive grains can be improved by further forming a silane coupling agent on the surface of the metal to be coated.
以上，添付図面を参照しながら本発明の好適な実施形態について説明したが，本発明はかかる例に限定されないことは言うまでもない。当業者であれば，特許請求の範囲に記載された範疇内において，各種の変更例または修正例に想到し得ることは明らかであり，それらについても当然に本発明の技術的範囲に属するものと了解される。 As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to this example. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.
本発明は，金属被覆砥粒，金属被覆砥粒の製造方法，およびその金属被覆砥粒を使用した砥石に適用可能である。 The present invention is applicable to metal-coated abrasive grains, a method for producing metal-coated abrasive grains, and a grindstone using the metal-coated abrasive grains.
Claims (6)
前記砥粒の表面の全部又は一部に形成されたシランカップリング剤を含むシランカップリング層と；
前記シランカップリング層の表面の全部又は一部を被覆する金属被覆層と；
を有することを特徴とする，金属被覆砥粒。 In the metal-coated abrasive grains in which the surface of the abrasive grains is coated with a metal coating layer,
A silane coupling layer containing a silane coupling agent formed on all or part of the surface of the abrasive grains;
A metal coating layer covering all or part of the surface of the silane coupling layer;
A metal-coated abrasive grain characterized by comprising:
前記シランカップリング処理が行われた砥粒の表面に，めっきの化学反応を促進させる触媒を付与する触媒付与処理を行い，
前記触媒付与処理が行われた砥粒に対して無電解めっきを行うことにより，前記シランカップリング剤が付着した砥粒の表面の全部又は一部に金属被覆層を形成することを特徴とする，金属被覆砥粒の製造方法。 Perform silane coupling treatment to attach a silane coupling agent to all or part of the surface of the abrasive grains,
The surface of the abrasive grain that has been subjected to the silane coupling treatment is subjected to a catalyst imparting treatment that imparts a catalyst that promotes a chemical reaction of plating,
A metal coating layer is formed on all or part of the surface of the abrasive grains to which the silane coupling agent has adhered by performing electroless plating on the abrasive grains that have been subjected to the catalyst application treatment. , Manufacturing method of metal coated abrasive.
5. A grindstone formed by using metal-coated abrasive grains obtained by the production method according to claim 3 or 4.
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