JP2007196289A - 電子部品用無鉛金属材料 - Google Patents

電子部品用無鉛金属材料 Download PDF

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Publication number
JP2007196289A
JP2007196289A JP2006329712A JP2006329712A JP2007196289A JP 2007196289 A JP2007196289 A JP 2007196289A JP 2006329712 A JP2006329712 A JP 2006329712A JP 2006329712 A JP2006329712 A JP 2006329712A JP 2007196289 A JP2007196289 A JP 2007196289A
Authority
JP
Japan
Prior art keywords
lead
free
less
weight
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006329712A
Other languages
English (en)
Japanese (ja)
Inventor
Yuji Kuri
里 裕 二 久
Toronron Tan
トロンロン タン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2006329712A priority Critical patent/JP2007196289A/ja
Publication of JP2007196289A publication Critical patent/JP2007196289A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2006329712A 2005-12-27 2006-12-06 電子部品用無鉛金属材料 Pending JP2007196289A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006329712A JP2007196289A (ja) 2005-12-27 2006-12-06 電子部品用無鉛金属材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005375621 2005-12-27
JP2006329712A JP2007196289A (ja) 2005-12-27 2006-12-06 電子部品用無鉛金属材料

Publications (1)

Publication Number Publication Date
JP2007196289A true JP2007196289A (ja) 2007-08-09

Family

ID=38282343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006329712A Pending JP2007196289A (ja) 2005-12-27 2006-12-06 電子部品用無鉛金属材料

Country Status (5)

Country Link
US (1) US20070178007A1 (de)
JP (1) JP2007196289A (de)
KR (1) KR100829465B1 (de)
CN (1) CN101209516B (de)
DE (1) DE102006061636A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051255A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. はんだ継手
TWI778648B (zh) * 2021-06-04 2022-09-21 岱暉股份有限公司 焊料合金

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2179815A4 (de) * 2007-08-24 2010-09-08 Toshiba Kk Bindungszusammensetzung
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
JP5253857B2 (ja) * 2008-03-27 2013-07-31 株式会社東芝 摺動材料、摺動材料の製造方法およびそれを用いた軸受装置
WO2010122764A1 (ja) 2009-04-20 2010-10-28 パナソニック株式会社 はんだ材料および電子部品接合体
JP5189669B2 (ja) * 2011-05-24 2013-04-24 田中貴金属工業株式会社 活性金属ろう材
US9050651B2 (en) * 2011-06-14 2015-06-09 Ingot Metal Company Limited Method for producing lead-free copper—bismuth alloys and ingots useful for same
CN102717203B (zh) * 2012-07-04 2015-07-22 深圳市亿铖达工业有限公司 具有高延展性的低银无铅锡膏焊料
CN102717201B (zh) * 2012-07-04 2015-04-22 深圳市斯特纳新材料有限公司 具有耐腐蚀的高强度高温焊料
CN103732349B (zh) * 2012-08-08 2015-11-25 千住金属工业株式会社 高温无铅焊料合金
KR20190017073A (ko) * 2012-08-31 2019-02-19 센주긴조쿠고교 가부시키가이샤 피막, 전자 부품의 접착 방법, 피막의 형성 및 박리 방법, 및 도전성 밀착 재료
CN105431253A (zh) 2014-06-24 2016-03-23 播磨化成株式会社 焊料合金、焊料组合物、钎焊膏以及电子线路基板
KR101639614B1 (ko) * 2014-08-29 2016-07-15 한국기계연구원 다종 나노/마이크로 솔더 및 이의 제조방법
CN108213764A (zh) * 2017-12-13 2018-06-29 华南理工大学 一种可有效减小母材溶解量的锡基无铅钎料合金
CN108044255B (zh) * 2018-01-17 2020-04-28 中山翰华锡业有限公司 一种用于智能焊接的锡线
CN114807677B (zh) * 2021-05-19 2023-08-08 苏州优诺电子材料科技有限公司 一种锡合金及其制备方法
CN113579557B (zh) * 2021-08-12 2024-05-28 北京康普锡威科技有限公司 SnBi系材料合金及其制备方法和用途

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony
US5066459A (en) * 1990-05-18 1991-11-19 General Electric Company Advanced high-temperature brazing alloys
EP0612578A1 (de) * 1993-02-22 1994-08-31 AT&T Corp. Gegenstand, der ein bleifreies Weichlot mit verbesserten mechanischen Eigenschaften enthält
DE19526822C2 (de) * 1995-07-15 1998-07-02 Euromat Gmbh Lotlegierung, Verwendung der Lotlegierung und Verfahren zum Verbinden von Werkstücken durch Löten
US6047876A (en) * 1997-09-12 2000-04-11 Materials Resources International Process of using an active solder alloy
US20040151616A1 (en) * 2003-02-04 2004-08-05 Sabarese Daniel M. Lead-free alloys, composition thereof, methods of preparation and uses for soldering and babbitting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051255A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. はんだ継手
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
TWI457192B (zh) * 2007-10-19 2014-10-21 Nihon Superior Co Ltd Solder connector
US8999519B2 (en) 2007-10-19 2015-04-07 Nihon Superior Sha Co., Ltd. Solder joint
TWI778648B (zh) * 2021-06-04 2022-09-21 岱暉股份有限公司 焊料合金

Also Published As

Publication number Publication date
KR20070069069A (ko) 2007-07-02
KR100829465B1 (ko) 2008-05-19
CN101209516B (zh) 2010-10-13
DE102006061636A1 (de) 2007-08-09
US20070178007A1 (en) 2007-08-02
CN101209516A (zh) 2008-07-02

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