JP2007180066A - Light emitting device and illumination device - Google Patents

Light emitting device and illumination device Download PDF

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Publication number
JP2007180066A
JP2007180066A JP2005373428A JP2005373428A JP2007180066A JP 2007180066 A JP2007180066 A JP 2007180066A JP 2005373428 A JP2005373428 A JP 2005373428A JP 2005373428 A JP2005373428 A JP 2005373428A JP 2007180066 A JP2007180066 A JP 2007180066A
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light
light emitting
emitting device
wavelength conversion
emitting element
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JP4698412B2 (en
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Toru Miyake
徹 三宅
Mitsuo Yanagisawa
美津夫 柳澤
Hiroki Mori
裕樹 森
Shingo Matsuura
真吾 松浦
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which a wavelength conversion member cannot easily be peeled off due to deterioration of heat and adhesive, and which has sufficient light emission performance, and to provide a illumination device. <P>SOLUTION: The light emitting device includes: a substrate 1; a light emitting element 2 loaded on an upper face of the substrate 1; a reflection member 4 fitted on the upper face of the substrate 1 so that it surrounds the light emitting element 2; and a plate-like wavelength conversion member 3 arranged inside the reflection member 2 while being spaced apart from the light emitting element 2 so that it surrounds the light emitting element 2, and comprises a phosphor which is excited by light that the light emitting element 2 emits and generates fluorescence. The reflection member 4 has an upper confronted face 6a confronted with an upper face of an outer periphery of the wavelength conversion member 3, and a lower confronted face 6b confronted with a lower face of the outer periphery of the wavelength conversion member 3. Since the wavelength conversion member 3 is loosely fitted between the upper confronted face 6a and the lower confronted face 6b and is held, the device is not easily peeled off due to deterioration of adhesive, and reliability improves. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子が発する光を外部に効率よく放射する発光装置および照明装置に関する。   The present invention relates to a light emitting device and an illumination device that efficiently emits light emitted from a light emitting element to the outside.

従来の発光ダイオード（ＬＥＤ）等の発光素子から発光される近紫外光や、青色，赤色，緑色，青色，黄色等の可視領域波長の光を発光する発光装置を図１５に示す。図１５において、１１は基体、１２は発光素子、１３は波長変換部材を示す。   FIG. 15 shows a light-emitting device that emits near-ultraviolet light emitted from a light-emitting element such as a conventional light-emitting diode (LED) and light in the visible region wavelength such as blue, red, green, blue, and yellow. In FIG. 15, 11 is a substrate, 12 is a light emitting element, and 13 is a wavelength conversion member.

従来の発光装置は、上面に発光素子１２を搭載するための搭載部１１ａを有し、搭載部１１ａまたはその周辺から発光装置の内外を電気的に導通接続する配線導体１１ｂが形成された絶縁体からなる基体１１と、搭載部１１ａに配線導体１１ｂと導電性部材１５を介してフリップチップ実装され電気的に接続固定された発光素子１２と、基体１１上面に発光素子１２を取り囲むように配置された反射部材１４と、反射部材１４の開口部を覆うように接着剤１６を介して取着された波長変換部材１３から主に構成される。   The conventional light emitting device has a mounting portion 11a for mounting the light emitting element 12 on the upper surface, and an insulator in which a wiring conductor 11b is formed to electrically connect the inside and outside of the light emitting device from the mounting portion 11a or its periphery. And a light emitting element 12 that is flip-chip mounted and electrically connected and fixed to the mounting portion 11a via the wiring conductor 11b and the conductive member 15, and is disposed on the upper surface of the base 11 so as to surround the light emitting element 12. The reflection member 14 and the wavelength conversion member 13 attached via an adhesive 16 so as to cover the opening of the reflection member 14 are mainly configured.

この発光装置は、発光装置駆動回路基板（図示せず）から供給される駆動電流により、発光素子１２を発光させ、発光素子１２から放射された可視光や近紫外光によって波長変換部材１３を励起させ、所望の波長スペクトルに変換して可視光を放射することができる発光装置である。近年、この様な発光装置は、照明用光源として利用され始めており、特に発光装置の発光効率や放射される光の色再現性や色安定性，環境性に対する要求が高まってきている。
特開２００３−１１０１４６号公報 特開２０００−１５６５２８号公報 The light emitting device causes the light emitting element 12 to emit light by a drive current supplied from a light emitting device driving circuit board (not shown), and excites the wavelength conversion member 13 by visible light or near ultraviolet light emitted from the light emitting element 12. The light emitting device can emit visible light after being converted into a desired wavelength spectrum. In recent years, such a light-emitting device has begun to be used as a light source for illumination, and in particular, there has been an increasing demand for light emission efficiency of the light-emitting device, color reproducibility, color stability, and environmental properties of emitted light.
JP 2003-110146 A JP 2000-156528 A

しかしながら、上記構成の発光装置においては、発光素子１２および波長変換部材１３から発せられる光が接着剤１６に吸収されることから、発光素子１２から波長変換部材１３に入射される光が減少するとともに、波長変換部材１３を介して放射される光が減少する。その結果、発光装置は、発光効率および光出力が低下するという問題点を有していた。   However, in the light emitting device configured as described above, the light emitted from the light emitting element 12 and the wavelength conversion member 13 is absorbed by the adhesive 16, so that the light incident on the wavelength conversion member 13 from the light emitting element 12 is reduced. The light emitted through the wavelength conversion member 13 is reduced. As a result, the light emitting device has a problem that the light emission efficiency and the light output are reduced.

また、発光素子１２からの熱が、基体１１と反射部材１４および接着剤１６を介して波長変換部材１３に伝達されることから、波長変換部材１３が変形したり、波長変換部材１３の光の透過率が劣化したり、波長変換部材１３の発光素子１２からの光を波長変換する効率（波長変換効率）が低下する。その結果、発光装置は、波長変換部材１３を介して放射される光が減少するとともに、波長変換部材１３を介して所望する色および波長スペクトルを有する光を発光装置より放射できないという問題点を有していた。   Further, since the heat from the light emitting element 12 is transmitted to the wavelength conversion member 13 through the base 11, the reflection member 14, and the adhesive 16, the wavelength conversion member 13 is deformed or the light of the wavelength conversion member 13 is transmitted. The transmittance deteriorates, and the efficiency of converting the wavelength of light from the light emitting element 12 of the wavelength conversion member 13 (wavelength conversion efficiency) decreases. As a result, the light emitting device has problems that light emitted through the wavelength converting member 13 is reduced and light having a desired color and wavelength spectrum cannot be emitted from the light emitting device through the wavelength converting member 13. Was.

また、接着剤１６による光吸収損失を低減させるため、発光素子１２の光に対して透明な樹脂やガラス等から成る接着剤１６を使用する場合、発光素子１２からの光が接着剤１６を透過して発光装置の側面から外部に放射される。その結果、発光素子１２から波長変換部材１３に入射される光が減少し、波長変換部材１３によって波長変換される光が減少する。さらに、透明性の接着剤１６を透過して発光装置の外部に漏洩した発光素子１２からの光が、波長変換部材１３から放射される光と混合される。これらの結果、発光装置は、発光効率および光出力が低下するとともに、所望する波長スペクトルおよび発光色を有する光を放射できないという問題点を有していた。   Further, in order to reduce the light absorption loss due to the adhesive 16, when the adhesive 16 made of resin or glass that is transparent to the light of the light emitting element 12 is used, the light from the light emitting element 12 passes through the adhesive 16. Then, the light is emitted from the side surface of the light emitting device. As a result, the light incident on the wavelength conversion member 13 from the light emitting element 12 decreases, and the light subjected to wavelength conversion by the wavelength conversion member 13 decreases. Further, the light from the light emitting element 12 that has passed through the transparent adhesive 16 and leaked to the outside of the light emitting device is mixed with the light emitted from the wavelength conversion member 13. As a result, the light emitting device has problems in that the light emission efficiency and the light output are lowered, and light having a desired wavelength spectrum and emission color cannot be emitted.

また、発光素子１２からの光が、紫外領域から近紫外領域および青色領域を含む光を放射する場合、透明性の接着剤１６を透過して発光装置の外部に漏洩したエネルギーの高い光が、発光装置の周辺部材や周辺機器の変色や機械的な強度劣化に影響を及ぼすという問題点を有していた。   Further, when the light from the light emitting element 12 emits light including the near ultraviolet region and the blue region from the ultraviolet region, the high energy light that has passed through the transparent adhesive 16 and leaked to the outside of the light emitting device, There has been a problem of affecting the discoloration and mechanical strength deterioration of the peripheral members and peripheral devices of the light emitting device.

また、接着による方法おいて避けられない問題として、接着剤１６が有機材料から成り、発光素子１２からの光や外光に紫外領域から近紫外領域および青色領域の光が含まれる場合、接着剤１６内の分子間結合が発光素子１２からの光や外光によって切断され、接着剤１６の機械的強度が劣化する。その結果、波長変換部材１３は、強固に反射部材１４に接着固定されず、波長変換部材１３が反射部材１４から剥がされたり、接着剤１６にクラックが発生したりする。このために、発光装置の長期信頼性が低下するという問題点を有していた。   In addition, as an inevitable problem in the bonding method, the adhesive 16 is made of an organic material, and when the light from the light emitting element 12 or external light includes light from the ultraviolet region to the near ultraviolet region and the blue region, the adhesive agent is used. Intermolecular bonds in 16 are cut by light from the light emitting element 12 or external light, and the mechanical strength of the adhesive 16 is deteriorated. As a result, the wavelength conversion member 13 is not firmly bonded and fixed to the reflection member 14, and the wavelength conversion member 13 is peeled off from the reflection member 14 or a crack occurs in the adhesive 16. For this reason, there has been a problem that the long-term reliability of the light emitting device is lowered.

さらにまた、波長変換部材１３が、接着材１６を介して反射部材１４に接着固定されていることにより、発光装置を発光装置駆動回路基板に実装する場合、波長変換部材１３と接着剤１６および反射部材１４との間に、実装環境の周囲温度と各々の熱膨張係数差に起因した応力が発生することになり、波長変換部材１３が反射部材１４から剥がされたり、接着剤１６にクラックが発生したりする。その結果、発光装置は、長期間にわたって正常かつ安定して光を放射できない、すなわち発光装置の寿命が短くなるという問題点を有していた。   Furthermore, when the wavelength conversion member 13 is bonded and fixed to the reflection member 14 via the adhesive 16, when the light emitting device is mounted on the light emitting device driving circuit board, the wavelength conversion member 13, the adhesive 16, and the reflection are provided. The stress due to the ambient temperature of the mounting environment and the respective thermal expansion coefficients is generated between the member 14 and the wavelength conversion member 13 is peeled off from the reflecting member 14 or a crack is generated in the adhesive 16. To do. As a result, the light emitting device has a problem that it cannot emit light normally and stably over a long period of time, that is, the life of the light emitting device is shortened.

したがって、本発明は上記問題点に鑑み完成されたものであり、その目的は、波長変換部材が熱や接着剤の劣化等によって剥離しにくく、良好な発光性能を有する発光装置および照明装置を提供することにある。   Therefore, the present invention has been completed in view of the above problems, and an object of the present invention is to provide a light emitting device and a lighting device that have a favorable light emitting performance because the wavelength conversion member is hardly peeled off due to heat, adhesive deterioration, or the like. There is to do.

本発明の発光装置は、基体と、この基体の上面に搭載された発光素子と、前記基体の上面に前記発光素子を取り囲むように取着された反射部材と、前記反射部材の内側に、前記発光素子を覆うように前記発光素子と離間させて配置され、前記発光素子が発する光に励起されて蛍光を発生する蛍光体を含有した板状の波長変換部材とを備えて成る発光装置において、前記反射部材は、その内周面に、前記波長変換部材の外周部の上面に対向する上側対向面および前記波長変換部材の外周面の下面に対向する下側対向面を有していることを特徴とする。   The light-emitting device of the present invention includes a base, a light-emitting element mounted on the top surface of the base, a reflective member attached to the top surface of the base so as to surround the light-emitting element, and the inside of the reflective member, In a light emitting device comprising a plate-like wavelength conversion member that is disposed so as to cover the light emitting element and is spaced apart from the light emitting element, and containing a phosphor that is excited by light emitted from the light emitting element and generates fluorescence. The reflection member has, on its inner peripheral surface, an upper facing surface that faces the upper surface of the outer peripheral portion of the wavelength conversion member and a lower facing surface that faces the lower surface of the outer peripheral surface of the wavelength conversion member. Features.

本発明の発光装置において好ましくは、前記波長変換部材の外周部は、前記反射部材の内周に沿って形成された溝状凹部内に遊嵌されており、前記上側対向面および前記下側対向面が前記溝状凹部の内面の一部を構成していることを特徴とする。   Preferably, in the light emitting device of the present invention, the outer peripheral portion of the wavelength conversion member is loosely fitted in a groove-shaped recess formed along the inner periphery of the reflecting member, and the upper facing surface and the lower facing portion The surface constitutes a part of the inner surface of the groove-shaped recess.

本発明の発光装置において好ましくは、前記反射部材は、前記上側対向面よりも上方に位置する前記反射部材の開口径が上方に向かって拡がるようにされていることを特徴とする。   In the light emitting device of the present invention, preferably, the reflecting member is configured such that an opening diameter of the reflecting member positioned above the upper facing surface is expanded upward.

本発明の発光装置において好ましくは、前記下側対向面の端部は、前記上側対向面の端部よりも前記発光素子側に配設されていることを特徴とする。   In the light emitting device of the present invention, preferably, the end portion of the lower facing surface is disposed closer to the light emitting element than the end portion of the upper facing surface.

本発明の発光装置において好ましくは、前記上側対向面および下側対向面は、前記反射部材の内周に環状に設けられていることを特徴とする。   In the light emitting device of the present invention, preferably, the upper facing surface and the lower facing surface are provided in an annular shape on the inner periphery of the reflecting member.

本発明の発光装置において好ましくは、前記反射部材は、前記波長変換部材の上側が透光性であることを特徴とする。   In the light-emitting device of the present invention, preferably, the reflecting member is translucent on the upper side of the wavelength conversion member.

本発明の発光装置において好ましくは、前記上側対向面および下側対向面の少なくとも一方は、突起の一部であることを特徴とする。   In the light emitting device of the present invention, preferably, at least one of the upper facing surface and the lower facing surface is a part of a protrusion.

本発明の発光装置において好ましくは、前記突起は、透光性であることを特徴とする。   In the light emitting device of the present invention, preferably, the protrusion is light-transmitting.

本発明の発光装置において好ましくは、前記発光素子は、少なくとも紫外領域から青色領域に含まれる光を放射する前記発光素子であることを特徴とする。   In the light-emitting device of the present invention, preferably, the light-emitting element is the light-emitting element that emits light included in at least an ultraviolet region to a blue region.

本発明の発光装置において好ましくは、前記上側対向面および下側対向面の内面が拡散面にされていることを特徴とする。   The light emitting device of the present invention is preferably characterized in that inner surfaces of the upper facing surface and the lower facing surface are diffusion surfaces.

本発明の発光装置において好ましくは、前記発光素子は、透光性部材によって被覆されていることを特徴とする。   In the light emitting device of the present invention, preferably, the light emitting element is covered with a translucent member.

本発明の発光装置において好ましくは、前記透光性部材は、シリコーン樹脂から成ることを特徴とする。   In the light emitting device of the present invention, preferably, the translucent member is made of a silicone resin.

本発明の照明装置は、上記本発明の発光装置と、前記発光装置が搭載され、前記発光装置を駆動する電気配線を有する駆動部と、前記発光装置から出射される光を反射する光反射手段とを含む。   The illuminating device of the present invention includes the light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having an electrical wiring for driving the light emitting device, and light reflecting means for reflecting light emitted from the light emitting device. Including.

本発明の発光装置は、反射部材の内周面に、波長変換部材の外周部の上面に対向する上側対向面および波長変換部材の下面に対向する下側対向面を有していることにより、波長変換部材は、その外周部を上側対向面および下側対向面によって挟み込まれるように保持されることから、波長変換部材と反射部材とを接着する接着剤や波長変換部材および反射部材の材料物性によって接着強度が影響されることがなく、接着剤を介して波長変換部材を固定する従来の発光装置と比較し、波長変換部材の固定を安定させることができ、波長変換部材が反射部材より剥離することを抑制できる。その結果、発光装置の長期信頼性や動作寿命は向上する。   The light emitting device of the present invention has, on the inner peripheral surface of the reflecting member, an upper facing surface that faces the upper surface of the outer peripheral portion of the wavelength conversion member and a lower facing surface that faces the lower surface of the wavelength conversion member. Since the wavelength conversion member is held so that the outer peripheral portion is sandwiched between the upper facing surface and the lower facing surface, an adhesive for bonding the wavelength conversion member and the reflecting member, or material properties of the wavelength converting member and the reflecting member Compared with conventional light emitting devices that fix the wavelength conversion member via the adhesive, the wavelength conversion member can be fixed stably, and the wavelength conversion member is peeled off from the reflection member. Can be suppressed. As a result, the long-term reliability and operating life of the light emitting device are improved.

さらに、波長変換部材は、上側対向面および下側対向面の間に遊嵌されるように保持されることにより、発光装置を発光装置駆動回路基板に実装する際の周囲温度や、発光装置を作動させる際の発光素子からの熱によって、波長変換部材と反射部材との熱膨張係数差に起因した応力がそれぞれに発生し難くなる。その結果、波長変換部材が変形したり、反射部材から剥がれたりせず、発光装置を長期間にわたり正常かつ安定して作動できる。   Further, the wavelength conversion member is held so as to be loosely fitted between the upper facing surface and the lower facing surface, so that the ambient temperature when the light emitting device is mounted on the light emitting device driving circuit board, the light emitting device Due to the heat from the light emitting element at the time of operation, stress due to the difference in thermal expansion coefficient between the wavelength conversion member and the reflection member is hardly generated. As a result, the wavelength converting member is not deformed or peeled off from the reflecting member, and the light emitting device can be operated normally and stably over a long period of time.

また、波長変換部材と上側対向面および下側対向面との間にできる隙間部によって、発光素子からの熱が反射部材から波長変換部材に伝えられ難くなる。その結果、波長変換部材が、発光素子からの熱によって変形したり、透過率が劣化したり、波長変換効率が劣化したりすることを抑制できる。   Further, the gap formed between the wavelength conversion member and the upper facing surface and the lower facing surface makes it difficult for heat from the light emitting element to be transferred from the reflecting member to the wavelength converting member. As a result, it can be suppressed that the wavelength conversion member is deformed by heat from the light emitting element, the transmittance is deteriorated, or the wavelength conversion efficiency is deteriorated.

さらに、波長変換部材の外周部から放射される一部の光は、波長変換部材と上側対向面または下側対向面との間に形成される隙間部との界面で波長変換部材と隙間部との屈折率差によって波長変換部材内に全反射される。その結果、波長変換部材の外周部から外側へ放射されて失われる光が少なくなり、発光装置の光出力や発光効率が向上する。さらに、波長変換部材を反射部材に接着固定する樹脂やガラス等を用いないので、発光素子や波長変換部材からの光が、樹脂やガラス等から成る接着剤で光吸収されない。   Further, some of the light emitted from the outer peripheral portion of the wavelength conversion member is separated from the wavelength conversion member and the gap portion at the interface between the wavelength conversion member and the gap portion formed between the upper facing surface or the lower facing surface. Is totally reflected in the wavelength conversion member by the difference in refractive index. As a result, less light is emitted and lost from the outer periphery of the wavelength conversion member, and the light output and light emission efficiency of the light emitting device are improved. Furthermore, since the resin or glass that adheres and fixes the wavelength conversion member to the reflecting member is not used, light from the light emitting element or the wavelength conversion member is not absorbed by the adhesive made of resin or glass.

また、波長変換部材は、その外周部の上下面がそれぞれ上側対向面および下側対向面の間に遊嵌されるように固定される構成となることから、波長変換部材と反射部材とを接着する接着剤の特性によって接着強度が影響されるようなことがない。その結果、波長変換部材の保持が長期間安定し、反射部材からの剥がれが抑制されて、発光装置の長期信頼性や寿命は向上する。   In addition, the wavelength conversion member is configured to be fixed so that the upper and lower surfaces of the outer peripheral portion are loosely fitted between the upper facing surface and the lower facing surface, respectively. The adhesive strength is not affected by the properties of the adhesive. As a result, holding of the wavelength conversion member is stabilized for a long time, peeling from the reflecting member is suppressed, and long-term reliability and life of the light-emitting device are improved.

本発明の発光装置において好ましくは、波長変換部材の外周部は、反射部材の内周に沿って形成された溝状凹部内に遊嵌されていることから、波長変換部材と溝状凹部の内面との間の隙間部を伝搬して発光装置の外部に放射される光を抑制できる。すなわち、隙間部に入射した光は、隙間部より屈折率の高い波長変換部材との界面で波長変換部材に入射されやすくなる。その結果、隙間部内を伝搬して発光装置の外部に放射される光が低減され、波長変換部材内で変換されて放射される光が増加し、発光装置の光出力や発光効率を向上できるとともに、発光装置から放射される光に発光素子からの光が混合する等による色バラツキや色ムラを抑制できる。   In the light-emitting device of the present invention, preferably, the outer peripheral portion of the wavelength conversion member is loosely fitted in a groove-shaped recess formed along the inner periphery of the reflecting member. It is possible to suppress light that propagates through a gap between the light emitting device and the light emitted to the outside of the light emitting device. That is, the light that has entered the gap is likely to enter the wavelength conversion member at the interface with the wavelength conversion member having a higher refractive index than the gap. As a result, the light that propagates in the gap and is emitted to the outside of the light emitting device is reduced, the light that is converted and emitted in the wavelength conversion member is increased, and the light output and light emission efficiency of the light emitting device can be improved. In addition, it is possible to suppress color variation and color unevenness due to light emitted from the light emitting device mixed with light emitted from the light emitting device.

本発明の発光装置において好ましくは、反射部材は上側対向面よりも上方に位置する反射部材の開口径が上方に向かって拡がるようにされていることから、発光素子からの光または波長変換部材によって波長変換された光が上側対向面より上側の拡がるように形成された内周面で所望する角度に反射される。その結果、発光装置は、表示用光源や照明用光源等の様々な配光制御が必要とされる発光装置として用いることができる。また、波長変換部材を上側対向面と下側対向面との間に挟み込むように組み立てる作業が容易となる。   In the light emitting device of the present invention, preferably, the reflecting member is configured such that the opening diameter of the reflecting member located above the upper facing surface is expanded upward, so that the light from the light emitting element or the wavelength converting member is used. The wavelength-converted light is reflected at a desired angle by an inner peripheral surface formed so as to spread above the upper facing surface. As a result, the light-emitting device can be used as a light-emitting device that requires various light distribution controls, such as a display light source and an illumination light source. In addition, the work of assembling the wavelength conversion member so as to be sandwiched between the upper facing surface and the lower facing surface is facilitated.

また、本発明の発光装置において好ましくは、下側対向面の端部は、上側対向面の端部よりも発光素子側に配設されていることから、波長変換部材の下面と下側対向面との間に形成される隙間部を伝搬する光の経路が長くなり、隙間部を伝播する光が屈折率差によって波長変換部材に入射され易くなるとともに、この隙間部を経由して発光素子からの光が発光装置の外部に漏洩し難くなる。また、発光装置の外部に露出する波長変換部材の上側主面の面積は大きくなる。その結果、波長変換部材からの光は有効に発光装置の外部に取り出され、発光装置の光出力や発光効率は向上する。   In the light emitting device of the present invention, preferably, the end portion of the lower facing surface is disposed closer to the light emitting element than the end portion of the upper facing surface. The path of light propagating through the gap formed between the light source and the light becomes longer, and the light propagating through the gap becomes easier to enter the wavelength conversion member due to the difference in refractive index. Light is less likely to leak outside the light emitting device. Moreover, the area of the upper main surface of the wavelength conversion member exposed to the outside of the light emitting device is increased. As a result, the light from the wavelength conversion member is effectively extracted outside the light emitting device, and the light output and light emission efficiency of the light emitting device are improved.

また、本発明の発光装置において好ましくは、上側対向面および下側対向面は、反射部材の内周に環状に設けられていることから、反射部材の内側表面に沿って伝搬する発光素子からの光が、波長変換部材の内部に入射することなく、波長変換部材の側方を経て発光装置の外部に漏洩しなくなる。その結果、発光装置外部に漏洩する発光素子からの光が少なくなり、発光素子からの漏洩光と波長変換部材で変換された光とが混合されて発光装置の外部に放射されることが抑制され、発光装置からは所望の波長スペクトルおよび発光色を有する光を放射できる。   In the light emitting device of the present invention, preferably, the upper facing surface and the lower facing surface are provided in an annular shape on the inner periphery of the reflecting member, and thus from the light emitting element that propagates along the inner surface of the reflecting member. Light does not enter the wavelength conversion member and does not leak to the outside of the light emitting device through the side of the wavelength conversion member. As a result, light from the light emitting element that leaks to the outside of the light emitting device is reduced, and the leakage light from the light emitting element and the light converted by the wavelength conversion member are prevented from being mixed and emitted to the outside of the light emitting device. The light emitting device can emit light having a desired wavelength spectrum and emission color.

さらにまた、発光素子からの光が、紫外領域から近紫外領域および青色領域を含む光を放射する場合、隙間部を伝搬して発光装置の外部にエネルギーの高い光が漏洩され難く、発光装置の周辺部材や周辺機器の変色や機械的な強度等の特性変化を抑制できる。   Furthermore, when the light from the light emitting element emits light including the near ultraviolet region and the blue region from the ultraviolet region, it is difficult for light with high energy to leak outside the light emitting device by propagating through the gap. Changes in characteristics such as discoloration and mechanical strength of peripheral members and peripheral devices can be suppressed.

本発明の発光装置において好ましくは、反射部材は、波長変換部材の上側が透光性であることから、波長変換部材の外周部より放射される変換光が、透光性の反射部材を透過して発光装置の外部に放射されやすくなり、発光装置の光出力や発光効率は向上する。   Preferably, in the light emitting device of the present invention, since the reflection member is translucent on the upper side of the wavelength conversion member, the converted light emitted from the outer peripheral portion of the wavelength conversion member is transmitted through the translucent reflection member. Thus, the light is easily emitted to the outside of the light emitting device, and the light output and light emission efficiency of the light emitting device are improved.

本発明の発光装置において好ましくは、上側対向面および下側対向面の少なくとも一方が突起の一部であることにより、波長変換部材の外周端面に位置する上側対向面または下側対向面による光吸収を抑制でき、発光装置の光出力や発光効率を向上できる。すなわち、波長変換部材を接着剤を用いずに十分な強度で反射部材に保持固定できる程度の平面視面積の小さな突起にされることにより、保持部による光吸収が抑制され、発光装置の光出力や発光効率は向上する。   In the light emitting device of the present invention, preferably, at least one of the upper facing surface and the lower facing surface is a part of the protrusion, whereby light absorption by the upper facing surface or the lower facing surface located on the outer peripheral end surface of the wavelength conversion member. And the light output and light emission efficiency of the light emitting device can be improved. That is, the wavelength conversion member is formed into a protrusion having a small area in plan view that can be held and fixed to the reflecting member with sufficient strength without using an adhesive, so that light absorption by the holding portion is suppressed, and the light output of the light emitting device And the luminous efficiency is improved.

本発明の発光装置において好ましくは、突起は透光性であることから、波長変換部材からの光に対しての突起による光吸収が少なくなり、発光装置からの光出力および発光効率は向上する。   Preferably, in the light emitting device of the present invention, since the protrusion is translucent, light absorption by the protrusion with respect to the light from the wavelength conversion member is reduced, and the light output from the light emitting device and the light emission efficiency are improved.

本発明の発光装置において好ましくは、発光素子が少なくとも紫外領域から青色領域に含まれる光を放射する発光素子であることから、紫外領域から青色領域の短波長でエネルギーの高い発光素子の光を、蛍光体等の波長変換粒子または波長変換材によって長波長でエネルギーの低い蛍光に変換するので、蛍光体等の波長変換効率は向上し、発光装置の光出力が増加する。   In the light-emitting device of the present invention, preferably, the light-emitting element is a light-emitting element that emits light contained in at least the ultraviolet region to the blue region. Since wavelength conversion particles such as phosphors or wavelength conversion materials are converted into fluorescence having a long wavelength and low energy, the wavelength conversion efficiency of the phosphors and the like is improved, and the light output of the light emitting device is increased.

本発明の発光装置において好ましくは、上側対向面および下側対向面の内面が拡散面にされていることから、発光素子から伝搬されて上側対向面または下側対向面に入射した光はこれら対向面の内面によって拡散され、波長変換部材に入射されやすくなるとともに、波長変換部材の外周部まで効率よく、発光素子からの光を波長変換させることができ、発光装置の光出力や発光効率は向上する。   In the light emitting device of the present invention, preferably, the inner surfaces of the upper facing surface and the lower facing surface are diffusion surfaces, so that light propagated from the light emitting element and incident on the upper facing surface or the lower facing surface is opposed to these. Diffused by the inner surface of the surface and easily incident on the wavelength conversion member, and can efficiently convert the wavelength of the light from the light emitting element to the outer periphery of the wavelength conversion member, improving the light output and light emission efficiency of the light emitting device To do.

本発明の発光装置において好ましくは、発光素子は透光性部材によって被覆されていることから、発光素子の内部から放射される光が屈折率差によって発光素子と透光性部材との界面において全反射されにくくなり、透光性部材に入射される。その結果、発光素子から効率よく光を取り出すことができ、発光装置の光出力や発光効率は向上する。   Preferably, in the light emitting device of the present invention, since the light emitting element is covered with the light transmissive member, the light emitted from the inside of the light emitting element is entirely at the interface between the light emitting element and the light transmissive member due to the refractive index difference. It becomes difficult to be reflected and enters the translucent member. As a result, light can be efficiently extracted from the light emitting element, and the light output and light emission efficiency of the light emitting device are improved.

本発明の発光装置において好ましくは、透光性部材はシリコーン樹脂から成ることから、シリコーン樹脂は、発光素子から発せられる紫外光や近紫外光または青色光等の波長が短くエネルギーが高い光を透過し易く、分子構造も切断されにくいため、透光性部材の透過率の劣化が抑制される。また、封止信頼性に優れた発光装置を提供することができる。   In the light emitting device of the present invention, preferably, the translucent member is made of a silicone resin, and the silicone resin transmits light having a short wavelength such as ultraviolet light, near ultraviolet light, or blue light emitted from the light emitting element. Since it is easy to do and the molecular structure is not easily cut, deterioration of the transmittance of the translucent member is suppressed. In addition, a light-emitting device with excellent sealing reliability can be provided.

本発明の照明装置は、上記本発明の発光装置と、発光装置が搭載され、発光装置を駆動する電気配線を有する駆動部と、発光装置から出射される光を反射する光反射手段とを含むことにより、発光装置の輝度や、放射される光の波長等の変動が抑制されるので、それぞれの発光装置は強度むらが抑制され、それらを集めて照明装置とした本発明の照明装置の強度むらも抑制される。   The lighting device of the present invention includes the above-described light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having electric wiring for driving the light emitting device, and a light reflecting means for reflecting light emitted from the light emitting device. As a result, fluctuations in the brightness of the light-emitting device and the wavelength of the emitted light are suppressed, so that the intensity unevenness of each light-emitting device is suppressed, and the intensity of the lighting device of the present invention that collects them as a lighting device. Unevenness is also suppressed.

本発明の発光装置について以下に詳細に説明する。図１乃至図１０はそれぞれ本発明の発光装置の実施の形態の各種の例を示す断面図または上視平面図である。それぞれの図において、１は基体、２は発光素子、３は波長変換部材、４は反射部材であり、主としてこれらで発光装置が構成される。また、１ｂは基体１の搭載部１ａまたはその周囲の一端から発光装置の外側へかけて形成された配線導体、５は配線導体１ｂの一端と発光素子２の電極とを接続する導電性部材であり、必要に応じて適宜発光装置に用いられる。   The light emitting device of the present invention will be described in detail below. 1 to 10 are cross-sectional views or top plan views showing various examples of embodiments of the light-emitting device of the present invention. In each figure, 1 is a substrate, 2 is a light emitting element, 3 is a wavelength converting member, 4 is a reflecting member, and these mainly constitute a light emitting device. Further, 1b is a wiring conductor formed from one end of the mounting portion 1a of the base 1 or its periphery to the outside of the light emitting device, and 5 is a conductive member that connects one end of the wiring conductor 1b and the electrode of the light emitting element 2. Yes, it is used for light emitting devices as needed.

本発明の基体１は、酸化アルミニウム質焼結体，窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂や液晶ポリマー（ＰＬＣ）等の樹脂から成る絶縁体であり、基体１上面に発光素子２が搭載されることによって、発光素子２を支持する支持部材として機能する。   The substrate 1 of the present invention is an insulator made of a ceramic such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin or a liquid crystal polymer (PLC). In addition, the light emitting element 2 is mounted on the upper surface of the base body 1 and functions as a support member for supporting the light emitting element 2.

また、基体１がセラミックス等から成る場合、基体１となる複数のグリーンシートに、発光装置の内外を電気的に導通接続するために、タングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ），銅（Ｃｕ）等の金属ペーストから成る配線導体１ｂを配置し、基体１を焼成すると同時に金属ペーストも焼成することにより、配線導体１ｂを有する基体１が形成される。そして発光素子２は、配線導体１ｂに導電性部材５を介して電気的に接続され、基体１の側面や下面などに導出された配線導体１ｂが発光装置駆動回路基板（図示せず）に電気的に接続されることにより、発光装置駆動回路基板と発光素子２とが電気的に接続される。このような配線導体１ｂは、上記周知のメタライズ法やメッキ法などを用いて形成される。   In addition, when the substrate 1 is made of ceramics or the like, tungsten (W), molybdenum (Mo), manganese (Mn), The wiring conductor 1b made of a metal paste such as copper (Cu) is disposed, and the base 1 having the wiring conductor 1b is formed by firing the base 1 and simultaneously firing the metal paste. The light emitting element 2 is electrically connected to the wiring conductor 1b via the conductive member 5, and the wiring conductor 1b led out to the side surface or the lower surface of the base 1 is electrically connected to the light emitting device driving circuit board (not shown). As a result, the light emitting device drive circuit board and the light emitting element 2 are electrically connected. Such a wiring conductor 1b is formed using the known metallization method, plating method or the like.

また、基体1が樹脂から成る絶縁体の場合、配線導体１ｂは、Ｃｕ、銀（Ａｇ）、アルミニウム（Ａｌ）、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金またはＦｅ−Ｎｉ合金等の導電性部材から成るリード端子を基体１に埋設し、リード端子の一端を搭載部１ａに導出し、他端を基体１の側面や下面に導出して露出させることによって形成される。   When the substrate 1 is an insulator made of a resin, the wiring conductor 1b includes Cu, silver (Ag), aluminum (Al), iron (Fe) -nickel (Ni) -cobalt (Co) alloy, or Fe—Ni alloy. A lead terminal made of a conductive member such as the like is embedded in the base 1, one end of the lead terminal is led out to the mounting portion 1 a, and the other end is led out to the side face or the bottom face of the base 1 to be exposed.

なお、配線導体１ｂは、基体１の露出する表面に厚さ0.5〜９μｍのＮｉ層や厚さ0.5〜５μｍのＡｕ層等の耐食性に優れる金属層が被着されておくのがよく、これにより配線導体１ｂが酸化腐食するのを有効に防止できるとともに、半田等の導電性部材５による発光素子２との接合を強固にすることができる。   The wiring conductor 1b is preferably coated with a metal layer having excellent corrosion resistance, such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm, on the exposed surface of the substrate 1. It is possible to effectively prevent the wiring conductor 1b from being oxidatively corroded and to strengthen the bonding with the light emitting element 2 by the conductive member 5 such as solder.

そして、発光素子２が基体１上面の配線導体１ｂの一端に電気的に導電性部材５を介して接続され、基体１の側面や下面などに導出された配線導体１ｂの他端と発光装置駆動回路基板とが電気的に接続されることにより、発光装置駆動回路基板と発光素子２とが電気的に接続される。   The light emitting element 2 is electrically connected to one end of the wiring conductor 1b on the upper surface of the base 1 via the conductive member 5, and the other end of the wiring conductor 1b led out to the side surface or the lower surface of the base 1 and the light emitting device drive. By electrically connecting the circuit board, the light emitting device driving circuit board and the light emitting element 2 are electrically connected.

また、基体１上面には、発光素子２からの光透過を抑制するとともに、基体１の上側に光を効率良く反射させることを目的として、配線導体１ｂに対して電気的に短絡しないように、アルミニウム（Ａｌ），銀（Ａｇ），金（Ａｕ），白金（Ｐｔ），Ｃｕ等の金属層が蒸着法やメッキ法により形成され、基体１の上方へ進むような光の反射率を向上させる反射層が作製されることがより好ましい。   Further, in order to suppress light transmission from the light emitting element 2 on the upper surface of the base 1 and to reflect light efficiently on the upper side of the base 1, so as not to be electrically short-circuited to the wiring conductor 1b. A metal layer such as aluminum (Al), silver (Ag), gold (Au), platinum (Pt), or Cu is formed by a vapor deposition method or a plating method to improve the reflectance of light that travels above the substrate 1. More preferably, a reflective layer is produced.

また、基体１は、上面に発光素子２を取り囲むように配置された反射部材４を具備している。これにより、発光素子２から側方に放射される光は、反射部材４の内周面４ａで上方に反射され、波長変換部材３に入射されるとともに、波長変換部材３によって波長変換され、発光装置の外部に放射される。   The base body 1 includes a reflecting member 4 disposed on the upper surface so as to surround the light emitting element 2. As a result, the light emitted from the light emitting element 2 to the side is reflected upward by the inner peripheral surface 4a of the reflecting member 4 and incident on the wavelength converting member 3, and the wavelength converted by the wavelength converting member 3 to emit light. Radiated outside the device.

基体１は、このように配線導体１ｂとなる金属およびこれを絶縁する絶縁体を組み合わせて、発光素子２を搭載する機能を有しておればよく、上記構成はその一例であって、これに限ることはない。   The substrate 1 only needs to have a function of mounting the light emitting element 2 by combining the metal that becomes the wiring conductor 1b and the insulator that insulates the substrate 1b, and the above-described configuration is an example thereof. There is no limit.

反射部材４は、基体１上面に発光素子２を取り囲むようにして、Ａｇ−Ｃｕ，鉛（Ｐｂ）−錫（Ｓｎ），Ａｕ−Ｓｎ，Ａｕ−ケイ素（Ｓｉ）,Ｓｎ−Ａｇ−Ｃｕ等の合金ロウ材（図示せず）や、シリコーン樹脂やエポキシ樹脂、アクリル樹脂等の樹脂接合材（図示せず）で取着されていてもよい。   The reflecting member 4 surrounds the light emitting element 2 on the upper surface of the base 1 and is made of Ag-Cu, lead (Pb) -tin (Sn), Au-Sn, Au-silicon (Si), Sn-Ag-Cu, or the like. It may be attached with an alloy brazing material (not shown) or a resin bonding material (not shown) such as a silicone resin, an epoxy resin, or an acrylic resin.

なお、この反射部材４と基体１とを接合する接合材は、基体１、反射部材４の材質や熱膨張係数等を考慮して適宜選定すればよく、特に限定されるものではない。また、基体１と反射部材４との接合に高信頼性が要求される場合、金属ロウ材や半田を用いるとよい。   The bonding material for bonding the reflecting member 4 and the substrate 1 may be appropriately selected in consideration of the material of the substrate 1 and the reflecting member 4, the thermal expansion coefficient, etc., and is not particularly limited. Further, when high reliability is required for joining the base 1 and the reflecting member 4, a metal brazing material or solder may be used.

また、反射部材４は、基体１と一体に形成されてもよく、例えば基体１および反射部材４がセラミックスからなる場合、基体１となるセラミックグリーンシートと反射部材４となるセラミックグリーンシートとを積層し、同時に焼成することにより形成できる。   The reflecting member 4 may be formed integrally with the base 1. For example, when the base 1 and the reflecting member 4 are made of ceramics, a ceramic green sheet to be the base 1 and a ceramic green sheet to be the reflecting member 4 are laminated. And it can form by baking simultaneously.

また、基体１と反射部材４とが、エポキシ樹脂やＬＣＰ等の熱硬化型樹脂や熱可塑性樹脂等の樹脂から成る絶縁体から成る場合、基体１と反射部材４とが一体的に形成された成形型によって樹脂から成る絶縁体と金属リードとを一体的にモールド成形することによっても形成できる。   Further, when the base 1 and the reflecting member 4 are made of an insulator made of a resin such as a thermosetting resin such as epoxy resin or LCP or a thermoplastic resin, the base 1 and the reflecting member 4 are integrally formed. It can also be formed by integrally molding an insulator made of resin and a metal lead with a molding die.

また、反射部材４は、内周面４ａが発光素子２の光を効率良く反射する反射面とされ、発光素子２は内周面４ａに取り囲まれている構成により、発光素子２から側方に発せられた光は、発光装置の上方に効率良く反射されるとともに、基体１および反射部材４による光の吸収や透過が効果的に抑制されながら波長変換部材３に入射される。その結果、発光装置の光出力や発光効率は著しく向上する。   Further, the reflection member 4 has an inner peripheral surface 4a that is a reflection surface that efficiently reflects the light of the light-emitting element 2, and the light-emitting element 2 is surrounded by the inner peripheral surface 4a, so that the light-emitting element 2 is formed laterally from the light-emitting element 2. The emitted light is efficiently reflected above the light emitting device, and is incident on the wavelength conversion member 3 while the absorption and transmission of light by the base 1 and the reflection member 4 are effectively suppressed. As a result, the light output and light emission efficiency of the light emitting device are significantly improved.

発光素子２の光を上方に効率よく反射させるために、内周面４ａは、上側に向かうに伴って外側に広がるように傾斜しているのがよい。これによって内周面４ａは、発光素子２から側方に放射された光を効率よく発光装置の上方に反射することができる。   In order to efficiently reflect the light of the light emitting element 2 upward, the inner peripheral surface 4a is preferably inclined so as to spread outward as it goes upward. As a result, the inner peripheral surface 4a can efficiently reflect the light emitted from the light emitting element 2 to the side toward the upper side of the light emitting device.

内周面４ａは、Ａｌ，Ａｇ，Ａｕ，Ｐｔ，チタン（Ｔｉ），クロム（Ｃｒ），Ｃｕ等の金属や白色等のセラミックス、白色等のエポキシ樹脂やＬＣＰ等で構成された反射部材４を、切削加工や金型成形、電界研磨や科学研磨等で鏡面加工することにより形成される。あるいは、内周面４ａに、Ａｌ，Ａｇ，Ａｕ等の金属鏡面を金属メッキや蒸着等により形成したり、エポキシ樹脂やシリコーン樹脂，アクリル樹脂等の未硬化の透明樹脂に、酸化アルミニウムや酸化チタン，酸化ジルコニウム等のセラミックス粒子を含有したペースト状の反射材料を固化させたり、他の部材の表面に塗布し硬化させたりすることにより内周面４ａを形成してもよい。なお、内周面４ａがＡｇやＣｕ等の酸化により変色し易い金属からなる場合、その表面に、紫外光領域から可視光領域にわたり透過率の優れる低融点ガラス，ゾル−ゲルガラスなどの無機物や、シリコーン樹脂，エポキシ樹脂，アクリル樹脂などの有機物を被着するのが良い。その結果、内周面４ａの耐腐食性、耐薬品性、耐候性が向上する。   The inner peripheral surface 4a has a reflecting member 4 made of metal such as Al, Ag, Au, Pt, titanium (Ti), chromium (Cr), Cu, ceramics such as white, epoxy resin such as white, or LCP. It is formed by mirror finishing by cutting, mold forming, electric field polishing, scientific polishing or the like. Alternatively, a metal mirror surface such as Al, Ag, Au or the like is formed on the inner peripheral surface 4a by metal plating or vapor deposition, or an uncured transparent resin such as an epoxy resin, a silicone resin, or an acrylic resin, or aluminum oxide or titanium oxide. The inner peripheral surface 4a may be formed by solidifying a paste-like reflective material containing ceramic particles such as zirconium oxide or by applying and curing the surface on the surface of another member. In addition, when the inner peripheral surface 4a is made of a metal that is easily discolored by oxidation such as Ag or Cu, an inorganic substance such as a low-melting glass or sol-gel glass having excellent transmittance from the ultraviolet light region to the visible light region, It is better to deposit organic substances such as silicone resin, epoxy resin and acrylic resin. As a result, the corrosion resistance, chemical resistance, and weather resistance of the inner peripheral surface 4a are improved.

そして、反射部材４は、その内周面４ａの上部に、波長変換部材３の外周部の上面に対向する上側対向面６ａおよび波長変換部材３の外周部の下面と対向する下側対向面６ｂを有している。この上側対向面６ａおよび下側対向面６ｂによって、波長変換部材３の外周部の上下面をゆるく挟み込むようにして保持する挟持部７が構成されている。   The reflecting member 4 has an upper facing surface 6a facing the upper surface of the outer peripheral portion of the wavelength converting member 3 and a lower facing surface 6b facing the lower surface of the outer peripheral portion of the wavelength converting member 3 at the upper portion of the inner peripheral surface 4a. have. The upper facing surface 6a and the lower facing surface 6b constitute a pinching portion 7 that holds the upper and lower surfaces of the outer peripheral portion of the wavelength conversion member 3 so as to be loosely pinched.

なお、内周面４ａは、その表面の算術平均粗さＲａを４μｍ以下とする場合、発光素子２からの光を低損失にかつ良好に発光装置の上方に反射することができる。これにより、例えば、発光素子２から直接外部に取り出された光と、波長変換部材３からの光と混合して光を放射する発光装置において発光効率は向上する。   In addition, when the arithmetic mean roughness Ra of the inner peripheral surface 4a is set to 4 μm or less, the light from the light emitting element 2 can be reflected well above the light emitting device with low loss. Thereby, for example, the light emission efficiency is improved in a light emitting device that emits light by mixing light extracted directly from the light emitting element 2 and light from the wavelength conversion member 3.

また、内周面４ａは、その表面の算術平均粗さＲａを４μｍより大きくする場合、発光素子２からの光を内周面４ａで発光装置の上方に拡散反射させることができることから、発光素子２からの光を反射部材４で波長変換部材３ａ全体に効率よく入射させることができる。その結果、波長変換部材３は、その波長変換効率に応じた光を発生させることができ、発光装置の光出力や発光効率は向上する。   Further, when the arithmetic mean roughness Ra of the inner peripheral surface 4a is larger than 4 μm, the light from the light emitting element 2 can be diffusely reflected above the light emitting device by the inner peripheral surface 4a. The light from 2 can be efficiently incident on the entire wavelength conversion member 3 a by the reflection member 4. As a result, the wavelength conversion member 3 can generate light according to the wavelength conversion efficiency, and the light output and the light emission efficiency of the light emitting device are improved.

なお、内周面４ａは、算術平均粗さＲａが0.004μｍ未満の場合、このような面を安定かつ効率よく形成することが困難となるとともに、製品コストが高くなりやすい。従って、内周面４ａの算術平均粗さは0.004μｍ以上とするのがより好ましい。また、算術平均粗さＲａが0.5μｍ以上の場合、このような面では発光素子２からの励起光を内周面４ａで拡散させて波長変換部材３全体を照射することが困難となり、波長変換部材３からその波長変換効率に応じた光を発せられず、発光装置の光出力が低下するとともに、発光装置の発光効率が低下する。従って、内周面４ａの算術平均粗さは0.004〜500μｍとしてもよい。   Note that, when the arithmetic average roughness Ra is less than 0.004 μm, it is difficult to form such a surface stably and efficiently, and the product cost tends to increase. Accordingly, the arithmetic average roughness of the inner peripheral surface 4a is more preferably 0.004 μm or more. In addition, when the arithmetic average roughness Ra is 0.5 μm or more, it is difficult to irradiate the entire wavelength conversion member 3 by diffusing the excitation light from the light emitting element 2 on the inner peripheral surface 4a on such a surface. The light corresponding to the wavelength conversion efficiency cannot be emitted from the member 3, the light output of the light emitting device is reduced, and the light emission efficiency of the light emitting device is reduced. Therefore, the arithmetic average roughness of the inner peripheral surface 4a may be 0.004 to 500 μm.

なお、内周面４ａのＲａを上記の範囲にするには、従来周知の電解研磨加工、化学研磨加工もしくは切削研磨加工等により形成すればよい。また、金型の面精度を利用した転写加工により形成する方法を用いてもよい。   In order to set the Ra of the inner peripheral surface 4a within the above range, it may be formed by a conventionally known electrolytic polishing process, chemical polishing process or cutting polishing process. Further, a method of forming by transfer processing using the surface accuracy of the mold may be used.

また、内周面４ａは、発光装置より放射される光として発光素子２の光を利用する発光装置の場合、内周面４ａを曲面状に形成することにより、発光素子２から指向性の強い光を波長変換部材３に入射させ、効率よく発光装置の外部に放射できる。一方、発光素子２からの光の大部分を波長変換部材３によって波長変換させる発光装置の場合、内周面４ａを直線状に形成することにより、発光素子２からの光を波長変換部材３の下面から広範囲に入射でき、これによって波長変換部材３によって波長変換される発光素子２の光が増加し、発光装置の光出力や発光効率を向上できる。   In the case of a light emitting device that uses the light of the light emitting element 2 as light emitted from the light emitting device, the inner peripheral surface 4a has a strong directivity from the light emitting element 2 by forming the inner peripheral surface 4a in a curved shape. Light is incident on the wavelength conversion member 3 and can be efficiently emitted outside the light emitting device. On the other hand, in the case of a light-emitting device that converts the wavelength of most of the light from the light-emitting element 2 by the wavelength conversion member 3, the light from the light-emitting element 2 is converted into the wavelength conversion member 3 by forming the inner peripheral surface 4 a linearly. Incident light can be made in a wide range from the lower surface, whereby the light of the light emitting element 2 whose wavelength is converted by the wavelength conversion member 3 is increased, and the light output and light emission efficiency of the light emitting device can be improved.

さらに、反射部材４は、開口部にガラス、サファイア、石英、またはエポキシ樹脂，シリコーン樹脂，アクリル樹脂等の樹脂（プラスチック）などの透明部材から成る蓋体（図示せず）を搭載固定しても良い。この場合、反射部材４の内側に設置された、発光素子２、配線導体１ｂ、波長変換部材３を保護するとともに、発光装置内部を気密に封止し、発光素子２を長期に安定した動作をさせることができる。また、蓋体をレンズ状に形成して光学レンズの機能を付加することによって、光を集光または分散させて所望の放射角度、強度分布で光を発光装置の外部に取りだすことができるとともに発光装置内部への耐浸水性が改善され長期信頼性が向上する。   Further, the reflection member 4 may be mounted and fixed with a lid (not shown) made of a transparent member such as glass, sapphire, quartz, or a resin (plastic) such as epoxy resin, silicone resin, acrylic resin, or the like in the opening. good. In this case, while protecting the light emitting element 2, the wiring conductor 1b, and the wavelength conversion member 3 installed inside the reflecting member 4, the inside of the light emitting device is hermetically sealed, and the light emitting element 2 operates stably for a long time. Can be made. In addition, by forming a lid in the shape of a lens and adding the function of an optical lens, it is possible to collect or disperse the light and take out the light with the desired radiation angle and intensity distribution to the outside of the light emitting device and emit light. Improves water resistance inside the device and improves long-term reliability.

反射部材４は、発光素子２を外部環境や発光装置を落下させた際の衝撃から保護するとともに、基体１と波長変換部材３との間に配されて、波長変換部材３を保持する保持部材として機能する。従って、上記に示す構成はその一例であって、これに限ることはなく、前記機能を果たせるものであればよい。例えば、基体１と反射部材４とが一体に形成されており、反射部材４と呼ばれる部分がない場合、基体１が反射部材４となる。また、内周面４ａが必ず反射面になっている必要もない。   The reflection member 4 protects the light emitting element 2 from an impact when the light emitting device is dropped or the external environment, and is disposed between the base 1 and the wavelength conversion member 3 to hold the wavelength conversion member 3. Function as. Therefore, the configuration described above is an example, and the configuration is not limited to this, and any configuration that can perform the above function is acceptable. For example, when the base 1 and the reflection member 4 are integrally formed and there is no portion called the reflection member 4, the base 1 becomes the reflection member 4. Further, the inner peripheral surface 4a does not necessarily have to be a reflecting surface.

波長変換部材３は、例えば発光素子２の発する光を波長変換する蛍光体等の波長変換粒子（図示せず）が透明部材または透光性部材の内部に含有されることにより、この波長変換粒子によって波長変換された任意の波長スペクトルを有する光、または発光素子２からの光と波長変換粒子によって波長変換された光とを混合した任意の波長スペクトルを有する光を発光装置から放射できる。   The wavelength conversion member 3 includes, for example, wavelength conversion particles (not shown) such as a phosphor that converts the wavelength of light emitted from the light-emitting element 2 in the transparent member or the translucent member. Light having an arbitrary wavelength spectrum that has been wavelength-converted by the above or light having an arbitrary wavelength spectrum obtained by mixing the light from the light emitting element 2 and the light that has been wavelength-converted by the wavelength converting particles can be emitted from the light emitting device.

波長変換部材３の透明部材または透光性部材は、紫外光領域から可視光領域の光に対して透過率の高いシリコーン樹脂，エポキシ樹脂，ユリア樹脂，フッ素系樹脂等の透明樹脂や、低融点ガラス，ゾル−ゲルガラス等の透明ガラスから成る。   The transparent member or translucent member of the wavelength conversion member 3 is made of a transparent resin such as silicone resin, epoxy resin, urea resin, or fluorine resin having a high transmittance with respect to light in the ultraviolet light region to the visible light region, or a low melting point. It consists of transparent glass such as glass and sol-gel glass.

波長変換部材３の波長変換粒子は、様々な材料が用いられ、例えば赤はＬａ２Ｏ２Ｓ：Ｅｕ（ＥｕドープＬａ２Ｏ２Ｓ）の蛍光体やＬｉＥｕＷ２Ｏ８、緑はＺｎＳ：Ｃｕ，ＡｌやＳｒＡｌ２Ｏ４：Ｅｕの蛍光体、青は（ＢａＭｇＡｌ）１０Ｏ１２：ＥｕやＢａＭｇＡｌ１０Ｏ１７：Ｅｕの蛍光体等の粒子状のものが用いられる。さらに、このような蛍光体は１種類に限らず、複数のものを任意の割合で配合することにより、所望の発光スペクトルと色を有する光を出力することができる。 Various materials are used for the wavelength conversion particles of the wavelength conversion member 3. For example, red is La 2 O 2 S: Eu (Eu-doped La 2 O 2 S) phosphor, LiEuW 2 O 8 , and green is ZnS: Cu. , Al and SrAl 2 O 4 : Eu phosphors, and blue ones such as (BaMgAl) 10 O 12 : Eu and BaMgAl 10 O 17 : Eu phosphors are used. Furthermore, such a phosphor is not limited to one type, and a light having a desired emission spectrum and color can be output by blending a plurality of phosphors at an arbitrary ratio.

また、波長変換部材３は、発光素子２より離間させて配置されることにより、発光素子２から全方向に放射された光が波長変換部材３に効率よく、かつ一様に入射される。その結果、波長変換部材３によって波長変換される発光素子２からの光が増加し、発光装置の光出力や発光効率が向上されるとともに発光装置より放射される光の色ムラや色バラツキが抑制される。   In addition, the wavelength conversion member 3 is disposed away from the light emitting element 2, so that light emitted from the light emitting element 2 in all directions is efficiently and uniformly incident on the wavelength conversion member 3. As a result, the light from the light emitting element 2 whose wavelength is converted by the wavelength conversion member 3 is increased, the light output and light emission efficiency of the light emitting device are improved, and the color unevenness and color variation of the light emitted from the light emitting device are suppressed. Is done.

なお、波長変換部材３は、波長変換粒子が含有された未硬化の透明部材を、平滑面または粗面のガラス板等の平板または曲面板上に塗布し、加熱または大気中に放置することにより硬化させて形成される。そして、波長変換部材３は発光素子２を覆うように反射部材４に設置される。   The wavelength converting member 3 is obtained by applying an uncured transparent member containing wavelength converting particles on a flat plate or curved plate such as a smooth or rough glass plate and heating or leaving it in the air. It is formed by curing. And the wavelength conversion member 3 is installed in the reflection member 4 so that the light emitting element 2 may be covered.

そして、波長変換部材３は、その外周部の上下面が反射部材４の内周面４ａに設けられた挟持部７によってゆるく遊びを持たせて挟持されていることにより（図１参照）、波長変換部材３の外周部から放射される一部の光は、波長変換部材３と挟持部７の上側対向面６ａ、下側対向面６ｂおよびこれらの間の挟持部７の奥面との間に形成される隙間部７ｂとの界面で波長変換部材３内に全反射される。すなわち、波長変換部材３の外周部より放射される光が、波長変換部材３と隙間部７ｂとの屈折率差によって隙間部７ｂとの界面で波長変換部材３内に全反射される。さらに、波長変換部材３を反射部材４に接着固定する樹脂やガラス等を用いないので発光素子２や波長変換部材３からの光が、波長変換部材３を反射部材４に接着固定する樹脂やガラス等から成る接着剤で光吸収されない。これらの結果、波長変換部材３の外周部から外側へ放射されて損失となる光が少なくなり、発光装置の光出力や発光効率が向上する。   Then, the wavelength conversion member 3 is sandwiched between the upper and lower surfaces of the outer peripheral portion thereof with loose play by the clamping portion 7 provided on the inner peripheral surface 4a of the reflection member 4 (see FIG. 1). Some of the light emitted from the outer periphery of the conversion member 3 is between the wavelength conversion member 3 and the upper facing surface 6a, the lower facing surface 6b of the sandwiching portion 7, and the inner surface of the sandwiching portion 7 between them. It is totally reflected in the wavelength conversion member 3 at the interface with the gap 7b to be formed. That is, the light emitted from the outer peripheral portion of the wavelength conversion member 3 is totally reflected in the wavelength conversion member 3 at the interface with the gap portion 7b due to the refractive index difference between the wavelength conversion member 3 and the gap portion 7b. Further, since the resin or glass that adheres and fixes the wavelength converting member 3 to the reflecting member 4 is not used, the light or light from the light emitting element 2 or the wavelength converting member 3 is resin or glass that adheres and fixes the wavelength converting member 3 to the reflecting member 4. It is not light-absorbed by an adhesive composed of etc. As a result, less light is emitted from the outer periphery of the wavelength conversion member 3 and lost, and the light output and light emission efficiency of the light emitting device are improved.

また、例えば、波長変換部材３内で散乱されて波長変換部材３の外周部から出射されたり、波長変換部材３の下面から波長変換部材３の側面を回って発光装置の外部に放射されたりする発光素子２からの光が、隙間部７ｂを伝搬して発光装置の外部に放射されることを抑制できる。すなわち、隙間部７ｂに入射した光は、隙間部７ｂ内で挟持部７の内面および波長変換部材３で反射されながら隙間部７ｂを伝搬する際に、隙間部７ｂより屈折率の高い波長変換部材３との界面で波長変換部材３内に入射されやすくなり、入射された光は波長変換部材３内で波長変換される。その結果、発光素子２から波長変換部材３に入射される光は増加するとともに、波長変換部材３によって波長変換される光が増加することから、発光装置の光出力や発光効率は向上する。   In addition, for example, the light is scattered in the wavelength conversion member 3 and emitted from the outer peripheral portion of the wavelength conversion member 3, or is emitted from the lower surface of the wavelength conversion member 3 around the side surface of the wavelength conversion member 3 to the outside of the light emitting device. Light from the light emitting element 2 can be prevented from propagating through the gap 7b and being emitted to the outside of the light emitting device. That is, when the light incident on the gap portion 7b propagates through the gap portion 7b while being reflected by the inner surface of the sandwiching portion 7 and the wavelength conversion member 3 in the gap portion 7b, the wavelength conversion member having a higher refractive index than the gap portion 7b. The incident light enters the wavelength conversion member 3 easily at the interface with the light, and the incident light is wavelength-converted in the wavelength conversion member 3. As a result, the light incident on the wavelength conversion member 3 from the light emitting element 2 increases and the light whose wavelength is converted by the wavelength conversion member 3 increases, so that the light output and the light emission efficiency of the light emitting device are improved.

さらに、波長変換部材３と反射部材４とは、波長変換部材３が挟持部７によって挟持固定され、波長変換部材３を反射部材４に樹脂やガラス等から成る接着剤によって接着しないことから、波長変換部材３の固定が、接着剤の材質や波長変換部材３または反射部材４の表面特性によって影響されることがない。また、波長変換部材３と反射部材４との間を接合する接着剤の接着強度が、発光素子２からの光や外光によって劣化して低下してしまうことがない。その結果、波長変換部材３が、接着剤の接着強度の劣化等によって反射部材４から剥離することがなく、長期間に亘って安定的に固定される。従って、発光装置の長期信頼性や動作寿命は向上する。   Further, the wavelength conversion member 3 and the reflection member 4 are configured such that the wavelength conversion member 3 is sandwiched and fixed by the sandwiching portion 7, and the wavelength conversion member 3 is not bonded to the reflection member 4 with an adhesive made of resin, glass, or the like. The fixing of the conversion member 3 is not affected by the material of the adhesive or the surface characteristics of the wavelength conversion member 3 or the reflection member 4. In addition, the adhesive strength of the adhesive that joins between the wavelength conversion member 3 and the reflection member 4 does not deteriorate and decrease due to light from the light emitting element 2 or external light. As a result, the wavelength conversion member 3 is not peeled off from the reflecting member 4 due to deterioration of the adhesive strength of the adhesive or the like, and is stably fixed over a long period of time. Accordingly, the long-term reliability and operating life of the light emitting device are improved.

さらに、波長変換部材３を挟持部７に嵌め込んで固定すればよいので、簡単な工程で組み立てることができるとともに、接着剤を固化させる時間を省くことができ、生産性が飛躍的に向上する。なお、本発明において、波長変換部材３の固定に全く接着剤を用いないということではなく、例えば波長変換部材３を仮止めする等の目的で、微量の接着剤を用いてもよいことは言うまでもない。   Furthermore, since the wavelength conversion member 3 only needs to be fitted and fixed to the sandwiching portion 7, it can be assembled in a simple process, the time for solidifying the adhesive can be omitted, and the productivity is dramatically improved. . In the present invention, it is needless to say that a small amount of adhesive may be used for the purpose of temporarily fixing the wavelength conversion member 3, for example. Yes.

また、波長変換部材３は、隙間部７ｂを介して反射部材４に設置されることから、発光素子２で発生した熱が反射部材４を介して波長変換部材３に伝えられ難くなる。その結果、波長変換部材３が熱によって変形したり、透過率が劣化したり、波長変換効率が低下したりすることを抑制できる。   In addition, since the wavelength conversion member 3 is installed on the reflection member 4 via the gap 7 b, it is difficult for heat generated in the light emitting element 2 to be transmitted to the wavelength conversion member 3 via the reflection member 4. As a result, it can be suppressed that the wavelength conversion member 3 is deformed by heat, the transmittance is deteriorated, or the wavelength conversion efficiency is lowered.

さらにまた、波長変換部材３は、その固定部または反射部材４の内側に充填される樹脂やガラス等の接着剤を用いることによって接着固定されるのではなく、挟持部７によって挟持されていることによって、隙間部７ｂが波長変換部材３の周囲に形成されることから、例えば発光装置を発光装置駆動回路基板に実装する際や、発光装置を作動させる際の環境温度または発光素子２からの熱によって、波長変換部材３や反射部材４または接着剤等の固定手段との熱膨張係数差に起因して応力が発生することがない。その結果、波長変換部材３が、波長変換部材３と反射部材４との間に発生する応力によって変形したり、反射部材４から剥離したりすることはなく、発光装置を長期間にわたり正常かつ安定して作動できる。   Furthermore, the wavelength conversion member 3 is not fixed and bonded by using an adhesive such as resin or glass filled inside the fixed portion or the reflection member 4, but is held by the holding portion 7. Accordingly, the gap 7b is formed around the wavelength conversion member 3, so that, for example, when the light emitting device is mounted on the light emitting device driving circuit board, or when the light emitting device is operated, the ambient temperature or the heat from the light emitting element 2 Thus, no stress is generated due to a difference in thermal expansion coefficient from the wavelength conversion member 3, the reflection member 4, or a fixing means such as an adhesive. As a result, the wavelength conversion member 3 is not deformed or peeled off from the stress generated between the wavelength conversion member 3 and the reflection member 4, and the light emitting device is normal and stable for a long period of time. Can operate.

挟持部７は、図１，図２，図３，図４，図５，図６に示されるように、反射部材４の内周方向に沿って、内周面４ａを切り欠くように形成された溝状凹部７ａで構成されたり、図７に示されるように、反射部材４の内周方向に沿って内周側へ突出させた突起７ｃによって構成されたりする。   As shown in FIGS. 1, 2, 3, 4, 5, and 6, the holding portion 7 is formed so as to cut out the inner peripheral surface 4 a along the inner peripheral direction of the reflecting member 4. It is comprised by the groove-shaped recessed part 7a which was formed, and as FIG. 7 shows, it is comprised by the protrusion 7c protruded to the inner peripheral side along the inner peripheral direction of the reflection member 4.

このような挟持部７は、金属や樹脂から成る反射部材４の内周面４ａを切削加工したり、金型成形したりすることによって形成される。または、挟持部７において反射部材４が上下に２分割されたものとし、反射部材４の上側と下側を切削加工や金型成型等によってそれぞれ形成した後、これを組み合わせて接着や嵌着、圧着等によって一体化することで形成される。   Such a clamping part 7 is formed by cutting the inner peripheral surface 4a of the reflecting member 4 made of metal or resin, or by molding it. Alternatively, it is assumed that the reflecting member 4 is vertically divided into two in the sandwiching portion 7, and the upper and lower sides of the reflecting member 4 are formed by cutting or molding, respectively, and then combined and bonded or fitted. It is formed by integrating by crimping or the like.

または、板状に形成されたセラミック板や金属板や樹脂板から成る複数の板状部材を、積層することによって反射部材４を形成する際に、挟持部７が存在する層の内周径のみ大きくしておくことによって形成される。   Alternatively, when the reflecting member 4 is formed by laminating a plurality of plate-shaped members made of a ceramic plate, a metal plate, or a resin plate formed in a plate shape, only the inner peripheral diameter of the layer in which the sandwiching portion 7 exists It is formed by keeping it large.

さらに、図６に示される発光装置の場合、挟持部７より上側の反射部材４ｃを透光性の部材から形成し、光を反射する金属や樹脂から形成された反射部材４ｂの上部に、組み合わせて一体化することにより、挟持部７の上側が透光性の反射部材４ｃで形成された発光装置を作製できる。図７に示される挟持部７が透光性の突起７ｃである場合も、同様に形成すればよい。なお、透光性とは必ずしも透明であることを意味するものではなく、光が透過するものであればよい。   Further, in the case of the light emitting device shown in FIG. 6, the reflective member 4c above the sandwiching portion 7 is formed from a translucent member, and is combined with the upper part of the reflective member 4b formed from a metal or resin that reflects light. Thus, a light-emitting device in which the upper side of the sandwiching portion 7 is formed of a light-transmissive reflecting member 4c can be manufactured. Even when the clamping part 7 shown in FIG. 7 is a translucent protrusion 7c, it may be formed similarly. In addition, translucency does not necessarily mean that it is transparent, What is necessary is just what can permeate | transmit light.

また、挟持部７の内面を拡散面にする場合、切削加工や金型成形や複数の部材を組み立てて挟持部７が形成された反射部材４を化学研磨や電解研磨することにより、挟持部７の内面を拡散面に形成できる。なお、金属酸化物粒子を焼成して成るセラミックスから成る場合、焼成されたセラミック表面を拡散面として使用することにより、挟持部７表面を拡散面にするための表面処理を施すことなく用いることができ、反射部材４の加工コストを低減できる。   Further, when the inner surface of the sandwiching portion 7 is made to be a diffusion surface, the sandwiching portion 7 is formed by chemical polishing or electrolytic polishing of the reflecting member 4 on which the sandwiching portion 7 is formed by assembling a plurality of members by cutting, molding, or molding. Can be formed as a diffusion surface. In the case of a ceramic formed by firing metal oxide particles, the fired ceramic surface can be used as a diffusion surface, so that the surface of the sandwiched portion 7 can be used without performing a surface treatment for making it a diffusion surface. This can reduce the processing cost of the reflecting member 4.

挟持部７が溝状凹部７ａで構成されている場合は、波長変換部材３を反射部材４により強固に設置固定できるとともに、波長変換部材３の外周部の可動範囲が溝状凹部７ａによって制限されることから、波長変換部材３の重さによる撓みや、発光装置の周囲温度に起因した熱膨張による変形を抑制できる。   When the sandwiching portion 7 is configured by the groove-shaped recess 7a, the wavelength conversion member 3 can be firmly installed and fixed by the reflecting member 4, and the movable range of the outer peripheral portion of the wavelength conversion member 3 is limited by the groove-shaped recess 7a. Therefore, the deformation due to the weight of the wavelength conversion member 3 and the deformation due to the thermal expansion caused by the ambient temperature of the light emitting device can be suppressed.

また、図１に示すような、溝状凹部７ａの奥側の上下面が切り欠かれて広くなっている場合、隙間部７ｂに伝搬された発光素子２からの光が、上下面に切り欠かれて広くなっている溝状凹部７ａで閉じ込められるとともに乱反射され、波長変換部材３に入射される割合が増加する。これにより、発光素子２からの光が波長変換部材３によって波長変換され、発光装置の光出力および発光効率は向上する。さらに、反射部材４を介して波長変換部材３に伝わる熱が上下面に切り欠かれて広くなっている溝状凹部７ａによって伝わり難くなり、熱による波長変換部材３の変形や透過率の劣化、波長変換効率の低下を抑制できる。   In addition, as shown in FIG. 1, when the upper and lower surfaces on the back side of the groove-like recess 7a are cut out and widened, the light from the light emitting element 2 propagated to the gap 7b is cut out on the upper and lower surfaces. It is confined by the groove-shaped recess 7a that is widened and diffused and is incident on the wavelength conversion member 3. Thereby, the wavelength of the light from the light emitting element 2 is converted by the wavelength conversion member 3, and the light output and the light emission efficiency of the light emitting device are improved. Furthermore, the heat transmitted to the wavelength conversion member 3 through the reflecting member 4 becomes difficult to be transmitted by the groove-shaped concave portion 7a that is widened by being cut off at the upper and lower surfaces, and the deformation of the wavelength conversion member 3 and the deterioration of the transmittance due to heat, Reduction in wavelength conversion efficiency can be suppressed.

なお、図１には溝状凹部７ａの奥側の横断面形状が四角形状にされているが、波長変換部材３に対して凹曲面状にされ、しかも、曲面によって光が波長変換部材３に向けて反射されやすい形状としてもよい。   In FIG. 1, the cross-sectional shape on the back side of the groove-like concave portion 7 a is a square shape, but the concave shape is formed with respect to the wavelength conversion member 3, and the light is transmitted to the wavelength conversion member 3 by the curved surface. It is good also as a shape which is easy to reflect toward.

なお、挟持部７（溝状凹部７ａ）は、必ずしも反射部材４の内周面４ａに沿って全周に連続するように形成される必要はなく、図１（ｂ）に示されるように３分割されて形成されたり、２分割であったり、もっと多くに分割されて形成されていてもよい。   Note that the sandwiching portion 7 (the groove-like recess 7a) does not necessarily need to be formed continuously along the inner peripheral surface 4a of the reflecting member 4, and as shown in FIG. It may be divided and formed, or may be divided into two or more.

図１（ｂ）に示されるような正三角形の頂点位置に３分割されて挟持部７が形成されている場合、波長変換部材３は外周部を３点支持されることによって反射部材４から外れ難くなり、また挟持部７が反射部材４の内周面４ａに偏らず等間隔に配置されることにより、発光装置の発光面および照射面の光強度分布が、光軸に対してほぼ回転軸対称になる。   When the pinching portion 7 is formed by being divided into three at the apex position of an equilateral triangle as shown in FIG. 1B, the wavelength conversion member 3 is separated from the reflection member 4 by supporting the outer peripheral portion at three points. In addition, since the sandwiching portions 7 are arranged at equal intervals without being biased to the inner peripheral surface 4a of the reflecting member 4, the light intensity distributions of the light emitting surface and the irradiation surface of the light emitting device are approximately rotational axes with respect to the optical axis. It becomes symmetric.

また、反射部材４は、図３に示されるように、内周面４ｂが溝状凹部７ａ開口の上側より上方に向かう従って拡がるように形成されている、すなわち反射部材４の開口径が上方に向かって拡がるようにされている場合、発光素子２からの光または波長変換部材３によって波長変換された光が、溝状凹部７ａ開口の上側の内周面４ｂで所望する角度に反射される。その結果、発光装置は、表示用光源や照明用光源等に必要とされる、様々な配光分布に制御された光を放射できる発光装置を作製できる。   Further, as shown in FIG. 3, the reflecting member 4 is formed such that the inner peripheral surface 4b expands upward from the upper side of the opening of the groove-shaped recess 7a, that is, the opening diameter of the reflecting member 4 is upward. When the light is spread toward the light, the light from the light emitting element 2 or the light whose wavelength is converted by the wavelength conversion member 3 is reflected at a desired angle on the inner peripheral surface 4b on the upper side of the opening of the groove-shaped recess 7a. As a result, the light-emitting device can produce a light-emitting device that can emit light controlled to have various light distributions required for a display light source, an illumination light source, and the like.

また、波長変換部材３を挟持部７に嵌め込む際に、シート状の波長変換部材３を反射部材４の上方から反射部材４の傾斜した内周面４ｂに沿って押し込めばよく、波長変換部材３の組立作業が容易となる。このとき、波長変換部材３を押し込んでいくと、挟持部７の位置で、波長変換部材３が、波長変換部材３自身の弾力で平板状に復帰し、挟持部７に嵌め込まれて挟持される。   Further, when the wavelength conversion member 3 is fitted into the sandwiching portion 7, the sheet-like wavelength conversion member 3 may be pushed along the inclined inner peripheral surface 4b of the reflection member 4 from above the reflection member 4, and the wavelength conversion member 3 is easy to assemble. At this time, when the wavelength conversion member 3 is pushed in, the wavelength conversion member 3 returns to a flat plate shape by the elasticity of the wavelength conversion member 3 itself at the position of the holding unit 7 and is fitted and held in the holding unit 7. .

また、図３，図４に示されるように、反射部材４は、挟持部７の下側対向面６ｂの端部が、挟持部７の上側対向面６ａの端部より発光素子２側に形成され、下側対向面６ｂの方が長く延設されるように、すなわち、挟持部７の下側の内周面４ａと挟持部７の奥面との距離が長くなるように配設されると、波長変換部材３の下面の隙間部７ｂを伝搬する光の経路が長くなり、この隙間部７ｂを経由して発光素子２からの光が伝搬される間に、隙間部７ｂと波長変換部材３との屈折率差によって発光素子２からの光が波長変換部材３に入射されやすくなるとともに、発光装置の外部に漏洩し難くなる。また、発光装置の外部に露出する波長変換部材３の上面の面積は大きくなる結果、波長変換部材３で波長変換された光は波長変換部材３の外周近くまで上方へ放射可能となり、変換光を有効に発光装置の外部に取り出して、発光装置の光出力や発光効率を向上させることができる。この場合も、反射部材４の挟持部７の上側が上方に向かうに伴って外側に広がるように形成されるのが好ましい。   As shown in FIGS. 3 and 4, the reflecting member 4 is formed such that the end of the lower facing surface 6 b of the sandwiching portion 7 is closer to the light emitting element 2 than the end of the upper facing surface 6 a of the sandwiching portion 7. The lower facing surface 6b is extended longer, that is, the distance between the lower inner peripheral surface 4a of the clamping part 7 and the inner surface of the clamping part 7 is increased. In addition, the light path propagating through the gap 7b on the lower surface of the wavelength conversion member 3 becomes long, and the light from the light emitting element 2 is propagated through the gap 7b. 3 makes it easy for light from the light emitting element 2 to be incident on the wavelength conversion member 3 and not to leak to the outside of the light emitting device. Further, as a result of an increase in the area of the upper surface of the wavelength conversion member 3 exposed to the outside of the light emitting device, the light subjected to wavelength conversion by the wavelength conversion member 3 can be emitted upward to the vicinity of the outer periphery of the wavelength conversion member 3, and the converted light is emitted. The light output from the light emitting device can be effectively taken out of the light emitting device, and the light output and the light emission efficiency of the light emitting device can be improved. Also in this case, it is preferable that the upper side of the sandwiching portion 7 of the reflecting member 4 is formed so as to spread outward as it goes upward.

また、図５の平面図に示されるように、挟持部７は、内周方向に沿って全周に連続するように形成されていると、反射部材の内側表面に沿って伝搬する光は全て挟持部７を横切ることになり、波長変換部材３の側方を素通りして発光装置の外部に漏洩する発光素子２からの光がなくなる。その結果、波長変換部材３によって変換されて放射される変換光が、発光素子２から漏洩してきた漏洩光と混合されることが少なくなり、発光装置は所望の波長スペクトルおよび発光色を有する光を放射できる。   Further, as shown in the plan view of FIG. 5, when the sandwiching portion 7 is formed so as to be continuous along the entire circumference along the inner circumferential direction, all of the light propagating along the inner surface of the reflecting member is transmitted. As a result, the light from the light-emitting element 2 that passes through the side of the wavelength conversion member 3 and leaks to the outside of the light-emitting device is eliminated. As a result, the converted light emitted by being converted by the wavelength conversion member 3 is less likely to be mixed with the leaked light leaking from the light emitting element 2, and the light emitting device emits light having a desired wavelength spectrum and emission color. Can radiate.

さらにまた、発光素子２からの光が紫外領域から近紫外領域および青色領域を含む光を放射する場合、この様なエネルギーの高い光が発光装置の外部に漏洩することによって発生する、発光装置の周辺部材や周辺機器の変色や機械的な強度劣化等の特性変化を抑制できる。   Furthermore, when the light from the light emitting element 2 emits light including the ultraviolet region, the near ultraviolet region, and the blue region, such a light having high energy is generated by leaking to the outside of the light emitting device. Characteristic changes such as discoloration of peripheral members and peripheral devices and mechanical strength deterioration can be suppressed.

また、図６の断面図に示されるように、反射部材４は、挟持部７の上側が透光性の反射部材４ｃで形成されている場合、十分な強度で挟持されている波長変換部材３の外周部より放射される変換光が、反射部材４ｃを透過し、発光装置の外部に放射されやすくなる。その結果、発光装置の光出力や発光効率は向上する。   Further, as shown in the cross-sectional view of FIG. 6, when the reflection member 4 is formed of a translucent reflection member 4 c on the upper side of the sandwiching portion 7, the wavelength conversion member 3 that is sandwiched with sufficient strength. The converted light radiated from the outer periphery of the light passes through the reflecting member 4c and is easily radiated to the outside of the light emitting device. As a result, the light output and light emission efficiency of the light emitting device are improved.

また、図７（ａ），（ｂ）の断面斜視図および平面図ならびに図８に示す図７（ｂ）の切断面Ａ−Ａ’における断面図のように、挟持部７の上側対向面６ａおよび下側対向面６ｂの少なくとも一方が反射部材４の内周面４ａから突出するように設けられた突起７ｃの一部で構成されている場合、波長変換部材３の外周部に位置する平面視面積の小さな挟持部７による光吸収を抑制でき、発光装置の光出力や発光効率は向上する。すなわち、挟持部７を、接着剤を用いずに十分な強度で波長変換部材３を反射部材４に固定できる程度に平面視面積の小さな突起７ｃにすることにより、挟持部７による光吸収や光反射を有効に抑制でき、発光装置の光出力や発光効率は向上する。   Further, as shown in the sectional perspective view and the plan view of FIGS. 7A and 7B and the sectional view taken along the line AA ′ of FIG. 7B shown in FIG. When at least one of the lower facing surface 6b is constituted by a part of the protrusion 7c provided so as to protrude from the inner peripheral surface 4a of the reflecting member 4, the plan view located at the outer peripheral portion of the wavelength conversion member 3 Light absorption by the pinching portion 7 having a small area can be suppressed, and the light output and light emission efficiency of the light emitting device are improved. That is, the pinching portion 7 is formed as a projection 7c having a small area in plan view so that the wavelength conversion member 3 can be fixed to the reflecting member 4 with sufficient strength without using an adhesive. Reflection can be effectively suppressed, and the light output and light emission efficiency of the light emitting device are improved.

図７に示すように、挟持部７の下側を内周面４ａに沿って設けられた段差とし、挟持部７の上側が突起７ｃとされてもよいし、下側および上側双方が内周面４ａから突出する突起７ｃとされてもよい。図７に示すような段差および突起７ｃを組み合わせたものとすれば、突起７ｃが発光素子２の光を大きく遮るものとならないし、かつ段差が図４に示される形態と同様の作用効果を奏することができる。   As shown in FIG. 7, the lower side of the sandwiching portion 7 may be a step provided along the inner peripheral surface 4a, and the upper side of the sandwiching portion 7 may be a projection 7c. The protrusion 7c may protrude from the surface 4a. If the step and the projection 7c as shown in FIG. 7 are combined, the projection 7c does not largely block the light of the light emitting element 2, and the step has the same effect as the embodiment shown in FIG. be able to.

また、突起７ｃを、透光性とすると、挟持部７によって光吸収または光反射されず、内周面４ａに沿って伝播してきた光も突起７ｃによって進行が妨げられることがないので、波長変換部材３から発光装置の外部に放射される光強度が低下することがない。   Further, if the protrusion 7c is translucent, light is not absorbed or reflected by the sandwiching portion 7, and light propagating along the inner peripheral surface 4a is not hindered by the protrusion 7c. The intensity of light emitted from the member 3 to the outside of the light emitting device does not decrease.

なお、突起７ｃは、図７（ａ）に示されるように、上視平面形状が三角状または四角状等の多角形状でもよく、半円状等の曲面状でもよく、また、突起７ｃの先端が横断面形状において上に向かって外側へ広がる傾斜面としてもよく、波長変換部材３を挟持固定するために必要な強度や、突起による光吸収等を考慮し、適宜選定できることは言うまでもない。   As shown in FIG. 7A, the projection 7c may have a polygonal shape such as a triangular shape or a square shape, or a curved surface shape such as a semicircular shape, or the tip of the projection 7c. Needless to say, it may be an inclined surface that spreads outward in the cross-sectional shape, and can be appropriately selected in consideration of the strength necessary for sandwiching and fixing the wavelength conversion member 3, light absorption by the protrusions, and the like.

また、上下双方が突起７ｃで構成される場合、必ずしも上下の突起７ｃが上下に対向するような位置に形成される必要はない。例えば、図９（ａ）に示す発光装置の上視平面図および図９（ｂ）に示す図９（ａ）の切断線Ｂ−Ｂ’における断面図のように、平面視において下側の突起７ｃの間に上側の突起７ｃが配置されるように形成されてもよい。   Further, when both the upper and lower protrusions are constituted by the protrusions 7c, the upper and lower protrusions 7c do not necessarily have to be formed at positions facing each other vertically. For example, as shown in the plan view of the light emitting device shown in FIG. 9A and the cross-sectional view taken along the line BB ′ of FIG. 9A shown in FIG. It may be formed so that the upper projection 7c is disposed between the 7c.

また、溝状凹部７ａの上下に突起７ｃを組み合わせるように設けてもよく、溝状凹部７ａが反射部材４の内周に浅く環状に設けられたものと組み合わせて突起７ｃを設けると、発光素子２からの光が波長変換部材３の側面から漏出しにくくするとともに、突起７ｃによって波長変換部材３をしっかり固定され、しかも波長変換部材３の主面の露出面積を大きくすることができる。   Further, the projections 7c may be provided on the upper and lower sides of the groove-like recess 7a. When the projection 7c is provided in combination with the groove-like recess 7a formed in a shallow annular shape on the inner periphery of the reflecting member 4, the light emitting element 2 is difficult to leak from the side surface of the wavelength conversion member 3, the wavelength conversion member 3 is firmly fixed by the projection 7 c, and the exposed area of the main surface of the wavelength conversion member 3 can be increased.

さらに、挟持部７の内面が拡散面に形成される場合、発光素子２から伝搬されて挟持部７に入射した光は挟持部７の内面で拡散され、波長変換部材３に入射されやすくなるとともに、光が拡散されて波長変換部材３に入射するので、波長変換部材３の波長変換効率が増加し、発光装置の光出力や発光効率は向上する。   Further, when the inner surface of the sandwiching portion 7 is formed on the diffusing surface, the light propagated from the light emitting element 2 and incident on the sandwiching portion 7 is diffused on the inner surface of the sandwiching portion 7 and easily enters the wavelength conversion member 3. Since the light is diffused and enters the wavelength conversion member 3, the wavelength conversion efficiency of the wavelength conversion member 3 is increased, and the light output and the light emission efficiency of the light emitting device are improved.

また、発光素子２が搭載部１ａに搭載されるとともに配線導体１ｂに導電性部材５を介して電気的に接続された後、発光素子２の表面から基体１上面や反射部材４の内側にかけて発光素子２を被覆するように透光性部材８を配置してもよい。この場合、透光性部材８と発光素子２との屈折率差の小さいものを選択することにより、発光素子２の内部から放射される光が発光素子２と透光性部材８との界面において発光素子２内に全反射され、発光素子２内に閉じ込められてしまい難くなり、透光性部材８を介して外部に放射されやすくなる。その結果、発光素子２から効率よく光を取り出すことができ、発光装置の光出力や発光効率は向上する。   Further, after the light emitting element 2 is mounted on the mounting portion 1 a and electrically connected to the wiring conductor 1 b via the conductive member 5, light is emitted from the surface of the light emitting element 2 to the upper surface of the substrate 1 or the inside of the reflecting member 4. The translucent member 8 may be disposed so as to cover the element 2. In this case, by selecting a material having a small refractive index difference between the translucent member 8 and the light emitting element 2, light emitted from the inside of the light emitting element 2 is transmitted at the interface between the light emitting element 2 and the translucent member 8. The light is totally reflected in the light emitting element 2 and is not easily trapped in the light emitting element 2, and is easily radiated to the outside through the translucent member 8. As a result, light can be efficiently extracted from the light emitting element 2, and the light output and light emission efficiency of the light emitting device are improved.

また、発光素子２を被覆するように反射部材４の内側に透光性部材８を充填する場合、波長変換部材３が透光性部材８に接触して接着されてしまわないようにすることが好ましい。その結果、透光性部材８を硬化する際の収縮や環境温度による熱膨張によって発生する、透光性部材８との接着面における波長変換部材３の変形を抑制できる。なお、波長変換部材３から発光素子２側に放射される一部の光は、波長変換部材３と透光性部材８との間に設けられた空間部と波長変換部材３との界面で全反射されやすくなる。その結果、波長変換部材３から発光素子２側に放射される光は、基体１や反射部材４の反射率に依存した光吸収損失によって、発光装置の光出力や発光効率が低下することがない。   Further, when the translucent member 8 is filled inside the reflecting member 4 so as to cover the light emitting element 2, the wavelength converting member 3 may be prevented from contacting and adhering to the translucent member 8. preferable. As a result, it is possible to suppress the deformation of the wavelength conversion member 3 on the adhesive surface with the translucent member 8, which occurs due to shrinkage when the translucent member 8 is cured or thermal expansion due to environmental temperature. A part of the light emitted from the wavelength conversion member 3 to the light emitting element 2 side is entirely at the interface between the wavelength conversion member 3 and the space provided between the wavelength conversion member 3 and the translucent member 8. It becomes easy to be reflected. As a result, the light emitted from the wavelength conversion member 3 to the light emitting element 2 side does not decrease the light output or the light emission efficiency of the light emitting device due to the light absorption loss depending on the reflectance of the substrate 1 or the reflection member 4. .

また、透光性部材８の材料としては、例えば、シリコーン樹脂，エポキシ樹脂，アクリル樹脂，フッ素系樹脂，ポリカーボネート樹脂，ポリイミド系樹脂等が挙げられるが、これに限定されるものではなく、基体１や反射部材４の材質や熱膨張係数等を考慮して適宜選定すればよい。透光性部材８は、未硬化の透光性部材８が反射部材４の内側に発光素子２を被覆するようにディスペンサー等の注入器で注入される。その後、未硬化の透光性部材８は、加熱や放置されることによって硬化されて固化する。なお、透光性部材８の上部を透光性の蓋体で覆うことが必要になるが、液状の透光性部材８を用いてもよいことは言うまでもない。   Examples of the material of the translucent member 8 include silicone resin, epoxy resin, acrylic resin, fluorine resin, polycarbonate resin, and polyimide resin, but are not limited thereto. And the material of the reflecting member 4 and the coefficient of thermal expansion may be selected as appropriate. The translucent member 8 is injected with an injector such as a dispenser so that the uncured translucent member 8 covers the light emitting element 2 inside the reflecting member 4. Thereafter, the uncured translucent member 8 is cured and solidified by being heated or left standing. In addition, although it is necessary to cover the upper part of the translucent member 8 with a translucent cover body, it cannot be overemphasized that the liquid translucent member 8 may be used.

なお、透光性部材８は、シリコーン樹脂から成ることがより好ましく、発光素子２から発せられる紫外光や近紫外光または青色光等の波長が短くエネルギーが高い光に対し、透過性がよく、分子構造が切断されにくいため、透光性部材の透過率の劣化が抑制され、封止信頼性に優れた発光装置を提供することができる。 The translucent member 8 is more preferably made of a silicone resin, and has good transmissivity for light having a short wavelength and high energy such as ultraviolet light, near-ultraviolet light, or blue light emitted from the light emitting element 2, Since the molecular structure is not easily cut, deterioration of the transmittance of the translucent member is suppressed, and a light-emitting device having excellent sealing reliability can be provided.

本発明の発光素子２は、少なくとも紫外領域から青色領域に含まれる光を放射する発光素子２であることがより好ましい。この場合、紫外領域から青色領域の短波長でエネルギーの高い発光素子２の光を、蛍光体等の波長変換粒子または波長変換材によって長波長でエネルギーの低い蛍光等に効率よく変換でき、発光装置の光出力や発光効率を向上できる。   The light emitting element 2 of the present invention is more preferably a light emitting element 2 that emits light contained in at least the ultraviolet region to the blue region. In this case, the light of the light emitting element 2 having a short wavelength from the ultraviolet region to the blue region and having a high energy can be efficiently converted into a fluorescent material having a long wavelength and a low energy by using a wavelength conversion particle or a wavelength conversion material such as a phosphor. Light output and luminous efficiency can be improved.

また、発光素子２は、白色光や種々の色の光を発光装置から視感性よく放射させるという観点から200乃至500ｎｍの波長範囲の紫外光から近紫外光および青色光の範囲に発光のピーク強度を有する素子であるのがよい。例えば、サファイア基板上にガリウム（Ｇａ）−窒素（Ｎ），Ａｌ−Ｇａ−Ｎ，インジウム（Ｉｎ）−ＧａＮ等から構成されるバッファ層，Ｎ型層，発光層，Ｐ型層を順次積層した窒化ガリウム系化合物半導体やシリコンカーバイド（ＳｉＣ）系化合物半導体、酸化亜鉛系化合物半導体やセレン化亜鉛系化合物半導体またはダイヤモンド系化合物半導体や窒化ホウ素系化合物半導体等が用いられる。   In addition, the light emitting element 2 emits white light and various colors of light from the light emitting device with good visibility, and emits light with a peak intensity from ultraviolet light in the wavelength range of 200 to 500 nm to near ultraviolet light and blue light. It is preferable that the element has For example, a buffer layer composed of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, etc., an N-type layer, a light-emitting layer, and a P-type layer are sequentially stacked on a sapphire substrate. A gallium nitride compound semiconductor, a silicon carbide (SiC) compound semiconductor, a zinc oxide compound semiconductor, a zinc selenide compound semiconductor, a diamond compound semiconductor, a boron nitride compound semiconductor, or the like is used.

なお、発光素子２から発生する光の紫外領域とは、可視光の短波長端360〜400ｎｍを下限とし、上限は１ｎｍくらいまでの波長範囲の電磁波とする（理化学事典第５版／岩波書店）。また、青色領域とは、可視光の短波長端360〜400ｎｍを上限とし、下限は495ｎｍくらいまでの波長範囲とする（ＪＩＳ Ｚ8701 ＸＹＺ表色系の色度座標）。   In addition, the ultraviolet region of the light generated from the light-emitting element 2 is the lower limit of the short wavelength end of visible light of 360 to 400 nm, and the upper limit is an electromagnetic wave having a wavelength range of up to about 1 nm (Rikagaku Encyclopedia 5th edition / Iwanami Shoten) . The blue region has an upper limit of 360 to 400 nm at the short wavelength end of visible light and a lower limit of a wavelength range up to about 495 nm (chromaticity coordinates of JIS Z8701 XYZ color system).

また、発光素子２は、その電極がＡｕ−Ｓｎ，Ｓｎ−Ａｇ，Ｓｎ−Ａｇ−ＣｕまたはＳｎ−Ｐｂ等のロウ材や半田を用いた金属バンプ、またはＡｕやＡｇ等の金属を用いた金属バンプ、エポキシ樹脂等の樹脂にＡｇ等の金属粉末を含有して成る導電性樹脂から成る導電性部材５を介してフリップチップ実装によって配線導体１ｂに電気的に接続される。例えば、配線導体１ｂ上にペースト状のＡｕ−ＳｎやＰｂ−Ｓｎ等の半田材やＡｇペースト等からなる導電性部材５がディスペンサー等を用いて載置され、発光素子２は発光素子２の電極と導電性部材５とが接触するように搭載され、その後、全体が１５０℃〜３５０℃程度で加熱されることにより、発光素子２の電極と配線導体１ｂとが導電性部材５によって電気的に接続された発光装置を作製する方法や、配線導体１ｂ上にペースト状のＡｕ−ＳｎやＰｂ−Ｓｎ等の半田材から成る導電性部材５がディスペンサー等を用いて載置されるとともに、全体が１５０℃〜３５０℃程度で加熱され、その後、発光素子２は発光素子２の電極と導電性部材５とが接触するように搭載され、発光素子２の電極と配線導体１ｂとが導電性部材５によって電気的に接続された発光装置を作製する方法等がある。また、配線導体１ｂおよび発光素子２の電極を、例えば、ボンディングワイヤ等の導電性部材５で電気的に接続する方法を用いてもよく、フリップチップ実装にしか用いることができないものではない。   The light emitting element 2 has a metal bump using a solder material such as Au—Sn, Sn—Ag, Sn—Ag—Cu, or Sn—Pb, or a metal bump, or a metal using a metal such as Au or Ag. It is electrically connected to the wiring conductor 1b by flip chip mounting through a conductive member 5 made of a conductive resin made of a resin such as a bump and an epoxy resin containing a metal powder such as Ag. For example, the conductive member 5 made of a solder material such as paste Au—Sn or Pb—Sn or Ag paste or the like is placed on the wiring conductor 1 b using a dispenser or the like, and the light emitting element 2 is an electrode of the light emitting element 2. And the conductive member 5 are brought into contact with each other, and then the whole is heated at about 150 ° C. to 350 ° C., whereby the electrode of the light emitting element 2 and the wiring conductor 1b are electrically connected by the conductive member 5. A method of manufacturing a connected light emitting device, and a conductive member 5 made of a solder material such as paste Au—Sn or Pb—Sn is placed on the wiring conductor 1b using a dispenser or the like, After heating at about 150 ° C. to 350 ° C., the light emitting element 2 is mounted so that the electrode of the light emitting element 2 and the conductive member 5 are in contact with each other, and the electrode of the light emitting element 2 and the wiring conductor 1 b are connected to the conductive member 5. By And a method of making a gas-connected to the light emitting device. Further, a method of electrically connecting the wiring conductor 1b and the electrode of the light emitting element 2 with, for example, a conductive member 5 such as a bonding wire may be used, and this method can only be used for flip chip mounting.

なお、挟持部７や溝状凹部７ａまたは突起７ｃの水平方向の長さは、波長変換部材３の平面視における外寸の５％以上であり、かつ３０％以内であることが好ましい。挟持部７や溝状凹部７ａまたは突起の水平方向の長さが波長変換部材３の外寸の５％より小さい場合、波長変換部材３を挟持部７に強固に挟持固定させることができない傾向がある。その結果、外部からの衝撃に対して波長変換部材３が反射部材４から外れ易くなり、発光装置を正常に作動させることができない。   In addition, it is preferable that the horizontal direction length of the clamping part 7, the groove-shaped recessed part 7a, or the processus | protrusion 7c is 5% or more of the outer dimension in the planar view of the wavelength conversion member 3, and it is less than 30%. When the length in the horizontal direction of the sandwiching portion 7, the groove-like recess 7 a, or the projection is smaller than 5% of the outer dimension of the wavelength conversion member 3, there is a tendency that the wavelength conversion member 3 cannot be firmly sandwiched and fixed to the sandwiching portion 7. is there. As a result, the wavelength conversion member 3 is easily detached from the reflection member 4 in response to an external impact, and the light emitting device cannot be operated normally.

また、挟持部７の水平方向の長さが波長変換部材３の外寸の３０％より大きい場合、挟持部７で挟持固定される波長変換部材３の外周部に光が閉じ込められ、波長変換部材３から発光装置の外部に光が取り出され難くなる。その結果、発光装置の光出力および発光効率は著しく低下する。   Further, when the horizontal length of the sandwiching portion 7 is larger than 30% of the outer dimension of the wavelength converting member 3, light is confined to the outer peripheral portion of the wavelength converting member 3 sandwiched and fixed by the sandwiching portion 7, and the wavelength converting member It becomes difficult for light to be extracted from 3 to the outside of the light emitting device. As a result, the light output and light emission efficiency of the light emitting device are significantly reduced.

本発明の照明装置は、上記本発明の発光装置と、発光装置が搭載され、発光装置を駆動する電気配線を有する駆動部と、発光装置から出射される光を反射する光反射手段とを含むことにより、発光装置の輝度が向上し、放射される光の波長等の変動およびそれぞれの発光装置の強度むらが抑制され、それらを集めて照明装置とした本発明の照明装置の強度むらも抑制され、輝度の高いものとなる。   The lighting device of the present invention includes the above-described light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having electric wiring for driving the light emitting device, and a light reflecting means for reflecting light emitted from the light emitting device. As a result, the brightness of the light emitting device is improved, fluctuations in the wavelength of the emitted light and the unevenness of the intensity of each light emitting device are suppressed, and the unevenness of the intensity of the lighting device of the present invention, which is collected as a lighting device, is also suppressed. As a result, the luminance becomes high.

また、本発明の照明装置において、図１１，図１２，図１３，図１４に示されるように、一個の発光装置から成る光源１０１を所定の配置となるように設置したり、または、複数個を、例えば、格子状や千鳥状、放射状等の所定の配置となるように設置したりしてもよい。あるいは、複数の光源１０１から成る円形状や多角形状の光源１０１群を同心状に複数群形成したもの等を所定の配置となるように設置してもよい。   In the illumination device of the present invention, as shown in FIGS. 11, 12, 13, and 14, the light source 101 composed of one light-emitting device is installed in a predetermined arrangement, or a plurality of light sources 101 are arranged. For example, they may be installed in a predetermined arrangement such as a lattice shape, a staggered shape, or a radial shape. Or you may install so that it may become predetermined arrangement | positioning etc. which formed multiple groups of the circular shape and polygonal light source 101 group which consists of the several light source 101 concentrically.

例えば、図１１の平面図およびその断面図を示す図１２のように複数個の光源１０１が光源１０１を駆動するための電気配線を有する駆動部１０２上に複数列に配置され、光源１０１の周囲に任意の形状に光学設計された反射板等の光反射手段１０３が設置されてなる発光装置の場合、隣り合う光源１０１との間隔が最短にならない配置、例えば一列に配置された複数個の光源１０１の間に隣り合う列の光源１０１が配置された配置、いわゆる千鳥状の配置とすることが好ましい。即ち、光源１０１が格子状に配置される場合には、光源１０１が縦横直線状の格子に配列されることによりグレアが強くなり、このような光源１０１が人の視覚に入ってくることにより、不快感を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人の眼に対する不快感を低減することができる。さらに、隣り合う光源１０１間の距離が長くなることにより、隣接する光源１０１間の熱的な干渉が有効に抑制され、光源１０１が実装された駆動部１０２内における熱のこもりが抑制され、光源１０１の外部に効率よく熱が放散される。その結果、人の眼に対して不快感が小さく、長期間にわたって光学特性の安定した長寿命の発光装置を作製することができる。   For example, a plurality of light sources 101 are arranged in a plurality of rows on a drive unit 102 having electrical wiring for driving the light sources 101 as shown in FIG. In the case of a light emitting device in which a light reflecting means 103 such as a reflector optically designed in an arbitrary shape is installed, an arrangement in which the distance between adjacent light sources 101 is not shortest, for example, a plurality of light sources arranged in a row It is preferable to adopt a so-called zigzag arrangement in which adjacent rows of light sources 101 are arranged between 101. That is, when the light sources 101 are arranged in a grid pattern, glare is strengthened by arranging the light sources 101 in vertical and horizontal linear grids, and when such a light source 101 enters human vision, Whereas discomfort is likely to occur, the staggered pattern can suppress glare and reduce discomfort for the human eye. Furthermore, since the distance between the adjacent light sources 101 is increased, thermal interference between the adjacent light sources 101 is effectively suppressed, heat accumulation in the drive unit 102 in which the light sources 101 are mounted is suppressed, and the light source Heat is efficiently dissipated to the outside of 101. As a result, it is possible to manufacture a light-emitting device with a long life with less discomfort to human eyes and stable optical characteristics over a long period of time.

また、発光装置が、図１３の平面図およびその断面図を示す図１４のような駆動部１０２上に複数の光源１０１からなる円形状や多角形状の光源１０１群を、同心状に複数群形成した発光装置の場合、一つの円形状や多角形状の光源１０１群における光源１０１の配置数を発光装置の中央側より外周側ほど多くすることが好ましい。これにより、光源１０１同士の間隔を適度に保ちながら光源１０１をより多く配置することができ、発光装置の照度をより向上させることができる。また、発光装置の中央部の光源１０１の密度を低くして駆動部１０２の中央部における熱のこもりを抑制することができる。その結果、駆動部１０２内における温度分布が一様となり、発光装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、光源１０１の温度上昇を抑制することができ、光源１０１は長期間にわたり安定して動作することができるとともに長寿命の発光装置を作製することができる。   Further, the light-emitting device forms a plurality of concentric groups of circular or polygonal light sources 101 formed of a plurality of light sources 101 on the driving unit 102 as shown in the plan view of FIG. 13 and a cross-sectional view thereof. In the case of the light emitting device, it is preferable to increase the number of the light sources 101 arranged in one circular or polygonal light source 101 group from the center side to the outer peripheral side of the light emitting device. Thereby, more light sources 101 can be arrange | positioned maintaining the space | interval of light sources 101 moderately, and the illumination intensity of a light-emitting device can be improved more. In addition, the density of the light source 101 at the center of the light emitting device can be lowered to suppress heat accumulation at the center of the drive unit 102. As a result, the temperature distribution in the drive unit 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board or heat sink on which the light emitting device is installed, and the temperature rise of the light source 101 can be suppressed. A light-emitting device that can operate stably over a period of time and has a long lifetime can be manufactured.

このような発光装置を用いた照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装、展示用照明器具、街路灯用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of the lighting device using such a light emitting device include, for example, general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, and display lighting fixtures that are used indoors and outdoors. Street lighting fixtures, guide lights and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency use Examples include lighting fixtures, flashlights, electric bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, vehicle lights, and the like.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行なうことは何等支障ない。例えば、反射部材４の上面に発光素子２または波長変換部材３より放射される光を所要に集光し拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接合剤等で接合することにより、所望する放射角度で光を取り出すことができる発光装置としてもよい。これにより、発光装置内への浸水性が改善され長期信頼性および作動寿命が向上する。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, an optical lens for collecting and diffusing light emitted from the light emitting element 2 or the wavelength conversion member 3 as necessary on the upper surface of the reflecting member 4 or a flat light-transmitting lid is bonded with solder or a resin bonding agent. Thus, a light emitting device that can extract light at a desired radiation angle may be used. Thereby, the water immersion in a light-emitting device is improved and long-term reliability and an operating life improve.

また、上記実施の形態例において、反射部材４の内周面４ａが平面視において円形状である例を示して説明したが、円形状に限定されることはなく、四角形状やその他の多角形状、楕円形状、その他星型等の不定形状であってもよい。また、反射部材４および基体１の外周形状も円形状に限定されることはなく、その他の多角形状、四角形状や楕円形状、その他の不定形状であってもよい。また、反射部材４の断面形状が直角三角形状のブロック状に示したが、例えば板材等で錐台状に形成されたものでもよい。   In the above-described embodiment, the inner peripheral surface 4a of the reflecting member 4 has been described as an example of a circular shape in plan view, but is not limited to a circular shape, and may be a rectangular shape or other polygonal shape. Further, it may be an indefinite shape such as an elliptical shape or a star shape. Further, the outer peripheral shape of the reflecting member 4 and the substrate 1 is not limited to a circular shape, and may be other polygonal shapes, quadrangular shapes, elliptical shapes, or other indefinite shapes. Moreover, although the cross-sectional shape of the reflecting member 4 is shown as a right triangle block, it may be formed in a frustum shape with a plate material or the like, for example.

また、上記実施の形態の説明において上下左右という用語は、単に図面上の位置関係を説明するために用いたものであり、実際の使用時における位置関係を意味するものではない。   In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

本発明の発光装置の実施の形態の一例を示す断面図および上視平面図である。It is sectional drawing and an upper plan view which show an example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す上視平面図である。It is a top view top view which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す部分断面斜視図および平面図である。It is the fragmentary sectional perspective view and top view which show the other example of embodiment of the light-emitting device of this invention. 図７（ｂ）の切断面Ａ−Ａ’における断面図である。It is sectional drawing in the cut surface A-A 'of FIG.7 (b). 本発明の発光装置の実施の形態の他の例を示す上視平面図および断面図である。It is the top view top view and sectional drawing which show the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の照明装置の実施の形態の一例を示す上視平面図である。It is a top view top view which shows an example of embodiment of the illuminating device of this invention. 図１１の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す上視平面図である。It is a top view top view which shows the other example of embodiment of the illuminating device of this invention. 図１３の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 従来の発光装置の断面図である。It is sectional drawing of the conventional light-emitting device.

符号の説明Explanation of symbols

１：基体
１ａ：搭載部
１ｂ：配線導体
２：発光素子
３：波長変換部材
４：反射部材
６：対向面
６ａ：上側対向面
６ｂ：下側対向面
７：狭持部
７ａ：溝状凹部
７ｂ：隙間部
７ｃ：突起 1: Base 1a: Mounting portion 1b: Wiring conductor 2: Light emitting element 3: Wavelength converting member 4: Reflecting member 6: Opposing surface 6a: Upper facing surface 6b: Lower facing surface 7: Holding portion 7a: Groove-shaped recess 7b : Gap 7c: Projection

Claims (13)

基体と、該基体の上面に搭載された発光素子と、前記基体の上面に前記発光素子を取り囲むように取着された反射部材と、前記反射部材の内側に、前記発光素子を覆うように前記発光素子と離間させて配置され、前記発光素子が発する光に励起されて蛍光を発生する蛍光体を含有した板状の波長変換部材とを備えて成る発光装置において、前記反射部材は、その内周面に、前記波長変換部材の外周部の上面に対向する上側対向面および前記波長変換部材の外周部の下面に対向する下側対向面を有していることを特徴とする発光装置。 A base, a light-emitting element mounted on the top surface of the base, a reflective member attached to the top surface of the base so as to surround the light-emitting element, and an inner side of the reflective member so as to cover the light-emitting element A light emitting device including a plate-like wavelength conversion member that is disposed apart from the light emitting element and contains a phosphor that is excited by light emitted from the light emitting element and generates fluorescence; The light emitting device according to claim 1, further comprising: an upper facing surface facing an upper surface of an outer peripheral portion of the wavelength conversion member; and a lower facing surface facing a lower surface of the outer peripheral portion of the wavelength conversion member. 前記波長変換部材の外周部は、前記反射部材の内周に沿って形成された溝状凹部内に遊嵌されており、前記上側対向面および前記下側対向面が前記溝状凹部の内面の一部を構成していることを特徴とする請求項１記載の発光装置。 The outer peripheral portion of the wavelength conversion member is loosely fitted in a groove-shaped recess formed along the inner periphery of the reflecting member, and the upper facing surface and the lower facing surface are the inner surfaces of the groove-shaped recess. The light-emitting device according to claim 1, wherein the light-emitting device constitutes a part. 前記反射部材は、前記上側対向面よりも上方に位置する前記反射部材の開口径が上方に向かって拡がるようにされていることを特徴とする請求項１または請求項２記載の発光装置。 3. The light emitting device according to claim 1, wherein the reflecting member is configured such that an opening diameter of the reflecting member positioned above the upper facing surface is expanded upward. 4. 前記下側対向面の端部は、前記上側対向面の端部よりも前記発光素子側に配設されていることを特徴とする請求項１乃至請求項３記載の発光装置。 4. The light emitting device according to claim 1, wherein an end portion of the lower facing surface is disposed closer to the light emitting element than an end portion of the upper facing surface. 前記上側対向面および下側対向面は、前記反射部材の内周に環状に設けられていることを特徴とする請求項１乃至請求項４のいずれかに記載の発光装置。 5. The light emitting device according to claim 1, wherein the upper facing surface and the lower facing surface are annularly provided on an inner periphery of the reflecting member. 前記反射部材は、前記波長変換部材の上側が透光性であることを特徴とする請求項１乃至請求項５のいずれかに記載の発光装置。 The light emitting device according to claim 1, wherein the reflection member is translucent on an upper side of the wavelength conversion member. 前記上側対向面および下側対向面の少なくとも一方は、突起の一部であることを特徴とする請求項１記載の発光装置。 The light emitting device according to claim 1, wherein at least one of the upper facing surface and the lower facing surface is a part of a protrusion. 前記突起は、透光性であることを特徴とする請求項７記載の発光装置。 The light emitting device according to claim 7, wherein the protrusion is translucent. 前記発光素子は、少なくとも紫外領域から青色領域に含まれる光を放射する前記発光素子であることを特徴とする請求項１乃至請求項８に記載の発光装置。 The light-emitting device according to claim 1, wherein the light-emitting element is the light-emitting element that emits light included in at least an ultraviolet region to a blue region. 前記上側対向面および下側対向面の内面が拡散面にされていることを特徴とする請求項１乃至請求項９に記載の発光装置。 10. The light emitting device according to claim 1, wherein inner surfaces of the upper facing surface and the lower facing surface are diffusion surfaces. 前記発光素子は、透光性部材によって被覆されていることを特徴とする請求項１乃至請求項１０に記載の発光装置。 The light emitting device according to claim 1, wherein the light emitting element is covered with a light transmissive member. 前記透光性部材は、シリコーン樹脂から成ることを特徴とする請求項１乃至請求項１１に記載の発光装置。 The light emitting device according to claim 1, wherein the translucent member is made of a silicone resin. 請求項１乃至請求項１２のいずれかに記載の発光装置と、前記発光装置が搭載され、前記発光装置を駆動する電気配線を有する駆動部と、前記発光装置から出射される光を反射する光反射手段とを含む照明装置。 13. The light emitting device according to any one of claims 1 to 12, a drive unit on which the light emitting device is mounted and having an electrical wiring that drives the light emitting device, and light that reflects light emitted from the light emitting device A lighting device including reflecting means;
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009224074A (en) * 2008-03-13 2009-10-01 Panasonic Electric Works Co Ltd Led lighting device
JP2010056398A (en) * 2008-08-29 2010-03-11 Toshiba Corp Light emitting device and light emitting apparatus
JP2011222665A (en) * 2010-04-07 2011-11-04 Mitsubishi Electric Corp Light-emitting device and wavelength conversion member
JP2012150943A (en) * 2011-01-18 2012-08-09 Mitsubishi Electric Corp Light source unit, and lighting fixture having the same
KR101186652B1 (en) * 2011-10-26 2012-09-28 서울반도체 주식회사 Lighting apparatus
JP2013004840A (en) * 2011-06-20 2013-01-07 Kyocera Corp Light-emitting device
JP2013123076A (en) * 2009-07-13 2013-06-20 Mitsubishi Electric Corp Light emitting device
WO2013175706A1 (en) * 2012-05-25 2013-11-28 日本電気株式会社 Optical element, light-emitting device, and projection device
JP2014036226A (en) * 2012-08-09 2014-02-24 Lg Innotek Co Ltd Light-emitting package
JP2014072213A (en) * 2012-09-27 2014-04-21 Toyoda Gosei Co Ltd Light-emitting device and process of manufacturing the same
US8729573B2 (en) 2007-07-26 2014-05-20 Panasonic Corporation LED lighting device
KR101456267B1 (en) * 2008-03-25 2014-11-04 서울반도체 주식회사 Lighting apparatus
JP2014212220A (en) * 2013-04-19 2014-11-13 日亜化学工業株式会社 Light emitting device
JP2015019099A (en) * 2007-09-27 2015-01-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Light source with adjustable emission characteristics
KR20150115081A (en) * 2014-04-02 2015-10-14 삼성디스플레이 주식회사 Light source unit, and method for manufacturing the same, and backlight assembly including the same
JP2015198130A (en) * 2014-03-31 2015-11-09 シチズンホールディングス株式会社 Led light-emitting device and method for manufacturing the same
JP2016004913A (en) * 2014-06-17 2016-01-12 日亜化学工業株式会社 Light emission device and manufacturing method for the same
JP2016018921A (en) * 2014-07-09 2016-02-01 日本電気硝子株式会社 Wavelength conversion member and light-emitting device
EP2472613A4 (en) * 2009-08-27 2016-02-17 Kyocera Corp Light-emitting device
US9341353B2 (en) 2011-02-28 2016-05-17 Nichia Corporation Light emitting device
JP2019029058A (en) * 2017-07-25 2019-02-21 株式会社小糸製作所 Light source module and vehicular lamp
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110146A (en) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd Light-emitting device
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode illuminator
JP2005166733A (en) * 2003-11-28 2005-06-23 Matsushita Electric Works Ltd Light emitting device
JP2005268708A (en) * 2004-03-22 2005-09-29 Stanley Electric Co Ltd Semiconductor light-emitting device and manufacturing method for the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110146A (en) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd Light-emitting device
JP2003347601A (en) * 2002-05-28 2003-12-05 Matsushita Electric Works Ltd Light emitting diode illuminator
JP2005166733A (en) * 2003-11-28 2005-06-23 Matsushita Electric Works Ltd Light emitting device
JP2005268708A (en) * 2004-03-22 2005-09-29 Stanley Electric Co Ltd Semiconductor light-emitting device and manufacturing method for the same

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US10388841B2 (en) 2012-08-09 2019-08-20 Lg Innotek Co., Ltd. Light emitting package
US9893259B2 (en) 2012-08-09 2018-02-13 Lg Innotek Co., Ltd. Light emitting package
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