JP2007141909A - Resistor and method of manufacturing same - Google Patents

Resistor and method of manufacturing same Download PDF

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JP2007141909A
JP2007141909A JP2005329657A JP2005329657A JP2007141909A JP 2007141909 A JP2007141909 A JP 2007141909A JP 2005329657 A JP2005329657 A JP 2005329657A JP 2005329657 A JP2005329657 A JP 2005329657A JP 2007141909 A JP2007141909 A JP 2007141909A
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resistor
electrode terminals
pair
resistance value
surface side
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JP5143353B2 (en
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Hiroki Konaka
浩樹 小中
Takeshi Watanabe
岳 渡辺
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistor in which a resistor value can be stabilized by making an error hardly occur in the resistance value. <P>SOLUTION: The resistor is provided with a resistor body 11 made of a metal plate, and a pair of electrode terminals 12 made of the same material as that of the resistor body 11 and integrally provided on both ends of the resistor body 11, wherein the pair of electrode terminals 12 are bent in a lower surface side of the resistor body 11 so that the lower surfaces of the pair of electrode terminals 12 can be connected each other. With this configuration, since an error hardly occurs in the resistance value even if the position of connection portion of the electrode terminals shifts from that of a mounting board, the resistance value can be stabilized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、各種電子機器の電流値検出等に使用される抵抗器およびその製造方法に関するものである。   The present invention relates to a resistor used for detecting a current value of various electronic devices and a manufacturing method thereof.

従来のこの種の抵抗器としては、図3に示すように、板状の金属で構成された抵抗体1と、この抵抗体1の両端部に形成された一対の電極端子2とを備え、前記抵抗体1を絶縁素材3で保護するようにしたもの、あるいは図4に示すように、電極部5と抵抗素子部6を一体成形するとともに、抵抗素子部6を薄肉化し、この薄肉化された抵抗素子部6を絶縁素材7で保護するようにしたものがあった。   As a conventional resistor of this type, as shown in FIG. 3, a resistor 1 made of a plate-like metal and a pair of electrode terminals 2 formed at both ends of the resistor 1 are provided. As shown in FIG. 4, the resistor 1 is protected by the insulating material 3, or the electrode portion 5 and the resistance element portion 6 are integrally formed, and the resistance element portion 6 is thinned. In some cases, the resistive element portion 6 is protected by an insulating material 7.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献1が知られている。
特開2001−176701号公報
As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2001-176701 A

図3に示した従来の抵抗器においては、一対の電極端子2と実装基板との接続部(ランドパターン)の位置がずれることにより、ランドパターンから抵抗体1まで電極端子2を通って電流の流れる距離が異なってくるため、抵抗値に誤差が生じるという課題を有していた。   In the conventional resistor shown in FIG. 3, the position of the connection part (land pattern) between the pair of electrode terminals 2 and the mounting substrate is shifted, so that the current flows through the electrode terminal 2 from the land pattern to the resistor 1. Since the flowing distance is different, there is a problem that an error occurs in the resistance value.

また、図4に示した従来の抵抗器においては、電極部5と抵抗素子部6を同一材料で形成するとともに、抵抗素子部6を電極部5よりも薄肉化しているため、電極部5と実装基板との接続部がずれても抵抗値に誤差は生じ難いものである。しかしながら、この図4においては、抵抗素子部6を薄肉化するのにエッチングプロセスを用いているため、工程が煩雑になってコストアップにつながるという課題を有していた。   In the conventional resistor shown in FIG. 4, the electrode portion 5 and the resistance element portion 6 are formed of the same material, and the resistance element portion 6 is thinner than the electrode portion 5. Even if the connection portion with the mounting substrate is displaced, an error in resistance value is unlikely to occur. However, in FIG. 4, since the etching process is used to reduce the thickness of the resistance element portion 6, there is a problem that the process becomes complicated and the cost is increased.

本発明は上記従来の課題を解決するもので、抵抗値に誤差が生じにくく、抵抗値の安定化が図れる抵抗器を提供することを目的とするものである。   The present invention solves the above-described conventional problems, and an object of the present invention is to provide a resistor that is less likely to cause an error in resistance value and that can stabilize the resistance value.

上記目的を達成するために本発明は、以下の構成を有するものである。   In order to achieve the above object, the present invention has the following configuration.

本発明の請求項1に記載の発明は、金属板で構成した抵抗体と、この抵抗体の両端部に前記抵抗体と同一材料で一体的に設けられた一対の電極端子とを備え、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続したもので、この構成によれば、抵抗体と同一材料で一体的に設けられた一対の電極端子を抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続しているため、接続後の電極端子の厚みは抵抗体の厚みのほぼ2倍となり、これにより、電極端子と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなるため、抵抗値の安定化が図れるという作用効果が得られるものである。   The invention according to claim 1 of the present invention includes a resistor composed of a metal plate, and a pair of electrode terminals integrally provided with the same material as the resistor at both ends of the resistor, The pair of electrode terminals are bent to the lower surface side of the resistor and the lower surfaces of the pair of electrode terminals are connected to each other. According to this configuration, the pair of electrode terminals integrally provided with the same material as the resistor are Since the lower surfaces of the pair of electrode terminals are connected by bending to the lower surface side of the resistor, the thickness of the electrode terminals after connection is almost twice the thickness of the resistor, thereby connecting the electrode terminals and the mounting substrate. Even if the position of the portion is shifted, it is difficult for an error to occur in the resistance value, so that the effect of stabilizing the resistance value can be obtained.

本発明の請求項2に記載の発明は、金属板で構成した抵抗体の両端部に前記抵抗体と同一材料で一対の電極端子を一体的に形成する工程と、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続する工程とを有し、前記一対の電極端子を前記抵抗体の下面側に折り曲げる前に、前記一対の電極端子の少なくとも下面にめっき層を形成し、その後、前記一対の電極端子を前記抵抗体の下面側に折り曲げ、さらに加熱することによりめっき層を介して一対の電極端子の下面同士を接続するようにしたもので、この製造方法によれば、抵抗体と同一材料で一体的に設けられた一対の電極端子が折り曲げられて電極端子の下面同士がめっき層を介して安定した状態で接続されるという作用効果が得られるとともに、電極端子の厚みも抵抗体の厚みのほぼ2倍となるため、電極端子と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなり、これにより、抵抗値の安定化が図れるという作用効果が得られ、さらに一対の電極端子は抵抗体の両端部を一体的に折り曲げることにより形成しているため、従来のように抵抗体部分を薄肉化するためにエッチングプロセスを用いる必要もなく、コスト的にも安価に得ることができるという作用効果が得られるものである。   According to a second aspect of the present invention, there is provided a step of integrally forming a pair of electrode terminals with the same material as the resistor at both ends of a resistor composed of a metal plate; and Bending the lower surface side of the resistor to connect the lower surfaces of the pair of electrode terminals, and before bending the pair of electrode terminals to the lower surface side of the resistor, at least the lower surface of the pair of electrode terminals A plating layer is formed, and then the pair of electrode terminals are bent to the lower surface side of the resistor, and further heated to connect the lower surfaces of the pair of electrode terminals through the plating layer. According to the manufacturing method, a pair of electrode terminals integrally formed of the same material as the resistor are bent, and the lower surface of the electrode terminals are connected to each other in a stable state via the plating layer. With Since the thickness of the electrode terminal is almost twice the thickness of the resistor, even if the position of the connection portion between the electrode terminal and the mounting substrate is shifted, an error in the resistance value is less likely to occur, thereby stabilizing the resistance value. In addition, since the pair of electrode terminals are formed by integrally bending both ends of the resistor, it is necessary to use an etching process to reduce the thickness of the resistor portion as in the past. In addition, there is an effect that it can be obtained at a low cost.

本発明の請求項3に記載の発明は、金属板で構成した抵抗体と、この抵抗体の両端部に設けられ、かつ前記抵抗体よりも比抵抗の低い材料で形成された一対の電極端子とを備え、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続したもので、この構成によれば、抵抗体よりも比抵抗の低い材料で形成された一対の電極端子を抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続しているため、接続後の電極端子の厚みは抵抗体の厚みのほぼ2倍となり、これにより、電極端子と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなるため、抵抗値の安定化が図れるという作用効果が得られるものである。   The invention according to claim 3 of the present invention is a pair of electrode terminals formed of a resistor composed of a metal plate and a material having a specific resistance lower than that of the resistor provided at both ends of the resistor. The pair of electrode terminals are bent to the lower surface side of the resistor and the lower surfaces of the pair of electrode terminals are connected to each other. According to this configuration, the resistor is formed of a material having a specific resistance lower than that of the resistor. Since the pair of electrode terminals are bent to the lower surface side of the resistor and the lower surfaces of the pair of electrode terminals are connected to each other, the thickness of the electrode terminal after connection is almost twice the thickness of the resistor. Even if the position of the connection portion between the terminal and the mounting substrate is shifted, it is difficult for an error to occur in the resistance value, so that the effect of stabilizing the resistance value can be obtained.

以上のように本発明の抵抗器は、金属板で構成した抵抗体の両端部に前記抵抗体と同一材料で一体的に設けられた一対の電極端子を抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続しているため、接続後の電極端子の厚みは抵抗体の厚みのほぼ2倍となり、これにより、電極端子と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなるため、抵抗値の安定化が図れるという優れた効果を奏するものである。   As described above, the resistor according to the present invention is formed by bending a pair of electrode terminals integrally formed of the same material as the resistor at both ends of the resistor composed of a metal plate to the lower surface side of the resistor. Since the lower surfaces of the electrode terminals are connected to each other, the thickness of the electrode terminal after connection is almost twice the thickness of the resistor, so that even if the position of the connection portion between the electrode terminal and the mounting substrate is shifted, the resistance value Therefore, an excellent effect of stabilizing the resistance value is obtained.

(実施の形態1)
以下、実施の形態1を用いて、本発明の特に請求項1,2に記載の発明について説明する。
(Embodiment 1)
Hereinafter, the first and second aspects of the present invention will be described with reference to the first embodiment.

図1(a)〜(c)は本発明の実施の形態1における抵抗器の製造方法の概略を示す斜視図である。   1 (a) to 1 (c) are perspective views showing an outline of a method for manufacturing a resistor in the first embodiment of the present invention.

まず、図1(a)に示すように、板状の金属に、切断加工、打ち抜き加工、プレス加工等を施すことにより、抵抗体11と、この抵抗体11の両端部に前記抵抗体11と同一材料で一体的に設けられた一対の電極端子12とを備えた所定形状の金属板を形成する。この金属板は、ニクロム、銅ニッケル、マンガニン等の導電性の良好な板状の金属で構成されているもので、その長さは1.0〜10mm、幅は0.5〜5mm、厚みは100〜1000μmとなっている。そして前記抵抗体11と電極端子12の長さ、幅、厚みを適宜選択することにより、所望の値の抵抗値を得ることができる。   First, as shown in FIG. 1A, by cutting, punching, and pressing a plate-like metal, the resistor 11 and the resistor 11 are connected to both ends of the resistor 11. A metal plate having a predetermined shape including a pair of electrode terminals 12 integrally formed of the same material is formed. This metal plate is composed of a plate-like metal having good conductivity such as nichrome, copper nickel, manganin, etc., the length is 1.0 to 10 mm, the width is 0.5 to 5 mm, and the thickness is It is 100-1000 micrometers. A desired resistance value can be obtained by appropriately selecting the length, width, and thickness of the resistor 11 and the electrode terminal 12.

次に、図1(b)に示すように、一対の電極端子12を抵抗体11の下面側に略コの字型に180度折り曲げ、そして一対の電極端子12の下面同士を溶接、圧接等の方法で接続する。このとき、前記一対の電極端子12を前記抵抗体11の下面側に折り曲げる前に、前記一対の電極端子12の少なくとも下面にめっき層(図示せず)を形成し、その後、前記一対の電極端子12を前記抵抗体11の下面側に折り曲げ、さらに加熱することによりめっき層(図示せず)を介して一対の電極端子12の下面同士を接続するようにしても良いものである。   Next, as shown in FIG. 1 (b), the pair of electrode terminals 12 are bent 180 degrees into a substantially U shape on the lower surface side of the resistor 11, and the lower surfaces of the pair of electrode terminals 12 are welded, pressed, etc. Connect with the method. At this time, before bending the pair of electrode terminals 12 to the lower surface side of the resistor 11, a plating layer (not shown) is formed on at least the lower surface of the pair of electrode terminals 12, and then the pair of electrode terminals The lower surfaces of the pair of electrode terminals 12 may be connected to each other through a plating layer (not shown) by bending the resistor 12 to the lower surface side of the resistor 11 and further heating.

次に、図1(c)に示すように、抵抗体11の上面と前面および後面にエポキシ樹脂、ポリイミド樹脂等の絶縁材からなる保護膜13を形成する。なお、この保護膜13を形成する前に抵抗体11の一部に抵抗値調整用の切欠部を形成しても良く、また、この保護膜13は抵抗体11の裏面にも回り込ませて抵抗体11の全体を覆うようにしても良いものである。   Next, as shown in FIG. 1C, a protective film 13 made of an insulating material such as epoxy resin or polyimide resin is formed on the upper surface, front surface, and rear surface of the resistor 11. Note that a notch for adjusting the resistance value may be formed in a part of the resistor 11 before forming the protective film 13, and the protective film 13 also wraps around the back surface of the resistor 11 to provide resistance. The entire body 11 may be covered.

最後に、一対の電極端子12の底面部の下面にスズめっき(図示せず)を施し、抵抗器が実装基板に実装可能なようにする。   Finally, tin plating (not shown) is applied to the lower surface of the bottom surface of the pair of electrode terminals 12 so that the resistor can be mounted on the mounting substrate.

上記したように本発明の実施の形態1においては、金属板で構成した抵抗体11の両端部に前記抵抗体11と同一材料で一体的に設けられた一対の電極端子12を抵抗体11の下面側に折り曲げて一対の電極端子12の下面同士を接続しているため、接続後の電極端子12の厚みは抵抗体11の厚みのほぼ2倍となり、これにより、電極端子12と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなるため、抵抗値の安定化が図れるという効果を有するものである。   As described above, in the first embodiment of the present invention, a pair of electrode terminals 12 integrally provided with the same material as the resistor 11 are provided at both ends of the resistor 11 formed of a metal plate. Since the lower surfaces of the pair of electrode terminals 12 are connected to each other by bending to the lower surface side, the thickness of the electrode terminals 12 after the connection is almost twice the thickness of the resistor 11, thereby the electrode terminals 12 and the mounting substrate Even if the position of the connecting portion is deviated, an error is hardly caused in the resistance value, so that the resistance value can be stabilized.

また、本発明の実施の形態1においては、一対の電極端子12を抵抗体11の下面側に折り曲げる前に、前記一対の電極端子12の少なくとも下面にめっき層(図示せず)を形成し、その後、前記一対の電極端子12を前記抵抗体11の下面側に折り曲げ、さらに加熱することによりめっき層(図示せず)を介して一対の電極端子12の下面同士を接続するようにしているため、電極端子12の下面同士はめっき層(図示せず)を介して安定した状態で接続されるという効果が得られるものである。   In Embodiment 1 of the present invention, before the pair of electrode terminals 12 are bent to the lower surface side of the resistor 11, a plating layer (not shown) is formed on at least the lower surface of the pair of electrode terminals 12, After that, the pair of electrode terminals 12 are bent to the lower surface side of the resistor 11 and further heated so that the lower surfaces of the pair of electrode terminals 12 are connected to each other through a plating layer (not shown). The bottom surfaces of the electrode terminals 12 are connected in a stable state via a plating layer (not shown).

そしてまた、本発明の実施の形態1においては、一対の電極端子12を形成する場合、抵抗体11の両端部を一体的に折り曲げることにより形成しているため、従来のように抵抗体部分を薄肉化するためにエッチングプロセスを用いる必要もなく、コスト的にも安価に得ることができるという効果を有するものである。   In Embodiment 1 of the present invention, when the pair of electrode terminals 12 is formed, the resistor 11 is formed by integrally bending both ends of the resistor 11, so that the resistor portion is formed as in the prior art. There is no need to use an etching process to reduce the thickness, and the cost can be obtained at a low cost.

なお、上記本発明の実施の形態1においては、一対の電極端子12を電極端子12の長さの約半分のところで下方に180度1回折り曲げて電極端子12の下面同士を接続することにより、電極端子12の厚みを元の厚みの2倍に増やしているが、このようにすることにより、抵抗器を実装する際の位置が同じ距離ずれた場合でも、抵抗値の誤差は電極端子12の厚みを増やさなかった場合に比べて1/2に低減させることができるものである。なお、電極端子12の折り曲げ回数を増やして電極端子12の厚みを元の厚みの3倍、4倍に増やした場合は、抵抗値の誤差を1/3、1/4にそれぞれ低減させることができるもので、この場合は、実装位置のずれに伴う抵抗値誤差が少なくなるという本発明の効果がより顕著に現れるものである。但し、電極端子12の厚みを増やすということは、使用する材料も多くなって抵抗器のサイズの増大ならびにコストアップにつながるため、電極端子12の厚みは抵抗値の安定性と製造コストのバランスを考えて適切に設定する必要がある。   In Embodiment 1 of the present invention described above, the pair of electrode terminals 12 are bent 180 degrees by 1 downward at approximately half the length of the electrode terminals 12 to connect the lower surfaces of the electrode terminals 12 to each other. Although the thickness of the electrode terminal 12 is increased to twice the original thickness, even if the position when the resistor is mounted is shifted by the same distance, an error in the resistance value of the electrode terminal 12 is increased. Compared to the case where the thickness is not increased, the thickness can be reduced to ½. In addition, when the number of times of bending of the electrode terminal 12 is increased and the thickness of the electrode terminal 12 is increased to 3 times or 4 times the original thickness, the error of the resistance value can be reduced to 1/3 and 1/4 respectively. In this case, the effect of the present invention that the resistance value error accompanying the displacement of the mounting position is reduced becomes more prominent. However, increasing the thickness of the electrode terminal 12 leads to an increase in the size of the resistor and an increase in cost because more materials are used, so the thickness of the electrode terminal 12 balances the stability of the resistance value and the manufacturing cost. It is necessary to think and set appropriately.

(実施の形態2)
以下、実施の形態2を用いて、本発明の特に請求項3に記載の発明について説明する。
(Embodiment 2)
Hereinafter, the invention described in claim 3 of the present invention will be described with reference to the second embodiment.

図2(a)〜(c)は本発明の実施の形態2における抵抗器の製造方法の概略を示す斜視図である。   2 (a) to 2 (c) are perspective views showing an outline of a method for manufacturing a resistor in the second embodiment of the present invention.

まず、図2(a)に示すように、ニクロム、銅ニッケル、マンガニン等の導電性の良好な板状の金属に、切断加工、打ち抜き加工、プレス加工等を施すことにより、抵抗体21に用いる金属板と電極端子22に用いる金属板をそれぞれ形成し、両者21,22を溶接、圧接等の手法で一体化する。このようにして一体化された金属板の長さは1.0〜10mm、幅は0.5〜5mm、厚みは100〜1000μmとなっている。なお、ここでは、電極端子22に用いられる金属としては、銅のような比抵抗の低い金属を用いることにより、抵抗体21に用いられる金属よりも比抵抗の低いものとしている。そして前記抵抗体21と電極端子22に用いられる金属板の材料組成、長さ、幅、厚みを適宜選択することにより、所望の値の抵抗値を得ることができるものである。   First, as shown in FIG. 2A, a plate-like metal having good conductivity such as nichrome, copper nickel, manganin or the like is subjected to cutting, punching, pressing, or the like to be used for the resistor 21. A metal plate and a metal plate used for the electrode terminal 22 are respectively formed, and both 21 and 22 are integrated by a technique such as welding or pressure welding. The metal plate thus integrated has a length of 1.0 to 10 mm, a width of 0.5 to 5 mm, and a thickness of 100 to 1000 μm. Here, as the metal used for the electrode terminal 22, a metal having a low specific resistance such as copper is used so that the specific resistance is lower than that of the metal used for the resistor 21. A desired resistance value can be obtained by appropriately selecting the material composition, length, width, and thickness of the metal plate used for the resistor 21 and the electrode terminal 22.

次に、図2(b)に示すように、一対の電極端子22を電極端子22の長さのほぼ半分のところで抵抗体21の下面側に略コの字型に180度折り曲げ、そして一対の電極端子22の下面同士を溶接、圧接等の方法で接続する。   Next, as shown in FIG. 2 (b), the pair of electrode terminals 22 is bent in a substantially U-shape 180 degrees on the lower surface side of the resistor 21 at approximately half the length of the electrode terminals 22, and the pair of electrodes The lower surfaces of the electrode terminals 22 are connected by a method such as welding or pressure welding.

次に、図2(c)に示すように、抵抗体21の上面と前面および後面にエポキシ樹脂、ポリイミド樹脂等の絶縁材からなる保護膜23を形成する。なお、この保護膜23を形成する前に抵抗体21の一部に抵抗値調整用の切欠部を形成しても良く、また、この保護膜23は抵抗体21の裏面にも回り込ませて抵抗体11の全体を覆うようにしても良いものである。   Next, as shown in FIG. 2C, a protective film 23 made of an insulating material such as epoxy resin or polyimide resin is formed on the upper surface, front surface, and rear surface of the resistor 21. Note that a notch for adjusting the resistance value may be formed in a part of the resistor 21 before the protective film 23 is formed. The entire body 11 may be covered.

最後に、一対の電極端子22の底面部の下面にスズめっき(図示せず)を施し、抵抗器が実装基板に実装可能なようにする。   Finally, tin plating (not shown) is applied to the lower surface of the bottom surface of the pair of electrode terminals 22 so that the resistor can be mounted on the mounting substrate.

上記したように本発明の実施の形態2においては、金属板で構成した抵抗体21の両端部に、前記抵抗体21よりも比抵抗の低い銅のような材料で形成された一対の電極端子22を備え、前記一対の電極端子22を抵抗体21の下面側に折り曲げて一対の電極端子22の下面同士を接続しているため、接続後の電極端子22の厚みは抵抗体21の厚みのほぼ2倍となり、これにより、電極端子22と実装基板の接続部の位置がずれても、抵抗値に誤差が生じにくくなるため、抵抗値の安定化が図れるという効果を有するものである。   As described above, in the second embodiment of the present invention, a pair of electrode terminals formed of a material such as copper having a specific resistance lower than that of the resistor 21 at both ends of the resistor 21 made of a metal plate. 22, the pair of electrode terminals 22 are bent to the lower surface side of the resistor 21 and the lower surfaces of the pair of electrode terminals 22 are connected to each other. As a result, even if the position of the connection portion between the electrode terminal 22 and the mounting substrate is shifted, an error is hardly caused in the resistance value, so that the resistance value can be stabilized.

本発明に係る抵抗器は、抵抗値に誤差が生じにくく、抵抗値の安定化が図れるもので、各種電子機器の電流値検出等に使用される抵抗器においても有用となるものである。   The resistor according to the present invention is less likely to cause an error in the resistance value and can stabilize the resistance value, and is also useful in a resistor used for detecting a current value of various electronic devices.

(a)〜(c)本発明の実施の形態1における抵抗器の製造工程を示す斜視図(A)-(c) Perspective view which shows the manufacturing process of the resistor in Embodiment 1 of this invention. (a)〜(c)本発明の実施の形態2における抵抗器の製造工程を示す斜視図(A)-(c) Perspective view which shows the manufacturing process of the resistor in Embodiment 2 of this invention. 従来例を示す抵抗器の断面図Cross-sectional view of a resistor showing a conventional example 他の従来例を示す抵抗器の断面図Cross-sectional view of a resistor showing another conventional example

符号の説明Explanation of symbols

11,21 抵抗体
12,22 一対の電極端子
13,23 保護膜
11,21 Resistor 12,22 Pair of electrode terminals 13,23 Protective film

Claims (3)

金属板で構成した抵抗体と、この抵抗体の両端部に前記抵抗体と同一材料で一体的に設けられた一対の電極端子とを備え、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続した抵抗器。 A resistor composed of a metal plate; and a pair of electrode terminals integrally formed of the same material as the resistor at both ends of the resistor; the pair of electrode terminals on the lower surface side of the resistor A resistor in which the lower surfaces of a pair of electrode terminals are connected by bending. 金属板で構成した抵抗体の両端部に前記抵抗体と同一材料で一対の電極端子を一体的に形成する工程と、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続する工程とを有し、前記一対の電極端子を前記抵抗体の下面側に折り曲げる前に、前記一対の電極端子の少なくとも下面にめっき層を形成し、その後、前記一対の電極端子を前記抵抗体の下面側に折り曲げ、さらに加熱することによりめっきを介して一対の電極端子の下面同士を接続するようにした抵抗器の製造方法。 A step of integrally forming a pair of electrode terminals of the same material as the resistor at both ends of the resistor composed of a metal plate, and a pair of electrode terminals by bending the pair of electrode terminals to the lower surface side of the resistor And forming a plating layer on at least the lower surface of the pair of electrode terminals before bending the pair of electrode terminals to the lower surface side of the resistor, and then the pair of electrodes. A method of manufacturing a resistor, wherein the terminals are bent to the lower surface side of the resistor and further heated to connect the lower surfaces of the pair of electrode terminals through plating. 金属板で構成した抵抗体と、この抵抗体の両端部に設けられ、かつ前記抵抗体よりも比抵抗の低い材料で形成された一対の電極端子とを備え、前記一対の電極端子を前記抵抗体の下面側に折り曲げて一対の電極端子の下面同士を接続した抵抗器。 A resistor composed of a metal plate, and a pair of electrode terminals provided at both ends of the resistor and made of a material having a lower specific resistance than the resistor, the pair of electrode terminals being the resistor A resistor in which the lower surfaces of a pair of electrode terminals are connected by bending to the lower surface side of the body.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105590712A (en) * 2014-11-15 2016-05-18 旺诠股份有限公司 Manufacturing method of micro-impedance resistor and the micro-impedance resistor
US9966170B2 (en) 2016-03-18 2018-05-08 Rohm Co., Ltd. Shunt resistor

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03179681A (en) * 1989-12-08 1991-08-05 Kenwood Corp Structure of chip jumper
JPH0418219Y2 (en) * 1986-07-31 1992-04-23
JPH06267707A (en) * 1993-03-10 1994-09-22 Koa Corp Current detecting resistor and manufacture thereof
JPH09213503A (en) * 1996-02-06 1997-08-15 Taisei Koki Kk Resistor and manufacturing method thereof
WO1999018584A1 (en) * 1997-10-02 1999-04-15 Matsushita Electric Industrial Co., Ltd. Resistor and method for manufacturing the same
JP2000068102A (en) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd Resistor
JP2001291601A (en) * 2000-04-04 2001-10-19 Koa Corp Low-value resistor
JP2004128000A (en) * 2002-09-30 2004-04-22 Koa Corp Metal plate resistor and its manufacturing method
JP2006228978A (en) * 2005-02-17 2006-08-31 Rohm Co Ltd Low resistance chip resistor and its production process
JP2006228979A (en) * 2005-02-17 2006-08-31 Rohm Co Ltd Low resistance chip resistor and its production process

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0418219Y2 (en) * 1986-07-31 1992-04-23
JPH03179681A (en) * 1989-12-08 1991-08-05 Kenwood Corp Structure of chip jumper
JPH06267707A (en) * 1993-03-10 1994-09-22 Koa Corp Current detecting resistor and manufacture thereof
JPH09213503A (en) * 1996-02-06 1997-08-15 Taisei Koki Kk Resistor and manufacturing method thereof
WO1999018584A1 (en) * 1997-10-02 1999-04-15 Matsushita Electric Industrial Co., Ltd. Resistor and method for manufacturing the same
JP2000068102A (en) * 1998-08-25 2000-03-03 Matsushita Electric Ind Co Ltd Resistor
JP2001291601A (en) * 2000-04-04 2001-10-19 Koa Corp Low-value resistor
JP2004128000A (en) * 2002-09-30 2004-04-22 Koa Corp Metal plate resistor and its manufacturing method
JP2006228978A (en) * 2005-02-17 2006-08-31 Rohm Co Ltd Low resistance chip resistor and its production process
JP2006228979A (en) * 2005-02-17 2006-08-31 Rohm Co Ltd Low resistance chip resistor and its production process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105590712A (en) * 2014-11-15 2016-05-18 旺诠股份有限公司 Manufacturing method of micro-impedance resistor and the micro-impedance resistor
US9966170B2 (en) 2016-03-18 2018-05-08 Rohm Co., Ltd. Shunt resistor

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