JP2001176701A - Resistor and manufacturing method therefor - Google Patents
Resistor and manufacturing method thereforInfo
- Publication number
- JP2001176701A JP2001176701A JP35923299A JP35923299A JP2001176701A JP 2001176701 A JP2001176701 A JP 2001176701A JP 35923299 A JP35923299 A JP 35923299A JP 35923299 A JP35923299 A JP 35923299A JP 2001176701 A JP2001176701 A JP 2001176701A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resistance element
- electrode
- manufacturing
- element portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、表面実装用の小型
抵抗器、いわゆるチップ抵抗器に関するものであって、
特に、極低い抵抗値に設定される抵抗器に関する。The present invention relates to a small resistor for surface mounting, a so-called chip resistor,
In particular, it relates to a resistor set to an extremely low resistance value.
【０００２】[0002]
【従来の技術】従来より、チップ抵抗器は、その抵抗値
を低く設定するにあたって極薄いＮｉ−Ｃｕ等の金属抵
抗板を抵抗素子本体として用いており、図６（イ）の如
く抵抗素子本体の両端部を折り曲げたり、図６（ロ）
（ハ）の如く端子部を別途溶着する等して電極を形成し
ている。2. Description of the Related Art Conventionally, a chip resistor uses an extremely thin metal resistor plate of Ni-Cu or the like as a resistor element main body when setting the resistance value to be low, and as shown in FIG. Bend the both ends of Fig. 6 (b)
As shown in (c), the electrodes are formed by separately welding the terminal portions.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前者で
は端子部を形成する際に折り曲げる位置のばらつきによ
って、電極部と抵抗素子部の割合が変動し高い精度の抵
抗値を得ることができない他、後者にあっては、溶接部
の位置変動或いは面積変動によって電極部と抵抗素子部
の割合が変動し、この場合も高い精度の抵抗値を得るこ
とができない。殊に、前者の場合は、実装時における半
田ののり具合によっても抵抗値が微妙に影響を受けるこ
とが多く、後者においても、溶着する端子部が異種金属
である場合には、抵抗値の温度特性が悪化するという問
題がある。However, in the former case, the ratio of the electrode portion to the resistance element portion fluctuates due to variations in the bending position when forming the terminal portion, so that a highly accurate resistance value cannot be obtained. In this case, the ratio between the electrode portion and the resistance element portion fluctuates due to the position fluctuation or the area fluctuation of the welded portion, and in this case also, a highly accurate resistance value cannot be obtained. In particular, in the former case, the resistance value is often slightly affected by the degree of soldering at the time of mounting, and also in the latter case, when the terminal to be welded is made of a dissimilar metal, the resistance value becomes lower. There is a problem that characteristics are deteriorated.
【０００４】本発明は、上記実情に鑑みて成されたもの
であって、製造過程や実装過程において生じ得る抵抗値
のばらつきはもとより、実働時における温度特性の悪化
をも防止し得る抵抗器とその製造方法の提供を目的とす
る。[0004] The present invention has been made in view of the above-mentioned circumstances, and provides a resistor capable of preventing deterioration in temperature characteristics in actual operation as well as variation in resistance that may occur during a manufacturing process or a mounting process. It is intended to provide a manufacturing method thereof.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に成された本発明による抵抗器は、同一素材から成る電
極部及び抵抗素子部を一連成形して成る導体基板と、当
該導体基板の抵抗素子部を覆う絶縁被膜を具備した抵抗
器であって、前記抵抗素子部が導体基板の中央部を薄肉
化して形成されたことを特徴とする。A resistor according to the present invention, which has been made to solve the above-mentioned problems, comprises a conductor substrate formed by forming a series of electrodes and a resistor element portion made of the same material, A resistor provided with an insulating coating covering the resistance element portion, wherein the resistance element portion is formed by thinning a central portion of a conductive substrate.
【０００６】前記電極部は、例えば回路基板へ実装する
際に、当該回路基板の接続端子と半田付けされる部分で
あり、抵抗素子部は、当該抵抗器の定数を決定する部分
である。この様に定数を決定すべく薄肉化する際の具体
的な態様について特に限定する必要はないが、断面形状
を一定にしておく方が計算上都合が良い。尚、絶縁コー
トは抵抗素子部全体を覆ってさえいればよく、実装時に
おいて半田付けが成される面積に影響が出ない限り電極
部の一部を覆っていても良い。The electrode portion is a portion that is soldered to a connection terminal of the circuit board when, for example, the device is mounted on a circuit board, and the resistance element portion is a portion that determines a constant of the resistor. It is not necessary to particularly limit the specific mode when the thickness is reduced in order to determine the constant in this way, but it is more convenient for calculation to keep the cross-sectional shape constant. Note that the insulating coat only needs to cover the entire resistance element portion, and may cover a part of the electrode portion as long as the area to be soldered during mounting is not affected.
【０００７】上記抵抗器の製造方法は、導体基板の中央
部にエッチングを施し広断面の電極部と狭断面の抵抗素
子部を形成する機能分割工程と、前記抵抗素子部を部分
的に削って当該抵抗素子部の電極部間抵抗値を調整する
トリミング工程と、当該抵抗素子部の表面に絶縁被膜を
被着するオーバーコート工程と、抵抗器一単位毎に分割
する分離工程を経ることを特徴とする。The method of manufacturing the resistor includes a function dividing step of etching a central portion of the conductive substrate to form an electrode portion having a wide cross section and a resistor element portion having a narrow cross section, and partially removing the resistor element portion. It is characterized by passing through a trimming step of adjusting the resistance value between the electrode parts of the resistance element part, an overcoating step of applying an insulating film on the surface of the resistance element part, and a separation step of dividing the resistor into one unit. And
【０００８】上記抵抗器の製造方法において挙げられて
いる工程は、必要に応じて複数回行っても良く、洗浄そ
の他の別工程を適宜介在しても良い。上記製造工程に加
えて、前記電極部の表面に、Ｓｎ−Ａｇ、Ａｕ又はＣｕ
の薄膜を形成するメッキ工程を経ることが望ましい。
尚、前記広断面及び狭断面とは、抵抗器の両電極部を結
ぶ方向に対して直角に分断した場合の断面積（以下、同
じ。）を比較したもので、電極部が抵抗素子部よりも断
面積が十分に大きいことを示すものである。The steps mentioned in the method of manufacturing the resistor may be performed a plurality of times, if necessary, and may include washing and other steps as appropriate. In addition to the above manufacturing steps, Sn-Ag, Au or Cu
It is desirable to go through a plating step of forming a thin film of the above.
The wide cross section and the narrow cross section are comparisons of cross sectional areas (hereinafter the same) when the electrode is divided at right angles to a direction connecting both electrode portions of the resistor. Also indicates that the cross-sectional area is sufficiently large.
【０００９】[0009]
【発明の実施の形態】以下、本発明による抵抗器の実施
の形態を、当該抵抗器の製造方法と共に説明する。図１
は、電極部１及び抵抗素子部２を一連成形して成るＮｉ
−Ｃｕ系合金製の均等厚な導体基板３と、当該導体基板
３の抵抗素子部２を覆う高耐熱性エポキシ樹脂から成る
絶縁被膜４を具備した抵抗器であって、前記抵抗素子部
２が前記導体基板３の片面中央部の長方形領域を一定厚
に薄肉化して形成されたものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a resistor according to the present invention will be described below together with a method for manufacturing the resistor. FIG.
Is a Ni formed by forming the electrode portion 1 and the resistance element portion 2 in series.
A resistor comprising: a conductive substrate 3 made of a Cu-based alloy having a uniform thickness; and an insulating film 4 made of a high heat-resistant epoxy resin covering the resistive element portion 2 of the conductive substrate 3. It is formed by thinning a rectangular region at the center of one surface of the conductor substrate 3 to a certain thickness.
【００１０】＜機能分割工程＞この抵抗器を得るに際し
て、Ｎｉ−Ｃｕ系合金の平板を一定の幅で分断して成る
短冊６に対し、表面には、その長手方向に向かって直線
的な境界を持ち且つ一定の幅に定められた長方形のレジ
スト膜７を一定の間隔で印刷し、更に、裏面全域にレジ
スト膜８を印刷した状態でエッチング処理を行い、洗浄
工程を経てレジスト膜７，８の剥離を行うと、レジスト
膜７，８が形成されることなく露出していた部分９が浸
食されいわゆる狭断面の抵抗素子部２が形成される（図
３参照）。抵抗素子部２の境界は、前記レジスト膜７の
直線的な境界が反映されて直線的となっており、浸食さ
れた深さ、即ち残存する厚みもほぼ一定となっている。
これらの工程により一つの短冊６のなかで抵抗素子部２
と電極部３とに機能が分割されることとなる。<Functional Separation Step> In obtaining this resistor, a strip 6 formed by dividing a flat plate of a Ni—Cu alloy at a certain width has a linear boundary on its surface in the longitudinal direction. A rectangular resist film 7 having a predetermined width and a predetermined width is printed at a constant interval, and further, an etching process is performed in a state where the resist film 8 is printed on the entire rear surface, and the resist films 7 and 8 are subjected to a cleaning process. When the resist is stripped, the exposed portions 9 are eroded without forming the resist films 7 and 8 to form the resistance element portion 2 having a so-called narrow cross section (see FIG. 3). The boundary of the resistive element portion 2 is linear, reflecting the linear boundary of the resist film 7, and the eroded depth, that is, the remaining thickness is substantially constant.
By these steps, the resistance element portion 2 in one strip 6 is formed.
The function is divided into the function and the electrode section 3.
【００１１】尚、エッチング工程は、複数の工程に分け
て、例えば図５の如く一次浸食部１０と二次浸食部１１
を設けても良いし、作業の流れにあっても、図４の如く
Ｎｉ−Ｃｕ系合金の平板１２に対して同様の工程を経て
エッチング処理を行い、洗浄工程を経てレジスト膜７，
８の剥離を行った後に、一定幅の短冊６に分断するとい
う工程を採っても良い。The etching step is divided into a plurality of steps, for example, as shown in FIG.
Also, even in the work flow, as shown in FIG. 4, an etching process is performed on the Ni—Cu-based alloy flat plate 12 through the same process, and a cleaning process is performed.
After the peeling of the strip 8, a step of dividing the strip into strips 6 having a fixed width may be adopted.
【００１２】＜トリミング工程＞機能分割がおこなわれ
た短冊６は、抵抗素子部２に対する抵抗値調整が行われ
る。当該抵抗値の調整は、例えば、一つの抵抗素子部２
の両端に存在する電極部１，１間の抵抗値を測定し、所
定の抵抗値となる様にレーザー光等で抵抗素子部２を部
分的に削ることによって行われる。<Trimming Step> The strip 6 on which the function division has been performed is subjected to resistance adjustment of the resistance element portion 2. The adjustment of the resistance value is performed, for example, by using one resistance element unit 2.
The resistance is measured by measuring the resistance value between the electrode portions 1 and 1 existing at both ends of the resistor element 2 and partially cutting the resistance element portion 2 with a laser beam or the like so as to have a predetermined resistance value.
【００１３】＜オーバーコート工程＞トリミング工程を
終えた各抵抗素子部２の表裏側面に対して、高耐熱性エ
ポキシ樹脂によるコーティングが行われる。当該コーテ
ィング工程で形成される絶縁被膜４により各抵抗素子部
２の対外絶縁性が確保できることとなる。尚、絶縁被膜
４の厚みは、前記エッチング工程によって浸食された深
さよりも薄いことが、実装時における抵抗器５の電極部
１と回路基板１３の端子との間に介在する半田を節約
し、当該抵抗器５の温度特性を高める上で大切である。<Overcoat Process> The front and back side surfaces of each resistance element portion 2 after the trimming process are coated with a highly heat-resistant epoxy resin. By the insulating coating 4 formed in the coating step, the external insulation of each resistance element portion 2 can be secured. Note that the thickness of the insulating film 4 is smaller than the depth eroded by the etching step, so that the solder interposed between the electrode portion 1 of the resistor 5 and the terminal of the circuit board 13 at the time of mounting can be saved, This is important in improving the temperature characteristics of the resistor 5.
【００１４】＜分割工程＞上記短冊６を抵抗器５一単位
毎に分割することによって個々が抵抗器としての機能を
果たし得るものとなり、最後に実装工程の便宜を図るべ
く電極部１に対し薄い半田メッキ（例えば、Ｓｎ−Ａｇ
等抵抗値の低い材料。金、銅メッキでも良い。）を行う
ことによって製品となる。<Dividing Step> By dividing the strip 6 into one unit of the resistor 5, each of the strips 6 can function as a resistor. Finally, the electrode section 1 is thinner for the convenience of the mounting step. Solder plating (for example, Sn-Ag
Materials with low resistance. Gold or copper plating may be used. ) To become a product.
【００１５】上記の如く製造された抵抗器は、電極部１
と抵抗素子部２とが一連で同素材を以て形成されている
ことにより温度特性の悪化を防止することができる。
又、抵抗素子部２を形成する手段が、レジスト膜を形成
してのエッチング処理という比較的精密な処理を以て行
われる為に、製造過程における抵抗値のばらつきをも防
止することができる。The resistor manufactured as described above has an electrode portion 1
The temperature characteristics can be prevented from being deteriorated by forming the resistor element portion 2 and the resistor element portion 2 in series using the same material.
In addition, since the means for forming the resistance element portion 2 is performed by a relatively precise process of etching after forming a resist film, it is possible to prevent variations in the resistance value during the manufacturing process.
【００１６】更に、電極部１と抵抗素子部２の肉厚差
が、絶縁被膜４の厚み以上設けてあれば、抵抗素子部２
の抵抗率が電極部１の抵抗率と比べて格段に大きいもの
となるので、実装時における電極部１への半田ののりに
応じて抵抗器の定数が変化するといった問題もなくな
る。その上、図２の如く電極部１の端子（回路基板の実
装用端子）に対する接触面が絶縁被膜４の表面よりも突
出するように成形してあれば、抵抗器の電極部１と回路
基板１３の実装用端子１４，１４間に介在すべき半田の
量が少なくて済み、半田接合部における温度特性の悪化
を防止することができる。Furthermore, if the thickness difference between the electrode portion 1 and the resistance element portion 2 is greater than the thickness of the insulating film 4, the resistance element portion 2
Is much higher than the resistivity of the electrode portion 1, and therefore, there is no problem that the constant of the resistor changes according to the soldering to the electrode portion 1 during mounting. In addition, as shown in FIG. 2, if the contact surface of the electrode portion 1 with the terminal (terminal for mounting the circuit board) is formed so as to protrude from the surface of the insulating coating 4, the electrode portion 1 of the resistor and the circuit board The amount of solder to be interposed between the thirteen mounting terminals 14 and 14 can be reduced, and the deterioration of the temperature characteristics at the solder joint can be prevented.
【００１７】[0017]
【発明の効果】以上の如く本発明による抵抗器を使用す
れば、製造過程や実装過程において生じる抵抗値のばら
つきはもとより、実働時における温度特性の悪化をも防
止でき、強度的にも優れた特性を奏する事となり、電子
機器の信頼性向上に寄与する事となる。又、本発明によ
る製造方法を採れば、極めて簡単で能率的に上記抵抗器
を製造できることとなり、更に、前記電極部の表面に、
Ｓｎ−Ａｇ、Ａｕ又はＣｕの薄膜を形成するメッキ工程
を経ることとなれば、実装時における半田濡れ性が向上
し、電極抵抗値を下げる事とも成るので、より信頼性の
高い電子機器の普及に寄与することとなる。As described above, when the resistor according to the present invention is used, not only the variation in the resistance value caused in the manufacturing process and the mounting process but also the deterioration of the temperature characteristic in the actual operation can be prevented and the strength is excellent. The characteristics are exhibited, and the reliability of the electronic device is improved. Further, if the manufacturing method according to the present invention is adopted, the resistor can be manufactured very simply and efficiently, and further, the surface of the electrode portion has
If a plating step of forming a thin film of Sn-Ag, Au or Cu is performed, solder wettability at the time of mounting is improved and an electrode resistance value is reduced, so that more reliable electronic devices are spread. Will be contributed to.
【図１】本発明による抵抗器の一例を示す断面図であ
る。FIG. 1 is a sectional view showing an example of a resistor according to the present invention.
【図２】図１に示す抵抗器の実装状態の一例を示す側面
図である。FIG. 2 is a side view showing an example of a mounting state of the resistor shown in FIG.
【図３】本発明による抵抗器の製造方法の一例を示す工
程図である。FIG. 3 is a process chart showing an example of a method for manufacturing a resistor according to the present invention.
【図４】本発明による抵抗器の製造方法の一例を示す工
程図である。FIG. 4 is a process chart showing an example of a method for manufacturing a resistor according to the present invention.
【図５】エッチング後の導体基板の一態様を示す斜視図
である。FIG. 5 is a perspective view showing one embodiment of a conductor substrate after etching.
【図６】（イ）（ロ）（ハ）従来の抵抗器の例を示す断
面図である。6 (a), (b) and (c) are cross-sectional views showing examples of a conventional resistor.
１ 電極部，２ 抵抗素子部 ３ 導体基板，４ 絶縁被膜 ５ 抵抗器 DESCRIPTION OF SYMBOLS 1 Electrode part, 2 Resistance element part 3 Conductor board, 4 Insulating coating 5 Resistor
Claims (3)
素子部（２）を一連成形して成る導体基板（３）と、当
該導体基板（３）の抵抗素子部（２）を覆う絶縁被膜
（４）を具備した抵抗器であって、前記抵抗素子部
（２）が導体基板（３）の中央部を薄肉化して形成され
た抵抗器。1. A conductor substrate (3) formed by forming an electrode part (1) and a resistance element part (2) made of the same material in series, and an insulation covering the resistance element part (2) of the conductor substrate (3). A resistor provided with a coating (4), wherein the resistor element portion (2) is formed by thinning a central portion of a conductive substrate (3).
施し広断面の電極部（１）と狭断面の抵抗素子部（２）
を形成する機能分割工程と、前記抵抗素子部（２）を部
分的に削って当該抵抗素子部（２）の電極部（１，１）
間抵抗値を調整するトリミング工程と、当該抵抗素子部
（２）の表面に絶縁被膜（４）を被着するオーバーコー
ト工程と、抵抗器（５）一単位毎に分割する分離工程を
経る抵抗器の製造方法。2. A central portion of a conductive substrate (3) is etched to form a wide section electrode section (1) and a narrow section resistance element section (2).
And a function division step of forming an electrode portion (1, 1) of the resistance element portion (2) by partially shaving the resistance element portion (2).
A resistor that goes through a trimming step of adjusting an inter-resistance value, an overcoating step of applying an insulating film (4) on the surface of the resistance element portion (2), and a separation step of dividing the resistor (5) into units. Method of manufacturing the vessel.
又はＣｕの薄膜を形成するメッキ工程を経る前記請求項
２に記載の抵抗器の製造方法。3. An Sn—Ag, Au coating on a surface of the electrode unit.
3. The method for manufacturing a resistor according to claim 2, further comprising a plating step of forming a Cu thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35923299A JP2001176701A (en) | 1999-12-17 | 1999-12-17 | Resistor and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35923299A JP2001176701A (en) | 1999-12-17 | 1999-12-17 | Resistor and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001176701A true JP2001176701A (en) | 2001-06-29 |
Family
ID=18463445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35923299A Pending JP2001176701A (en) | 1999-12-17 | 1999-12-17 | Resistor and manufacturing method therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001176701A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001774A1 (en) * | 2002-06-19 | 2003-12-31 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| JP2006013002A (en) * | 2004-06-23 | 2006-01-12 | Rohm Co Ltd | Chip resistor having low resistance and manufacturing method therefor |
| US7327214B2 (en) | 2003-04-28 | 2008-02-05 | Rohm Co., Ltd. | Chip resistor and method of making the same |
| US7378937B2 (en) | 2003-04-28 | 2008-05-27 | Rohm Co., Ltd. | Chip resistor and method of making the same |
| JP2012502468A (en) * | 2008-09-05 | 2012-01-26 | ヴィシェイ デール エレクトロニクス インコーポレイテッド | Metal strip resistor and manufacturing method thereof |
| JP2013055130A (en) * | 2011-09-01 | 2013-03-21 | Rohm Co Ltd | Jumper resistor |
-
1999
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004001774A1 (en) * | 2002-06-19 | 2003-12-31 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| US7221254B2 (en) | 2002-06-19 | 2007-05-22 | Rohm Co., Ltd. | Chip resistor having low resistance and method of making the same |
| US7327214B2 (en) | 2003-04-28 | 2008-02-05 | Rohm Co., Ltd. | Chip resistor and method of making the same |
| US7378937B2 (en) | 2003-04-28 | 2008-05-27 | Rohm Co., Ltd. | Chip resistor and method of making the same |
| JP2006013002A (en) * | 2004-06-23 | 2006-01-12 | Rohm Co Ltd | Chip resistor having low resistance and manufacturing method therefor |
| JP4526117B2 (en) * | 2004-06-23 | 2010-08-18 | ローム株式会社 | Chip resistor having low resistance value and manufacturing method thereof |
| JP2012502468A (en) * | 2008-09-05 | 2012-01-26 | ヴィシェイ デール エレクトロニクス インコーポレイテッド | Metal strip resistor and manufacturing method thereof |
| JP2013055130A (en) * | 2011-09-01 | 2013-03-21 | Rohm Co Ltd | Jumper resistor |
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