JP2007115955A5 - - Google Patents
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- Publication number
- JP2007115955A5 JP2007115955A5 JP2005306930A JP2005306930A JP2007115955A5 JP 2007115955 A5 JP2007115955 A5 JP 2007115955A5 JP 2005306930 A JP2005306930 A JP 2005306930A JP 2005306930 A JP2005306930 A JP 2005306930A JP 2007115955 A5 JP2007115955 A5 JP 2007115955A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- connection
- bump
- forming
- counted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 33
- 239000002344 surface layer Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- 238000007731 hot pressing Methods 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 4
- 230000000149 penetrating Effects 0.000 claims 4
- 239000000835 fiber Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000035515 penetration Effects 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005306930A JP4892924B2 (ja) | 2005-10-21 | 2005-10-21 | 多層プリント配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005306930A JP4892924B2 (ja) | 2005-10-21 | 2005-10-21 | 多層プリント配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007115955A JP2007115955A (ja) | 2007-05-10 |
| JP2007115955A5 true JP2007115955A5 (zh) | 2008-11-27 |
| JP4892924B2 JP4892924B2 (ja) | 2012-03-07 |
Family
ID=38097868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005306930A Expired - Fee Related JP4892924B2 (ja) | 2005-10-21 | 2005-10-21 | 多層プリント配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4892924B2 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4825286B2 (ja) * | 2009-08-07 | 2011-11-30 | ナミックス株式会社 | 多層配線板の製造方法 |
| US20240178124A1 (en) * | 2022-11-30 | 2024-05-30 | Compass Technology Company Limited | Embedded Die Package |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0719939B2 (ja) * | 1988-09-19 | 1995-03-06 | 三井東圧化学株式会社 | フレキシブル両面金属箔積層板 |
| JPH02109390A (ja) * | 1988-10-18 | 1990-04-23 | Furukawa Electric Co Ltd:The | 高密度フレキシブルプリント回路基板 |
| JP2787228B2 (ja) * | 1989-07-26 | 1998-08-13 | 日本メクトロン株式会社 | 可撓性回路基板の製造法 |
| JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
| JP3892209B2 (ja) * | 2000-06-22 | 2007-03-14 | 大日本印刷株式会社 | プリント配線板およびその製造方法 |
| JP2003017856A (ja) * | 2001-06-29 | 2003-01-17 | Kyocera Chemical Corp | 多層プリント配線板及びその製造方法 |
-
2005
- 2005-10-21 JP JP2005306930A patent/JP4892924B2/ja not_active Expired - Fee Related
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