JP2007035911A - ボンディングパッドの製造方法、ボンディングパッド、及び電子デバイスの製造方法、電子デバイス - Google Patents
ボンディングパッドの製造方法、ボンディングパッド、及び電子デバイスの製造方法、電子デバイス Download PDFInfo
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- JP2007035911A JP2007035911A JP2005216881A JP2005216881A JP2007035911A JP 2007035911 A JP2007035911 A JP 2007035911A JP 2005216881 A JP2005216881 A JP 2005216881A JP 2005216881 A JP2005216881 A JP 2005216881A JP 2007035911 A JP2007035911 A JP 2007035911A
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Abstract
【解決手段】 ボンディングパッド45の製造方法は、基体P上に液滴吐出法により導電性材料を含む液からなる液滴Lを配置する工程と、液滴Lを固化させてパッドを形成する工程と、を備えている。形成されたボンディングパッド45は、円柱状であり、凹状の凹部47を有している。
【選択図】 図3
Description
<基体>
<液滴吐出法>
<液滴吐出装置>
液滴吐出装置IJは、液滴吐出ヘッド1と、X軸方向駆動軸4と、Y軸方向ガイド軸5と、制御装置CONTと、ステージ7と、クリーニング機構8と、基台9と、ヒータ15とを備えている。
ステージ7は、この液滴吐出装置IJにより液体材料を配置される基体としての基板Pを支持するものであって、基板Pを基準位置に固定する不図示の固定機構を備えている。
1はX軸方向に移動する。
Y軸方向ガイド軸5は、基台9に対して動かないように固定されている。ステージ7は、Y軸方向駆動モータ3を備えている。Y軸方向駆動モータ3はステッピングモータ等であり、制御装置CONTからY軸方向の駆動信号が供給されると、ステージ7をY軸方向に移動する。
クリーニング機構8は、液滴吐出ヘッド1をクリーニングするものである。クリーニング機構8には、図示しないY軸方向の駆動モータが備えられている。このY軸方向の駆動モータの駆動により、クリーニング機構8は、Y軸方向ガイド軸5に沿って移動する。クリーニング機構8の移動も制御装置CONTにより制御される。
ヒータ15は、ここではランプアニールにより基板Pを熱処理する手段であり、基板P上に配置された液体材料に含まれる溶媒の蒸発、乾燥を行う。このヒータ15の電源の投入及び遮断も制御装置CONTにより制御される。
図2において、液体材料を収容する液体室21に隣接してピエゾ素子22が設置されている。液体室21には、液体材料を収容する材料タンクを含む液体材料供給系23を介して液体材料が供給される。ピエゾ素子22は駆動回路24に接続されており、この駆動回路24を介してピエゾ素子22に電圧を印加して、ピエゾ素子22を変形させることにより、液体室21が変形する。液体室21が元の状態に復元するときに、吐出ノズル25から液体材料が吐出される。この場合、印加電圧の値を変化させることにより、ピエゾ素子22の歪み量が制御される。また、印加電圧の周波数を変化させることにより、ピエゾ素子22の歪み速度が制御される。ピエゾ方式による液滴吐出は液体材料に熱を加えないため、液体材料の組成に影響を与えにくいという利点を有する。
<表面処理方法>
<ボンディングパッド材料>
<ボンディングパッドの製造方法>
(基板洗浄工程)
(基板表面処理工程)
(材料配置工程)
(乾燥工程)
(硬化処理工程)
<電子デバイス>
(2)ボンディングパッド45が円柱状であるから、矩形状と比べると、円の直径と矩形状の一辺の長さが同じであれば、円の方が矩形状よりも面積が少なくなるので、ボンディングパッド45を形成するための材料も少なくできるので、材料の節約ができる。
(3)ボンディングパッド45を凹状に形成すると、ボンディングワイヤ46がボンディングパッド45の凹部47に安定して配置されることになる。そして、ボンディングワイヤ46をボンディングするときの力の加わり方が均一になりやすくなるので、ボンディングワイヤ46がボンディングパッド45へきちんと接続できる。したがって、ボンディング作業が容易になり、生産性が向上する。
(4)液滴吐出法によりボンディングパッド45を形成するから、製造方法が簡単なボンディングパッド45を提供できる。ボンディングパッド45を簡単に形成できる製造方法だから、電子デバイス50の生産性が向上する。
Claims (8)
- 基体上にパッドを形成するボンディングパッドの製造方法であって、
前記基体上に液滴吐出法により導電性材料を含む液からなる液滴を配置する工程と、
前記液滴を固化させて前記パッドを形成する工程と、
を備えていることを特徴とするボンディングパッドの製造方法。 - 請求項1に記載のボンディングパッドの製造方法において、
前記パッドを形成する工程では、
前記パッドを、円柱状に形成することを特徴とするボンディングパッドの製造方法。 - 請求項1または請求項2に記載のボンディングパッドの製造方法において、
前記パッドを形成する工程では、
前記パッドを凹状に形成することを特徴とするボンディングパッドの製造方法。 - 基体上に形成されるボンディングパッドであって、
前記基体上に液滴吐出法により導電性材料を含む液からなる液滴を配置させて、前記液滴を固化させて形成されたパッドを備えていることを特徴とするボンディングパッド。 - 請求項4に記載のボンディングパッドにおいて、
前記パッドが、円柱状に形成されていることを特徴とするボンディングパッド。 - 請求項4または請求項5に記載のボンディングパッドにおいて、
前記パッドが、凹状に形成されていることを特徴とするボンディングパッド。 - 基体と、
前記基体上に配設された電極を有する素子と、を備えた電子デバイスの製造方法であって、
前記基体上に液滴吐出法により導電性材料を含む液からなる液滴を配置させ、前記液滴を固化させてボンディングパッドを形成する工程と、
前記電極と前記ボンディングパッドとをワイヤで接続する接続工程と、
を備えていることを特徴とする電子デバイスの製造方法。 - 基体と、
前記基体上に配設された電極を有する素子と、を備えた電子デバイスにおいて、
前記基体上に液滴吐出法により導電性材料を含む液からなる液滴を配置させ、前記液滴を固化させることにより形成されたボンディングパッドと、
前記電極と前記ボンディングパッドとを接続するワイヤと、
を備えていることを特徴とする電子デバイス。
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JP2005216881A JP2007035911A (ja) | 2005-07-27 | 2005-07-27 | ボンディングパッドの製造方法、ボンディングパッド、及び電子デバイスの製造方法、電子デバイス |
US11/457,505 US7754597B2 (en) | 2005-07-27 | 2006-07-14 | Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device |
TW095127010A TW200741914A (en) | 2005-07-27 | 2006-07-24 | Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device |
KR1020060069582A KR100845505B1 (ko) | 2005-07-27 | 2006-07-25 | 본딩 패드의 제조 방법, 본딩 패드, 전자 디바이스의 제조방법, 및 전자 디바이스 |
CNB2006101086077A CN100447974C (zh) | 2005-07-27 | 2006-07-25 | 接合焊盘及其制造方法、电子设备及其制造方法 |
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JP2016178201A (ja) * | 2015-03-20 | 2016-10-06 | コミッサリア ア レネルジー アトミーク エ オ エナジーズ アルタナティブス | キャビティを備えた端部を含む、電子構成要素のための導電性部材の製造方法 |
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US8704379B2 (en) | 2007-09-10 | 2014-04-22 | Invensas Corporation | Semiconductor die mount by conformal die coating |
WO2009051847A1 (en) * | 2007-10-19 | 2009-04-23 | Calin Caluser | Three dimensional mapping display system for diagnostic ultrasound machines and method |
CN101999167B (zh) | 2008-03-12 | 2013-07-17 | 伊文萨思公司 | 支撑安装的电互连管芯组件 |
US9153517B2 (en) | 2008-05-20 | 2015-10-06 | Invensas Corporation | Electrical connector between die pad and z-interconnect for stacked die assemblies |
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- 2006-07-25 CN CNB2006101086077A patent/CN100447974C/zh not_active Expired - Fee Related
- 2006-07-25 KR KR1020060069582A patent/KR100845505B1/ko not_active IP Right Cessation
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JP2016178201A (ja) * | 2015-03-20 | 2016-10-06 | コミッサリア ア レネルジー アトミーク エ オ エナジーズ アルタナティブス | キャビティを備えた端部を含む、電子構成要素のための導電性部材の製造方法 |
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CN100447974C (zh) | 2008-12-31 |
CN1905148A (zh) | 2007-01-31 |
KR100845505B1 (ko) | 2008-07-10 |
US20070023900A1 (en) | 2007-02-01 |
KR20070014042A (ko) | 2007-01-31 |
US7754597B2 (en) | 2010-07-13 |
TW200741914A (en) | 2007-11-01 |
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