JP2007013121A5 - - Google Patents
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- Publication number
- JP2007013121A5 JP2007013121A5 JP2006147676A JP2006147676A JP2007013121A5 JP 2007013121 A5 JP2007013121 A5 JP 2007013121A5 JP 2006147676 A JP2006147676 A JP 2006147676A JP 2006147676 A JP2006147676 A JP 2006147676A JP 2007013121 A5 JP2007013121 A5 JP 2007013121A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- transistor
- temperature
- manufacturing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 17
- 239000011347 resin Substances 0.000 claims 17
- 238000004519 manufacturing process Methods 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 14
- 239000010408 film Substances 0.000 claims 13
- 238000010438 heat treatment Methods 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 2
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 229920002803 Thermoplastic polyurethane Polymers 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 230000001678 irradiating Effects 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- XTXRWKRVRITETP-UHFFFAOYSA-N vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006147676A JP5057700B2 (ja) | 2005-05-31 | 2006-05-29 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005160729 | 2005-05-31 | ||
JP2005160729 | 2005-05-31 | ||
JP2006147676A JP5057700B2 (ja) | 2005-05-31 | 2006-05-29 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007013121A JP2007013121A (ja) | 2007-01-18 |
JP2007013121A5 true JP2007013121A5 (zh) | 2009-07-09 |
JP5057700B2 JP5057700B2 (ja) | 2012-10-24 |
Family
ID=37751150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006147676A Expired - Fee Related JP5057700B2 (ja) | 2005-05-31 | 2006-05-29 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5057700B2 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1970951A3 (en) * | 2007-03-13 | 2009-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US8021960B2 (en) * | 2009-10-06 | 2011-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126733A (ja) * | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | 薄膜デバイスの転写方法、薄膜デバイス、薄膜集積回路装置,アクティブマトリクス基板、液晶表示装置および電子機器 |
JP4027740B2 (ja) * | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2003142666A (ja) * | 2001-07-24 | 2003-05-16 | Seiko Epson Corp | 素子の転写方法、素子の製造方法、集積回路、回路基板、電気光学装置、icカード、及び電子機器 |
-
2006
- 2006-05-29 JP JP2006147676A patent/JP5057700B2/ja not_active Expired - Fee Related
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