JP2007012737A - ウェハ搬送装置 - Google Patents
ウェハ搬送装置 Download PDFInfo
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- JP2007012737A JP2007012737A JP2005189315A JP2005189315A JP2007012737A JP 2007012737 A JP2007012737 A JP 2007012737A JP 2005189315 A JP2005189315 A JP 2005189315A JP 2005189315 A JP2005189315 A JP 2005189315A JP 2007012737 A JP2007012737 A JP 2007012737A
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- wafer
- suction pad
- bending strength
- suction
- transfer device
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- Granted
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- 238000012546 transfer Methods 0.000 title claims abstract description 101
- 230000003746 surface roughness Effects 0.000 claims abstract description 26
- 239000011148 porous material Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims description 45
- 238000004140 cleaning Methods 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 230000015556 catabolic process Effects 0.000 abstract 2
- 238000006731 degradation reaction Methods 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 241
- 238000005452 bending Methods 0.000 description 58
- 230000007423 decrease Effects 0.000 description 12
- 230000007246 mechanism Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 230000032258 transport Effects 0.000 description 5
- 230000003313 weakening effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- Manipulator (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】ウェハ搬送装置は,ウェハを吸着部により真空吸着して搬送する装置であり,吸着部は,アルミナを主成分とした材料から形成され,気孔率が34〜40%である。吸着部の表面における気孔以外の部分の表面粗さRyは,5μm以下であることを特徴とする。これにより,吸着部のウェハとの接触面における凹凸の高低差が小さくなるため,ウェハに与えるダメージを低減することができる。したがって,吸着部によりウェハを吸引保持する際に発生する,ウェハの抗折強度の低下を抑制することができる。
【選択図】図3
Description
(第1の実施形態)
まず,本発明の第1の実施形態にかかる研磨装置について説明する。なお,図1は,本実施形態にかかる研磨装置1の全体構成を示す斜視図である。
次に,実施例として,従来のウェハ搬送装置と,本発明のウェハ搬送装置とについて,それぞれのウェハ搬送装置により搬送されたウェハWの抗折強度を測定し,その比較結果を示す。
110,112 搬送アーム
111,113 保持部
120 ウェハ搬送装置
122 吸着パッド
W ウェハ
C チップ
Claims (3)
- ウェハを吸着部により吸着保持して搬送するウェハ搬送装置において:
前記吸着部は,アルミナを主成分とした材料から形成され,気孔率が34〜40%であり,
前記吸着部の表面における気孔以外の部分の表面粗さRyは,5μm以下であることを特徴とする,ウェハ搬送装置。 - 表面研削により変質した前記ウェハの研削面を研磨する研磨装置に備えられることを特徴とする,請求項1に記載のウェハ搬送装置。
- 前記ウェハを,前記ウェハを保持するチャックテーブルから,前記ウェハを洗浄する洗浄手段へ搬送するために用いられることを特徴とする,請求項1または2のいずれかに記載のウェハ搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189315A JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189315A JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012737A true JP2007012737A (ja) | 2007-01-18 |
JP4526449B2 JP4526449B2 (ja) | 2010-08-18 |
Family
ID=37750881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005189315A Active JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4526449B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009253244A (ja) * | 2008-04-11 | 2009-10-29 | Disco Abrasive Syst Ltd | ウエーハの搬出方法 |
JP2013144323A (ja) * | 2012-01-13 | 2013-07-25 | Disco Corp | 搬送方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH068086A (ja) * | 1991-11-29 | 1994-01-18 | Kyocera Corp | 真空吸着装置 |
JPH0855896A (ja) * | 1994-08-11 | 1996-02-27 | Disco Abrasive Syst Ltd | ウェーハ搬送手段 |
JP2001351961A (ja) * | 2000-06-07 | 2001-12-21 | Taiheiyo Cement Corp | Siウェハ搬送治具及びその製造方法 |
JP2004140132A (ja) * | 2002-10-17 | 2004-05-13 | Taiheiyo Cement Corp | 試料載置ステージ |
-
2005
- 2005-06-29 JP JP2005189315A patent/JP4526449B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH068086A (ja) * | 1991-11-29 | 1994-01-18 | Kyocera Corp | 真空吸着装置 |
JPH0855896A (ja) * | 1994-08-11 | 1996-02-27 | Disco Abrasive Syst Ltd | ウェーハ搬送手段 |
JP2001351961A (ja) * | 2000-06-07 | 2001-12-21 | Taiheiyo Cement Corp | Siウェハ搬送治具及びその製造方法 |
JP2004140132A (ja) * | 2002-10-17 | 2004-05-13 | Taiheiyo Cement Corp | 試料載置ステージ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009253244A (ja) * | 2008-04-11 | 2009-10-29 | Disco Abrasive Syst Ltd | ウエーハの搬出方法 |
JP2013144323A (ja) * | 2012-01-13 | 2013-07-25 | Disco Corp | 搬送方法 |
Also Published As
Publication number | Publication date |
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JP4526449B2 (ja) | 2010-08-18 |
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