JP2007007747A

JP2007007747A - Retainer for matter to be polished and polishing head

Info

Publication number: JP2007007747A
Application number: JP2005188844A
Authority: JP
Inventors: Hiroyuki Yamada; 博行山田; Hidenobu Mizumoto; 英伸水本; Katsumasa Kawabata; 克昌川端
Original assignee: Nitta Haas Inc
Current assignee: Nitta DuPont Inc
Priority date: 2005-06-28
Filing date: 2005-06-28
Publication date: 2007-01-18

Abstract

<P>PROBLEM TO BE SOLVED: To provide a retainer for matter to be polished and a polishing head, relaxing the stress applied to the retainer for the matter to be polished in the process of polishing, preventing breakage and separation of the matter to be polished and the retainer for the matter to be polished, and obtaining favorable polishing result. <P>SOLUTION: This retainer 1a for the matter to be polished includes: an internal retainer 3 having a holding part 5 for the matter to be polished inside; and an external retainer 2 formed on the outside of the internal retainer 3. A fixed gap 4a is provided between the internal retainer 3 and the external retainer 2, thereby solving the problem. In the retainer 1b for the matter to be polished, a buffer frame material 4b formed of a member having lower hardness than the internal retainer 3 is provided, thereby solving the problem. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、被研磨物を研磨機に設置して固定する際に使用する被研磨物保持枠材および研磨ヘッドに関する。 The present invention relates to an object holding frame material and a polishing head used when an object to be polished is installed and fixed in a polishing machine.

シリコンウェハやＬＣＤガラス等の被研磨物の研磨において、被研磨物は研磨ヘッドに保持された状態で定盤上に設置した研磨布に押し付けられて、砥粒を含んだスラリーを介して摺動することにより研磨される。当該研磨において、研磨ヘッドには、摩擦力や遠心力による被研磨物の脱落防止のため、被研磨物保持枠材が使用されている。 When polishing an object to be polished such as silicon wafer or LCD glass, the object to be polished is pressed against a polishing cloth placed on a surface plate while being held by a polishing head, and slides through a slurry containing abrasive grains. It is polished by doing. In the polishing, a polishing object holding frame material is used for the polishing head in order to prevent the polishing object from falling off due to frictional force or centrifugal force.

当該被研磨物保持枠材の使用により被研磨物の脱落問題は改善されたが、研磨中に被研磨物保持枠材の内側面に接触して被研磨物が破損したり、被研磨物保持枠材内側面が破損してスクラッチの原因となったりする問題が新たに発生した。 Although the problem of falling off of the object has been improved by using the object holding frame material, the object to be polished may be damaged by contacting the inner surface of the object holding frame material during polishing or holding the object to be polished. A new problem has arisen in which the inner surface of the frame material is damaged and causes scratches.

係る問題を解決するために、様々な方法が考案されている。例えば、図７に示すように、被研磨物保持枠材３０の材質を有機繊維と樹脂からなる積層板とし、さらに被研磨物保持枠材内側面３１に耐摩耗性に優れた有機繊維と樹脂からなる部材３２を用いることにより、被研磨物保持枠材内側面３１における前記問題の解決を図っている（例えば、特許文献１参照。）。 Various methods have been devised to solve such problems. For example, as shown in FIG. 7, the material to be polished holding frame material 30 is a laminated plate made of organic fibers and resin, and organic fiber and resin having excellent wear resistance are provided on the inner surface 31 of the polishing object holding frame material. By using the member 32 made of the above, the problem on the inner surface 31 of the workpiece holding frame material is solved (see, for example, Patent Document 1).

この特許文献１を説明すると、研磨時における被研磨物保持材３０にかかる応力は、例えば図８に示すように、被研磨物２０の揺動に起因する応力７と、被研磨物２０を研磨布８へ圧接することにより発生する応力９、の二つに大別される。 Explaining this Patent Document 1, the stress applied to the workpiece holding material 30 during polishing is, for example, as shown in FIG. 8, the stress 7 resulting from the oscillation of the workpiece 20 and the polishing of the workpiece 20. There are roughly two types of stresses 9, which are generated by press contact with the cloth 8.

応力７に着目すると、被研磨物保持パッド１０上に粘着層１１を介して設置した被研磨物保持枠材３０は、被研磨物２０が揺動することにより発生する応力７を、被研磨物２０が部材３２と接触することにより受け止めている。当該技術により、被研磨物２０が接触することによる部材３２表面が研削されることなどに起因するスクラッチは軽減された。しかしながら、被研磨物保持枠材３０自体は一体に成形されているため、被研磨物２０が接触する際に発生する応力７を分散することができず、被研磨物２０や被研磨物保持枠材３０が破損するといった問題や、被研磨物保持枠材３０と被研磨物保持パッド１０の界面に応力が集中するため、当該界面で剥離が生じるといった問題が生じていた。 Focusing on the stress 7, the workpiece holding frame member 30 installed on the workpiece holding pad 10 via the adhesive layer 11 applies the stress 7 generated by the oscillation of the workpiece 20 to the workpiece. 20 is received by contacting the member 32. According to this technique, scratches caused by grinding the surface of the member 32 due to contact with the workpiece 20 are reduced. However, since the workpiece holding frame member 30 itself is integrally formed, the stress 7 generated when the workpiece 20 contacts cannot be dispersed, and the workpiece 20 or the workpiece holding frame is not dispersed. The problem that the material 30 was damaged and the stress concentrated at the interface between the workpiece holding frame member 30 and the workpiece holding pad 10 caused peeling at the interface.

一方、応力９に着目した場合、研磨布８からの応力９が、被研磨物保持枠材３０に対し応力９の方向に作用する。当該応力９により被研磨物保持枠材３０は、応力９の方向に変形したり、被研磨物保持パッド１０が不均一に沈み込んだりすることとなり、被研磨物保持枠材３０の被研磨物２０側が持ち上がり、被研磨物保持枠材３０が破損したり、剥がれたりする現象が発生していた。このため、被研磨物保持枠材３０の厚さを被研磨物２０の厚さより薄く設計することが考えられるが、この方法では被研磨物２０の突き出し量を確保することができず、被研磨物２０の表面平坦度を確保できなかった。また、当該変形により研磨布表面に傷が生じるといった問題も生じており、改善策が望まれていた。 On the other hand, when attention is paid to the stress 9, the stress 9 from the polishing pad 8 acts on the workpiece holding frame material 30 in the direction of the stress 9. The workpiece holding frame member 30 is deformed in the direction of the stress 9 due to the stress 9 or the workpiece holding pad 10 sinks non-uniformly, and the workpiece of the workpiece holding frame member 30 is polished. The phenomenon that 20 side lifted up and the to-be-polished object holding frame member 30 was damaged or peeled off occurred. For this reason, it can be considered that the thickness of the workpiece holding frame member 30 is designed to be thinner than the thickness of the workpiece 20. However, this method cannot secure the protrusion amount of the workpiece 20, and the workpiece is polished. The surface flatness of the object 20 could not be secured. In addition, there is a problem that the surface of the polishing cloth is scratched by the deformation, and an improvement measure has been desired.

特開２００３−２２５８５７号公報（頁５、図２）JP 2003-225857 A (Page 5, FIG. 2)

したがって、本発明は上記問題点を解決するためになされたもので、被研磨物保持枠材が研磨中に受ける応力を緩和し、被研磨物および被研磨物保持枠材の破損や剥がれを防止し、良好な研磨結果を得ることができる被研磨物保持枠材および研磨ヘッドを提供することを目的とする。 Therefore, the present invention has been made to solve the above-described problems, and relaxes the stress that the workpiece holding frame material receives during polishing, and prevents damage and peeling of the workpiece and the workpiece holding frame material. And it aims at providing the to-be-polished material holding | maintenance frame material and polishing head which can obtain a favorable grinding | polishing result.

上記目的を達成するために、本発明の被研磨物保持枠材は、被研磨物を研磨する際に、前記被研磨物を研磨機の研磨ヘッドに設置して固定する際に使用する被研磨物保持枠材であって、内側に前記被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材との間に一定の隙間を有する外部保持枠材とを有することを特徴とする。 In order to achieve the above object, the object-holding frame material of the present invention is a material to be used for polishing when the object to be polished is installed and fixed on a polishing head of a polishing machine. It is an object holding frame material, and is provided on the inner side of the inner holding frame material having the holding portion for the object to be polished and on the outer side of the inner holding frame material, and has a certain gap between the inner holding frame material. And an external holding frame member.

また、本発明の被研磨物保持枠材は、内側に被研磨物保持部を有する内部保持枠材と、前記内部保持枠材の外側に一定の隙間を有して設けられる外部保持枠材とによって構成し、前記隙間が前記内部保持枠材の内側壁から前記外部保持枠材の外側壁までの幅に対して０．１〜２０％であることを特徴とする。 Further, an object holding frame material of the present invention includes an inner holding frame material having an object holding portion on the inner side, and an outer holding frame material provided with a certain gap on the outer side of the inner holding frame material. The gap is 0.1 to 20% with respect to the width from the inner side wall of the inner holding frame member to the outer side wall of the outer holding frame member.

また、本発明の研磨ヘッドは、内側に被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材との間に一定の隙間を有する外部保持枠材とで構成される被研磨物保持枠材が粘着層を介して被研磨物保持パッドに複数設置されていることを特徴とする。 In addition, the polishing head of the present invention has an internal holding frame member having a holding part for an object to be polished on the inner side and an outer side of the inner holding frame member, and has a certain gap between the inner holding frame member. A plurality of workpiece holding frame members composed of an external holding frame member are provided on the workpiece holding pad via an adhesive layer.

また、本発明の研磨ヘッドは、内側に被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材との間に一定の隙間を有する外部保持枠材とで構成される被研磨物保持枠材が粘着層を介して直接複数設置されていることを特徴とする。 In addition, the polishing head of the present invention has an internal holding frame member having a holding part for an object to be polished on the inner side and an outer side of the inner holding frame member, and has a certain gap between the inner holding frame member. A plurality of workpiece holding frame materials composed of an external holding frame material are directly installed via an adhesive layer.

また、本発明の被研磨物保持枠材は、内側に前記被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材より低硬度の部材からなる緩衝枠材と、前記緩衝枠材の外側に設けられる外部保持枠材とを有することを特徴とする。 Further, the object holding frame material of the present invention is provided with an inner holding frame material having a holding part for the object to be polished on the inner side and an outer side of the inner holding frame material, and has a lower hardness than the inner holding frame material. It has the buffer frame material which consists of a member, and the external holding frame material provided in the outer side of the said buffer frame material, It is characterized by the above-mentioned.

また、本発明の被研磨物保持枠材は、内側に前記被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材より低硬度の部材からなる緩衝枠材と、前記緩衝枠材の外側に設けられる外部保持枠材によって構成し、前記緩衝枠材の幅が前記内部保持枠材の内側壁から前記外部保持枠材の外側壁までの幅に対して、０．１〜２０％であることを特徴とする。 Further, the object holding frame material of the present invention is provided with an inner holding frame material having a holding part for the object to be polished on the inner side and an outer side of the inner holding frame material, and has a lower hardness than the inner holding frame material. A buffer frame member made of a member and an external holding frame member provided outside the buffer frame member, and the width of the buffer frame member extends from the inner wall of the inner holding frame member to the outer wall of the outer holding frame member It is characterized by being 0.1 to 20% with respect to the width.

また、本発明の研磨ヘッドは、内側に前記被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材より低硬度の部材からなる緩衝枠材と、前記緩衝枠材の外側に設けられる外部保持枠材とで構成される被研磨物保持枠材が粘着層を介して被研磨物保持パッドに複数設置されていることを特徴とする。 Further, the polishing head of the present invention is provided with an internal holding frame member having a holding portion for the object to be polished on the inner side and a buffer provided on the outer side of the inner holding frame member and having a lower hardness than the internal holding frame member. A plurality of objects to be polished holding frame members, each comprising a frame material and an external holding frame material provided outside the buffer frame material, are provided on the object holding pad through an adhesive layer. .

また、本発明の被研磨物保持枠材は、内側に前記被研磨物の保持部を有する内部保持枠材と、前記内部保持枠材の外側に設けられ、前記内部保持枠材より低硬度の部材からなる緩衝枠材と、前記緩衝枠材の外側に設けられる外部保持枠材とで構成される被研磨物保持枠材が粘着層を介して直接複数設置されていることを特徴とする。 Further, the object holding frame material of the present invention is provided with an inner holding frame material having a holding part for the object to be polished on the inner side and an outer side of the inner holding frame material, and has a lower hardness than the inner holding frame material. A plurality of polished object holding frame materials, each comprising a buffer frame material made of a member and an external holding frame material provided outside the buffer frame material, are directly installed via an adhesive layer.

本発明の被研磨物保持枠材および研磨ヘッドを用いることにより、被研磨物保持枠材の内側面や被研磨物が破損しないため、破損によって発生する樹脂片、繊維片、および被研磨物片などが発生せず、スクラッチの発生が抑制される。 By using the object holding frame material and the polishing head of the present invention, the inner surface of the object holding frame material and the object to be polished are not damaged. Therefore, the resin piece, the fiber piece, and the object piece generated by the damage Etc., and the occurrence of scratches is suppressed.

また、被研磨物の突き出し量を確保することにより、被研磨物表面の平坦度などの特性が向上する。 Further, by ensuring the protrusion amount of the object to be polished, characteristics such as the flatness of the surface of the object to be polished are improved.

さらに、スクラッチの発生が抑制されると被研磨物保持枠材の寿命が延びることとなり、交換頻度が減少するため、コストを抑えることが可能となる。 Furthermore, if the generation of scratches is suppressed, the life of the workpiece holding frame material is extended, and the replacement frequency is reduced, so that the cost can be suppressed.

以下に、本発明の実施形態を説明する。
図１は、本発明に係る被研磨物保持枠材の実施形態の例を示す図である。
図１（ａ）に示すように、本発明の実施形態に係る被研磨物保持枠材１ａは、例えば円形の外部保持枠材２と、その内側に一定の隙間４ａをおいて設置される例えば円形の内部保持枠材３からなり、前記内部保持枠材３は、被研磨物保持部５を有している。 Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a diagram showing an example of an embodiment of an object holding frame material according to the present invention.
As shown to Fig.1 (a), the to-be-polished object holding | maintenance frame material 1a which concerns on embodiment of this invention is installed, for example with the circular external holding frame material 2 and the fixed clearance gap 4a inside it, for example. The inner holding frame member 3 is formed of a circular inner holding frame member 3 and has an object holding portion 5 to be polished.

また、図１（ｂ）に示すように、本発明の実施形態に係る被研磨物保持枠材１ｂは、例えば円形の外部保持枠材２と、その内側に設置される内部保持枠材より低硬度の部材からなる例えば円形の緩衝枠材４ｂと、その緩衝枠材４ｂの内側に設置される例えば円形の内部保持枠材３からなり、前記内部保持枠材３は、被研磨物保持部５を有している。 Moreover, as shown in FIG.1 (b), the to-be-polished object holding | maintenance frame material 1b which concerns on embodiment of this invention is lower than the internal holding frame material installed in the circular outer holding frame material 2 and its inside, for example For example, a circular buffer frame material 4b made of a hardness member and a circular internal holding frame material 3 installed inside the buffer frame material 4b, the internal holding frame material 3 is a workpiece holding portion 5 to be polished. have.

ここで、図１（ａ）に示す外部保持枠材２と内部保持枠材３の間に設けられる隙間４ａは、被研磨物保持枠材１ａの幅６（内部保持枠材３の内側壁から外部保持枠材２の外側壁までの幅）に対して０．１〜２０％、より好ましくは０．８〜１５％である。隙間４ａが０．１％より小さい場合、被研磨物２０（図２参照）が接触した際の緩衝領域が狭すぎるため、内部保持枠材３と外部保持枠材２が頻繁に接触することとなるため好ましくない。また、隙間４ａが２０％を超える場合は、その分、各保持枠材２，３の幅が狭くなり、強度が低下するため好ましくない。また、各保持枠材２，３の幅を広くした場合、内部保持枠材３の内径を小さくする必要があり、適用できる被研磨物サイズが小さくなるため、好ましくない。また、外部保持枠材２と内部保持枠材３の幅は、それぞれ選択されるが、同一であっても良い。 Here, the gap 4a provided between the outer holding frame member 2 and the inner holding frame member 3 shown in FIG. 1A is a width 6 of the workpiece holding frame member 1a (from the inner side wall of the inner holding frame member 3). 0.1-20%, and more preferably 0.8-15% with respect to the outer wall of the external holding frame member 2). When the gap 4a is smaller than 0.1%, the buffer region when the workpiece 20 (see FIG. 2) contacts is too narrow, so that the internal holding frame material 3 and the external holding frame material 2 are frequently in contact with each other. Therefore, it is not preferable. Further, when the gap 4a exceeds 20%, the width of each holding frame member 2 and 3 is reduced correspondingly, and the strength is lowered. Further, when the width of each holding frame member 2, 3 is increased, it is necessary to reduce the inner diameter of the inner holding frame member 3, which is not preferable because the applicable size of the object to be polished is reduced. The widths of the external holding frame member 2 and the internal holding frame member 3 are selected, but may be the same.

また、図１（ｂ）に示す外部保持枠材２と内部保持枠材３の間に設けられる緩衝枠材４ｂの硬度は、内部保持枠材３より低硬度であればよく、必要に応じて選択されるが、十分な緩衝特性を発揮するためには、内部保持枠材３の硬度の９０％以下の硬度であることが好ましく、８０％以下の硬度であることがより好ましい。また、緩衝枠材４ｂの材質は、内部保持枠材３より低硬度の部材であればよく、必要に応じて選択されるが、例えば、発泡高分子フォーム、シリコンゴム、シリコンゲル封入物、不織布、軟質ゴムなどが使用できる。緩衝枠材４ｂの幅は、被研磨物保持枠材１ｂの幅６に対して０．１〜２０％、より好ましくは０．８〜１５％である。緩衝枠材４ｂの幅が０．１％より小さい場合、被研磨物２０（図２参照）が接触した際に緩衝枠材４ｂが十分に機能しないこととなり好ましくない。また、緩衝枠材４ｂの幅が２０％を超える場合は、その分、各保持枠材２，３の幅が狭くなり、強度が低下するため好ましくない。また、各保持枠材２，３の幅を広くした場合、内部保持枠材３の内径を小さくする必要があり、適用できる被研磨物サイズが小さくなるため、好ましくない。また、外部保持枠材２と内部保持枠材３の幅は、それぞれ選択されるが、同一であっても良い。 Further, the hardness of the buffer frame member 4b provided between the outer holding frame member 2 and the inner holding frame member 3 shown in FIG. 1 (b) may be lower than that of the inner holding frame member 3, and as required. Although selected, in order to exhibit sufficient buffering properties, the hardness is preferably 90% or less of the hardness of the internal holding frame member 3, and more preferably 80% or less. The material of the buffer frame material 4b may be a member having a hardness lower than that of the internal holding frame material 3, and is selected as necessary. For example, foamed polymer foam, silicon rubber, silicon gel inclusion, non-woven fabric Soft rubber can be used. The width of the buffer frame material 4b is 0.1 to 20%, more preferably 0.8 to 15% with respect to the width 6 of the workpiece holding frame material 1b. When the width of the buffer frame material 4b is smaller than 0.1%, the buffer frame material 4b does not function sufficiently when the workpiece 20 (see FIG. 2) comes into contact with the buffer frame material 4b. In addition, when the width of the buffer frame material 4b exceeds 20%, the width of each holding frame material 2 and 3 is correspondingly reduced, and the strength is lowered. Further, when the width of each holding frame member 2, 3 is increased, it is necessary to reduce the inner diameter of the inner holding frame member 3, which is not preferable because the applicable size of the object to be polished is reduced. The widths of the external holding frame member 2 and the internal holding frame member 3 are selected, but may be the same.

図２は、研磨ヘッドの被研磨物保持パッドに複数の被研磨物保持部５を作成した例である。この例においても、隙間４ａの幅は同様に設定される。この場合、外部保持枠材２は複数の隙間４ａの外側全体となる。また、隙間４ａの基準となる幅６は、被研磨物保持枠材１ａの最外周と被研磨物保持部５の内周が最も近接する距離とすることが好ましい。被研磨物保持部５がさらに多数作成される場合についても、最外周と被研磨物保持部５の内周が最も近接する距離を基準として、隙間４ａを設定する。幅６は、被研磨物の種類や研磨機によって種々選択されるが、例えば円形の被研磨物を研磨する際は、５ｍｍ〜３５ｍｍに設定される。 FIG. 2 is an example in which a plurality of objects to be polished holding portions 5 are formed on the objects to be polished holding pad of the polishing head. Also in this example, the width of the gap 4a is set similarly. In this case, the external holding frame member 2 is the entire outside of the plurality of gaps 4a. Moreover, it is preferable that the width 6 serving as a reference of the gap 4a is a distance at which the outermost periphery of the workpiece holding frame member 1a is closest to the inner periphery of the workpiece holding portion 5. Even when a larger number of the workpiece holding parts 5 are formed, the gap 4a is set based on the distance that the outermost circumference and the inner circumference of the workpiece holding part 5 are closest to each other. The width 6 is variously selected depending on the type of the object to be polished and the polishing machine. For example, when polishing a circular object to be polished, the width 6 is set to 5 mm to 35 mm.

ここで、図２において隙間４ａを緩衝枠材４ｂに置き換えることにより、複数の被研磨物保持部５を有した被研磨物保持枠材１ｂを構成することも可能である。 Here, by replacing the gap 4a in FIG. 2 with the buffer frame material 4b, it is also possible to configure the workpiece holding frame material 1b having a plurality of workpiece holding parts 5.

実施形態に係る被研磨物保持枠材１ａ，１ｂは、その形状も円形にとらわれるものではなく、同様に内部保持枠材３の形状も円形にとらわれるものではない。 The shapes of the workpiece holding frame members 1a and 1b according to the embodiment are not limited to a circle, and similarly, the shape of the internal holding frame member 3 is not limited to a circle.

図３は、実施形態に係る被研磨物保持枠材１ａを研磨ヘッドの被研磨物保持パッドに用いて研磨する際の状態を示す図である。 FIG. 3 is a diagram illustrating a state in which the workpiece holding frame member 1a according to the embodiment is polished using the workpiece holding pad of the polishing head.

研磨作業中において、被研磨物２０が揺動した際、被研磨物２０はまず内部保持枠材３に接触する。このとき、内部保持枠材３には被研磨物２０から外向きの応力７がかかることとなるが、前記応力７は内部保持部材３およびその外側に設けられた隙間４ａにより分散し緩衝され、被研磨物２０及び内部保持枠材３は破損したり、剥がれたり、脱落したりすることはない。内部保持枠材３に被研磨物２０から一定以上の応力７が負荷された場合は、内部保持枠材３が隙間４ａを介して外部保持枠材２に接触することになり、内部保持枠材３にかかる応力７を更に分散する。 During the polishing operation, when the workpiece 20 swings, the workpiece 20 first contacts the internal holding frame member 3. At this time, the outward holding stress 7 is applied to the internal holding frame member 3 from the object to be polished 20, but the stress 7 is dispersed and buffered by the internal holding member 3 and the gap 4a provided outside thereof, The object to be polished 20 and the internal holding frame member 3 are not damaged, peeled off, or dropped off. When a certain stress 7 or more is applied to the internal holding frame material 3 from the work 20, the internal holding frame material 3 comes into contact with the external holding frame material 2 through the gap 4 a, and the internal holding frame material 3 is further dispersed.

また、研磨布８側からの応力９は、外部保持枠材２によって受け止められ、内部保持枠材３に殆ど影響をおよぼさない。この結果、設計時に設定された被研磨物２０の突き出し量を確保することができる。研磨布８側から一定以上の応力９が負荷された場合は、内部保持枠材３も研磨布８を保持することとなり、応力９を更に分散する。 Further, the stress 9 from the polishing cloth 8 side is received by the external holding frame material 2 and hardly affects the internal holding frame material 3. As a result, the protrusion amount of the workpiece 20 set at the time of design can be ensured. When a certain stress 9 or more is applied from the polishing cloth 8 side, the internal holding frame member 3 also holds the polishing cloth 8 and further disperses the stress 9.

なお、実際の研磨においては、前記応力7及び９に加えて、摩擦力や振動などの応力が発生するが、外部保持枠材２と内部保持枠材３が独立してその応力を受け、必要に応じて一体となってその応力等を分散することにより、被研磨物２０や被研磨物保持枠材１を破損することがない。 In actual polishing, in addition to the stresses 7 and 9, stresses such as frictional force and vibration are generated. However, the external holding frame material 2 and the internal holding frame material 3 are independently subjected to the stress. Accordingly, the object to be polished 20 and the object to be polished holding frame 1 are not damaged by integrally dispersing the stress and the like.

図４は、実施形態に係る被研磨物保持枠材１ｂを研磨ヘッドの被研磨物保持パッドに用いて研磨する際の状態を示す図である。 FIG. 4 is a diagram illustrating a state in which the workpiece holding frame member 1b according to the embodiment is polished using the workpiece holding pad of the polishing head.

研磨作業中において、被研磨物２０が揺動した際、被研磨物２０はまず内部保持枠材３に接触する。このとき、内部保持枠材３には被研磨物２０から外向きの応力７がかかることとなるが、前記応力７は内部保持部材３およびその外側に設けられた緩衝枠材４ｂにより分散し緩衝され、被研磨物２０及び内部保持枠材３は破損したり、剥がれたり、脱落したりすることはない。この場合緩衝枠材４ｂは、圧縮されることとなり、弾性体として機能することによって前記応力７を分散し緩和する。内部保持枠材３に被研磨物２０から緩衝枠材４ｂの限界変形量以上の応力７が負荷された場合は、外部保持枠材２を含む被研磨物保持枠材１ｂ全体で内部保持枠材３にかかる応力７を更に分散する。 During the polishing operation, when the workpiece 20 swings, the workpiece 20 first contacts the internal holding frame member 3. At this time, an outward stress 7 is applied to the internal holding frame member 3 from the workpiece 20, but the stress 7 is dispersed and buffered by the internal holding member 3 and the buffer frame member 4 b provided on the outside thereof. Thus, the object to be polished 20 and the internal holding frame member 3 are not damaged, peeled off or dropped off. In this case, the buffer frame material 4b is compressed and functions as an elastic body to disperse and relax the stress 7. When the internal holding frame member 3 is subjected to a stress 7 greater than the limit deformation amount of the shock absorbing frame member 4b from the object 20 to be polished, the entire inner holding frame member 1b including the outer holding frame member 2 is used as the inner holding frame member. 3 is further dispersed.

また、研磨布８側からの応力９は、外部保持枠材２によって受け止められ、内部保持枠材３に殆ど影響をおよぼさない。このとき、緩衝枠材４ｂは引っ張られることとなり、弾性体として機能することによって前記応力９を分散し緩和する。この結果、設計時に設定された被研磨物２０の突き出し量を確保することができる。研磨布８側から一定以上の応力９が負荷された場合は、内部保持枠材３を含む被研磨物保持枠材１ｂ全体で研磨布８を保持することとなり、応力９を更に分散する。 Further, the stress 9 from the polishing cloth 8 side is received by the external holding frame material 2 and hardly affects the internal holding frame material 3. At this time, the buffer frame material 4b is pulled, and the stress 9 is dispersed and relaxed by functioning as an elastic body. As a result, the protrusion amount of the workpiece 20 set at the time of design can be ensured. When a certain stress 9 or more is applied from the polishing cloth 8 side, the polishing cloth 8 is held by the entire workpiece holding frame material 1b including the internal holding frame material 3, and the stress 9 is further dispersed.

なお、実際の研磨におけるその他振動や応力についても、外部保持枠材２と内部保持枠材３が独立してその応力を受け、必要に応じて一体となってその応力等を分散することにより、被研磨物２０や被研磨物保持枠材１ｂを破損することがない。 As for other vibrations and stresses in actual polishing, the external holding frame material 2 and the internal holding frame material 3 are independently subjected to the stress, and the stress and the like are integrally dispersed as necessary. The workpiece 20 and the workpiece holding frame material 1b are not damaged.

ここで、緩衝枠材４ｂの高さは、外部保持枠材２および内部保持枠材３の高さを超えることは無く、外部保持枠材２および内部保持枠材３の高さの９５％未満であることが好ましい。前記高さが、外部保持枠材２および内部保持枠材３の高さを超える場合、応力７による緩衝枠材４ｂの圧縮変形部分が研磨布８側に突出することとなり、平坦性に影響をおよぼすため好ましくない。 Here, the height of the buffer frame material 4b does not exceed the height of the external holding frame material 2 and the internal holding frame material 3, and is less than 95% of the height of the external holding frame material 2 and the internal holding frame material 3. It is preferable that When the height exceeds the height of the outer holding frame member 2 and the inner holding frame member 3, the compressive deformation portion of the buffer frame member 4b due to the stress 7 protrudes toward the polishing pad 8 and affects the flatness. Therefore, it is not preferable.

被研磨物保持枠材１ａ，１ｂの材質としては、被研磨物２０の種類および研磨条件に応じて適宜選択されるが、例えばポリエーテルケトン、ポリカーボネイト、アクリル樹脂、ユニレート（登録商標）等の高分子材料、もしくは、ガラス繊維、カーボン繊維、テトロン（登録商標）繊維等にエポキシ樹脂等を含浸したり、積層したりした材料を用いることができる。 The material of the workpiece holding frame materials 1a and 1b is appropriately selected according to the type of the workpiece 20 and the polishing conditions. For example, a material such as polyether ketone, polycarbonate, acrylic resin, unilate (registered trademark), etc. A molecular material, or a material in which glass fiber, carbon fiber, Tetron (registered trademark) fiber, or the like is impregnated with epoxy resin or laminated can be used.

また、外部保持枠材２と内部保持枠材３は、必要に応じてそれぞれ別の種類の材料を用いることができる。この場合、各枠材の材料の選択幅はさらに広がり、セラミックスや、金属などの硬質材料から、発泡ウレタンフォームなどの軟質材料まで種々選択することができる。また、各枠材は単一材料から構成される必要は無く、複数材料から構成されても良い。 Further, different types of materials can be used for the outer holding frame member 2 and the inner holding frame member 3 as necessary. In this case, the selection range of the material of each frame material is further expanded, and various materials can be selected from hard materials such as ceramics and metal to soft materials such as foamed urethane foam. Each frame member does not need to be made of a single material, and may be made of a plurality of materials.

被研磨物保持枠材１ａ，１ｂは、図３および図４に示すように、被研磨物保持パッド１０上に両面テープなどの粘着層１１を介して設置することにより、被研磨物保持パッド１０の弾力性を有効に利用することができる。 As shown in FIGS. 3 and 4, the workpiece holding frame members 1 a and 1 b are placed on the workpiece holding pad 10 via an adhesive layer 11 such as a double-sided tape, whereby the workpiece holding pad 10. Can be used effectively.

ここで、緩衝枠材４ｂは他の方法によっても設置することが可能である。例えば、接着剤や両面テープなどの粘着層により、外部保持枠材２の内側面や内部保持枠材３の外側面の片方または両方に固定することが可能である。また、外部保持枠材２の内側面や内部保持枠材３の外側面の片方または両方と、緩衝枠材４ｂの内側面および外側面または片方に噛合部を形成することも可能である。 Here, the buffer frame member 4b can be installed by other methods. For example, it is possible to fix to one or both of the inner side surface of the external holding frame member 2 and the outer side surface of the inner holding frame member 3 with an adhesive layer such as an adhesive or a double-sided tape. It is also possible to form a meshing portion on one or both of the inner side surface of the outer holding frame member 2 and the outer side surface of the inner holding frame member 3 and the inner side surface and outer side surface or one side of the buffer frame member 4b.

図５は、実施形態に係る被研磨物保持枠材１ａを研磨ヘッドに用いて研磨した際の状態を示す図である。 FIG. 5 is a diagram illustrating a state when the workpiece holding frame member 1a according to the embodiment is polished using a polishing head.

被研磨物保持枠材１ａは、図５に示すように、粘着層１１を介して研磨ヘッド１２上に直接設置することもできる。粘着層１１は、被研磨物保持部材１ａや被研磨物２０の種類と研磨条件を調整することにより両面テープなど種々の物を使用することが可能であるが、被研磨物保持枠材１ａの奏する効果をより顕著なものとするために、フォームテープなどのクッション性を有する材料を使用することも可能である。 As shown in FIG. 5, the workpiece holding frame material 1 a can be directly placed on the polishing head 12 via the adhesive layer 11. The adhesive layer 11 can use various objects such as a double-sided tape by adjusting the type of the object to be polished 1a and the object 20 to be polished and the polishing conditions. In order to make the effect obtained more prominent, it is also possible to use a cushioning material such as foam tape.

本発明の実施形態に係る被研磨物保持枠材１ａ，１ｂは、種々の方法で製造できる。その製造には、切削、切断、射出成型、加熱加工、加圧加工など一般的な方法が用いられる。例えば、厚さが均一な一枚の樹脂製シートから、同一円心状の被研磨物保持枠材１ａ，１ｂを切り出すことが可能である。この場合、外部保持枠材２と内部保持枠材３の間の部分は、被研磨物保持枠材１ａ，１ｂを設置する際に有効なスペーサーとして使用することができる。すなわち、外部保持枠材２と内部保持枠材３の間に、前記スペーサーを置いて設置後、前記スペーサーを取り除くことにより、一定間隔の隙間４ａを形成することが可能である。当然のことながら、各保持枠材２，３をそれぞれ製造することも可能である。この場合、各保持枠材２，３を設置する際には別途作成した、円状または、数個に分割されたスペーサーなどを使用することも可能であるが、その他の方法を用いることにより設置することもできる。 The to-be-polished object holding frame materials 1a and 1b according to the embodiment of the present invention can be manufactured by various methods. For the production, general methods such as cutting, cutting, injection molding, heat processing, and pressure processing are used. For example, it is possible to cut the same-centered workpiece holding frame materials 1a and 1b from a single resin sheet having a uniform thickness. In this case, the portion between the outer holding frame member 2 and the inner holding frame member 3 can be used as an effective spacer when the workpiece holding frame members 1a and 1b are installed. That is, it is possible to form the gaps 4a at regular intervals by placing the spacer between the outer holding frame member 2 and the inner holding frame member 3 and then removing the spacer. Naturally, it is also possible to manufacture the holding frame members 2 and 3 respectively. In this case, when installing the holding frame members 2 and 3, it is possible to use a separately created circular shape or a spacer divided into several pieces, but it is possible to install by using other methods. You can also

また、本発明に係る緩衝枠材４ｂは、連続したものに限られない。すなわち、一定の幅を有したテープ上の緩衝枠材４ｂを内部保持枠材３の外側に設置した後、不要部分を切除することにより被研磨用保持枠材１ｂを得ることが可能である。 Moreover, the buffer frame material 4b which concerns on this invention is not restricted to the continuous thing. That is, it is possible to obtain the holding frame material 1b to be polished by installing the buffer frame material 4b on the tape having a certain width outside the internal holding frame material 3 and then cutting away unnecessary portions.

次に、本発明に係る被研磨物保持材の実施例を説明する。
本発明に係る実施例１として、例えば、図３に示す被研磨物保持枠材１ａのケースで、その材料としてガラスエポキシ積層シートを用い、切削加工により、幅１５ｍｍの外部保持枠材２と１３ｍｍの内部保持枠材３を得た。これらを２ｍｍの隙間４ａを確保してニッタ・ハース社製被研磨物保持パッド（商品名：Ｒ６０１）上に設置し、研磨ヘッドに設置した。次に、研磨布８としてニッタ・ハース社製研磨布（商品名：ＳＵＢＡ６００）を用いて研磨試験を実施した。研磨機はシトラスバー社製研磨機（装置名：６ＣＡ）を用い、研磨条件は、定盤および研磨ヘッドの回転速度を５０ｒｐｍ、研磨時間を１５分として、シリコンウェハを研磨した。研磨後、ＫＬＡ−Ｔｅｎｃｏｒ社製表面試験機（装置名：Ｐ−１２）を用いて、全体的な平坦度を示す指標であるＧＢＩＲ(Global Back-side Ideal
Range)および部分的な平坦度を示す指標であるＳＦＱＲ（Site Front Least Squares
Range）を測定し評価した。また寿命は、被研磨物保持枠材１ａに剥離が発生するまでの研磨処理枚数を評価した。研磨傷発生頻度は、目視並びに光学顕微鏡により行い、研磨傷発生個数を評価した。結果を図６に示す。 Next, examples of the workpiece holding material according to the present invention will be described.
As Example 1 according to the present invention, for example, in the case of the object holding frame material 1a shown in FIG. 3, a glass epoxy laminated sheet is used as the material, and the external holding frame material 2 having a width of 15 mm and 13 mm by cutting. The internal holding frame material 3 was obtained. These were installed on a polishing object holding pad (trade name: R601) manufactured by Nitta Haas with a gap 4a of 2 mm, and installed on a polishing head. Next, a polishing test was performed using a polishing cloth (trade name: SUBA600) manufactured by Nitta Haas as the polishing cloth 8. The polishing machine used was a citrus bar polishing machine (device name: 6CA). The polishing conditions were such that the rotation speed of the surface plate and the polishing head was 50 rpm, and the polishing time was 15 minutes. After polishing, using a surface tester (apparatus name: P-12) manufactured by KLA-Tencor, GBIR (Global Back-side Ideal) is an index indicating overall flatness.
Range) and SFQR (Site Front Least Squares), which is an indicator of partial flatness
Range) was measured and evaluated. Moreover, the lifetime evaluated the number of grinding | polishing processes until peeling | exfoliation generate | occur | produces in the to-be-polished object holding frame material 1a. The frequency of occurrence of polishing flaws was evaluated visually and with an optical microscope, and the number of occurrences of polishing flaws was evaluated. The results are shown in FIG.

本発明に係る実施例２として、例えば、図４に示す被研磨物保持枠材１ｂのケースで、その材料としてガラスエポキシ積層シートを用い、切削加工により、幅１５ｍｍの外部保持枠材２と１３ｍｍの内部保持枠材３を得た。次に発泡ウレタンフォームを幅２ｍｍ、高さを外部保持枠材２と内部保持枠材３の９５％として緩衝枠材４ｂを作成した。これらをニッタ・ハース社製被研磨物保持パッド（商品名：Ｒ６０１）上に設置し、研磨ヘッドに設置した。その他の条件は実施例１と同様にして研磨試験を行った。評価も実施例１と同様とし、その結果を図６に併せて示した。 As Example 2 according to the present invention, for example, in the case of the object holding frame material 1b shown in FIG. 4, a glass epoxy laminated sheet is used as the material, and the external holding frame material 2 having a width of 15 mm and 13 mm by cutting. The internal holding frame material 3 was obtained. Next, a shock-absorbing frame material 4b was prepared with a foamed urethane foam having a width of 2 mm and a height of 95% of the external holding frame material 2 and the internal holding frame material 3. These were placed on a polishing object holding pad (trade name: R601) manufactured by Nitta Haas and placed on a polishing head. The other conditions were the same as in Example 1 and the polishing test was performed. Evaluation was also the same as in Example 1, and the results are also shown in FIG.

＜比較例＞
幅３０ｍｍの一体型である以外は、全て実施例１と同条件により作成した被研磨物保持枠材を、実施例１と同様の方法で評価した。結果を図６に併せて示した。図６において、寿命と研磨傷発生頻度は、比較例を１００とした場合の相対値を示した。 <Comparative example>
Except for the integral type having a width of 30 mm, the workpiece holding frame material prepared under the same conditions as in Example 1 was evaluated in the same manner as in Example 1. The results are shown in FIG. In FIG. 6, the lifetime and the frequency of occurrence of polishing flaws are relative values when the comparative example is 100.

図６は、本発明に係る実施例１，２と比較例の研磨試験結果を示す図である。
図６の実施例１および実施例２に示す通り、本発明に係る被研磨物保持枠材１ａおよび１ｂを使用することにより、ＧＢＩＲの値が比較例に比べて小さく、平坦であることが確認された。また、ＳＦＱＲの値についても比較例に比べて小さく、平坦であることが確認された。寿命についても、本発明に係る被研磨物保持枠材１ａおよび１ｂは約１０％長かった。さらに、研磨キズの発生頻度が低いことから、被研磨物保持枠材１ａおよび１ｂの内面の破損などが殆ど見られないことが確認された。 FIG. 6 is a diagram showing the polishing test results of Examples 1 and 2 and a comparative example according to the present invention.
As shown in Example 1 and Example 2 of FIG. 6, it is confirmed that the use of the workpiece holding frame materials 1a and 1b according to the present invention has a smaller GBIR value than that of the comparative example and is flat. It was done. Moreover, it was confirmed that the value of SFQR is also smaller and flat compared to the comparative example. Also in terms of life, the polished object holding frame materials 1a and 1b according to the present invention were about 10% longer. Furthermore, since the frequency of occurrence of polishing scratches was low, it was confirmed that the inner surface of the workpiece holding frame members 1a and 1b was hardly damaged.

本発明に係る被研磨物保持枠材の実施形態を示す図。The figure which shows embodiment of the to-be-polished object holding | maintenance frame material which concerns on this invention. 本発明に係る被研磨物保持枠材を複数作成した場合の実施形態を示す図。The figure which shows embodiment at the time of producing several to-be-polished object holding | maintenance frame materials which concern on this invention. 本発明に係る被研磨物保持枠材を研磨ヘッドの被研磨物保持パッドに用いて研磨した際の状態を示す図。The figure which shows the state at the time of grind | polishing using the to-be-polished object holding frame material which concerns on this invention for the to-be-polished object holding pad of a polishing head. 本発明に係る被研磨物保持枠材を研磨ヘッドの被研磨物保持パッドに用いて研磨した際の状態を示す図。The figure which shows the state at the time of grind | polishing using the to-be-polished object holding frame material which concerns on this invention for the to-be-polished object holding pad of a polishing head. 本発明に係る被研磨物保持枠材を研磨ヘッドに用いて研磨した際の状態を示す図。The figure which shows the state at the time of grind | polishing using the grinding | polishing head for the to-be-polished material holding | maintenance frame material which concerns on this invention. 実施例１、２と比較例の研磨結果を示す図。The figure which shows the grinding | polishing result of Example 1, 2 and a comparative example. 従来技術に係る被研磨物保持枠材を示す図。The figure which shows the to-be-polished material holding | maintenance frame material which concerns on a prior art. 従来技術に係る被研磨物保持枠材を研磨ヘッドの被研磨物保持パッドに用いて研磨した際の状態を示す図。The figure which shows the state at the time of grind | polishing using the to-be-polished object holding frame material which concerns on a prior art for the to-be-polished object holding pad of a polishing head.

符号の説明Explanation of symbols

１ａ，１ｂ被研磨物保持枠材
２外部保持枠材
３内部保持枠材
４ａ隙間
４ｂ緩衝枠材
５被研磨物保持部
７，９応力
８研磨布
１０被研磨物保持パッド
１１粘着層
１２研磨ヘッド
２０被研磨物 DESCRIPTION OF SYMBOLS 1a, 1b Polishing object holding frame material 2 External holding frame material 3 Internal holding frame material 4a Gap 4b Buffer frame material 5 Polishing object holding part 7,9 Stress 8 Polishing cloth 10 Polishing object holding pad 11 Adhesive layer 12 Polishing head 20 Workpiece

Claims

被研磨物を研磨する際に、前記被研磨物を研磨機の研磨ヘッドに設置して固定する際に使用する被研磨物保持枠材であって、
内側に前記被研磨物の保持部を有する内部保持枠材と、
前記内部保持枠材の外側に設けられ、前記内部保持枠材との間に一定の隙間を有する外部保持枠材と
を有することを特徴とする被研磨物保持枠材。 When polishing an object to be polished, the object to be polished holding frame material used when installing and fixing the object to be polished on a polishing head of a polishing machine,
An inner holding frame material having a holding part for the object to be polished inside;
An object holding frame material provided on the outside of the internal holding frame material, and having an external holding frame material having a certain gap with the internal holding frame material.

前記隙間が、前記内部保持枠材の内側壁から前記外部保持枠材の外側壁までの幅に対して、０．１〜２０％であることを特徴とする請求項１に記載の被研磨物保持枠材。 The object to be polished according to claim 1, wherein the gap is 0.1 to 20% with respect to a width from an inner wall of the inner holding frame member to an outer wall of the outer holding frame member. Holding frame material.

前記請求項１に記載の被研磨物保持枠材が粘着層を介して被研磨物保持パッドに複数設置されていることを特徴とする研磨ヘッド。 A polishing head, wherein a plurality of the workpiece holding frame members according to claim 1 are installed on a workpiece holding pad via an adhesive layer.

前記請求項１に記載の被研磨物保持枠材が粘着層を介して直接複数設置されていることを特徴とする研磨ヘッド。 A polishing head, wherein a plurality of the workpiece holding frame members according to claim 1 are installed directly via an adhesive layer.

被研磨物を研磨する際に、前記被研磨物を研磨機の研磨ヘッドに設置して固定する際に使用する被研磨物保持枠材であって、
内側に前記被研磨物の保持部を有する内部保持枠材と、
前記内部保持枠材の外側に設けられ、前記内部保持枠材より低硬度の部材からなる緩衝枠材と、
前記緩衝枠材の外側に設けられる外部保持枠材と
を有することを特徴とする被研磨物保持枠材。 When polishing an object to be polished, the object to be polished holding frame material used when installing and fixing the object to be polished on a polishing head of a polishing machine,
An inner holding frame material having a holding part for the object to be polished inside;
A buffer frame material provided on the outside of the internal holding frame material, and made of a member having a lower hardness than the internal holding frame material;
An object holding frame material comprising an external holding frame material provided outside the buffer frame material.

前記緩衝枠材の幅が前記内部保持枠材の内側壁から前記外部保持枠材の外側壁までの幅に対して、０．１〜２０％であることを特徴とする請求項５に記載の被研磨物保持枠材。 The width of the buffer frame member is 0.1 to 20% with respect to the width from the inner wall of the inner holding frame member to the outer wall of the outer holding frame member. Workpiece holding frame material.

前記請求項５に記載の被研磨物保持枠材が粘着層を介して被研磨物保持パッドに複数設置されていることを特徴とする研磨ヘッド。 A polishing head, wherein a plurality of the workpiece holding frame members according to claim 5 are installed on the workpiece holding pad via an adhesive layer.

前記請求項５に記載の被研磨物保持枠材が粘着層を介して直接複数設置されていることを特徴とする研磨ヘッド。 A polishing head, wherein a plurality of the workpiece holding frame members according to claim 5 are directly installed via an adhesive layer.