JP2006344717A - Light-emitting device and its manufacturing method - Google Patents

Light-emitting device and its manufacturing method Download PDF

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JP2006344717A
JP2006344717A JP2005168008A JP2005168008A JP2006344717A JP 2006344717 A JP2006344717 A JP 2006344717A JP 2005168008 A JP2005168008 A JP 2005168008A JP 2005168008 A JP2005168008 A JP 2005168008A JP 2006344717 A JP2006344717 A JP 2006344717A
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light emitting
emitting device
light
metal base
emitting element
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Hideaki Kato
英昭 加藤
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of effectively dissipating heat generated by a light-emitting element accompanied by the increase of an output even in a surface-mounted light-emitting element, and its manufacturing method. <P>SOLUTION: The light-emitting device is provided with the light-emitting element; an external connection lead whose one end is connected to the light-emitting element and the other end is connected to the surface of an electric wiring substrate, and which is electrically connected with the electric wiring substrate; and a metal base having a recess to which the light-emitting element is mounted, and which holds the external connection lead, and dissipates the heat of the light-emitting element. The external connection lead is held in the recess by an insulating resin filled into the recess. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光装置に関し、特に、高出力化に伴う発光素子の発熱を、表面実装タイプの発光素子においても、効果的に放熱できるようにした発光装置およびその製造方法に関する。   The present invention relates to a light-emitting device, and more particularly, to a light-emitting device that can effectively dissipate heat generated by a light-emitting element accompanying an increase in output even in a surface-mounted light-emitting element, and a method for manufacturing the same.

近年、高出力のＬＥＤ（Light-Emitting Diode：発光ダイオード）の開発が進められており、すでに数ワットの大出力タイプも製品化されている。ＬＥＤは発熱の少ないことが特徴であるが、高出力（高輝度）タイプのＬＥＤ素子は大電流が流れるため、無視できないレベルの発熱が生じる。   In recent years, high-power LEDs (Light-Emitting Diodes) have been developed, and a high-power type of several watts has already been commercialized. LEDs are characterized by low heat generation, but high power (high brightness) type LED elements generate a large amount of current, and therefore generate heat that cannot be ignored.

従来、ＬＥＤパッケージは、発生した熱を周囲に発散させて除去する工夫がされたものとして、例えば、半導体光線パッケージは、リードフレームと、半導体発光エミッタと、封入部分とを備えて、リードフレームは、半導体発光エミッタを支持し且つエミッタ内で発生された熱を周囲環境に除去する熱経路を提供する吸熱部材と、半導体発光エミッタに電気的に接続するための少なくとも２つの電気導線とを備えたものがある（例えば、特許文献１参照）。   Conventionally, an LED package has been devised to radiate and remove the generated heat to the surroundings. For example, a semiconductor light package includes a lead frame, a semiconductor light emitting emitter, and an encapsulating portion. A heat absorbing member that supports the semiconductor light emitting emitter and provides a heat path for removing heat generated in the emitter to the ambient environment, and at least two electrical conductors for electrical connection to the semiconductor light emitting emitter. There are some (see, for example, Patent Document 1).

また、さらに放熱効果を高める工夫がされたものとして、例えば、サブマウントに搭載され、このサブマウントは、放熱器として機能する銅製の金属ベース部に搭載される。金属ベース部には金属反射鏡が接合され、放熱体として機能するよう構成されたものがある（例えば、特許文献２参照）。
特開２００５−５７４０号公報 特開２００５−１１６９９０号公報 Further, as a device for further improving the heat dissipation effect, for example, it is mounted on a submount, and this submount is mounted on a copper metal base functioning as a radiator. Some metal bases are joined to a metal reflector and function as a radiator (see, for example, Patent Document 2).
JP 2005-5740 A JP 2005-116990 A

しかし、従来の発光装置によると、リードフレームを用いたＬＥＤのパッケージを構成する場合、樹脂を溶融し絶縁体として用い、樹脂絶縁体が構造の主要部材を占めている。また、樹脂としては、白色系樹脂に代表される様な、高反射率樹脂を用いて、ＬＥＤパッケージからの光の取り出し効率を上げていた。この樹脂は、主に射出成型工法で、製作される熱可塑性の樹脂であるので、実装時の半田耐熱に問題があり、また、高温・高光出力の条件下では、劣化を起こし寿命に影響する。   However, according to a conventional light emitting device, when an LED package using a lead frame is formed, resin is melted and used as an insulator, and the resin insulator occupies the main member of the structure. Further, as the resin, a high reflectance resin such as a white resin is used to increase the light extraction efficiency from the LED package. Since this resin is a thermoplastic resin that is manufactured mainly by the injection molding method, there is a problem with soldering heat resistance during mounting, and under high temperature and high light output conditions, it will deteriorate and affect the service life. .

従来から生産されている、パワー系半導体・トランジスタは、一般的に放熱部材として、樹脂で固定された、ヒートシンクを設置し、半導体から発生する熱を逃がしている。またこの場合の樹脂は、熱硬化型の樹脂を用いる場合が多く、トランスファモールドに代表されるような工法で、成型され、色調としては、一般的に黒色〜灰色系の物が多く、光の反射率は低くＬＥＤの反射部材としては使用できない。パワー系半導体のリードフレームを利用してＬＥＤを構成した例も多くあるが、一般的に、先に述べたような樹脂の劣化による寿命の低下が問題となる。従って、放熱部材として樹脂を用いることは種々の問題があると共に、放熱性は金属に比べて劣るという問題がある。   Conventionally produced power semiconductors / transistors have a heat sink fixed with resin as a heat dissipating member to release heat generated from the semiconductor. The resin in this case is often a thermosetting resin, and is molded by a method represented by transfer molding, and the color tone is generally black to gray. The reflectance is low and it cannot be used as a reflective member for LEDs. There are many examples in which an LED is configured using a lead frame of a power semiconductor, but in general, there is a problem of a decrease in life due to deterioration of the resin as described above. Therefore, using a resin as a heat radiating member has various problems and has a problem that heat dissipation is inferior to metal.

また、従来から用いられている、金属製のステムは、放熱性が必要なレーザダイオードや、トランジスタのパッケージ等に広く使用されていた。しかしこのステム方式では、配線基板に穴を明けて、半田付けをする必要があり、昨今の高密度実装を実現するための、表面実装には適さない。特許文献２に開示されたような、リードフレームを横方向に出した構成においても、上記と同様に、表面実装には適さないという問題がある。   Further, conventionally used metal stems have been widely used in laser diodes, transistor packages, and the like that require heat dissipation. However, in this stem system, it is necessary to make a hole in the wiring board and solder it, and it is not suitable for surface mounting to realize the recent high-density mounting. Even in the configuration in which the lead frame is extended in the horizontal direction as disclosed in Patent Document 2, there is a problem that it is not suitable for surface mounting as described above.

以上のように、従来の発光装置によると、樹脂材料でインサートモールドされたリードフレームに挿入される構成では十分な放熱効果が得られず、ＬＥＤ素子の高出力化に対応することができず、また、配線基板への表面実装にも適さないという問題がある。   As described above, according to the conventional light emitting device, the structure inserted into the lead frame insert-molded with a resin material does not provide a sufficient heat dissipation effect and cannot cope with the high output of the LED element. There is also a problem that it is not suitable for surface mounting on a wiring board.

従って、本発明の目的は、高出力化に伴う発光素子の発熱を、表面実装タイプの発光素子においても、効果的に放熱できるようにした発光装置およびその製造方法を提供することにある。   Accordingly, an object of the present invention is to provide a light-emitting device and a method for manufacturing the same, which can effectively dissipate heat generated by the light-emitting element due to higher output even in a surface-mounted light-emitting element.

本発明は、上記の目的を達成するため、電気配線基板の表面に実装される発光装置であって、発光素子と、前記発光素子に一端が接続され、他の一端が前記電気配線基板の表面に接続されて、前記電気配線基板との電気的接続を行う外部接続用リード部と、前記発光素子が搭載されると共に、前記外部接続用リード部を保持するための凹部を有し、前記発光素子の熱を放熱する金属ベース部とを備え、前記外部接続用リード部は、前記凹部に充填された絶縁性樹脂により前記凹部に保持されている発光装置を提供する。   In order to achieve the above object, the present invention is a light emitting device mounted on the surface of an electric wiring board, wherein one end is connected to the light emitting element and the light emitting element, and the other end is the surface of the electric wiring board. An external connection lead portion that is electrically connected to the electrical wiring board; and the light emitting element is mounted and has a recess for holding the external connection lead portion; A light emitting device in which the external connection lead portion is held in the concave portion by an insulating resin filled in the concave portion.

前記外部接続用リード部は、前記発光素子と前記電気配線基板との間において、応力を緩和するための屈曲部を有することが好ましい。   The external connection lead portion preferably has a bent portion for relaxing stress between the light emitting element and the electric wiring board.

前記金属ベース部は、前記発光素子の光取出し効率を向上させる凸部を有し、前記発光素子は、前記凸部に搭載されていることが好ましい。   It is preferable that the metal base portion has a convex portion that improves the light extraction efficiency of the light emitting element, and the light emitting element is mounted on the convex portion.

前記金属ベース部は、前記発光素子を封止する封止材を充填するための封止材保持部を位置決めする位置決め部を有することが好ましい。   The metal base part preferably has a positioning part for positioning a sealing material holding part for filling a sealing material for sealing the light emitting element.

前記金属ベース部は、前記発光素子の光取出し効率を向上させる反射部を有することが好ましい。   The metal base part preferably has a reflection part that improves the light extraction efficiency of the light emitting element.

前記反射部は、前記金属ベース部と一体的に形成されていることが好ましい。   The reflection part is preferably formed integrally with the metal base part.

前記封止材保持部は、前記発光素子を封止する封止材によって形成されて前記発光素子から放射される光を集光するレンズ部を保持することが好ましい。   It is preferable that the sealing material holding part holds a lens part that is formed of a sealing material that seals the light emitting element and collects light emitted from the light emitting element.

前記金属ベース部は、前記発光装置を前記電気配線基板へ実装するときに、前記発光装置の取付け方向の識別を容易にするための識別部を有することが好ましい。   It is preferable that the metal base portion has an identification portion for facilitating identification of the mounting direction of the light emitting device when the light emitting device is mounted on the electric wiring board.

本発明は、上記の目的を達成するため、発光素子が搭載されると共に、外部接続用リードを保持するための凹部を有し、前記発光素子の熱を放熱する金属ベース部に前記発光素子を取付ける素子取付け工程と、前記金属ベース部の凹部に前記外部接続用リード部を前記金属ベース部と接触しないよう保持する保持工程と、前記金属ベース部の前記外部接続用リード部が保持された凹部に絶縁性樹脂を充填する充填工程とを有する発光装置の製造方法を提供する。   In order to achieve the above object, the present invention is provided with a light emitting element and a recess for holding an external connection lead, and the light emitting element is disposed on a metal base that radiates heat from the light emitting element. An element mounting step for mounting, a holding step for holding the external connection lead portion in contact with the metal base portion in the concave portion of the metal base portion, and a concave portion in which the external connection lead portion of the metal base portion is held And a filling step of filling the insulating resin with the insulating resin.

前記保持工程において、外部接続用リード部に予め接触防止部材を備えた後に、前記金属ベース部の凹部に前記外部接続用リード部を保持することが好ましい。   In the holding step, it is preferable that the external connection lead portion is held in the concave portion of the metal base portion after the contact prevention member is provided in advance in the external connection lead portion.

本発明の発光装置によれば、発光素子を放熱効果の高い金属ベース部に搭載する構成としたので、高出力化に伴う発光素子の発熱を、表面実装タイプの発光素子においても、効果的に放熱することが可能となる。   According to the light-emitting device of the present invention, since the light-emitting element is mounted on the metal base portion having a high heat dissipation effect, the heat generation of the light-emitting element accompanying the increase in output can be effectively achieved even in the surface-mounted light-emitting element. It is possible to dissipate heat.

（第１の実施の形態）
図１は、本発明の第１の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図、（ｃ）はＢ−Ｂ方向から見た底面図である。 (First embodiment)
FIG. 1 is a light emitting device using an LED element according to the first embodiment of the present invention, in which (a) is a plan view, (b) is an AA longitudinal sectional view of the light emitting device, and (c) is a plan view. It is the bottom view seen from the BB direction.

この発光装置１は、放熱器としての金属ベース部１１と、金属ベース部１１上に搭載されるＬＥＤ素子１２と、ＬＥＤ素子１２に一端がワイヤ１８で接続され、他の一端が電気配線基板２０の表面に接続されて、電気配線基板２０との電気的接続を行う外部接続用リード部１３と、外部接続用リード部１３を金属ベース部１１に保持する絶縁性樹脂１４と、金属ベース部１１に装着される封止材保持部材１５と、この封止材保持部に充填された封止材１６とを備えて構成されている。   The light emitting device 1 includes a metal base portion 11 as a heat radiator, an LED element 12 mounted on the metal base portion 11, one end connected to the LED element 12 with a wire 18, and the other end connected to an electric wiring board 20. External connection lead part 13 that is electrically connected to the electrical wiring substrate 20, an insulating resin 14 that holds the external connection lead part 13 on the metal base part 11, and the metal base part 11. And a sealing material 16 filled in the sealing material holding part.

金属ベース部１１は、銅、アルミニウム等の熱伝導性に優れる金属が用いられ、ＬＥＤ素子１２の消費電力等に応じて十分な放熱効果が得られる厚み及び大きさを有している。また、底面には、電気配線基板２０との間に間隙を設けて、外部接続用リード部１３を保持するための凹部１１ｂが形成されている。この凹部１１ｂは、外部接続用リード部１３が金属ベース部１１と接触せずに保持されるスペースであればよく、金属ベース部１１の放熱効果をより発揮させるために、金属ベース部１１に大きさの制限がある場合には、凹部１１ｂは小さな容積で形成するのが好ましく、逆に、金属ベース部１１の金属部分は大きな容積で形成するのが好ましい。   The metal base portion 11 is made of a metal having excellent thermal conductivity, such as copper or aluminum, and has a thickness and a size that can provide a sufficient heat dissipation effect according to the power consumption of the LED element 12. In addition, a recess 11 b is formed on the bottom surface for holding the external connection lead portion 13 by providing a gap with the electrical wiring board 20. The recess 11b may be a space in which the external connection lead portion 13 is held without contacting the metal base portion 11, and is large in the metal base portion 11 in order to exhibit the heat dissipation effect of the metal base portion 11. When there is a limitation, it is preferable to form the concave portion 11b with a small volume, and conversely, it is preferable to form the metal portion of the metal base portion 11 with a large volume.

また、金属ベース部１１の少なくとも１の角部に、発光装置１の取付け方向の識別を容易にするための識別部を形成する。識別部は、図１に、面取り部１１ｅを示すが、これに限らず、識別マーク等でもよい。実装時に、発光装置１をパーツフィーダから電気配線基板２０へ供給する場合は、面取り部１１ｅを形成しておくのが好ましい。   In addition, an identification portion for facilitating identification of the mounting direction of the light emitting device 1 is formed in at least one corner of the metal base portion 11. Although the identification part shows the chamfered part 11e in FIG. 1, it is not limited to this and may be an identification mark or the like. When the light emitting device 1 is supplied from the parts feeder to the electric wiring board 20 at the time of mounting, it is preferable to form the chamfered portion 11e.

ＬＥＤ素子１２は、ＧａＮ、ＡｌＩｎＧａＰ等の材料を用いて作られた高出力型であり、そのチップサイズは、０．３×０．３ｍｍ（標準サイズ）、１×１ｍｍ（ラージサイズ）等である。そして、ＬＥＤ素子１２は、ワイヤ１８を接続要素とするフェイスアップ型であり、封止によりワイヤ１８が変形するおそれがある場合には、封止材１６に粘度の低い樹脂材を用いることが好ましい。   The LED element 12 is a high-power type made using a material such as GaN or AlInGaP, and the chip size is 0.3 × 0.3 mm (standard size), 1 × 1 mm (large size), or the like. . The LED element 12 is a face-up type using the wire 18 as a connecting element. When the wire 18 may be deformed by sealing, it is preferable to use a resin material having a low viscosity for the sealing material 16. .

外部接続用リード部１３は、銅、銅系合金等の金属が用いられ、ワイヤ１８及び電気配線基板２０との接続箇所である、端部１３ａ、１３ｂは、半田とのなじみが良好となるよう、金メッキ、ロジウムメッキ等の表面処理が施されているのが好ましい。また、金属ベース部１１の素子実装面に設けられる円形の開口１１Aに露出した端部１３ａがＬＥＤ素子１２に接続され、他の端部１３ｂが電気配線基板２０の表面に接続されて、電気配線基板２０との電気的接続を行う。この外部接続用リード部１３は、ＬＥＤ素子１２と電気配線基板２０との間において、応力を緩和するための屈曲部を有している。屈曲部は曲面あるいは平面の組合せにより構成され、また、電気配線基板２０と平行な部分、垂直な部分、又は斜めの部分の組合せにより構成されている。   The external connection lead portion 13 is made of a metal such as copper or a copper-based alloy, and the end portions 13a and 13b, which are connection portions between the wire 18 and the electric wiring board 20, have good compatibility with solder. Surface treatment such as gold plating or rhodium plating is preferably performed. Also, the end 13a exposed in the circular opening 11A provided on the element mounting surface of the metal base portion 11 is connected to the LED element 12, and the other end 13b is connected to the surface of the electric wiring board 20, so that the electric wiring Electrical connection with the substrate 20 is performed. The external connection lead portion 13 has a bent portion for relaxing stress between the LED element 12 and the electric wiring board 20. The bent portion is configured by a combination of a curved surface or a plane, and is configured by a combination of a portion parallel to the electrical wiring substrate 20, a vertical portion, or an oblique portion.

図１には、略Ｚ形状の外部接続用リード部１３が図示されているが、この形状に限定されず、他の形状であっても、応力を緩和できる形状であればよい。外部接続用リード部１３の電気配線基板２０の表面に接続される端部１３ｂは、表面実装に適した形状に形成されている。すなわち、図１に示すように、電気配線基板２０の表面との接触を確実に行えるよう、電気配線基板２０の表面に平行な部分を有して構成されるのが好ましい。また、外部接続用リード部１３の端部１３ｂは、図１では、金属ベース部１１の外形の外側へ出ているが、金属ベース部１１の外形の内側に収まった形状であっても、電気配線基板２０への表面実装作業にはなんら問題ない。   Although FIG. 1 shows the external connection lead portion 13 having a substantially Z shape, the shape is not limited to this shape, and any other shape may be used as long as it can relieve stress. The end 13b of the external connection lead 13 connected to the surface of the electrical wiring board 20 is formed in a shape suitable for surface mounting. That is, as shown in FIG. 1, it is preferable to have a portion parallel to the surface of the electrical wiring board 20 so as to ensure contact with the surface of the electrical wiring board 20. Further, in FIG. 1, the end 13 b of the external connection lead portion 13 protrudes outside the outer shape of the metal base portion 11, but even if the shape is within the outer shape of the metal base portion 11, There is no problem in the surface mounting work on the wiring board 20.

また、外部接続用リード部１３は、充填される絶縁性樹脂１４により金属ベース部１１への保持あるいは固定が確実となるよう、孔部１３ｃを有すると共に、製作時に金属ベース部１１との接触を防止するために、接触防止部材１７を装着するための装着孔部１３ｄを有している。なお、絶縁性樹脂１４は、リード封止性および充填性に優れる熱硬化性樹脂を使用する。   Further, the external connection lead portion 13 has a hole portion 13c so as to be securely held or fixed to the metal base portion 11 by the filled insulating resin 14, and is in contact with the metal base portion 11 at the time of manufacture. In order to prevent this, a mounting hole 13d for mounting the contact preventing member 17 is provided. The insulating resin 14 is a thermosetting resin that is excellent in lead sealing and filling properties.

封止材保持部材１５は、ＬＥＤ素子１２を封止する封止材１６を充填するために、金属ベース部１１上に取付けられている。封止材保持部材１５は、白色等のＬＥＤ素子１２からの光を反射する樹脂が用いられるが、他の金属等でも使用可能である。尚、図１において、封止材保持部材１５の封止材１６が充填される部分の形状は、円形状に図示されているが、これに限らず、楕円状あるいは矩形状等であってもよい。また、金属ベース部１１は、上記の封止材保持部材１５の形状を一体に形成したものでもよく、封止材１６が充填される部分の形状を有する形状とすることで、金属ベース部１１が封止材保持部材１５の機能を兼用することができる。   The sealing material holding member 15 is attached on the metal base portion 11 in order to fill the sealing material 16 that seals the LED element 12. The sealing material holding member 15 is made of a resin that reflects light from the LED element 12 such as white, but other metals can also be used. In FIG. 1, the shape of the portion filled with the sealing material 16 of the sealing material holding member 15 is shown as a circular shape, but is not limited thereto, and may be an elliptical shape or a rectangular shape. Good. Further, the metal base portion 11 may be formed integrally with the shape of the sealing material holding member 15 described above, and the metal base portion 11 has a shape of a portion filled with the sealing material 16. However, the function of the sealing material holding member 15 can be shared.

封止材１６は、ＬＥＤ素子１２の上面で、封止材保持部材１５の中に充填されるもので、透光性のシリコーン、エポキシ等の樹脂材料又は透光性で低融点のガラス材等を用いる。尚、封止材１６は、蛍光体を含有しても良く、例えば、ＧａＮ系半導体材料からなる青色光を放射するＧａＮ系ＬＥＤ素子１２と、ＹＡＧ（Yttrium Aluminum Garnet）蛍光体を含有した封止材１６とを有することで青色光と黄色光との混合に基づく白色発光装置にできる。また、紫外光を放射するＬＥＤ素子１２を使用し、紫外光の励起に基づいてＲＧＢの各色を放射する蛍光体を封止材１６に含有させることで、緑色、青色、赤色の光の混合に基づいて白色を生じる白色発光装置とすることもできる。   The sealing material 16 is filled in the sealing material holding member 15 on the upper surface of the LED element 12, and is a resin material such as translucent silicone or epoxy, or a translucent and low-melting glass material. Is used. The sealing material 16 may contain a phosphor. For example, a sealing material containing a GaN-based LED element 12 that emits blue light made of a GaN-based semiconductor material and a YAG (Yttrium Aluminum Garnet) phosphor. By having the material 16, a white light emitting device based on a mixture of blue light and yellow light can be obtained. Moreover, the LED element 12 which radiates | emits ultraviolet light is used, and the phosphor which radiates | emits each color of RGB based on excitation of ultraviolet light is contained in the sealing material 16, and it mixes green, blue, and red light. Based on this, a white light emitting device that produces white color can be obtained.

次に、発光装置１の組み立て方法について説明する。   Next, a method for assembling the light emitting device 1 will be described.

図２は、発光装置１の組み立てにおいて、（ａ）〜（ｅ）の手順で組み立てることを示す図である。   FIG. 2 is a diagram illustrating assembly in the procedure of (a) to (e) in assembling the light emitting device 1.

（ａ）の工程は、ＬＥＤ素子１２を金属ベース部１１の中心に搭載し、接着剤等で固定する。   In the step (a), the LED element 12 is mounted at the center of the metal base portion 11 and fixed with an adhesive or the like.

次に、（ｂ）の工程では、外部接続用リード部１３に備えた孔部１３ｃに、接触防止部材１７を装着する。接触防止部材１７は絶縁性の樹脂等で形成されたもので、孔部１３ｃに圧入または挿入固定される。上記の手順で接触防止部材１７を備えた外部接続用リード部１３を、所定の組み立て冶具で金属ベース部１１の凹部１１ｂの内部に位置決めする。外部接続用リード部１３は、接触防止部材１７が凹部１１ｂの上壁面に接触することで金属ベース部１１に対して位置決めされてもよく、又は、上記組み立て冶具に金属ベース部１１と接触防止部材１７を備えた外部接続用リード部１３とを所定の位置関係でセットすることで金属ベース部１１に対して位置決めされてもよい。後者の方法で位置決めする場合では、上記組み立て冶具による金属ベース部１１と接触防止部材１７を備えた外部接続用リード部１３との位置決め精度がよく、外部接続用リード部１３が金属ベース部１１と接触しない場合には、外部接続用リード部１３は必ずしも接触防止部材１７を備える必要はない。いずれの位置決め方法による場合でも、外部接続用リード部１３が金属ベース部１１と接触せず、かつ、電気配線基板２０に表面実装できるように、外部接続用リード部１３の端部１３ｂの下面が金属ベース部１１の下面とほぼ面一となるようにする。   Next, in the step (b), the contact preventing member 17 is mounted in the hole 13 c provided in the external connection lead 13. The contact preventing member 17 is formed of an insulating resin or the like, and is press-fitted or inserted and fixed into the hole 13c. The external connection lead portion 13 provided with the contact preventing member 17 is positioned inside the concave portion 11b of the metal base portion 11 by a predetermined assembly jig in the above procedure. The lead portion 13 for external connection may be positioned with respect to the metal base portion 11 by the contact preventing member 17 coming into contact with the upper wall surface of the concave portion 11b, or the metal base portion 11 and the contact preventing member on the assembly jig. The external connection lead part 13 provided with 17 may be positioned with respect to the metal base part 11 by setting it in a predetermined positional relationship. In the case of positioning by the latter method, the positioning accuracy between the metal base part 11 and the external connection lead part 13 provided with the contact preventing member 17 by the assembly jig is good, and the external connection lead part 13 is connected to the metal base part 11. When not in contact, the external connection lead 13 does not necessarily need to include the contact preventing member 17. Regardless of which positioning method is used, the lower surface of the end portion 13b of the external connection lead portion 13 is arranged so that the external connection lead portion 13 does not contact the metal base portion 11 and can be surface-mounted on the electric wiring board 20. It is made to be substantially flush with the lower surface of the metal base portion 11.

（ｃ）の工程は、（ｂ）の工程で金属ベース部１１と外部接続用リード部１３が所定の位置関係でセットされた状態で、凹部１１ｂに絶縁性樹脂１４を充填する。絶縁性樹脂１４として熱硬化性樹脂を使用する場合は、充填後に加熱硬化させる。絶縁性樹脂１４の充填は、凹部１１ｂの内部に行い、金属ベース部１１の下面、すなわち、電気配線基板２０と接触する面側へ、はみ出さないように充填する。   In the step (c), the insulating resin 14 is filled in the recess 11b in a state where the metal base portion 11 and the external connection lead portion 13 are set in a predetermined positional relationship in the step (b). When a thermosetting resin is used as the insulating resin 14, it is cured by heating after filling. The insulating resin 14 is filled in the concave portion 11b so as not to protrude into the lower surface of the metal base portion 11, that is, the surface side in contact with the electric wiring board 20.

（ｄ）の工程は、ＬＥＤ素子１２と外部接続用リード部１３との接続工程であって、ワイヤボンディングによりＬＥＤ素子１２と外部接続用リード部１３の端部１３ａをワイヤ１８により接続する。   The step (d) is a step of connecting the LED element 12 and the external connection lead portion 13, and the LED element 12 and the end portion 13 a of the external connection lead portion 13 are connected by the wire 18 by wire bonding.

（ｅ）の工程は、封止材保持部材１５を金属ベース部１１の上面に固定し、封止材１６をＬＥＤ素子１２の上面で、封止材保持部材１５の中に充填することで、ＬＥＤ素子１２を封止する工程である。封止材１６に蛍光体を含有させる場合は、予め封止材１６に蛍光体を混合させたものを封止材保持部材１５の中に充填する。以上により、発光装置１が完成する。   In the step (e), the sealing material holding member 15 is fixed to the upper surface of the metal base portion 11, and the sealing material 16 is filled into the sealing material holding member 15 on the upper surface of the LED element 12, This is a step of sealing the LED element 12. When the encapsulant 16 contains a phosphor, the encapsulant holding member 15 is filled with a mixture of the encapsulant 16 and the phosphor in advance. Thus, the light emitting device 1 is completed.

次に、発光装置１の動作について説明する。例えば、外部接続用リード部１３がＬＥＤ素子１２のアノード側に接続されているとすると、外部接続用リード部１３に直流電源（図示せず）のプラス側が接続され、他端側にはマイナス側が接続される。電源供給に伴い、電流が流れ、ＬＥＤ素子１２が発光する。ＬＥＤ素子１２の上面から出た光は封止材１６内を通過して外部へ出射し、ＬＥＤ素子１２の側面部から出た光は封止材保持部材１５の内面で反射した後、封止材１６内を通過して外部へ出射する。
（第１の実施の形態の効果） Next, the operation of the light emitting device 1 will be described. For example, if the external connection lead 13 is connected to the anode side of the LED element 12, a positive side of a DC power source (not shown) is connected to the external connection lead 13, and a negative side is connected to the other end. Connected. Along with the power supply, a current flows and the LED element 12 emits light. The light emitted from the upper surface of the LED element 12 passes through the sealing material 16 and is emitted to the outside. The light emitted from the side surface of the LED element 12 is reflected by the inner surface of the sealing material holding member 15 and then sealed. The light passes through the material 16 and is emitted to the outside.
(Effects of the first embodiment)

上記した第１の実施の形態によると、以下の効果が得られる。
（１）ＬＥＤ素子１２を金属ベース部１１に搭載し、金属ベース部１１の金属部分を大きく形成したので、ＬＥＤ素子１２の発する熱を効果的に放熱することができる。
（２）外部接続用リード部１３は、ＬＥＤ素子１２と電気配線基板２０との間において、応力を緩和するための屈曲部を有しているので、外力あるいはＬＥＤ素子１２の発熱等により生じる応力を外部接続用リード部１３で吸収して、ＬＥＤ素子１２又は電気配線基板２０との接続状態を安定にでき、信頼性の高い発光装置が可能となる。
（３）外部接続用リード部１３は、電気配線基板２０の表面に実装可能な形状に形成されているので、実装密度の高い電気実装が可能となる。 According to the first embodiment described above, the following effects are obtained.
(1) Since the LED element 12 is mounted on the metal base portion 11 and the metal portion of the metal base portion 11 is formed large, the heat generated by the LED element 12 can be effectively dissipated.
(2) Since the external connection lead portion 13 has a bent portion for relieving stress between the LED element 12 and the electric wiring board 20, stress caused by external force or heat generation of the LED element 12. Can be absorbed by the external connection lead portion 13 to stabilize the connection state with the LED element 12 or the electric wiring board 20, and a highly reliable light emitting device can be realized.
(3) Since the external connection lead portion 13 is formed in a shape that can be mounted on the surface of the electrical wiring board 20, electrical mounting with a high mounting density is possible.

（第２の実施の形態）
図３は、本発明の第２の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡＡ縦断面図である。第２の実施の形態は、第１の実施の形態の構成において、金属ベース部１１は、ＬＥＤ素子１２が搭載される面を金属ベース部１１の他の面より一段高く設定した凸部１１ａを有するところに特徴がある。ＬＥＤ素子１２は、金属ベース部１１の中央で、凸部１１ａに搭載され、第１の実施の形態と同様の工程で製造される。
（第２の実施の形態の効果） (Second Embodiment)
FIG. 3 is a light emitting device using an LED element according to the second embodiment of the present invention, in which (a) is a plan view and (b) is an AA longitudinal sectional view of the light emitting device. According to the second embodiment, in the configuration of the first embodiment, the metal base portion 11 has a convex portion 11a in which the surface on which the LED element 12 is mounted is set higher than the other surface of the metal base portion 11. There is a feature in having. The LED element 12 is mounted on the convex portion 11a at the center of the metal base portion 11, and is manufactured in the same process as in the first embodiment.
(Effect of the second embodiment)

上記した第２の実施の形態によると、第１の実施の形態による効果に加え、ＬＥＤ素子１２の上面から出た光は、ＬＥＤ素子１２の取付け部分の影響を受けにくく、同じ電流で同じ発熱でも、より多くのＬＥＤ光を外部へ取出すことが可能となる。
（第３の実施の形態） According to the second embodiment described above, in addition to the effects of the first embodiment, the light emitted from the upper surface of the LED element 12 is not easily affected by the mounting portion of the LED element 12, and the same heat is generated with the same current. However, it becomes possible to extract more LED light to the outside.
(Third embodiment)

図４は、本発明の第３の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡＡ縦断面図である。第３の実施の形態は、第１の実施の形態の構成において、封止材保持部材１５の内側の斜面を、反射面１１ｃとし、また、封止材保持部材１５のＬＥＤ素子１２に対する中心位置を決めるため、金属ベース部１１に位置決め部１１ｄを設けたところに特徴がある。反射面１１ｃは、その内表面に銀蒸着、クロームや銀のメッキ、銀色又は白色の表面処理等によって鏡面状態に仕上げられていることにより、反射面が形成されている。
（第３の実施の形態の効果） FIG. 4 is a light-emitting device using an LED element according to the third embodiment of the present invention, in which (a) is a plan view and (b) is an AA longitudinal sectional view of the light-emitting device. In the configuration of the first embodiment, the third embodiment uses the inclined surface inside the sealing material holding member 15 as a reflecting surface 11c, and the central position of the sealing material holding member 15 with respect to the LED element 12 Therefore, the metal base portion 11 is provided with a positioning portion 11d. The reflective surface 11c is formed into a mirror surface state by silver deposition, chrome or silver plating, silver or white surface treatment, or the like on its inner surface, thereby forming a reflective surface.
(Effect of the third embodiment)

上記した第３の実施の形態によると、第１の実施の形態による効果に加え、ＬＥＤ素子１２の横方向から出射した光を反射面１１ｃにより前方へ効果的に導くことができ、また、封止材保持部材１５は位置決め部１１ｄにより組み立て性が容易になると共に、ＬＥＤ素子１２の中心と反射面１１ｃの中心がより一致するようになるので、対称な出射光が可能となる。
（第４の実施の形態） According to the third embodiment described above, in addition to the effect of the first embodiment, the light emitted from the lateral direction of the LED element 12 can be effectively guided forward by the reflecting surface 11c, and the sealing is performed. The stop member holding member 15 can be easily assembled by the positioning portion 11d, and the center of the LED element 12 and the center of the reflecting surface 11c are more coincident with each other.
(Fourth embodiment)

図５は、本発明の第４の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡＡ縦断面図である。第４の実施の形態は、第１の実施の形態の構成において、封止材保持部材１５の内側に、ＬＥＤ素子１２の出射光を前方へ導くレンズ部１７を設けたところに特徴がある。レンズ部１７は、封止材１６を凸状、凹状、フラット形状等に形成してもよく、また、封止材１６とは別に、樹脂あるいはガラス材で形成したレンズを封止材保持部材１５に装着してもよい。
（第４の実施の形態の効果） FIG. 5 is a light emitting device using an LED element according to the fourth embodiment of the present invention, in which (a) is a plan view and (b) is an AA longitudinal sectional view of the light emitting device. The fourth embodiment is characterized in that, in the configuration of the first embodiment, a lens portion 17 that guides the emitted light of the LED element 12 forward is provided inside the sealing material holding member 15. The lens unit 17 may be formed by forming the sealing material 16 into a convex shape, a concave shape, a flat shape, or the like. You may attach to.
(Effect of the fourth embodiment)

上記した第４の実施の形態によると、第１の実施の形態による効果に加え、レンズ部１７を、凸状、凹状、フラット形状等にできるので、レンズ形状に応じて、ＬＥＤ素子１２からの出射光を、集束光、発散光、あるいは平行光にすることができる。また、封止材保持部材１５の内側の斜面を、反射面１１ｃとすることで、より光の出射効率を高めることができる。   According to the above-described fourth embodiment, in addition to the effects of the first embodiment, the lens portion 17 can be convex, concave, flat, or the like. The emitted light can be focused light, divergent light, or parallel light. Moreover, the light emission efficiency can be further increased by setting the inner slope of the sealing material holding member 15 as the reflecting surface 11c.

（第５の実施の形態）
図６は、本発明の第５の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡＡ縦断面図である。第５の実施の形態は、第１の実施の形態の構成において、ＬＥＤ素子１２を２個搭載したもので、これに対応して、外部接続用リード部１３等を２対備えて構成されている。さらに多数のＬＥＤ素子１２を、金属ベース部１１に搭載した構成も可能である。尚、図６において、封止材保持部材１５の封止材１６が充填される部分の形状は、円形状に図示されているが、これに限らず、搭載されるＬＥＤ素子１２の個数に応じて、楕円状あるいは矩形状等であってもよい。
（第５の実施の形態の効果） (Fifth embodiment)
FIG. 6 is a light emitting device using an LED element according to the fifth embodiment of the present invention, in which (a) is a plan view and (b) is an AA longitudinal sectional view of the light emitting device. The fifth embodiment includes two LED elements 12 in the configuration of the first embodiment, and is configured to include two pairs of external connection leads 13 and the like corresponding thereto. Yes. Furthermore, the structure which mounted many LED elements 12 in the metal base part 11 is also possible. In addition, in FIG. 6, although the shape of the part with which the sealing material 16 of the sealing material holding member 15 is filled is shown circularly, it is not restricted to this, According to the number of the LED elements 12 mounted. The shape may be elliptical or rectangular.
(Effect of 5th Embodiment)

上記した第５の実施の形態によると、第１の実施の形態による効果に加え、多数のＬＥＤ素子１２を金属ベース部１１に搭載した構成であっても、外部接続用リード部１３の端部１３ｂは、電気配線基板２０の表面に実装されるので、電気配線基板２０にリード穴等が不要で、高密度実装が可能である。ＬＥＤ素子１２の数が増加するほど従来の方式に比べて効果が顕著になり、今後要求されるさらなる高密度実装に対応することができる。   According to the fifth embodiment described above, in addition to the effects of the first embodiment, the end portion of the external connection lead portion 13 even in a configuration in which a large number of LED elements 12 are mounted on the metal base portion 11. Since 13b is mounted on the surface of the electric wiring board 20, no lead hole or the like is required in the electric wiring board 20, and high-density mounting is possible. As the number of LED elements 12 increases, the effect becomes more conspicuous as compared with the conventional method, and it is possible to cope with further high-density mounting required in the future.

第１の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図、（ｃ）はＢ−Ｂ方向から見た底面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a light-emitting device using the LED element which concerns on 1st Embodiment, (a) is a top view, (b) is AA longitudinal cross-sectional view of a light-emitting device, (c) was seen from the BB direction. It is a bottom view. 発光装置１の組み立てにおいて、（ａ）〜（ｅ）の手順で組み立てることを示す図である。In the assembly of the light-emitting device 1, it is a figure which shows assembling in the procedure of (a)-(e). 第２の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図である。It is the light-emitting device using the LED element which concerns on 2nd Embodiment, (a) is a top view, (b) is AA longitudinal cross-sectional view of a light-emitting device. 第３の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図である。It is the light-emitting device using the LED element which concerns on 3rd Embodiment, (a) is a top view, (b) is AA longitudinal cross-sectional view of a light-emitting device. 第４の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図である。It is the light-emitting device using the LED element which concerns on 4th Embodiment, (a) is a top view, (b) is AA longitudinal cross-sectional view of a light-emitting device. 第５の実施の形態に係るＬＥＤ素子を用いた発光装置であり、（ａ）は平面図、（ｂ）は発光装置のＡ−Ａ縦断面図、（ｃ）はＢ−Ｂ方向から見た底面図である。It is the light-emitting device using the LED element which concerns on 5th Embodiment, (a) is a top view, (b) is AA longitudinal cross-sectional view of a light-emitting device, (c) was seen from the BB direction. It is a bottom view.

符号の説明Explanation of symbols

１…発光装置、１１…金属ベース部、１１A…開口、１２…ＬＥＤ素子、１３…外部接続用リード部、１４…絶縁性樹脂、１５…封止材保持部材、１６…封止材、１７…接触防止部材、１８…ワイヤ、２０…電気配線基板、 DESCRIPTION OF SYMBOLS 1 ... Light-emitting device, 11 ... Metal base part, 11A ... Opening, 12 ... LED element, 13 ... External connection lead part, 14 ... Insulating resin, 15 ... Sealing material holding member, 16 ... Sealing material, 17 ... Contact prevention member, 18 ... wire, 20 ... electric wiring board,

Claims (10)

電気配線基板の表面に実装される発光装置であって、
発光素子と、
前記発光素子に一端が接続され、他の一端が前記電気配線基板の表面に接続されて、前記電気配線基板との電気的接続を行う外部接続用リード部と、
前記発光素子が搭載されると共に、前記外部接続用リード部を保持するための凹部を有し、前記発光素子の熱を放熱する金属ベース部とを備え、
前記外部接続用リード部は、前記凹部に充填された絶縁性樹脂により前記凹部に保持されていることを特徴とする発光装置。 A light emitting device mounted on the surface of an electrical wiring board,
A light emitting element;
One end is connected to the light emitting element, the other end is connected to the surface of the electrical wiring board, and an external connection lead portion for electrical connection with the electrical wiring board,
The light-emitting element is mounted, and has a recess for holding the external connection lead part, and includes a metal base part that radiates heat of the light-emitting element,
The light emitting device characterized in that the external connection lead portion is held in the recess by an insulating resin filled in the recess. 前記外部接続用リード部は、前記発光素子と前記電気配線基板との間において、応力を緩和するための屈曲部を有することを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the external connection lead portion includes a bent portion for relaxing stress between the light emitting element and the electric wiring board. 前記金属ベース部は、前記発光素子の光取出し効率を向上させる凸部を有し、前記発光素子は、前記凸部に搭載されていることを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the metal base portion has a convex portion that improves light extraction efficiency of the light emitting element, and the light emitting element is mounted on the convex portion. 前記金属ベース部は、前記発光素子を封止する封止材を充填するための封止材保持部を位置決めする位置決め部を有することを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the metal base portion includes a positioning portion that positions a sealing material holding portion for filling a sealing material that seals the light emitting element. 前記金属ベース部は、前記発光素子の光取出し効率を向上させる反射部を有することを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the metal base portion includes a reflecting portion that improves light extraction efficiency of the light emitting element. 前記反射部は、前記金属ベース部と一体的に形成されていることを特徴とする請求項５に記載の発光装置。   The light emitting device according to claim 5, wherein the reflection portion is formed integrally with the metal base portion. 前記封止材保持部は、前記発光素子を封止する封止材によって形成されて前記発光素子から放射される光を集光するレンズ部を保持することを特徴とする請求項１に記載の発光装置。   The said sealing material holding | maintenance part hold | maintains the lens part which is formed with the sealing material which seals the said light emitting element, and condenses the light radiated | emitted from the said light emitting element. Light emitting device. 前記金属ベース部は、前記発光装置を前記電気配線基板へ実装するときに、前記発光装置の取付け方向の識別を容易にするための識別部を有することを特徴とする請求項１に記載の発光装置。   2. The light emitting device according to claim 1, wherein the metal base portion has an identification portion for facilitating identification of an attachment direction of the light emitting device when the light emitting device is mounted on the electric wiring board. apparatus. 発光素子が搭載されると共に、外部接続用リードを保持するための凹部を有し、前記発光素子の熱を放熱する金属ベース部に前記発光素子を取付ける素子取付け工程と、
前記金属ベース部の凹部に前記外部接続用リード部を前記金属ベース部と接触しないよう保持する保持工程と、
前記金属ベース部の前記外部接続用リード部が保持された凹部に絶縁性樹脂を充填する充填工程とを有する発光装置の製造方法。 An element mounting step of mounting the light emitting element and having a recess for holding an external connection lead, and attaching the light emitting element to a metal base portion that dissipates heat of the light emitting element;
A holding step of holding the external connection lead portion in a recess of the metal base portion so as not to contact the metal base portion;
A method of manufacturing a light emitting device, comprising: a filling step of filling an insulating resin in a recess in which the external connection lead portion of the metal base portion is held. 前記保持工程において、
外部接続用リード部に予め接触防止部材を備えた後に、前記金属ベース部の凹部に前記外部接続用リード部を保持することを特徴とする請求項９に記載の発光装置の製造方法。 In the holding step,
The method for manufacturing a light emitting device according to claim 9, wherein after the external connection lead portion is provided with a contact preventing member in advance, the external connection lead portion is held in the concave portion of the metal base portion.
JP2005168008A 2005-06-08 2005-06-08 Light-emitting device and its manufacturing method Pending JP2006344717A (en)

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JP2009152482A (en) * 2007-12-21 2009-07-09 Citizen Electronics Co Ltd Surface mounting led with reflection frame
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JPWO2017163598A1 (en) * 2016-03-24 2019-01-31 ソニー株式会社 LIGHT EMITTING DEVICE, DISPLAY DEVICE, AND LIGHTING DEVICE
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