JP2007280983A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2007280983A
JP2007280983A JP2006101527A JP2006101527A JP2007280983A JP 2007280983 A JP2007280983 A JP 2007280983A JP 2006101527 A JP2006101527 A JP 2006101527A JP 2006101527 A JP2006101527 A JP 2006101527A JP 2007280983 A JP2007280983 A JP 2007280983A
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light
package
light emitting
emitting element
emitting device
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JP2007280983A5 (en
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Naofumi Sumiya
直文 炭谷
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of simplifying a manufacturing process and securing strength as a package by forming the package integrally without exposing a protective element to light emitted from a light-emitting element, and without losing withstand voltage strength and output as the light-emitting device. <P>SOLUTION: In the light-emitting device; metal members 12a, 12b electrically connected to the light-emitting element 11 are embedded to the package 13 partially. In the light-emitting device, the light-emitting element 11 is mounted at a partial region of the metal members 12a, 12b in a recessed opening 14 formed on the surface of the package 13, and other regions in the metal members 12a, 12b in the package 13 are demarcated as protective element mounting regions by the package 13 independently of the partial region. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光装置に関し、より詳細には、保護素子が設けられた発光装置に関する。   The present invention relates to a light emitting device, and more particularly to a light emitting device provided with a protection element.

近年、小型・薄型化を目的として、表面実装型の発光装置が、ランプ型の発光装置に代わって多く使用されるようになっている。
この表面実装型の発光装置は、パッケージの内部に発光素子が備えられ、発光素子の正負の電極がそれぞれ接続される正及び負の電極としてリード端子が一体成形されて構成されている。この発光装置は、例えば、静電気が生じやすい環境で用いられる場合には、静電耐圧に対してより強いものが要求されるため、発光素子に加えて、ツェナーダイオード等の保護素子が、発光素子に近接するように設けられている。 In recent years, surface-mounted light-emitting devices are often used in place of lamp-type light-emitting devices for the purpose of miniaturization and thinning.
This surface-mount type light-emitting device includes a light-emitting element inside a package, and lead terminals are integrally formed as positive and negative electrodes to which positive and negative electrodes of the light-emitting element are connected, respectively. For example, when the light emitting device is used in an environment in which static electricity is likely to occur, a device that is stronger against electrostatic withstand voltage is required. Therefore, in addition to the light emitting element, a protective element such as a Zener diode is used. It is provided so that it may adjoin.

しかし、パッケージ内において、保護素子を発光素子に近接して併設すると、保護素子自体が、発光素子からの光を吸収することにより、発光装置としての出力が低下することがある。   However, when the protective element is provided close to the light emitting element in the package, the protective element itself may absorb light from the light emitting element, and the output as the light emitting device may be reduced.

そこで、例えば、図６に示したように、パッケージ５１内であって、リード端子５２上に、保護素子５３と発光素子５４とを載置し、これら保護素子５３と発光素子５４との間に、パッケージ５１部材とは別個に、発光素子５４からの光を所定の方向に出射させる反射部材５５を設ける発光装置が提案されている（例えば、特許文献１等）。   Therefore, for example, as shown in FIG. 6, the protective element 53 and the light emitting element 54 are placed on the lead terminal 52 in the package 51, and between the protective element 53 and the light emitting element 54. In addition to the package 51 member, there has been proposed a light emitting device provided with a reflecting member 55 that emits light from the light emitting element 54 in a predetermined direction (for example, Patent Document 1).

また、図７に示したように、パッケージ６１表面であって、リード端子６２上に、保護素子６３と発光素子６４とを載置し、保護素子６３に対しては、保護素子６３への回部からの光を遮断する遮断部６５ａ機能を有し、発光素子６４に対しては、発光素子６４からの光を所定の方向に出射させる出射部６５ｂを有する被覆部材６５を、パッケージ６１と別個に設けられた発光装置が提案されている（例えば、特許文献２等）。
特開２００５−１０９１７２号公報 特開２００２−１２４７０３号公報 Further, as shown in FIG. 7, the protective element 63 and the light emitting element 64 are placed on the lead terminal 62 on the surface of the package 61, and the protective element 63 is rotated to the protective element 63. A cover member 65 having a function of blocking a light from the light-emitting portion and having a light-emitting element 65 b that emits light from the light-emitting element 64 in a predetermined direction is separated from the package 61. Have been proposed (for example, Patent Document 2).
JP 2005-109172 A JP 2002-124703 A

しかし、図６に示したように、パッケージに反射部材を取り付ける方法では、保護素子載置領域を確保するために、パッケージと反射部材との間の接着面積が小さくなり、接着強度が低下するという問題が生じる。
また、図７に示したように、パッケージ表面にリード端子、発光素子、保護素子を載置し、その上を被覆部材で被覆する方法では、パッケージと被覆部材との強度低下が生じた場合には、リード端子等が外部から入り込む水分等によって悪影響を受け、発光装置自体の信頼性が低下するという問題がある。
本発明は、上記課題に環がみなされたものであり、保護素子を発光素子から出射される光にさらすことなく、発光装置としての耐圧強度及び出力を損なうことなく、一体的にパッケージを形成することにより、製造工程を簡略化するとともに、パッケージとしての強度を確保することができる発光装置を提供することを目的とする。 However, as shown in FIG. 6, in the method of attaching the reflective member to the package, the bonding area between the package and the reflective member is reduced in order to secure the protection element mounting region, and the adhesive strength is reduced. Problems arise.
Further, as shown in FIG. 7, in the method in which the lead terminal, the light emitting element, and the protective element are placed on the surface of the package and the top is covered with the covering member, the strength of the package and the covering member is reduced. However, there is a problem in that the reliability of the light emitting device itself is lowered due to adverse effects of moisture or the like that the lead terminals enter from the outside.
In the present invention, the ring is regarded as the above problem, and the protective element is not exposed to light emitted from the light emitting element, and the package is integrally formed without impairing the pressure resistance strength and the output as the light emitting device. Accordingly, an object of the present invention is to provide a light emitting device capable of simplifying a manufacturing process and ensuring strength as a package.

本発明の発光装置によれば、発光素子と電気的に接続される金属部材の一部がパッケージに埋め込まれてなる発光装置であって、前記発光素子が、パッケージ表面に形成された凹状開口部において金属部材の一部領域に搭載されており、かつ、パッケージ内であって前記金属部材の他の領域が、前記一部領域と独立して前記パッケージによって画定されていることを特徴とする。
このような発光装置では、他の領域が、パッケージ表面に形成された凹状開口部によってパッケージから露出し、かつ該他の領域の外周をパッケージが取り囲むように画定されているか、あるいはパッケージ内に形成された空洞としてパッケージに取り囲まれて画定されていてもよい。
また、他の領域に保護素子が搭載されていることが好ましい。
さらに、発光素子が搭載されたパッケージの凹状開口部に透光性被覆材が埋設されていることが好ましい。 According to the light-emitting device of the present invention, a part of a metal member that is electrically connected to the light-emitting element is embedded in the package, and the light-emitting element has a concave opening formed on the surface of the package. The metal member is mounted in a partial region of the metal member, and the other region of the metal member in the package is defined by the package independently of the partial region.
In such a light emitting device, the other region is exposed from the package by a concave opening formed on the surface of the package and is defined so that the outer periphery of the other region surrounds the package, or formed in the package. It may be defined surrounded by the package as a defined cavity.
Moreover, it is preferable that the protective element is mounted in another area.
Furthermore, it is preferable that a translucent coating material is embedded in the concave opening of the package on which the light emitting element is mounted.

本発明によれば、発光素子と、保護素子とを、パッケージ自体の単一の部材により確実に分離することができるために、保護素子を、発光素子から出射される光にさらすことを回避することができる。その結果、発光効率の低下を抑制することができ、高出力の発光装置を実現することができる。しかも、パッケージ自体が一体構造であるために、貼り合せ作業をなくし、貼り合せ等に伴う強度の低下を防止して、パッケージとしての強度を確保して、信頼性の高い発光素子を、簡便な製造工程によって得ることが可能となる。   According to the present invention, since the light emitting element and the protective element can be reliably separated by a single member of the package itself, the protective element is avoided from being exposed to light emitted from the light emitting element. be able to. As a result, a decrease in luminous efficiency can be suppressed, and a high-output light emitting device can be realized. In addition, since the package itself is an integral structure, the bonding work is eliminated, the strength is reduced due to the bonding, the strength as the package is ensured, and a highly reliable light-emitting element is easily obtained. It can be obtained by a manufacturing process.

本発明の発光装置は、主として、発光素子と、発光素子と電気的に接続される金属部材と、パッケージとから構成される。
（発光素子）
発光素子は、半導体発光素子であればよく、いわゆる発光ダイオードと呼ばれる素子であればどのようなものでもよい。例えば、基板上に、ＩｎＮ、ＡｌＮ、ＧａＮ、ＩｎＧａＮ、ＡｌＧａＮ、ＩｎＧａＡｌＮ等の窒化物半導体、III-V族化合物半導体、II-VI族化合物半導体等、種々の半導体によって、活性層を含む積層構造が形成されたものが挙げられる。半導体の構造としては、ＭＩＳ接合、ＰＩＮ接合、ＰＮ接合などのホモ構造、ヘテロ結合あるいはダブルヘテロ結合のものが挙げられる。また、半導体活性層を量子効果が生ずる薄膜に形成させた単一量子井戸構造、多重量子井戸構造としてもよい。活性層には、Ｓｉ、Ｇｅ等のドナー不純物及び／又はＺｎ、Ｍｇ等のアクセプター不純物がドープされる場合もある。得られる発光素子の発光波長は、半導体の材料、混晶比、活性層のＩｎＧａＮのＩｎ含有量、活性層にドープする不純物の種類を変化させるなどによって、紫外領域から赤色まで変化させることができる。 The light emitting device of the present invention mainly includes a light emitting element, a metal member electrically connected to the light emitting element, and a package.
(Light emitting element)
The light emitting element may be a semiconductor light emitting element, and any element may be used as long as it is an element called a light emitting diode. For example, a laminated structure including an active layer is formed on a substrate by various semiconductors such as nitride semiconductors such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN, III-V group compound semiconductors, and II-VI group compound semiconductors. What was formed is mentioned. Examples of the semiconductor structure include a homostructure such as a MIS junction, a PIN junction, and a PN junction, a hetero bond, and a double hetero bond. Alternatively, the semiconductor active layer may have a single quantum well structure or a multiple quantum well structure in which a thin film in which a quantum effect is generated is formed. The active layer may be doped with donor impurities such as Si and Ge and / or acceptor impurities such as Zn and Mg. The emission wavelength of the resulting light-emitting element can be changed from the ultraviolet region to red by changing the semiconductor material, the mixed crystal ratio, the In content of InGaN in the active layer, the type of impurities doped in the active layer, etc. .

このような発光素子は、後述する金属部材に搭載される。発光素子を金属部材に搭載するためには、接合部材が用いられる。例えば、青及び緑発光を有し、サファイア基板上に窒化物半導体を成長させた発光素子の場合には、エポキシ樹脂、シリコーン等を用いることができる。また、発光素子からの光や熱による劣化を考慮して、発光素子裏面にＡｌメッキをしてもよいし、樹脂を使用せず、Ａｕ−Ｓｎ共晶などの半田、低融点金属等のろう材を用いてもよい。さらに、ＧａＡｓ等からなり、赤色発光を有する発光素子のように、両面に電極が形成された発光素子の場合には、銀、金、パラジウムなどの導電性ペースト等によってダイボンディングしてもよい。   Such a light emitting element is mounted on a metal member to be described later. In order to mount the light emitting element on the metal member, a bonding member is used. For example, in the case of a light emitting element having blue and green light emission and having a nitride semiconductor grown on a sapphire substrate, epoxy resin, silicone, or the like can be used. In consideration of deterioration from light and heat from the light emitting element, the back surface of the light emitting element may be plated with Al, without using resin, solder such as Au—Sn eutectic, low melting point metal, etc. A material may be used. Furthermore, in the case of a light emitting element made of GaAs or the like and having electrodes formed on both sides thereof, such as a light emitting element that emits red light, die bonding may be performed using a conductive paste such as silver, gold, or palladium.

（金属部材）
金属部材は、通常、発光素子と電気的に接続され、一般にリード電極としての機能を有する。また、発光素子及び任意に保護素子を載置する役割を果たす。金属部材は、通常、その一部がパッケージ内に埋設されているため、パッケージ内で、発光素子等の載置台及びリード電極として機能する部分を内部端子、パッケージ外にまで延設され、外部端子との電気的な接続をとる機能を有する部分を外部端子ともいう。従って、これらの機能を果たすことができるものであれば、その材料は特に限定されないが、例えば、熱伝導率の比較的大きな材料で形成することが好ましい。このような材料で形成することにより、発光素子で発生する熱を効率的に逃がすことができる。例えば、２００Ｗ／（ｍ・Ｋ）程度以上の熱伝導率を有しているもの、比較的大きい機械的強度を有するもの、あるいは打ち抜きプレス加工又はエッチング加工等が容易な材料が好ましい。例えば、銅、アルミニウム、金、銀、タングステン、鉄、ニッケル等の金属又は鉄−ニッケル合金、燐青銅、鉄入り銅等あるいはこれらの表面に銀、アルミニウム、銅、金等の金属メッキ膜が施こされたもの等が挙げられる。なお、金属部材の表面は反射率を向上させるために平滑であることが好ましい。 (Metal member)
The metal member is usually electrically connected to the light emitting element and generally has a function as a lead electrode. It also plays a role of placing a light emitting element and optionally a protective element. Since a part of the metal member is normally embedded in the package, the part that functions as a mounting base for the light emitting element and the lead electrode in the package is extended to the internal terminal and the outside of the package, and the external terminal A portion having a function of making an electrical connection to is also referred to as an external terminal. Therefore, the material is not particularly limited as long as it can perform these functions. For example, the material is preferably formed of a material having a relatively large thermal conductivity. By forming with such a material, heat generated in the light emitting element can be efficiently released. For example, a material having a thermal conductivity of about 200 W / (m · K) or more, a material having a relatively large mechanical strength, or a material that can be easily punched or etched is preferable. For example, metal such as copper, aluminum, gold, silver, tungsten, iron, nickel or iron-nickel alloy, phosphor bronze, iron-containing copper, etc. or a metal plating film such as silver, aluminum, copper, gold, etc. is applied to the surface. Examples include rubbed ones. In addition, it is preferable that the surface of a metal member is smooth in order to improve a reflectance.

金属部材は、１つの発光装置において、２本以上、金属部材に搭載する発光素子の数＋１本以上、あるいは、金属部材に搭載する発光素子の数の２倍本以上であることが適当である。例えば、発光素子が１つのみ搭載される場合には、金属部材の一方に発光素子を載置するとともに、発光素子の一方の電極と電気的な接続をとり、他の金属部材が発光素子の別の電極との電気的接続をとる。   It is appropriate that the number of the metal members in one light emitting device is two or more, the number of light emitting elements mounted on the metal member + 1 or more, or two or more times the number of light emitting elements mounted on the metal member. . For example, when only one light emitting element is mounted, the light emitting element is placed on one of the metal members, and is electrically connected to one electrode of the light emitting element, and the other metal member is the light emitting element. Make electrical connection with another electrode.

発光素子が２つ以上搭載される場合には、発光素子の全て又は数個を１つの金属部材に載置し、電気的な接続をとり、さらに別の金属部材が各発光素子に対応してそれぞれ別の電気的な接続をとってもよい。好ましくは、発光素子それぞれを別個の金属部材に載置するとともに、電気的な接続をとり、さらに別の金属部材が各発光素子に対応してそれぞれ別の電気的な接続をとるように構成される。このように、発光素子が複数搭載され、それぞれについて、独立して金属部材と電気的に接続されるような独立配線をすることによって、発光装置の実装面において、直列又は並列等、種々の配線パターンを選択することが可能となり、自由な回路設計ができる。また、独立配線の場合、載置される発光素子の発光強度を調整することが容易となるため、特に、フルカラーＬＥＤ等の異なった発光色を有する複数の発光素子を使用する際に有利である。加えて、各発光素子の放熱経路を重複させることなく形成できるため、各発光素子から発生した熱を均等に放熱でき、より放熱性が良好となる。   When two or more light-emitting elements are mounted, all or several of the light-emitting elements are placed on one metal member for electrical connection, and another metal member corresponds to each light-emitting element. Different electrical connections may be made. Preferably, each of the light emitting elements is mounted on a separate metal member and is electrically connected, and another metal member is configured to have a separate electrical connection corresponding to each light emitting element. The In this way, a plurality of light emitting elements are mounted, and for each of them, independent wiring that is electrically connected to a metal member independently, various wirings such as series or parallel on the mounting surface of the light emitting device. It is possible to select a pattern and design a free circuit. In addition, in the case of the independent wiring, it is easy to adjust the light emission intensity of the light emitting element to be mounted, which is particularly advantageous when using a plurality of light emitting elements having different light emission colors such as full color LEDs. . In addition, since the heat dissipation paths of the light emitting elements can be formed without overlapping, the heat generated from the light emitting elements can be evenly dissipated, and the heat dissipation becomes better.

また、発光素子と電気的に接続されず、発光素子を載置するのみ又は発光素子を載置しないものが備えられていてもよい。このような金属部材は、パッケージ内において、発光素子から生じた熱を外部に導く放熱経路として、また、過電圧対策として機能し得る。   Further, a device that is not electrically connected to the light-emitting element and that only mounts the light-emitting element or does not mount the light-emitting element may be provided. Such a metal member can function as a heat dissipation path for guiding heat generated from the light emitting element to the outside in the package and as a countermeasure against overvoltage.

金属部材の形状は、特に限定されず、発光素子の個数、配列、配置可能なスペース等を考慮して適宜決定することができる。例えば、内部端子を構成する金属部材の大きさ及び形状等は、放熱性を高め、配置される発光素子の温度上昇を効果的に抑制することができ、発光素子により多くの電流を投入することができ、ワイヤボンディングの作業性を容易とする、さらには、後述するパッケージを構成する材料等との熱膨張係数の差異に起因する金属部材とパッケージとの間で剥離、発光素子の位置ずれ及び剥がれ等を考慮して適宜調整することが好ましい。   The shape of the metal member is not particularly limited, and can be appropriately determined in consideration of the number of light emitting elements, the arrangement, the space in which the light emitting elements can be arranged, and the like. For example, the size and shape of the metal member constituting the internal terminal can increase heat dissipation, effectively suppress the temperature rise of the arranged light emitting element, and supply more current to the light emitting element. The wire bonding workability is facilitated, and the metal member and the package are peeled off due to the difference in thermal expansion coefficient from the material constituting the package, which will be described later. It is preferable to adjust appropriately in consideration of peeling or the like.

なお、金属部材の延設方向は、特に限定されるものではなく、実装のタイプ（例えば、サイドビュータイプ、トップビュータイプ等）を考慮して、適宜調整することができる。例えば、図１（ａ）及び（ｂ）に示したように、発光素子が載置される金属部材を、パッケージの長手方向に並置し、発光素子が載置される金属部材を挟み込むようにして、発光素子の並置方向のパッケージ端部に、ワイヤボンディング用の金属部材を配置し、各金属部材を、パッケージの短手方向の一面から外部に突出させるように延設させる態様が挙げられる。これにより、厚さ方向の長さをより短くすることができるサイドビュータイプの発光装置を得ることができる。その結果、この発光装置を、バックライト等に用いることにより、バックライトをより薄型にすることができる。また、パッケージの同一面から外部へ突出した金属部材を、突出面に沿って、発光装置の発光面方向及び背面方向に向かって、交互に折り曲げることにより、パッケージにおける金属部材の突出面を、安定性よく実装基板に接続することができるとともに、各金属部材間に、十分な距離を設けることができるため、基板に実装する際、実装精度に対し十分な余裕度を確保でき、電極間のショート等を防ぐことができる。ただし、金属部材は、必ずしもパッケージの同一面から外部に突出させる必要はなく、異なる複数の面から外部に突出させてもよいし、全ての金属部材を、発光装置の背面方向に向かって折り曲げることにより、トップビュータイプの発光装置としてもよい。また、図２に示したように、金属部材の全てを同一面から外部に突出させ、そのまま屈曲させることなく、サイドビュータイプの実装基板への嵌合型の発光装置としてもよい。   The extending direction of the metal member is not particularly limited, and can be appropriately adjusted in consideration of the mounting type (for example, side view type, top view type, etc.). For example, as shown in FIGS. 1A and 1B, the metal member on which the light emitting element is placed is juxtaposed in the longitudinal direction of the package, and the metal member on which the light emitting element is placed is sandwiched between them. An example is an embodiment in which a metal member for wire bonding is disposed at the package end in the juxtaposition direction of the light emitting elements, and each metal member is extended so as to protrude outward from one surface in the short direction of the package. Thereby, the side view type light-emitting device which can shorten the length of the thickness direction more can be obtained. As a result, the backlight can be made thinner by using the light emitting device for a backlight or the like. In addition, the metal member protruding outward from the same surface of the package is alternately bent along the protruding surface toward the light emitting surface direction and the back surface direction of the light emitting device, thereby stabilizing the protruding surface of the metal member in the package. Since it can be connected to the mounting board with good performance and a sufficient distance can be provided between each metal member, a sufficient margin can be secured for mounting accuracy when mounting on the board, and a short circuit between the electrodes Etc. can be prevented. However, the metal member does not necessarily have to protrude outward from the same surface of the package, and may protrude outward from a plurality of different surfaces, or all metal members may be bent toward the back side of the light emitting device. Thus, a top view type light emitting device may be used. Further, as shown in FIG. 2, all of the metal members may protrude from the same surface to the outside, and may be a fitting type light emitting device to a side view type mounting board without being bent as it is.

金属部材は、一部領域上に発光素子を載置している。この一部領域は、パッケージ表面に形成された凹状開口部内に、パッケージから露出するように配置する領域である。この一部領域での発光素子の金属部材への電気的な接続は、金属部材に対して、ワイヤを用いたワイヤボンディングによって行うことができる。   The metal member has the light emitting element mounted on a partial region. This partial region is a region that is disposed so as to be exposed from the package in a concave opening formed on the surface of the package. The electrical connection of the light emitting element to the metal member in this partial region can be performed by wire bonding using a wire to the metal member.

ワイヤとしては、発光素子の電極とのオーミック性が良好であるか、機械的接続性が良好であるか、電気伝導性及び熱伝導性が良好なものであることが好ましい。熱伝導率としては、０．０１ｃａｌ／Ｓ・ｃｍ2・℃／ｃｍ程度以上が好ましく、さらに０．５ｃａｌ／Ｓ・ｃｍ2・℃／ｃｍ程度以上がより好ましい。作業性などを考慮すると、ワイヤの直径は、１０μｍ〜４５μｍ程度であることが好ましい。このようなワイヤとしては、例えば、金、銅、白金、アルミニウム等の金属及びそれらの合金が挙げられる。ワイヤは、発光素子とワイヤボンデイング用の金属部材と、ワイヤボンディング機器によって容易に接続することができる。 The wire preferably has good ohmic properties with the electrode of the light emitting element, good mechanical connectivity, or good electrical and thermal conductivity. The thermal conductivity, preferably 0.01cal / S · cm 2 · ℃ / than about cm further 0.5cal / S · cm 2 · ℃ / cm or higher order is more preferable. Considering workability and the like, the diameter of the wire is preferably about 10 μm to 45 μm. Examples of such wires include metals such as gold, copper, platinum, and aluminum, and alloys thereof. The wire can be easily connected to the light emitting element, the metal member for wire bonding, and the wire bonding apparatus.

（パッケージ）
パッケージは、上述した金属部材の一部を一体的に埋め込み、塊状に封止することができ、発光素子及び金属部材に対して、絶縁性を確保することができるものであれば、どのような材料によって形成されていてもよい。例えば、ポリフタルアミド（ＰＰＡ）、ポリカーボネート樹脂、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）、ＡＢＳ樹脂、エポキシ樹脂、フェノール樹脂、アクリル樹脂、ＰＢＴ樹脂等の樹脂、セラミック等が挙げられる。また、これらの材料には、パッケージ内に搭載される発光素子の光が、後述する保護素子に照射されないようにするために、発光素子の発光光に対して遮光性を有することが必要である。そのため、着色剤又は光拡散剤として、種々の染料又は顔料等を混合して用いてもよい。着色剤としては、Ｃｒ2Ｏ3、ＭｎＯ2、Ｆｅ2Ｏ3、カーボンブラック等が挙げられ、光拡散剤としては、炭酸カルシウム、酸化アルミニウム、酸化チタン等が挙げられる。光拡散剤を混合することにより、反射率の高い白色パッケージを構成させることができる。なお、パッケージは、後述する開口部が、通常、透光性被覆材で埋め込まれるため、発光素子等から生じた熱の影響を受けた場合のパッケージ材料と透光性被覆材との密着性等を考慮して、これらの熱膨張係数の差の小さいものを選択することが好ましい。 (package)
Any package can be used as long as a part of the above-described metal member can be embedded integrally and sealed in a lump shape, and insulation can be secured to the light emitting element and the metal member. It may be formed of a material. Examples thereof include polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, epoxy resin, phenol resin, acrylic resin, resin such as PBT resin, ceramic, and the like. In addition, these materials are required to have a light shielding property with respect to the light emitted from the light emitting element in order to prevent the light emitted from the light emitting element mounted in the package from being irradiated to the protective element described later. . Therefore, various dyes or pigments may be mixed and used as the colorant or light diffusing agent. Examples of the colorant include Cr 2 O 3 , MnO 2 , Fe 2 O 3 , and carbon black. Examples of the light diffusing agent include calcium carbonate, aluminum oxide, and titanium oxide. By mixing the light diffusing agent, a white package with high reflectance can be configured. In addition, since the opening part mentioned later is normally embedded with the translucent coating | covering material, the adhesiveness of the package material and translucent coating | covering material at the time of receiving the influence of the heat which generate | occur | produced from the light emitting element etc. In consideration of the above, it is preferable to select one having a small difference between these thermal expansion coefficients.

パッケージは、金属部材（好ましくは、複数）がインサートされて閉じられた金型内に、パッケージの下面側に対応する箇所に形成されたゲートから、溶融した上記材料を流し込み、硬化させることにより、それ自体を一体的に形成することができる。ここで、それ自体が一体的に形成されているとは、パッケージとして機能する部材は、単一のものであり、複数の部材を接着又は接合等によって一つの形状に組み立てたものではないことを意味する。このように一体的に構成されることにより、それ自体の強度を増加させ、剥がれ等によって生じる埋設金属部材又は素子に対する悪影響を排除することができる。   The package is made by pouring the molten material from a gate formed at a location corresponding to the lower surface side of the package into a mold in which a metal member (preferably a plurality) is inserted and closed, It can be formed integrally. Here, the fact that the member itself is integrally formed means that the member that functions as a package is a single member, and that a plurality of members are not assembled into one shape by bonding or joining. means. By being integrally configured in this way, the strength of itself can be increased, and adverse effects on the embedded metal member or element caused by peeling or the like can be eliminated.

パッケージの大きさ及び形状は特に限定されるものではなく、例えば、円、楕円、三角形、四角形、多角形柱又はこれらに近似する形状等どのような形状でもよい。一実施形態として、図１（ａ）及び（ｂ）に示すように、少なくとも２本の金属部材を、好ましくは、それぞれの発光素子が個別に配される複数の金属部材と発光素子が載置される複数の金属部材とを挟み込むように、パッケージの長手方向に長く、短手方向の厚さを最小限にした四角柱が挙げられる。また、図２に示すように、パッケージの奥行きを最小限にした平板形状等が挙げられる。   The size and shape of the package are not particularly limited, and may be any shape such as a circle, an ellipse, a triangle, a quadrangle, a polygonal column, or a shape similar to these. As an embodiment, as shown in FIGS. 1A and 1B, at least two metal members, preferably a plurality of metal members and light emitting elements on which the respective light emitting elements are individually arranged, are mounted. For example, there is a quadrangular column that is long in the longitudinal direction of the package and has a minimum thickness in the short-side direction so as to sandwich the plurality of metal members. Moreover, as shown in FIG. 2, the flat shape etc. which minimized the depth of the package are mentioned.

パッケージの表面には、発光素子を搭載するための凹状開口部が形成されている。この凹状開口部の形状は特に限定されるものではなく、凹状開口部内、好ましくは凹状開口部の底面に、発光素子を載置し、電気的な接続をとる金属部材が露出させるものであれば、円、楕円、三角形、四角形もしくは多角形柱、ドーム状、碗状等又はこれらに近似する形状が挙げられる。また、大きさ及び深さ等は、搭載する発光素子の数、ボンディング方法等によって適宜調整することができる。なお、この凹状開口部の底面及び／又は側面は、エンボス加工又はプラズマ処理などで、接着面積を増加させ、後述する透光性被覆部材との密着性を向上させることが好ましい。   A concave opening for mounting the light emitting element is formed on the surface of the package. The shape of the concave opening is not particularly limited as long as the light emitting element is placed in the concave opening, preferably on the bottom surface of the concave opening, and the metal member for electrical connection is exposed. , A circle, an ellipse, a triangle, a quadrangular or polygonal column, a dome shape, a bowl shape, and the like, or a shape similar to these. The size, depth, and the like can be adjusted as appropriate depending on the number of light emitting elements to be mounted, a bonding method, and the like. In addition, it is preferable that the bottom surface and / or side surface of this concave opening part increase an adhesion area by embossing or plasma processing, etc., and improve adhesiveness with the translucent coating | coated member mentioned later.

また、パッケージ内においては、他の領域が確保されている。ここでの他の領域とは、素子、好ましくは保護素子を搭載するための領域であって、この領域は、パッケージ内部に埋め込まれた金属部材上の領域、つまり、上述した凹状開口部内に位置する金属部材の一部領域とは異なる領域（以下、「他の領域」と記すことがある）であって、かつ、一部領域とは独立した領域を指す。ここで、独立した領域とは、それぞれの領域がパッケージ自体によって分離されており、他の領域がパッケージ自体によって画定されていることを意味する。   Also, other areas are secured in the package. The other region here is a region for mounting an element, preferably a protective element, and this region is located on the metal member embedded in the package, that is, in the concave opening described above. This is a region that is different from a partial region of the metal member (hereinafter, may be referred to as “other region”) and is independent of the partial region. Here, the independent region means that each region is separated by the package itself, and other regions are defined by the package itself.

従って、他の領域は、パッケージ表面に形成された凹状開口部によってパッケージから露出し、その外周をパッケージ自体が壁となって、取り囲むように画定されていてもよいし（図１中の１５又図２中の２５参照）、パッケージ内に形成された空洞としてパッケージに取り囲まれて画定されていてもよい（図３中の３５参照）。つまり、前者の場合、他の領域としてパッケージ表面に形成された凹状開口部の底面と側面とが一体的につながっており、その側面によって、発光素子から出射された光が略完全に遮光され、そこに搭載される保護素子に光が照射されないことを意味する。また、後者の場合、他の領域は、その側面及び上面がパッケージ材料によって略完全に被覆され、その被覆によって、発光素子から出射された光が略完全に遮光され、そこに搭載される保護素子に光が照射されないことを意味する。なお、他の領域に配置される金属部材は、保護素子を搭載して機能させることができる程度であることが好ましい。   Therefore, the other region may be defined so as to be exposed from the package by a concave opening formed on the surface of the package and to surround the outer periphery of the package with the package itself as a wall (see 15 or 15 in FIG. 1). It may be defined by being surrounded by the package as a cavity formed in the package (see 25 in FIG. 2) (see 35 in FIG. 3). That is, in the former case, the bottom surface and the side surface of the concave opening formed on the package surface as another region are integrally connected, and the light emitted from the light emitting element is almost completely shielded by the side surface, It means that light is not irradiated to the protective element mounted there. In the latter case, in the other region, the side surface and the upper surface thereof are almost completely covered with the package material, and the light emitted from the light emitting element is almost completely shielded by the covering, and the protective element mounted thereon Means that no light is irradiated. In addition, it is preferable that the metal member arrange | positioned in another area | region is a grade which can mount and function a protection element.

他の領域は、保護素子が搭載可能な状態であればよく、必ずしも保護素子が搭載されていなくてもよい。他の領域の形状、大きさ及び深さは、保護素子を搭載し得るものであれば、凹状開口部と同様に、どのような形状、大きさ、深さであってもよい。また、凹状開口部と同様に、接着面積を増加させるような加工等が施されていることが好ましい。他の領域は、その形状等によって１つ又は２以上の保護素子を搭載することができるように形成されていてもよいし、１つの発光装置に２つ以上、例えば、複数の発光素子が搭載されている場合には、それぞれの発光素子に対して保護素子を搭載することができるように、複数の他の領域が形成されていてもよい。ここで、保護素子は、特に限定されるものではなく、発光装置に搭載される公知のもののいずれでもよい。具体的には、過熱、過電圧、過電流、保護回路、静電保護素子等が挙げられる。   The other region may be in a state where the protection element can be mounted, and the protection element does not necessarily have to be mounted. The shape, size, and depth of the other region may be any shape, size, and depth as in the case of the concave opening as long as the protective element can be mounted. Moreover, it is preferable that the process etc. which increase an adhesion area are given like the recessed opening part. The other region may be formed so that one or two or more protective elements can be mounted depending on the shape or the like, or two or more, for example, a plurality of light emitting elements are mounted on one light emitting device. In such a case, a plurality of other regions may be formed so that a protective element can be mounted on each light emitting element. Here, the protective element is not particularly limited, and may be any known element mounted on the light emitting device. Specifically, overheating, overvoltage, overcurrent, a protection circuit, an electrostatic protection element, etc. are mentioned.

本発明の発光装置においては、発光素子が載置された凹状開口部内に、透光性被覆材が埋め込まれていることが好ましい。透光性被覆材は、外力、水分等から発光素子を保護することができるとともに、ワイヤを保護することもできる。透光性被覆材としては、エポキシ樹脂、シリコーン樹脂、アクリル樹脂、ユリア樹脂等の耐候性に優れた透明樹脂又は硝子等が挙げられる。特に、透明樹脂は、工程中あるいは保管中に透光性被覆材内に水分が含まれてしまった場合においても、１００℃で１４時間以上のベーキングを行うことによって、樹脂内に含有された水分を外気へ逃がすことができる。従って、水蒸気爆発、発光素子とモールド部材との剥がれを防止することができる。   In the light emitting device of the present invention, it is preferable that a translucent covering material is embedded in the concave opening on which the light emitting element is placed. The translucent coating material can protect the light emitting element from external force, moisture, and the like, and can also protect the wire. Examples of the translucent coating material include transparent resins or glass having excellent weather resistance such as epoxy resins, silicone resins, acrylic resins, urea resins, and the like. In particular, the transparent resin contains moisture contained in the resin by baking at 100 ° C. for 14 hours or more even when moisture is contained in the translucent coating material during the process or during storage. Can escape to the open air. Accordingly, it is possible to prevent water vapor explosion and peeling of the light emitting element and the mold member.

また、透光性被覆材には、拡散剤又は蛍光物質を含有させてもよい。拡散剤は、光を拡散させるものであり、発光素子からの指向性を緩和させ、視野角を増大させることができる。蛍光物質は、発光素子からの光を変換させるものであり、発光素子からパッケージの外部へ出射される光の波長を変換することができる。発光素子からの光がエネルギーの高い短波長の可視光の場合、有機蛍光体であるペリレン系誘導体、ＺｎＣｄＳ：Ｃｕ、ＹＡＧ：Ｃｅ、Ｅｕ及び／又はＣｒで賦活された窒素含有ＣａＯ−Ａｌ2Ｏ3−ＳｉＯ2などの無機蛍光体など、種々好適に用いられる。本発明において、白色光を得る場合、特にＹＡＧ：Ｃｅ蛍光体を利用すると、その含有量によって青色発光素子からの光と、その光を一部吸収して補色となる黄色系が発光可能となり白色系が比較的簡単に信頼性良く形成できる。同様に、Ｅｕ及び／又はＣｒで賦活された窒素含有ＣａＯ−Ａｌ2Ｏ3−ＳｉＯ2蛍光体を利用した場合は、その含有量によって青色発光素子からの光と、その光を一部吸収して補色となる赤色系が発光可能であり白色系が比較的簡単に信頼性よく形成できる。また、蛍光体を完全に沈降させ、気泡を除くことで色むらを低減させることができる。 Further, the light-transmitting coating material may contain a diffusing agent or a fluorescent substance. The diffusing agent diffuses light and can reduce the directivity from the light emitting element and increase the viewing angle. The fluorescent substance converts light from the light emitting element, and can convert the wavelength of light emitted from the light emitting element to the outside of the package. When the light from the light-emitting element is high-energy short-wavelength visible light, nitrogen-containing CaO—Al 2 O activated with perylene derivatives, organic phosphors, ZnCdS: Cu, YAG: Ce, Eu and / or Cr Various inorganic phosphors such as 3- SiO 2 are suitably used. In the present invention, when white light is obtained, in particular, when a YAG: Ce phosphor is used, light from the blue light emitting element and a yellow color which is a complementary color by partially absorbing the light can be emitted depending on the content. The system can be formed relatively easily and reliably. Similarly, when a nitrogen-containing CaO—Al 2 O 3 —SiO 2 phosphor activated with Eu and / or Cr is used, light from the blue light-emitting element and a part of the light are absorbed depending on its content. Thus, a red color which is a complementary color can emit light, and a white color can be formed relatively easily and with high reliability. In addition, color unevenness can be reduced by completely precipitating the phosphor and removing bubbles.

さらに、保護素子がすでに他の領域に搭載されている場合には、他の領域に形成された凹状開口部内に、上述したパッケージ材料又は透光性被覆材を埋め込んでもよい。これにより、保護素子、金属部材及びワイヤを保護することができる。   Furthermore, when the protective element is already mounted in another region, the above-described package material or translucent covering material may be embedded in the concave opening formed in the other region. Thereby, a protection element, a metal member, and a wire can be protected.

以下に、本発明の発光装置の実施例を図面に基づいて詳細に説明する。   Embodiments of the light emitting device according to the present invention will be described below in detail with reference to the drawings.

実施例１
この実施例の発光装置１０は、図１（ａ）及び（ｂ）に示したように、サイドビュータイプの表面実装型発光装置であって、発光素子１１を載置する金属部材１２ａの一端と、発光素子１１と電気的に接続される金属部材１２ｂの一端がパッケージ１３に埋設され、他端が、パッケージ１３の一面において突出し、屈曲されて外部端子と機能するように構成されている。 Example 1
As shown in FIGS. 1A and 1B, the light-emitting device 10 of this embodiment is a side-view type surface-mounted light-emitting device, and includes one end of a metal member 12a on which the light-emitting element 11 is placed. One end of the metal member 12b electrically connected to the light emitting element 11 is embedded in the package 13, and the other end protrudes on one surface of the package 13 and is bent to function as an external terminal.

金属部材１２ａ、１２ｂは、例えば、０．１５ｍｍ厚の銀メッキ銅板をプレスを用いた打ち抜き加工により形成されたものである。
パッケージ１３に埋設された金属部材１２ａ、１２ｂの一部の領域は、パッケージ１３に形成された凹状の開口部１４（例えば、０．４５ｍｍ×３ｍｍの矩形×最大深さ０．６ｍｍ）から露出しており、その露出した金属部材１２ａ、１２ｂの上に、発光素子１１がダイボンディングされている。 For example, the metal members 12a and 12b are formed by punching a silver-plated copper plate having a thickness of 0.15 mm using a press.
Part of the metal members 12a and 12b embedded in the package 13 is exposed from a concave opening 14 formed in the package 13 (for example, a 0.45 mm × 3 mm rectangle × maximum depth 0.6 mm). The light emitting element 11 is die-bonded on the exposed metal members 12a and 12b.

ここで、発光素子１１は、サファイア基板上にｎ型ＧａＮよりなるｎ型コンタクト層と、ｎ型ＡｌＧａＮよりなるｎ型クラッド層と、ＩｎＮ、ＡｌＮ、ＧａＮ、ＩｎＧａＮ、ＡｌＧａＮ、ＩｎＧａＡｌＮ等の窒化物半導体からなる発光層と、ｐ型ＡｌＧａＮ又はＩｎＧａＮよりなるｐ型クラッド層と、ｐ型ＧａＮよりなるｐ型コンタクト層とが順次に積層されて、主波長が約４７０ｎｍの青色発光を有するＩｎＧａＮ半導体、主波長が約５２５ｎｍの緑色発光を有するＩｎＧａＮ半導体及び主波長が約６３０ｎｍの赤色発光を有するＡｌＩｎＧａＮ／ＧａＡｓ半導体によって、それぞれ形成されている。   Here, the light emitting element 11 includes an n-type contact layer made of n-type GaN on an sapphire substrate, an n-type clad layer made of n-type AlGaN, and a nitride semiconductor such as InN, AlN, GaN, InGaN, AlGaN, and InGaAlN. A light-emitting layer made of p-type AlGaN or a p-type cladding layer made of InGaN and a p-type contact layer made of p-type GaN are sequentially stacked, and an InGaN semiconductor having a blue light emission having a main wavelength of about 470 nm, They are formed of an InGaN semiconductor having a green emission with a wavelength of about 525 nm and an AlInGaN / GaAs semiconductor having a red emission with a dominant wavelength of about 630 nm.

発光素子１１のダイボンデイングは、例えば、赤色発光を有する発光素子については銀ペーストを用い、青色発光及び緑色発光を有する発光素子については、エポキシ樹脂を用いて行う。また、直径１０μｍの金線からなるワイヤによって、発光素子１１に形成された電極（図示せず）と金属部材１２ａ、１２ｂとの接続が行われている。   The die bonding of the light emitting element 11 is performed using, for example, a silver paste for a light emitting element having red light emission, and using an epoxy resin for a light emitting element having blue light emission and green light emission. Further, an electrode (not shown) formed on the light emitting element 11 and the metal members 12a and 12b are connected by a wire made of a gold wire having a diameter of 10 μm.

パッケージ１３は、発光素子１１が搭載される開口部１４以外に、さらに他の領域として、保護素子搭載領域である開口部１５を有している。この開口部１５は、発光素子１１が搭載される開口部１４とは独立して、例えば、０．４５ｍｍ×０．３５ｍｍの矩形×最大深さ０．６ｍｍで形成されている。つまり、パッケージ１３自体の一部１３ａが、保護素子搭載領域を画定するために、開口部１５を取り囲む壁の役割を果たしている。
このような開口部１５内には、金属部材１２ａ、１２ｂの一部が露出されており、その上に、図示しないが、保護素子が搭載される。 The package 13 has an opening 15 which is a protection element mounting area as another area in addition to the opening 14 where the light emitting element 11 is mounted. The opening 15 is formed independently of the opening 14 in which the light emitting element 11 is mounted, for example, a rectangle of 0.45 mm × 0.35 mm × a maximum depth of 0.6 mm. That is, a part 13 a of the package 13 itself serves as a wall surrounding the opening 15 in order to define the protection element mounting region.
A part of the metal members 12a and 12b is exposed in the opening 15 and a protective element is mounted on the metal members 12a and 12b.

発光素子１１が搭載されたパッケージ１３の開口部１４内に、保護素子が搭載されている場合には開口部１５内にも、エポキシ樹脂からなる透光性被覆材１６が充填され、硬化されている。また、パッケージ１３外部に突出した金属部材１２ａ、１２ｂは、それぞれ突出面に沿って、交互に折り曲げられ、個々に分離されている。   When the protective element is mounted in the opening 14 of the package 13 on which the light emitting element 11 is mounted, the transparent coating material 16 made of epoxy resin is also filled in the opening 15 and cured. Yes. Further, the metal members 12a and 12b protruding to the outside of the package 13 are alternately bent along the protruding surfaces and separated individually.

このような構成の発光装置によれば、発光素子１１と、保護素子とを、一体的なパッケージ１３自体の一部１３ａによって、確実に分離することができるために、保護素子を、発光素子１１から出射される光にさらすことを回避することができる。その結果、発光効率の低下を抑制することができ、高出力の発光装置を実現することができる。
また、開口部１５が形成されていることにより、必ずしも保護素子の搭載を、この発光装置の製造時に同時に行うことを必要とせず、予め又は発光装置の製造後に、必要に応じて、所望の保護素子を搭載することが可能となる。
しかも、パッケージ１３自体が一体構造であるために、貼り合せ作業などを必要せず、簡便に製造することができる。
さらに、貼り合せ等に伴う強度の低下を防止して、パッケージとしての強度を確保して、信頼性の高い発光装置を得ることができる。 According to the light emitting device having such a configuration, the light emitting element 11 and the protective element can be reliably separated by the part 13a of the integrated package 13 itself. It is possible to avoid exposure to light emitted from. As a result, a decrease in luminous efficiency can be suppressed, and a high-output light emitting device can be realized.
Further, since the opening 15 is formed, it is not always necessary to mount the protective element at the same time when the light-emitting device is manufactured, and desired protection can be performed in advance or after the light-emitting device is manufactured. An element can be mounted.
In addition, since the package 13 itself has an integral structure, it can be easily manufactured without requiring a bonding operation or the like.
Furthermore, strength reduction as a result of bonding or the like can be prevented, and the strength as a package can be secured, so that a highly reliable light-emitting device can be obtained.

実施例２
この実施例の発光装置２０は、図２に示したように、嵌合させて表面実装を行うサイドビュータイプの発光装置を構成するために、各部材を形成した以外は、実質的に実施例１の発光装置１０と同様の構成である。
この発光装置２０では、保護素子搭載領域として、開口部２５が、実施例１と同様に、発光素子１１を搭載した領域に形成された開口部１４とは、パッケージ２３自体の一部２３ａによって独立的に画定されて形成されている。
これによって、発光素子１１からの光が、この開口部２５内に搭載された保護素子に吸収されることがない。 Example 2
As shown in FIG. 2, the light emitting device 20 of this embodiment is substantially the same as the embodiment except that each member is formed in order to constitute a side view type light emitting device that is fitted and surface-mounted. The light emitting device 10 has the same configuration as that of the first light emitting device 10.
In the light emitting device 20, an opening 25 is provided as a protective element mounting region, as in the first embodiment, and is independent of the opening 14 formed in the region where the light emitting element 11 is mounted by a part 23 a of the package 23 itself. Are defined and formed.
As a result, light from the light emitting element 11 is not absorbed by the protective element mounted in the opening 25.

実施例３
この実施例の発光装置３０は、図３に示したように、嵌合させて表面実装を行うサイドビュータイプの発光装置であり、保護素子搭載領域が開口部ではなく、パッケージ３３表面に開口を有さず、パッケージ３３内部に形成された空洞３５である以外は、実質的に実施例１及び実施例２の発光装置と同様の構成である。
この発光装置３０では、保護素子搭載領域として、空洞３５が、発光素子１１を搭載した領域に形成された開口部１４とは、パッケージ２３自体の一部３３ａによって独立的に画定されており、これによって、発光素子１１からの光が、この空洞３５内に搭載された保護素子に吸収されることがない。 Example 3
As shown in FIG. 3, the light emitting device 30 of this embodiment is a side view type light emitting device that is fitted and surface-mounted, and the protective element mounting region is not an opening, but an opening is formed on the surface of the package 33. The configuration is substantially the same as that of the light-emitting devices of Example 1 and Example 2 except that the cavity 35 is formed inside the package 33.
In the light emitting device 30, the cavity 35 is defined as a protection element mounting region independently from the opening 14 formed in the region where the light emitting element 11 is mounted, by a part 33 a of the package 23 itself. Therefore, the light from the light emitting element 11 is not absorbed by the protective element mounted in the cavity 35.

実施例４
この実施例の発光装置４０は、図４に示したように、嵌合させて表面実装を行うサイドビュータイプの発光装置を構成するために、各部材を形成するとともに、保護素子搭載領域となる開口部を複数形成した以外は、実質的に実施例１及び実施例２の発光装置と同様の構成である。
この発光装置４０では、保護素子搭載領域が、各発光装置に対して形成されているために、全ての発光装置に対する耐圧等を確保することができ、高性能の発光装置を得ることができる。 Example 4
As shown in FIG. 4, the light emitting device 40 of this embodiment forms each member and forms a protection element mounting region in order to form a side view type light emitting device that is fitted and surface-mounted. Except that a plurality of openings are formed, the configuration is substantially the same as that of the light-emitting devices of Example 1 and Example 2.
In this light emitting device 40, since the protection element mounting region is formed for each light emitting device, it is possible to ensure a withstand voltage for all the light emitting devices and to obtain a high performance light emitting device.

実施例５
この実施例の発光装置５０は、図５に示したように、嵌合させて表面実装を行うサイドビュータイプの発光装置であり、さらに、金属部材５２ｃとして、過電圧対策用リードが一部パッケージ２３内に挿入されて設けられている以外、実質的に実施例１の発光装置と同様の構成である。
この発光装置５０では、特に、フリーの状態でリード５２ｃが設けられていることにより、有効に過電圧をパッケージ外に逃がすことができる。 Example 5
As shown in FIG. 5, the light-emitting device 50 of this embodiment is a side-view type light-emitting device that is fitted and surface-mounted. Further, as the metal member 52c, the overvoltage countermeasure lead is partially packaged 23. The structure is substantially the same as that of the light-emitting device of Example 1 except that the light-emitting device is provided by being inserted therein.
In the light emitting device 50, in particular, the lead 52c is provided in a free state, so that overvoltage can be effectively released outside the package.

照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源などに使用することができる。   It can be used for illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, and the like.

本発明の発光装置の一実施形態を示す斜視図及び断面図である。It is the perspective view and sectional drawing which show one Embodiment of the light-emitting device of this invention. 本発明の発光装置の別の実施形態を示す図である。It is a figure which shows another embodiment of the light-emitting device of this invention. 本発明の発光装置のさらに別の実施形態を示す図である。It is a figure which shows another embodiment of the light-emitting device of this invention. 本発明の発光装置のさらに別の実施形態を示す図である。It is a figure which shows another embodiment of the light-emitting device of this invention. 本発明の発光装置のさらに別の実施形態を示す図である。It is a figure which shows another embodiment of the light-emitting device of this invention. 従来の発光ダイオードを示す断面図である。It is sectional drawing which shows the conventional light emitting diode. 従来の別の発光ダイオードを示す斜視図である。It is a perspective view which shows another conventional light emitting diode.

符号の説明Explanation of symbols

１０、２０、３０、４０、５０ 発光装置
１１ 発光素子、
１２ａ、１２ｂ、２２ａ、２２ｂ、３２ａ、３２ｂ、４２ａ、４２ｂ、５２ａ、５２ｂ、５２ｃ 金属部材
１３、２３、３３、４３ パッケージ
１３ａ、２３ａ、３３ａ、４３ａ パッケージの一部
１４、１５、２５、４５ａ、４５ｂ 開口部
１６ 透光性被覆部材
３５ 空洞




10, 20, 30, 40, 50 Light-emitting device 11 Light-emitting element,
12a, 12b, 22a, 22b, 32a, 32b, 42a, 42b, 52a, 52b, 52c Metal member 13, 23, 33, 43 Package 13a, 23a, 33a, 43a Part of package 14, 15, 25, 45a, 45b Opening 16 Translucent covering member 35 Cavity




Claims (5)

発光素子と電気的に接続される金属部材の一部がパッケージに埋め込まれてなる発光装置であって、
前記発光素子が、パッケージ表面に形成された凹状開口部において金属部材の一部領域に搭載されており、かつ、パッケージ内であって前記金属部材の他の領域が、前記一部領域と独立して前記パッケージによって画定されていることを特徴とする発光装置。 A light emitting device in which a part of a metal member electrically connected to a light emitting element is embedded in a package,
The light emitting element is mounted on a partial region of the metal member in a concave opening formed on the surface of the package, and the other region of the metal member in the package is independent of the partial region. A light emitting device defined by the package. 他の領域が、パッケージ表面に形成された凹状開口部によってパッケージから露出し、かつ該他の領域の外周をパッケージが取り囲むように画定されている請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the other region is exposed from the package by a concave opening formed in the package surface, and is defined so that the package surrounds the outer periphery of the other region. 他の領域が、パッケージ内に形成された空洞としてパッケージに取り囲まれて画定されている請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the other region is defined by being surrounded by the package as a cavity formed in the package. 他の領域に保護素子が搭載されてなる請求項１〜３のいずれか１つに記載の発光装置。   The light emitting device according to claim 1, wherein a protection element is mounted in another region. 発光素子が搭載されたパッケージの凹状開口部に透光性被覆材が埋設されてなる請求項１〜４のいずれか１つに記載の発光装置。

The light-emitting device according to claim 1, wherein a light-transmitting coating material is embedded in a concave opening of a package on which the light-emitting element is mounted.

JP2006101527A 2006-04-03 2006-04-03 Light-emitting device Pending JP2007280983A (en)

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