JP2006332590A - 半導体ウエハ移送装置 - Google Patents
半導体ウエハ移送装置 Download PDFInfo
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- JP2006332590A JP2006332590A JP2006016896A JP2006016896A JP2006332590A JP 2006332590 A JP2006332590 A JP 2006332590A JP 2006016896 A JP2006016896 A JP 2006016896A JP 2006016896 A JP2006016896 A JP 2006016896A JP 2006332590 A JP2006332590 A JP 2006332590A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
- G11B15/60—Guiding record carrier
- G11B15/66—Threading; Loading; Automatic self-loading
- G11B15/665—Threading; Loading; Automatic self-loading by extracting loop of record carrier from container
- G11B15/6653—Threading; Loading; Automatic self-loading by extracting loop of record carrier from container to pull the record carrier against drum
- G11B15/6656—Threading; Loading; Automatic self-loading by extracting loop of record carrier from container to pull the record carrier against drum using two-sided extraction, i.e. "M-type"
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B15/00—Driving, starting or stopping record carriers of filamentary or web form; Driving both such record carriers and heads; Guiding such record carriers or containers therefor; Control thereof; Control of operating function
- G11B15/675—Guiding containers, e.g. loading, ejecting cassettes
- G11B15/67544—Guiding containers, e.g. loading, ejecting cassettes with movement of the cassette parallel to its main side and subsequent movement perpendicular thereto, i.e. front loading
- G11B15/67547—Guiding containers, e.g. loading, ejecting cassettes with movement of the cassette parallel to its main side and subsequent movement perpendicular thereto, i.e. front loading the two movements being made by the cassette holder
- G11B15/67549—Guiding containers, e.g. loading, ejecting cassettes with movement of the cassette parallel to its main side and subsequent movement perpendicular thereto, i.e. front loading the two movements being made by the cassette holder with servo control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0235—Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
- H04M1/0237—Sliding mechanism with one degree of freedom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】駆動手段によって回転されるボールスクリュー31の回転によって左右両側に移動可能に、該ボールスクリュー31と結合され、外面に傾斜面が形成されたガイド部材33と、該ガイド部材33が移動する時、上記傾斜面によってその中心を基準に部分回転駆動が可能なように上記ガイド部材と面接触するレバー40と結合し、該レバー40と面接触されて該レバー40の駆動によってガイド軸上に上下スライディングする多数のスライド部材61,62,63,64 に対応結合された連結部材81,82,83,84に結合された中心フィンガー27と上下両側に移動する多数の駆動フィンガー90とで構成される。
【選択図】図3
Description
13: 駆動モータ 14: 軸
15: 移送ブロック 16: 突出部
17: タイミングベルト
21: 支持体 23: シリンダ
27: 中心フィンガー 30: モータ
31: ボールスクリュー 33: ガイド部材
34: 第1ブロック 35: 第2ブロック
35a: 傾斜面 40: レバー
41、71、72、73、74: カム 43、67: スプリング
48: ストッパカム
51: ベース 53: 溝
55: 上部ベース 57: 軸
60: ガイド軸 61、62、63、64: スライド部材
81、82、83、84: 連結部材 90: 駆動フィンガー
100: 半導体ウエハ移送装置
Claims (7)
- 半導体ウエハ移送装置において、
ガイド本体(10)と、
上記ガイド本体(10)に往復スライディング可能に結合される支持体(21); 上記支持体(21)に支持される中心フィンガー(27);を含む第1搬送部と、
上記支持体(21)と離脱可能に結合されるベース(51); 上記支持体(51)に設置される駆動手段; 上記駆動手段によって回転されるボールスクリュー(31); 上記ボールスクリュー(31)の回転によって左右両側に移動可能に上記ボールスクリュー(31)と結合され、外面に傾斜面(35a)が形成されたガイド部材(33); 上記ガイド部材(33)が移動する時、上記傾斜面(35a)によってその中心を基準に部分回転駆動が可能なように上記ガイド部材(33)と面接触するレバー(40); 上記レバー(40)と面接触されて上記レバー(40)の駆動によってガイド軸(60)上に上下スライディングする多数のスライド部材(61、62、63、64); 相互一定の間隔離隔する形態で上記各スライド部材(61、62、63、64)に対応して結合される多数の連結部材(81、82、83、84); 上記各連結部材(81、82、83、84)に対応して結合され、相互一定の間隔離隔し、上記中心フィンガー(27)を中心に上下両側に配置される多数の駆動フィンガー(90);を含む第2搬送部と、
を含んで構成されることを特徴とする半導体ウエハ移送装置。 - 上記支持体(21)にはシリンダ(23)が設置され、上記ベース(51)には上記シリンダ(23)の膨脹する部位に対応する溝(53)が形成され上記第1搬送部と上記第2搬送部は上記シリンダ(23)の駆動によって選択的に結合または離脱されることを特徴とする請求項1に記載の半導体ウエハ移送装置。
- 上記スライド部材(61、62、63、64)には各々偏心したカム(71、72、73、74)が選択的に回転可能に結合され、上記スライド部材(61、62、63、64)とレバー(40)は上記カム(71、72、73、74)を介して面接触されることを特徴とする請求項1に記載の半導体ウエハ移送装置。
- 上記レバー(40)には偏心したカム(41)が選択的に回転可能に結合され、上記レバー(40)とガイド部材(33)は上記カム(41)を介して面接触されることを特徴とする請求項1に記載の半導体ウエハ移送装置。
- 上記第2搬送部は、
上記レバー(40)とスライド部材(61、62、63、64)に復元力を付与するために上記ベース(51)とレバー(40)及び上記ベース(51)とスライド部材(61、62、63、64)を連結する弾性手段をさらに含んで構成されることを特徴とする請求項1に記載の半導体ウエハ移送装置。 - 上記弾性手段はスプリング(43、67) であることを特徴とする請求項5に記載の半導体ウエハ移送装置。
- 上記ガイド部材(33)は、
上記ボールスクリュー(31)の回転によって左右両側に移動可能に上記ボールスクリュー(31)と結合される第1ブロック(34)と;
その外面に傾斜面(35a)が形成されて上記第1ブロック(34)と分離可能に結合される第2ブロック(35);で構成されることを特徴とする請求項1ないし請求項6の何れか1項に記載の半導体ウエハ移送装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050044834A KR100746850B1 (ko) | 2005-05-27 | 2005-05-27 | 반도체 웨이퍼 이송장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006332590A true JP2006332590A (ja) | 2006-12-07 |
Family
ID=37524257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006016896A Pending JP2006332590A (ja) | 2005-05-27 | 2006-01-25 | 半導体ウエハ移送装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060280589A1 (ja) |
JP (1) | JP2006332590A (ja) |
KR (1) | KR100746850B1 (ja) |
TW (1) | TWI280221B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007204181A (ja) * | 2006-01-31 | 2007-08-16 | Meikikou:Kk | 板材の搬送装置 |
JP2010179420A (ja) * | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
JP2010179419A (ja) * | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
JP2013058735A (ja) * | 2011-08-12 | 2013-03-28 | Shibaura Mechatronics Corp | 処理システムおよび処理方法 |
CN106158714A (zh) * | 2015-05-15 | 2016-11-23 | 苏斯微技术光刻有限公司 | 用于操作对准晶片对的装置 |
JP2020189390A (ja) * | 2019-05-24 | 2020-11-26 | 日本電産サンキョー株式会社 | 産業用ロボットの調整方法および測定用器具 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106892380B (zh) * | 2015-12-17 | 2019-04-23 | 北京北方华创微电子装备有限公司 | 弹性连接组件及应用其的片盒升降装置、半导体加工设备 |
JP6862233B2 (ja) * | 2017-03-27 | 2021-04-21 | 日本電産サンキョー株式会社 | 産業用ロボット |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3006714B2 (ja) * | 1988-12-02 | 2000-02-07 | 東京エレクトロン株式会社 | 縦型基板移載装置及び縦型熱処理装置並びに縦型熱処理装置における基板移載方法 |
US4988261A (en) * | 1989-10-06 | 1991-01-29 | Blatt John A | Multiple motion transfer apparatus |
JP2825616B2 (ja) * | 1990-05-21 | 1998-11-18 | 東京エレクトロン株式会社 | 板状体搬送装置 |
US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
US6645355B2 (en) * | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
JPH1041370A (ja) | 1996-07-17 | 1998-02-13 | Shinko Electric Co Ltd | ピッチ可変ウェハ移載ハンド |
JPH1041371A (ja) | 1996-07-17 | 1998-02-13 | Shinko Electric Co Ltd | ピッチ可変ウェハ移載ハンド |
-
2005
- 2005-05-27 KR KR1020050044834A patent/KR100746850B1/ko not_active IP Right Cessation
-
2006
- 2006-01-25 JP JP2006016896A patent/JP2006332590A/ja active Pending
- 2006-01-26 TW TW095103184A patent/TWI280221B/zh not_active IP Right Cessation
- 2006-01-30 US US11/343,231 patent/US20060280589A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007204181A (ja) * | 2006-01-31 | 2007-08-16 | Meikikou:Kk | 板材の搬送装置 |
JP2010179420A (ja) * | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
JP2010179419A (ja) * | 2009-02-06 | 2010-08-19 | Nidec Sankyo Corp | 産業用ロボット |
JP2013058735A (ja) * | 2011-08-12 | 2013-03-28 | Shibaura Mechatronics Corp | 処理システムおよび処理方法 |
CN106158714A (zh) * | 2015-05-15 | 2016-11-23 | 苏斯微技术光刻有限公司 | 用于操作对准晶片对的装置 |
JP2020189390A (ja) * | 2019-05-24 | 2020-11-26 | 日本電産サンキョー株式会社 | 産業用ロボットの調整方法および測定用器具 |
JP7267541B2 (ja) | 2019-05-24 | 2023-05-02 | ニデックインスツルメンツ株式会社 | 産業用ロボットの調整方法および測定用器具 |
Also Published As
Publication number | Publication date |
---|---|
US20060280589A1 (en) | 2006-12-14 |
TWI280221B (en) | 2007-05-01 |
TW200642030A (en) | 2006-12-01 |
KR100746850B1 (ko) | 2007-08-07 |
KR20060122396A (ko) | 2006-11-30 |
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