JP2006331817A - Light emitting device and luminaire using it - Google Patents

Light emitting device and luminaire using it Download PDF

Info

Publication number
JP2006331817A
JP2006331817A JP2005152997A JP2005152997A JP2006331817A JP 2006331817 A JP2006331817 A JP 2006331817A JP 2005152997 A JP2005152997 A JP 2005152997A JP 2005152997 A JP2005152997 A JP 2005152997A JP 2006331817 A JP2006331817 A JP 2006331817A
Authority
JP
Japan
Prior art keywords
substrate
lens unit
light emitting
led
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005152997A
Other languages
Japanese (ja)
Other versions
JP4529795B2 (en
Inventor
Mamoru Yamakawa
守 山川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2005152997A priority Critical patent/JP4529795B2/en
Publication of JP2006331817A publication Critical patent/JP2006331817A/en
Application granted granted Critical
Publication of JP4529795B2 publication Critical patent/JP4529795B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve light emitting efficiency and reliability in a light emitting device using a light emitting diode (LED) by improving heat radiating property of a substrate mounting the LED and durability of a lens unit. <P>SOLUTION: The light emitting device 1 provided with the substrate 4 mounting the LED 3, the lens unit 2 covering the substrate 4 and a radiator plate 7 attached to a back face of the substrate 4 has a fitting part 10 comprising a thread part 11a, a collar part 12, a rubber part 13 deformed by being pressed by the collar part 12 and pressing a depressed part 6 of the lens unit 2 and a spacer part 14 pressing the substrate 4 with the pressure from the rubber part 13. The fitting part 10 is fitted in a through hole 15 of the substrate 4 and a screw hole 16 of the radiator plate 7 to strongly closely fix the lens unit 2 and the substrate 4 to the radiator plate 7. Thereby, the heat radiating property and the light emitting efficiency of the LED 3 are improved, distortion or crack by secular change of the lens unit 2 is eliminated to improve the durability. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光ダイオード（以下、ＬＥＤと略称する）の発光する光をレンズで集光するＬＥＤを用いた発光装置及びそれを用いた照明器具に関する。   The present invention relates to a light emitting device using an LED that collects light emitted from a light emitting diode (hereinafter abbreviated as LED) with a lens, and a lighting fixture using the same.

従来のこの種のＬＥＤを用いた発光装置の例を、図１２（ａ）〜（ｄ）に示す。これらの図において、発光装置１００は、発光ダイオードのＬＥＤ１０２が実装された基板１０１と、基板１０１を覆うレンズユニット１１０と、ＬＥＤ１０２の発熱を図１２（ａ）に示す白抜きの矢印の方向に放熱する放熱部材１０５とを備えている。レンズユニット１１０は、ＬＥＤ１０２からの光を集光するレンズ部１０４とレンズ部１０４を保持するレンズホルダ１０３とからなり、樹脂で形成されている。このレンズユニット１１０は、その外形の一部を中心部より離れる方向に拡大した半円形状のつば部１０３ａを備え、このつば部１０３ａにはネジ用の貫通孔１０７が設けられている。そして、貫通孔１０７を通るネジ１０６により、レンズユニット１１０と基板１０１が放熱部材１０５に固定されている。 Examples of conventional light emitting devices using this type of LED are shown in FIGS. In these drawings, the light-emitting device 100 radiates heat generated by the substrate 101 on which the LED 102 of the light-emitting diode is mounted, the lens unit 110 covering the substrate 101, and the LED 102 in the direction of the white arrow shown in FIG. The heat radiating member 105 is provided. The lens unit 110 includes a lens unit 104 that collects light from the LED 102 and a lens holder 103 that holds the lens unit 104, and is formed of resin. The lens unit 110 includes a semicircular collar portion 103a in which a part of its outer shape is enlarged in a direction away from the center portion, and a screw through hole 107 is provided in the collar portion 103a. The lens unit 110 and the substrate 101 are fixed to the heat radiating member 105 by screws 106 that pass through the through holes 107.

このような従来の発光装置１００では、基板１０１を放熱部材１０５に強く押付けるために、つば部１０３ａと放熱部材１０５との間には、隙間ｄ１が必要とされる。しかしながら、樹脂製のレンズユニット１１０を放熱部材１０５にネジ１０６で固定すると、隙間ｄ１の存在により、図１２（ｃ）に示すように、放熱部材１０５に接するつば部１０３ａの外周側と基板１０１を押圧する圧接部１０３ｂ側とで、隙間ｄ１が異なってくる。すなわち、樹脂製のつば部１０３ａが傾斜して取り付けられ、つば部１０３ａが斜めに変形される。さらに、この変形は、図１２（ｄ）に示されるように、経年変化により、圧接部１０３ｂの背面側に割れ１０３ｃを発生する。従って、つば部１０３ａにより基板１０１を放熱部材１０５に強く固定できず、放熱部材１０５に基板１０１を継続的に強く押付けることができなかった。このため、ＬＥＤ１０２の熱を十分に放熱できず、ＬＥＤ１０２に多くの電流を流すことができないという問題があった。   In such a conventional light emitting device 100, a gap d <b> 1 is required between the collar portion 103 a and the heat dissipation member 105 in order to strongly press the substrate 101 against the heat dissipation member 105. However, when the resin lens unit 110 is fixed to the heat radiating member 105 with the screw 106, the presence of the gap d1, the outer peripheral side of the flange portion 103a in contact with the heat radiating member 105 and the substrate 101 are caused as shown in FIG. The gap d1 is different on the pressing portion 103b side to be pressed. That is, the flange portion 103a made of resin is attached with an inclination, and the flange portion 103a is deformed obliquely. Further, as shown in FIG. 12D, this deformation causes a crack 103c on the back side of the press contact portion 103b due to aging. Therefore, the substrate 101 cannot be firmly fixed to the heat radiating member 105 by the collar portion 103a, and the substrate 101 cannot be pressed firmly and continuously against the heat radiating member 105. For this reason, there was a problem that the heat of the LED 102 could not be sufficiently radiated and a large amount of current could not flow through the LED 102.

なお、ＬＥＤチップアレイを装着したヘッド基板をロッドレンズアレイを備えたカバー体と放熱板とで挟んで締結するＬＥＤアレイプリントヘッドにおいて、カバー体の左右両側に位置決めピンを設け、この位置決めピンが挿入されるピン孔をロッドレンズアレイと放熱板に穿設し、各位置決めピンの外周面に、凹み溝を刻設することによりレンズ焦点のずれを低減する発光装置が知られている（例えば、特許文献１参照）。しかしながら、この発光装置では、ロッドレンズアレイをカバー体と放熱板で挟み、カバー体の係合突起と板バネ製の締結体の係合孔とを係合させるだけの接合であり、ネジ留めによる締結がなされていない。このため、圧接力が弱く、また、板バネ製の締結体が周囲温度で変動する等により、ロッドレンズアレイと放熱板との密着性が不十分となり、ＬＥＤの放熱を十分に行うことができなかった。
実開平６−３６４４号公報 In LED array print heads that are fastened by sandwiching a head substrate mounted with an LED chip array between a cover body equipped with a rod lens array and a heat sink, positioning pins are provided on both the left and right sides of the cover body, and these positioning pins are inserted. There is known a light emitting device that reduces a lens focus shift by drilling a pin hole to be formed in a rod lens array and a heat radiating plate and engraving a concave groove on an outer peripheral surface of each positioning pin (for example, a patent) Reference 1). However, in this light emitting device, the rod lens array is sandwiched between the cover body and the heat radiating plate, and is simply joined by engaging the engagement protrusion of the cover body and the engagement hole of the fastening body made of a leaf spring, by screwing. No conclusion has been made. For this reason, the pressure contact force is weak, and the adhesion between the rod lens array and the heat radiating plate becomes insufficient due to fluctuations in the fastening body made of leaf springs at the ambient temperature. There wasn't.
Japanese Utility Model Publication No. 6-3644

本発明は、上記の問題を解決するためになされたものであり、ＬＥＤの放熱性を向上させ発光効率を高めると共に、耐久性の良い、安定な発光装置及びそれを用いた照明器具を提供することを目的とする。   The present invention has been made in order to solve the above-described problems, and provides a stable and light-emitting device having good durability and a lighting apparatus using the same while improving the heat dissipation of the LED to increase the light emission efficiency. For the purpose.

上記目的を達成するために請求項１の発明は、発光ダイオード（ＬＥＤ）が実装された基板と、この基板を覆う樹脂製のレンズユニットと、前記基板の背面に取付けられた放熱部材とを備えた発光装置において、前記基板の外形を、前記レンズユニットの外形より小さく形成し、前記基板及び前記放熱部材に、互いに対応する孔部を設け、前記基板及びレンズユニットを前記放熱部材に固定するための嵌合手段を備え、前記嵌合手段は、前記孔部に嵌入されるネジ部と、このネジ部の頭部にあるつば部と、該つば部により押圧されて変形し前記レンズユニットの縁部を押圧する弾性部材と、前記基板を前記放熱部材に押圧するためのスペーサ部とを備えたものである。   In order to achieve the above object, the invention of claim 1 includes a substrate on which a light emitting diode (LED) is mounted, a resin lens unit covering the substrate, and a heat radiating member attached to the back surface of the substrate. In the light emitting device, the outer shape of the substrate is formed smaller than the outer shape of the lens unit, holes corresponding to each other are provided in the substrate and the heat dissipation member, and the substrate and the lens unit are fixed to the heat dissipation member. The fitting means includes a screw part fitted into the hole part, a collar part at a head part of the screw part, and is deformed by being pressed by the collar part. An elastic member that presses the portion, and a spacer portion that presses the substrate against the heat radiating member.

請求項２の発明は、請求項１に記載の発明において、前記レンズユニットと前記基板とを一体化したものである。   The invention of claim 2 is the invention according to claim 1, wherein the lens unit and the substrate are integrated.

請求項３の発明は、請求項１に記載の発明において、前記スペーサ部と前記基板との接触面にそれぞれテーパを設けたものである。   According to a third aspect of the present invention, in the first aspect of the present invention, the contact surface between the spacer portion and the substrate is provided with a taper.

請求項４の発明は、前記請求項１乃至請求項３のいずれかに記載の発光装置を用いた照明器具である。   Invention of Claim 4 is a lighting fixture using the light-emitting device in any one of the said Claim 1 thru | or 3.

請求項１の発明によれば、ＬＥＤが実装された基板を照明器具の一部を成す放熱部材に、強固に押付けることができるので、ＬＥＤから発する熱を効率良く放熱することができる。そして、放熱が良くなることにより、ＬＥＤにより電流を流すことが可能となり、より明るくＬＥＤを発光させることができる。さらに、樹脂製のレンズユニットを固定する際に、弾性部材で押付けるので、レンズユニットの変形や経年変化によるレンズユニットの割れを防止することができ、同時に、弾性部材のスプリングワッシャの効果により、ネジの緩みを防止することができ、装置の耐久性を良くすることができる。   According to invention of Claim 1, since the board | substrate with which LED was mounted can be firmly pressed on the heat radiating member which comprises a part of lighting fixture, the heat | fever emitted from LED can be thermally radiated efficiently. And since heat dissipation becomes good, it becomes possible to flow an electric current with LED, and can lighten LED more brightly. Furthermore, when fixing the lens unit made of resin, it is pressed with an elastic member, so it is possible to prevent the lens unit from cracking due to deformation and aging of the lens unit, and at the same time, due to the effect of the spring washer of the elastic member, The loosening of the screw can be prevented and the durability of the device can be improved.

請求項２の発明によれば、レンズユニットと基板を同時に放熱部材へ固定できるため、別々に放熱部材へ固定するよりも、放熱部材への取付けの部品点数を削減することができ、作業を軽減することができる。また、ＬＥＤをレンズユニットでほぼ完全に覆うことができるので、ＬＥＤに直接、人が触れることを避けることができ、人体によるＬＥＤの静電気破壊を防止することができる。   According to the invention of claim 2, since the lens unit and the substrate can be fixed to the heat dissipation member at the same time, the number of parts to be attached to the heat dissipation member can be reduced and the work can be reduced rather than separately fixing to the heat dissipation member. can do. Further, since the LED can be almost completely covered with the lens unit, it is possible to avoid direct contact with the LED, and to prevent electrostatic breakdown of the LED by the human body.

請求項３の発明によれば、スペーサ部の基板上の位置決めを正確に行うことができ、ネジ締め作業をスムーズに行うことができる。   According to the invention of claim 3, the spacer portion can be accurately positioned on the substrate, and the screw tightening operation can be performed smoothly.

請求項４の発明によれば、ＬＥＤの放熱性の向上に伴う電流増加により発光効率が高められ、レンズユニットの歪や経年変化の割れを削減され、耐久性の向上された発光装置を光源として用いることができ、明るい、信頼性の高い照明器具を構成することができる。   According to the invention of claim 4, the luminous efficiency is increased by increasing the current accompanying the improvement of the heat dissipation of the LED, and the light emitting device with improved durability is reduced by reducing distortion of the lens unit and cracking with age. A bright and highly reliable lighting fixture can be constructed.

以下、本発明の一実施形態に係る発光装置について図１乃至図１１を参照して説明する。図１及び図２は本実施形態による発光装置１の構成を示す。   Hereinafter, a light emitting device according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2 show the configuration of the light emitting device 1 according to the present embodiment.

発光装置１は、光源となる発光ダイオード（以下、ＬＥＤと略す）３が複数個（本例では４個）実装された基板４と、この基板４を覆いＬＥＤ３からの光を集光するレンズ部２ｂと、このレンズ部２ｂを保持するレンズホルダ部２ａと、基板４の背面に取付けられた照明器具の一部をなす放熱板（放熱部材）７とを備えている。基板４には、４つのＬＥＤ３が中心に対し略対称に配置され、レンズ部２ｂ及びレンズホルダ部２ａは、樹脂製であり、一体化されてレンズユニット２を形成してる。レンズユニット２は、その外形が基板４の外形よりも大きく形成されて基板４を覆っている。また、レンズユニット２の外形の一部には、中心方向に略半円形状の窪み部（縁部）６が形成され、窪み部６の周辺には、ネジ留めされる半円形状のつば部６ａが形成されている。   The light emitting device 1 includes a substrate 4 on which a plurality of light emitting diodes (hereinafter abbreviated as LEDs) 3 serving as light sources are mounted (four in this example), and a lens unit that covers the substrate 4 and collects light from the LEDs 3. 2b, a lens holder portion 2a for holding the lens portion 2b, and a heat radiating plate (heat radiating member) 7 constituting a part of a lighting fixture attached to the back surface of the substrate 4. On the substrate 4, four LEDs 3 are arranged substantially symmetrically with respect to the center, and the lens portion 2 b and the lens holder portion 2 a are made of resin and are integrated to form the lens unit 2. The lens unit 2 has a larger outer shape than the substrate 4 and covers the substrate 4. In addition, a substantially semicircular recess (edge) 6 is formed in the center direction in a part of the outer shape of the lens unit 2, and a semicircular collar that is screwed around the recess 6. 6a is formed.

上記基板４及び放熱板７は、互いに対応して、貫通孔１５（孔部）及びネジ穴１６（孔部）をそれぞれ備えている。この貫通孔１５及びネジ穴１６には、これらに嵌合し、基板４及びレンズユニット２を放熱板７に固定する嵌合部（嵌合手段）１０が形成されている。この嵌合部１０は、貫通孔１５及びネジ穴１６に嵌入されるネジ部１１ａと、このネジ部１１ａの頭部に位置するつば部１２と、このつば部１２により押圧されて変形しレンズユニット２の窪み部６のつば部６ａを押圧するゴム部（弾性部材）１３と、ゴム部１３からの圧力により基板４を放熱板７に押圧するためのスペーサ部１４とにより構成される。   The substrate 4 and the heat radiating plate 7 are respectively provided with a through hole 15 (hole) and a screw hole 16 (hole) corresponding to each other. The through-hole 15 and the screw hole 16 are formed with a fitting portion (fitting means) 10 that fits into the through-hole 15 and the screw hole 16 and fixes the substrate 4 and the lens unit 2 to the heat radiating plate 7. The fitting portion 10 is deformed by being pressed by the screw portion 11a inserted into the through hole 15 and the screw hole 16, the flange portion 12 positioned at the head of the screw portion 11a, and the flange portion 12 to be deformed. The rubber part (elastic member) 13 that presses the flange part 6 a of the two recessed parts 6 and the spacer part 14 that presses the substrate 4 against the heat radiating plate 7 by the pressure from the rubber part 13.

図３（ａ）、（ｂ）は、ネジ部１１ａが締まっていない状態、及びネジ部１１ａが十分締まっている状態におけるそれぞれのネジ部１１ａとレンズユニット２及び基板４との嵌合状態を示す。図３（ａ）に示すように、ネジ部１１ａが放熱板７に十分締まっていない状態では、スペーサ部１４と基板４の間には、隙間ｄが存在する。そして、ネジ部１１ａが放熱板７にほぼ完全にネジ留めされた状態では、図３（ｂ）に示すように、つば部１２の下に設けたゴム部１３は、つば部１２とスペーサ部１４との間で押圧され、横方向に変形する。この変形により、レンズユニット２の窪み部６の半円状のつば部６ａが押されると同時に、スペーサ部１４が押圧される。この圧力により、レンズユニット２は基板４に圧接され、スペーサ部１４も基板４に押圧され、隙間ｄが無くなり、レンズユニット２とスペーサ部１４は、基板４に密着して接合される。   FIGS. 3A and 3B show a fitting state between the screw unit 11a, the lens unit 2 and the substrate 4 in a state where the screw unit 11a is not tightened and in a state where the screw unit 11a is sufficiently tightened. . As shown in FIG. 3A, a gap d exists between the spacer portion 14 and the substrate 4 when the screw portion 11 a is not sufficiently tightened to the heat sink 7. In the state where the screw portion 11a is screwed to the heat radiating plate 7 almost completely, as shown in FIG. 3B, the rubber portion 13 provided below the collar portion 12 is formed with the collar portion 12 and the spacer portion 14. And is deformed in the lateral direction. By this deformation, the semicircular collar portion 6a of the hollow portion 6 of the lens unit 2 is pressed, and at the same time, the spacer portion 14 is pressed. With this pressure, the lens unit 2 is pressed against the substrate 4, the spacer portion 14 is also pressed against the substrate 4, the gap d is eliminated, and the lens unit 2 and the spacer portion 14 are in close contact with and bonded to the substrate 4.

このように、嵌合部１０によるレンズユニット２と基板４との放熱板７への嵌合により、つば部１２と、ゴム部１３と、スペーサ部１４を連動させて嵌合させる。これにより、弾性をもって、レンズユニット２と基板４と放熱板７との各接合部は、水平方向に平行性を持って接合され、歪や割れのない強固で耐久性のある接合が可能となる。   In this way, by fitting the lens unit 2 and the substrate 4 to the heat radiating plate 7 by the fitting portion 10, the collar portion 12, the rubber portion 13, and the spacer portion 14 are engaged with each other. Thereby, each joint part of the lens unit 2, the board | substrate 4, and the heat sink 7 is joined with elasticity in the horizontal direction with elasticity, and strong and durable joining without distortion and cracking becomes possible. .

図４（ａ）乃至（ｄ）は、レンズユニット２を示す。ここに、図４（ｃ）は、レンズユニット２が透光性樹脂で一体化成形された場合を示す。この一体化により、レンズ部２ｂのレンズホルダ部２ａへの取り付け作業が不要になり、部品を削減することができ低コストとなる。図４（ｄ）は、レンズユニット２が分離型とされた場合を示す。レンズ部２ｂは、レンズホルダ部２ａとは別体で製作されレンズ基板３１に装着される。レンズ基板３１は、レンズホルダ部２ａの上蓋部に設けられたレンズ部２ｂが貫通する貫通孔２１の入力側に設けられ凹部２２に嵌合され、圧入又は接着材で固定される。そして、レンズホルダ部２ａは、レンズ部２ｂが基板４（図１参照）のＬＥＤ３（図１参照）位置に対応するように接合される。この場合、レンズホルダ部２ａは、透光性樹脂でなくてもよく他の安価な材料を利用できる。   4A to 4D show the lens unit 2. Here, FIG. 4C shows a case where the lens unit 2 is integrally molded with a translucent resin. This integration eliminates the need for attaching the lens portion 2b to the lens holder portion 2a, reducing the number of parts and reducing the cost. FIG. 4D shows a case where the lens unit 2 is a separation type. The lens unit 2 b is manufactured separately from the lens holder unit 2 a and is attached to the lens substrate 31. The lens substrate 31 is provided on the input side of the through hole 21 through which the lens portion 2b provided in the upper lid portion of the lens holder portion 2a passes, and is fitted into the concave portion 22, and is fixed by press-fitting or an adhesive. The lens holder portion 2a is bonded so that the lens portion 2b corresponds to the LED 3 (see FIG. 1) position of the substrate 4 (see FIG. 1). In this case, the lens holder portion 2a may not be a translucent resin, and other inexpensive materials can be used.

図５（ａ）は、ＬＥＤ３と基板４の接合状態を示す。同図（ｂ）は、基板として金属板４１とその表面に形成された絶縁体４２よりなる金属基板４ａを用いた場合を示す。金属板４１は、アルミや銅等で形成され、ＬＥＤ３からの熱の放熱性を向上する。絶縁体４２は、ガラスエポキシやセラミック等の絶縁体で形成され、ＬＥＤ３と金属板４１間の絶縁性を保つ。また、基板４は、放熱板７との密着性が良ければ、絶縁体４２のみで形成することも可能である。   FIG. 5A shows a joined state of the LED 3 and the substrate 4. FIG. 2B shows a case where a metal substrate 4a composed of a metal plate 41 and an insulator 42 formed on the surface thereof is used as the substrate. The metal plate 41 is formed of aluminum, copper, or the like, and improves the heat dissipation from the LED 3. The insulator 42 is formed of an insulator such as glass epoxy or ceramic, and maintains the insulation between the LED 3 and the metal plate 41. Further, the substrate 4 can be formed of only the insulator 42 as long as the adhesion to the heat sink 7 is good.

図６（ａ）、（ｂ）は、レンズユニット２と基板４を放熱板７（図１参照）に取り付け易くするために、両者を接合し、固定して一体化する構造を示す。図６（ｃ）、（ｄ）は、レンズユニット２と基板４との固定状態を示すもので、図６（ａ）のＣ部を拡大して示す。図６（ａ）乃至（ｃ）において、レンズユニット２は、当初、基板４の嵌合穴９に嵌合するピン状の突起部５ａを有し、この突起部５ａは、基板４の嵌合穴９を貫通して嵌合される。次に、この貫通された突起部５ａの頭部分は、樹脂の熱変形等により扁平に広げられて基板４に接合する扁平山部８として形成される。この扁平山部８により、レンズユニット２と基板４とは、強く固定され、両者が一体化される。放熱板７（図３参照）には、この扁平山部８の出っ張り部が放熱板７に当らないように対応する部分に凹部１７（図３参照）が設けられている。   FIGS. 6A and 6B show a structure in which the lens unit 2 and the substrate 4 are joined, fixed, and integrated in order to facilitate attachment of the lens unit 2 and the substrate 4 to the heat radiating plate 7 (see FIG. 1). FIGS. 6C and 6D show a fixed state of the lens unit 2 and the substrate 4, and an enlarged view of a portion C of FIG. 6A. 6A to 6C, the lens unit 2 initially has a pin-like protrusion 5 a that fits into the fitting hole 9 of the substrate 4, and the protrusion 5 a is fitted to the substrate 4. It fits through the hole 9. Next, the head portion of the projecting portion 5 a that is penetrated is formed as a flat mountain portion 8 that is flattened by thermal deformation of the resin and joined to the substrate 4. By this flat mountain portion 8, the lens unit 2 and the substrate 4 are firmly fixed, and both are integrated. The heat sink 7 (see FIG. 3) is provided with a recess 17 (see FIG. 3) at a corresponding portion so that the protruding portion of the flat mountain portion 8 does not hit the heat sink 7.

また、図６（ｄ）では、基板４の嵌合穴９に、レンズユニット２の突起部５ｂが基板４の表面上近くまで嵌入され、樹脂用のネジ１８によりワッシャ１９を挟んで突起部５ｂにネジ止めされる。これにより、レンズユニット２と基板４とを、ネジ１８とワッシャ１９により強固に圧接して一体化することができる。   In FIG. 6D, the protrusion 5b of the lens unit 2 is inserted into the fitting hole 9 of the substrate 4 up to near the surface of the substrate 4, and the washer 19 is sandwiched by the resin screw 18 so that the protrusion 5b. Screwed on. As a result, the lens unit 2 and the substrate 4 can be integrated by firmly pressing them with the screw 18 and the washer 19.

このレンズユニット２と基板４との一体化構成により、ＬＥＤ３をレンズユニット２でほぼ完全に覆うことができる。従って、ＬＥＤ３に直接、人体が触れることが無くなり、人体によるＬＥＤ３の静電気破壊を防止することができる。また、レンズユニット２と基板４を同時に放熱板７へ固定できるため、別々に放熱板７へ固定するよりも取り付け工数を削減することができる。但し、本実施形態は、レンズユニット２と基板４を別々に放熱板７に固定することを制限するものではない。なお、図６（ｅ）に示すように、レンズユニット２に突起部５ｃを設け、この突起部５ｃを基板４の嵌合穴９に挿入し、基板４とレンズユニット２との一体化でなく位置決定用とすることもできる。   Due to the integrated configuration of the lens unit 2 and the substrate 4, the LED 3 can be almost completely covered with the lens unit 2. Therefore, the human body does not directly touch the LED 3, and the static electricity destruction of the LED 3 by the human body can be prevented. Moreover, since the lens unit 2 and the board | substrate 4 can be simultaneously fixed to the heat sink 7, attachment man-hours can be reduced rather than fixing to the heat sink 7 separately. However, this embodiment does not restrict fixing the lens unit 2 and the substrate 4 to the heat sink 7 separately. 6E, the lens unit 2 is provided with a protrusion 5c, and the protrusion 5c is inserted into the fitting hole 9 of the substrate 4, so that the substrate 4 and the lens unit 2 are not integrated. It can also be used for position determination.

図７（ａ）、（ｂ）は、嵌合部１０の構成を示す。嵌合部１０は、ネジ山部１１ｐ及びネジ山部１１ｐより細いネジ切り部１１ｑを持つネジ部１１ａと、ネジ部１１ａのネジ山部１１ｐより大きい外形を持ったつば部１２と、Ｏリングなどの中空のゴム材からなるゴム部（弾性部材）１３と、つば部１２と略同形の中空を持つスペーサ部１４とにより構成される。スペーサ部１４の内径は、ネジ部１１ａのネジ切り部１１ｑより大きく、スペーサ部１４の外径は、つば部１２の外径より小さく形成されている。ゴム部１３の内径は、スペーサ部１４の外径に嵌るように形成される。このような構成により、ネジ留め時に、つば部１２でゴム部１３を密着して押圧できると共に、スペーサ部１４内にネジ部１１ａを通し、スペーサ部１４を確実に基板４（図１参照）に押圧させることができる。   7A and 7B show the configuration of the fitting portion 10. The fitting part 10 includes a threaded part 11p and a threaded part 11a having a threaded part 11q thinner than the threaded part 11p, a collar part 12 having an outer shape larger than the threaded part 11p of the threaded part 11a, an O-ring, etc. The rubber part (elastic member) 13 made of a hollow rubber material and the spacer part 14 having a hollow substantially the same shape as the collar part 12 are constituted. The inner diameter of the spacer portion 14 is larger than the threaded portion 11q of the screw portion 11a, and the outer diameter of the spacer portion 14 is smaller than the outer diameter of the collar portion 12. The inner diameter of the rubber part 13 is formed to fit the outer diameter of the spacer part 14. With such a configuration, when screwing, the rubber portion 13 can be pressed closely with the collar portion 12 and the screw portion 11a can be passed through the spacer portion 14 so that the spacer portion 14 is securely attached to the substrate 4 (see FIG. 1). Can be pressed.

このように、本実施形態によれば、ＬＥＤ３が実装された基板４を放熱板７に、強く圧接することができるので、ＬＥＤ３から発する熱を効率良く放熱板７を通して放熱することができる。そして、この放熱が良くなることにより、ＬＥＤ３により大きな電流を流すことが可能となり、ＬＥＤ３をより明るく発光させることができる。また、樹脂製のレンズユニット２を固定する際に、弾性のあるゴム部１３で押付けるので、レンズユニット２の変形や経年変化によるレンズユニット２の割れを防止することができる。同時に、ゴム部１３のスプリングワッシャの効果により、ネジ部１１ａの緩みを防止することができ、装置の信頼性と耐久性を高めることができる。   Thus, according to this embodiment, since the board | substrate 4 with which LED3 was mounted can be press-contacted to the heat sink 7 strongly, the heat | fever emitted from LED3 can be thermally radiated through the heat sink 7 efficiently. And since this heat dissipation becomes good, it becomes possible to flow a big electric current by LED3, and LED3 can be made to light-emit more brightly. Further, when the resin lens unit 2 is fixed, it is pressed by the elastic rubber portion 13, so that the lens unit 2 can be prevented from being deformed or cracked due to aging. At the same time, due to the effect of the spring washer of the rubber part 13, it is possible to prevent the screw part 11a from loosening, and to improve the reliability and durability of the apparatus.

また、レンズユニット２と基板４とを一体化することにより、レンズユニット２と基板４とを一体化構成にしたことにより、レンズユニット２と基板４を同時に放熱板７へ固定できるため、別々に放熱板７へ固定するよりも取り付け工数を削減することができる。同時に、ＬＥＤ３をレンズユニット２でほぼ完全に覆うことができ、人がＬＥＤ３に直接触れることが無くなり、人体によるＬＥＤ３の静電気破壊を防止することができる。   Moreover, since the lens unit 2 and the substrate 4 are integrated, and the lens unit 2 and the substrate 4 are integrated, the lens unit 2 and the substrate 4 can be fixed to the heat radiating plate 7 at the same time. The number of mounting steps can be reduced as compared with fixing to the heat sink 7. At the same time, the LED 3 can be almost completely covered with the lens unit 2, so that a person does not directly touch the LED 3, and electrostatic damage to the LED 3 by the human body can be prevented.

また、ＬＥＤ３の放熱性の向上に伴う電流増加により発光効率が高められ、レンズユニット２の歪や経年変化の割れを削減され、耐久性の向上された発光装置１を光源として用いることにより、明るい、信頼性の高い照明器具を構成することができる。   Further, the luminous efficiency is increased by increasing the current accompanying the improvement in the heat dissipation of the LED 3, the distortion of the lens unit 2 and the crack of secular change are reduced, and the light emitting device 1 having improved durability is used as a light source. A reliable lighting apparatus can be configured.

図８は本実施形態の発光装置１における嵌合部１０の変形例を示し、図９は、この嵌合部１０を用いて基板４を放熱板７に固定した状態を示す。この嵌合部１０は、ネジ部１１ｂを、ネジ部１１ａ（図６参照）と、つば部１２（図６参照）とスペーサ部１４（図６参照）を一体化形成した点で前記実施形態と異なる。   FIG. 8 shows a modification of the fitting portion 10 in the light emitting device 1 of the present embodiment, and FIG. 9 shows a state where the substrate 4 is fixed to the heat radiating plate 7 using the fitting portion 10. The fitting portion 10 is different from the above embodiment in that the screw portion 11b is integrally formed with the screw portion 11a (see FIG. 6), the collar portion 12 (see FIG. 6), and the spacer portion 14 (see FIG. 6). Different.

これらの図において、嵌合部１０は、ネジ部１１ｂとゴム部１３で構成され、ネジ部１１ｂは、つば部１２とスペーサ部１４とネジ切り部１１ｒとが一体化されて形成されている。スペーサ部１４の外径寸法ｂは、図９に示すように、基板４の貫通孔１５の外径寸法ａより大きく形成されている。このネジ部１１ｂは、ゴム部１３を介し、基板４の貫通孔１５を通って放熱板７のネジ穴１６に嵌合され、基板４とレンズユニット２（図３（ｂ）参照）を放熱板７に圧接する。   In these drawings, the fitting portion 10 is composed of a screw portion 11b and a rubber portion 13, and the screw portion 11b is formed by integrating a flange portion 12, a spacer portion 14, and a threaded portion 11r. As shown in FIG. 9, the outer diameter dimension b of the spacer portion 14 is formed larger than the outer diameter dimension a of the through hole 15 of the substrate 4. The screw portion 11b is fitted into the screw hole 16 of the heat radiating plate 7 through the through hole 15 of the substrate 4 through the rubber portion 13, and the substrate 4 and the lens unit 2 (see FIG. 3B) are connected to the heat radiating plate. 7 is pressed.

このように、ネジ部１１ｂを一体化形成したことにより、つば部１２とスペーサ部１４とネジ切り部１１ｒの３つの部品が１つになるため部品点数が大幅に削減される。これにより、ネジ部１１ｂによりレンズユニット２と基板４を放熱板７に取り付ける際の作業性が著しく向上する。またネジ山部１１ｐ（図７（ａ）参照）を無くしたことにより、ネジ部１１ｂは、全長が短くなり、全体を小型化できる。   Thus, by integrally forming the screw part 11b, the three parts of the collar part 12, the spacer part 14, and the threaded part 11r become one, so the number of parts is greatly reduced. Thereby, the workability | operativity at the time of attaching the lens unit 2 and the board | substrate 4 to the heat sink 7 with the screw part 11b improves remarkably. Further, by eliminating the screw thread portion 11p (see FIG. 7A), the entire length of the screw portion 11b is shortened and the entire size can be reduced.

次に、図１０（ａ）は、本実施形態の発光装置１における嵌合部１０のさらに他の変形例の構成を示し、図１０（ｂ）は、この嵌合部１０を用いて基板４を放熱板７に固定した状態を示す。本実施形態の嵌合部１０は、スペーサ部１４にテーパ１４ｓを形成した点で前記実施形態と異なる。   Next, FIG. 10A shows a configuration of still another modified example of the fitting portion 10 in the light emitting device 1 of the present embodiment, and FIG. 10B shows a substrate 4 using the fitting portion 10. The state which fixed to the heat sink 7 is shown. The fitting part 10 of this embodiment is different from the above-described embodiment in that a taper 14 s is formed on the spacer part 14.

これらの図において、嵌合部１０は、ネジ部１１ｂと、つば部１２、とスペーサ部１４と、ネジ切り部１１ｒと、ゴム部１３で構成され、スペーサ部１４にはテーパ１４ｓが形成されている。ネジ部１１ｂのスペーサ部１４が基板４に接する貫通孔１５の入口面に、スペーサ部１４のテーパ１４ｓに対応して、逆方向のテーパ１５ａが設けられている。この基板４のテーパ１５ａとスペーサ部１４のテーパ１４ｓは、互いに嵌合するように構成されている。このスペーサ部１４の外径寸法ｂは、基板４の貫通孔１５の外径寸法ａより大きく形成されている。   In these drawings, the fitting part 10 is composed of a screw part 11b, a collar part 12, a spacer part 14, a threaded part 11r, and a rubber part 13, and the spacer part 14 is formed with a taper 14s. Yes. A taper 15 a in the opposite direction is provided on the entrance surface of the through hole 15 where the spacer portion 14 of the screw portion 11 b contacts the substrate 4, corresponding to the taper 14 s of the spacer portion 14. The taper 15a of the substrate 4 and the taper 14s of the spacer portion 14 are configured to be fitted to each other. The outer diameter dimension b of the spacer portion 14 is formed larger than the outer diameter dimension a of the through hole 15 of the substrate 4.

このようにスペーサ部１４にテーパ１４ｓを設け、これに合わせて、基板４側の貫通孔１５の入り口側に逆方向のテーパ１５ａを設けたことにより、ネジ部１１ｂの基板４上の位置決めを正確に行うことができ、ネジ締め作業をスムーズに行える。   As described above, the spacer portion 14 is provided with the taper 14s, and the taper 15a in the reverse direction is provided on the entrance side of the through hole 15 on the substrate 4 side, thereby accurately positioning the screw portion 11b on the substrate 4. The screw tightening operation can be performed smoothly.

図１１（ａ）は、本実施形態の発光装置１における嵌合部１０のさらに他の変形例の構成を示し、図１１（ｂ）は、この嵌合部１０を用いて基板４を放熱板７に固定した状態を示す。本実施形態の嵌合部１０は、つば部１２と、スペーサ部１４と、ネジ切り部１１ｒとを一体したネジ部１１ｂと、ゴム部１３で構成され、ネジ部１１ｂのスペーサ部１４にテーパ１４ｔを形成した点で前記実施形態と異なる。   FIG. 11A shows a configuration of still another modified example of the fitting portion 10 in the light emitting device 1 of the present embodiment, and FIG. 11B shows the substrate 4 using the fitting portion 10 as a heat sink. 7 shows a fixed state. The fitting portion 10 according to the present embodiment is composed of a screw portion 11b in which a flange portion 12, a spacer portion 14, and a threaded portion 11r are integrated, and a rubber portion 13. The spacer portion 14 of the screw portion 11b has a taper 14t. It differs from the above embodiment in that it is formed.

これらの図において、嵌合部１０は、ネジ部１１ｂと、ゴム部１３で構成され、ネジ部１１ｂは、つば部１２、スペーサ部１４と、ネジ切り部１１ｒとを一体形成され、このネジ部１１ｂのスペーサ部１４には、テーパ１４ｔが形成されている。基板４側には、スペーサ部１４のテーパ１４ｔに対応して、貫通孔１５の入口面に逆方向のテーパ１５ａが設けられている。この基板４のテーパ１５ａとスペーサ部１４のテーパ１４ｔは、互いに嵌合するように構成されている。このスペーサ部１４の外径寸法ｂは、基板４の貫通孔１５の外径寸法ａより大きく形成されている。   In these drawings, the fitting portion 10 is constituted by a screw portion 11b and a rubber portion 13, and the screw portion 11b is integrally formed with a collar portion 12, a spacer portion 14, and a threaded portion 11r. The spacer portion 14 of 11b is formed with a taper 14t. On the substrate 4 side, a taper 15 a in the reverse direction is provided on the entrance surface of the through hole 15 corresponding to the taper 14 t of the spacer portion 14. The taper 15a of the substrate 4 and the taper 14t of the spacer portion 14 are configured to fit each other. The outer diameter dimension b of the spacer portion 14 is formed larger than the outer diameter dimension a of the through hole 15 of the substrate 4.

このように一体化されたネジ部１１ｂのスペーサ部１４にテーパ１４ｔを設け、基板４側の貫通孔１５の入り口側に逆方向のテーパ１５ａを設けたことにより、ネジ部１１ｂの基板４上の位置決めを正確に行うことができると共に、ネジ締め作業をさらにスムーズに行える。   The spacer 14 of the screw part 11b integrated in this way is provided with a taper 14t, and a taper 15a in the reverse direction is provided on the entrance side of the through hole 15 on the substrate 4 side, whereby the screw part 11b on the substrate 4 is provided. Positioning can be performed accurately and screw tightening can be performed more smoothly.

以上述べたように、本実施形態に係る発光装置１によれば、ＬＥＤ３が実装された基板４を照明器具の一部をなす放熱板７に強固に押付けることができるので、ＬＥＤ３から発する熱を効率良く放熱することができる。そして、放熱が良くなることにより、ＬＥＤ３により大きい電流を流すことが可能となり、より明るくＬＥＤ３を発光させることができる。さらに、樹脂製のレンズユニット２を固定する際に、弾性体のゴム部１３で押付けるので、レンズユニット２と基板４及び放熱板７との接合の密着性が良くなり、樹脂の変形や経年変化による樹脂の割れを防止することができる。同時に、ゴム部１３のスプリングワッシャの効果により、ネジの緩みを防止することができ、装置の耐久性を向上することができる。   As described above, according to the light emitting device 1 according to the present embodiment, the substrate 4 on which the LED 3 is mounted can be firmly pressed against the heat radiating plate 7 that forms a part of the lighting fixture. Can be efficiently dissipated. And by improving heat dissipation, it becomes possible to flow a larger current through the LED 3, and the LED 3 can emit light more brightly. Further, when the resin lens unit 2 is fixed, the elastic rubber part 13 is pressed, so that the adhesion between the lens unit 2 and the substrate 4 and the heat radiating plate 7 is improved. It is possible to prevent cracking of the resin due to changes. At the same time, due to the effect of the spring washer of the rubber part 13, it is possible to prevent the screws from loosening and improve the durability of the apparatus.

また、レンズユニットと基板を一体型として構成することにより、レンズユニットと基板を同時に放熱板へ固定できるため、別々に放熱板へ固定するよりも作業性を軽減することができる。そして、ＬＥＤがレンズユニットでほぼ完全に覆われ、人間が直接ＬＥＤを触れることが無くなり、ＬＥＤの人体による静電気破壊を防止することができる。   In addition, since the lens unit and the substrate are configured as an integrated type, the lens unit and the substrate can be fixed to the heat sink at the same time, so that the workability can be reduced as compared with the case where the lens unit and the substrate are separately fixed to the heat sink. Then, the LED is almost completely covered with the lens unit, so that the human does not touch the LED directly, and the electrostatic breakdown of the LED by the human body can be prevented.

また、ＬＥＤを実装する基板に金属基板を使用することによりと、経年変化による基板の寸法変化（縮み、ヤセ）が無いので長期にわたり安定した押付け力が得られ、ＬＥＤの放熱性能が安定させることができる。   In addition, by using a metal substrate as the substrate for mounting the LED, there is no dimensional change (shrinkage, fraying) of the substrate due to aging, so a stable pressing force can be obtained for a long time, and the heat dissipation performance of the LED should be stabilized Can do.

また、スペーサ部と基板との双方の接触面にテーパを設けたことにより、ネジ部の基板上の位置決めを正確に行うことができ、ネジ締め作業をスムーズに行え、量産の作業性が上がる。   Further, by providing the taper on the contact surfaces of both the spacer portion and the substrate, the screw portion can be accurately positioned on the substrate, the screw tightening operation can be performed smoothly, and the mass production workability is improved.

本発明の一実施形態に係る発光装置の断面図。1 is a cross-sectional view of a light emitting device according to an embodiment of the present invention. 上記発光装置の平面図。The top view of the said light-emitting device. （ａ）はネジ部の未締結の状態における図１のＡ部の拡大図、（ｂ）はネジ部の締結された状態における図１のＡ部の拡大図。(A) is an enlarged view of the A part of FIG. 1 in a state where the screw part is not fastened, and (b) is an enlarged view of the A part of FIG. 1 in a state where the screw part is fastened. （ａ）は上記発光装置のレンズユニットの断面図、（ｂ）は（ａ）の平面図、（ｃ）は（ｂ）のＢ１−Ｂ１線断面図、（ｄ）は分離型レンズユニットの場合の断面図。(A) is a cross-sectional view of the lens unit of the light-emitting device, (b) is a plan view of (a), (c) is a cross-sectional view taken along line B1-B1 of (b), and (d) is a separation type lens unit. FIG. （ａ）はＬＥＤを実装した基板の断面図、（ｂ）は基板を金属基板とした場合の一部拡大断面図。(A) is sectional drawing of the board | substrate which mounted LED, (b) is a partially expanded sectional view at the time of using a board | substrate as a metal substrate. （ａ）は基板と一体化したレンズユニットの断面図、（ｂ）は（ａ）の平面図、（ｃ）は（ａ）のＣ部の時系列での拡大断面図、（ｄ）は基板とレンズユニットのネジ接合の場合の拡大断面図、（ｅ）は基板とレンズユニットの位置決め接合の場合の拡大断面図。(A) is a sectional view of a lens unit integrated with a substrate, (b) is a plan view of (a), (c) is an enlarged sectional view of part C of (a) in time series, and (d) is a substrate. FIG. 5E is an enlarged cross-sectional view in the case of screw joining of the lens unit and FIG. （ａ）は上記発光装置の嵌合部の分解図及び組立図、（ｂ）は同部の平面図。(A) is the exploded view and assembly drawing of the fitting part of the said light-emitting device, (b) is a top view of the part. （ａ）は本実施形態に係る嵌合部の変形例の分解図及び組立図、（ｂ）は同部の平面図。(A) is an exploded view and assembly drawing of the modification of the fitting part which concerns on this embodiment, (b) is a top view of the part. 上記嵌合部で接合された基板と放熱板の断面図。Sectional drawing of the board | substrate and heat sink which were joined by the said fitting part. （ａ）は本実施形態に係る嵌合部の他の変形例の構成図、（ｂ）は同嵌合部で接合された基板と放熱板の断面図。(A) is a block diagram of the other modification of the fitting part which concerns on this embodiment, (b) is sectional drawing of the board | substrate and heat sink joined by the fitting part. （ａ）は本実施形態に係る嵌合部の他の変形例の構成図、（ｂ）は同嵌合部で接合された基板と放熱板の断面図。(A) is a block diagram of the other modification of the fitting part which concerns on this embodiment, (b) is sectional drawing of the board | substrate and heat sink joined by the fitting part. （ａ）は従来の発光装置の断面図、（ｂ）は（ａ）の平面図、（ｃ）は（ a ）のＤ部の拡大図、（ｄ）はレンズユニットが割れた状態における（ｂ）のＤ部の拡大図。(A) is a cross-sectional view of a conventional light emitting device, (b) is a plan view of (a), (c) is an enlarged view of portion D of (a), and (d) is a state in which the lens unit is broken (b FIG.

符号の説明Explanation of symbols

１ 発光装置
２ レンズユニット
３ ＬＥＤ（発光ダイオード）
４、４ａ 基板
６ 窪み部（縁部）
７ 放熱板（放熱部材）
１０ 嵌合部（嵌合手段）
１１ａ〜１１ｂ ネジ部
１２ つば部
１３ ゴム部（弾性部材）
１４ スペーサ部
１４ｓ、１４ｔ、１５ａ テーパ
１５ 貫通孔
１６ ネジ穴 1 Light Emitting Device 2 Lens Unit 3 LED (Light Emitting Diode)
4, 4a Substrate 6 Depression (edge)
7 Heat sink (heat radiating member)
10 Fitting part (fitting means)
11a-11b Screw part 12 Collar part 13 Rubber part (elastic member)
14 Spacer portion 14s, 14t, 15a Taper 15 Through hole 16 Screw hole

Claims (4)

発光ダイオード（ＬＥＤ）が実装された基板と、この基板を覆う樹脂製のレンズユニットと、前記基板の背面に取付けられた放熱部材とを備えた発光装置において、
前記基板の外形を、前記レンズユニットの外形より小さく形成し、
前記基板及び前記放熱部材に、互いに対応する孔部を設け、
前記基板及びレンズユニットを前記放熱部材に固定するための嵌合手段を備え、
前記嵌合手段は、前記孔部に嵌入されるネジ部と、このネジ部の頭部にあるつば部と、該つば部により押圧されて変形し前記レンズユニットの縁部を押圧する弾性部材と、前記基板を前記放熱部材に押圧するためのスペーサ部とを備えたことを特徴とする発光装置。 In a light emitting device including a substrate on which a light emitting diode (LED) is mounted, a resin lens unit covering the substrate, and a heat dissipation member attached to the back surface of the substrate,
Forming the outer shape of the substrate smaller than the outer shape of the lens unit;
The substrate and the heat dissipation member are provided with holes corresponding to each other,
A fitting means for fixing the substrate and the lens unit to the heat radiating member;
The fitting means includes a screw portion to be inserted into the hole portion, a flange portion at a head portion of the screw portion, and an elastic member that is pressed and deformed by the flange portion to press the edge portion of the lens unit. A light emitting device comprising: a spacer portion for pressing the substrate against the heat radiating member. 前記レンズユニットと前記基板とを一体化したことを特徴とする請求項１又は請求項２に記載の発光装置。   The light emitting device according to claim 1, wherein the lens unit and the substrate are integrated. 前記スペーサ部と前記基板との接触面にそれぞれテーパを設けたことを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein a taper is provided on each contact surface between the spacer portion and the substrate. 前記請求項１乃至請求項３のいずれかに記載の発光装置を用いたことを特徴とする照明器具。   A lighting apparatus comprising the light emitting device according to any one of claims 1 to 3.
JP2005152997A 2005-05-25 2005-05-25 Light emitting device and lighting apparatus using the same Expired - Fee Related JP4529795B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005152997A JP4529795B2 (en) 2005-05-25 2005-05-25 Light emitting device and lighting apparatus using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005152997A JP4529795B2 (en) 2005-05-25 2005-05-25 Light emitting device and lighting apparatus using the same

Publications (2)

Publication Number Publication Date
JP2006331817A true JP2006331817A (en) 2006-12-07
JP4529795B2 JP4529795B2 (en) 2010-08-25

Family

ID=37553299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005152997A Expired - Fee Related JP4529795B2 (en) 2005-05-25 2005-05-25 Light emitting device and lighting apparatus using the same

Country Status (1)

Country Link
JP (1) JP4529795B2 (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008138231A1 (en) * 2007-05-16 2008-11-20 Jie She Led lamp of highly efficient heat dissipation
JP2009071186A (en) * 2007-09-14 2009-04-02 Stanley Electric Co Ltd Led unit
JP2009123601A (en) * 2007-11-16 2009-06-04 Toyoda Gosei Co Ltd Lighting system
JP2009205834A (en) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd Lighting fixture for vehicle
JP2009267292A (en) * 2008-04-30 2009-11-12 Toshiba Lighting & Technology Corp Light-emitting device and luminaire
JP2010526416A (en) * 2007-05-04 2010-07-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED-type luminaire and related method for temperature management
JP2010529600A (en) * 2007-06-07 2010-08-26 浙江名▲創▼光▲電▼科技有限公司 High power LED lamp
KR100983954B1 (en) 2008-07-16 2010-09-27 김수식 The outdoor lighting device where the light-emitting diode is had
JP2010258457A (en) * 2009-04-23 2010-11-11 Ipc Korea Co Ltd Light emitting device
JP2010287312A (en) * 2009-01-13 2010-12-24 Enplas Corp Light-emitting device and lighting system
JP2011119094A (en) * 2009-12-02 2011-06-16 Koito Mfg Co Ltd Lighting fixture for vehicle
JP2011134668A (en) * 2009-12-25 2011-07-07 Casio Computer Co Ltd Light source device and projector
JP2011521410A (en) * 2008-05-15 2011-07-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ High pressure gas discharge lamp for lighting equipment
CN102182939A (en) * 2009-11-09 2011-09-14 Lg伊诺特有限公司 Lighting device
WO2011121845A1 (en) * 2010-03-31 2011-10-06 シャープ株式会社 Illumination apparatus and plant cultivation apparatus
JP2011254008A (en) * 2010-06-03 2011-12-15 Sharp Corp Display device and method of manufacturing the same
JP2012048969A (en) * 2010-08-26 2012-03-08 Panasonic Electric Works Co Ltd Led illumination unit
JP2012133964A (en) * 2010-12-21 2012-07-12 Panasonic Corp Led unit, and lighting fixture using the same
JP2013008555A (en) * 2011-06-24 2013-01-10 Casio Computer Co Ltd Light source device and projector
WO2013014809A1 (en) * 2011-07-27 2013-01-31 コニカミノルタアドバンストレイヤー株式会社 Led illumination device and optical element
JP2013506251A (en) * 2009-09-25 2013-02-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Semiconductor lighting device
JP2014007317A (en) * 2012-06-26 2014-01-16 Toyoda Gosei Co Ltd Light-emitting module
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
JP2015011773A (en) * 2013-06-26 2015-01-19 三菱電機株式会社 Illumination lamp and luminaire including the same
CN105090852A (en) * 2014-05-09 2015-11-25 松下知识产权经营株式会社 Lighting apparatus and automobile including the same
WO2015176605A1 (en) * 2014-05-20 2015-11-26 彭依彧 Heat-dissipation led street lamp
JP2015216023A (en) * 2014-05-09 2015-12-03 パナソニックＩｐマネジメント株式会社 Luminaire and vehicle including luminaire
WO2016006446A1 (en) * 2014-07-11 2016-01-14 スタンレー電気株式会社 Road lighting fixture
JP2016162705A (en) * 2015-03-05 2016-09-05 東芝ライテック株式会社 Light fixture
JP2016167468A (en) * 2016-06-22 2016-09-15 日立アプライアンス株式会社 Luminaire
JP2019133753A (en) * 2018-01-29 2019-08-08 三菱電機株式会社 Lighting fixture
JP2020057628A (en) * 2018-07-10 2020-04-09 東芝ライテック株式会社 Lighting fixture
WO2021209343A1 (en) * 2020-04-14 2021-10-21 Signify Holding B.V. Illumination device
WO2023006428A1 (en) * 2021-07-28 2023-02-02 Signify Holding B.V. Sealed assembly and manufacturing process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233115B1 (en) * 2020-06-11 2021-03-29 엘이디라이팅 주식회사 Lens module for led luminaire

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144415U (en) * 1980-03-31 1981-10-31
JPS62211973A (en) * 1986-03-12 1987-09-17 Honda Motor Co Ltd Lighting device using light emitting diode
JPS642309U (en) * 1987-06-25 1989-01-09
JPH063644U (en) * 1992-06-22 1994-01-18 ローム株式会社 Structure of LED array print head
JP2002093206A (en) * 2000-09-18 2002-03-29 Stanley Electric Co Ltd Led signal light
JP2004265724A (en) * 2003-02-28 2004-09-24 Toshiba Lighting & Technology Corp Luminaire
JP2004265626A (en) * 2003-02-13 2004-09-24 Matsushita Electric Ind Co Ltd Socket for led light source
JP2005085912A (en) * 2003-09-05 2005-03-31 Seiwa Electric Mfg Co Ltd Led lamp
JP2005268172A (en) * 2004-03-22 2005-09-29 Morikawa Seisakusho:Kk Illumination fixture
JP2006172893A (en) * 2004-12-15 2006-06-29 Matsushita Electric Works Ltd Lighting fixture

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56144415U (en) * 1980-03-31 1981-10-31
JPS62211973A (en) * 1986-03-12 1987-09-17 Honda Motor Co Ltd Lighting device using light emitting diode
JPS642309U (en) * 1987-06-25 1989-01-09
JPH063644U (en) * 1992-06-22 1994-01-18 ローム株式会社 Structure of LED array print head
JP2002093206A (en) * 2000-09-18 2002-03-29 Stanley Electric Co Ltd Led signal light
JP2004265626A (en) * 2003-02-13 2004-09-24 Matsushita Electric Ind Co Ltd Socket for led light source
JP2004265724A (en) * 2003-02-28 2004-09-24 Toshiba Lighting & Technology Corp Luminaire
JP2005085912A (en) * 2003-09-05 2005-03-31 Seiwa Electric Mfg Co Ltd Led lamp
JP2005268172A (en) * 2004-03-22 2005-09-29 Morikawa Seisakusho:Kk Illumination fixture
JP2006172893A (en) * 2004-12-15 2006-06-29 Matsushita Electric Works Ltd Lighting fixture

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010526416A (en) * 2007-05-04 2010-07-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ LED-type luminaire and related method for temperature management
WO2008138231A1 (en) * 2007-05-16 2008-11-20 Jie She Led lamp of highly efficient heat dissipation
JP2010529600A (en) * 2007-06-07 2010-08-26 浙江名▲創▼光▲電▼科技有限公司 High power LED lamp
JP2009071186A (en) * 2007-09-14 2009-04-02 Stanley Electric Co Ltd Led unit
JP2009123601A (en) * 2007-11-16 2009-06-04 Toyoda Gosei Co Ltd Lighting system
JP2009205834A (en) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd Lighting fixture for vehicle
JP2009267292A (en) * 2008-04-30 2009-11-12 Toshiba Lighting & Technology Corp Light-emitting device and luminaire
JP2011521410A (en) * 2008-05-15 2011-07-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ High pressure gas discharge lamp for lighting equipment
KR100983954B1 (en) 2008-07-16 2010-09-27 김수식 The outdoor lighting device where the light-emitting diode is had
JP2010287312A (en) * 2009-01-13 2010-12-24 Enplas Corp Light-emitting device and lighting system
JP2010258457A (en) * 2009-04-23 2010-11-11 Ipc Korea Co Ltd Light emitting device
JP2013506251A (en) * 2009-09-25 2013-02-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Semiconductor lighting device
US9562680B2 (en) 2009-11-09 2017-02-07 LG Innotek., Ltd. Lighting device
CN102182939A (en) * 2009-11-09 2011-09-14 Lg伊诺特有限公司 Lighting device
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
US8471443B2 (en) 2009-11-09 2013-06-25 Lg Innotek Co., Ltd. Lighting device
JP2011119094A (en) * 2009-12-02 2011-06-16 Koito Mfg Co Ltd Lighting fixture for vehicle
JP2011134668A (en) * 2009-12-25 2011-07-07 Casio Computer Co Ltd Light source device and projector
WO2011121845A1 (en) * 2010-03-31 2011-10-06 シャープ株式会社 Illumination apparatus and plant cultivation apparatus
JP2011254008A (en) * 2010-06-03 2011-12-15 Sharp Corp Display device and method of manufacturing the same
JP2012048969A (en) * 2010-08-26 2012-03-08 Panasonic Electric Works Co Ltd Led illumination unit
JP2012133964A (en) * 2010-12-21 2012-07-12 Panasonic Corp Led unit, and lighting fixture using the same
JP2013008555A (en) * 2011-06-24 2013-01-10 Casio Computer Co Ltd Light source device and projector
US8702241B2 (en) 2011-06-24 2014-04-22 Casio Computer Co., Ltd. Light source device and projector
WO2013014809A1 (en) * 2011-07-27 2013-01-31 コニカミノルタアドバンストレイヤー株式会社 Led illumination device and optical element
JP2014007317A (en) * 2012-06-26 2014-01-16 Toyoda Gosei Co Ltd Light-emitting module
JP2015011773A (en) * 2013-06-26 2015-01-19 三菱電機株式会社 Illumination lamp and luminaire including the same
JP2015216023A (en) * 2014-05-09 2015-12-03 パナソニックＩｐマネジメント株式会社 Luminaire and vehicle including luminaire
CN105090852A (en) * 2014-05-09 2015-11-25 松下知识产权经营株式会社 Lighting apparatus and automobile including the same
US9909733B2 (en) 2014-05-09 2018-03-06 Panasonic Intellectual Property Management Co., Ltd. Lighting apparatus and automobile including the same
WO2015176605A1 (en) * 2014-05-20 2015-11-26 彭依彧 Heat-dissipation led street lamp
WO2016006446A1 (en) * 2014-07-11 2016-01-14 スタンレー電気株式会社 Road lighting fixture
JP2016162705A (en) * 2015-03-05 2016-09-05 東芝ライテック株式会社 Light fixture
JP2016167468A (en) * 2016-06-22 2016-09-15 日立アプライアンス株式会社 Luminaire
JP2019133753A (en) * 2018-01-29 2019-08-08 三菱電機株式会社 Lighting fixture
JP7026518B2 (en) 2018-01-29 2022-02-28 三菱電機株式会社 lighting equipment
JP2020057628A (en) * 2018-07-10 2020-04-09 東芝ライテック株式会社 Lighting fixture
WO2021209343A1 (en) * 2020-04-14 2021-10-21 Signify Holding B.V. Illumination device
US12007100B2 (en) 2020-04-14 2024-06-11 Signify Holding, B.V. Illumination device
WO2023006428A1 (en) * 2021-07-28 2023-02-02 Signify Holding B.V. Sealed assembly and manufacturing process

Also Published As

Publication number Publication date
JP4529795B2 (en) 2010-08-25

Similar Documents

Publication Publication Date Title
JP4529795B2 (en) Light emitting device and lighting apparatus using the same
US7976188B2 (en) LED illumination device and illumination module using the same
US7654702B1 (en) LED lamp
JP4703761B2 (en) Light irradiation device
JP5285417B2 (en) Lighting device
JP5720468B2 (en) Light bulb shaped LED lamp
JP3132536U (en) LED module
JP6191914B2 (en) Lighting device
JP5830697B2 (en) Lamp and lighting device
US20080291677A1 (en) Led lamp with a perforated cover plate
JP5732612B2 (en) LED unit and lighting apparatus using the same
US7507004B2 (en) Lamp with heat dissipating capability
EP2551584A2 (en) Bulb-type led lamp
JP5483537B2 (en) LED downlight lighting device
JP5563407B2 (en) LED lighting unit
US9791141B2 (en) Light emitting diode module
JP5282953B2 (en) Lighting device
JP5017688B2 (en) Light emitting device and illumination lamp
JP5772661B2 (en) lighting equipment
JP2010055939A (en) Light source unit and lighting fixture
JP2011082095A (en) Lighting device
JP4716008B2 (en) Socket and lighting device
JP2014212076A (en) Lighting apparatus
JP5072568B2 (en) LED lighting device
JP2015002118A (en) Illumination lamp

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080325

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100126

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100315

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100518

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100531

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130618

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees