JP2006287533A - 光学装置用モジュール - Google Patents
光学装置用モジュール Download PDFInfo
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- JP2006287533A JP2006287533A JP2005103775A JP2005103775A JP2006287533A JP 2006287533 A JP2006287533 A JP 2006287533A JP 2005103775 A JP2005103775 A JP 2005103775A JP 2005103775 A JP2005103775 A JP 2005103775A JP 2006287533 A JP2006287533 A JP 2006287533A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
【解決手段】 撮像部1に螺子部15を設け、光路画定器20に螺子部15と螺嵌する螺子穴部28とを設け、螺子部15及び螺子穴部28を螺嵌させることで、固体撮像素子2の表面に接着された透光性蓋体6に光路画定器20の鏡筒22を接触させて固定する。また、固体撮像素子2、透光性蓋体6、DSP8及び配線基板7等を樹脂よりなる封止部14により封止する。
【選択図】 図2
Description
2 固体撮像素子
3 撮像面
5 接着部
6 透光性蓋体
7 配線基板
8 DSP(画像処理装置)
14 封止部
15 螺子部
20 光路画定器
21 レンズ
22 鏡筒(保持体)
23 位置決め爪(位置決め部)
24 弾性体
25 支持部
28 螺子穴部
Claims (8)
- 撮像面を有する固体撮像素子、前記撮像面に対向して配される透光性蓋体及び前記固体撮像素子に前記透光性蓋体を接着する接着部を有する撮像部と、光学部材及び該光学部材を保持する保持体を有し、前記撮像面への光路を画定する光路画定器とを備える光学装置用モジュールにおいて、
前記撮像部は、前記透光性蓋体の一部又は全部を露出させて、前記固体撮像素子及び前記透光性蓋体を樹脂により封止する封止部を有し、
前記透光性蓋体の前記封止部からの露出部分に前記保持体を接触させ、前記光路画定器を前記撮像部に固定する固定手段を備え、
該固定手段は、前記撮像部に設けられた螺子部と、前記光路画定器に設けられ、前記螺子部と螺嵌する螺子穴部とを有し、前記螺子部及び前記螺子穴部を螺嵌して、前記撮像部に前記光路画定器を固定するようにしてあること
を特徴とする光学装置用モジュール。 - 前記撮像部は、導体配線が形成された配線基板と、該配線基板に固定され、前記導体配線に電気的に接続される画像処理装置とを有し、
前記封止部は、前記固体撮像素子及び前記透光性蓋体と共に、前記配線基板及び前記画像処理装置を樹脂により封止するようにしてあること
を特徴とする請求項1に記載の光学装置用モジュール。 - 前記螺子部は、樹脂よりなり、前記封止部と一体的に形成してあること
を特徴とする請求項1又は請求項2に記載の光学装置用モジュール。 - 前記保持体は、前記保持体及び前記透光性蓋体の相対位置を決定する位置決め部を有すること
を特徴とする請求項1乃至請求項3のいずれか1つに記載の光学装置用モジュール。 - 前記透光性蓋体は板状をなし、前記封止部から一つの面と側面の一部又は全部とが露出しており、
前記位置決め部は、前記保持体を前記透光性蓋体の一つの面に接触させた場合に、前記透光性蓋体の側面の少なくとも2箇所に係合する爪部を有すること
を特徴とする請求項4に記載の光学装置用モジュール。 - 前記光路画定器は、前記保持体に固定された弾性体と、該弾性体を支持する支持部とを備え、
前記撮像部に前記光路画定器を固定した場合に、前記弾性体が前記保持体を前記透光性蓋体に押圧するようにしてあること
を特徴とする請求項1乃至請求項5のいずれか1つに記載の光学装置用モジュール。 - 前記支持部は、前記弾性体が前記支持部に対して相対移動可能に、前記弾性体を支持するようにしてあること
を特徴とする請求項6に記載の光学装置用モジュール。 - 前記光路画定器を前記撮像部に固定した場合、前記保持体は前記封止部と接触しないようにしてあること
を特徴とする請求項1乃至請求項7のいずれか1つに記載の光学装置用モジュール。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103775A JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
US11/396,427 US7294828B2 (en) | 2005-03-31 | 2006-03-30 | Distortion and shock resistant optical device module for image capture |
TW095111290A TWI302209B (en) | 2005-03-31 | 2006-03-30 | Optical device module |
EP06251791A EP1708476A3 (en) | 2005-03-31 | 2006-03-30 | Optical device module |
CNB2006100719797A CN100423562C (zh) | 2005-03-31 | 2006-03-31 | 光学装置模块 |
KR1020060029824A KR100758584B1 (ko) | 2005-03-31 | 2006-03-31 | 광학 장치용 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005103775A JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006287533A true JP2006287533A (ja) | 2006-10-19 |
JP4233536B2 JP4233536B2 (ja) | 2009-03-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005103775A Expired - Fee Related JP4233536B2 (ja) | 2005-03-31 | 2005-03-31 | 光学装置用モジュール |
Country Status (6)
Country | Link |
---|---|
US (1) | US7294828B2 (ja) |
EP (1) | EP1708476A3 (ja) |
JP (1) | JP4233536B2 (ja) |
KR (1) | KR100758584B1 (ja) |
CN (1) | CN100423562C (ja) |
TW (1) | TWI302209B (ja) |
Cited By (8)
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WO2009057436A1 (ja) * | 2007-11-01 | 2009-05-07 | Konica Minolta Holdings, Inc. | 撮像装置 |
JP2009204721A (ja) * | 2008-02-26 | 2009-09-10 | Fujinon Corp | カメラモジュール及びカメラモジュールの実装方法 |
US7923676B2 (en) | 2007-04-27 | 2011-04-12 | Sharp Kabushiki Kaisha | Optical unit, solid-state image sensing device with position adjusting section and electronic apparatus comprising same |
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JP2019517171A (ja) * | 2016-03-28 | 2019-06-20 | ニンボー サニー オプテック カンパニー,リミテッド | カメラモジュールおよび成型された感光性アセンブリおよびその製造方法、および電子デバイス |
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2005
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2006
- 2006-03-30 US US11/396,427 patent/US7294828B2/en not_active Expired - Fee Related
- 2006-03-30 EP EP06251791A patent/EP1708476A3/en not_active Withdrawn
- 2006-03-30 TW TW095111290A patent/TWI302209B/zh not_active IP Right Cessation
- 2006-03-31 KR KR1020060029824A patent/KR100758584B1/ko not_active IP Right Cessation
- 2006-03-31 CN CNB2006100719797A patent/CN100423562C/zh not_active Expired - Fee Related
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JP2009204721A (ja) * | 2008-02-26 | 2009-09-10 | Fujinon Corp | カメラモジュール及びカメラモジュールの実装方法 |
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JP2019016998A (ja) * | 2017-07-10 | 2019-01-31 | 海華科技股▲分▼有限公司 | 携帯型電子装置、画像撮影モジュール及び画像検知ユニット |
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WO2022270633A1 (ja) * | 2021-06-24 | 2022-12-29 | 京セラ株式会社 | 非接触通信媒体 |
Also Published As
Publication number | Publication date |
---|---|
JP4233536B2 (ja) | 2009-03-04 |
TWI302209B (en) | 2008-10-21 |
TW200641430A (en) | 2006-12-01 |
US20060219885A1 (en) | 2006-10-05 |
KR20060105677A (ko) | 2006-10-11 |
CN100423562C (zh) | 2008-10-01 |
US7294828B2 (en) | 2007-11-13 |
EP1708476A3 (en) | 2008-01-16 |
CN1842139A (zh) | 2006-10-04 |
KR100758584B1 (ko) | 2007-09-13 |
EP1708476A2 (en) | 2006-10-04 |
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