JP2006269564A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2006269564A JP2006269564A JP2005082785A JP2005082785A JP2006269564A JP 2006269564 A JP2006269564 A JP 2006269564A JP 2005082785 A JP2005082785 A JP 2005082785A JP 2005082785 A JP2005082785 A JP 2005082785A JP 2006269564 A JP2006269564 A JP 2006269564A
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- Prior art keywords
- semiconductor chip
- heat
- chip
- semiconductor device
- semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】
プリント配線基板2の一方の面にフリップチップ実装される半導体チップ3と、半導体チップ3から発生した熱を放熱する放熱部材4とを有し、放熱部材4は、半導体チップ3のフリップチップ実装している側とは反対側の全面に熱伝導性接着剤を介して取り付けられていることを特徴とする。
【選択図】図1
Description
Claims (3)
- プリント配線基板の一方の面にフリップチップ実装される半導体チップと、
上記半導体チップから発生した熱を放熱する放熱部材とを有し、
上記放熱部材は、上記半導体チップのフリップチップ実装している側とは反対側の全面に熱伝導性接着剤を介して取り付けられ、上記半導体チップとともに上記プリント配線基板上に取り付けられていることを特徴とする半導体装置。 - 更に、上記プリント配線基板の上記半導体チップが実装されている面に突き合わされる外周壁の内側に放熱部材に突き合わされる突部が設けられた金属製のキャップ部材を有することを特徴とする請求項1記載の半導体装置。
- 上記半導体チップには、高周波回路が形成されていることを特徴とする請求項1記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005082785A JP4696621B2 (ja) | 2005-03-22 | 2005-03-22 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005082785A JP4696621B2 (ja) | 2005-03-22 | 2005-03-22 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006269564A true JP2006269564A (ja) | 2006-10-05 |
JP4696621B2 JP4696621B2 (ja) | 2011-06-08 |
Family
ID=37205238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005082785A Expired - Fee Related JP4696621B2 (ja) | 2005-03-22 | 2005-03-22 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4696621B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021093386A (ja) * | 2019-12-06 | 2021-06-17 | サクサ株式会社 | 電子機器における放熱構造 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61120451A (ja) * | 1984-11-16 | 1986-06-07 | Nec Corp | 半導体容器 |
JPH01107141U (ja) * | 1988-01-07 | 1989-07-19 | ||
JPH09298275A (ja) * | 1996-04-30 | 1997-11-18 | Toshiba Corp | 半導体装置 |
JPH1032305A (ja) * | 1996-07-16 | 1998-02-03 | Nec Corp | マルチチップモジュール |
JPH1126623A (ja) * | 1997-06-30 | 1999-01-29 | Oki Electric Ind Co Ltd | 電子装置、電子装置の製造方法 |
JPH1174425A (ja) * | 1997-06-03 | 1999-03-16 | Lsi Logic Corp | フリップチップパッケージ用高性能熱拡散装置 |
JP2000195979A (ja) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2000299398A (ja) * | 1999-04-12 | 2000-10-24 | Nec Corp | マイクロ波集積回路 |
JP2003124665A (ja) * | 2001-10-11 | 2003-04-25 | Fujikura Ltd | 電子装置用放熱構造 |
JP2003124411A (ja) * | 2001-10-05 | 2003-04-25 | Samsung Electronics Co Ltd | 半導体パッケージ |
JP2003152149A (ja) * | 2001-11-03 | 2003-05-23 | Samsung Electronics Co Ltd | 半導体パッケージ及びその製造方法 |
JP2003258142A (ja) * | 2002-02-28 | 2003-09-12 | Hitachi Ltd | 半導体装置 |
JP2004153179A (ja) * | 2002-10-31 | 2004-05-27 | Hitachi Ltd | 半導体装置および電子装置 |
-
2005
- 2005-03-22 JP JP2005082785A patent/JP4696621B2/ja not_active Expired - Fee Related
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61120451A (ja) * | 1984-11-16 | 1986-06-07 | Nec Corp | 半導体容器 |
JPH01107141U (ja) * | 1988-01-07 | 1989-07-19 | ||
JPH09298275A (ja) * | 1996-04-30 | 1997-11-18 | Toshiba Corp | 半導体装置 |
JPH1032305A (ja) * | 1996-07-16 | 1998-02-03 | Nec Corp | マルチチップモジュール |
JPH1174425A (ja) * | 1997-06-03 | 1999-03-16 | Lsi Logic Corp | フリップチップパッケージ用高性能熱拡散装置 |
JPH1126623A (ja) * | 1997-06-30 | 1999-01-29 | Oki Electric Ind Co Ltd | 電子装置、電子装置の製造方法 |
JP2000195979A (ja) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2000299398A (ja) * | 1999-04-12 | 2000-10-24 | Nec Corp | マイクロ波集積回路 |
JP2003124411A (ja) * | 2001-10-05 | 2003-04-25 | Samsung Electronics Co Ltd | 半導体パッケージ |
JP2003124665A (ja) * | 2001-10-11 | 2003-04-25 | Fujikura Ltd | 電子装置用放熱構造 |
JP2003152149A (ja) * | 2001-11-03 | 2003-05-23 | Samsung Electronics Co Ltd | 半導体パッケージ及びその製造方法 |
JP2003258142A (ja) * | 2002-02-28 | 2003-09-12 | Hitachi Ltd | 半導体装置 |
JP2004153179A (ja) * | 2002-10-31 | 2004-05-27 | Hitachi Ltd | 半導体装置および電子装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021093386A (ja) * | 2019-12-06 | 2021-06-17 | サクサ株式会社 | 電子機器における放熱構造 |
JP7326138B2 (ja) | 2019-12-06 | 2023-08-15 | サクサ株式会社 | 電子機器における放熱構造 |
Also Published As
Publication number | Publication date |
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JP4696621B2 (ja) | 2011-06-08 |
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