JP2006261478A - プリント配線基板およびその製造方法と実装方法ならびにプログラム - Google Patents
プリント配線基板およびその製造方法と実装方法ならびにプログラム Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
【解決手段】レジスト材で覆われた部品ランド6とレジスト材で覆われない部品ランド5が混在するプリント配線基板1であって、かつ、基板認識マーク3用の導体箔7と基板認識マーク用のレジスト開口4を同一形状および同一寸法とし、基板認識マーク用の導体箔7と基板認識マーク用のレジスト開口4との重なりでできた導体箔7の露出部分を基板認識マーク3とし、CCDカメラ等の撮像装置で撮像して中心点12を求めそれを基準点とする。これにより、レジスト位置ズレが発生しても、クリームはんだ印刷位置ズレおよび部品搭載位置ズレを、レジスト材で覆われた部品ランド6とレジスト材で覆われない部品ランド5でのズレ量を均等にする。
【選択図】図1
Description
Claims (5)
- 導体箔で形成された基板認識マークと、レジスト材で覆われた部品ランドと、レジスト材で覆われない部品ランドとを具備するプリント配線基板であって、
上記基板認識マーク用の導体箔は、当該基板認識マーク用のレジスト開口と同一形状および同一寸法からなり、該導体箔と該レジスト開口との重なりでできた該導体箔の露出部分を基板認識マークとして用いることを特徴とするプリント配線基板。 - 請求項1に記載のプリント配線基板に印刷機にてクリームはんだを印刷する方法であって、
上記導体箔と上記レジスト開口との重なりで形成された上記基板認識マークを撮像装置で撮像して該基板認識マークの中心点を求める手順と、
該中心点を基準としてレジスト材で覆われた部品ランドとレジスト材で覆われない部品ランドに対するズレ量を均等に分散してクリームはんだを印刷する手順と
を有することを特徴とするプリント配線基板印刷方法。 - 請求項1に記載のプリント配線基板に自動マウンタで部品を搭載する方法であって、
上記導体箔と上記レジスト開口との重なりで形成された上記基板認識マークを撮像装置で撮像して該基板認識マークの中心点を求める手順と、
該中心点を基準としてレジスト材で覆われた部品ランドとレジスト材で覆われない部品ランドに対するズレ量を均等分散して部品を搭載する手順と
を有することを特徴とするプリント配線基板実装方法。 - 請求項1に記載のプリント配線基板に自動マウンタで部品を搭載する方法であって、
上記導体箔と上記レジスト開口との重なりで形成された上記基板認識マークを撮像装置で撮像して該基板認識マークの中心点を求める第1の手順と、
上記基板認識マークの寸法(X2,Y2)を計測して、上記導体箔の設計値寸法X1,Y1との差X3,Y3を算出する第2の手順と、
該第2の手順で算出した差X3,Y3を1/2してX4,Y4を求める第3の手順と、
レジスト材のズレ方向に対応させて上記第1の手順で求めた基板認識マークの中心点のX座標,Y座標に上記第3の手順で求めたX4,Y4を加算もしくは減算することで上記導体箔の中心点および上記レジスト開口の中心点を求める第4の手順と、
該第4の手順で求めた上記導体箔の中心点を基準として、レジスト材で覆われない部品ランドに対応する部品を搭載する第5の手順と、
上記第4の手順で求めたレジスト開口の中心点を基準として、レジスト材で覆われた部品ランドに対応する部品を搭載する第6の手順と
を有することを特徴とするプリント配線基板実装方法。 - コンピュータに、請求項3もしくは請求項4のいずれかに記載のプリント配線基板実装方法における各手順を実行させることを特徴とするプログラム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005078496A JP4646661B2 (ja) | 2005-03-18 | 2005-03-18 | プリント配線基板印刷方法と実装方法ならびにプログラム |
US11/372,087 US7313862B2 (en) | 2005-03-18 | 2006-03-10 | Method of mounting components on a PCB |
CNB2006100673952A CN100515158C (zh) | 2005-03-18 | 2006-03-20 | 印刷布线板及其制造方法和安装方法 |
US11/938,635 US7719124B2 (en) | 2005-03-18 | 2007-11-12 | Printed wiring board for mounting components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005078496A JP4646661B2 (ja) | 2005-03-18 | 2005-03-18 | プリント配線基板印刷方法と実装方法ならびにプログラム |
Publications (2)
Publication Number | Publication Date |
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JP2006261478A true JP2006261478A (ja) | 2006-09-28 |
JP4646661B2 JP4646661B2 (ja) | 2011-03-09 |
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Application Number | Title | Priority Date | Filing Date |
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JP2005078496A Expired - Fee Related JP4646661B2 (ja) | 2005-03-18 | 2005-03-18 | プリント配線基板印刷方法と実装方法ならびにプログラム |
Country Status (3)
Country | Link |
---|---|
US (2) | US7313862B2 (ja) |
JP (1) | JP4646661B2 (ja) |
CN (1) | CN100515158C (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008102692A1 (ja) * | 2007-02-21 | 2008-08-28 | Sony Chemical & Information Device Corporation | プリント配線板、プリント配線板の製造方法、および電子デバイス |
JP2009004453A (ja) * | 2007-06-19 | 2009-01-08 | Fuji Mach Mfg Co Ltd | 部品実装システム、半田印刷装置、部品実装装置及び部品実装方法 |
JP2010054345A (ja) * | 2008-08-28 | 2010-03-11 | Anritsu Corp | レジストずれ検出装置、並びにそれを用いた印刷はんだ検査装置及び印刷はんだ検査方法 |
JP2010139445A (ja) * | 2008-12-12 | 2010-06-24 | Anritsu Corp | 印刷はんだ検査装置 |
JP2013172143A (ja) * | 2012-02-23 | 2013-09-02 | Fuji Mach Mfg Co Ltd | 基板外観検査機および生産ラインおよび基板外観検査方法 |
JP2014041893A (ja) * | 2012-08-22 | 2014-03-06 | Panasonic Corp | 電子部品実装システムおよび電子部品実装装置ならびに電子部品実装方法 |
KR20160067091A (ko) * | 2013-10-08 | 2016-06-13 | 베시 네덜란드 비.브이. | 전자 부품에 대한 캐리어의 위치 결정 방법 및 그러한 방법으로 제조된 전자 부품 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007294640A (ja) * | 2006-04-25 | 2007-11-08 | Orion Denki Kk | 層構成表示部を備えた多層基板 |
JP2008135699A (ja) * | 2006-10-26 | 2008-06-12 | Ricoh Co Ltd | 部品搭載装置及び部品搭載装置の制御方法 |
KR100882261B1 (ko) * | 2007-07-25 | 2009-02-06 | 삼성전기주식회사 | 인쇄회로기판의 제조 방법 및 장치 |
JP5018840B2 (ja) * | 2009-07-27 | 2012-09-05 | 富士通株式会社 | クーポン基板 |
JP2011086880A (ja) * | 2009-10-19 | 2011-04-28 | Advantest Corp | 電子部品実装装置および電子部品の実装方法 |
CN101839690B (zh) * | 2010-04-13 | 2011-12-21 | 河海大学常州校区 | 一种基于边缘拟合的片式电子元件位置误差视觉检测方法 |
CN103635031A (zh) * | 2012-08-23 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 印刷电路板的制作方法 |
CN106294905B (zh) * | 2015-06-01 | 2021-07-06 | 鸿富锦精密电子(郑州)有限公司 | 印刷电路板布线***及方法 |
EP3833164A1 (en) | 2019-12-05 | 2021-06-09 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature |
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JPH09260826A (ja) * | 1996-03-18 | 1997-10-03 | Ibiden Co Ltd | 半田層を有する配線基板の製造方法 |
JPH1140907A (ja) * | 1997-07-17 | 1999-02-12 | Fuji Photo Film Co Ltd | プリント配線板及び部品取り付け方法 |
JPH11307890A (ja) * | 1998-04-17 | 1999-11-05 | Sony Corp | プリント配線板 |
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JPH0823160A (ja) * | 1994-05-06 | 1996-01-23 | Seiko Epson Corp | プリント配線板と電子部品の接続方法 |
DE69740139D1 (de) * | 1996-12-19 | 2011-04-14 | Ibiden Co Ltd | Mehrlagige Leiterplatte |
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JP3607069B2 (ja) | 1998-02-03 | 2005-01-05 | イビデン株式会社 | プリント配線板の製造方法 |
JP3205548B2 (ja) * | 1999-10-01 | 2001-09-04 | ソニーケミカル株式会社 | 多層フレキシブル配線板 |
JP4761662B2 (ja) * | 2001-07-17 | 2011-08-31 | 三洋電機株式会社 | 回路装置の製造方法 |
JP4061108B2 (ja) | 2002-04-09 | 2008-03-12 | 株式会社リコー | 実装装置 |
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2005
- 2005-03-18 JP JP2005078496A patent/JP4646661B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-10 US US11/372,087 patent/US7313862B2/en not_active Expired - Fee Related
- 2006-03-20 CN CNB2006100673952A patent/CN100515158C/zh not_active Expired - Fee Related
-
2007
- 2007-11-12 US US11/938,635 patent/US7719124B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06326446A (ja) * | 1993-05-14 | 1994-11-25 | Sony Corp | 基板の製造方法及び基板 |
JPH09260826A (ja) * | 1996-03-18 | 1997-10-03 | Ibiden Co Ltd | 半田層を有する配線基板の製造方法 |
JPH1140907A (ja) * | 1997-07-17 | 1999-02-12 | Fuji Photo Film Co Ltd | プリント配線板及び部品取り付け方法 |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008102692A1 (ja) * | 2007-02-21 | 2008-08-28 | Sony Chemical & Information Device Corporation | プリント配線板、プリント配線板の製造方法、および電子デバイス |
JP2009004453A (ja) * | 2007-06-19 | 2009-01-08 | Fuji Mach Mfg Co Ltd | 部品実装システム、半田印刷装置、部品実装装置及び部品実装方法 |
JP2010054345A (ja) * | 2008-08-28 | 2010-03-11 | Anritsu Corp | レジストずれ検出装置、並びにそれを用いた印刷はんだ検査装置及び印刷はんだ検査方法 |
JP2010139445A (ja) * | 2008-12-12 | 2010-06-24 | Anritsu Corp | 印刷はんだ検査装置 |
JP2013172143A (ja) * | 2012-02-23 | 2013-09-02 | Fuji Mach Mfg Co Ltd | 基板外観検査機および生産ラインおよび基板外観検査方法 |
JP2014041893A (ja) * | 2012-08-22 | 2014-03-06 | Panasonic Corp | 電子部品実装システムおよび電子部品実装装置ならびに電子部品実装方法 |
KR20160067091A (ko) * | 2013-10-08 | 2016-06-13 | 베시 네덜란드 비.브이. | 전자 부품에 대한 캐리어의 위치 결정 방법 및 그러한 방법으로 제조된 전자 부품 |
JP2017501559A (ja) * | 2013-10-08 | 2017-01-12 | ベシ ネーデルランズ ビー.ヴイ.Besi Netherlands B.V. | 電子部品を載せた担体の位置決め方法、及びそのような方法で製作された電子部品 |
US10217679B2 (en) | 2013-10-08 | 2019-02-26 | Besi Netherlands B.V. | Method for positioning a carrier with electronic components and electronic component produced with such method |
KR102302345B1 (ko) | 2013-10-08 | 2021-09-17 | 베시 네덜란드 비.브이. | 전자 부품에 대한 캐리어의 위치 결정 방법 및 그러한 방법으로 제조된 전자 부품 |
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US7719124B2 (en) | 2010-05-18 |
US20080073112A1 (en) | 2008-03-27 |
US7313862B2 (en) | 2008-01-01 |
US20060207091A1 (en) | 2006-09-21 |
CN1835655A (zh) | 2006-09-20 |
JP4646661B2 (ja) | 2011-03-09 |
CN100515158C (zh) | 2009-07-15 |
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