JP2006216388A5 - - Google Patents
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- Publication number
- JP2006216388A5 JP2006216388A5 JP2005028157A JP2005028157A JP2006216388A5 JP 2006216388 A5 JP2006216388 A5 JP 2006216388A5 JP 2005028157 A JP2005028157 A JP 2005028157A JP 2005028157 A JP2005028157 A JP 2005028157A JP 2006216388 A5 JP2006216388 A5 JP 2006216388A5
- Authority
- JP
- Japan
- Prior art keywords
- metal particles
- particles
- conductive film
- soft
- particle diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (1)
前記導電性膜の表面の***した突起は、軟質の金属粒子と硬質の非金属粒子とをそれぞれ芯物質とし、
軟質の金属粒子の平均粒子径は、硬質の非金属粒子の平均粒子径に対して、１．０５〜６倍であり、軟質の金属粒子のビッカース硬度は５０〜９９９であり、硬質の非金属粒子のビッカース硬度は１０００〜３０００であることを特徴とする導電性微粒子。 The surface of the substrate fine particles is coated with a conductive film, and the conductive film is a conductive fine particle having protrusions raised on the surface,
The raised protrusions on the surface of the conductive film have soft metal particles and hard non-metal particles as core materials,
The average particle diameter of the metal particles of soft, relative to the average particle diameter of the non-metallic particles of hard, Ri 1.05 to 6 Baidea, Vickers hardness of the soft metal particles are from 50 to 999, rigid non of Conductive fine particles, wherein the metal particles have a Vickers hardness of 1000 to 3000 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005028157A JP4593302B2 (en) | 2005-02-03 | 2005-02-03 | Conductive fine particles and anisotropic conductive materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005028157A JP4593302B2 (en) | 2005-02-03 | 2005-02-03 | Conductive fine particles and anisotropic conductive materials |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006216388A JP2006216388A (en) | 2006-08-17 |
| JP2006216388A5 true JP2006216388A5 (en) | 2007-11-29 |
| JP4593302B2 JP4593302B2 (en) | 2010-12-08 |
Family
ID=36979423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005028157A Active JP4593302B2 (en) | 2005-02-03 | 2005-02-03 | Conductive fine particles and anisotropic conductive materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4593302B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7410698B2 (en) * | 2004-01-30 | 2008-08-12 | Sekisui Chemical Co., Ltd. | Conductive particle with protrusions and anisotropic conductive material therefrom |
| JP4563110B2 (en) * | 2004-08-20 | 2010-10-13 | 積水化学工業株式会社 | Method for producing conductive fine particles |
| JP4877230B2 (en) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | Adhesive composition, circuit connection material, connection structure, and circuit member connection method |
| KR20110019392A (en) * | 2008-07-01 | 2011-02-25 | 히다치 가세고교 가부시끼가이샤 | Circuit connection material and circuit connection structure |
| JP6034177B2 (en) * | 2011-12-22 | 2016-11-30 | 積水化学工業株式会社 | Conductive particles, conductive materials, and connection structures |
| JP6333552B2 (en) * | 2012-01-19 | 2018-05-30 | 積水化学工業株式会社 | Conductive particles, conductive materials, and connection structures |
| JP6460803B2 (en) * | 2014-01-10 | 2019-01-30 | 積水化学工業株式会社 | Conductive particle, method for producing conductive particle, conductive material, and connection structure |
| CN115216246B (en) * | 2021-04-21 | 2024-01-12 | 南京恩微信息科技有限公司 | Universal conductive adhesive and universal ultralow-resistance reinforcing film |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3196317B2 (en) * | 1992-05-27 | 2001-08-06 | 株式会社ブリヂストン | Rubber composition |
| JPH06306412A (en) * | 1993-04-19 | 1994-11-01 | Tokyo Nickel Kk | Production of conductive filler |
| JP3360772B2 (en) * | 1994-09-02 | 2002-12-24 | 日立化成工業株式会社 | Connection structure of fine electrode and inspection method of electronic component having fine electrode |
| JPH08337413A (en) * | 1995-06-15 | 1996-12-24 | Sekisui Finechem Co Ltd | Silica particles and their production |
| JP2001247903A (en) * | 1999-12-28 | 2001-09-14 | Mitsui Mining & Smelting Co Ltd | Nickel powder, electrically conductive paste and method for producing nickel powder |
| JP2002261416A (en) * | 2001-03-01 | 2002-09-13 | Denso Corp | Connection structure of electrode |
-
2005
- 2005-02-03 JP JP2005028157A patent/JP4593302B2/en active Active
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