JP2006179640A - Solder processing method and connector applied therewith - Google Patents

Solder processing method and connector applied therewith Download PDF

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Publication number
JP2006179640A
JP2006179640A JP2004370566A JP2004370566A JP2006179640A JP 2006179640 A JP2006179640 A JP 2006179640A JP 2004370566 A JP2004370566 A JP 2004370566A JP 2004370566 A JP2004370566 A JP 2004370566A JP 2006179640 A JP2006179640 A JP 2006179640A
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Prior art keywords
curable resin
conductor
ultraviolet curable
soldering
contact
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Japanese (ja)
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Kazuya Okano
一也 岡野
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Amphenol FCI Connectors Singapore Pte Ltd
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FCI Asia Technologies Pte Ltd
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Priority to JP2004370566A priority Critical patent/JP2006179640A/en
Priority to TW094141785A priority patent/TW200628036A/en
Priority to PCT/JP2005/023613 priority patent/WO2006068228A1/en
Publication of JP2006179640A publication Critical patent/JP2006179640A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector, not causing ion migration or the like. <P>SOLUTION: The solder processing method between a contact and a conductor which are installed in a housing comprises a coating step of ultraviolet ray curing resin so as to cover at least a soldered part after soldering the contact to the conductor, and a curing step of the ultraviolet ray curing resin by irradiating ultraviolet rays against the ultraviolet ray curing resin. According to this method, short circuit due to migration of ion or the like can be prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明はコネクタにおける導体の半田付け後の処理に関し、特に半田付け部分を樹脂で覆うことによって短絡などの原因となる半田ボールあるいはマイグレーションを防止できる処理方法である。   The present invention relates to a process after soldering of a conductor in a connector, and in particular, is a processing method capable of preventing solder balls or migration causing a short circuit by covering a soldered portion with a resin.

コネクタのハウジング上に形成されるコンタクトと導電線の接続のような電気的な接続は通常半田および物理的な接触を伴う半田装置によって行われる。しかしながら近年、携帯電話のような小型の通信機器では高性能を実現させるために、限られたスペースに多くの電気的な部品を必要としており、よってコネクタも小型化が要求されている。   Electrical connections such as the connection of contacts and conductive lines formed on the housing of the connector are usually made by solder and a soldering device with physical contact. However, in recent years, a small communication device such as a mobile phone requires many electrical components in a limited space in order to realize high performance, and thus the connector is also required to be downsized.

通常、コネクタは多数のコンタクトを備えており、細い導電線を多数接続するような場合は通常の半田装置のように熱源となる部分が対象に物理的に接触するような方法によってコネクタを製造するのが困難である。さらに熱源が半田近傍の例えばハウジングに熱的な変形をもたらすことも起こり得る。   Usually, a connector is provided with a large number of contacts, and when a large number of thin conductive wires are connected, the connector is manufactured by a method in which a portion serving as a heat source physically contacts an object like a normal soldering device. Is difficult. Further, the heat source may cause thermal deformation in the vicinity of the solder, for example, the housing.

またコネクタなどを量産する場合にはペースト状の半田を基板に塗布し、基板全体を加熱して半田付けを行う方法や、赤外線などの熱線を照射する方法、高温の空気を吹き付ける方法などによって半田付けを行っていた。これらの方法はいわゆるリフロータイプと呼ばれている。   For mass production of connectors, solder is applied by applying paste solder to the board and heating the whole board to solder, irradiating heat rays such as infrared rays, or blowing hot air. I was doing it. These methods are called so-called reflow types.

またリフロータイプでは基板はコネクタなど半田付けを行う領域以外も加熱されるが、これとは異なる方法として、光ビームを用いることによって半田付けに必要な最小限の領域のみを加熱させる方法が提案できる。   Also, in the reflow type, the substrate is heated in areas other than the area to be soldered, such as a connector, but as a different method, a method of heating only the minimum area necessary for soldering by using a light beam can be proposed. .

例えば携帯型の通信機器等に使用されるような小さなサイズのコネクタでは、導体と隣の導体の間隔、つまりピッチは１ｍｍ以下である。またコネクタの挿入方向に対する横幅は１ｃｍ程度である。このような小さなコネクタではピッチが小さいために光ビームを用いた半田付けが行われる。   For example, in a small-sized connector used in a portable communication device or the like, the distance between a conductor and an adjacent conductor, that is, the pitch is 1 mm or less. The lateral width with respect to the connector insertion direction is about 1 cm. Since such a small connector has a small pitch, soldering using a light beam is performed.

この光ビームを用いた半田付けは、半田を短時間で溶融させて半田付けができる利点を有しているが、短時間で半田を高温で溶融させるためリフロータイプに比べると、半田がボール状になって残ってしまう場合がある。   Soldering using this light beam has the advantage that the solder can be melted in a short time, but the solder is ball-shaped compared to the reflow type because the solder is melted at a high temperature in a short time. May remain.

また通電により電気化学反応が生じ金属がイオン化溶融し析出するいわゆるイオンマイグレーション（単にマイグレーション、あるいはエレクトロケミカルマイグレーションと称する場合もある）が起こる。よって、上記のように小さなピッチを有するコネクタではこのようなボール状の半田、あるいは金属片が導体またはコンタクト間の短絡の原因となり得る。   In addition, so-called ion migration (sometimes simply referred to as migration or electrochemical migration) occurs in which an electrochemical reaction is caused by energization and the metal is ionized, melted, and deposited. Therefore, in the connector having a small pitch as described above, such ball-shaped solder or metal piece may cause a short circuit between the conductors or contacts.

従って本願発明は上記の問題を解決するために、ハウジングに設置されたコンタクト部と導体との半田処理方法であって、該コンタクト部と導体を半田付けした後に少なくとも半田付けした部分を覆うように紫外線硬化樹脂を塗布する段階と、該紫外線硬化樹脂に紫外線を照射して該紫外線硬化樹脂を硬化させる段階を有する半田処理方法を提供する。この方法はコンタクト部、導体、および半田を樹脂で覆うため、ボール状の半田が移動できないように固定してしまうため、短絡が起きることはない。また樹脂に覆われた部分は空気や水分と遮断されるためエレクトロマイグレーションが発生しない。   Accordingly, in order to solve the above problems, the present invention is a soldering method between a contact portion and a conductor installed in a housing, and covers at least the soldered portion after soldering the contact portion and the conductor. There is provided a solder processing method including a step of applying an ultraviolet curable resin and a step of irradiating the ultraviolet curable resin with ultraviolet rays to cure the ultraviolet curable resin. In this method, since the contact portion, the conductor, and the solder are covered with the resin, the ball-like solder is fixed so as not to move, so that a short circuit does not occur. In addition, since the portion covered with the resin is blocked from air and moisture, electromigration does not occur.

このような方法は特に光ビームによりコンタクト部と導体を半田付けしたときに有効である。また、本発明はハウジングに設置されたコンタクトと導体を半田付けした後に少なくとも半田付けした部分を覆うように紫外線硬化樹脂を塗布し、該紫外線硬化樹脂に紫外線を照射して該紫外線硬化樹脂を硬化させ半田処理を行ったコネクタを提供する。これによって信頼性の高いコネクタを提供することができる。   Such a method is particularly effective when the contact portion and the conductor are soldered by a light beam. Further, the present invention applies an ultraviolet curable resin so as to cover at least the soldered part after soldering the contact and conductor installed in the housing, and irradiates the ultraviolet curable resin with ultraviolet rays to cure the ultraviolet curable resin. A soldered connector is provided. Thereby, a highly reliable connector can be provided.

本発明はハウジングに設置されたコンタクト部と導体との接続において、少なくとも半田付けを行った部分を覆うように樹脂を塗布し硬化させるため、半田付けによって生じたボール状の半田や、いわゆるイオンマイグレーションによって析出した金属が、隣接するコンタクトあるいは導体間を短絡させることを防止することができる。特に本発明は光ビームによる半田付け処理に対して前記の効果を有する。さらにこのような処理を行ったコネクタを提供することで短絡による不具合の発生を極めて少なくすることができる。   In the present invention, since the resin is applied and cured so as to cover at least the soldered portion in the connection between the contact portion and the conductor installed in the housing, the ball-shaped solder generated by the soldering or so-called ion migration Can prevent the deposited metal from shorting adjacent contacts or conductors. In particular, the present invention has the above-described effect on the soldering process using a light beam. Furthermore, by providing a connector that has been subjected to such processing, the occurrence of problems due to short circuits can be extremely reduced.

以下に本発明の実施例を図を用いて説明する。図１はコネクタの斜視図でありＵＶ樹脂を塗布する前の状態である。コネクタはハウジング１を有しており、該ハウジング１にはコンタクトが複数、整列して配置されている。またコンタクト９には複数の細線３が対応して設置される。ハウジング１には位置決め用および隣接するコンタクトとの隔離を確実にするための壁部２が形成されるが、ただしこれは本発明の本質とは無関係であり、該壁部２がなくても本発明を実施できることは当業者には明白である。以後、視認性を良好にするため上面図および側面図は該壁部２を省略し示している。ハウジング１のコンタクト９には細線３の導体４が設置される。細線は本実施例では同軸細線であるが同軸細線でなくても良く、複数のケーブルを並列して配置し板状の形状とした平形ケーブルでもよい。さらに導体４とコンタクト９は半田付けされて電気的に接続される。参照番号５で示されている部分は半田である。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the connector, and shows a state before the UV resin is applied. The connector has a housing 1, and a plurality of contacts are arranged in line in the housing 1. In addition, a plurality of fine wires 3 are provided corresponding to the contacts 9. The housing 1 is formed with a wall 2 for positioning and ensuring isolation from adjacent contacts, but this is irrelevant to the essence of the present invention. It will be apparent to those skilled in the art that the invention can be practiced. Hereinafter, in order to improve visibility, the top view and the side view omit the wall 2. A conductor 4 of a thin wire 3 is installed on the contact 9 of the housing 1. In this embodiment, the thin wire is a coaxial thin wire, but it may not be a coaxial thin wire, and a flat cable having a plate shape by arranging a plurality of cables in parallel may be used. Furthermore, the conductor 4 and the contact 9 are soldered and electrically connected. The part indicated by reference numeral 5 is solder.

図２は図１のコネクタの上面図である。前記記載の壁部２は省略してある。本図においてコンタクト９と導体４が半田付けされる半田付け部分８は、導体４全体に形成する必要ななく、図示されたように一部分でよい。しかしながら導体４全体が半田付け部分８となっても良い。半田付け部分８は複数の導体４について、導体４の中央部付近のほぼ同一の領域に形成されている。   FIG. 2 is a top view of the connector of FIG. The wall portion 2 described above is omitted. In this figure, the soldered portion 8 to which the contact 9 and the conductor 4 are soldered does not have to be formed on the entire conductor 4 and may be a part as shown. However, the entire conductor 4 may be the soldering portion 8. The soldering portion 8 is formed in substantially the same region near the central portion of the conductor 4 for the plurality of conductors 4.

このようにハウジング１に設置されたコンタクト９と導体４との半田付けが終わると次に少なくとも半田付けした部分を覆うように紫外線硬化樹脂を塗布する。紫外線硬化樹脂を塗布した後の状態を図３に示した。該紫外線硬化樹脂７は少なくとも半田付け部分８を覆うように塗布され、複数の導体４がハウジング１に設置されているときは、少なくともコンタクト領域を覆うように塗布する。また紫外線硬化樹脂７は導体４の露出している部分全体を覆う必要はない。   When the contact 9 and the conductor 4 installed in the housing 1 are thus soldered, an ultraviolet curable resin is applied so as to cover at least the soldered portion. The state after applying the ultraviolet curable resin is shown in FIG. The ultraviolet curable resin 7 is applied so as to cover at least the soldering portion 8, and when the plurality of conductors 4 are installed in the housing 1, it is applied so as to cover at least the contact region. The ultraviolet curable resin 7 does not need to cover the entire exposed part of the conductor 4.

次に図４は、紫外線硬化樹脂を塗布した後の状態の側面図である。紫外線硬化樹脂７は導体４の側面と半田５、およびコンタクト９の一部分を覆っていることが解る。紫外線硬化樹脂７は紫外線を照射するまでは流動状態であるので、塗布したとき導体４の側面や、導体４とコンタクト９の接触面近傍の狭い領域にも入り込むことができる。   Next, FIG. 4 is a side view of the state after applying the ultraviolet curable resin. It can be seen that the ultraviolet curable resin 7 covers the side surface of the conductor 4, the solder 5, and a part of the contact 9. Since the ultraviolet curable resin 7 is in a fluidized state until it is irradiated with ultraviolet rays, when applied, it can enter the side surface of the conductor 4 and a narrow region near the contact surface between the conductor 4 and the contact 9.

図５は紫外線硬化樹脂を塗布した後の正面図である。本図では半田付け部分５および半田付け領域８は示されていない。図示したように紫外線硬化樹脂７は導体を完全に覆う厚さに塗布することが好ましい。このように、紫外線硬化樹脂７を塗布した後に紫外線１０を照射して紫外線硬化樹脂を硬化させる。これによって該樹脂が硬化し、樹脂で覆われた部分は水分などと隔離される。従ってコネクタに通電してもイオンマイグレーションは発生しない。   FIG. 5 is a front view after an ultraviolet curable resin is applied. In this figure, the soldering portion 5 and the soldering area 8 are not shown. As shown in the drawing, the ultraviolet curable resin 7 is preferably applied to a thickness that completely covers the conductor. In this manner, after the ultraviolet curable resin 7 is applied, the ultraviolet curable resin 7 is irradiated with the ultraviolet rays 10 to cure the ultraviolet curable resin. As a result, the resin is cured, and the portion covered with the resin is isolated from moisture and the like. Therefore, ion migration does not occur even when the connector is energized.

また、上記のようにコンタクト９と導体４との半田付けは光ビームによって行われる。このとき半田の溶融はごく短時間で高温になるため、半田がボール状に残ってしまう場合がある。しかし、図３〜５に示されているように紫外線硬化樹脂によって少なくとも半田付け部分８が覆われることによって、このボール状の半田も樹脂の中に固定される。これによって振動等が加えられても、ボール状の半田が近隣の導体やコンタクトと接触して短絡させることを防止することができる。   Further, as described above, the soldering between the contact 9 and the conductor 4 is performed by a light beam. At this time, the solder melts at a high temperature in a very short time, so that the solder may remain in a ball shape. However, as shown in FIGS. 3 to 5, at least the soldering portion 8 is covered with the ultraviolet curable resin, so that the ball-like solder is also fixed in the resin. Thus, even when vibration or the like is applied, it is possible to prevent the ball-shaped solder from coming into contact with a nearby conductor or contact and causing a short circuit.

この紫外線硬化樹脂７を塗布した部分を詳細に説明する。図６は図３のある１つの導線３の紫外線硬化樹脂７で覆われた部分Ａを拡大して示した上面図である。図６では導体４の中間の部分は省略している。上記のように紫外線硬化樹脂７は紫外線を照射するまでは流動状態であるため、半田付け部分８の近傍の領域のコンタクト９も覆っている。これによって露出しているコンタクト９も空気あるいは水分から遮断され、コンタクト９の劣化などを防止することができる。   A portion where the ultraviolet curable resin 7 is applied will be described in detail. FIG. 6 is an enlarged top view showing a portion A covered with the ultraviolet curable resin 7 of one conductor 3 shown in FIG. In FIG. 6, the middle part of the conductor 4 is omitted. As described above, since the ultraviolet curable resin 7 is in a fluid state until it is irradiated with ultraviolet rays, the contact 9 in the area near the soldering portion 8 is also covered. As a result, the exposed contact 9 is also shielded from air or moisture, and deterioration of the contact 9 can be prevented.

本発明によればとりわけ狭ピッチと言われる小型化されたコネクタであって、隣接するコンタクト間の間隙を十分確保しにくい場合であっても、短絡などの現象を防止することができる。
以上説明した本発明は紫外線硬化樹脂７で半田付け部分８を覆うものであるが、本発明ではプラスチックや他の種類の樹脂で覆うこともできる。 According to the present invention, it is possible to prevent a phenomenon such as a short circuit even in the case of a miniaturized connector referred to as a narrow pitch, even when it is difficult to sufficiently secure a gap between adjacent contacts.
In the present invention described above, the soldering portion 8 is covered with the ultraviolet curable resin 7, but in the present invention, it can be covered with plastic or other types of resins.

図１は紫外線硬化樹脂を塗布する前のコネクタの斜視図である。FIG. 1 is a perspective view of a connector before application of an ultraviolet curable resin. 図２は紫外線硬化樹脂を塗布する前のコネクタの上面図である。FIG. 2 is a top view of the connector before applying the ultraviolet curable resin. 図３は紫外線硬化樹脂を塗布した後のコネクタの上面図である。FIG. 3 is a top view of the connector after the ultraviolet curable resin is applied. 図４は紫外線硬化樹脂を塗布した後のコネクタの側面図である。FIG. 4 is a side view of the connector after the ultraviolet curable resin is applied. 図５は紫外線硬化樹脂を塗布した後のコネクタの正面図である。FIG. 5 is a front view of the connector after the ultraviolet curable resin is applied. 図６は紫外線硬化樹脂を塗布した後の導体４の拡大図である。FIG. 6 is an enlarged view of the conductor 4 after applying the ultraviolet curable resin.

符号の説明Explanation of symbols

１ ハウジング
２ 壁部
３ 同軸細線
４ 導体
５ 半田
７ 紫外線硬化樹脂
８ 半田付け部分
９ コンタクト
１０ 紫外線 DESCRIPTION OF SYMBOLS 1 Housing 2 Wall part 3 Coaxial thin wire 4 Conductor 5 Solder 7 Ultraviolet curable resin 8 Solder part 9 Contact 10 Ultraviolet

Claims (3)

ハウジングに設置されたコンタクトと導体との半田処理方法であって、該コンタクトと導体を半田付けした後に少なくとも半田付けした部分を覆うように紫外線硬化樹脂を塗布する段階と、該紫外線硬化樹脂に紫外線を照射して該紫外線硬化樹脂を硬化させる段階を有する半田処理方法。   A method of soldering a contact and a conductor installed in a housing, wherein the contact and the conductor are soldered and an ultraviolet curable resin is applied so as to cover at least a soldered portion, and the ultraviolet curable resin is coated with an ultraviolet ray. Soldering method comprising the step of curing the ultraviolet curable resin by irradiating with UV. コンタクトと導体の半田付けは光ビームによって行う請求項１に記載の方法。   The method according to claim 1, wherein the soldering of the contact and the conductor is performed by a light beam. ハウジングに設置されたコンタクトと導体を半田付けした後に少なくとも半田付けした部分を覆うように紫外線硬化樹脂を塗布し、該紫外線硬化樹脂に紫外線を照射して該紫外線硬化樹脂を硬化させ半田処理を行ったコネクタ。   After soldering the contacts and conductors installed in the housing, an ultraviolet curable resin is applied so as to cover at least the soldered portion, and the ultraviolet curable resin is irradiated with ultraviolet rays to cure the ultraviolet curable resin and perform a soldering process. Connector.
JP2004370566A 2004-12-22 2004-12-22 Solder processing method and connector applied therewith Pending JP2006179640A (en)

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JP2004370566A JP2006179640A (en) 2004-12-22 2004-12-22 Solder processing method and connector applied therewith
TW094141785A TW200628036A (en) 2004-12-22 2005-11-28 Solder processing method and connector applied therewith
PCT/JP2005/023613 WO2006068228A1 (en) 2004-12-22 2005-12-22 Solder processing method and connector subjected to such processing

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Citations (5)

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JPH03173083A (en) * 1989-11-30 1991-07-26 Amp Japan Ltd Wire connecting method and connecting structure
JPH07230872A (en) * 1994-02-18 1995-08-29 Olympus Optical Co Ltd Image pickup device assembling method
JP2001189403A (en) * 1999-10-22 2001-07-10 Ibi Tech Co Ltd Wiring board
JP2002190663A (en) * 2000-12-21 2002-07-05 Taiyo Yuden Co Ltd Hybrid ic
JP2003163445A (en) * 2001-11-29 2003-06-06 Fujitsu Ltd Bonding method of electronic component

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0371585A (en) * 1989-08-09 1991-03-27 Showa Electric Wire & Cable Co Ltd Structure for connecting electric wire connector
JPH11168275A (en) * 1997-12-05 1999-06-22 Hitachi Ltd Local heating connecting method and repairing method
JP3720681B2 (en) * 2000-06-26 2005-11-30 株式会社ファインディバイス Laser type soldering method and apparatus
JP2003178826A (en) * 2001-12-07 2003-06-27 Hitachi Cable Ltd Terminal connecting part and terminal connecting method of ultra-fine multi-core cable

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173083A (en) * 1989-11-30 1991-07-26 Amp Japan Ltd Wire connecting method and connecting structure
JPH07230872A (en) * 1994-02-18 1995-08-29 Olympus Optical Co Ltd Image pickup device assembling method
JP2001189403A (en) * 1999-10-22 2001-07-10 Ibi Tech Co Ltd Wiring board
JP2002190663A (en) * 2000-12-21 2002-07-05 Taiyo Yuden Co Ltd Hybrid ic
JP2003163445A (en) * 2001-11-29 2003-06-06 Fujitsu Ltd Bonding method of electronic component

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WO2006068228A1 (en) 2006-06-29

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