JP2006156187A - Led light source device and led electric bulb - Google Patents

Led light source device and led electric bulb Download PDF

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Publication number
JP2006156187A
JP2006156187A JP2004346401A JP2004346401A JP2006156187A JP 2006156187 A JP2006156187 A JP 2006156187A JP 2004346401 A JP2004346401 A JP 2004346401A JP 2004346401 A JP2004346401 A JP 2004346401A JP 2006156187 A JP2006156187 A JP 2006156187A
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Prior art keywords
light
emitting diode
light emitting
diode element
led light
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Japanese (ja)
Inventor
Kenichi Ishii
健一 石井
Hiroyoshi Tanabe
浩義 田邊
Yasuo Imai
康雄 今井
Akito Tanaka
章人 田中
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Mitsubishi Electric Corp
Mitsubishi Electric Lighting Corp
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Priority to JP2004346401A priority Critical patent/JP2006156187A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

<P>PROBLEM TO BE SOLVED: To promote life-prolongation of a phosphor and a light emitting diode element, while enabling the brightness of light to become approximately uniform of which the wavelength is converted with a wavelength conversion cover. <P>SOLUTION: This is provided with an LED light emitting diode part 6 having a plurality of light emitting diode elements 12 which are arranged so as to have a plane surface and radiate near-ultraviolet rays or blue rays, and the wavelength conversion cover 9 which has a planar part 16 opposing to the light emitting diode elements 12 in a separated position at a prescribed distance from the face where the light emitting diode elements 12 are arranged, and in which a phosphor 15 is installed that carries out the wavelength conversion of the light radiated from the light emitting diode elements 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、発光ダイオード素子から放射される光を波長変換してランプ等の光源とするＬＥＤ光源装置及びこのＬＥＤ光源装置を用いたＬＥＤ電球に関するものである。   The present invention relates to an LED light source device that converts the wavelength of light emitted from a light emitting diode element into a light source such as a lamp, and an LED bulb using the LED light source device.

従来のＬＥＤ光源装置においては、発光ダイオードが放射する青色光を蛍光材で励起させて白色光などに波長変換するように構成している（例えば特許文献１）。   A conventional LED light source device is configured to excite blue light emitted from a light emitting diode with a fluorescent material and convert the wavelength into white light or the like (for example, Patent Document 1).

特許第３１６７６４１号公報（第３頁、図２）Japanese Patent No. 3167641 (page 3, FIG. 2)

従来のＬＥＤ光源装置によれば、発光ダイオード素子を平面状に実装してなる発光器本体と、この発光器本体において発光ダイオード素子の周囲に装着された蛍光材入りの第１のドーム状キャップ部材とを備え、発光ダイオード素子から出た光は第１のドーム状キャップ部材に入射し、第１のドーム状キャップ部材内部の蛍光材が励起されてその固有の蛍光を発し、第１のドーム状キャップ部材に入射した光の一部は第１のドーム状キャップ部材を透過して、蛍光材で発した蛍光と第１のドーム状キャップ部材を透過した光とを混合させて混合色光を得ていた。しかし、発光ダイオード素子と蛍光材との距離が第１のドーム状キャップ部材における発光ダイオード素子の発する光の入射位置により異なり、また、発光ダイオード素子から放射される光の強度が放射する方向により異なるため、発光ダイオードの光の照度が第１のドームの入射位置により異なり、その結果、第１のドームの透過位置により波長変換された光の輝度にムラが生じるという問題点があった。また、輝度のムラを低減するためにドーム状キャップ部材に混入する蛍光材の量を発光ダイオードの発する光の照度に応じて調整することが困難であるという問題点があった。   According to a conventional LED light source device, a light emitter body in which a light emitting diode element is mounted in a planar shape, and a first dome-shaped cap member containing a fluorescent material mounted around the light emitting diode element in the light emitter body. The light emitted from the light emitting diode element is incident on the first dome-shaped cap member, and the fluorescent material inside the first dome-shaped cap member is excited to emit its own fluorescence. Part of the light incident on the cap member is transmitted through the first dome-shaped cap member, and the mixed color light is obtained by mixing the fluorescence emitted from the fluorescent material and the light transmitted through the first dome-shaped cap member. It was. However, the distance between the light emitting diode element and the fluorescent material varies depending on the incident position of the light emitted from the light emitting diode element in the first dome-shaped cap member, and the intensity of the light emitted from the light emitting diode element varies depending on the direction in which the light is emitted. Therefore, the illuminance of the light from the light emitting diode differs depending on the incident position of the first dome, and as a result, there is a problem that the luminance of the light whose wavelength is converted by the transmission position of the first dome is uneven. In addition, there is a problem that it is difficult to adjust the amount of the fluorescent material mixed in the dome-shaped cap member in accordance with the illuminance of light emitted from the light emitting diode in order to reduce unevenness in luminance.

この発明は、上記のような課題を解決するためになされたもので、波長変換された光の光源部位置の違いによる輝度ムラの少ないＬＥＤ光源装置およびこれを用いたＬＥＤ電球を提供することを目的とする。   The present invention has been made to solve the above-described problems, and provides an LED light source device having less luminance unevenness due to a difference in position of a light source portion of wavelength-converted light and an LED bulb using the same. Objective.

この発明に係るＬＥＤ光源装置は、近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する平面部を有し、発光ダイオード素子から放射される光を波長変換する蛍光部材を平面部に設けた波長変換カバーとを備えたものである。   An LED light source device according to the present invention includes a LED light emitting unit having a plurality of light emitting diode elements that radiate near ultraviolet light or blue light and are disposed in a plane, and a predetermined distance from the surface on which the light emitting diode elements are disposed. A wavelength conversion cover having a flat portion facing the light emitting diode element at a separated position and provided with a fluorescent member for converting the wavelength of light emitted from the light emitting diode element on the flat portion.

また、近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する扁平な曲面部を有し、発光ダイオード素子から放射される光を波長変換する蛍光部材を曲面部に設けた波長変換カバーとを備えたものである。   Also, an LED light-emitting unit having a plurality of light-emitting diode elements that radiate near ultraviolet light or blue light and are arranged in a plane, and a light-emitting diode element at a predetermined distance from the surface on which the light-emitting diode elements are arranged And a wavelength conversion cover provided with a fluorescent member that converts the wavelength of light emitted from the light-emitting diode element on the curved surface portion.

また、近紫外光または青色光を放射し平面状に配設される発光ダイオード素子及びこの発光ダイオード素子の表面を封止する封止樹脂を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する平面部とこの平面部の外周に接続する側面部とを有するペン皿形状に形成され、発光ダイオード素子から放射される光を波長変換する蛍光部材を平面部及び側面部に設けた波長変換カバーとを備えたものである。   In addition, a light emitting diode element that emits near-ultraviolet light or blue light and is disposed in a planar shape, an LED light emitting unit that includes a sealing resin that seals the surface of the light emitting diode element, and the light emitting diode element are disposed. It is formed in a pen dish shape having a flat part facing the light emitting diode element at a position separated from the surface and a side part connected to the outer periphery of the flat part, and converts the wavelength of light emitted from the light emitting diode element. A wavelength conversion cover provided with a fluorescent member on the flat surface portion and the side surface portion is provided.

この発明に係るＬＥＤ電球は、一端に口金が設けられ、他端に向けてラッパ状に拡がる電球外郭部と、上記のいずれかに記載のＬＥＤ光源装置と、電球外郭部の他端に設けられ、ＬＥＤ光源装置が実装される光源装置実装基板と、電球外郭部の他端に設けられ、基板及びＬＥＤ光源装置を密閉して覆う透光性カバーとを備えたものである。   An LED bulb according to the present invention is provided with a cap at one end and a bulb outer portion that expands in a trumpet shape toward the other end, the LED light source device according to any one of the above, and the other end of the bulb outer portion. A light source device mounting substrate on which the LED light source device is mounted, and a translucent cover provided on the other end of the bulb outer portion and sealingly covering the substrate and the LED light source device.

この発明に係るＬＥＤ光源装置は、近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する平面部を有し、発光ダイオード素子から放射される光を波長変換する蛍光部材を平面部に設けた波長変換カバーとを備えたので、発光ダイオード素子と蛍光部材とが互いに平行な平面上に配置され、発光ダイオード素子に対する蛍光部材の位置の違いによる距離の違いが低減され、波長変換される光の光源部の位置に違いによる輝度ムラを低減できる効果がある。   An LED light source device according to the present invention includes a LED light emitting unit having a plurality of light emitting diode elements that radiate near ultraviolet light or blue light and are disposed in a plane, and a predetermined distance from the surface on which the light emitting diode elements are disposed. The light emitting diode element and the fluorescent light are provided with a wavelength conversion cover having a flat part facing the light emitting diode element at a separated position and having a fluorescent member for converting the wavelength of light emitted from the light emitting diode element on the flat part. The members are arranged on a plane parallel to each other, the difference in distance due to the difference in the position of the fluorescent member with respect to the light emitting diode element is reduced, and the luminance unevenness due to the difference in the position of the light source part of the wavelength converted light can be reduced. is there.

また、近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する扁平な曲面部を有し、発光ダイオード素子から放射される光を波長変換する蛍光部材を曲面部に設けた波長変換カバーとを備えたので、発光ダイオード素子と蛍光部材とが互いに略平行な平面上に配置され、発光ダイオード素子に対する蛍光部材の位置の違いによる距離の違いが低減され、波長変換される光の光源部の位置の違いによる輝度ムラを低減できる効果がある。   Also, an LED light-emitting unit having a plurality of light-emitting diode elements that radiate near ultraviolet light or blue light and are arranged in a plane, and a light-emitting diode element at a predetermined distance from the surface on which the light-emitting diode elements are arranged And a wavelength conversion cover having a curved surface portion provided with a fluorescent member for converting the wavelength of light emitted from the light emitting diode element, so that the light emitting diode element and the fluorescent member are substantially the same. Arranged on a parallel plane, the difference in distance due to the difference in the position of the fluorescent member with respect to the light emitting diode element is reduced, and there is an effect that the luminance unevenness due to the difference in the position of the light source part of the light subjected to wavelength conversion can be reduced.

また、近紫外光または青色光を放射し平面状に配設される発光ダイオード素子及びこの発光ダイオード素子の表面を封止する封止樹脂を有するＬＥＤ発光部と、発光ダイオード素子が配設される面から所定の距離隔てた位置に発光ダイオード素子と対向する平面部とこの平面部の外周に接続する側面部とを有するペン皿形状に形成され、発光ダイオード素子から放射される光を波長変換する蛍光部材を平面部及び側面部に設けた波長変換カバーとを備えたので、発光ダイオード素子と蛍光部材とが互いに平行な平面上に配置され、発光ダイオード素子に対する蛍光部材の位置の違いによる距離の違いが低減され、波長変換される光の光源部の位置の違いによる輝度ムラを低減できる効果がある。さらに、発光ダイオード素子から波長変換カバーの側面部方向に放射される光についても側面部に設けられた蛍光部材により波長変換されるので、効率のよい光源装置を得られる効果がある。   In addition, a light emitting diode element that emits near-ultraviolet light or blue light and is disposed in a planar shape, an LED light emitting unit that includes a sealing resin that seals the surface of the light emitting diode element, and the light emitting diode element are disposed. It is formed in a pen dish shape having a flat part facing the light emitting diode element at a position separated from the surface and a side part connected to the outer periphery of the flat part, and converts the wavelength of light emitted from the light emitting diode element. Since the fluorescent member is provided with the wavelength conversion cover provided on the plane part and the side part, the light emitting diode element and the fluorescent member are arranged on a plane parallel to each other, and the distance due to the difference in the position of the fluorescent member with respect to the light emitting diode element is increased. The difference is reduced, and there is an effect that the luminance unevenness due to the difference in the position of the light source part of the light subjected to wavelength conversion can be reduced. Furthermore, since the light emitted from the light emitting diode element toward the side surface of the wavelength conversion cover is also wavelength-converted by the fluorescent member provided on the side surface, there is an effect that an efficient light source device can be obtained.

また、この発明に係るＬＥＤ電球は、一端に口金が設けられ、他端に向けてラッパ状に拡がる電球外郭部と、上記のいずれかに記載のＬＥＤ光源装置と、電球外郭部の他端に設けられ、ＬＥＤ光源装置が実装される光源装置実装基板と、電球外郭部の他端に設けられ、基板及びＬＥＤ光源装置を密閉して覆う透光性カバーとを備えたので、輝度ムラの少ないＬＥＤ光源装置により効率のよいＬＥＤ電球が得られる効果がある。また、ＬＥＤ光源装置において波長変換カバーの発光ダイオード素子と対向する面に蛍光部材を設けたので、透光性カバーが破損しても発光ダイオード素子の放射する近紫外光または青光が直接ＬＥＤ電球の外部に放射されることがなく、安全性の高いＬＥＤ電球が得られる効果がある。   Further, the LED bulb according to the present invention is provided with a cap at one end and a bulb outer portion expanding in a trumpet shape toward the other end, the LED light source device according to any one of the above, and the other end of the bulb outer portion. Provided with a light source device mounting substrate on which the LED light source device is mounted and a translucent cover that is provided on the other end of the bulb outer casing and hermetically covers the substrate and the LED light source device, so that there is little luminance unevenness The LED light source device has an effect of obtaining an efficient LED bulb. In addition, since the fluorescent member is provided on the surface of the LED light source device that faces the light emitting diode element of the wavelength conversion cover, even if the translucent cover is damaged, the near ultraviolet light or blue light emitted from the light emitting diode element is directly emitted from the LED bulb. There is an effect that a highly safe LED bulb can be obtained.

実施の形態１．
図１〜図８は、この実施の形態におけるＬＥＤ電球の構成を示す図であり、図１、図３は、ＬＥＤ電球の一部破断断面図、図２、図４はＬＥＤ電球の分解斜視図、図５、図６、図７は波長変換カバーの断面図、図８は点光源の光出力特性と被照射物の水平照度と鉛直面照度の関係を示す図である。 Embodiment 1 FIG.
FIGS. 1-8 is a figure which shows the structure of the LED bulb in this embodiment, FIG.1, FIG.3 is a partially broken sectional view of a LED bulb, FIG.2, FIG.4 is an exploded perspective view of a LED bulb. 5, FIG. 6, and FIG. 7 are sectional views of the wavelength conversion cover, and FIG. 8 is a diagram showing the relationship between the light output characteristics of the point light source, the horizontal illuminance of the irradiated object, and the vertical illuminance.

図１、図２に示すＬＥＤ電球１の外郭は、両端が開口されるラッパ形状の電球外郭部２の一端である小径開口部に電気的に絶縁する中空リング状の絶縁部３を介して商用電源が給電される口金４を配置し、電球外郭部２の他端である大径開口部に半球状のガラスなどからなる透光性カバー５を配置して構成している。この透光性カバー５は電球外郭部２の大径開口部に取り付けられて、外部から埃などが後述するＬＥＤ発光部６に付着するのを防止し、またユーザーが電極などに触れ感電するのを防止している。   The outer shell of the LED bulb 1 shown in FIGS. 1 and 2 is commercialized through a hollow ring-shaped insulating portion 3 that is electrically insulated from a small-diameter opening that is one end of a trumpet-shaped bulb outer portion 2 that is open at both ends. A base 4 to which power is supplied is disposed, and a translucent cover 5 made of hemispherical glass or the like is disposed in a large-diameter opening which is the other end of the bulb outer shell 2. The translucent cover 5 is attached to the large-diameter opening of the bulb outer shell 2 to prevent dust and the like from adhering to the LED light-emitting unit 6 to be described later, and the user touches the electrode to get an electric shock. Is preventing.

ＬＥＤ発光部６は、平面状に配設され近紫外光を出力する複数の発光ダイオード素子１２と、この発光ダイオード素子１２が実装される平面部と、この平面部の周縁を斜めに起こした略すり鉢状のセラミックなどからなる発光ダイオード素子実装基板１３とを備え、発光ダイオード素子１２を発光ダイオード素子実装基板１３の平面部の略中央に配置するように取り付ける。この発光ダイオード素子１２をシリコン系の樹脂など耐紫外特性がよい透明な封止樹脂１４で発光ダイオード素子１２の表面を封止して、発光ダイオード素子１２と空気の屈折率の違いによる近紫外光の全反射を軽減させて、発光ダイオード素子１２の内部で発生する近紫外光を効率よく発光ダイオード素子１２の外部に放射させる。   The LED light emitting unit 6 includes a plurality of light emitting diode elements 12 that are arranged in a plane and output near-ultraviolet light, a plane part on which the light emitting diode elements 12 are mounted, and an approximately raised edge of the plane part. And a light emitting diode element mounting substrate 13 made of a mortar-shaped ceramic or the like, and the light emitting diode element 12 is attached so as to be disposed at substantially the center of the flat portion of the light emitting diode element mounting substrate 13. The surface of the light-emitting diode element 12 is sealed with a transparent sealing resin 14 having good ultraviolet resistance such as a silicon-based resin, and near-ultraviolet light due to a difference in refractive index between the light-emitting diode element 12 and air. Thus, near-ultraviolet light generated inside the light-emitting diode element 12 is efficiently radiated to the outside of the light-emitting diode element 12.

電球外郭部２の大径開口部の内側側壁部に断面がＬ字形状のリング７を当接させて嵌め込まれ、このＬ字形状のリング７に、ＬＥＤ発光部６と後述する波長変換カバー９とを備えたＬＥＤ光源装置を実装するための光源装置実装基板であるアルミ基板８が取り付けられている。   A ring 7 having an L-shaped cross section is fitted into the inner side wall of the large-diameter opening of the bulb outer shell 2, and the LED light-emitting unit 6 and a wavelength conversion cover 9 to be described later are fitted into the L-shaped ring 7. The aluminum substrate 8 which is a light source device mounting substrate for mounting the LED light source device provided with is attached.

アルミ基板８には、アルミ基板８の透光性カバー５側に配設された配線パターン上に複数のＬＥＤ発光部６とこのＬＥＤ発光部６から出力される近紫外光を白色光に変換する波長変換カバー９とを備えたＬＥＤ光源装置とが実装され、波長変換カバー９を取り付けるカバー取付穴１０が設けられている。   The aluminum substrate 8 converts a plurality of LED light emitting units 6 and near-ultraviolet light output from the LED light emitting units 6 into white light on a wiring pattern disposed on the translucent cover 5 side of the aluminum substrate 8. An LED light source device including a wavelength conversion cover 9 is mounted, and a cover mounting hole 10 for mounting the wavelength conversion cover 9 is provided.

電球外郭部２の内部には、ＬＥＤ発光部６を駆動するための電源回路１１が備えられ、電源回路１１は口金４に給電される商用電源を変換してアルミ基板８に配設された配線パターンを介してＬＥＤ発光部６に電力を給電して、ＬＥＤ発光部６から近紫外光を出力する。   A power source circuit 11 for driving the LED light emitting unit 6 is provided inside the bulb outer portion 2, and the power source circuit 11 converts the commercial power supplied to the base 4 and is disposed on the aluminum substrate 8. Electric power is supplied to the LED light emitting unit 6 through the pattern, and near ultraviolet light is output from the LED light emitting unit 6.

波長変換カバー９は、近紫外光を白色光に変換するための、たとえば赤色変換蛍光体、緑色変換蛍光体、青色変換蛍光体を混合した蛍光部材である蛍光体１５が塗布される円形平面部１６と、円形平面部１６の周縁の対向する位置から外側に突出される一対のＬ字形状の取付部１７を備え、突出させるＬ字形状の先端部は、円形平面部１６から外側に略直角に突出してアルミ基板８に取り付ける基板取付穴１８を備えている。アルミ基板８のカバー取付穴１０と波長変換カバー９の基板取付穴１８を用いてネジ止めなどにより、波長変換カバー９とアルミ基板８とがスペーサ１０ａを介して固定される。円形平面部１６は、複数の発光ダイオード素子１２が配設される面から略平行で所定の距離隔てた位置に発光ダイオード素子１２と対向している。   The wavelength conversion cover 9 is a circular flat surface portion on which a phosphor 15 that is a fluorescent member mixed with, for example, a red conversion phosphor, a green conversion phosphor, and a blue conversion phosphor is applied to convert near ultraviolet light into white light. 16 and a pair of L-shaped attachment portions 17 projecting outward from the opposing positions of the peripheral edge of the circular plane portion 16, and the projecting L-shaped tip portions are substantially perpendicular to the outside from the circular plane portion 16. The board mounting hole 18 is provided so as to project to the aluminum board 8. The wavelength conversion cover 9 and the aluminum substrate 8 are fixed via the spacer 10a by screwing or the like using the cover mounting hole 10 of the aluminum substrate 8 and the substrate mounting hole 18 of the wavelength conversion cover 9. The circular flat portion 16 is opposed to the light emitting diode element 12 at a position that is substantially parallel to the surface on which the plurality of light emitting diode elements 12 are arranged and separated by a predetermined distance.

なお、波長変換カバー９の取付部１７を２ヶ所としたが、波長変換カバー９をアルミ基板８に略平行に取り付けることができればよく、取付部１７を３ヶ所設けてもよい。   Although the wavelength conversion cover 9 has two attachment portions 17 as long as the wavelength conversion cover 9 can be attached to the aluminum substrate 8 substantially in parallel, three attachment portions 17 may be provided.

また、図３、図４に示す波長変換カバー９及びアルミ基板８のように、波長変換カバー９の取付部１７の先端部を係止片１８ａにしてアルミ基板８のカバー取付穴１０に嵌合させるようにし、波長変換カバー９の取付部１７とは異なる周縁に固定爪１９を備えて、ＬＥＤ発光部６と波長変換カバー９の円形平面部１６とを略一定の間隔にするように固定してもよい。   Further, like the wavelength conversion cover 9 and the aluminum substrate 8 shown in FIGS. 3 and 4, the distal end portion of the mounting portion 17 of the wavelength conversion cover 9 is engaged with the cover mounting hole 10 of the aluminum substrate 8 with the locking piece 18 a. A fixing claw 19 is provided at a peripheral edge different from the mounting portion 17 of the wavelength conversion cover 9, and the LED light emitting portion 6 and the circular flat portion 16 of the wavelength conversion cover 9 are fixed at a substantially constant interval. May be.

図５は蛍光体１５が塗布される波長変換カバー９の断面図を示しており、蛍光体１５が設けられる円形平面部１６に複数の凹部が形成され、この凹部に蛍光体１５が塗布される。これらの凹部は各ＬＥＤ発光部６から近紫外光が照射される位置にあり、各凹部の直径は対応するＬＥＤ発光部６から照射される近紫外光の照度分布に基づき適宜設定される。凹部に蛍光体１５を塗布し、凹部の深さを適宜選択することにより、平面に塗布する場合と比較し、塗布される蛍光体１５の膜厚を容易に制御することができる。蛍光体１５の膜厚が厚いところでは波長変換される光の強度が高められるので、蛍光体１５に照射される近紫外光の照度に応じて蛍光体１５の膜厚を調整することにより、均一な輝度の白色光に変換することができる。   FIG. 5 shows a cross-sectional view of the wavelength conversion cover 9 to which the phosphor 15 is applied. A plurality of concave portions are formed in the circular flat portion 16 on which the phosphor 15 is provided, and the phosphor 15 is applied to the concave portions. . These concave portions are located at positions where the near-ultraviolet light is irradiated from each LED light emitting portion 6, and the diameter of each concave portion is appropriately set based on the illuminance distribution of the near-ultraviolet light irradiated from the corresponding LED light emitting portion 6. By applying the phosphor 15 to the recess and appropriately selecting the depth of the recess, the film thickness of the applied phosphor 15 can be easily controlled as compared with the case of applying to the flat surface. Since the intensity of the wavelength-converted light is increased where the phosphor 15 is thick, by adjusting the film thickness of the phosphor 15 according to the illuminance of near-ultraviolet light applied to the phosphor 15, it is uniform. Can be converted into white light with high brightness.

なお、波長変換カバー９に蛍光体１５を塗布することなく、波長変換カバー９を形成する樹脂などの材料に蛍光体１５を混ぜ合せてもよい。   The phosphor 15 may be mixed with a material such as a resin forming the wavelength conversion cover 9 without applying the phosphor 15 to the wavelength conversion cover 9.

また、図６、図７に示す波長変換カバー９のように、波長変換カバー９の円形平面部の蛍光体１５を塗布する面と反対側の面にレンズ２０を備えると、蛍光体１５によって変換した白色光をこのレンズ２０によって集光する、或いは所定方向へ光を配光・拡散するなど、光学設計の自由度を大きくすることができる。   Moreover, when the lens 20 is provided on the surface opposite to the surface on which the phosphor 15 is applied in the circular flat portion of the wavelength conversion cover 9 as in the wavelength conversion cover 9 shown in FIGS. The degree of freedom in optical design can be increased, such as condensing the white light by the lens 20 or distributing / diffusing the light in a predetermined direction.

各発光ダイオード素子１２は非常に小さいのでそれぞれ点光源とみなすものとすると、点光源の光出力と照度との関係は図８及び（１）式のようになる。図８は、被照射面から高さｈに配置される光源Ｌの光出力と、光源Ｌの直下方向から角度θの方向の被照射面上のＰ点における各種照度との関係を示している。
Ｅｈ＝（Ｉθ／ｌ２）・ｃｏｓθ ・・・ （１）
ここで、ＥｈはＰ点における直射水平面照度、Ｉθはθ方向の光度（ｃｄ）、ｌは点光源からＰ点までの距離（ｍ）、θはＰ点における入射角である。 If each light emitting diode element 12 is very small and is regarded as a point light source, the relationship between the light output of the point light source and the illuminance is as shown in FIG. 8 and (1). FIG. 8 shows the relationship between the light output of the light source L arranged at a height h from the irradiated surface and various illuminances at point P on the irradiated surface in the direction of angle θ from the direction directly below the light source L. .
Eh = (Iθ / l 2 ) · cos θ (1)
Here, Eh is the direct horizontal plane illuminance at point P, Iθ is the luminous intensity (cd) in the θ direction, l is the distance (m) from the point light source to point P, and θ is the incident angle at point P.

（１）式より、直射水平面照度Ｅｈは、ＬＥＤ発光部６からθ方向に放射される光度Ｉθに比例し、距離ｌの自乗に反比例することがわかる。一方、蛍光体１５に照射される光出力である直射水平面照度が大きくなると、蛍光体１５により励起されて出力される白色光も大きくなることが知られている。光源Ｌから凹部の外周を見込むθの範囲で光度Ｉθがほぼ一様であるとし、そのθの範囲で距離ｌの変化が小さく、ｃｏｓθの値の変化も小さいとすると、光源Ｌから凹部の外周を見込むθの範囲で直射水平面照Ｅｈがほぼ均一となり、蛍光体１５により励起される白色光の輝度もほぼ均一となり、輝度ムラの小さいＬＥＤ光源装置が得られる。   From the equation (1), it is understood that the direct horizontal plane illuminance Eh is proportional to the luminous intensity Iθ emitted from the LED light emitting unit 6 in the θ direction and inversely proportional to the square of the distance l. On the other hand, it is known that when the direct horizontal plane illuminance, which is the light output irradiated to the phosphor 15, increases, the white light excited and output by the phosphor 15 also increases. Assuming that the light intensity Iθ is substantially uniform within the range of θ from which the outer periphery of the recess is viewed from the light source L, and the change in the distance l is small and the change in the value of cos θ is also small within the range of θ, the outer periphery of the recess from the light source L In the range of θ in which the light is projected, the direct horizontal plane illumination Eh is substantially uniform, the luminance of the white light excited by the phosphor 15 is also approximately uniform, and an LED light source device with small luminance unevenness is obtained.

また、電球外郭部２の大径開口部を透光性カバー５で覆っているので、ＬＥＤ発光部６に埃などが付着するのを防止でき、ユーザーが電極などに触れて感電するのを防止できる。   Moreover, since the large-diameter opening of the bulb outer shell 2 is covered with the translucent cover 5, it is possible to prevent dust and the like from adhering to the LED light-emitting unit 6, and to prevent the user from touching the electrode and the like to receive an electric shock. it can.

また、発光ダイオード素子１２の表面を封止している封止樹脂１４は湿度によって劣化するが、透光性カバー５と電球外郭部２とにより封止樹脂１４を防湿するので、封止樹脂１４を長寿命化することができる。   Further, the sealing resin 14 that seals the surface of the light emitting diode element 12 is deteriorated by humidity, but the sealing resin 14 is moisture-proof by the translucent cover 5 and the bulb outer portion 2, so that the sealing resin 14 Can extend the service life.

また、ＬＥＤ発光部６から近紫外光が照射される部分に蛍光体１５が塗布されるので、発光ダイオード素子１２の配設される面と蛍光体塗布面との距離を小さくすることにより波長変換カバー９を小型化でき、さらに蛍光体１５の塗布量を少なくすることができる。   Further, since the phosphor 15 is applied to the portion irradiated with near-ultraviolet light from the LED light emitting unit 6, the wavelength conversion can be performed by reducing the distance between the surface where the light emitting diode element 12 is disposed and the phosphor application surface. The cover 9 can be downsized, and the amount of the phosphor 15 applied can be reduced.

また、ＬＥＤ発光部６は発光することで熱が発生し、また近紫外光を蛍光体１５に照射して蛍光体１５を励起させると発熱をする。この発熱が大きくなるとＬＥＤ発光部６の寿命が短くなるばかりでなく、発光ダイオード素子１２を封止している封止樹脂１４が劣化してＬＥＤ発光部６から照射される近紫外光が弱くなるが、ＬＥＤ発光部６と蛍光体１５を密着させずに所定の距離隔てているので、蛍光体１５を励起するときにストークスシフトにより発生する熱がＬＥＤ発光部６に与える影響を抑えることができ、ＬＥＤ発光部６を長寿命化することができる。ここで所定の距離とは、蛍光体１５で生じる発熱が発光ダイオード素子１２を劣化させない範囲で小さい距離である。   Further, the LED light emitting unit 6 generates heat by emitting light, and generates heat when the phosphor 15 is excited by irradiating the phosphor 15 with near ultraviolet light. When this heat generation is increased, not only the life of the LED light emitting unit 6 is shortened, but also the sealing resin 14 that seals the light emitting diode element 12 is deteriorated, and the near ultraviolet light emitted from the LED light emitting unit 6 is weakened. However, since the LED light-emitting unit 6 and the phosphor 15 are separated from each other by a predetermined distance, the influence of heat generated by the Stokes shift on the LED light-emitting unit 6 when the phosphor 15 is excited can be suppressed. The life of the LED light emitting unit 6 can be extended. Here, the predetermined distance is a small distance in a range in which heat generated in the phosphor 15 does not deteriorate the light emitting diode element 12.

また、電球外郭部２と、電球外郭部２の大径開口部の内側側壁部に当接されるＬ字形状のリング７をアルミニウムなどの熱伝導率がよく放熱性のある材質を用いれば、ＬＥＤ発光部６から発生する熱は、アルミ基板８、リング７、電球外郭部２へと熱が伝えられて電球外郭部２から外気に熱が放射され、ＬＥＤ発光部６の発光効率がよくなり光出力が向上する。   Moreover, if the L-shaped ring 7 abutted on the inner wall portion of the bulb outer portion 2 and the large-diameter opening of the bulb outer portion 2 is made of a material having a good thermal conductivity such as aluminum, and having a heat dissipation property, The heat generated from the LED light emitting unit 6 is transmitted to the aluminum substrate 8, the ring 7, and the bulb outer portion 2, and is radiated from the bulb outer portion 2 to the outside air, so that the luminous efficiency of the LED light emitting portion 6 is improved. The light output is improved.

また、ＬＥＤ発光部６から出力される近紫外光は波長変換カバー９と透光性カバー５を透過して出力されるので、外部から衝撃を受けて透光性カバー５が割れてもＬＥＤ発光部６は波長変換カバー９で覆われている。したがって、ＬＥＤ発光部６から出力される近紫外線光が直接外部へ出力されることがない２重安全構造となっており、より安全性が向上している。   Further, since the near-ultraviolet light output from the LED light emitting unit 6 is transmitted through the wavelength conversion cover 9 and the translucent cover 5, the LED light is emitted even if the translucent cover 5 is cracked due to an external impact. The part 6 is covered with a wavelength conversion cover 9. Therefore, it has a double safety structure in which near-ultraviolet light output from the LED light emitting unit 6 is not directly output to the outside, and the safety is further improved.

なお、本実施の形態において、近紫外光を出力する発光ダイオード素子１２について説明したが、青色光を出力する発光ダイオード素子１２ａを用いてもよい。この場合、青色光を照射するとき黄色光に変換する蛍光体１５ａを用いれば、この蛍光体１５ａを透過する青色光とこの蛍光体１５ａで励起されて発光する黄色光とが混合されて白色光を得ることができる。   In the present embodiment, the light-emitting diode element 12 that outputs near-ultraviolet light has been described, but a light-emitting diode element 12a that outputs blue light may be used. In this case, if the phosphor 15a that converts to yellow light when irradiated with blue light is used, the blue light transmitted through the phosphor 15a and the yellow light excited and emitted by the phosphor 15a are mixed to produce white light. Can be obtained.

また、赤色変換蛍光体、緑色変換蛍光体、青色変換蛍光体を混合した白色光に変換する蛍光体１５について説明したが、赤、緑、青の光に変換するそれぞれの蛍光体１５の混合比を変えて、例えば電球色の光に変換する蛍光体１５ｂなどを用いてもよい。   In addition, the phosphor 15 that converts the red conversion phosphor, the green conversion phosphor, and the blue conversion phosphor into white light has been described. However, the mixing ratio of the respective phosphors 15 that convert red, green, and blue light. For example, a phosphor 15b that converts light into light bulb color may be used.

また、ＬＥＤ発光部６の放熱を効率よくするためにアルミ基板８にＬＥＤ発光部６を取り付けた例を示したが、ＬＥＤ発光部６の放熱が充分にできるときは、ガラスエポキシ基板などに取り付けてもよい。   In addition, in order to efficiently dissipate the heat from the LED light-emitting unit 6, the example in which the LED light-emitting unit 6 is attached to the aluminum substrate 8 has been shown. May be.

実施の形態２．
図９〜図１１は、この実施の形態におけるＬＥＤ電球の構成を示す図である。
本実施の形態は実施の形態１の波長変換カバー９をペン皿形状にし、アルミ基板８上に発光ダイオード素子実装基板１３を用いずに発光ダイオード素子１２ｂを実装し、その表面を封止樹脂１４ａで封止したＬＥＤ発光部としてのＬＥＤ光源素子モジュール２１を構成したものである。 Embodiment 2. FIG.
FIGS. 9-11 is a figure which shows the structure of the LED light bulb in this Embodiment.
In the present embodiment, the wavelength conversion cover 9 of the first embodiment is made into a pen dish shape, the light emitting diode element 12b is mounted on the aluminum substrate 8 without using the light emitting diode element mounting substrate 13, and the surface thereof is sealed with the sealing resin 14a. The LED light source element module 21 is configured as an LED light emitting unit sealed with the above.

図９はＬＥＤ電球の分解斜視図、図１０は波長変換カバーの断面図、図１１はＬＥＤ光源素子モジュールの配光特性を示す図であり、実施の形態１と同じ部分は同符号を付し、説明を省略する。   FIG. 9 is an exploded perspective view of the LED bulb, FIG. 10 is a cross-sectional view of the wavelength conversion cover, and FIG. 11 is a diagram showing the light distribution characteristics of the LED light source element module. The description is omitted.

ＬＥＤ電球１の外郭は口金４、電球外郭部２、透光性カバー５で構成されており、電球外郭部２の内部に電源回路１１を備え、電球外郭部２の大径開口部にリング７を当接させて取り付け、このリング７にアルミ基板８を取り付けている。アルミ基板８上には絶縁層を備えており、絶縁層には通電するための配線パターンが印刷されている。   The outer bulb of the LED bulb 1 is composed of a base 4, a bulb outer portion 2, and a translucent cover 5. A power circuit 11 is provided inside the bulb outer portion 2, and a ring 7 is formed in a large-diameter opening of the bulb outer portion 2. The aluminum substrate 8 is attached to the ring 7. An insulating layer is provided on the aluminum substrate 8, and a wiring pattern for energization is printed on the insulating layer.

この配線パターン上に近紫外光を発光する発光ダイオード素子１２ｂに形成される略球状のバンプを使ってフリップチップ接続して、発光ダイオード素子１２ｂが略中央に配置するように封止樹脂１４ａを半球状にポッティングしてＬＥＤ光源素子モジュール２１を構成している。   The sealing resin 14a is hemispherical so that the light emitting diode element 12b is arranged at the substantially center by using a substantially spherical bump formed on the light emitting diode element 12b that emits near ultraviolet light on the wiring pattern. The LED light source element module 21 is configured by potting in a shape.

図１０は、このＬＥＤ光源素子モジュール２１から出力される近紫外光を白色光に変換するペン皿形状の波長変換カバー９ａを示しており、アルミ基板８に備えられる。   FIG. 10 shows a pen dish-shaped wavelength conversion cover 9 a that converts near-ultraviolet light output from the LED light source element module 21 into white light, and is provided on the aluminum substrate 8.

波長変換カバー９ａはペン皿形状に形成され、円形平面部１６と、円形平面部１６の外周に接続する側面部であるペン皿側面部２２とを備える。ペン皿側面部２２の先端部には、ペン皿側面部２２の開口枠の対向する位置から突出する一対の基板取付部１８を備え、円形平面部１６とペン皿側面部２２の内側に蛍光体１５が塗布されている。   The wavelength conversion cover 9 a is formed in a pen dish shape, and includes a circular flat part 16 and a pen dish side part 22 which is a side part connected to the outer periphery of the circular flat part 16. The tip of the pen dish side 22 includes a pair of substrate mounting portions 18 that protrude from positions opposite to the opening frame of the pen dish side 22, and phosphors are disposed inside the circular flat part 16 and the pen dish side 22. 15 is applied.

図１１はＬＥＤ光源モジュール２１の配光特性の一例を示しており、ＬＥＤ光源素子モジュール２１の照射面から鉛直方向を９０°としたときの配光である。この図から、ＬＥＤ光源素子モジュール２１の照射面から約１１°〜約２０°及び約１６０°〜約１６９°の範囲（略側面方向）、約４７°〜約１３３°範囲（鉛直方向）は光出力が高く、約２０°〜約４７°及び約１３３°〜約１６０°の範囲（斜め方向）は光出力が弱いことが明らかである。   FIG. 11 shows an example of the light distribution characteristics of the LED light source module 21, and the light distribution when the vertical direction is 90 ° from the irradiation surface of the LED light source element module 21. From this figure, the range of about 11 ° to about 20 ° and about 160 ° to about 169 ° (substantially in the lateral direction) and the range of about 47 ° to about 133 ° (vertical direction) from the irradiation surface of the LED light source element module 21 are light. The output is high, and it is clear that the light output is weak in the range of about 20 ° to about 47 ° and about 133 ° to about 160 ° (oblique direction).

ここで、蛍光体１５に照射される光の照度が大きいほど励起される白色光の輝度が高くなる特性がある。ＬＥＤ光源素子モジュール２１の照射面に対し鉛直方向、略側面方向が特に強く出力され、斜め方向は弱い出力であるので、ＬＥＤ光源素子モジュール２１の照射面に対し鉛直方向にあたる波長変換カバー９ａの円形平面部１６の蛍光体塗布量を少なくして蛍光体１５の膜厚を薄くし、斜め方向にあたる周辺部分は蛍光体塗布量を多くして蛍光体１５の膜厚を厚くする。   Here, the luminance of the excited white light increases as the illuminance of the light applied to the phosphor 15 increases. Since the vertical direction and the substantially side direction are particularly strongly output with respect to the irradiation surface of the LED light source element module 21, and the oblique direction is weak output, the circular shape of the wavelength conversion cover 9a corresponding to the vertical direction with respect to the irradiation surface of the LED light source element module 21. The phosphor coating amount on the flat portion 16 is decreased to reduce the film thickness of the phosphor 15, and the peripheral portion corresponding to the oblique direction is increased to increase the phosphor coating amount to increase the film thickness of the phosphor 15.

このように波長変換カバー９ａに塗布する蛍光体１５の膜厚を変えると、ＬＥＤ光源素子モジュール２１から照射される光の照度の小さい部分は蛍光体１５の膜厚が厚く、照度の大きい部分は蛍光体１５の膜厚が薄くなるので、波長変換カバー９ａの蛍光体１５で変換される光の輝度のバランスがとれるので、より輝度ムラの少ない白色光を得ることができる。なお、蛍光体１５の膜厚を薄くすると蛍光体１５を透過する紫外光が増加するので、波長変換カバー９ａの可視光出力面に紫外光吸収膜または紫外光反射膜を備えるとよい。   Thus, when the film thickness of the phosphor 15 applied to the wavelength conversion cover 9a is changed, the portion where the illuminance of the light irradiated from the LED light source element module 21 is small is thick, and the portion where the illuminance is large is Since the thickness of the phosphor 15 is reduced, the brightness of light converted by the phosphor 15 of the wavelength conversion cover 9a can be balanced, so that white light with less brightness unevenness can be obtained. In addition, since the ultraviolet light which permeate | transmits the fluorescent substance 15 will increase when the film thickness of the fluorescent substance 15 is made thin, it is good to provide an ultraviolet light absorption film or an ultraviolet light reflection film in the visible light output surface of the wavelength conversion cover 9a.

また、ペン皿側面部２２に蛍光体１５を塗布することで、ＬＥＤ光源素子モジュール２１から発光される近紫外光の約１１°〜約２０°及び約１６０°〜約１６９°の近紫外光がペン皿側面部２２に照射されて白色光を得ることができ、効率がよく、広い角度にわたり光を照射できるＬＥＤ光源装置を得ることができる。   Further, by applying the phosphor 15 to the pen dish side surface portion 22, near ultraviolet light of about 11 ° to about 20 ° and about 160 ° to about 169 ° of the near ultraviolet light emitted from the LED light source element module 21 is emitted. It is possible to obtain an LED light source device that can irradiate the pen dish side surface portion 22 and obtain white light, can efficiently irradiate light over a wide angle.

このように蛍光体１５の膜厚を制御したＬＥＤ光源装置を備えることにより、それぞれのＬＥＤ光源素子モジュール２１から照射される近紫外光は、波長変換カバー９ａで光出力のバランスのよい白色光に変換され、またＬＥＤ光源素子モジュール２１から略側面方向へ照射される近紫外光はペン皿側面部２２に塗布される蛍光体１５で白色光に変換されるので、光出力にムラが少なく見栄えがよく、効率のよいＬＥＤ電球を得ることができる。   Thus, by providing the LED light source device in which the film thickness of the phosphor 15 is controlled, the near-ultraviolet light emitted from each LED light source element module 21 is converted into white light with a balanced light output by the wavelength conversion cover 9a. The near-ultraviolet light that is converted and irradiated from the LED light source element module 21 in a substantially lateral direction is converted into white light by the phosphor 15 applied to the pen dish side surface portion 22, so that there is little unevenness in the light output and the appearance is good. Well, an efficient LED bulb can be obtained.

また、ＬＥＤ光源素子モジュール２１の照射面に対し鉛直方向、略側面方向が特に強く出力され、斜め方向は弱い出力であるので、ＬＥＤ光源素子モジュール２１の小斜面に対し鉛直方向にあたる波長変換カバー９ａの円形平面部１６の蛍光体塗布量を多くして蛍光体１５の膜厚を厚くし、斜め方向にあたる周辺部分は蛍光体塗布量を少なくして蛍光体１５の膜厚を薄くしてもよい。このように波長変換カバー９ａに塗布する蛍光体１５の膜厚を変えると、ＬＥＤ光源素子モジュール２１から照射される光の照度の小さい部分は蛍光体１５の膜厚が薄く、照度の大きい部分は蛍光体１５の膜厚が厚くなるので、波長変換カバー９ａの蛍光体１５で変換される可視光の出力を大きくすることができる。
なお、この場合可視光を多く得ることができるが輝度ムラが起こるので、波長変換カバー９ａの可視光出力面に光拡散膜などを備えて可視光を拡散して、光の輝度ムラを少なくするようにしてもよい。 Further, since the vertical direction and the substantially side direction are particularly strongly output with respect to the irradiation surface of the LED light source element module 21 and the oblique direction is weak output, the wavelength conversion cover 9a corresponding to the vertical direction with respect to the small inclined surface of the LED light source element module 21. The phosphor coating amount of the circular flat portion 16 may be increased to increase the thickness of the phosphor 15, and the peripheral portion corresponding to the diagonal direction may be decreased to decrease the thickness of the phosphor 15. . Thus, when the film thickness of the phosphor 15 applied to the wavelength conversion cover 9a is changed, the portion where the illuminance of the light irradiated from the LED light source element module 21 is small is thin, and the portion where the illuminance is large is Since the thickness of the phosphor 15 is increased, the output of visible light converted by the phosphor 15 of the wavelength conversion cover 9a can be increased.
In this case, a large amount of visible light can be obtained, but luminance unevenness occurs. Therefore, the visible light output surface of the wavelength conversion cover 9a is provided with a light diffusion film or the like to diffuse visible light, thereby reducing light unevenness in light. You may do it.

また、ＬＥＤ光源素子モジュール２１は発光することで熱が発生し、また近紫外光を蛍光体１５に照射して蛍光体１５を励起させると発熱をする。この発熱が大きくなると発光ダイオード素子１２ｂの寿命が短くなるばかりでなく、発光ダイオード素子１２ｂを封止している封止樹脂１４ａが劣化して発光ダイオード素子１２ｂから照射される近紫外光が弱くなるが、ＬＥＤ光源素子モジュール２１と蛍光体１５は密着せずに離れているので、蛍光体１５を励起するときにストークスシフトにより発生する熱がＬＥＤ光源素子モジュール２１に与える影響を抑えることができ、ＬＥＤ光源素子モジュール２１を長寿命化することができる。   The LED light source element module 21 generates heat by emitting light, and generates heat when the phosphor 15 is excited by irradiating the phosphor 15 with near-ultraviolet light. When this heat generation increases, not only the life of the light emitting diode element 12b is shortened, but also the sealing resin 14a that seals the light emitting diode element 12b deteriorates and the near ultraviolet light irradiated from the light emitting diode element 12b becomes weak. However, since the LED light source element module 21 and the phosphor 15 are separated without being in close contact with each other, it is possible to suppress the influence of heat generated by Stokes shift on the LED light source element module 21 when the phosphor 15 is excited. The life of the LED light source element module 21 can be extended.

また、ＬＥＤ光源素子モジュール２１から出力される近紫外光は波長変換カバー９ａと透光性カバー５を透過して出力されるので、外部から衝撃を受けて透光性カバー５が割れてもＬＥＤ光源素子モジュール２１の光は波長変換カバー９ａで覆われている。したがって、ＬＥＤ光源素子モジュール２１から出力される近紫外線光が直接外部へ出力されることがない２重安全構造となっており、より安全性が向上している。   Further, since the near ultraviolet light output from the LED light source element module 21 is transmitted through the wavelength conversion cover 9a and the translucent cover 5, the LED is output even if the translucent cover 5 is broken due to an external impact. The light from the light source element module 21 is covered with a wavelength conversion cover 9a. Therefore, it has a double safety structure in which near-ultraviolet light output from the LED light source element module 21 is not directly output to the outside, and the safety is further improved.

実施の形態３．
図１２、図１３は、この実施の形態におけるＬＥＤ電球の構成を示す図である。
本実施の形態は実施の形態２のペン皿形状の波長変換カバーを扁平な曲面形状で構成したものである。 Embodiment 3 FIG.
12 and 13 are diagrams showing the configuration of the LED bulb in this embodiment.
In the present embodiment, the pen dish-shaped wavelength conversion cover of the second embodiment is configured with a flat curved surface.

図１２は、ＬＥＤ電球の側面断面図を示しており、実施の形態１及び実施の形態２と同じ部分は同符号を付し、説明を省略する。   FIG. 12 shows a side cross-sectional view of the LED bulb. The same parts as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and description thereof is omitted.

ＬＥＤ電球１の外郭は口金４、電球外郭部２、透光性カバー５で構成されており、電球外郭部２の内部に電源回路１１を備え、電球外郭部２の大径開口部にリングを当接させて取り付け、このリングにアルミ基板８を備えている。アルミ基板８上には絶縁層を備えており、絶縁層には通電するための配線パターンが印刷されて、ＬＥＤ光源素子モジュール２１が備えられている。   The outer bulb of the LED bulb 1 is composed of a base 4, a bulb outer portion 2, and a translucent cover 5. A power circuit 11 is provided inside the bulb outer portion 2, and a ring is attached to the large-diameter opening of the bulb outer portion 2. The ring is provided with an aluminum substrate 8 on the ring. An insulating layer is provided on the aluminum substrate 8, and a wiring pattern for energization is printed on the insulating layer, and the LED light source element module 21 is provided.

このＬＥＤ光源素子モジュール２１から出力される近紫外光を白色光に変換するペン皿形状の波長変換カバー９ｂがアルミ基板８に備えられている。   A pen dish-shaped wavelength conversion cover 9 b for converting near-ultraviolet light output from the LED light source element module 21 into white light is provided on the aluminum substrate 8.

波長変換曲面カバー９ｂは扁平な曲面部２３と、この曲面部２３の周縁の対向する位置から外側に突出させる一対の突出部２４とを備えていて、曲面部２３の内側に赤色変換蛍光体、緑色変換蛍光体、青色変換蛍光体を混合した蛍光体１５が塗布されている。この突出部２４にはアルミ基板８に取り付ける基板取付穴１８を備えている。   The wavelength conversion curved surface cover 9b includes a flat curved surface portion 23 and a pair of projecting portions 24 that project outward from the opposing positions of the periphery of the curved surface portion 23, and a red conversion phosphor, A phosphor 15 in which a green conversion phosphor and a blue conversion phosphor are mixed is applied. The protrusion 24 is provided with a substrate mounting hole 18 that is attached to the aluminum substrate 8.

図１１のＬＥＤ光源素子モジュール２１の配光特性から、ＬＥＤ光源素子モジュール２１の照射面の鉛直方向を９０°とするとき、約１１°〜約２０°及び約１６０°〜約１６９°の範囲（略側面方向）、約４７°〜約１３３°の範囲（鉛直方向）は光出力が高く、約２０°〜約４７°及び約１３３°〜約１６０°の範囲（斜め方向）は光出力が弱い。   From the light distribution characteristics of the LED light source element module 21 in FIG. 11, when the vertical direction of the irradiation surface of the LED light source element module 21 is 90 °, ranges of about 11 ° to about 20 ° and about 160 ° to about 169 ° ( The light output is high in the range of about 47 ° to about 133 ° (vertical direction), and the range of about 20 ° to about 47 ° and about 133 ° to about 160 ° (diagonal direction) is weak. .

波長変換カバー９ｂを扁平な曲面部２３で構成することにより、実施の形態２と同様にＬＥＤ光源素子モジュール２１から発光される鉛直方向の近紫外光は、波長変換カバー９ｂの曲面部２３に照射されて蛍光体１５を励起して白色光に変換さられ、ほぼ均一な輝度の白色光を透光面から得ることができる。   By configuring the wavelength conversion cover 9b with the flat curved surface portion 23, vertical near-ultraviolet light emitted from the LED light source element module 21 is irradiated onto the curved surface portion 23 of the wavelength conversion cover 9b, as in the second embodiment. Then, the phosphor 15 is excited and converted into white light, and white light with substantially uniform luminance can be obtained from the light transmitting surface.

また、ＬＥＤ光源素子モジュール２１から略側面方向へ発光される近紫外光は波長変換カバー９ｂの外枠側の蛍光体１５を励起して白色光に変換することができ、透光面から側面方向を照らすことができる。   Further, near-ultraviolet light emitted from the LED light source element module 21 in the substantially lateral direction can excite the phosphor 15 on the outer frame side of the wavelength conversion cover 9b and can be converted into white light. Can illuminate.

このように、波長変換カバー９ｂの透光面が緩やかな曲面で形成されているので、複数のＬＥＤ光源素子モジュール２１から鉛直方向へ照射される近紫外光は、ほぼ均一な輝度の白色光に変換され、また、略側面方向へ照射される近紫外線光が波長変換カバー９ｂの周囲を照射するので、波長変換カバー９ｂから広い角度範囲に光を出力することができ、波長変換カバー９ｂ全体がほぼ均一な輝度の白色光を発するので見栄えがよく、効率のよいＬＥＤ光源装置が得られる。   Thus, since the light-transmitting surface of the wavelength conversion cover 9b is formed with a gentle curved surface, the near-ultraviolet light irradiated in the vertical direction from the plurality of LED light source element modules 21 is converted into white light with substantially uniform luminance. The near-ultraviolet light that is converted and is irradiated substantially in the side direction irradiates the periphery of the wavelength conversion cover 9b, so that light can be output from the wavelength conversion cover 9b in a wide angle range, and the entire wavelength conversion cover 9b Since white light with substantially uniform luminance is emitted, it looks good and an efficient LED light source device can be obtained.

なお、図１３に示す波長変換カバー９ｃのように、複数のＬＥＤ光源素子モジュール２１から鉛直方向に照射される波長変換カバー９ｃ部分を円形平面部１６ａとし、波長変換カバー９ｃの円形平面部１６ａの周囲を曲面形状の曲面部２３ａとしてもよく、波長変換カバー９ｃの円形平面部１６ａはＬＥＤ光源素子モジュール２１と平行になるのでより均一な輝度の白色光を得ることができ、ＬＥＤ光源素子モジュール２１から略側面方向に放射される近紫外光が波長変換カバー９ｃの曲面部２３ａに照射されて白色光が得られる。   In addition, like the wavelength conversion cover 9c shown in FIG. 13, the wavelength conversion cover 9c portion irradiated in the vertical direction from the plurality of LED light source element modules 21 is a circular plane portion 16a, and the circular plane portion 16a of the wavelength conversion cover 9c is The periphery may be a curved surface portion 23a, and the circular flat surface portion 16a of the wavelength conversion cover 9c is parallel to the LED light source element module 21, so that white light with a more uniform luminance can be obtained. The near-ultraviolet light radiated in the substantially side direction is irradiated onto the curved surface portion 23a of the wavelength conversion cover 9c, and white light is obtained.

発光ダイオード素子から発光される光で蛍光体を励起して白色光などの可視光を発光する光源に関する。   The present invention relates to a light source that excites a phosphor with light emitted from a light emitting diode element to emit visible light such as white light.

この発明の実施の形態１におけるＬＥＤ電球の一部破断断面図である。It is a partially broken sectional view of the LED bulb in Embodiment 1 of this invention. この発明の実施の形態１におけるＬＥＤ電球の分解斜視図である。It is a disassembled perspective view of the LED bulb in Embodiment 1 of this invention. この発明の実施の形態１における他のＬＥＤ電球の一部破断断面図である。It is a partially broken sectional view of the other LED bulb in Embodiment 1 of this invention. この発明の実施の形態１における他のＬＥＤ電球の分解斜視図である。It is a disassembled perspective view of the other LED bulb in Embodiment 1 of this invention. この発明の実施の形態１における波長変換カバーの断面図である。It is sectional drawing of the wavelength conversion cover in Embodiment 1 of this invention. この発明の実施の形態１における他の波長変換カバーの断面図である。It is sectional drawing of the other wavelength conversion cover in Embodiment 1 of this invention. この発明の実施の形態１における他の波長変換カバーの断面図である。It is sectional drawing of the other wavelength conversion cover in Embodiment 1 of this invention. この発明の実施の形態１における点光源の光出力特性を示す図である。It is a figure which shows the light output characteristic of the point light source in Embodiment 1 of this invention. この発明の実施の形態２におけるＬＥＤ電球の分解斜視図である。It is a disassembled perspective view of the LED bulb in Embodiment 2 of this invention. この発明の実施の形態２における波長変換カバーの断面図である。It is sectional drawing of the wavelength conversion cover in Embodiment 2 of this invention. この発明の実施の形態２におけるＬＥＤ光源素子モジュールの配光特性図である。It is a light distribution characteristic view of the LED light source element module in Embodiment 2 of this invention. この発明の実施の形態３におけるＬＥＤ電球の一部破断断面図である。It is a partially broken sectional view of the LED bulb in Embodiment 3 of this invention. この発明の実施の形態３における他のＬＥＤ電球の一部破断断面図である。It is a partially broken sectional view of the other LED bulb in Embodiment 3 of this invention.

符号の説明Explanation of symbols

１ ＬＥＤ電球、２ 電球外郭部、３ 絶縁部、４ 口金、５ 透光性カバー、６ ＬＥＤ発光部、７ リング、８ 光源装置実装基板であるアルミ基板、９、９ａ、９ｂ、９ｃ 波長変換カバー、１０ カバー取付穴、１０ａ スペーサ、１１ 電源回路、１２、１２ａ、１２ｂ 発光ダイオード素子、１３ 発光ダイオード素子実装基板、１４、１４ａ 封止樹脂、１５、１５ａ、１５ｂ 蛍光部材である蛍光体、１６ 円形平面部、１７ 取付部、１８ 基板取付穴、１８ａ 係止片、１９ 固定爪、２０ レンズ、２１ ＬＥＤ光源素子モジュール、２２ 側面部であるペン皿側面部、２３、２３ａ 曲面部、２４ 突出部。 DESCRIPTION OF SYMBOLS 1 LED bulb, 2 Light bulb outer part, 3 Insulation part, 4 base, 5 Translucent cover, 6 LED light emission part, 7 Ring, 8 Aluminum substrate which is a light source device mounting board, 9, 9a, 9b, 9c Wavelength conversion cover DESCRIPTION OF SYMBOLS 10 Cover mounting hole, 10a Spacer, 11 Power supply circuit, 12, 12a, 12b Light emitting diode element, 13 Light emitting diode element mounting substrate, 14, 14a Sealing resin, 15, 15a, 15b Phosphor as fluorescent member, 16 circular Plane part, 17 attachment part, 18 substrate attachment hole, 18a locking piece, 19 fixing claw, 20 lens, 21 LED light source element module, 22 pen dish side part as side part, 23, 23a curved part, 24 projecting part.

Claims (8)

近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、
前記発光ダイオード素子が配設される面から所定の距離隔てた位置に前記発光ダイオード素子と対向する平面部を有し、前記発光ダイオード素子から放射される光を波長変換する蛍光部材を前記平面部に設けた波長変換カバーと、
を備えたＬＥＤ光源装置。 An LED light-emitting unit having a plurality of light-emitting diode elements that radiate near ultraviolet light or blue light and are arranged in a plane; and
A flat part facing the light emitting diode element at a predetermined distance from a surface on which the light emitting diode element is disposed, and a fluorescent member for converting the wavelength of light emitted from the light emitting diode element; A wavelength conversion cover provided on the
LED light source device comprising 近紫外光または青色光を放射し平面状に配設される複数の発光ダイオード素子を有するＬＥＤ発光部と、
前記発光ダイオード素子が配設される面から所定の距離隔てた位置に前記発光ダイオード素子と対向する扁平な曲面部を有し、前記発光ダイオード素子から放射される光を波長変換する蛍光部材を前記曲面部に設けた波長変換カバーと、
を備えたＬＥＤ光源装置。 An LED light-emitting unit having a plurality of light-emitting diode elements that radiate near ultraviolet light or blue light and are arranged in a plane; and
A fluorescent member that has a flat curved surface facing the light emitting diode element at a predetermined distance from a surface on which the light emitting diode element is disposed, and converts the wavelength of light emitted from the light emitting diode element; A wavelength conversion cover provided on the curved surface,
LED light source device comprising: 蛍光部材の膜厚を、ＬＥＤ発光部から放射される光の照度が大きいところで薄く、小さいところで厚くすることを特徴とする請求項１または請求項２のいずれかに記載のＬＥＤ光源装置。 3. The LED light source device according to claim 1, wherein the thickness of the fluorescent member is thin when the illuminance of light emitted from the LED light emitting portion is large and thick when it is small. 蛍光部材が設けられる面にこの蛍光部材を塗布する凹部を設け、この凹部の深さにより前記蛍光部材の膜厚を制御することを特徴とする請求項３に記載のＬＥＤ光源装置。 4. The LED light source device according to claim 3, wherein a concave portion for applying the fluorescent member is provided on a surface on which the fluorescent member is provided, and the thickness of the fluorescent member is controlled by the depth of the concave portion. 波長変換カバーにおいて蛍光部材が設けられる面と反対側の面にレンズを備えたことを特徴とする請求項１乃至請求項４のいずれかに記載のＬＥＤ光源装置。 The LED light source device according to any one of claims 1 to 4, wherein a lens is provided on a surface of the wavelength conversion cover opposite to a surface on which the fluorescent member is provided. ＬＥＤ発光部が発光ダイオード素子の表面を封止する封止樹脂を備えたことを特徴とする請求項１乃至請求項５のいずれかに記載のＬＥＤ光源装置。 The LED light source device according to any one of claims 1 to 5, wherein the LED light emitting unit includes a sealing resin that seals a surface of the light emitting diode element. 近紫外光または青色光を放射し平面状に配設される発光ダイオード素子及びこの発光ダイオード素子の表面を封止する封止樹脂を有するＬＥＤ発光部と、
前記発光ダイオード素子が配設される面から所定の距離隔てた位置に前記発光ダイオード素子と対向する平面部とこの平面部の外周に接続する側面部とを有するペン皿形状に形成され、前記発光ダイオード素子から放射される光を波長変換する蛍光部材を前記平面部及び前記側面部に設けた波長変換カバーと、
を備えたＬＥＤ光源装置。 A light-emitting diode element that emits near-ultraviolet light or blue light and is disposed in a plane, and an LED light-emitting unit that has a sealing resin that seals the surface of the light-emitting diode element;
The light emitting diode element is formed in a pen dish shape having a flat part facing the light emitting diode element and a side part connected to the outer periphery of the flat part at a predetermined distance from a surface on which the light emitting diode element is disposed. A wavelength conversion cover provided with a fluorescent member for wavelength-converting light emitted from the diode element on the plane part and the side part; and
LED light source device comprising: 一端に口金が設けられ、他端に向けてラッパ状に拡がる電球外郭部と、
請求項１乃至請求項７のいずれかに記載のＬＥＤ光源装置と、
前記電球外郭部の他端に設けられ、前記ＬＥＤ光源装置が実装される光源装置実装基板と、
前記電球外郭部の他端に設けられ、前記基板及び前記ＬＥＤ光源装置を密閉して覆う透光性カバーと、
を備えたＬＥＤ電球。 A bulb outer part that is provided with a base at one end and spreads in a trumpet shape toward the other end;
The LED light source device according to any one of claims 1 to 7,
A light source device mounting board provided on the other end of the bulb outer portion, on which the LED light source device is mounted;
A translucent cover that is provided at the other end of the bulb outer shell and covers the substrate and the LED light source device in a sealed manner;
LED bulb with
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