JP2006128402A - 積層型圧電素子 - Google Patents
積層型圧電素子 Download PDFInfo
- Publication number
- JP2006128402A JP2006128402A JP2004314497A JP2004314497A JP2006128402A JP 2006128402 A JP2006128402 A JP 2006128402A JP 2004314497 A JP2004314497 A JP 2004314497A JP 2004314497 A JP2004314497 A JP 2004314497A JP 2006128402 A JP2006128402 A JP 2006128402A
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- external electrode
- piezoelectric element
- electrode
- external
- main body
- Prior art date
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Fuel-Injection Apparatus (AREA)
Abstract
【解決手段】 積層型圧電素子1では、第2の外部電極25は、第1の外部電極23と電気的且つ物理的に接続された本体部27と、積層方向において積層体2の上面2cより突出した上端29aを有する延在部29とを含んで一体的に形成されている。これにより、第2の外部電極25の延在部29を端子として使用し得るが、第2の外部電極25は一体的に形成されているため、第2の外部電極25が断線するのを防止することができる。従って、圧電素子1の信頼性が向上することとなる。更に、対向する第2の外部電極25間において延在部29間の距離は本体部27間の距離より大きいため、予圧印加用のプレートを積層体2の上面2cに配置するなど、各種装置に組み込む際の圧電素子1のユニット化が容易となる。
【選択図】 図1
Description
Claims (1)
- 複数の圧電体と複数の内部電極とが交互に積層されてなる積層体と、
前記積層体の側面に対向するように設けられ、所定の前記内部電極と電気的に接続された第1の外部電極と、
前記第1の外部電極のそれぞれの外側に設けられた第2の外部電極と、を備え、
前記第2の外部電極は、前記第1の外部電極と電気的且つ物理的に接続された本体部と、前記積層体の積層方向において前記積層体の一端面より突出した一端を有する延在部とを含んで一体的に形成され、
対向する前記第2の外部電極間において前記延在部間の距離は前記本体部間の距離より大きいことを特徴とする積層型圧電素子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004314497A JP4466321B2 (ja) | 2004-10-28 | 2004-10-28 | 積層型圧電素子 |
US11/252,893 US7282839B2 (en) | 2004-10-28 | 2005-10-19 | Multilayer piezoelectric device |
FR0510835A FR2877494B1 (fr) | 2004-10-28 | 2005-10-24 | Dispositif piezoelectrique multicouche |
DE200510051066 DE102005051066B4 (de) | 2004-10-28 | 2005-10-25 | Piezoelektrik-Bauelement mit mehreren Schichten |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004314497A JP4466321B2 (ja) | 2004-10-28 | 2004-10-28 | 積層型圧電素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006128402A true JP2006128402A (ja) | 2006-05-18 |
JP4466321B2 JP4466321B2 (ja) | 2010-05-26 |
Family
ID=36177569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004314497A Expired - Fee Related JP4466321B2 (ja) | 2004-10-28 | 2004-10-28 | 積層型圧電素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7282839B2 (ja) |
JP (1) | JP4466321B2 (ja) |
DE (1) | DE102005051066B4 (ja) |
FR (1) | FR2877494B1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003574A (ja) * | 2009-06-16 | 2011-01-06 | Kyocera Corp | 積層型圧電素子、これを用いた噴射装置および燃料噴射システム |
WO2013114768A1 (ja) * | 2012-01-30 | 2013-08-08 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
JP2013211419A (ja) * | 2012-03-30 | 2013-10-10 | Kyocera Corp | 積層型圧電素子および圧電アクチュエータ |
WO2014021324A1 (ja) * | 2012-07-30 | 2014-02-06 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
JP2019102474A (ja) * | 2017-11-28 | 2019-06-24 | 京セラ株式会社 | 積層型圧電素子およびアクチュエータ |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004057795B4 (de) * | 2004-11-30 | 2006-12-28 | Siemens Ag | Kontaktierung von Vielschicht-Piezoaktoren bzw. -sensoren |
US7665445B2 (en) * | 2008-04-18 | 2010-02-23 | Caterpillar Inc. | Motion coupler for a piezoelectric actuator |
DE102008029185A1 (de) * | 2008-06-19 | 2009-12-24 | Epcos Ag | Piezoelektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Kontaktes |
EP2511968B1 (en) * | 2009-11-26 | 2015-04-22 | Kyocera Corporation | Stacked piezoelectric element, injection device using same, and fuel injection system |
DE102010022925B4 (de) * | 2010-06-07 | 2019-03-07 | Tdk Electronics Ag | Piezoelektrisches Vielschichtbauelement und Verfahren zur Ausbildung einer Außenelektrode bei einem piezoelektrischen Vielschichtbauelement |
DE102014214018A1 (de) * | 2014-07-18 | 2016-01-21 | Continental Automotive Gmbh | Piezobauelement, Kontaktierungsbauelement zum elektrischen Kontaktieren eines Piezostapels und Verfahren zum Herstellen eines solchen Piezobauelements |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4860750A (en) * | 1986-04-17 | 1989-08-29 | Intermedics Inc. | Sidelock pacer lead connector |
US4803763A (en) * | 1986-08-28 | 1989-02-14 | Nippon Soken, Inc. | Method of making a laminated piezoelectric transducer |
JP2892672B2 (ja) * | 1989-03-24 | 1999-05-17 | 日立金属株式会社 | 積層型変位素子 |
DE19928189A1 (de) | 1999-06-19 | 2001-04-19 | Bosch Gmbh Robert | Piezoaktor |
ATE356441T1 (de) * | 1999-06-29 | 2007-03-15 | Siemens Ag | Piezoaktor mit einer elektrisch leitenden mehrschichtfolie |
DE10025998A1 (de) * | 2000-05-25 | 2001-12-06 | Bosch Gmbh Robert | Piezoaktor |
JP4158338B2 (ja) * | 2000-06-06 | 2008-10-01 | 株式会社デンソー | インジェクタ用圧電体素子 |
JP2002203999A (ja) * | 2000-11-06 | 2002-07-19 | Denso Corp | 積層型圧電体素子とその製造方法 |
JP4248777B2 (ja) * | 2000-12-28 | 2009-04-02 | 株式会社デンソー | インジェクタ用圧電体素子及びその製造方法,並びにインジェクタ |
JP2003060249A (ja) * | 2001-08-08 | 2003-02-28 | Nec Tokin Ceramics Corp | 積層型圧電セラミック |
JP4483275B2 (ja) * | 2003-02-05 | 2010-06-16 | 株式会社デンソー | 積層型圧電素子及びその製造方法 |
JP2005086110A (ja) * | 2003-09-10 | 2005-03-31 | Denso Corp | 積層型圧電体素子 |
JP4706209B2 (ja) * | 2004-08-30 | 2011-06-22 | 株式会社デンソー | 積層型圧電体素子及びその製造方法並びに導電性接着剤 |
JP4736422B2 (ja) * | 2004-12-24 | 2011-07-27 | 株式会社デンソー | 積層型圧電素子の製造方法 |
-
2004
- 2004-10-28 JP JP2004314497A patent/JP4466321B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-19 US US11/252,893 patent/US7282839B2/en not_active Expired - Fee Related
- 2005-10-24 FR FR0510835A patent/FR2877494B1/fr active Active
- 2005-10-25 DE DE200510051066 patent/DE102005051066B4/de not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011003574A (ja) * | 2009-06-16 | 2011-01-06 | Kyocera Corp | 積層型圧電素子、これを用いた噴射装置および燃料噴射システム |
WO2013114768A1 (ja) * | 2012-01-30 | 2013-08-08 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
JP2013211419A (ja) * | 2012-03-30 | 2013-10-10 | Kyocera Corp | 積層型圧電素子および圧電アクチュエータ |
WO2014021324A1 (ja) * | 2012-07-30 | 2014-02-06 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
JP5797339B2 (ja) * | 2012-07-30 | 2015-10-21 | 京セラ株式会社 | 積層型圧電素子およびこれを備えた噴射装置ならびに燃料噴射システム |
US9698334B2 (en) | 2012-07-30 | 2017-07-04 | Kyocera Corporation | Multi-layer piezoelectric element, and injection device and fuel injection system provided with the same |
JP2019102474A (ja) * | 2017-11-28 | 2019-06-24 | 京セラ株式会社 | 積層型圧電素子およびアクチュエータ |
Also Published As
Publication number | Publication date |
---|---|
DE102005051066A1 (de) | 2006-05-04 |
US20060091766A1 (en) | 2006-05-04 |
FR2877494B1 (fr) | 2015-06-05 |
FR2877494A1 (fr) | 2006-05-05 |
DE102005051066B4 (de) | 2013-10-17 |
US7282839B2 (en) | 2007-10-16 |
JP4466321B2 (ja) | 2010-05-26 |
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