JP2006114524A - Reduced pressure drying device - Google Patents

Reduced pressure drying device Download PDF

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JP2006114524A
JP2006114524A JP2004297078A JP2004297078A JP2006114524A JP 2006114524 A JP2006114524 A JP 2006114524A JP 2004297078 A JP2004297078 A JP 2004297078A JP 2004297078 A JP2004297078 A JP 2004297078A JP 2006114524 A JP2006114524 A JP 2006114524A
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chamber
substrate
exhaust port
support
drying apparatus
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JP4408786B2 (en
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Takashi Kakimura
崇 柿村
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Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a reduced pressure drying device where a displacement volume from a chamber can easily be changed without using a special displacement volume adjusting member. <P>SOLUTION: The reduced pressure drying device is provided with a chamber 10 formed of a lid 11, a packing 12 and a base 13, support pins 15 erected on the base 13 in the chamber 10, and a support plate 22 where rise/fall pins 21 are erected. Exhaust ports 31 are formed in the base 13 in the chamber 10. The exhaust ports 31 are connected to a vacuum pump 34. The displacement volume from the exhaust ports 31 is changed by a distance between a lower face of the support plate 22 and openings on a chamber 10-side in the exhaust ports 31. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、減圧乾燥装置に関する。   The present invention relates to a vacuum drying apparatus.

例えば、半導体ウエハや液晶表示パネル用ガラス基板あるいは半導体製造装置用マスク基板等の基板に塗布されたフォトレジスト等の薄膜を減圧乾燥する減圧乾燥装置は、特許文献１に開示されている。この特許文献１に記載の減圧乾燥装置においては、基板を搬入したチャンバ内を真空ポンプにより減圧することで、レジスト液の成分の中心である溶剤の蒸発を促進し、フォトレジストを迅速に乾燥させるようにしている。このような減圧乾燥装置を使用してフォトレジストを乾燥させた場合には、風や熱等の外的要因の影響を防止して、フォトレジストをムラなく乾燥させることが可能となる。
特開平７−２８３１０８号公報 For example, Patent Document 1 discloses a vacuum drying apparatus for drying a thin film such as a photoresist applied to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus under reduced pressure. In the reduced-pressure drying apparatus described in Patent Document 1, the inside of the chamber into which the substrate is loaded is decompressed by a vacuum pump, thereby promoting the evaporation of the solvent that is the center of the resist solution component and quickly drying the photoresist. I am doing so. When the photoresist is dried using such a reduced pressure drying apparatus, it is possible to prevent the influence of external factors such as wind and heat, and to dry the photoresist evenly.
JP-A-7-283108

このような減圧乾燥装置を使用した場合、減圧乾燥処理を開始した直後に突沸と呼ばれる現象が発生する場合がある。これは、基板表面に塗布されたフォトレジスト中の溶剤成分が急激に蒸発して突然沸騰することにより生ずる現象である。このような突沸が発生した場合には、脱泡と呼ばれるフォトレジストの表面に小さな泡が形成される現象が生じ、その基板の使用が不可能となる。   When such a vacuum drying apparatus is used, a phenomenon called bumping may occur immediately after the vacuum drying process is started. This is a phenomenon that occurs when the solvent component in the photoresist applied to the substrate surface suddenly evaporates and suddenly boils. When such bumping occurs, a phenomenon called small bubbles is formed on the surface of the photoresist called defoaming, and the substrate cannot be used.

このため、減圧乾燥処理の初期段階においては、チャンバ内より低速で排気を行って、脱泡の発生を防止する必要がある。一方、基板の全面において迅速で均一な乾燥を行うためには、チャンバ内より強力に排気を実行する必要がある。   For this reason, in the initial stage of the reduced-pressure drying process, it is necessary to exhaust air at a lower speed than in the chamber to prevent the occurrence of defoaming. On the other hand, in order to perform quick and uniform drying over the entire surface of the substrate, it is necessary to exhaust the air more strongly than in the chamber.

このためには、チャンバ内からの排気量を制御するため、ダンパや流量可変弁等の排気量調整部材を配設する必要があり、装置の製造コストが高額となる。このとき、排気量調整部材として排気量を連続的に変更可能なものを使用したときには、そのコストが特に高額となる。   For this purpose, in order to control the exhaust amount from the inside of the chamber, it is necessary to dispose an exhaust amount adjusting member such as a damper or a flow rate variable valve, which increases the manufacturing cost of the apparatus. At this time, when an exhaust amount adjusting member that can continuously change the exhaust amount is used, the cost is particularly high.

この発明は上記課題を解決するためになされたものであり、特別な排気量調整部材を使用することなく簡易にチャンバからの排気量を変更することが可能な減圧乾燥装置を提供することを目的とする。   The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a reduced-pressure drying apparatus that can easily change the exhaust amount from the chamber without using a special exhaust amount adjusting member. And

請求項１に記載の発明は、基板の主面に形成された薄膜を減圧乾燥する減圧乾燥装置において、基板の周囲を覆うチャンバと、基板を支持する支持部材と、支持部材を昇降させる昇降手段と、チャンバに形成された排気口と、排気口を介して排気を行う排気手段と、支持部材と連結され、排気口におけるチャンバ側の開口部と対向する位置において当該支持部材とともに昇降移動することにより、排気口との距離を変更することで当該排気口からの排気量を変更する遮蔽部材とを備えたことを特徴とする。   According to a first aspect of the present invention, there is provided a vacuum drying apparatus for drying a thin film formed on a main surface of a substrate under reduced pressure, a chamber that covers the periphery of the substrate, a support member that supports the substrate, and an elevating unit that moves the support member up and down And an exhaust port formed in the chamber, an exhaust means for exhausting air through the exhaust port, and a support member, and is moved up and down together with the support member at a position facing the chamber side opening at the exhaust port. Thus, a shielding member for changing the amount of exhaust from the exhaust port by changing the distance to the exhaust port is provided.

請求項２に記載の発明は、請求項１に記載の発明において、支持部材は各々基板の下面に当接する複数の昇降ピンであり、遮蔽部材は複数の昇降ピンを連結する支持板である。   According to a second aspect of the present invention, in the first aspect of the present invention, the support member is a plurality of elevating pins that abut against the lower surface of the substrate, and the shielding member is a support plate that connects the plurality of elevating pins.

請求項３に記載の発明は、請求項２に記載の発明において、排気口は、チャンバの底面における平面視において支持板と重複する位置に形成される。   According to a third aspect of the present invention, in the second aspect of the present invention, the exhaust port is formed at a position overlapping the support plate in a plan view on the bottom surface of the chamber.

請求項４に記載の発明は、請求項３に記載の発明において、チャンバ内には、基板の減圧処理時に基板を支持する複数の支持ピンが立設されており、昇降ピンは支持ピンとの間で基板の受け渡しを実行する。   According to a fourth aspect of the present invention, in the third aspect of the present invention, the chamber is provided with a plurality of support pins that support the substrate during the decompression processing of the substrate, and the lift pins are located between the support pins. Execute the board transfer.

請求項１に記載の発明によれば、支持部材とともに昇降移動する遮蔽部材を利用して排気口からの排気量を変更することから、特別な排気量調整部材を使用することなく、簡易にチャンバからの排気量を変更することが可能となる。   According to the first aspect of the present invention, since the exhaust amount from the exhaust port is changed using the shielding member that moves up and down together with the support member, the chamber can easily be used without using a special exhaust amount adjusting member. It becomes possible to change the displacement from the engine.

請求項２に記載の発明によれば、複数の昇降ピンを連結する支持板を利用して、簡易にチャンバからの排気量を変更することが可能となる。   According to the second aspect of the present invention, it is possible to easily change the exhaust amount from the chamber by using the support plate connecting the plurality of lifting pins.

請求項３に記載の発明によれば、排気口はが平面視において支持板と重複する位置に形成されることから、チャンバの設置面積を小さくすることが可能となる。   According to the third aspect of the present invention, since the exhaust port is formed at a position overlapping the support plate in plan view, the installation area of the chamber can be reduced.

請求項４に記載の発明によれば、支持ピンとの間で基板の受け渡しを実行する昇降ピンの昇降動作を利用して、簡易にチャンバからの排気量を変更することが可能となる。   According to the fourth aspect of the present invention, it is possible to easily change the exhaust amount from the chamber by using the lifting / lowering operation of the lifting / lowering pin that transfers the substrate to / from the support pin.

以下、この発明の実施の形態を図面に基づいて説明する。図１乃至図３はこの発明の第１実施形態に係る減圧乾燥装置の概要図であり、図４は排気口３１におけるチャンバ１０側の開口部付近の拡大図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 3 are schematic views of a vacuum drying apparatus according to the first embodiment of the present invention, and FIG. 4 is an enlarged view of the vicinity of an opening on the chamber 10 side in the exhaust port 31.

この減圧乾燥装置は、蓋部１１と、パッキング１２と、基部１３とから成るチャンバ１０と、このチャンバ１０における基部１３に立設された支持ピン１５と、複数の昇降ピン２１が立設された支持板２２とを備える。基板Ｗは、チャンバ１０内において、その主面を上方に向けた水平姿勢で支持ピン１５または昇降ピン２１により支持される。なお、昇降ピン２１はこの発明に係る支持部材を構成し、支持板２２は、複数の昇降ピン２１を連結するこの発明に係る遮蔽部材を構成する。   In this vacuum drying apparatus, a chamber 10 including a lid portion 11, a packing 12, and a base portion 13, a support pin 15 erected on the base portion 13 in the chamber 10, and a plurality of elevating pins 21 are erected. And a support plate 22. The substrate W is supported in the chamber 10 by the support pins 15 or the lift pins 21 in a horizontal posture with its main surface facing upward. In addition, the raising / lowering pin 21 comprises the support member based on this invention, and the support plate 22 comprises the shielding member based on this invention which connects the several raising / lowering pin 21. As shown in FIG.

チャンバ１０における基部１３には、排気口３１が形成されている。この排気口３１は、チャンバ１０の底面を構成する基部１３における平面視において支持板２２と重複する位置に形成されている。この排気口３１は、管路３２により、真空ポンプ３４と接続されている。そして、排気口３１と真空ポンプ３４の間には、開閉弁３３が配設されている。なお、真空ポンプ３４に変えて排気ファン等を使用してもよい。   An exhaust port 31 is formed in the base portion 13 of the chamber 10. The exhaust port 31 is formed at a position overlapping the support plate 22 in a plan view of the base portion 13 constituting the bottom surface of the chamber 10. The exhaust port 31 is connected to a vacuum pump 34 by a pipe line 32. An opening / closing valve 33 is disposed between the exhaust port 31 and the vacuum pump 34. An exhaust fan or the like may be used instead of the vacuum pump 34.

また、支持板２２は、支持棒２４を介して昇降機構２５と連結されている。昇降ピン２１は支持板２２とともに、昇降機構２５の作用により、図示しない搬送アームとの間で基板Ｗを受け渡す基板Ｗの受け渡し位置と、各々高さが異なる第１、第２の乾燥位置との高さ位置の間を昇降可能となっている。   The support plate 22 is connected to the lifting mechanism 25 via a support bar 24. The lift pins 21, together with the support plate 22, by the action of the lift mechanism 25, the transfer position of the substrate W between the transfer arm (not shown), the first and second drying positions having different heights, respectively. It is possible to move up and down between the height positions.

次に、この減圧乾燥装置により基板の主面に形成された薄膜を乾燥する乾燥動作について説明する。図５および図６は、この発明の第１実施形態に係る減圧乾燥装置による乾燥動作を示すフローチャートである。   Next, a drying operation for drying the thin film formed on the main surface of the substrate by the reduced pressure drying apparatus will be described. 5 and 6 are flowcharts showing a drying operation by the reduced pressure drying apparatus according to the first embodiment of the present invention.

基板Ｗの主面に形成された薄膜を乾燥する場合には、最初に、図１に示すようにチャンバ１０における蓋部１１を図示しない昇降機構により上昇させて、チャンバ１０を開放する（ステップＳ１１）。次に、基板Ｗを支持した図示しない搬送アームがチャンバ１０内に進入する（ステップＳ１２）。   When drying the thin film formed on the main surface of the substrate W, first, as shown in FIG. 1, the lid portion 11 in the chamber 10 is raised by a lifting mechanism (not shown) to open the chamber 10 (step S11). ). Next, a transfer arm (not shown) that supports the substrate W enters the chamber 10 (step S12).

次に、昇降機構２５の駆動により、昇降ピン２１が支持板２２とともに図１に示す基板Ｗの受け渡し位置まで上昇する（ステップＳ１３）。これにより、搬送アームに支持されていた基板Ｗが、昇降ピン２１により支持される。そして、搬送アームがチャンバ１０内より退出する（ステップＳ１４）。   Next, by the driving of the elevating mechanism 25, the elevating pins 21 are raised together with the support plate 22 to the delivery position of the substrate W shown in FIG. 1 (step S13). As a result, the substrate W supported by the transport arm is supported by the lift pins 21. Then, the transfer arm leaves the chamber 10 (step S14).

次に、昇降機構２５の駆動により、昇降ピン２１が支持板２２とともに図２に示す第１の乾燥位置まで下降する（ステップＳ１５）。これにより、昇降ピン２１にその下面を支持されていた基板Ｗが支持ピン１５に移載される。そして、図２に示すように、チャンバ１０における蓋部１１を図示しない昇降機構により下降させて、チャンバ１０を閉止する（ステップＳ１６）。この状態においては、図２に示すように、支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄ（図４参照）は、小さくなっている。   Next, by driving the lifting mechanism 25, the lifting pins 21 are lowered together with the support plate 22 to the first drying position shown in FIG. 2 (step S15). As a result, the substrate W whose lower surface is supported by the lift pins 21 is transferred to the support pins 15. Then, as shown in FIG. 2, the lid portion 11 in the chamber 10 is lowered by an elevator mechanism (not shown) to close the chamber 10 (step S16). In this state, as shown in FIG. 2, the distance D (see FIG. 4) between the lower surface of the support plate 22 and the opening 35 on the chamber 10 side in the exhaust port 31 is small.

この状態において、開閉弁３３を開放し、真空ポンプ３４の作用により排気を行う（ステップＳ１７）。このとき、この減圧乾燥装置においては、排気口３１がチャンバ１０の底部に形成されており、基板Ｗの主面とチャンバ１０の蓋部１１下面との距離は小さく設定されている。このため、この排気口３１から排気を行った場合には、基板Ｗの主面において、その中央から端縁に向かう空気流が発生する。   In this state, the on-off valve 33 is opened and exhaust is performed by the action of the vacuum pump 34 (step S17). At this time, in this vacuum drying apparatus, the exhaust port 31 is formed at the bottom of the chamber 10, and the distance between the main surface of the substrate W and the lower surface of the lid 11 of the chamber 10 is set small. For this reason, when exhaust is performed from the exhaust port 31, an air flow from the center toward the edge is generated on the main surface of the substrate W.

この状態においては、支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄが小さく設定されている。このため、真空ポンプ３４による排気力にかかわらず、排気口３１からの排気量は小さいものとなる。このときの支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄは、１０ｍｍ以下とすることが好ましく、４ｍｍ以下とすることがより好ましい。   In this state, the distance D between the lower surface of the support plate 22 and the opening 35 on the chamber 10 side in the exhaust port 31 is set small. For this reason, the exhaust amount from the exhaust port 31 is small regardless of the exhaust force by the vacuum pump 34. At this time, the distance D between the lower surface of the support plate 22 and the opening 35 on the chamber 10 side at the exhaust port 31 is preferably 10 mm or less, and more preferably 4 mm or less.

このように基板Ｗの主面とチャンバ１０における蓋部１１との距離を小さく設定した上で、少量の排気量により減圧乾燥を行った場合には、基板Ｗの主面における中央から端縁に向かう緩やかな空気流により、突沸による脱泡を防止した状態で、適切な減圧乾燥を実行することが可能となる。但し、基板Ｗの主面中央部の薄膜部分については、十分な乾燥は行い得ない。   In this way, when the distance between the main surface of the substrate W and the lid portion 11 in the chamber 10 is set to be small and vacuum drying is performed with a small exhaust amount, the center of the main surface of the substrate W is shifted from the center to the edge. Appropriate drying under reduced pressure can be performed in a state in which defoaming due to bumping is prevented by the gentle air flow that is directed. However, the thin film portion at the center of the main surface of the substrate W cannot be sufficiently dried.

上述した第１乾燥工程を開始して一定の時間が経過すれば（ステップＳ１８）、昇降ピン２１が支持板２２とともに図３に示す第２の乾燥位置まで上昇する（ステップＳ１９）。これにより、支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄが大きくなり、排気口３１からの排気量が大きくなる。このときには、基板Ｗの主面において、その中央から端縁に向かう比較的大きな空気流が発生する。このように大きな排気量により減圧乾燥を行った場合には、基板Ｗの主面全域にわたり、迅速に乾燥が行われる。しかしながら、上述した第１乾燥工程において薄膜はある程度乾燥していることから、突沸による脱泡が発生することはない。   When a predetermined time has elapsed since the first drying step described above has been started (step S18), the elevating pins 21 are raised together with the support plate 22 to the second drying position shown in FIG. 3 (step S19). As a result, the distance D between the lower surface of the support plate 22 and the opening 35 on the chamber 10 side at the exhaust port 31 is increased, and the exhaust amount from the exhaust port 31 is increased. At this time, a relatively large air flow is generated on the main surface of the substrate W from the center toward the edge. When vacuum drying is performed with such a large displacement, drying is performed quickly over the entire main surface of the substrate W. However, since the thin film is dried to some extent in the first drying step described above, defoaming due to bumping does not occur.

上述した第２乾燥工程において、図示しないセンサによりチャンバー１０内の真空度が予め設定した値に到達したことを検知すれば（ステップＳ２０）、開閉弁３３を閉止する（ステップＳ２１）。そして、チャンバー内に窒素ガスをパージする（ステップＳ２２）。   In the second drying step described above, if it is detected by a sensor (not shown) that the degree of vacuum in the chamber 10 has reached a preset value (step S20), the on-off valve 33 is closed (step S21). Then, nitrogen gas is purged into the chamber (step S22).

チャンバー１０内が大気圧となれば、チャンバ１０における蓋部１１を図示しない昇降機構により上昇させて、チャンバ１０を開放する（ステップＳ２３）。次に、昇降機構２５の駆動により、昇降ピン２１が支持板２２とともに図１に示す基板Ｗの受け渡し位置まで上昇する（ステップＳ２４）。   When the inside of the chamber 10 reaches atmospheric pressure, the lid portion 11 in the chamber 10 is raised by an elevator mechanism (not shown) to open the chamber 10 (step S23). Next, by the driving of the elevating mechanism 25, the elevating pins 21 are raised together with the support plate 22 to the delivery position of the substrate W shown in FIG. 1 (step S24).

この状態において、図示しない搬送アームがチャンバ１０内に進入する（ステップＳ２５）。そして、昇降機構２５の駆動により、昇降ピン２１が支持板２２とともに下降する（ステップＳ２６）。これにより、昇降ピン２１に支持されていた基板Ｗが搬送アームにより支持される。そして、基板Ｗを支持した搬送アームがチャンバ１０内より退出する（ステップＳ２７）。   In this state, a transfer arm (not shown) enters the chamber 10 (step S25). And by the drive of the raising / lowering mechanism 25, the raising / lowering pin 21 falls with the support plate 22 (step S26). Thereby, the board | substrate W currently supported by the raising / lowering pin 21 is supported by the conveyance arm. Then, the transfer arm that supports the substrate W leaves the chamber 10 (step S27).

図７は、上述した減圧乾燥動作時のチャンバ１０内の真空度の変化を示す説明図である。   FIG. 7 is an explanatory diagram showing changes in the degree of vacuum in the chamber 10 during the above-described reduced-pressure drying operation.

この図においては、縦軸は時間（秒）を表示しており、縦軸は真空度（Torr）を対数で表示している。領域Ａは支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄを小さくして小さな排気量により排気を行う第１乾燥工程を、領域Ｂは支持板２２の下面と排気口３１におけるチャンバ１０側の開口部３５との距離Ｄを大きくして大きな排気量で排気を行う第２乾燥工程を、領域Ｃは窒素ガスによるパージ工程を示している。また、符号Ｐは大気圧を示している。   In this figure, the vertical axis represents time (seconds), and the vertical axis represents the degree of vacuum (Torr) in logarithm. Region A is a first drying process in which the distance D between the lower surface of the support plate 22 and the opening 35 on the chamber 10 side at the exhaust port 31 is reduced to perform exhaust with a small exhaust amount, and region B is the lower surface of the support plate 22. Region C indicates a second drying step in which the distance D between the exhaust port 31 and the opening 35 on the chamber 10 side is increased to perform exhaust with a large exhaust amount, and region C indicates a purge step with nitrogen gas. Moreover, the code | symbol P has shown atmospheric pressure.

以上のように、この発明に係る減圧乾燥装置によれば、流量調整弁等の特別な排気量調整部材を使用することなく、簡易にチャンバからの排気量を変更することが可能となる。   As described above, according to the vacuum drying apparatus of the present invention, it is possible to easily change the exhaust amount from the chamber without using a special exhaust amount adjusting member such as a flow rate adjusting valve.

次に、この発明の他の実施形態について説明する。図８は、第２実施形態に係る真空減圧装置における排気口３１のチャンバ１０側の開口部付近の拡大図である。   Next, another embodiment of the present invention will be described. FIG. 8 is an enlarged view of the vicinity of the opening on the chamber 10 side of the exhaust port 31 in the vacuum decompression apparatus according to the second embodiment.

この実施形態においては、支持板２２の下面における排気口３１と対向する位置に、下方を向くテーパ面を有し、排気口３１におけるチャンバー１０側の開口部３５内に進入可能な凸部３６を付設した点が、上述した第１実施形態と異なる。この実施形態においては、排気口３１からの排気量をより微妙に調整することが可能となる。   In this embodiment, a convex portion 36 having a tapered surface facing downward at a position facing the exhaust port 31 on the lower surface of the support plate 22 and capable of entering the opening 35 on the chamber 10 side in the exhaust port 31 is provided. The attached point is different from the first embodiment described above. In this embodiment, the exhaust amount from the exhaust port 31 can be finely adjusted.

次に、この発明のさらに他の実施形態について説明する。図９は、第３実施形態に係る真空減圧装置における排気口３１のチャンバ１０側の開口部付近の拡大図である。   Next, still another embodiment of the present invention will be described. FIG. 9 is an enlarged view of the vicinity of the opening on the chamber 10 side of the exhaust port 31 in the vacuum decompression apparatus according to the third embodiment.

この実施形態においては、第１、第２実施形態における支持板２２を省略し、複数の昇降ピン２１を線状の連結部材３８により連結する構成を有する。そして、この連結部材３８における排気口３１と対向する位置には、板状の遮蔽部３７が配設されている。この実施形態においても、上述した第１実施形態と同様、排気口３１からの排気量を調整することが可能となる。   In this embodiment, the support plate 22 in the first and second embodiments is omitted, and a plurality of lifting pins 21 are connected by a linear connecting member 38. A plate-shaped shielding portion 37 is disposed at a position facing the exhaust port 31 in the connecting member 38. Also in this embodiment, the exhaust amount from the exhaust port 31 can be adjusted as in the first embodiment described above.

なお、上述した第１、第２実施形態においては、排気口３１がチャンバ１０の底面を構成する基部１３における平面視において支持板２２と重複する位置に形成されている。しかしながら、排気口を平面視において支持板２２と重複しない位置に形成し、第３実施形態と同様の線状の連結部材により支持板と連結させた遮蔽部を、排気口の上部に配設する構成を採用してもよい。但し、排気口３１を平面視において支持板２２と重複する位置に形成した場合には、チャンバの設置面積を小さくすることが可能となる。   In the first and second embodiments described above, the exhaust port 31 is formed at a position overlapping the support plate 22 in a plan view of the base portion 13 constituting the bottom surface of the chamber 10. However, the exhaust port is formed at a position that does not overlap with the support plate 22 in plan view, and a shielding portion that is connected to the support plate by a linear connecting member similar to that of the third embodiment is disposed above the exhaust port. A configuration may be adopted. However, when the exhaust port 31 is formed at a position overlapping the support plate 22 in plan view, the installation area of the chamber can be reduced.

また、上述した各実施形態においては、いずれも、基板Ｗを昇降ピン２１から支持ピン１５に移載して減圧乾燥処理を実行しているが、支持ピン１５を省略し、基板を支持ピン２１により支持したままの状態で減圧乾燥処理を実行するようにしてもよい。   In each of the above-described embodiments, the substrate W is transferred from the lifting pins 21 to the support pins 15 and the reduced-pressure drying process is performed. However, the support pins 15 are omitted, and the substrate is supported by the support pins 21. Thus, the reduced-pressure drying process may be executed in a state where it is supported.

さらに、上述した各実施においては、いずれも、昇降ピン２１を第１、第２の乾燥位置で停止させて減圧乾燥を実行しているが、昇降ピン２１を第１乾燥位置から第２乾燥位置まで連続的に移動させながら乾燥を実行するようにしてもよい。そうすれば、より連続的に排気速度が変更できる。   Furthermore, in each implementation mentioned above, although the raising / lowering pin 21 is stopped in the 1st, 2nd drying position and pressure reduction drying is performed in all, the raising / lowering pin 21 is moved from the 1st drying position to the 2nd drying position. You may make it perform drying, moving continuously to. Then, the exhaust speed can be changed more continuously.

この発明の第１実施形態に係る減圧乾燥装置の概要図である。1 is a schematic diagram of a vacuum drying apparatus according to a first embodiment of the present invention. この発明の第１実施形態に係る減圧乾燥装置の概要図である。1 is a schematic diagram of a vacuum drying apparatus according to a first embodiment of the present invention. この発明の第１実施形態に係る減圧乾燥装置の概要図である。1 is a schematic diagram of a vacuum drying apparatus according to a first embodiment of the present invention. 排気口３１におけるチャンバ１０側の開口部付近の拡大図である。4 is an enlarged view of the vicinity of an opening on the chamber 10 side in an exhaust port 31. FIG. 乾燥動作を示すフローチャートである。It is a flowchart which shows drying operation. 乾燥動作を示すフローチャートである。It is a flowchart which shows drying operation. 減圧乾燥動作時のチャンバ１０内の真空度の変化を示す説明図である。It is explanatory drawing which shows the change of the vacuum degree in the chamber 10 at the time of pressure reduction drying operation. 第２実施形態に係る真空減圧装置における排気口３１のチャンバ１０側の開口部付近の拡大図である。It is an enlarged view near the opening part by the side of the chamber 10 of the exhaust port 31 in the vacuum decompression device concerning 2nd Embodiment. 第２実施形態に係る真空減圧装置における排気口３１のチャンバ１０側の開口部付近の拡大図である。It is an enlarged view near the opening part by the side of the chamber 10 of the exhaust port 31 in the vacuum decompression device concerning 2nd Embodiment.

符号の説明Explanation of symbols

１０ チャンバ
１１ 蓋部
１２ パッキング
１３ 基部
１４ 上面
１５ 支持ピン
１５ 凹部
２１ 昇降ピン
２２ 支持板
３１ 排気口
３２ 管路
３３ 開閉弁
３４ 真空ポンプ
３５ 開口部
３６ 凸部
３７ 遮蔽部
３８ 連結部材
４１ 板状部材
４３ エアシリンダ
Ｗ 基板
DESCRIPTION OF SYMBOLS 10 Chamber 11 Cover part 12 Packing 13 Base 14 Upper surface 15 Support pin 15 Recess 21 Lifting pin 22 Support plate 31 Exhaust port 32 Pipe line 33 On-off valve 34 Vacuum pump 35 Opening part 36 Projection part 37 Shielding part 38 Connecting member 41 Plate-like member 43 Air cylinder W Substrate

Claims (4)

基板の主面に形成された薄膜を減圧乾燥する減圧乾燥装置において、
基板の周囲を覆うチャンバと、
基板を支持する支持部材と、
前記支持部材を昇降させる昇降手段と、
前記チャンバに形成された排気口と、
前記排気口を介して排気を行う排気手段と、
前記支持部材と連結され、前記排気口における前記チャンバ側の開口部と対向する位置において当該支持部材とともに昇降移動することにより、前記排気口との距離を変更することで当該排気口からの排気量を変更する遮蔽部材と、
を備えたことを特徴とする減圧乾燥装置。 In a vacuum drying apparatus for vacuum drying a thin film formed on a main surface of a substrate,
A chamber covering the periphery of the substrate;
A support member for supporting the substrate;
Elevating means for elevating the support member;
An exhaust port formed in the chamber;
An exhaust means for exhausting air through the exhaust port;
The exhaust amount from the exhaust port is changed by changing the distance from the exhaust port by moving up and down together with the support member at a position that is connected to the support member and faces the opening on the chamber side in the exhaust port. A shielding member for changing
A reduced-pressure drying apparatus comprising: 請求項１に記載の減圧乾燥装置において、
前記支持部材は各々基板の下面に当接する複数の昇降ピンであり、前記遮蔽部材は前記複数の昇降ピンを連結する支持板である減圧乾燥装置。 The vacuum drying apparatus according to claim 1,
The reduced pressure drying apparatus, wherein the support members are a plurality of elevating pins each abutting on the lower surface of the substrate, and the shielding member is a support plate connecting the plurality of elevating pins. 請求項２に記載の減圧乾燥装置において、
前記排気口は、前記チャンバの底面における平面視において前記支持板と重複する位置に形成される減圧乾燥装置。 The reduced-pressure drying apparatus according to claim 2,
The exhaust port is a vacuum drying apparatus formed at a position overlapping the support plate in a plan view on the bottom surface of the chamber. 請求項３に記載の減圧乾燥装置において、
前記チャンバ内には、基板の減圧処理時に基板を支持する複数の支持ピンが立設されており、
前記昇降ピンは前記支持ピンとの間で基板の受け渡しを実行する減圧乾燥装置。
The reduced-pressure drying apparatus according to claim 3,
In the chamber, a plurality of support pins are provided to support the substrate at the time of decompression processing of the substrate,
The elevating pin is a reduced-pressure drying apparatus that transfers a substrate to and from the support pin.
JP2004297078A 2004-10-12 2004-10-12 Vacuum drying apparatus and vacuum drying method Expired - Fee Related JP4408786B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096711A (en) * 2009-10-27 2011-05-12 Tokyo Electron Ltd Reduced pressure drying apparatus
CN102313442A (en) * 2010-07-06 2012-01-11 赵宽 Lithium ion battery pole piece coil vacuum drying oven

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011096711A (en) * 2009-10-27 2011-05-12 Tokyo Electron Ltd Reduced pressure drying apparatus
CN102313442A (en) * 2010-07-06 2012-01-11 赵宽 Lithium ion battery pole piece coil vacuum drying oven

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