JP2006108177A - Light emitting diode device and manufacturing method therefor - Google Patents

Light emitting diode device and manufacturing method therefor Download PDF

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JP2006108177A
JP2006108177A JP2004289229A JP2004289229A JP2006108177A JP 2006108177 A JP2006108177 A JP 2006108177A JP 2004289229 A JP2004289229 A JP 2004289229A JP 2004289229 A JP2004289229 A JP 2004289229A JP 2006108177 A JP2006108177 A JP 2006108177A
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emitting diode
light emitting
metal substrate
metal
light
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Iwatomo Moriyama
厳與 森山
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Toshiba Lighting and Technology Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode device capable of efficiently transmitting the heat of a light emitting device to a substrate, enhancing heat-dissipating properties, and reducing the thermal effect that the substrate has on other components or the like during mounting of the light emitting diode on the substrate. <P>SOLUTION: The light emitting diode device comprises a metal substrate 22 that has a circuit pattern and has heat resistance for resisting the melting point of a eutectic metal or over; a light emitting diode 21 that has an electrode comprising a eutectic metal 38 and is mounted on the metal substrate by heating or ultra sonic wave, such that it has a temperature which is the same as or below the heat-resistance temperature of the metal substrate and is the same as or over the melting point of the eutectic metal; a thermoplastic resin 28 that has a reflection plane optically opposing the light emitting diode and is deposited on the metal substrate; a wire 27 for electrically connecting the light emitting diode and the circuit pattern; and thermosetting resin 32 containing a fluorescent material that is provided to cover the light emitting diode and cures at a lower temperature than the thermoplastic resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光ダイオードを光源とする発光ダイオード装置およびその製造方法に関する。   The present invention relates to a light emitting diode device using a light emitting diode as a light source and a method for manufacturing the same.

従来、発光素子として例えば固体発光素子である発光ダイオードを光源とする発光装置では、金属基板上に発光ダイオードを直接実装し、発光ダイオードが挿入される挿入孔が形成されたプリント配線基板を接着剤によって金属基板上に固定するとともにこのプリント配線基板と発光ダイオードとをワイヤボンディングによって接続し、発光ダイオードやワイヤボンディングを被覆して透明樹脂部を設けている。   Conventionally, in a light emitting device using a light emitting diode as a light source as a light emitting element, for example, a light emitting diode is directly mounted on a metal substrate, and a printed wiring board in which an insertion hole for inserting the light emitting diode is formed is used as an adhesive. The printed wiring board and the light emitting diode are connected by wire bonding, and the transparent resin portion is provided so as to cover the light emitting diode and the wire bonding.

この種の発光装置では、発光ダイオードの温度上昇によって発光効率の低下、寿命の低下、透明樹脂部の劣化などの熱影響が生じるが、発光ダイオードを基板に直接実装することにより、発光ダイオードから基板への熱伝達効率を高め、放熱性の向上を図っている（例えば、特許文献１参照。）。
特開２００３−１５２２２５号公報（第４頁、図１） In this type of light-emitting device, the temperature of the light-emitting diode causes a thermal effect such as a decrease in light-emitting efficiency, a decrease in service life, and deterioration of the transparent resin part. The heat transfer efficiency is improved to improve heat dissipation (see, for example, Patent Document 1).
JP 2003-152225 A (Page 4, FIG. 1)

しかしながら、発光ダイオードを基板に直接実装することで、使用時では、発光ダイオードから基板への熱伝達効率を高め、放熱性を向上させようとしているが、製造時では、発光ダイオードと基板とを加熱して接合する場合には基板から熱が逃げやすく十分な固着を得られないことがある。   However, by mounting the light emitting diode directly on the substrate, the heat transfer efficiency from the light emitting diode to the substrate is improved and the heat dissipation is improved in use. However, at the time of manufacture, the light emitting diode and the substrate are heated. When joining together, heat may easily escape from the substrate, and sufficient fixation may not be obtained.

発光ダイオードと基板とを銀ペーストにより接合する場合には、製造時、比較的低温で固着することができるが、使用時には、発光ダイオードからの放熱性を向上させることができにくくなる。   When the light emitting diode and the substrate are bonded with a silver paste, the light emitting diode can be fixed at a relatively low temperature during manufacture, but it is difficult to improve heat dissipation from the light emitting diode during use.

そこで、発光ダイオードから基板への熱伝達効率を高めるには発光ダイオードを熱伝達性のよい共晶金属などによって実装することが好ましいが、このような共晶金属は融点が高いため、発光ダイオードを共晶金属によって基板に実装する際に、基板上の樹脂部品や接着剤などが溶ける熱影響が生じる問題がある。   Therefore, in order to increase the heat transfer efficiency from the light emitting diode to the substrate, it is preferable to mount the light emitting diode with a eutectic metal having a good heat transfer property, but such a eutectic metal has a high melting point. When mounting on a substrate with a eutectic metal, there is a problem that a heat effect is caused by melting a resin component or an adhesive on the substrate.

本発明は、発光ダイオードの熱を基板に効率よく伝達し、放熱性を向上でき、また、発光ダイオードの基板への実装時における基板上の他の部品などへの熱影響も低減できる発光ダイオード装置を提供することを目的とする。   The present invention can efficiently transfer heat of a light emitting diode to a substrate, improve heat dissipation, and reduce the influence of heat on other components on the substrate when the light emitting diode is mounted on the substrate. The purpose is to provide.

請求項１の発明は、回路パターンを有し、共晶金属の融点以上の耐熱温度を有する金属製基板と；共晶金属からなる電極を有し、前記金属製基板の耐熱温度以下であって共晶金属の融点以上となるように加熱または超音波により前記金属製基板に実装される発光ダイオードと；発光ダイオードに光学的に対向する反射面を有し、金属製基板上に溶着された熱可塑性樹脂と；発光ダイオードと前記回路パターンとを電気的に接続するワイヤと；発光ダイオードを覆うように設けられ、熱可塑性樹脂よりも低温で硬化する蛍光体含有熱硬化性樹脂と；を具備していることを特徴とする。   The invention according to claim 1 is a metal substrate having a circuit pattern and having a heat resistance temperature equal to or higher than the melting point of the eutectic metal; an electrode made of a eutectic metal; A light-emitting diode mounted on the metal substrate by heating or ultrasonic waves so as to be equal to or higher than the melting point of the eutectic metal; and heat deposited on the metal substrate, having a reflective surface optically opposed to the light-emitting diode A wire that electrically connects the light emitting diode and the circuit pattern; and a phosphor-containing thermosetting resin that is provided so as to cover the light emitting diode and cures at a temperature lower than that of the thermoplastic resin. It is characterized by.

共晶金属の融点以上の耐熱温度を有する金属製基板とは、例えば、発光ダイオードの電極が金錫の共晶金属である場合には、２８０℃以上の耐熱温度を有する金属製基板のことをいう。   A metal substrate having a heat resistant temperature equal to or higher than the melting point of the eutectic metal is, for example, a metal substrate having a heat resistant temperature of 280 ° C. or higher when the electrode of the light emitting diode is a eutectic metal of gold tin. Say.

金属製基板は、複数の材料を層状に構成してもよく、また、アルミニウム等の熱伝導性の良好なものが望ましい。発光ダイオードからの熱を伝導して放熱することができるからである。発光ダイオードは、熱の影響により発光効率の低下、色温度の変化が見られるため、放熱性を良くすると、この問題を低減することができる。回路パターンは、例えば銅箔のパターンが一般的である。   The metal substrate may be formed by laminating a plurality of materials, and preferably has a good thermal conductivity such as aluminum. This is because the heat from the light emitting diode can be conducted and released. Since the light emitting diode has a decrease in light emission efficiency and a change in color temperature due to the influence of heat, this problem can be reduced if heat dissipation is improved. The circuit pattern is typically a copper foil pattern, for example.

熱可塑性樹脂は、高分子量の有機化合物で、加熱によって軟化し可塑性を持つようになる高分子物質で、通称プラスチックスの大部分を占める。代表的なものに、エチレン・酢酸ビニル共重合体、エチレン・エチルアクリレート共重合体、ポリエチレン、ポリプロプレンなどがある。したがって、熱可塑性樹脂は、発光ダイオードに光学的に対向する反射面を形成する金型に流されて金属製基板上に溶着される。発光ダイオードに光学的に対向する反射面を複数個同時に成形するのに好適な樹脂である。   A thermoplastic resin is a high molecular weight organic compound, and is a polymer substance that becomes soft and plastic when heated and occupies most of the so-called plastics. Typical examples include ethylene / vinyl acetate copolymer, ethylene / ethyl acrylate copolymer, polyethylene, and polypropylene. Accordingly, the thermoplastic resin is flowed through a mold that forms a reflective surface that is optically opposed to the light emitting diode, and is welded onto the metal substrate. This resin is suitable for simultaneously molding a plurality of reflecting surfaces optically opposed to the light emitting diodes.

熱硬化性樹脂は、熱または触媒などで化学反応が起こり、硬い三次元網状構造を持った高分子となるもの。硬化物は熱を加えても軟化することはなく、より高温に加熱すれば分解する。蛍光体含有熱硬化性樹脂は、熱可塑性樹脂よりも低温で硬化するため、熱可塑性樹脂で形成された反射面形状等が変形することがない。   A thermosetting resin is a polymer that undergoes a chemical reaction with heat or a catalyst and becomes a polymer with a hard three-dimensional network structure. The cured product does not soften even when heat is applied, and decomposes when heated to a higher temperature. Since the phosphor-containing thermosetting resin is cured at a lower temperature than the thermoplastic resin, the shape of the reflecting surface formed of the thermoplastic resin is not deformed.

請求項２の発明は、請求項１記載の発光ダイオード装置において、共晶金属は金錫であることを特徴とする。   According to a second aspect of the present invention, in the light-emitting diode device according to the first aspect, the eutectic metal is gold tin.

請求項３の発明は、共晶金属からなる電極を有する発光ダイオードを回路パターンを有する耐熱温度２８０℃以上の金属製基板に、前記金属製基板の耐熱温度以下であって共晶金属の融点以上となるように加熱または超音波により固着する工程と；熱可塑性樹脂により発光ダイオードに光学的に対向する反射面を形成するとともに金属製基板上に溶着する工程と；発光ダイオードと前記金属製基板の回路パターンとを電気的にワイヤボンディングする工程と；蛍光体を含有する熱硬化性樹脂を前記発光ダイオードを覆うように充填する工程と；を具備していることを特徴とする。   According to a third aspect of the present invention, a light emitting diode having an electrode made of a eutectic metal is applied to a metal substrate having a circuit pattern and having a heat resistance temperature of 280 ° C. or higher, which is not higher than the heat resistance temperature of the metal substrate and higher than the melting point of the eutectic metal. A step of fixing by heating or ultrasonic waves so as to be; a step of forming a reflective surface optically opposed to the light emitting diode by a thermoplastic resin and welding the light emitting diode on a metal substrate; and a step of forming the light emitting diode and the metal substrate And a step of electrically wire bonding the circuit pattern; and a step of filling a thermosetting resin containing a phosphor so as to cover the light emitting diode.

加熱は、金属製基板からの放熱も考慮し十分に行なう必要があるが、特に超音波の場合には、発光ダイオード部分をスポット的に溶かして溶着させることができ、金属製基板からの放熱はあまり問題とならない。   Heating needs to be performed sufficiently in consideration of heat radiation from the metal substrate, but especially in the case of ultrasonic waves, the light emitting diode portion can be spot-melted and welded, and heat radiation from the metal substrate is not possible. It doesn't matter much.

請求項１記載の発光ダイオード装置によれば、金属製基板および共晶金属により発光ダイオードの熱を金属製基板に効率よく伝達し、放熱性を向上できるため、樹脂の剥がれ、反りを抑制することができ、光学特性を維持できる。また、発光ダイオードの金属製基板への実装時における金属製基板上の他の部品などへの熱影響も低減できる。   According to the light-emitting diode device according to claim 1, since heat of the light-emitting diode can be efficiently transmitted to the metal substrate by the metal substrate and the eutectic metal and the heat dissipation can be improved, the resin is prevented from peeling and warping. And the optical characteristics can be maintained. Further, it is possible to reduce the thermal influence on other components on the metal substrate when the light emitting diode is mounted on the metal substrate.

請求項２記載の発光ダイオード装置によれば、金錫は好適な材料であり、請求項１記載の効果を有する。   According to the light emitting diode device of claim 2, gold tin is a suitable material and has the effect of claim 1.

請求項３記載の発光ダイオード装置によれば、発光ダイオードを回路パターンを有する耐熱温度２８０℃以上の金属製基板に、前記金属製基板の耐熱温度以下であって共晶金属の融点以上となるように加熱または超音波により固着し、熱可塑性樹脂により発光ダイオードに光学的に対向する反射面を形成するとともに金属製基板上に溶着し、熱硬化性樹脂を前記発光ダイオードを覆うように充填するように製造しているので、発光ダイオードの金属製基板への実装時における金属製基板上の他の部品などへの熱影響を低減できる。   According to the light-emitting diode device according to claim 3, the light-emitting diode is placed on a metal substrate having a circuit pattern and having a heat resistance temperature of 280 ° C. or higher so as to be lower than the heat resistance temperature of the metal substrate and higher than the melting point of the eutectic metal. It is fixed by heating or ultrasonic waves, a reflective surface optically opposed to the light emitting diode is formed by a thermoplastic resin and welded onto a metal substrate, and a thermosetting resin is filled so as to cover the light emitting diode. Therefore, it is possible to reduce the influence of heat on other components on the metal substrate when the light emitting diode is mounted on the metal substrate.

以下、本発明の一実施の形態を図１ないし図４の図面を参照して説明する。図１は本発明の一実施の形態を示す照明装置の正面図、図２は同じく要部正面図、図３は同じく要部断面図、図４は同じく拡大要部断面である。   An embodiment of the present invention will be described below with reference to the drawings of FIGS. FIG. 1 is a front view of a lighting device showing an embodiment of the present invention, FIG. 2 is a front view of the main part, FIG. 3 is a cross-sectional view of the main part, and FIG.

図において、照明装置11は、四角形で薄形に形成された器具本体12を有し、この器具本体12の表面に四角形の開口部13が形成され、この開口部13内に四角形の複数の発光モジュール14がマトリクス状に配列され、これら複数の発光   In the figure, a lighting device 11 has a rectangular and thin instrument body 12, a square opening 13 is formed on the surface of the instrument body 12, and a plurality of square light emitting elements are formed in the opening 13. Modules 14 are arranged in a matrix, and these multiple

モジュール14によって発光面15が形成されている。 A light emitting surface 15 is formed by the module 14.

発光ダイオード装置としての発光モジュール14は、共晶金属38の融点以上の耐熱性を有する金属製基板22と、発光ダイオード21と、発光ダイオードに光学的に対向する反射面を有し、金属製基板22上に溶着された熱可塑性樹脂としての反射板28と、発光ダイオード21と前記回路パターン25とを電気的に接続するワイヤ27と、発光ダイオードを覆うように設けられ、熱可塑性樹脂28よりも低温で硬化する蛍光体含有熱硬化性樹脂32とを具備している。   The light emitting module 14 as a light emitting diode device has a metal substrate 22 having a heat resistance equal to or higher than the melting point of the eutectic metal 38, a light emitting diode 21, and a reflective surface optically opposed to the light emitting diode. 22 is provided so as to cover the light-emitting diode, the reflecting plate 28 as a thermoplastic resin welded on the wire 22, the wire 27 that electrically connects the light-emitting diode 21 and the circuit pattern 25, and more than the thermoplastic resin 28 And a phosphor-containing thermosetting resin 32 that cures at a low temperature.

各発光モジュール14は、発光ダイオード21を有しており、これら複数の発光ダイオード21が、例えば、アルミニウムまたは窒化アルミニウムなどの高熱伝導性を有する材料で形成された金属製基板22の一面である表面の実装面にマトリクス状に実装されている。すなわち、発光ダイオード21は、共晶金属38からなる電極38を有し、金属製基板22の耐熱温度以下であって共晶金属38の融点以上となるように加熱または超音波により金属製基板22に実装される。   Each light emitting module 14 includes a light emitting diode 21, and the plurality of light emitting diodes 21 is a surface that is one surface of a metal substrate 22 formed of a material having high thermal conductivity such as aluminum or aluminum nitride. Are mounted in a matrix on the mounting surface. That is, the light-emitting diode 21 has an electrode 38 made of a eutectic metal 38, and is heated or ultrasonically so as to be equal to or lower than the heat resistance temperature of the metal substrate 22 and equal to or higher than the melting point of the eutectic metal 38. To be implemented.

金属製基板22の実装面には、弾性率がエポキシ樹脂より低くエンジニアリングプラスチックより高いとともに絶縁性および熱伝導性を有する熱硬化性樹脂または熱可塑性樹脂である絶縁層23を介して、例えば銅、金およびニッケル等によって回路パターン25が形成され、この回路パターン25上に発光ダイオード21マトリクス状に実装している。各実装位置においては、発光ダイオード21の一方の電極38が回路パターン25の一方の極パターンに共晶金属38によって接続され、他方の電極が回路パターン25の他方の極パターンにワイヤボンディングによるワイヤ27によって接続されている。   The mounting surface of the metal substrate 22 has an elastic modulus lower than that of an epoxy resin and higher than that of an engineering plastic, and an insulating layer 23 made of a thermosetting resin or a thermoplastic resin having insulating properties and thermal conductivity, for example, copper, A circuit pattern 25 is formed of gold, nickel, or the like, and is mounted on the circuit pattern 25 in a matrix of light emitting diodes 21. At each mounting position, one electrode 38 of the light emitting diode 21 is connected to one pole pattern of the circuit pattern 25 by a eutectic metal 38, and the other electrode is connected to the other pole pattern of the circuit pattern 25 by wire bonding 27. Connected by.

金属製基板22の実装面側には、例えばガラスエポキシ樹脂、アクリル樹脂などの材料で形成された反射板28が配置されている。また、金属製基板22に等間隔に形成された複数の発光ダイオード配設部21aおよび隣り合う発光ダイオード配設部21aの中央部分に形成された貫通孔21bを有している。   On the mounting surface side of the metal substrate 22, a reflector 28 made of a material such as glass epoxy resin or acrylic resin is disposed. In addition, a plurality of light emitting diode placement portions 21a formed at equal intervals on the metal substrate 22 and a through hole 21b formed in the central portion of the adjacent light emitting diode placement portions 21a are provided.

反射板28は、発光ダイオード21からの光を反射する反射部28aおよび前記貫通孔21bに貫通して配設される支持部28bを有してなる。貫通孔21bは、隣り合う発光ダイオード配設部21aの中央部分に形成され、反射板28は、この貫通孔21bに貫通して配設される支持部28bにより支持されるため、放熱性を向上させることができるとともに、反射板28の剥がれ、反りを抑制することができるため、光学特性を維持できる。   The reflection plate 28 includes a reflection portion 28a that reflects light from the light emitting diode 21 and a support portion 28b that is disposed to penetrate the through hole 21b. The through hole 21b is formed at the center of the adjacent light emitting diode arrangement part 21a, and the reflecting plate 28 is supported by the support part 28b arranged to penetrate the through hole 21b, thereby improving heat dissipation. In addition, the reflection plate 28 can be prevented from peeling off and warping, so that the optical characteristics can be maintained.

また、反射板28には、各実装位置対応して各発光ダイオード21がそれぞれ収容配置される複数の収容部29が開口形成されている。各収容部29は、金属製基板22側に対して反対のレンズ33側つまり表面側の開口が、金属製基板22側つまり裏面側の開口より大きく、金属製基板22側からレンズ33側つまり裏面側から表面側へ向けて拡開されており、収容部29内に臨んで傾斜した反射面が形成されている。反射面には、例えば白色の酸化チタン、銅、ニッケル、アルミニウムなどの光反射率の高い反射膜が形成されている。   Further, the reflecting plate 28 is formed with a plurality of accommodating portions 29 in which the respective light emitting diodes 21 are accommodated and arranged corresponding to the respective mounting positions. Each housing 29 has an opening on the opposite side of the lens 33, that is, on the front surface side relative to the metal substrate 22 side, which is larger than an opening on the metal substrate 22 side, that is, the back surface side. A reflective surface that is widened from the side toward the surface side and that is inclined toward the inside of the accommodating portion 29 is formed. A reflective film having a high light reflectivity, such as white titanium oxide, copper, nickel, and aluminum, is formed on the reflective surface.

収容部29には、発光ダイオード21を被覆するように蛍光体含有熱硬化性樹脂としての可視光変換樹脂層32が充填形成されている。この可視光変換樹脂層32は、発光ダイオード21からの紫外線を可視光に変換する蛍光体などの可視光変換物質を例えばシリコーン樹脂、エポキシ樹脂および変性エポキシ樹脂などに分散されて形成されている。   The housing portion 29 is filled with a visible light conversion resin layer 32 as a phosphor-containing thermosetting resin so as to cover the light emitting diode 21. The visible light conversion resin layer 32 is formed by dispersing a visible light conversion substance such as a phosphor that converts ultraviolet light from the light emitting diode 21 into visible light, for example, in a silicone resin, an epoxy resin, a modified epoxy resin, or the like.

反射板28の表面側には、接着剤23を介して、例えばポリカーボネートおよびアクリル樹脂などの透光性樹脂で形成されたレンズ33が配置されている。   On the surface side of the reflecting plate 28, a lens 33 formed of a translucent resin such as polycarbonate and acrylic resin is disposed with an adhesive 23 interposed therebetween.

レンズ33は、各発光ダイオード21に対応してレンズ形状に形成されたレンズ部を有する。   The lens 33 has a lens portion formed in a lens shape corresponding to each light emitting diode 21.

そして、発光ダイオード21を点灯させることにより、発光ダイオード21の光が可視光変換樹脂層32に入射し、この可視光変換樹脂層32に入射した光が収容部29からレンズ33に入射して発光面15から出射する。   Then, by turning on the light emitting diode 21, the light of the light emitting diode 21 enters the visible light conversion resin layer 32, and the light incident on the visible light conversion resin layer 32 enters the lens 33 from the housing portion 29 and emits light. The light exits from the surface 15.

この発光ダイオード21の点灯時、発光ダイオード21の発熱が金属製基板22、反射板28、レンズ33などに伝わるが、これら金属製基板22、反射板28、レンズ33の材料の違いによって熱膨脹差が生じる。しかしながら、貫通孔21bに貫通して配設される支持部28bにより支持されるため、放熱性を向上させることができるとともに、反射板28の剥がれ、反りを抑制することができるため、光学特性を維持できるものである。   When the light-emitting diode 21 is turned on, the heat generated by the light-emitting diode 21 is transmitted to the metal substrate 22, the reflector 28, the lens 33, etc., but the thermal expansion difference is caused by the difference in the material of the metal substrate 22, the reflector 28, and the lens 33. Arise. However, since it is supported by the support portion 28b disposed through the through-hole 21b, it is possible to improve heat dissipation and to prevent the reflection plate 28 from peeling off and warping. It can be maintained.

なお、前記実施の形態において、照明装置11は、複数の発光モジュール14をマトリクス状に配列して構成したが、これら発光モジュール14を一体に形成した１つの発光モジュールで構成してもよい。   In the above embodiment, the lighting device 11 is configured by arranging a plurality of light emitting modules 14 in a matrix, but may be configured by one light emitting module in which these light emitting modules 14 are integrally formed.

また、発光ダイオード装置製造方法は、共晶金属38からなる電極を有する発光ダイオード21を耐熱温度２８０℃以上の金属製基板22に、前記金属製基板22の耐熱温度以下であって共晶金属38の融点以上となるように加熱または超音波により固着する工程と、熱可塑性樹脂28により発光ダイオード21に光学的に対向する反射面28aを形成するとともに金属製基板22上に溶着する工程と、発光ダイオード21と前記金属製基板22の回路パターン25とを電気的にワイヤボンディングする工程と、蛍光体を含有する熱硬化性樹脂32を前記発光ダイオード21を覆うように充填する工程とを具備している。   Further, in the method of manufacturing a light emitting diode device, a light emitting diode 21 having an electrode made of a eutectic metal 38 is placed on a metal substrate 22 having a heat resistant temperature of 280 ° C. or higher, and the eutectic metal 38 has a temperature lower than the heat resistant temperature of the metal substrate 22. A step of fixing by heating or ultrasonic waves so as to be equal to or higher than the melting point, a step of forming a reflective surface 28a optically opposed to the light-emitting diode 21 by the thermoplastic resin 28 and welding it on the metal substrate 22, and light emission A step of electrically wire-bonding the diode 21 and the circuit pattern 25 of the metal substrate 22, and a step of filling the light-emitting diode 21 with a thermosetting resin 32 containing a phosphor. Yes.

この製造方法により、発光ダイオード21の金属製基板22への実装時における金属製基板上の他の部品などへの熱影響も低減できる。   This manufacturing method can also reduce the thermal influence on other components on the metal substrate when the light emitting diode 21 is mounted on the metal substrate 22.

本発明の一実施の形態を示す照明装置の正面図。The front view of the illuminating device which shows one embodiment of this invention. 同じく要部正面図。Similarly the principal part front view. 同じく要部断面図。Similarly principal part sectional drawing. 同じく拡大要部断面図。Similarly expanded principal part sectional drawing.

符号の説明Explanation of symbols

11照明装置、21発光ダイオード、22金属製基板、23絶縁層、28反射板、29収容部、32可視光変換樹脂層、33レンズ。   11 lighting devices, 21 light emitting diodes, 22 metal substrates, 23 insulating layers, 28 reflectors, 29 housing parts, 32 visible light conversion resin layers, 33 lenses.

Claims (3)

回路パターンを有し、共晶金属の融点以上の耐熱温度を有する金属製基板と；
共晶金属からなる電極を有し、前記金属製基板の耐熱温度以下であって共晶金属の融点以上となるように加熱または超音波により前記金属製基板に実装される発光ダイオードと；
発光ダイオードに光学的に対向する反射面を有し、金属製基板上に溶着された熱可塑性樹脂と；
発光ダイオードと前記回路パターンとを電気的に接続するワイヤと；
発光ダイオードを覆うように設けられ、熱可塑性樹脂よりも低温で硬化する蛍光体含有熱硬化性樹脂と；
を具備していることを特徴とする発光ダイオード装置。 A metal substrate having a circuit pattern and having a heat resistance temperature equal to or higher than the melting point of the eutectic metal;
A light-emitting diode that has an electrode made of a eutectic metal and is mounted on the metal substrate by heating or ultrasonic waves so as to be equal to or lower than the heat resistant temperature of the metal substrate and equal to or higher than the melting point of the eutectic metal;
A thermoplastic resin having a reflective surface optically opposed to the light emitting diode and welded onto a metal substrate;
A wire for electrically connecting the light emitting diode and the circuit pattern;
A phosphor-containing thermosetting resin that is provided so as to cover the light emitting diode and cures at a lower temperature than the thermoplastic resin;
A light-emitting diode device comprising: 共晶金属は金錫であることを特徴とする請求項１記載の発光ダイオード装置。   2. The light emitting diode device according to claim 1, wherein the eutectic metal is gold tin. 共晶金属からなる電極を有する発光ダイオードを回路パターンを有する耐熱温度２８０℃以上の金属製基板に、前記金属製基板の耐熱温度以下であって共晶金属の融点以上となるように加熱または超音波により固着する工程と；
熱可塑性樹脂により発光ダイオードに光学的に対向する反射面を形成するとともに金属製基板上に溶着する工程と；
発光ダイオードと前記金属製基板の回路パターンとを電気的にワイヤボンディングする工程と；
蛍光体を含有する熱硬化性樹脂を前記発光ダイオードを覆うように充填する工程と；
を具備していることを特徴とする発光ダイオード装置製造方法。 A light emitting diode having an electrode made of a eutectic metal is heated or superposed on a metal substrate having a circuit pattern having a heat resistance temperature of 280 ° C. or higher so as to be lower than the heat resistance temperature of the metal substrate and higher than the melting point of the eutectic metal. Fixing by sound waves;
Forming a reflective surface optically opposed to the light emitting diode with a thermoplastic resin and welding it onto a metal substrate;
Electrically wire bonding the light emitting diode and the circuit pattern of the metal substrate;
Filling a thermosetting resin containing a phosphor so as to cover the light emitting diode;
A method for manufacturing a light-emitting diode device, comprising:
JP2004289229A 2004-09-30 2004-09-30 Light emitting diode device and manufacturing method therefor Pending JP2006108177A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228369A (en) * 2010-04-16 2011-11-10 Nichia Chem Ind Ltd Light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011228369A (en) * 2010-04-16 2011-11-10 Nichia Chem Ind Ltd Light emitting device

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