JP2007073718A - Package for housing light emitting element - Google Patents

Package for housing light emitting element Download PDF

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Publication number
JP2007073718A
JP2007073718A JP2005258608A JP2005258608A JP2007073718A JP 2007073718 A JP2007073718 A JP 2007073718A JP 2005258608 A JP2005258608 A JP 2005258608A JP 2005258608 A JP2005258608 A JP 2005258608A JP 2007073718 A JP2007073718 A JP 2007073718A
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Prior art keywords
emitting element
light emitting
storage package
metal body
wire bond
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JP2005258608A
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Japanese (ja)
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Yoichi Matsuda
陽一 松田
Takeshi Kumoi
威 雲井
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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Priority to JP2005258608A priority Critical patent/JP2007073718A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a low cost package for housing a light emitting element excellent in a heat dissipating properties from the light emitting element and capable of improving a light emitting efficiency of the light emitting element. <P>SOLUTION: The package 10 for housing the light emitting element has a wire bonding pad 14 for being in electrical continuity through the light emitting element 12 and a bonding wire 13 on an insulating base substance 11, and a metal body 18 with the insulating base 11 bonded that has an external connection terminal pad 15 for connecting the pad 14 through the conductor wiring on its lower surface; and a mounting part 17 for mounting the light emitting element 12 on its upper surface. The package 10 further has a through-hole 19 for exposing the pad 14 from the opening at the bonded part between the metal body 18 and the insulating base 11, the wire bonding pad 14 is provided so as to be isolated from the peripheral border of the through-hole 19, and the metal body 18 has an inclined wall surface 20 with its opening wider as upward so that the metal body 18 surrounds the light emitting element 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光ダイオード（Ｌｉｇｈｔ Ｅｍｉｓｓｉｏｎ Ｄｉｏｄｅ：以下、ＬＥＤという。）等の発光素子を実装し収納するための発光素子収納用パッケージに関し、より詳細には、発光素子からの発熱を速やかに放熱できると共に、発光素子からの発光の発光効率を向上できる発光素子収納用パッケージに関する。   The present invention relates to a light-emitting element storage package for mounting and storing a light-emitting element such as a light-emitting diode (hereinafter referred to as LED), and more specifically, can quickly dissipate heat generated from the light-emitting element. In addition, the present invention relates to a light emitting element storage package that can improve the light emission efficiency of light emitted from the light emitting element.

従来からＬＥＤ等の発光素子を収容するための発光素子収納用パッケージには、絶縁性を有し、発光素子からの発熱に耐えることができる耐熱性の高い樹脂製や、セラミック製の発光素子収納用パッケージが用いられている。また、この発光素子収納用パッケージには、一般照明や大画面液晶用バックライト、自動車用ランプ等に代表されるような高い光出力を発する用途の発光素子を搭載する場合に、発光素子からの発熱を速やかに取り除かなければ、発光素子の温度が上昇して発光効率が低下して高い光出力が得られないという問題を有している。更に、発光素子収納用パッケージには、発光素子からの発光をより効率的に反射させて、発光効率を向上させることが求められている。   Conventionally, a light emitting element storage package for storing a light emitting element such as an LED has an insulating property and is made of a highly heat-resistant resin or ceramic light emitting element that can withstand heat generated from the light emitting element. Package is used. In addition, in this light emitting element storage package, when mounting a light emitting element for use that emits a high light output as typified by general lighting, a backlight for a large screen liquid crystal, an automobile lamp, etc., If the heat generation is not quickly removed, the temperature of the light emitting element rises, resulting in a problem that the light emission efficiency is lowered and a high light output cannot be obtained. Further, the light emitting element storage package is required to reflect light emitted from the light emitting element more efficiently and improve the light emission efficiency.

図４（Ａ）に示すように、従来の樹脂製の発光素子収納用パッケージ５０は、通常、複数枚の樹脂基板を接合して形成した樹脂基体５１からなっている。この樹脂基体５１に形成された発光素子搭載部には、発光素子５２が搭載された後、ボンディングワイヤ５３等で発光素子５２とワイヤボンドパッド５４を接続して樹脂基体５１の外部接続端子パッド５５と電気的に導通状態としている。そして、発光素子５２は、例えば、透光性のある封止樹脂５６で気密に封止されるようになっている。   As shown in FIG. 4A, a conventional resin light emitting element storage package 50 is usually composed of a resin base 51 formed by joining a plurality of resin substrates. After the light emitting element 52 is mounted on the light emitting element mounting portion formed on the resin base 51, the light emitting element 52 and the wire bond pad 54 are connected by a bonding wire 53 or the like to connect the external connection terminal pad 55 of the resin base 51. And electrically connected. The light emitting element 52 is hermetically sealed with, for example, a translucent sealing resin 56.

また、図４（Ｂ）に示すように、従来のセラミック製の発光素子収納用パッケージ５０ａは、通常、発光素子５２を収納させるための壁面がテーパー状や、垂直からなるキャビティ部５７を、キャビティ部５７の外形の大きさの孔を穿孔したセラミック枠体５８となるセラミックグリーンシートと、孔を設けないセラミック基体５９となるセラミックグリーンシートを重ね合わせ積層している。また、積層する前のセラミックグリーンシートには、例えば、ワイヤボンドパッド５４や、外部接続端子パッド５５や、それぞれのパターン間を接続させるため等の配線パターンや、ビア等の導体パターンを金属導体ペーストを用いてスクリーン印刷で形成している。そして、複数枚のセラミックグリーンシートを積層した後は、セラミックグリーンシートと導体パターンを同時焼成して発光素子収納用パッケージ５０ａを形成している。この発光素子収納用パッケージ５０ａに形成された発光素子搭載部には、発光素子５２が搭載された後、ボンディングワイヤ５３等で接続してセラミック基体５９の外部接続端子パッド５５と電気的に導通状態としている。そして、発光素子５２は、例えば、レンズ等からなる蓋体６０をセラミック枠体５８の上面周縁に接合して気密に封止されるようになっている。なお、この発光素子収納用パッケージ５０ａには、通常、キャビティ部５７の内側壁となるセラミック枠体５８の内周側面や、セラミック基体５９の表面に反射率を向上させる、例えば、所定波長での反射率の大きい金属めっき被膜等を施すことで、キャビティ部５７に搭載される発光素子５２の発光効率を向上させる工夫がなされている。   Further, as shown in FIG. 4B, a conventional ceramic light-emitting element storage package 50a usually has a cavity 57 in which the wall surface for storing the light-emitting element 52 is tapered or vertical. A ceramic green sheet to be a ceramic frame 58 in which holes having an outer size of the portion 57 are perforated and a ceramic green sheet to be a ceramic base 59 without holes are laminated and laminated. In addition, the ceramic green sheet before lamination includes, for example, a wire bond pad 54, an external connection terminal pad 55, a wiring pattern for connecting each pattern, and a conductor pattern such as a via, a metal conductor paste. Is formed by screen printing. And after laminating | stacking several ceramic green sheets, the ceramic green sheet and the conductor pattern are simultaneously baked, and the light emitting element accommodation package 50a is formed. After the light emitting element 52 is mounted on the light emitting element mounting portion formed in the light emitting element storage package 50a, it is connected to the external connection terminal pad 55 of the ceramic base 59 by connecting with the bonding wire 53 or the like. It is said. The light emitting element 52 is hermetically sealed by bonding a lid 60 made of, for example, a lens or the like to the periphery of the upper surface of the ceramic frame 58. The light emitting element storage package 50a usually improves the reflectance on the inner peripheral side surface of the ceramic frame 58 serving as the inner side wall of the cavity portion 57 and the surface of the ceramic base 59, for example, at a predetermined wavelength. A contrivance has been made to improve the light emission efficiency of the light emitting element 52 mounted in the cavity 57 by applying a metal plating film or the like having a high reflectance.

しかしながら、従来のそれぞれの発光素子収納用パッケージ５０、５０ａは、発光素子５２を載置する発光素子搭載部がそれぞれ熱伝導率の低い樹脂基体５１や、セラミック基体５９であるので、発光素子５２からの発熱を速やかに放熱させることが難しく、発光素子５２の温度が上昇して発光効率が低下して高い光出力が得られないという問題がある。そこで、発光素子収納用パッケージには、発光素子搭載部を設ける絶縁基体に熱伝導率が優れる窒化アルミニウム基板を用いるものが開発されている。   However, in each of the conventional light emitting element storage packages 50 and 50a, the light emitting element mounting portion on which the light emitting element 52 is mounted is the resin base 51 or the ceramic base 59 having low thermal conductivity. It is difficult to quickly dissipate the heat generated, and the temperature of the light emitting element 52 rises, resulting in a decrease in light emission efficiency and a high light output cannot be obtained. Accordingly, a light emitting element storage package has been developed that uses an aluminum nitride substrate having excellent thermal conductivity as an insulating substrate on which a light emitting element mounting portion is provided.

従来の発光素子収納用パッケージには、セラミック基板や、樹脂基板からなる絶縁基体の上に発光素子を囲繞するようにして金属製や、セラミック製や、樹脂製の反射体を取付、絶縁基体の発光素子搭載部に搭載した発光素子の発光効率を向上させると同時に発光素子の放熱効果の極大化を図るものが提案されている（例えば、特許文献１、特許文献２参照）。また、従来の発光素子収納用パッケージには、金属からなる発光素子搭載用の基体と、基体の発光素子搭載部を囲繞するようにして基体に取り付けられた配線導体を設ける絶縁性枠体と、絶縁性枠体上に取り付けられた金属製の反射用枠体で構成するものが提案されている（例えば、特許文献３参照）。更に、従来の発光素子収納用パッケージには、金属製基体の突出部に発光素子搭載部となる凹所が形成され、この凹所の壁面を発光素子反射部とし、突出部を囲繞するようにして金属製基体に取り付けられた絶縁性枠体で構成するものが提案されている（例えば、特許文献４参照）。   In a conventional light emitting element storage package, a reflector made of metal, ceramic or resin is attached so as to surround the light emitting element on an insulating base made of a ceramic substrate or a resin substrate. There has been proposed one that improves the light emission efficiency of the light emitting element mounted on the light emitting element mounting portion and at the same time maximizes the heat dissipation effect of the light emitting element (see, for example, Patent Document 1 and Patent Document 2). Further, a conventional light emitting element storage package includes a base for mounting a light emitting element made of metal, and an insulating frame provided with a wiring conductor attached to the base so as to surround the light emitting element mounting portion of the base; There has been proposed one constituted by a metal reflection frame attached on an insulating frame (see, for example, Patent Document 3). Further, in the conventional light emitting element storage package, a recess serving as a light emitting element mounting portion is formed in the protruding portion of the metal base, and the wall surface of this recess is used as a light emitting element reflecting portion so as to surround the protruding portion. In other words, a structure composed of an insulating frame attached to a metal base has been proposed (see, for example, Patent Document 4).

特開２００３−１９７９７４号公報JP 2003-197974 A 特開２００４−２５９９０１号公報JP 2004-259901 A 特開２００４−２２８２４０号公報JP 2004-228240 A 特開２００４−２００２０７号公報JP 2004-200207 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
（１）絶縁基体に窒化アルミニウム基板を用いる発光素子収納用パッケージは、窒化アルミニウムが高価であるので、発光素子収納用パッケージのコストアップとなっている。
（２）特開２００３−１９７９７４号公報や、特開２００４−２５９９０１号公報で開示されているような、絶縁基体の上に反射体を取付、発光素子の発光効率を向上させると同時に発光素子の放熱効果の極大化を図る発光素子収納用パッケージは、発光素子が熱伝導率の低い絶縁基体に搭載されるので、絶縁基体からの放熱が少ないと同時に、発光素子が反射体に直接接合されていないので、反射体からの放熱は少ない。
（３）特開２００４−２２８２４０号公報で開示されているような、金属製基体と、この基体の発光素子搭載部を囲繞するようにして基体に取り付けられた絶縁性枠体と、絶縁性枠体上に取り付けられた金属製の反射用枠体で構成される発光素子収納用パッケージは、発光素子からの発熱の放熱性は改善されるものの、パッケージの構造が複雑となり、作製のための工数が増加すると共に、歩留の低下によってパッケージのコストアップとなっている。
（４）特開２００４−２００２０７号公報で開示されているような、金属製基体の突出部に発光素子搭載部となる凹所が形成され、突出部を囲繞するようにして金属製基体に取り付けられた絶縁性枠体で構成される発光素子収納用パッケージは、構造が比較的簡単で、発光素子からの発熱の放熱性も良好であるが、発光素子と絶縁性枠体のワイヤボンドパッドとボンディングワイヤを介して接続するために、発光素子搭載部となる凹所を狭くする必要があり、凹所の反射部を広くすることができないので、発光素子の発光効率の向上が期待できない。
本発明は、かかる事情に鑑みてなされたものであって、発光素子からの発熱の放熱性に優れ、発光素子の発光効率を向上させることができる安価な発光素子収納用パッケージを提供することを目的とする。 However, the conventional light emitting element storage package as described above has the following problems.
(1) A light emitting element storage package using an aluminum nitride substrate as an insulating base is expensive because aluminum nitride is expensive.
(2) As disclosed in Japanese Patent Application Laid-Open No. 2003-197974 and Japanese Patent Application Laid-Open No. 2004-259901, a reflector is mounted on an insulating substrate to improve the light emission efficiency of the light emitting element and at the same time The light emitting element storage package for maximizing the heat dissipation effect is because the light emitting element is mounted on an insulating base with low thermal conductivity, so that the light emitting element is directly bonded to the reflector at the same time as the heat dissipation from the insulating base is low. Because there is no heat dissipation from the reflector.
(3) As disclosed in JP 2004-228240 A, a metal base, an insulating frame attached to the base so as to surround the light emitting element mounting portion of the base, and an insulating frame The light emitting element storage package composed of a metal reflective frame mounted on the body improves the heat dissipation of the heat generated from the light emitting element, but the structure of the package becomes complicated and the number of man-hours for production The package cost increases due to a decrease in yield.
(4) As disclosed in Japanese Patent Application Laid-Open No. 2004-200207, a recess serving as a light emitting element mounting portion is formed in the protruding portion of the metal base, and is attached to the metal base so as to surround the protruding portion. The light emitting element storage package composed of the insulating frame body has a relatively simple structure and good heat dissipation from the light emitting element, but the light emitting element and the wire bond pad of the insulating frame body In order to connect via a bonding wire, it is necessary to narrow the concave part which becomes a light emitting element mounting part, and since the reflective part of a concave part cannot be enlarged, the improvement of the light emission efficiency of a light emitting element cannot be expected.
The present invention has been made in view of the above circumstances, and provides an inexpensive light-emitting element storage package that is excellent in heat dissipation from the light-emitting elements and can improve the light-emitting efficiency of the light-emitting elements. Objective.

前記目的に沿う本発明に係る発光素子収納用パッケージは、１又は複数枚の絶縁基板からなる絶縁基体の上面側に発光素子とボンディングワイヤを介して電気的に導通状態とするためのワイヤボンドパッドを有し、ワイヤボンドパッドと電気的に導通状態とする導体配線を介して接続する外部接続端子パッドを下面側に有する絶縁基体の上面側に発光素子を載置するための搭載部を設ける金属体を接合する発光素子収納用パッケージであって、金属体の絶縁基体との接合部にワイヤボンドパッドを開口部から露出させる貫通孔を有すると共に、ワイヤボンドパッドが絶縁基体との接合部の貫通孔周縁から隔離されて設けられ、しかも、金属体が発光素子を囲繞するように壁面を有し、壁面が上方に開口を広くする傾斜状に設けられている。   The light emitting element storage package according to the present invention that meets the above-described object is a wire bond pad for electrically connecting a light emitting element and a bonding wire on the upper surface side of an insulating base composed of one or a plurality of insulating substrates. And a metal for providing a mounting portion for mounting the light emitting element on the upper surface side of the insulating substrate having an external connection terminal pad on the lower surface side, which is connected to the wire bond pad through a conductor wiring that is electrically conductive A package for housing a light emitting element for bonding a body, having a through-hole for exposing a wire bond pad from an opening at a joint portion between a metal body and an insulating substrate, and the wire bond pad penetrating the joint portion with the insulating substrate. In addition, the metal body has a wall surface so as to surround the light emitting element, and the wall surface is provided in an inclined shape so that the opening is widened upward.

ここで、発光素子収納用パッケージは、絶縁基板がセラミック基板、又は樹脂基板からなるのがよい。   Here, in the light emitting element storage package, the insulating substrate is preferably made of a ceramic substrate or a resin substrate.

請求項１又はこれに従属する請求項２記載の発光素子収納用パッケージは、１又は複数枚の絶縁基板からなる絶縁基体の上面側に発光素子とボンディングワイヤを介して電気的に導通状態とするためのワイヤボンドパッドを有し、ワイヤボンドパッドと電気的に導通状態とする導体配線を介して接続する外部接続端子パッドを下面側に有する絶縁基体の上面側に発光素子を載置するための搭載部を設ける金属体を接合する発光素子収納用パッケージであって、金属体の絶縁基体との接合部にワイヤボンドパッドを開口部から露出させる貫通孔を有すると共に、ワイヤボンドパッドが絶縁基体との接合部の貫通孔周縁から隔離されて設けられ、しかも、金属体が発光素子を囲繞するように壁面を有し、壁面が上方に開口を広くする傾斜状に設けられているので、絶縁基体に熱伝導率は高いが高価な窒化アルミニウム基板を用いなくても発光素子からの発熱を直接接合している金属体を介して上面側に効率よく放熱することができる。また、発光素子収納用パッケージには、発光素子と外部接続端子パッドを電気的に導通状態とするために、発光素子と、ボンディングワイヤを介して接続するためのワイヤボンドパッドが金属板に設ける貫通孔に露出させて形成できるので、発光素子搭載部を広くして設けることができると共に、発光素子からの発光を壁面で効率よく反射させて上面側に発光でき、発光素子の発光効率を向上させることができる。更に、発光素子収納用パッケージは、絶縁基体に貫通孔を設けた金属体を接合するだけの簡単な構造であるので、作製のための多くの工数を必要としない歩留のよい安価なパッケージとすることができる。   The light emitting element storage package according to claim 1 or claim 2 dependent thereon is electrically connected to the upper surface side of an insulating base composed of one or a plurality of insulating substrates via a light emitting element and a bonding wire. For mounting a light emitting element on the upper surface side of an insulating substrate having an external connection terminal pad on the lower surface side, which is connected to the wire bond pad through a conductor wiring that is electrically connected to the wire bond pad. A light emitting element storage package for bonding a metal body to be provided with a mounting portion, and having a through hole for exposing a wire bond pad from an opening at a joint portion between the metal body and the insulating base, and the wire bond pad and the insulating base In addition, the metal body has a wall surface so as to surround the light emitting element, and the wall surface is provided in an inclined shape with an opening widened upward. Therefore, even if an insulating aluminum substrate has a high thermal conductivity but does not use an expensive aluminum nitride substrate, the heat generated from the light emitting element can be efficiently radiated to the upper surface side through the metal body directly bonded. . Further, in the light emitting element storage package, a wire bond pad for connecting the light emitting element and the external connection terminal pad through a bonding wire is provided in the metal plate in order to electrically connect the light emitting element and the external connection terminal pad. Since it can be formed exposed to the hole, the light emitting element mounting portion can be widened, and the light emitted from the light emitting element can be efficiently reflected by the wall surface to emit light to the upper surface side, thereby improving the light emitting efficiency of the light emitting element. be able to. Furthermore, since the light emitting element storage package has a simple structure in which a metal body provided with a through hole in an insulating substrate is simply joined, an inexpensive package with a good yield that does not require many man-hours for manufacturing can do.

特に、請求項２記載の発光素子収納用パッケージは、絶縁基板がセラミック基板、又は樹脂基板からなるので、特段に熱伝導率の高い窒化アルミニウム基板からなる絶縁基体を用いなくても、発光素子の放熱性が高く、発光効率の高い、しかも、安価なパッケージにすることができる。   In particular, in the light emitting element storage package according to claim 2, since the insulating substrate is made of a ceramic substrate or a resin substrate, the light emitting device can be used without using an insulating substrate made of an aluminum nitride substrate having a particularly high thermal conductivity. A package with high heat dissipation, high luminous efficiency, and low cost can be obtained.

続いて、添付した図面を参照しつつ、本発明を具体化した実施するための最良の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、図２（Ａ）、（Ｂ）はそれぞれ同発光素子収納用パッケージの変形例の平面図、Ｂ−Ｂ’線縦断面図、図３（Ａ）、（Ｂ）はそれぞれ同発光素子収納用パッケージの他の変形例の平面図、Ｃ−Ｃ’線縦断面図である。 Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A and 1B are a plan view, a longitudinal sectional view taken along line AA ′, and FIGS. 2A and 2B, respectively, of the light emitting element storage package according to the embodiment of the present invention. Is a plan view of a modified example of the light emitting element storage package, BB ′ line longitudinal sectional view, FIGS. 3A and 3B are plan views of other modified examples of the light emitting element storage package, It is CC 'line longitudinal cross-sectional view.

図１（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、外形形状が平面視して、矩形状や、多角形や、円形等で１又は複数枚の絶縁基板からなる絶縁基体１１の上面側にＬＥＤ等の、例えば、上面側に２つの接続端子を有する発光素子１２とボンディングワイヤ１３を介して電気的に導通状態とするための２つのワイヤボンドパッド１４を有している。また、この発光素子収納用パッケージ１０は、それぞれのワイヤボンドパッド１４と電気的に導通状態とする導体配線を介して接続する外部接続端子パッド１５を絶縁基体１１の下面側に有している。そして、この発光素子収納用パッケージ１０は、絶縁基体１１の上面側に発光素子１２を収納するためのキャビティ部１６を形成するようにして発光素子１２を載置するための搭載部１７を設ける金属体１８を接合して有している。   As shown in FIGS. 1A and 1B, a light emitting element storage package 10 according to an embodiment of the present invention has a rectangular shape, a polygonal shape, a circular shape, etc. in plan view. An LED or the like on the upper surface side of an insulating substrate 11 made of one or a plurality of insulating substrates, for example, for electrically connecting with a light emitting element 12 having two connection terminals on the upper surface side and a bonding wire 13 Two wire bond pads 14 are provided. The light emitting element storage package 10 has external connection terminal pads 15 on the lower surface side of the insulating base 11 connected to the respective wire bond pads 14 through conductor wirings that are electrically connected. The light emitting element storage package 10 is a metal provided with a mounting portion 17 for mounting the light emitting element 12 so as to form a cavity portion 16 for storing the light emitting element 12 on the upper surface side of the insulating substrate 11. The body 18 is joined.

この金属体１８は、銅や、アルミニウムや、ＫＶ（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖａｒ（コバール）」）や、４２アロイ（Ｆｅ−Ｎｉ系合金）等からなり絶縁基体１１との接合部にそれぞれのワイヤボンドパッド１４を開口部から露出させる、例えば、２つの貫通孔１９を有している。そして、それぞれのワイヤボンドパッド１４は、絶縁基体１１との接合部の貫通孔１９周縁から隔離されて設けられている。これらのワイヤボンドパッド１４が絶縁基体１１との接合部の貫通孔１９周縁から隔離されて設けられていることにより、金属体１８の搭載部１７に搭載される、例えば、上面側に２つの接続端子を有する発光素子１２は、ボンディングワイヤ１３を介してそれぞれのワイヤボンドパッド１４と電気的に導通状態とする時に、それぞれのボンディングワイヤ１３が金属体１８と短絡することなくそれぞれのワイヤボンドパッド１４と接続でき、発光素子１２とそれぞれの外部接続端子パッド１５とを電気的に導通状態とすることができる。また、金属体１８は、発光素子１２を囲繞することができるように、例えば、平面視してサークル状等からなる壁面２０を有している。そして、この壁面２０は、上方に開口を広くする傾斜状に設けられている。この壁面２０が傾斜状に設けられることによって、キャビティ部１６に収納される発光素子１２は、発光素子１２からの発光を上方側へ効率よく反射させて、発光効率を向上させることができる。   The metal body 18 is made of copper, aluminum, KV (Fe—Ni—Co alloy, trade name “Kovar”), 42 alloy (Fe—Ni alloy), or the like. For example, there are two through holes 19 that expose the respective wire bond pads 14 from the openings at the joint. Each wire bond pad 14 is provided so as to be isolated from the periphery of the through hole 19 in the joint portion with the insulating base 11. Since these wire bond pads 14 are provided separately from the periphery of the through-hole 19 in the joint portion with the insulating base 11, two connections are mounted on the mounting portion 17 of the metal body 18, for example, on the upper surface side. When the light emitting element 12 having a terminal is electrically connected to each wire bond pad 14 via the bonding wire 13, each wire bond pad 14 is not short-circuited with the metal body 18. The light emitting element 12 and each external connection terminal pad 15 can be electrically connected. Further, the metal body 18 has a wall surface 20 made of, for example, a circle shape in plan view so that the light emitting element 12 can be surrounded. The wall surface 20 is provided in an inclined shape that widens the opening upward. By providing the wall surface 20 in an inclined shape, the light emitting element 12 accommodated in the cavity portion 16 can efficiently reflect the light emitted from the light emitting element 12 upward and improve the light emission efficiency.

図２（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０の変形例の発光素子収納用パッケージ１０ａは、発光素子収納用パッケージ１０と同様の１又は複数枚の絶縁基板からなる絶縁基体１１の上面側にＬＥＤ等の、例えば、上面側と下面側のそれぞれに接続端子を有する発光素子１２ａの上面側の接続端子とボンディングワイヤ１３を介して電気的に導通状態とするための１つのワイヤボンドパッド１４ａを有している。そして、この発光素子収納用パッケージ１０ａは、ワイヤボンドパッド１４ａと電気的に導通状態とする導体配線を介して接続する外部接続端子パッド１５ａを絶縁基体１１の下面側に有している。また、この発光素子収納用パッケージ１０ａは、絶縁基体１１の上面側に発光素子１２ａを収納するためのキャビティ部１６を形成するようにして発光素子１２ａを載置するための搭載部１７を設ける金属体１８ａを接合して有している。この金属体１８ａの搭載部１７には、発光素子１２ａの下面側の接続端子が直接接続され、金属体１８ａと電気的に導通状態とする導体配線を介して接続する外部接続端子パッド１５ｂを絶縁基体１１の下面側に有している。   As shown in FIGS. 2A and 2B, a light emitting element storage package 10 a of a modification of the light emitting element storage package 10 according to the embodiment of the present invention is the same as the light emitting element storage package 10. Via the bonding wires 13 and the connection terminals on the upper surface side of the light emitting element 12a having the connection terminals on the upper surface side and the lower surface side, such as LEDs on the upper surface side of the insulating substrate 11 made of one or a plurality of insulating substrates. One wire bond pad 14a for electrically conducting is provided. The light emitting element storage package 10a has an external connection terminal pad 15a on the lower surface side of the insulating substrate 11 to be connected to the wire bond pad 14a through a conductor wiring that is electrically connected. Further, the light emitting element storage package 10a is a metal provided with a mounting portion 17 for mounting the light emitting element 12a so as to form a cavity portion 16 for storing the light emitting element 12a on the upper surface side of the insulating substrate 11. The body 18a is joined. A connecting terminal on the lower surface side of the light emitting element 12a is directly connected to the mounting portion 17 of the metal body 18a to insulate the external connection terminal pad 15b that is connected to the metal body 18a through a conductor wiring that is in electrical conduction. It is provided on the lower surface side of the base 11.

上記の金属体１８ａは、発光素子収納用パッケージ１０の場合と同様に、銅や、アルミニウムや、ＫＶや、４２アロイ等からなり絶縁基体１１との接合部にワイヤボンドパッド１４ａを開口部から露出させる１つの貫通孔１９ａを有している。そして、ワイヤボンドパッド１４ａは、絶縁基体１１との接合部の貫通孔１９ａ周縁から隔離されて設けられている。このワイヤボンドパッド１４ａが絶縁基体１１との接合部の貫通孔１９ａ周縁から隔離されて設けられていることにより、金属体１８ａの搭載部１７に搭載される、例えば、上面側と下面側のそれぞれに接続端子を有する発光素子１２ａは、上面側の接続端子とボンディングワイヤ１３を介してワイヤボンドパッド１４ａと電気的に導通状態とする時に、ボンディングワイヤ１３が金属体１８ａと短絡することなくワイヤボンドパッド１４ａと接続でき、発光素子１２ａの上面側の接続端子と外部接続端子パッド１５ａとを電気的に導通状態とすることができる。また、金属体１８ａは、発光素子収納用パッケージ１０の場合と同様に、発光素子１２ａを囲繞することができるように、例えば、平面視してサークル状等からなる壁面２０を有している。そして、この壁面２０は、上方に開口を広くする傾斜状に設けられている。この壁面２０が傾斜状に設けられることによって、キャビティ部１６に収納される発光素子１２ａは、発光素子１２ａからの発光を上方側へ効率よく反射させて、発光効率を向上させることができる。   The metal body 18a is made of copper, aluminum, KV, 42 alloy, or the like, and the wire bond pad 14a is exposed from the opening in the joint portion with the insulating substrate 11 as in the case of the light emitting element storage package 10. One through-hole 19a is provided. The wire bond pad 14 a is provided so as to be isolated from the periphery of the through hole 19 a at the joint portion with the insulating base 11. The wire bond pad 14a is provided so as to be isolated from the periphery of the through hole 19a in the joint portion with the insulating base 11, so that the wire bond pad 14a is mounted on the mounting portion 17 of the metal body 18a. The light emitting element 12a having a connection terminal in the wire bond without causing the bonding wire 13 to be short-circuited with the metal body 18a when electrically connected to the wire bond pad 14a via the bonding wire 13 and the connection terminal on the upper surface side. The connection terminal can be connected to the pad 14a, and the connection terminal on the upper surface side of the light emitting element 12a and the external connection terminal pad 15a can be electrically connected. Moreover, the metal body 18a has the wall surface 20 which consists of a circle shape etc. in planar view so that the light emitting element 12a can be enclosed similarly to the case of the light emitting element accommodation package 10. FIG. The wall surface 20 is provided in an inclined shape that widens the opening upward. By providing the wall surface 20 in an inclined shape, the light emitting element 12a accommodated in the cavity portion 16 can efficiently reflect the light emitted from the light emitting element 12a upward, thereby improving the light emission efficiency.

図３（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０の他の変形例の発光素子収納用パッケージ１０ｂは、発光素子収納用パッケージ１０と同様の１又は複数枚の絶縁基板からなる絶縁基体１１の上面側にＬＥＤ等の、例えば、上面側に２つの接続端子を有する発光素子１２とボンディングワイヤ１３を介して電気的に導通状態とするための２つのワイヤボンドパッド１４を有している。また、この発光素子収納用パッケージ１０ｂは、それぞれのワイヤボンドパッド１４と電気的に導通状態とする導体配線を介して接続する外部接続端子パッド１５を絶縁基体１１の下面側に有している。そして、この発光素子収納用パッケージ１０は、絶縁基体１１の上面側に発光素子１２を収納するためのキャビティ部１６を形成するようにして発光素子１２を載置するための搭載部１７を設ける金属体１８ｂを接合して有している。   As shown in FIGS. 3A and 3B, a light emitting element storage package 10b of another modification of the light emitting element storage package 10 according to an embodiment of the present invention includes a light emitting element storage package 10 and a light emitting element storage package 10b. An electrically conductive state is established through a bonding wire 13 and a light emitting element 12 having two connection terminals on the upper surface side, such as an LED on the upper surface side of a similar insulating substrate 11 made of one or a plurality of insulating substrates. Two wire bond pads 14 are provided. The light emitting element storage package 10 b has external connection terminal pads 15 on the lower surface side of the insulating base 11 connected to the respective wire bond pads 14 through conductor wirings that are electrically conductive. The light emitting element storage package 10 is a metal provided with a mounting portion 17 for mounting the light emitting element 12 so as to form a cavity portion 16 for storing the light emitting element 12 on the upper surface side of the insulating substrate 11. The body 18b is joined.

この金属体１８ｂは、銅や、アルミニウムや、ＫＶや、４２アロイ等の筒形状からなり絶縁基体１１との接合部にそれぞれのワイヤボンドパッド１４を開口部から露出させる、例えば、２つの貫通孔１９を有している。そして、それぞれのワイヤボンドパッド１４は、絶縁基体１１との接合部の貫通孔１９周縁から隔離されて設けられている。これらのワイヤボンドパッド１４が絶縁基体１１との接合部の貫通孔１９周縁から隔離されて設けられていることにより、金属体１８ｂの搭載部１７に搭載される、例えば、上面側に２つの接続端子を有する発光素子１２は、ボンディングワイヤ１３を介してそれぞれのワイヤボンドパッド１４と電気的に導通状態とする時に、それぞれのボンディングワイヤ１３が金属体１８ｂと短絡することなくそれぞれのワイヤボンドパッド１４と接続でき、発光素子１２とそれぞれの外部接続端子パッド１５とを電気的に導通状態とすることができる。また、金属体１８ｂは、発光素子１２を囲繞することができるようにして、筒形状の上方側の開口径が広くなるラッパ形状からなる傾斜状の壁面２０を有している。この壁面２０が傾斜状に設けられることによって、キャビティ部１６に収納される発光素子１２は、発光素子１２からの発光を上方側へ効率よく反射させて、発光効率を向上させることができる。   The metal body 18b has a cylindrical shape such as copper, aluminum, KV, or 42 alloy, and exposes each wire bond pad 14 from the opening at the joint with the insulating base 11, for example, two through holes. 19. Each wire bond pad 14 is provided so as to be isolated from the periphery of the through hole 19 in the joint portion with the insulating base 11. These wire bond pads 14 are provided so as to be isolated from the periphery of the through hole 19 in the joint portion with the insulating base 11, so that the two mountings are mounted on the mounting portion 17 of the metal body 18b, for example, on the upper surface side. When the light emitting element 12 having a terminal is electrically connected to each wire bond pad 14 via the bonding wire 13, each wire bond pad 14 is not short-circuited with the metal body 18b. The light emitting element 12 and each external connection terminal pad 15 can be electrically connected. Further, the metal body 18b has an inclined wall surface 20 having a trumpet shape in which an opening diameter on the upper side of the cylindrical shape is wide so that the light emitting element 12 can be surrounded. By providing the wall surface 20 in an inclined shape, the light emitting element 12 accommodated in the cavity portion 16 can efficiently reflect the light emitted from the light emitting element 12 upward and improve the light emission efficiency.

なお、図示しないが、発光素子収納用パッケージ１０、１０ａ、１０ｂは、それぞれ金属体１８、１８ａ、１８ｂの搭載部１７の高さを高くすることで、そこに搭載する発光素子１２、１２ａを高くさせることができ、発光素子１２、１２ａの側面からの発光をそれぞれ金属体１８、１８ａ、１８ｂの壁面２０に効率的に反射させることができるようにすることもできる。この発光素子１２、１２ａの搭載部１７を高くさせる方法には、金属体１８、１８ａ、１８ｂの搭載部１７部分の厚さを厚くしたり、搭載部１７部分を上方に屈曲させて折り曲げたりして形成することができる。また、金属体１８、１８ａ、１８ｂの壁面２０は、稜線が直線状に限定されるものではなく、例えば、椀形の形状のような曲線状のものであってもよい。   Although not shown, the light emitting element storage packages 10, 10 a, and 10 b increase the height of the mounting portion 17 of the metal bodies 18, 18 a, and 18 b, thereby increasing the light emitting elements 12 and 12 a mounted thereon. The light emitted from the side surfaces of the light emitting elements 12 and 12a can be efficiently reflected on the wall surfaces 20 of the metal bodies 18, 18a and 18b, respectively. In order to raise the mounting portion 17 of the light emitting elements 12, 12a, the thickness of the mounting portion 17 portion of the metal bodies 18, 18a, 18b is increased, or the mounting portion 17 portion is bent upward and bent. Can be formed. Moreover, the wall surface 20 of the metal bodies 18, 18a, and 18b is not limited to a linear ridgeline, and may be a curved shape such as a bowl shape.

上記の発光素子収納用パッケージ１０、１０ａ、１０ｂに用いられる絶縁基体１１の絶縁基板は、例えば、アルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）や、低温焼成セラミック等の１又は複数枚のセラミックグリーンシートを積層し焼成して形成したセラミック基板からなっている。あるいは、絶縁基板は、例えば、ＢＴ樹脂（ビスマレイミドトリアジンを主成分にした樹脂）や、ポリイミド樹脂等からなる樹脂基板からなっている。 The insulating substrate of the insulating base 11 used in the light emitting element storage package 10, 10a, 10b is one or a plurality of sheets such as alumina (Al 2 O 3 ), aluminum nitride (AlN), low-temperature fired ceramic, and the like. The ceramic green sheets are laminated and fired to form a ceramic substrate. Alternatively, the insulating substrate is made of, for example, a resin substrate made of BT resin (resin mainly composed of bismaleimide triazine), polyimide resin, or the like.

本発明の発光素子収納用パッケージは、ＬＥＤ等の発光素子を搭載させて照明や、ディスプレイ等に用いることができる。   The light emitting element storage package of the present invention can be used for illumination, a display, or the like by mounting a light emitting element such as an LED.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。(A), (B) is a top view of the light emitting element storage package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view. （Ａ）、（Ｂ）はそれぞれ同発光素子収納用パッケージの変形例の平面図、Ｂ−Ｂ’線縦断面図である。(A), (B) is the top view of the modification of the package for the said light emitting element accommodation, respectively, and the B-B 'line longitudinal cross-sectional view. （Ａ）、（Ｂ）はそれぞれ同発光素子収納用パッケージの他の変形例の平面図、Ｃ−Ｃ’線縦断面図である。(A), (B) is the top view of the other modification of the light emitting element storage package, respectively, and the C-C 'line longitudinal cross-sectional view. （Ａ）、（Ｂ）はそれぞれ従来の発光素子収納用パッケージの断面図である。(A), (B) is sectional drawing of the conventional light emitting element storage package, respectively.

符号の説明Explanation of symbols

１０、１０ａ、１０ｂ：発光素子収納用パッケージ、１１：絶縁基体、１２、１２ａ：発光素子、１３：ボンディングワイヤ、１４、１４ａ：ワイヤボンドパッド、１５、１５ａ、１５ｂ：外部接続端子パッド、１６：キャビティ部、１７：搭載部、１８、１８ａ、１８ｂ：金属体、１９、１９ａ：貫通孔、２０：壁面   10, 10a, 10b: Light emitting element storage package, 11: Insulating substrate, 12, 12a: Light emitting element, 13: Bonding wire, 14, 14a: Wire bond pad, 15, 15a, 15b: External connection terminal pad, 16: Cavity part, 17: Mounting part, 18, 18a, 18b: Metal body, 19, 19a: Through hole, 20: Wall surface

Claims (2)

１又は複数枚の絶縁基板からなる絶縁基体の上面側に発光素子とボンディングワイヤを介して電気的に導通状態とするためのワイヤボンドパッドを有し、該ワイヤボンドパッドと電気的に導通状態とする導体配線を介して接続する外部接続端子パッドを下面側に有する前記絶縁基体の上面側に前記発光素子を載置するための搭載部を設ける金属体を接合する発光素子収納用パッケージであって、
前記金属体の前記絶縁基体との接合部に前記ワイヤボンドパッドを開口部から露出させる貫通孔を有すると共に、前記ワイヤボンドパッドが前記絶縁基体との接合部の前記貫通孔周縁から隔離されて設けられ、しかも、前記金属体が前記発光素子を囲繞するように壁面を有し、該壁面が上方に開口を広くする傾斜状に設けられていることを特徴とする発光素子収納用パッケージ。 A wire bond pad is provided on the upper surface side of an insulating base composed of one or a plurality of insulating substrates to be electrically connected to the light emitting element via a bonding wire, and is electrically connected to the wire bond pad. A light emitting element storage package for joining a metal body to provide a mounting portion for placing the light emitting element on the upper surface side of the insulating base having external connection terminal pads to be connected via a conductor wiring to be provided on the lower surface side; ,
The metal body has a through hole that exposes the wire bond pad from the opening at a joint portion between the metal substrate and the insulating base, and the wire bond pad is provided separately from the periphery of the through hole at the joint portion with the insulating base. In addition, the light-emitting element storage package is characterized in that the metal body has a wall surface so as to surround the light-emitting element, and the wall surface is provided in an inclined shape so as to widen the opening upward. 請求項１記載の発光素子収納用パッケージにおいて、前記絶縁基板がセラミック基板、又は樹脂基板からなることを特徴とする発光素子収納用パッケージ。   2. The light emitting element storage package according to claim 1, wherein the insulating substrate is made of a ceramic substrate or a resin substrate.
JP2005258608A 2005-09-07 2005-09-07 Package for housing light emitting element Pending JP2007073718A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102374404A (en) * 2010-08-19 2012-03-14 台达电子工业股份有限公司 Lamp module
JP2012134305A (en) * 2010-12-21 2012-07-12 Panasonic Corp Light emitting device and lighting device using the light emitting device
CN102709441A (en) * 2012-05-24 2012-10-03 重庆四联光电科技有限公司 LED (light-emitting diode) packaging structure
CN104595791A (en) * 2013-10-30 2015-05-06 龙璟印刷（深圳）有限公司 LED small night lamp wall paste touched to emit light and production process thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102374404A (en) * 2010-08-19 2012-03-14 台达电子工业股份有限公司 Lamp module
JP2012134305A (en) * 2010-12-21 2012-07-12 Panasonic Corp Light emitting device and lighting device using the light emitting device
US8592836B2 (en) 2010-12-21 2013-11-26 Panasonic Corporation Light emitting device and illumination apparatus using same
CN102709441A (en) * 2012-05-24 2012-10-03 重庆四联光电科技有限公司 LED (light-emitting diode) packaging structure
CN104595791A (en) * 2013-10-30 2015-05-06 龙璟印刷（深圳）有限公司 LED small night lamp wall paste touched to emit light and production process thereof

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