JP2006086204A - Coating device - Google Patents

Coating device Download PDF

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Publication number
JP2006086204A
JP2006086204A JP2004267121A JP2004267121A JP2006086204A JP 2006086204 A JP2006086204 A JP 2006086204A JP 2004267121 A JP2004267121 A JP 2004267121A JP 2004267121 A JP2004267121 A JP 2004267121A JP 2006086204 A JP2006086204 A JP 2006086204A
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Japan
Prior art keywords
substrate
mist
coating liquid
punching plate
horizontal portion
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JP2004267121A
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Japanese (ja)
Inventor
Taiichiro Aoki
泰一郎 青木
Yoshihiro Inao
吉浩 稲尾
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2004267121A priority Critical patent/JP2006086204A/en
Priority to KR1020050081111A priority patent/KR20060050905A/en
Priority to TW094130392A priority patent/TW200611315A/en
Priority to CNA2005101040558A priority patent/CN1749859A/en
Publication of JP2006086204A publication Critical patent/JP2006086204A/en
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a coating device which can prevent the attachment of a coating liquid to the rear surface of a substrate by containing little mist of the coating liquid in an air flow passing along the rear surface side of the substrate. <P>SOLUTION: When the substrate W turns and a space S becomes a decompressed state, only the pure air passes through a punching plate 8 from the peripheral edge of the substrate W and then passes in a space between a mist guard 10 and a horizontal portion 7 and then flows outward in the radial direction in a space between the top face of the horizontal portion 7 and the bottom face of the substrate W from an opening 9 for breathing. Meanwhile, excessive filamentous coating liquid scattering from the peripheral edge of the substrate W is trapped by the punching plate 8 when it passes through it, and the mist passes through the punching plate 8 but is trapped by the mist guard 10. Consequently, there is no coating liquid nor the mist contained in the air flow going toward the space between the top face of the horizontal portion 7 and the bottom face of the substrate W from the opening 9 for breathing, and therefore the coating liquid never attaches to the bottom face of the substrate W. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は半導体ウェーハやガラス基板などの基板表面にレジスト液などの塗布液を均一に塗布する塗布装置に関する。   The present invention relates to a coating apparatus that uniformly coats a coating solution such as a resist solution on a substrate surface such as a semiconductor wafer or a glass substrate.

カップ内にスピンナーを配置し、このスピンナーに半導体ウェーハがガラス基板などの基板を吸着させた状態で、スピンナーを高速回転せしめ遠心力で基板表面に滴下したレジストなどの塗布液を均一に基板表面に拡散させる塗布装置は従来から知られている。そして、斯かる従来装置にあっては基板裏面にミスト状になったレジストが付着し、これが固化すると露光時に基板の水平或いは高さを維持できず焦点ずれを起こすことがある。
そこで、従来から基板裏面にミスト状の塗布液が付着しない提案が特許文献１〜３になされている。 A spinner is placed in the cup, and the spinner is rotated at a high speed with the semiconductor wafer adsorbed to the spinner on the spinner, and the coating solution such as resist dripped onto the substrate surface by centrifugal force is uniformly applied to the substrate surface. A coating apparatus for diffusing is conventionally known. In such a conventional apparatus, a mist-like resist adheres to the back surface of the substrate, and when this resist is solidified, the horizontal or height of the substrate cannot be maintained at the time of exposure, and defocusing may occur.
Thus, Patent Documents 1 to 3 have proposed that mist-like coating liquid does not adhere to the back surface of the substrate.

特許文献１には、カップを外カップと内カップに分け、この内カップ内に基板の裏面周辺部と全周にわたり等間隔で近接する整流リングを設け、内カップ内を排気した際に、基板裏面側の雰囲気を基板裏面に沿って基板中心寄りから外周に向かわせ、レジストミストが基板裏面に廻り込むことがないようにしている。   In Patent Document 1, the cup is divided into an outer cup and an inner cup, and a rectifying ring is provided in the inner cup that is adjacent to the back surface peripheral portion of the substrate at equal intervals over the entire circumference. The atmosphere on the back surface side is directed from the center of the substrate toward the outer periphery along the back surface of the substrate so that the resist mist does not enter the back surface of the substrate.

特許文献２には、カップ内に裁頭円錐形状の整流部材を設け、基板の裏面に隙間を介して対向する整流部材の上面に環状溝を複数本形成し、塗布液の飛沫が基板（ウェーハ）の裏面に付着することを防止している。   In Patent Document 2, a truncated cone-shaped rectifying member is provided in a cup, and a plurality of annular grooves are formed on the upper surface of the rectifying member facing the back surface of the substrate with a gap between them. ) Is prevented from adhering to the back surface.

特許文献３には、基板（ウェーハ）の裏面にできるだけ隙間が小さくなるように整流板を配置している。特にこの特許文献３には基板の裏面を洗浄するバックリンスノズルが開示されている。
特開平５−１０９６１２号公報 特開平５−２０６０１９号公報 特開平６−２０９３５号公報 In Patent Document 3, a rectifying plate is arranged on the back surface of the substrate (wafer) so that the gap is as small as possible. In particular, Patent Document 3 discloses a back rinse nozzle for cleaning the back surface of a substrate.
Japanese Patent Laid-Open No. 5-109612 JP-A-5-206019 JP-A-6-20935

上述した特許文献に開示される手段では、基板裏面にミスト状の塗布液が付着するのを完全に防止することができない。特に、アクリル系樹脂が含まれているレジスト液を塗布する場合、陰圧となっている基板裏面側に綿菓子のような白い糸状（煙状）になって吸い込まれて付着する。   The means disclosed in the above-mentioned patent document cannot completely prevent the mist-like coating liquid from adhering to the back surface of the substrate. In particular, when a resist solution containing an acrylic resin is applied, it is sucked and attached in the form of a white thread (smoke) like cotton candy on the back side of the substrate which is at a negative pressure.

例えば、レジストＰＭＥＲ−ＬＡ９００（東京応化工業製：粘度９００ｃｐ）を、整流部材を備えていない従来の塗布装置で１０００rpmで回転している半導体ウェーハ上に滴下すると、ケース内には多量の糸引きが発生しウェーハ裏面にその糸が付着した。   For example, when a resist PMER-LA900 (manufactured by Tokyo Ohka Kogyo Co., Ltd .: viscosity 900 cp) is dropped on a semiconductor wafer rotating at 1000 rpm with a conventional coating apparatus that does not include a rectifying member, a large amount of stringing occurs in the case. Generated and adhered to the backside of the wafer.

上記課題を解決するため本発明に係る塗布装置は、スピンドルチャックを配置したケースの底面に、前記スピンドルチャックを上面が露出した状態で収納する筒状壁部を設け、この筒状壁部の外側に整流部材が配置し、この整流部材を前記ケースに固設される起立壁とこの起立壁の上端から前記筒状壁部に向かって伸びる水平部とから構成し、更に前記起立壁の全部または一部をエアが流通可能な多孔体またはパンチングプレートとし、前記水平部には呼吸用の開口を形成し、この呼吸用の開口の下方にはミストガードを配置した。このような構成とすることで、塗布液が基板裏面に廻り込んで付着することを確実に防止できる。   In order to solve the above-described problems, the coating apparatus according to the present invention is provided with a cylindrical wall portion that accommodates the spindle chuck with the upper surface exposed on the bottom surface of the case where the spindle chuck is disposed, and the outside of the cylindrical wall portion. The rectifying member is arranged on the case, and the rectifying member is constituted by a standing wall fixed to the case and a horizontal portion extending from an upper end of the standing wall toward the cylindrical wall portion, and further, the whole of the standing wall or A part is a porous body or punching plate through which air can flow, a breathing opening is formed in the horizontal portion, and a mist guard is disposed below the breathing opening. With such a configuration, it is possible to reliably prevent the coating liquid from flowing around and adhering to the back surface of the substrate.

また、前記整流部材の起立壁上端に複数の洗浄液供給口を設けることで常時または必要なときに起立壁表面に洗浄液を供給することができ、起立壁表面で補足した塗布液を洗い流すことができる。   Further, by providing a plurality of cleaning liquid supply ports at the upper end of the rising wall of the flow regulating member, the cleaning liquid can be supplied to the surface of the rising wall at all times or when necessary, and the coating liquid supplemented on the surface of the rising wall can be washed away. .

本発明によれば、基板裏面と整流部材の水平部との間を流れる気流が外向きとなり、しかも気流中にはミスト状の塗布液が殆んど含まれないため、基板裏面に塗布液が付着することがない。その結果、例えば露光工程において基板の水平が維持できずに焦点がずれるなどの不利が生じることがない。   According to the present invention, the airflow flowing between the back surface of the substrate and the horizontal portion of the rectifying member is outward, and the mist-like coating liquid is hardly included in the airflow, so that the coating liquid is present on the back surface of the substrate. There is no adhesion. As a result, there is no disadvantage that the substrate is not kept horizontal in the exposure process and the focus is shifted.

以下に本発明の実施例を添付図面に基づいて説明する。図１は本発明に係る塗布装置の側断面図、図２は同塗布装置の平面図であり、塗布装置は上面が開放されたケース１の側面に排気口１ａが形成され、更にケース１の底面を貫通してスピンドル軸２がケース１内まで伸び、このスピンドル軸２の上端部にチャック３が取り付けられている。このチャック３は吸引或いは静電力によって半導体ウェーハやガラス基板などの基板Ｗを固定する。   Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a sectional side view of a coating apparatus according to the present invention, and FIG. 2 is a plan view of the coating apparatus. The spindle shaft 2 extends through the bottom surface into the case 1, and a chuck 3 is attached to the upper end portion of the spindle shaft 2. The chuck 3 fixes a substrate W such as a semiconductor wafer or a glass substrate by suction or electrostatic force.

また、スピンドル軸２は上下方向に移動可能とされ、前記ケース１の底面の中央には筒状壁部４が形成され、この筒状壁部４内にスピンドルチャック（スピンドル軸２とチャック３）が収納されている。尚、筒状壁部４の高さはスピンドル軸２が最も下降した位置でチャック３の上面が筒状壁部４の上端よりも若干高くなるように設定する。   The spindle shaft 2 is movable in the vertical direction, and a cylindrical wall portion 4 is formed at the center of the bottom surface of the case 1. A spindle chuck (spindle shaft 2 and chuck 3) is formed in the cylindrical wall portion 4. Is stored. The height of the cylindrical wall portion 4 is set so that the upper surface of the chuck 3 is slightly higher than the upper end of the cylindrical wall portion 4 at the position where the spindle shaft 2 is lowered most.

また、筒状壁部４の外側には整流部材５が配置されている。この整流部材５は前記ケース１底面に固設される起立壁６と、この起立壁６の上端から前記筒状壁部４に向かって伸びる水平部７とから構成され、更に前記起立壁６の下半部はパンチングプレート８で構成されている。ここで、起立壁６を設ける位置はスピンドルチャックにて保持する基板Ｗの外周端よりも径方向を基準として外側位置とする。   A rectifying member 5 is disposed outside the cylindrical wall portion 4. The straightening member 5 includes an upright wall 6 fixed to the bottom surface of the case 1 and a horizontal portion 7 extending from the upper end of the upright wall 6 toward the cylindrical wall portion 4. The lower half is constituted by a punching plate 8. Here, the position where the upright wall 6 is provided is an outer position with respect to the radial direction from the outer peripheral edge of the substrate W held by the spindle chuck.

尚、パンチングプレート８の代わりに多孔体などのエアの流通は妨げないが、糸状の塗布液は捕獲する部材を用いてもよい。また起立壁６全体をパンチングプレートや多孔体で構成してもよい。   It should be noted that, instead of the punching plate 8, the flow of air such as a porous body is not hindered, but a member that captures the filamentous coating solution may be used. Moreover, you may comprise the whole standing wall 6 with a punching plate or a porous body.

また前記起立壁６の水平部７の内側端と筒状壁部４との間には隙間が形成され、更に、中間位置には呼吸用の開口９が複数個形成され、この呼吸用の開口９の下方にミストガード１０が配置されている。このミストガード１０と水平部７の下面との間の空間を狭く設定することで、ラビリンス機能を発揮してミスト状の塗布液が基板Ｗ裏面側に廻り込まないようにしている。   Further, a gap is formed between the inner end of the horizontal portion 7 of the upright wall 6 and the cylindrical wall portion 4, and a plurality of breathing openings 9 are formed at an intermediate position. A mist guard 10 is disposed below 9. By setting the space between the mist guard 10 and the lower surface of the horizontal portion 7 narrow, the labyrinth function is exhibited so that the mist-like coating liquid does not enter the back side of the substrate W.

また、起立壁６の上端部は傾斜面とされ、この傾斜面に洗浄液を供給する洗浄液供給口１１が複数形成され、必要に応じて起立壁６やパンチングプレート８に付着している糸状の余剰塗布液を洗い流す。   Further, the upper end portion of the standing wall 6 is an inclined surface, and a plurality of cleaning liquid supply ports 11 for supplying a cleaning liquid are formed on the inclined surface, and a thread-like surplus attached to the standing wall 6 and the punching plate 8 as necessary. Rinse the coating solution.

以上において、排気口１ａを介して吸引しつつスピンドルチャック（スピンドル軸２とチャック３）を回転させ、基板Ｗ表面に滴下した塗布液を遠心力で拡散せしめる。この回転に伴って基板Ｗ表面には径方向外側に向かった気流が形成され、筒状壁部４と整流部材５に囲まれる空間Ｓと基板Ｗ裏面と整流部材との隙間は減圧状態となる。   In the above, the spindle chuck (spindle shaft 2 and chuck 3) is rotated while sucking through the exhaust port 1a, and the coating liquid dripped onto the surface of the substrate W is diffused by centrifugal force. With this rotation, an air flow directed radially outward is formed on the surface of the substrate W, and the space between the cylindrical wall portion 4 and the rectifying member 5, the back surface of the substrate W, and the rectifying member is in a reduced pressure state. .

このように基板Ｗが回転し且つ空間Ｓ内が減圧状態になると、純粋なエアのみについては、図３に示すように、基板Ｗの外周縁からパンチングプレート８を透過してミストガード１０と水平部７との隙間を通り、呼吸用の開口９から水平部７の上面と基板Ｗの下面との間の隙間を径方向外側に向かって流れる。   When the substrate W is thus rotated and the space S is in a reduced pressure state, only pure air passes through the punching plate 8 from the outer peripheral edge of the substrate W as shown in FIG. Passing through the gap with the portion 7, the gap flows between the upper surface of the horizontal portion 7 and the lower surface of the substrate W from the breathing opening 9 toward the radially outer side.

一方、純粋なエアのみの流れの他に基板Ｗの外周縁から糸状に飛び出す余剰の塗布液及びミストがある。糸状の余剰塗布液はパンチングプレート８を通過する際にトラップされパンチングプレートに捕捉される。一方、ミストについてはパンチングプレート８は通過するがミストガード１０において捕捉され、結局、呼吸用の開口９から水平部７の上面と基板Ｗの下面との間の隙間に向かう気流中には塗布液及びミストは含まれず塗布液が基板Ｗの下面に付着することがない。また、洗浄液供給口１１からは洗浄液が適宜供給され、起立壁６やパンチングプレート８に付着している余剰塗布液を随時洗い流す。   On the other hand, in addition to the flow of pure air, there are excess coating liquid and mist that jump out from the outer peripheral edge of the substrate W in the form of threads. The thread-like surplus coating liquid is trapped and captured by the punching plate when passing through the punching plate 8. On the other hand, the mist passes through the punching plate 8 but is captured by the mist guard 10. As a result, the coating liquid is present in the airflow from the breathing opening 9 toward the gap between the upper surface of the horizontal portion 7 and the lower surface of the substrate W. The mist is not contained and the coating liquid does not adhere to the lower surface of the substrate W. Further, the cleaning liquid is appropriately supplied from the cleaning liquid supply port 11, and the excess coating liquid adhering to the standing wall 6 and the punching plate 8 is washed away as needed.

以上の塗布装置を用いて、１０００rpmで回転している半導体ウェーハ上に、レジストＰＭＥＲ−ＬＡ９００（東京応化工業製：粘度９００ｃｐ）を滴下したところ、ケース内には糸引きが発生したが、当該糸はウェーハ裏面に廻り込むことなく、起立壁のパンチングプレートに捕獲された。   When the resist PMER-LA900 (manufactured by Tokyo Ohka Kogyo Co., Ltd .: viscosity 900 cp) was dropped onto a semiconductor wafer rotating at 1000 rpm using the above coating apparatus, stringing occurred in the case. Was caught on the standing wall punching plate without going around the back of the wafer.

本発明に係る塗布装置の側断面図Side sectional view of a coating apparatus according to the present invention 同塗布装置の平面図Top view of the coating device 同塗布装置の作用を説明する拡大側面図An enlarged side view for explaining the operation of the coating apparatus

符号の説明Explanation of symbols

１…ケース、１ａ…排気口、２…スピンドル、３…チャック、４…筒状壁部、５…整流部材、６…起立壁、７…水平部、８…パンチングプレート、９…呼吸用の開口、１０…ミストガード、１１…洗浄液供給口、Ｗ…基板。
DESCRIPTION OF SYMBOLS 1 ... Case, 1a ... Exhaust port, 2 ... Spindle, 3 ... Chuck, 4 ... Cylindrical wall part, 5 ... Rectifying member, 6 ... Standing wall, 7 ... Horizontal part, 8 ... Punching plate, 9 ... Opening for breathing 10: Mist guard, 11: Cleaning liquid supply port, W: Substrate.

Claims (2)

ケース内に配置したスピンドルチャックに基板を載置し、前記スピンドルチャックによって基板を回転せしめることで基板表面に滴下した塗布液を均一に拡げるようにした塗布装置において、前記ケースの底面には前記スピンドルチャックを上面が露出した状態で収納する筒状壁部が設けられ、この筒状壁部の外側には整流部材が配置され、この整流部材は前記ケースに固設される起立壁とこの起立壁の上端から前記筒状壁部に向かって伸びる水平部とから構成され、更に前記起立壁の全部または一部はエアが流通可能な多孔体またはパンチングプレートとされ、前記水平部には呼吸用の開口が形成され、この呼吸用の開口の下方にはミストガードが配置されていることを特徴とする塗布装置。 A coating apparatus in which a substrate is placed on a spindle chuck disposed in a case, and the substrate is rotated by the spindle chuck to uniformly spread the coating solution dripped onto the substrate surface. A cylindrical wall portion for storing the chuck with the upper surface exposed is provided, and a rectifying member is disposed outside the cylindrical wall portion. The rectifying member is an upright wall fixed to the case and the upright wall. A horizontal portion extending from the upper end of the cylindrical wall portion toward the cylindrical wall portion, and further, all or a part of the standing wall is a porous body or punching plate through which air can flow, and the horizontal portion has a breathing plate. An applicator characterized in that an opening is formed and a mist guard is disposed below the breathing opening. 請求項１に記載の塗布装置において、前記整流部材の起立壁上端には起立壁表面に洗浄液を供給する洗浄液供給口が複数形成されていることを特徴とする塗布装置。

The coating apparatus according to claim 1, wherein a plurality of cleaning liquid supply ports for supplying a cleaning liquid to the surface of the standing wall are formed at an upper end of the standing wall of the rectifying member.

JP2004267121A 2004-09-14 2004-09-14 Coating device Withdrawn JP2006086204A (en)

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JP2004267121A JP2006086204A (en) 2004-09-14 2004-09-14 Coating device
KR1020050081111A KR20060050905A (en) 2004-09-14 2005-09-01 Coating apparatus
TW094130392A TW200611315A (en) 2004-09-14 2005-09-05 Coating apparatus
CNA2005101040558A CN1749859A (en) 2004-09-14 2005-09-14 Coating device

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JP2011222685A (en) * 2010-04-08 2011-11-04 Tokyo Electron Ltd Substrate processing apparatus and coating development system equipped with the same
JP2013243317A (en) * 2012-05-22 2013-12-05 Tokyo Ohka Kogyo Co Ltd Coating applicator, substrate processing system, and substrate processing method
JP2014179378A (en) * 2013-03-13 2014-09-25 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method
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KR20180114841A (en) * 2017-04-11 2018-10-19 도쿄엘렉트론가부시키가이샤 Substrate processing apparatus
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JP2019046833A (en) * 2017-08-29 2019-03-22 東京エレクトロン株式会社 Coating processing device and coating liquid collection member
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CN1749859A (en) 2006-03-22
KR20060050905A (en) 2006-05-19

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