JP2006057113A

JP2006057113A - Jet plating device

Info

Publication number: JP2006057113A
Application number: JP2004236959A
Authority: JP
Inventors: Jun Kudo; 純工藤; Hiroshi Yamamoto; 洋山本; Takashi Aiba; 尚相庭; Shoichi Nakayama; 正一中山; Kazushige Toda; 一重遠田; Akihiko Umetsu; 明彦梅津
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2004-08-17
Filing date: 2004-08-17
Publication date: 2006-03-02

Abstract

<P>PROBLEM TO BE SOLVED: To attain the minimization of an exchanging member of a cathode electrode body required per change in the kind of the object to be plated and the simplification of the exchanging operation by improving the cathode electrode body and the mechanism of the peripheral part thereof. <P>SOLUTION: In the jet plating device where the conductor part of a substrate 1 as the object to be plated is arranged downward on the opening side of a jet plating tank 10 for generating the jet of a plating liquid, and electric current is made to flow between a cathode electrode body 30 and an anode electrode 5 connected to the conductor part while jetting the plating liquid on the conductor part, so as to perform plating, the cathode electrode body 30 is divided into a fixed cathode electrode part 31 and a power feed electrode part 40. The fixed cathode electrode part 31 is supported by a cathode fixing support part 15, and the power feed electrode part 40 is supported by an elevation power feed part 45 so as to be freely elevated/lowered. At least the part contacted with the conductor part of the substrate 1 in the fixed cathode electrode part 31 is freely exchangeable, and, when the elevation power feed part 45 is lowered, the power feed electrode part 40 is contacted with the fixed cathode electrode part 31 and feeds power thereto. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、プリント回路配線基板等の被めっき物に電解めっきを施すめっき装置に係り、特に、めっきを施す際に、被めっき物のフェースダウンの片面（下面）を電解めっきするのに適した噴流めっき装置に関するものである。 The present invention relates to a plating apparatus for performing electroplating on an object to be plated such as a printed circuit wiring board, and particularly suitable for electroplating one side (lower surface) of the face down of the object to be plated when performing plating. The present invention relates to a jet plating apparatus.

プリント回路配線基板あるいは半導体ウェハ等における回路配線用の導体部にめっきを施す場合、前記導体部を下向きにして電解めっきするフェースダウン方式による噴流めっき装置が知られている。 2. Description of the Related Art A face-down type jet plating apparatus that performs electroplating with a conductor portion facing downward when plating on a conductor portion for circuit wiring on a printed circuit wiring board or a semiconductor wafer is known.

この噴流めっき装置は、上方に開口し内部にめっき液を保持するめっき槽と、被めっき基板を着脱自在に下向きに保持して該被めっき基板を前記めっき槽の上部開口部を塞ぐ位置に配置する基板保持部とを有している。前記めっき槽の内部にはめっき液中に浸漬されてアノード（陽極）電極体となる平板状のアノード板が水平に配置され、前記基板の導体部がカソード（陰極）電極体側となるようになっている。前記アノード板は、多孔質材料又は網目を有する材料で構成されている。 This jet plating apparatus has a plating tank that opens upward and holds a plating solution inside, and a substrate to be plated that is detachably held downward and is placed at a position that closes the upper opening of the plating tank. And a substrate holding part. A flat anode plate, which is immersed in a plating solution and becomes an anode (anode) electrode body, is horizontally disposed inside the plating tank, and the conductor portion of the substrate is on the cathode (cathode) electrode body side. ing. The anode plate is made of a porous material or a material having a mesh.

前記めっき槽の底部中央には、上方に向けためっき液の噴流を形成するめっき液噴射管が接続され、めっき槽の外側には、めっき液受けが配置されている。 A plating solution injection pipe that forms a jet of a plating solution directed upward is connected to the center of the bottom of the plating vessel, and a plating solution receiver is disposed outside the plating vessel.

そして、前記めっき槽の上部に被めっき基板を前記基板保持部で下向きに保持して配置し、アノード板と被めっき基板（カソード電極体側）の間に所定の電圧を印加しつつ、被めっき基板の下面（被めっき面）に垂直にめっき液の噴流を当てることで、アノード板と基板の間にめっき電流を流して、基板の下面にめっき膜を形成するようにしている。この時、めっき槽からオーバーフローしためっき液は、めっき液受けで回収される。 Then, the substrate to be plated is disposed on the upper part of the plating tank while being held downward by the substrate holder, and a predetermined voltage is applied between the anode plate and the substrate to be plated (cathode electrode body side). By applying a jet of the plating solution perpendicularly to the lower surface (surface to be plated), a plating current is passed between the anode plate and the substrate to form a plating film on the lower surface of the substrate. At this time, the plating solution overflowed from the plating tank is collected by the plating solution receiver.

上述のフェースダウン方式の噴流めっき装置においては、回路配線用の導体部を有する被めっき基板の品種切換によりカソード電極体パターン（基板下面への接触面パターン）が変わる場合、カソード電極体及びこれを保持する保持構造部全体を交換する必要が生じてしまう。このため、被めっき物の品種切換毎に、これに対応したカソード電極体及び保持構造部を準備する必要があり、然も、保持構造部全体を交換する煩雑な作業を余儀なくされるという費用面、製造リードタイム面での欠陥が生じる。さらに、カソード電極体へめっき膜が形成されたり、めっき液の気泡により被めっき面のめっきが不均一（あるいはめっき無し不良）になったりする等の問題が存在している。 In the above-described face-down type jet plating apparatus, when the cathode electrode body pattern (contact surface pattern to the lower surface of the substrate) is changed by changing the type of the substrate to be plated having the conductor portion for circuit wiring, the cathode electrode body and It becomes necessary to replace the entire holding structure portion to be held. For this reason, it is necessary to prepare a cathode electrode body and a holding structure corresponding to each product type change of the object to be plated. However, it is necessary to perform complicated work to replace the entire holding structure. As a result, defects in production lead time occur. Furthermore, there are problems such as formation of a plating film on the cathode electrode body, and uneven plating (or defective plating) due to the bubbles of the plating solution.

この種の噴流めっき装置の公知文献としては、下記特許文献１、特許文献２及び特許文献３がある。 Known documents of this type of jet plating apparatus include the following Patent Document 1, Patent Document 2, and Patent Document 3.

特開２００１−１３１７９７号公報JP 2001-131797 A 特開２００１−４９４９５号公報JP 2001-49495 A 特開２００１−２００９６号公報Japanese Patent Laid-Open No. 2001-20096

特許文献１は上方を開放した処理槽の上部に半導体ウェハをその被処理面を下にして保持し、カソード側の半導体ウェハの被処理面に処理液を噴流させながらアノードとの間に電流を流して半導体ウェハにめっき、化成等の処理を施す半導体製造装置において、半導体ウェハへ向かって処理液を下方から上方へ流す主流路とは別に、処理液流通方向上流側において前記主流路から分流し、その分流した流路の下流端が半導体ウェハの存在しない外部空間に開放した副流路を設け、当該副流路内にアノードを配置してなる噴流めっき装置を備えた半導体製造装置に係る。 In Patent Document 1, a semiconductor wafer is held on the upper surface of a processing tank whose upper side is opened, and the current is passed between the anode and the anode while the processing liquid is jetted onto the processing surface of the semiconductor wafer on the cathode side. In a semiconductor manufacturing apparatus that performs processing such as plating and chemical conversion on a semiconductor wafer by flowing it, the processing liquid is separated from the main flow path upstream in the flow direction of the processing liquid separately from the main flow path that flows the processing liquid from the bottom toward the semiconductor wafer. The present invention relates to a semiconductor manufacturing apparatus provided with a jet plating apparatus in which a sub-flow path is provided in an external space where the downstream end of the flow-divided flow path is not present in a semiconductor wafer and an anode is disposed in the sub-flow path.

特許文献２はめっき液を保持する円筒状のめっき槽と、該めっき槽の外部から供給されるめっき液により上方に向けためっき液の噴流を形成するめっき液噴射部と、基板を着脱自在に保持して該基板下面のめっき面がめっき液の噴流と接触するように水平に配置する基板保持部と、該基板保持部を回転及び昇降させる回転機構及び昇降機構を備えた駆動部とを具備し、該昇降機構により基板保持部を下降させた位置において該基板下面のめっき面にめっきを施すことを可能とし、該昇降機構により基板保持部を上昇させた位置において該基板保持部へ基板を取付けまたは該基板保持部から基板を取出すことを可能とした噴流めっき装置に係る。 Patent Document 2 discloses a cylindrical plating tank for holding a plating solution, a plating solution injection unit for forming a plating solution jet directed upward by a plating solution supplied from the outside of the plating vessel, and a detachable substrate. A substrate holding portion that is held and horizontally disposed so that the plating surface of the lower surface of the substrate is in contact with the jet of the plating solution, a rotation mechanism that rotates and lifts the substrate holding portion, and a drive portion that includes a lifting mechanism. Then, it is possible to plate the plating surface on the lower surface of the substrate at a position where the substrate holding portion is lowered by the lifting mechanism, and the substrate is moved to the substrate holding portion at a position where the substrate holding portion is raised by the lifting mechanism. The present invention relates to a jet plating apparatus capable of mounting or removing a substrate from the substrate holding portion.

特許文献３は被めっき基板のめっきを施すめっき面外周に当接するリング状のシール部材を具備し、該被めっき基板のめっき面を露出させ、且つ該めっき面を下に向けて保持する基板保持具を具備し、めっき液の充満しためっき槽内で基板保持具に保持された被めっき基板の下方から該被めっき基板のめっき面に達するめっき液噴流を生成しながらめっきを行うめっき装置において、基板保持具の下端部に被めっき基板のめっき面に残留する気泡を該基板保持具の外側に逃がす通気孔を設けた噴流めっき装置に係る。 Patent Document 3 includes a ring-shaped sealing member that abuts on the outer periphery of a plating surface on which a substrate to be plated is plated, and exposes the plating surface of the substrate to be plated and holds the plating surface downward. A plating apparatus for performing plating while generating a plating solution jet reaching the plating surface of the substrate to be plated from below the substrate to be plated held in the substrate holder in the plating tank filled with the plating solution. The present invention relates to a jet plating apparatus in which an air hole for allowing bubbles remaining on a plating surface of a substrate to be plated to escape to the outside of the substrate holder is provided at a lower end portion of the substrate holder.

ところで、特許文献１乃至３において共通する問題は、被めっき物の品種切換によりカソード電極体（基板下面への接触面パターン）が変わる場合、カソード電極体及びこれを保持する保持構造部全体を交換する必要が生じることであり、これについての対策は開示されていない。 By the way, a problem common to Patent Documents 1 to 3 is that when the cathode electrode body (contact surface pattern to the lower surface of the substrate) is changed by changing the type of the object to be plated, the cathode electrode body and the entire holding structure section for holding the cathode electrode body are replaced. It is necessary to do this, and measures for this are not disclosed.

更に、特許文献２及び特許文献３においては、めっき作業の過程で発生する気泡を通気孔を通してめっき槽の外側に逃がすという手段が設けられているが、積極的な消泡手段が設けられていない。このため、被めっき基板面に残留する気泡の影響により、被めっき面全体でめっきが不均一になるという品質面での欠陥が生じる問題がある。 Furthermore, in Patent Document 2 and Patent Document 3, there is provided means for allowing bubbles generated during the plating process to escape to the outside of the plating tank through the vent hole, but no positive defoaming means is provided. . For this reason, there is a problem in that a defect in quality occurs in that plating is not uniform over the entire surface to be plated due to the influence of bubbles remaining on the surface of the substrate to be plated.

本発明の第１の目的は、カソード電極体及びその周辺部機構を改善することにより、被めっき物の品種切換毎に要するカソード電極体の交換部材の最小化、交換作業の簡素化を図り、費用面及び製造リードタイム面で優れた噴流めっき装置を提供することにある。 The first object of the present invention is to improve the cathode electrode body and its peripheral mechanism, thereby minimizing the replacement member of the cathode electrode body required for each type change of the object to be plated and simplifying the replacement work. An object of the present invention is to provide a jet plating apparatus excellent in terms of cost and manufacturing lead time.

本発明の第２の目的は、めっき液中に残留する気泡を効果的、効率的に消泡し、被めっき面全体のめっき膜厚の均一化を図り、品質面及び製造原価面で優れた噴流めっき装置を提供することにある。 The second object of the present invention is to effectively and efficiently eliminate bubbles remaining in the plating solution, to achieve uniform plating film thickness over the entire surface to be plated, and is excellent in terms of quality and manufacturing cost. It is to provide a jet plating apparatus.

本発明のその他の目的や新規な特徴は後述の実施の形態において明らかにする。 Other objects and novel features of the present invention will be clarified in embodiments described later.

上記目的を達成するために、本発明は、めっき液の噴流を発生させる噴流めっき槽の開口側に、被めっき物の導体部を下向きとして配置し、前記導体部にめっき液を噴流させながら前記導体部に接続したカソード電極体とアノード間に電流を流してめっきする噴流めっき装置である。そして、前記カソード電極体は固定カソード電極部と給電電極部とに分割され、前記固定カソード電極部はカソード固定支持部に支持され、前記給電電極部は昇降給電部で昇降自在に支持され、前記固定カソード電極部の前記被めっき物の導体部に接触する部分が少なくとも交換自在であり、前記昇降給電部の下降時に前記給電電極部が前記固定カソード電極部に接触して給電することを特徴としている。 In order to achieve the above-mentioned object, the present invention arranges the conductor portion of the object to be plated downward on the opening side of the jet plating tank for generating a jet of the plating solution, and jets the plating solution to the conductor portion while This is a jet plating apparatus for plating by flowing current between a cathode electrode body connected to a conductor portion and an anode. The cathode electrode body is divided into a fixed cathode electrode portion and a feeding electrode portion, the fixed cathode electrode portion is supported by a cathode fixing support portion, and the feeding electrode portion is supported by a lifting and lowering feeding portion so as to be raised and lowered. The portion of the fixed cathode electrode portion that contacts the conductor portion of the object to be plated is at least replaceable, and the power supply electrode portion contacts the fixed cathode electrode portion to supply power when the elevating power supply portion is lowered. Yes.

前記噴流めっき装置において、前記固定カソード電極部は固定導電ブロックと、該固定導電ブロックに対して例えば螺子等により交換自在に取り付けられていて、前記被めっき物の導体部に接触する交換電極部材とを有している構成であってもよい。 In the jet plating apparatus, the fixed cathode electrode portion is fixedly attached to the fixed conductive block, for example, by a screw or the like, and exchange electrode members that contact the conductor portion of the object to be plated, The structure which has this may be sufficient.

前記噴流めっき装置において、前記昇降給電部が前記被めっき物を上から押さえる押さえ板に設けられているとよい。 In the jet plating apparatus, the elevating power feeding unit may be provided on a pressing plate that presses the object to be plated from above.

前記アノードが噴流めっき槽に固定され、該噴流めっき槽に前記カソード固定支持部が取り付けられているとよい。 The anode may be fixed to a jet plating tank, and the cathode fixing support portion may be attached to the jet plating tank.

前記噴流めっき槽内の前記アノードの下方位置に分散板が設けられているとよい。 A dispersion plate may be provided at a position below the anode in the jet plating tank.

前記噴流めっき装置において、前記噴流めっき槽から排出されためっき液を汲み上げて前記噴流めっき槽に供給する手段を更に備えるとよい。例えば、前記噴流めっき槽から排出されためっき液を受ける受け槽と、該受け槽の底部を貫通して受け槽の底面よりも高く突出しためっき液戻り管と、前記受け槽よりも低い位置で前記めっき液戻り管で戻されためっき液を受ける静液槽と、該静液槽からポンプで汲み上げられためっき液を前記噴流めっき槽に供給するめっき液供給管とを更に備える構成としてもよい。 The jet plating apparatus may further include means for pumping the plating solution discharged from the jet plating tank and supplying the pump to the jet plating tank. For example, a receiving tank that receives the plating solution discharged from the jet plating tank, a plating solution return pipe that passes through the bottom of the receiving tank and protrudes higher than the bottom surface of the receiving tank, and a position lower than the receiving tank. It is good also as a structure further provided with the still solution tank which receives the plating solution returned with the said plating solution return pipe, and the plating solution supply pipe which supplies the plating solution pumped up from the said still solution tank with the pump to the said jet plating tank .

前記静液槽内に、仕切り板が前記めっき液供給管の接続口近傍、又は前記めっき液戻り管と前記接続口間に位置するように設けられているとよい。これにより、消泡の効果がある。 A partition plate may be provided in the still liquid tank so as to be positioned in the vicinity of the connection port of the plating solution supply pipe or between the plating solution return pipe and the connection port. This has the effect of defoaming.

本発明に係る噴流めっき装置によれば、被めっき物の導体部に接続するカソード電極体を、固定カソード電極部と給電電極部とに分割し、前記固定カソード電極部の前記被めっき物の導体部に接触する部分を少なくとも交換自在にしており、被めっき物の品種切換毎に要するカソード電極体の交換部材の最小化、交換作業の簡素化を図ることができ、コスト削減及び製造リードタイムの短縮に寄与可能である。 According to the jet plating apparatus according to the present invention, the cathode electrode body connected to the conductor portion of the object to be plated is divided into the fixed cathode electrode portion and the feeding electrode portion, and the conductor of the object to be plated of the fixed cathode electrode portion. The part that contacts the part can be exchanged at least, minimizing the replacement member of the cathode electrode body required every time the product type is switched, and simplifying the replacement work, reducing costs and manufacturing lead time. It can contribute to shortening.

更に、めっき液の循環経路においてめっき液中に含まれる気泡を除去する機構を設けるようにすれば、すなわち、噴流めっき槽から排出されためっき液を受ける受け槽と、該受け槽の底部を貫通して受け槽の底面よりも高く突出しためっき液戻り管と、前記受け槽よりも低い位置で前記めっき液戻り管で戻されためっき液を受ける静液槽とを備える場合、めっき液中の気泡を効果的、効率的に消去でき、気泡付着に起因するめっき不良を除去し、被めっき面全体のめっき均一化を図ることができ、品質向上を図ることが可能である。 Furthermore, if a mechanism for removing bubbles contained in the plating solution is provided in the circulation path of the plating solution, that is, a receiving tank for receiving the plating solution discharged from the jet plating tank and a bottom portion of the receiving tank are passed through. And a plating solution return pipe that protrudes higher than the bottom surface of the receiving tank, and a still solution tank that receives the plating solution returned by the plating solution return pipe at a position lower than the receiving tank, Air bubbles can be effectively and efficiently erased, defective plating due to air bubble adhesion can be removed, plating can be uniformly applied to the entire surface to be plated, and quality can be improved.

以下、本発明を実施するための最良の形態として、噴流めっき装置の実施の形態を図面に従って説明する。 Hereinafter, as a best mode for carrying out the present invention, an embodiment of a jet plating apparatus will be described with reference to the drawings.

図１〜図３を用いて本発明に係る噴流めっき装置の実施の形態を説明する。噴流めっき装置は、被めっき物としての被めっき基板１の導体部を下向きとして、カソード電極体３０を分割した固定側の固定カソード電極部３１にて支持するフェースダウン方式であり、カソード電極体３０を分割した可動側の給電電極部４０は押さえ板２０に設けられている。そして、被めっき基板１の導体部にめっき液Ｒ１を噴流させながらアノード電極５、被めっき基板１の導体部、これに電気的に接続する固定カソード電極部３１、押さえ板２０の下降時に前記固定カソード電極部３１に電気的に接続する給電電極部４０の経路にてめっき電流を流すことにより被めっき基板１の導体部に電解めっきを施す構成である（なお、図１は押さえ板２０が上昇した状態を図示している）。 An embodiment of a jet plating apparatus according to the present invention will be described with reference to FIGS. The jet plating apparatus is a face-down system in which the conductor part of the substrate 1 to be plated as the object to be plated is faced down and is supported by the fixed cathode electrode part 31 on the fixed side obtained by dividing the cathode electrode body 30. The movable-side power supply electrode portion 40 obtained by dividing the above is provided on the pressing plate 20. The anode electrode 5, the conductor portion of the substrate 1 to be plated, the fixed cathode electrode portion 31 electrically connected thereto, and the holding plate 20 are fixed while the plating solution R 1 is jetted to the conductor portion of the substrate 1. In this configuration, the plating portion is subjected to electrolytic plating by flowing a plating current through the path of the feeding electrode portion 40 electrically connected to the cathode electrode portion 31 (in FIG. 1, the pressing plate 20 is raised). Is shown).

めっき液の噴流を発生するための噴流めっき槽１０の最上部は固定カソード電極部３１を保持するカソード固定支持部１５となっている。固定カソード電極部３１は固定導電ブロック３２と、固定導電ブロック３２に対して螺子３３により交換自在に取り付けられていて、被めっき基板１の導体部に接触する交換電極部材３４（例えば略Ｌ字形状である）とを有している。固定導電ブロック３２は常にカソード固定支持部１５に固定されている。ここで、被めっき基板１の導体部パターンが変わるときに交換する必要があるのは、被めっき基板１の導体部パターンに対応した形状の交換電極部材３４に限られる。 The uppermost portion of the jet plating tank 10 for generating a jet of plating solution is a cathode fixed support portion 15 that holds a fixed cathode electrode portion 31. The fixed cathode electrode portion 31 is attached to the fixed conductive block 32 and the fixed conductive block 32 by screws 33 so as to be exchangeable, and an exchange electrode member 34 (for example, substantially L-shaped) that contacts the conductor portion of the substrate 1 to be plated. ). The fixed conductive block 32 is always fixed to the cathode fixing support portion 15. Here, what needs to be replaced when the conductor pattern of the substrate 1 to be plated changes is limited to the exchange electrode member 34 having a shape corresponding to the conductor pattern of the substrate 1 to be plated.

噴流されるめっき液Ｒ１により、固定カソード電極部３１へめっき膜が形成されたり、被めっき基板１の側面や裏面が金属汚染されたりすることのないように、交換電極部材３４の内周側にはゴム等の弾性体シール３５が、下側には、補強用絶縁板３６を介してゴム等の弾性体シール３７がそれぞれ配設される。 On the inner peripheral side of the exchange electrode member 34, the plating film R <b> 1 that is jetted does not form a plating film on the fixed cathode electrode portion 31 and the side surface and back surface of the substrate 1 to be plated are not contaminated with metal. An elastic seal 35 made of rubber or the like is disposed on the lower side, and an elastic seal 37 made of rubber or the like is disposed on the lower side via a reinforcing insulating plate 36.

前記押さえ板２０は、図示しないエアーシリンダ等で昇降自在であり、めっきの作業中に被めっき基板１が、浮き上がったり、反ったり、撓んだりすることのないように、固定カソード電極部３１で支持された被めっき基板１の上面に下降して圧接する。 The pressing plate 20 can be moved up and down by an air cylinder (not shown) or the like, and the fixed cathode electrode portion 31 prevents the substrate 1 to be plated from being lifted, warped or bent during the plating operation. It descends and presses onto the upper surface of the supported substrate 1 to be plated.

また、前記押さえ板２０には、図３のように、圧縮ばね（コイルばね）２１及び給電電極部４０を有する昇降給電部４５が、例えば４箇所に設けられている。 Further, as shown in FIG. 3, the holding plate 20 is provided with elevating and lowering power supply portions 45 having compression springs (coil springs) 21 and power supply electrode portions 40 at, for example, four locations.

めっき動作のために前記押さえ板２０が下降して被めっき基板１を押さえた状態となると、各昇降給電部４５の給電電極部４０は押さえ板２０に対して下方に突出する向きに独立懸架式に圧縮ばね（コイルばね）２１で付勢されているため、給電電極部４０が固定導電ブロック３２に押圧接触し、電気的接続が行われる。この結果、給電電極部４０を介して固定カソード電極部３１に直流電圧が給電される。なお、固定導電ブロック３２と給電電極部４０の接触部は被めっき基板１の種類にかかわらず共通構造とする。 When the pressing plate 20 is lowered to press the substrate to be plated 1 for the plating operation, the feeding electrode portion 40 of each lifting power feeding portion 45 is independently suspended so as to protrude downward with respect to the pressing plate 20. Since the compression spring (coil spring) 21 is urged, the power supply electrode portion 40 comes into pressure contact with the fixed conductive block 32 and electrical connection is made. As a result, a DC voltage is supplied to the fixed cathode electrode portion 31 via the power supply electrode portion 40. The contact portion between the fixed conductive block 32 and the feeding electrode portion 40 has a common structure regardless of the type of the substrate 1 to be plated.

また、前記噴流めっき槽１０には、めっき液Ｒ１の噴出孔（貫通孔）１１ａを備えた分散板１１、めっき液Ｒ１の噴出孔（貫通孔）１２ａを備えた分散板１２、めっき液Ｒ１の噴出孔（貫通孔）５ａを備えたアノード電極５がそれぞれ噴流めっき槽１０の下部方向から順に水平に配置、固定されている。各分散板１１，１２は被めっき基板１の被めっき面に対応した広範囲の噴流を作成するために設けられる。噴流めっき槽１０の底部に設けられためっき液供給管１３から噴出しためっき液Ｒ１は、噴出孔１１ａ、噴出孔１２ａ、噴出孔５ａを通過し、被めっき基板１の導体部に噴流となって当たる（接触する）。そして、めっき作用に使われた後のめっき液Ｒ２は、固定カソード電極部３１を保持する噴流めっき槽１０のカソード固定支持部１５とアノード電極５の間に形成された流出口１４から排出され、噴流めっき槽１０の周囲を囲む受け槽（上槽）５０にて貯留される。 The jet plating tank 10 includes a dispersion plate 11 provided with a spray hole (through hole) 11a for the plating solution R1, a dispersion plate 12 provided with a spray hole (through hole) 12a for the plating solution R1, and a plating solution R1. The anode electrode 5 provided with the ejection hole (through-hole) 5a is horizontally arrange | positioned and fixed in order from the lower part direction of the jet plating tank 10, respectively. Each of the dispersion plates 11 and 12 is provided to create a wide range of jets corresponding to the surface to be plated of the substrate 1 to be plated. The plating solution R1 ejected from the plating solution supply pipe 13 provided at the bottom of the jet plating tank 10 passes through the ejection hole 11a, the ejection hole 12a, and the ejection hole 5a, and becomes a jet on the conductor portion of the substrate 1 to be plated. Hit (contact). Then, the plating solution R2 after being used for the plating action is discharged from the outlet 14 formed between the cathode fixing support portion 15 of the jet plating tank 10 holding the fixed cathode electrode portion 31 and the anode electrode 5, It is stored in a receiving tank (upper tank) 50 surrounding the jet plating tank 10.

そして、図２のように受け槽５０で貯留されためっき液Ｒ２の気泡の少ない上澄み液は、受け槽５０の底部を貫通して受け槽底面よりも高く突出しためっき液戻り管５１を経由して下方位置の静液槽（下槽）６０に戻される（重力で流れ落ちる）。静液槽６０の側面にはめっき液供給管１３の一端が接続され、他端が受け槽５０を貫通して噴流めっき槽１０の底部に接続される。また、静液槽６０内に、仕切り板６２がめっき液供給管１３の接続口近傍で、めっき液戻り管５１と前記接続口間に位置するように略垂直に設けられている。この仕切り板６２は、気泡を含んだめっき液が直接めっき液供給管１３に入り込まないようにする。めっき液供給管１３の途中にはポンプ７０とフィルタ７５が挿入されており、静液槽６０に貯留されためっき液Ｒ２はポンプ７０で汲み上げられ、フィルタ７５で浮遊物が除去されてめっき液Ｒ１として噴流めっき槽１０に送出されることになる。 Then, as shown in FIG. 2, the supernatant liquid with less bubbles of the plating solution R2 stored in the receiving tank 50 passes through the plating solution return pipe 51 that penetrates the bottom of the receiving tank 50 and protrudes higher than the bottom surface of the receiving tank. And returned to the still liquid tank (lower tank) 60 at the lower position (flows down due to gravity). One end of the plating solution supply pipe 13 is connected to the side surface of the hydrostatic bath 60, and the other end passes through the receiving bath 50 and is connected to the bottom of the jet plating bath 10. In addition, a partition plate 62 is provided in the still liquid tank 60 in the vicinity of the connection port of the plating solution supply pipe 13 so as to be positioned between the plating solution return pipe 51 and the connection port. The partition plate 62 prevents the plating solution containing bubbles from directly entering the plating solution supply pipe 13. A pump 70 and a filter 75 are inserted in the middle of the plating solution supply pipe 13, and the plating solution R2 stored in the still liquid bath 60 is pumped up by the pump 70, and the suspended matter is removed by the filter 75 to remove the plating solution R1. Will be sent to the jet plating tank 10.

この実施の形態に示した噴流めっき装置の全体的な動作説明を行う。 The overall operation of the jet plating apparatus shown in this embodiment will be described.

まず、噴流めっき槽１０の上部開口を塞ぐように被めっき基板１を配置し、固定カソード電極部３１にて被めっき基板１を下方から支持する。このとき固定カソード電極部３１の一部を構成する交換電極部材３４が被めっき基板１の導体部に電気的に接続した状態となる。次いで、押さえ板２０が下降して被めっき基板１を上から押さえる。このとき、給電電極部４０が固定カソード電極部３１の固定導電ブロック３２に接触して、直流電圧が給電される。すなわち、アノード電極５は図示しない配線により直流電源の正側に接続されており、被めっき基板１下面の導体部は、交換電極部材３４、固定導電ブロック３２、給電電極部４０の経路で直流電源の負側に接続される。 First, the substrate to be plated 1 is disposed so as to close the upper opening of the jet plating tank 10, and the substrate to be plated 1 is supported from below by the fixed cathode electrode portion 31. At this time, the exchange electrode member 34 constituting a part of the fixed cathode electrode portion 31 is electrically connected to the conductor portion of the substrate 1 to be plated. Next, the pressing plate 20 is lowered to press the substrate 1 to be plated from above. At this time, the feeding electrode unit 40 comes into contact with the fixed conductive block 32 of the fixed cathode electrode unit 31 and a DC voltage is fed. That is, the anode electrode 5 is connected to the positive side of the DC power supply by a wiring (not shown), and the conductor part on the lower surface of the substrate 1 to be plated is connected to the DC power supply through the path of the exchange electrode member 34, the fixed conductive block 32, and the feeding electrode part 40. Connected to the negative side of

この状態でポンプ７０を作動させることにより、めっき液Ｒ１は噴流めっき槽１０の内部に入り分散板１１の噴出孔１１ａ、分散板１２の噴出孔１２ａ、アノード電極５の噴出孔５ａを通過して噴流となって被めっき基板１の下面に当たり、アノード電極５側からカソード側となる被めっき基板１の導体部に電流を流すことで所定の電解めっきが行われる。 By operating the pump 70 in this state, the plating solution R1 enters the jet plating tank 10 and passes through the ejection holes 11a of the dispersion plate 11, the ejection holes 12a of the dispersion plate 12, and the ejection holes 5a of the anode electrode 5. Predetermined electroplating is performed by causing a current to flow from the anode electrode 5 side to the conductor portion of the substrate to be plated 1 on the cathode side as a jet that hits the lower surface of the substrate to be plated 1.

めっき作用に使われためっき液Ｒ２は、噴流めっき槽１０の流出口１４から溢れて受け槽５０に一時的に溜まる。このようにめっき液Ｒ２を一時溜めて静止状態とすることで、めっき液Ｒ２中の気泡の減少を図ることができる。消泡されためっき液Ｒ２の上澄み液は、めっき液戻り管５１を落下して静液槽６０に溜められる。この静液槽６０においても、めっき液Ｒ２を溜めて静止状態とすることでめっき液Ｒ２中の気泡の減少を図り、併せて消泡用仕切り板６２で気泡を含んだめっき液が直接めっき液供給管１３に入り込まないようにしている。このようにして、めっき液中の気泡を除去させながらめっき液を循環使用している。 The plating solution R2 used for the plating action overflows from the outlet 14 of the jet plating tank 10 and temporarily accumulates in the receiving tank 50. In this way, by temporarily storing the plating solution R2 to be in a stationary state, it is possible to reduce the bubbles in the plating solution R2. The defoamed plating solution R2 supernatant falls in the plating solution return pipe 51 and is stored in the still solution bath 60. Also in this still solution tank 60, the plating solution R2 is accumulated to be in a stationary state, thereby reducing the bubbles in the plating solution R2, and the plating solution containing the bubbles is directly applied to the plating solution by the defoaming partition plate 62. The supply pipe 13 is prevented from entering. In this way, the plating solution is circulated and used while removing bubbles in the plating solution.

この実施の形態によれば、次の通りの効果を得ることができる。 According to this embodiment, the following effects can be obtained.

(1) 被めっき物としての被めっき基板１の導体部に接続するカソード電極体３０を、固定カソード電極部３１と給電電極部４０とに分割し、固定カソード電極部３１の被めっき基板１の導体部に接触する部分を交換電極部材３４として交換自在にしている。このため、被めっき基板１の品種切換によってカソード側パターン（被めっき基板１への接触面パターン）の変更が必要となっても、交換電極部材３４の交換で済む。この結果、被めっき基板１の品種切換毎に要するカソード電極体の交換部分の最小化、交換作業の簡素化（単なる螺子外し及び螺子止めで済む）を図ることができ、コスト削減及び製造リードタイムの短縮に寄与可能である。なお、交換電極部材３４の交換に伴い、弾性体シール３５も必要に応じて交換する場合もある。 (1) A cathode electrode body 30 connected to a conductor portion of a substrate 1 to be plated as an object to be plated is divided into a fixed cathode electrode portion 31 and a feeding electrode portion 40, and the substrate 1 to be plated of the fixed cathode electrode portion 31 is separated. A portion in contact with the conductor is exchangeable as an exchange electrode member 34. For this reason, even if it is necessary to change the cathode side pattern (contact surface pattern to the substrate 1 to be plated) by changing the type of the substrate 1 to be plated, the replacement electrode member 34 can be replaced. As a result, it is possible to minimize the replacement part of the cathode electrode body required every time the product type of the substrate to be plated 1 is switched, simplify the replacement work (simply remove screws and screws), reduce costs and manufacture lead time. It can contribute to shortening. Note that the elastic body seal 35 may be replaced as necessary with replacement of the replacement electrode member 34.

(2) めっきに使用された後に噴流めっき槽１０から流出しためっき液Ｒ２を上槽となる受け槽５０で受けて一旦貯留することで消泡を図り、さらに受け槽５０の上澄み液を、受け槽５０底面より高く突出しためっき液戻り管５１を通して下槽となる静液槽６０に戻して静止状態で貯留することで消泡を図っている。また、静液槽６０内に、消泡用仕切り板６２をめっき液供給管１３の接続口近傍（めっき液戻り管５１と前記接続口間）に設けているため、気泡を含んだめっき液が直接めっき液供給管１３に入り込まないようにすることができる。これらの構成により、めっき液中の気泡、泡溜まりを効果的、効率的に消去でき、気泡が被めっき基板１に付着することに起因してめっき液が被めっき基板１に非接触となる現象の防止、気泡によるめっき不良の防止、被めっき面のめっき膜厚のばらつき発生の防止が可能である。すなわち、被めっき面全体のめっき膜厚の均一化が可能であり、品質向上が可能である。 (2) The plating solution R2 that has flowed out of the jet plating tank 10 after being used for plating is received in the receiving tank 50, which is the upper tank, and temporarily stored for defoaming, and the supernatant liquid of the receiving tank 50 is received. Defoaming is achieved by returning to the still liquid tank 60 which is a lower tank through the plating solution return pipe 51 protruding higher than the bottom of the tank 50 and storing it in a stationary state. In addition, since the defoaming partition plate 62 is provided in the vicinity of the connection port of the plating solution supply pipe 13 (between the plating solution return pipe 51 and the connection port) in the still solution tank 60, the plating solution containing bubbles is removed. It is possible not to enter the plating solution supply pipe 13 directly. With these configurations, bubbles and bubble pools in the plating solution can be effectively and efficiently erased, and the plating solution does not contact the substrate 1 to be plated due to the bubbles adhering to the substrate 1 to be plated. Prevention of plating defects due to bubbles and the occurrence of variations in the plating film thickness of the surface to be plated can be prevented. That is, the plating film thickness on the entire surface to be plated can be made uniform, and quality can be improved.

(3) 被めっき物としての被めっき基板１の導体部に接続するカソード電極体３０を、固定カソード電極部３１と給電電極部４０とに分割することにより、被めっき基板１を噴流めっき槽１０に取り付けたり、取り外したりする時に、押さえ板２０を上昇位置にすると、押さえ板２０と一体的に給電電極部４０を有する昇降給電部４５も上昇位置となるため、固定カソード電極部３１側に電圧が印加されない状態になり、作業安全面で好都合である。 (3) The cathode electrode body 30 connected to the conductor portion of the substrate 1 to be plated as an object to be plated is divided into the fixed cathode electrode portion 31 and the feeding electrode portion 40, whereby the substrate 1 to be plated is jet-plated bath 10. When the presser plate 20 is set to the raised position when attaching to or detaching from the base plate, the elevating power feeding unit 45 having the power supply electrode unit 40 integrally with the presser plate 20 is also in the raised position. This is convenient in terms of work safety.

以上本発明の実施の形態について説明してきたが、本発明はこれに限定されることなく請求項の記載の範囲内において各種の変形、変更が可能なことは当業者には自明であろう。 Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.

本発明に係る噴流めっき装置の実施の形態であって、噴流めっき槽及びその周辺構成を示す正断面図である。It is embodiment of the jet plating apparatus which concerns on this invention, Comprising: It is a front sectional view which shows a jet plating tank and its periphery structure. 実施の形態の全体構成を示す説明図である。It is explanatory drawing which shows the whole structure of embodiment. 実施の形態における押さえ板部分の平面図である。It is a top view of the pressing board part in embodiment.

符号の説明Explanation of symbols

１被めっき基板
５アノード電極
１０噴流めっき槽
１１，１２分散板
１３めっき液供給管
１４流出口
１５カソード固定支持部
２０押さえ板
２１圧縮ばね
３０カソード電極体
３１固定カソード電極部
３２固定導電ブロック
３３螺子
３４交換電極部材
３５，３７弾性体シール
３６絶縁板
４０給電電極部
４５昇降給電部
５０受け槽
５１めっき液戻り管
６０静液槽
６２消泡用仕切り板
７０ポンプ
７５フィルタ
Ｒ１，Ｒ２めっき液 DESCRIPTION OF SYMBOLS 1 Substrate to be plated 5 Anode electrode 10 Jet plating tank 11, 12 Dispersion plate 13 Plating solution supply pipe 14 Outlet 15 Cathode fixing support portion 20 Press plate 21 Compression spring 30 Cathode electrode body 31 Fixed cathode electrode portion 32 Fixed conductive block 33 Screw 34 Replacement electrode member 35, 37 Elastic body seal 36 Insulating plate 40 Power supply electrode part 45 Lifting power supply part 50 Receiving tank 51 Plating solution return pipe 60 Still liquid tank 62 Defoaming partition plate 70 Pump 75 Filter R1, R2 Plating solution

Claims

めっき液の噴流を発生させる噴流めっき槽の開口側に、被めっき物の導体部を下向きとして配置し、前記導体部にめっき液を噴流させながら前記導体部に接続したカソード電極体とアノード間に電流を流してめっきする噴流めっき装置であって、
前記カソード電極体は固定カソード電極部と給電電極部とに分割され、前記固定カソード電極部はカソード固定支持部に支持され、前記給電電極部は昇降給電部で昇降自在に支持され、前記固定カソード電極部の前記被めっき物の導体部に接触する部分が少なくとも交換自在であり、前記昇降給電部の下降時に前記給電電極部が前記固定カソード電極部に接触して給電することを特徴とする噴流めっき装置。 On the opening side of the jet plating tank that generates a jet of plating solution, the conductor part of the object to be plated is arranged facing downward, and between the cathode electrode body connected to the conductor part and the anode while jetting the plating solution to the conductor part A jet plating apparatus for plating by passing an electric current,
The cathode electrode body is divided into a fixed cathode electrode portion and a feeding electrode portion, the fixed cathode electrode portion is supported by a cathode fixing support portion, and the feeding electrode portion is supported by a lifting and lowering feeding portion so as to be raised and lowered. A portion of the electrode portion that contacts the conductor portion of the object to be plated is at least exchangeable, and the power supply electrode portion contacts the fixed cathode electrode portion to supply power when the lifting power supply portion is lowered. Plating equipment.

前記固定カソード電極部は固定導電ブロックと、該固定導電ブロックに対して交換自在に取り付けられていて、前記被めっき物の導体部に接触する交換電極部材とを有している請求項１記載の噴流めっき装置。 2. The fixed cathode electrode portion includes a fixed conductive block, and an exchange electrode member that is attached to the fixed conductive block so as to be exchangeable and contacts a conductor portion of the object to be plated. Jet plating equipment.

前記昇降給電部が前記被めっき物を上から押さえる押さえ板に設けられている請求項１又は２記載の噴流めっき装置。 3. The jet plating apparatus according to claim 1, wherein the elevating power supply unit is provided on a pressing plate that presses the object to be plated from above.

前記アノードが前記噴流めっき槽に固定され、該噴流めっき槽に前記カソード固定支持部が取り付けられている請求項１，２又は３記載の噴流めっき装置。 4. The jet plating apparatus according to claim 1, wherein the anode is fixed to the jet plating tank, and the cathode fixing support portion is attached to the jet plating tank.

前記噴流めっき槽内の前記アノードの下方位置に分散板が設けられている請求項１，２３又は４記載の噴流めっき装置。 The jet plating apparatus according to claim 1, 23 or 4, wherein a dispersion plate is provided at a position below the anode in the jet plating tank.

前記噴流めっき槽から排出されためっき液を汲み上げて前記噴流めっき槽に供給する手段を更に備える請求項１，２，３，４又は５記載の噴流めっき装置。 The jet plating apparatus according to claim 1, 2, 3, 4 or 5, further comprising means for pumping up the plating solution discharged from the jet plating tank and supplying it to the jet plating tank.

前記噴流めっき槽から排出されためっき液を受ける静液槽内に、仕切り板がめっき液供給管の接続口近傍、又はめっき液戻り管と前記接続口間に位置するように設けられている請求項６記載の噴流めっき装置。 The partition plate is provided in the still liquid tank that receives the plating solution discharged from the jet plating tank so that the partition plate is located near the connection port of the plating solution supply pipe or between the plating solution return pipe and the connection port. Item 6. The jet plating apparatus according to Item 6.