JP2006050354A - 電子回路 - Google Patents
電子回路 Download PDFInfo
- Publication number
- JP2006050354A JP2006050354A JP2004229941A JP2004229941A JP2006050354A JP 2006050354 A JP2006050354 A JP 2006050354A JP 2004229941 A JP2004229941 A JP 2004229941A JP 2004229941 A JP2004229941 A JP 2004229941A JP 2006050354 A JP2006050354 A JP 2006050354A
- Authority
- JP
- Japan
- Prior art keywords
- transmission
- current
- transmission coil
- coil
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 72
- 239000003990 capacitor Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000004891 communication Methods 0.000 abstract description 9
- 230000008878 coupling Effects 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 abstract description 5
- 238000005859 coupling reaction Methods 0.000 abstract description 5
- 230000001939 inductive effect Effects 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract description 2
- 239000000872 buffer Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/22—Capacitive coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B7/00—Radio transmission systems, i.e. using radiation field
- H04B7/02—Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
- H04B7/10—Polarisation diversity; Directional diversity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/03—Shaping networks in transmitter or receiver, e.g. adaptive shaping networks
- H04L25/03006—Arrangements for removing intersymbol interference
- H04L25/03178—Arrangements involving sequence estimation techniques
- H04L25/03248—Arrangements for operating in conjunction with other apparatus
- H04L25/03254—Operation with other circuitry for removing intersymbol interference
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Near-Field Transmission Systems (AREA)
- Dc Digital Transmission (AREA)
- Logic Circuits (AREA)
Abstract
【解決手段】送信データTxdataがローからハイになると、トランジスタT1はオフからオンになると共に、トランジスタT2はオンからオフになり、送信コイル14には電流ITが流れコンデンサ15を充電する。コンデンサ15が十分に充電されると電流ITは止まり、結局、送信コイル14には三角波形状のパルス電流が流れることになる。つぎに、送信データTxdataがハイからローになると、送信コイル14には電流ITが逆に流れコンデンサ15を放電し、送信コイル14には逆極性の三角波形状のパルス電流が流れることになる。逆極性のパルス電流を流すのにコンデンサ15の放電を用いていて、電源電流を用いていないので、節電ができる。
【選択図】図1
Description
12 NAND
13 NOR
14 送信コイル
15 コンデンサ
21 送信回路
22 送信コイル
23 受信コイル
24 受信回路
25 電流計
31 LSIチップ
32 送信回路
33 送信コイル
34 受信回路
35 受信コイル
41 遅延バッファ
42 送信コイル
T1、T2、T7〜T10 トランジスタ
Txdata 送信データ
Claims (3)
- 送信信号に応じて第1基準電位又は第2基準電位を出力する選択回路と、該選択回路の出力と前記第1電位との間にコンデンサと基板上の配線により形成される送信コイルとを直列に接続して有する第1基板と、
基板上の配線により前記送信コイルと対応する位置に形成され前記送信コイルと誘導結合する受信コイルを有する第2基板と
を備えることを特徴とする電子回路。 - 前記選択回路は、CMOS構造のトランジスタから成ることを特徴とする請求項1記載の電子回路。
- 前記選択回路は、前記送信コイルが信号を送信していない間は送信コイルを開放することを特徴とする請求項1又は2記載の電子回路。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004229941A JP4677598B2 (ja) | 2004-08-05 | 2004-08-05 | 電子回路 |
US11/659,111 US20090057039A1 (en) | 2004-08-05 | 2005-08-01 | Electronic circuit |
PCT/JP2005/014063 WO2006013835A1 (ja) | 2004-08-05 | 2005-08-01 | 電子回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004229941A JP4677598B2 (ja) | 2004-08-05 | 2004-08-05 | 電子回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006050354A true JP2006050354A (ja) | 2006-02-16 |
JP4677598B2 JP4677598B2 (ja) | 2011-04-27 |
Family
ID=35787120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004229941A Active JP4677598B2 (ja) | 2004-08-05 | 2004-08-05 | 電子回路 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090057039A1 (ja) |
JP (1) | JP4677598B2 (ja) |
WO (1) | WO2006013835A1 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2007029435A1 (ja) * | 2005-09-02 | 2009-03-12 | 日本電気株式会社 | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
US7546106B2 (en) | 2004-12-15 | 2009-06-09 | Keio University | Electronic circuit |
US8005119B2 (en) | 2008-02-02 | 2011-08-23 | Keio University | Integrated circuit |
US8054871B2 (en) | 2008-03-27 | 2011-11-08 | Renesas Electronics Corporation | Semiconductor device and semiconductor integrated circuit |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8276822B2 (en) | 2008-04-28 | 2012-10-02 | Keio University | Electronic circuit |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
JP5187310B2 (ja) * | 2007-09-12 | 2013-04-24 | 日本電気株式会社 | データ伝送装置およびデータ伝送方法 |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8588683B2 (en) | 2010-11-19 | 2013-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Electronic circuit, semiconductor device, and electronic device |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
US9053950B2 (en) | 2007-11-26 | 2015-06-09 | Keio University | Electronic circuit |
US9979441B2 (en) | 2008-06-03 | 2018-05-22 | Thruchip Japan Inc. | Inductive relayed coupling circuit between substrates |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5283075B2 (ja) | 2008-12-26 | 2013-09-04 | 学校法人慶應義塾 | 電子回路 |
US9431168B2 (en) * | 2012-06-13 | 2016-08-30 | Advanced Micro Devices, Inc. | Contactless interconnect |
US9509375B2 (en) * | 2013-08-01 | 2016-11-29 | SK Hynix Inc. | Wireless transceiver circuit with reduced area |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5701037A (en) * | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
JPH08149054A (ja) * | 1994-11-25 | 1996-06-07 | Japan Aviation Electron Ind Ltd | 非接触コネクタ、このコネクタを使用する信号送受信方法およびこの方法を実施する装置 |
JPH09171541A (ja) * | 1995-12-19 | 1997-06-30 | Tokimec Inc | 通信装置 |
JP3258923B2 (ja) * | 1997-02-26 | 2002-02-18 | 株式会社東芝 | 半導体集積回路装置 |
FR2791493B1 (fr) * | 1999-03-25 | 2001-06-08 | Inside Technologies | Circuit d'emission/reception de donnees par couplage inductif |
JP3575340B2 (ja) * | 1999-07-28 | 2004-10-13 | 株式会社日本自動車部品総合研究所 | Ask変調波を用いた送信機 |
US6807109B2 (en) * | 2001-12-05 | 2004-10-19 | Renesas Technology Corp. | Semiconductor device suitable for system in package |
-
2004
- 2004-08-05 JP JP2004229941A patent/JP4677598B2/ja active Active
-
2005
- 2005-08-01 US US11/659,111 patent/US20090057039A1/en not_active Abandoned
- 2005-08-01 WO PCT/JP2005/014063 patent/WO2006013835A1/ja active Application Filing
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7546106B2 (en) | 2004-12-15 | 2009-06-09 | Keio University | Electronic circuit |
US8190086B2 (en) | 2005-09-02 | 2012-05-29 | Nec Corporation | Transmission method, interface circuit, semiconductor device, semiconductor package, semiconductor module and memory module |
JPWO2007029435A1 (ja) * | 2005-09-02 | 2009-03-12 | 日本電気株式会社 | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
JP4784773B2 (ja) * | 2005-09-02 | 2011-10-05 | 日本電気株式会社 | 伝送方法、インターフェース回路、半導体装置、半導体パッケージ、半導体モジュールおよびメモリモジュール |
JP5187310B2 (ja) * | 2007-09-12 | 2013-04-24 | 日本電気株式会社 | データ伝送装置およびデータ伝送方法 |
US9053950B2 (en) | 2007-11-26 | 2015-06-09 | Keio University | Electronic circuit |
US8005119B2 (en) | 2008-02-02 | 2011-08-23 | Keio University | Integrated circuit |
US8054871B2 (en) | 2008-03-27 | 2011-11-08 | Renesas Electronics Corporation | Semiconductor device and semiconductor integrated circuit |
US8276822B2 (en) | 2008-04-28 | 2012-10-02 | Keio University | Electronic circuit |
US8704627B2 (en) | 2008-05-14 | 2014-04-22 | Keio University | Inductor element, integrated circuit device, and three-dimensional circuit device |
US9979441B2 (en) | 2008-06-03 | 2018-05-22 | Thruchip Japan Inc. | Inductive relayed coupling circuit between substrates |
US8283944B2 (en) | 2008-07-04 | 2012-10-09 | Keio University | Electronic circuit device |
US8564093B2 (en) | 2008-08-12 | 2013-10-22 | Keio University | Semiconductor device and manufacturing method therefor |
US8704609B2 (en) | 2008-10-21 | 2014-04-22 | Keio University | Electronic circuit |
US8611816B2 (en) | 2008-10-21 | 2013-12-17 | Keio University | Electronic circuit and communication functionality inspection method |
US8872609B2 (en) | 2009-02-25 | 2014-10-28 | Keio University | Inductor element and integrated circuit device |
KR20110134387A (ko) | 2009-02-25 | 2011-12-14 | 각고호우징 게이오기주크 | 인덕터 소자 및 집적 회로 장치 |
KR20120031164A (ko) | 2009-06-12 | 2012-03-30 | 각고호우징 게이오기주크 | 밀봉형 반도체 기록 매체 및 밀봉형 반도체 기록 장치 |
US8744349B2 (en) | 2009-10-15 | 2014-06-03 | Keio University | Multi-stack semiconductor integrated circuit device |
US8588683B2 (en) | 2010-11-19 | 2013-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Electronic circuit, semiconductor device, and electronic device |
Also Published As
Publication number | Publication date |
---|---|
WO2006013835A1 (ja) | 2006-02-09 |
US20090057039A1 (en) | 2009-03-05 |
JP4677598B2 (ja) | 2011-04-27 |
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