JP2006041924A - 圧電振動子収納用パッケージおよび圧電装置 - Google Patents
圧電振動子収納用パッケージおよび圧電装置 Download PDFInfo
- Publication number
- JP2006041924A JP2006041924A JP2004218905A JP2004218905A JP2006041924A JP 2006041924 A JP2006041924 A JP 2006041924A JP 2004218905 A JP2004218905 A JP 2004218905A JP 2004218905 A JP2004218905 A JP 2004218905A JP 2006041924 A JP2006041924 A JP 2006041924A
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- Prior art keywords
- piezoelectric vibrator
- piezoelectric
- wiring conductor
- insulating base
- semiconductor element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
【解決手段】 上側主面の中央部に半導体素子9の搭載部11を有し、上側主面の搭載部11から上側主面の外周部および下側主面にかけて第1の配線導体5−1が形成された第1の絶縁基体2と、下面の中央部に圧電振動子3を収容するための凹部12を有し、凹部12の内側から下面の外周部にかけて第2の配線導体5−2が形成された第2の絶縁基体1と、凹部12の内側に取着され、凹部12に収容される圧電振動子3を封止する蓋体4とを具備しており、第1の絶縁基体2の上側主面の外周部および第2の絶縁基体1の下面の外周部が接合されるとともに第1および第2の配線導体5−1,5−2が電気的に接続されている。
【選択図】 図1
Description
2・・・・・第1の絶縁基体
3・・・・・圧電振動子
4・・・・・蓋体
5・・・・・配線導体
5−1・・・・・第1の配線導体
5−2・・・・・第2の配線導体
11・・・・・搭載部
12・・・・・凹部
Claims (2)
- 上側主面の中央部に半導体素子の搭載部を有し、上側主面の前記搭載部から上側主面の外周部および下側主面にかけて第1の配線導体が形成された第1の絶縁基体と、下面の中央部に圧電振動子を収容するための凹部を有し、該凹部の内側から前記下面の外周部にかけて第2の配線導体が形成された第2の絶縁基体と、前記凹部の内側に取着され、前記凹部に収容される圧電振動子を封止する蓋体とを具備しており、前記第1の絶縁基体の上側主面の外周部および前記第2の絶縁基体の下面の外周部が接合されるとともに前記第1および第2の配線導体が電気的に接続されていることを特徴とする圧電振動子収納用パッケージ。
- 請求項1記載の圧電振動子収納用パッケージと、前記凹部内に収納されるとともに端部に形成された電極が前記第2の配線導体に電気的に接続された圧電振動子と、前記搭載部に搭載されるとともに電極が前記第1の配線導体に電気的に接続された半導体素子とを具備していることを特徴とする圧電装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004218905A JP4587726B2 (ja) | 2004-07-27 | 2004-07-27 | 圧電振動子収納用パッケージおよび圧電装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004218905A JP4587726B2 (ja) | 2004-07-27 | 2004-07-27 | 圧電振動子収納用パッケージおよび圧電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006041924A true JP2006041924A (ja) | 2006-02-09 |
JP4587726B2 JP4587726B2 (ja) | 2010-11-24 |
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JP2004218905A Expired - Fee Related JP4587726B2 (ja) | 2004-07-27 | 2004-07-27 | 圧電振動子収納用パッケージおよび圧電装置 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007251766A (ja) * | 2006-03-17 | 2007-09-27 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010034374A (ja) * | 2008-07-30 | 2010-02-12 | Denso Corp | 電子装置 |
JP2011035660A (ja) * | 2009-07-31 | 2011-02-17 | Kyocera Kinseki Corp | 圧電デバイス |
JP2012084669A (ja) * | 2010-10-08 | 2012-04-26 | Murata Mfg Co Ltd | 電子部品装置及びその製造方法 |
JP2015115403A (ja) * | 2013-12-10 | 2015-06-22 | 日本特殊陶業株式会社 | パッケージ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54161365A (en) * | 1978-06-09 | 1979-12-20 | Citizen Watch Co Ltd | Electronic watch |
JPH06283619A (ja) * | 1993-03-30 | 1994-10-07 | Nippon Steel Corp | 高周波回路素子およびその製造方法 |
JPH1051255A (ja) * | 1996-07-30 | 1998-02-20 | Kyocera Corp | 圧電共振装置の製造方法 |
JPH11308052A (ja) * | 1998-04-17 | 1999-11-05 | Toyo Commun Equip Co Ltd | 発振器の構造 |
JP2000278047A (ja) * | 1999-03-24 | 2000-10-06 | Nippon Dempa Kogyo Co Ltd | 表面実装用水晶発振器及びその製造方法 |
-
2004
- 2004-07-27 JP JP2004218905A patent/JP4587726B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54161365A (en) * | 1978-06-09 | 1979-12-20 | Citizen Watch Co Ltd | Electronic watch |
JPH06283619A (ja) * | 1993-03-30 | 1994-10-07 | Nippon Steel Corp | 高周波回路素子およびその製造方法 |
JPH1051255A (ja) * | 1996-07-30 | 1998-02-20 | Kyocera Corp | 圧電共振装置の製造方法 |
JPH11308052A (ja) * | 1998-04-17 | 1999-11-05 | Toyo Commun Equip Co Ltd | 発振器の構造 |
JP2000278047A (ja) * | 1999-03-24 | 2000-10-06 | Nippon Dempa Kogyo Co Ltd | 表面実装用水晶発振器及びその製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007251766A (ja) * | 2006-03-17 | 2007-09-27 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2010034374A (ja) * | 2008-07-30 | 2010-02-12 | Denso Corp | 電子装置 |
JP2011035660A (ja) * | 2009-07-31 | 2011-02-17 | Kyocera Kinseki Corp | 圧電デバイス |
JP2012084669A (ja) * | 2010-10-08 | 2012-04-26 | Murata Mfg Co Ltd | 電子部品装置及びその製造方法 |
JP2015115403A (ja) * | 2013-12-10 | 2015-06-22 | 日本特殊陶業株式会社 | パッケージ |
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JP4587726B2 (ja) | 2010-11-24 |
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