JP2006004928A - スタッドバンプソケット - Google Patents
スタッドバンプソケット Download PDFInfo
- Publication number
- JP2006004928A JP2006004928A JP2005173143A JP2005173143A JP2006004928A JP 2006004928 A JP2006004928 A JP 2006004928A JP 2005173143 A JP2005173143 A JP 2005173143A JP 2005173143 A JP2005173143 A JP 2005173143A JP 2006004928 A JP2006004928 A JP 2006004928A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- stud bump
- side wall
- contact
- central chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81052—Detaching bump connectors, e.g. after testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81897—Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
- H01L2224/81898—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
- H01L2224/81899—Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other using resilient parts in the bump connector or in the bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01043—Technetium [Tc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Abstract
【解決手段】スタッドバンプ150は、ベース部151と、これから先端157にかけて延びる細長いボディ152とを含む。ソケット100は、中央室125を取り巻く少なくとも一つの側壁112とこれの上端114に位置した接点構造115とを含む金属フレーム110を含む。接点構造115は、中央室125に連通する開口117を画定する。スタッドバンプ150の先端157が中央室125に挿入されると、スタッドバンプ150のベース部151および細長いボディ152の少なくとも一方が二つ以上の接触点において接点構造115に当接する。
【選択図】図1
Description
Claims (3)
- ソケットであって、該ソケットに搭載されるスタッドバンプを電気的に接続するソケットであり、前記スタッドバンプは、ベース部および前記ベース部から先端にかけて延びた細長いボディを含み、前記ソケットは、中央室を取り巻く少なくとも一つの側壁と該側壁の上端に位置した接点構造とを含む金属フレームを含んで構成され、前記接点構造は前記中央室に連通する開口を画定し、前記スタッドバンプの前記先端が前記中央室に挿入されると、前記スタッドバンプの前記ベース部および前記細長いボディの少なくとも一方が二つ以上の接触点において前記接点構造に当接することを特徴とするソケット。
- 電子デバイスとホストシステムとを含むアセンブリであって、
前記電子デバイスは、スタッドバンプを含み、
前記スタッドバンプは、前記電子デバイスの表面に取り付けられたベース部、前記表面から離れて位置した先端、および前記ベース部から前記先端にかけて延びた細長いボディを含み、
前記ホストシステムは、基板と、当該基板の表面に設けられたソケットとを含み、
前記ソケットは、金属フレームを含み、
前記金属フレームは、前記基板表面に接続された固定端および前記基板表面から離れて位置した自由端を有する少なくとも一つの側壁であって、細長い中央室を取り巻く少なくとも一つの側壁、および、前記少なくとも一つの側壁の前記自由端に位置した接点構造であって、前記中央室に連通する開口を画定する接点構造を含み、
前記電子デバイスは、前記スタッドバンプの前記先端が前記開口を通って前記ソケットの前記中央室内に挿入されるように、かつ前記ソケットの前記接点構造が二つ以上の接触点において前記スタッドバンプの前記ベース部および前記細長いボディの少なくとも一方に当接するように、前記ホストシステムに接続されることを特徴とするアセンブリ。 - 電子デバイスであって該電子デバイスから延びた複数のスタッドバンプを含む電子デバイスを電気的に接続するソケットアレイであって、前記複数のスタッドバンプは所定のパターンに配列され、前記スタッドバンプの各々はベース部および前記ベース部から先端にかけて延びた細長いボディを含むソケットアレイであって、
基板、および、前記基板の表面に前記所定のパターンで配列された複数のソケットを含んで構成され、
各ソケットは、金属フレームを含んで構成され、
前記金属フレームは、前記基板表面に接続された固定端および前記基板表面から離れて位置した自由端を有する少なくとも一つの側壁であって、細長い中央室を取り巻く少なくとも一つの側壁、および、前記少なくとも一つの側壁の前記自由端に位置した接点構造であって、前記中央室に連通する開口を画定する接点構造を含み、
前記ソケットアレイの各ソケットは、対応するスタッドバンプの前記先端が該ソケットの中央室に挿入されると、前記対応するスタッドバンプの前記ベース部および前記細長いボディの少なくとも一方が二つ以上の接触点で前記接点構造に当接するように、構成されることを特徴とするソケットアレイ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/871,330 | 2004-06-18 | ||
US10/871,330 US7118389B2 (en) | 2004-06-18 | 2004-06-18 | Stud bump socket |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006004928A true JP2006004928A (ja) | 2006-01-05 |
JP4728707B2 JP4728707B2 (ja) | 2011-07-20 |
Family
ID=35481191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005173143A Expired - Fee Related JP4728707B2 (ja) | 2004-06-18 | 2005-06-14 | スタッドバンプソケット |
Country Status (3)
Country | Link |
---|---|
US (1) | US7118389B2 (ja) |
JP (1) | JP4728707B2 (ja) |
CN (1) | CN1722535B (ja) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7771803B2 (en) * | 2004-10-27 | 2010-08-10 | Palo Alto Research Center Incorporated | Oblique parts or surfaces |
US7288327B2 (en) * | 2004-12-16 | 2007-10-30 | Xerox Corporation | Plated structures or components |
JP4710627B2 (ja) * | 2006-01-26 | 2011-06-29 | パナソニック電工株式会社 | 基板間接続コネクタ |
US7452214B2 (en) * | 2006-12-08 | 2008-11-18 | Verigy (Singapore) Pte. Ltd. | Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads |
CN201097291Y (zh) * | 2007-08-28 | 2008-08-06 | 鸿富锦精密工业(深圳)有限公司 | 数据存取器收容空间的遮蔽装置 |
JP5082924B2 (ja) * | 2008-02-27 | 2012-11-28 | 富士通株式会社 | 可動型コネクタ |
US8552464B2 (en) * | 2008-04-12 | 2013-10-08 | Long-Sheng Fan | CMOS-compatible movable microstructure based devices |
US7821107B2 (en) | 2008-04-22 | 2010-10-26 | Micron Technology, Inc. | Die stacking with an annular via having a recessed socket |
US7872332B2 (en) * | 2008-09-11 | 2011-01-18 | Micron Technology, Inc. | Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
TWI455263B (zh) * | 2009-02-16 | 2014-10-01 | Ind Tech Res Inst | 晶片封裝結構及晶片封裝方法 |
EP2261965A1 (en) * | 2009-06-12 | 2010-12-15 | Nxp B.V. | Crimp bump interconnection |
US8143704B2 (en) * | 2009-10-02 | 2012-03-27 | Texas Instruments Incorporated | Electronic assemblies including mechanically secured protruding bonding conductor joints |
TWI534432B (zh) * | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
FR2967296B1 (fr) * | 2010-11-05 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Elements de connexion pour l'hybridation de circuits electroniques |
WO2013136896A1 (ja) * | 2012-03-15 | 2013-09-19 | 富士電機株式会社 | 半導体装置およびその製造方法 |
JPWO2014033977A1 (ja) * | 2012-08-29 | 2016-08-08 | パナソニックIpマネジメント株式会社 | 半導体装置 |
TWM494399U (zh) * | 2014-04-02 | 2015-01-21 | Hon Hai Prec Ind Co Ltd | 電連接器 |
JP6660687B2 (ja) * | 2015-07-30 | 2020-03-11 | シチズン電子株式会社 | 半導体素子および発光装置 |
FR3041625B1 (fr) * | 2015-09-29 | 2021-07-30 | Tronics Microsystems | Dispositif de fixation de deux elements tels qu'une puce, un interposeur et un support |
KR101806472B1 (ko) * | 2015-12-29 | 2017-12-07 | 주식회사 오킨스전자 | 와이어 실리콘 고무가 콘택 핀과 반도체 기기 사이에 인터포저 되는 번인 테스트 소켓 |
US9754914B1 (en) * | 2016-05-10 | 2017-09-05 | Rosemount Aerospace Inc. | Method to provide die attach stress relief using gold stud bumps |
TWI644408B (zh) * | 2016-12-05 | 2018-12-11 | 美商美光科技公司 | 中介層及半導體封裝體 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5273395A (en) * | 1975-12-17 | 1977-06-20 | Seiko Epson Corp | Connector |
JPH11185913A (ja) * | 1997-12-25 | 1999-07-09 | Nec Corp | Bgaパッケージ用ソケット |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59230741A (ja) * | 1983-06-15 | 1984-12-25 | 株式会社日立製作所 | 形状記憶複合材料 |
US5615824A (en) * | 1994-06-07 | 1997-04-01 | Tessera, Inc. | Soldering with resilient contacts |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US6200143B1 (en) * | 1998-01-09 | 2001-03-13 | Tessera, Inc. | Low insertion force connector for microelectronic elements |
JPH11326379A (ja) * | 1998-03-12 | 1999-11-26 | Fujitsu Ltd | 電子部品用コンタクタ及びその製造方法及びコンタクタ製造装置 |
JP3440243B2 (ja) * | 2000-09-26 | 2003-08-25 | 株式会社アドバンストシステムズジャパン | スパイラルコンタクタ |
JP2004119275A (ja) * | 2002-09-27 | 2004-04-15 | Alps Electric Co Ltd | コネクタ装置 |
-
2004
- 2004-06-18 US US10/871,330 patent/US7118389B2/en not_active Expired - Fee Related
-
2005
- 2005-06-14 JP JP2005173143A patent/JP4728707B2/ja not_active Expired - Fee Related
- 2005-06-17 CN CN2005100785563A patent/CN1722535B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5273395A (en) * | 1975-12-17 | 1977-06-20 | Seiko Epson Corp | Connector |
JPH11185913A (ja) * | 1997-12-25 | 1999-07-09 | Nec Corp | Bgaパッケージ用ソケット |
Also Published As
Publication number | Publication date |
---|---|
US20050282411A1 (en) | 2005-12-22 |
JP4728707B2 (ja) | 2011-07-20 |
CN1722535A (zh) | 2006-01-18 |
US7118389B2 (en) | 2006-10-10 |
CN1722535B (zh) | 2010-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4728707B2 (ja) | スタッドバンプソケット | |
US7202677B2 (en) | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component | |
US6741085B1 (en) | Contact carriers (tiles) for populating larger substrates with spring contacts | |
US7317322B2 (en) | Interconnect for bumped semiconductor components | |
JP5306224B2 (ja) | コンプライアンスを有するマイクロ電子アセンブリ及びそのための方法 | |
US7059047B2 (en) | Sockets for “springed” semiconductor devices | |
US6016060A (en) | Method, apparatus and system for testing bumped semiconductor components | |
US7048548B2 (en) | Interconnect for microelectronic structures with enhanced spring characteristics | |
EP1523229B1 (en) | Semiconductor exercising apparatus, test socket apparatus and method of making thereof | |
US6586955B2 (en) | Methods and structures for electronic probing arrays | |
US6246247B1 (en) | Probe card assembly and kit, and methods of using same | |
US5962921A (en) | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | |
US8207604B2 (en) | Microelectronic package comprising offset conductive posts on compliant layer | |
JP3939467B2 (ja) | 半導体アセンブリ | |
US5974662A (en) | Method of planarizing tips of probe elements of a probe card assembly | |
US6437591B1 (en) | Test interconnect for bumped semiconductor components and method of fabrication | |
EP0886894B1 (en) | Contact carriers for populating substrates with spring contacts | |
US6400034B1 (en) | Semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080609 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100706 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101004 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110415 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140422 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |