JP2005291854A - 半導体装置、及びその電気的検査方法、並びにそれを備えた電子機器 - Google Patents
半導体装置、及びその電気的検査方法、並びにそれを備えた電子機器 Download PDFInfo
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- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
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- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Semiconductor Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Abstract
【解決手段】 LSIチップ3に電圧VGLを供給するためのVGL用配線として、LSIチップに直接接続された配線L1と、LSIチップ3には直接に接続されることなく電圧VGH用の配線l2との間に設けられたコンデンサC1の一方の電極に接続された配線LB1とが設けられ、配線L1と配線LB1には電圧入力端子が別々に設けられている。
【選択図】 図1
Description
3 LSIチップ(半導体チップ)
5 配線パターン
GD ゲートドライバ(半導体装置)
SD ソースドライバ(半導体装置)
30 液晶表示装置(電子機器)
L1〜L5 配線(直接配線)
L9 配線(直接配線)
LB1〜LB9 配線(バイパス用配線)
C1〜C5 コンデンサ
C11〜C15 コンデンサ
Claims (10)
- 半導体チップを搭載するテープキャリアに、上記半導体チップに第1電源電圧を供給するための第1電源電圧用配線と、上記半導体チップに第2電源電圧を供給するための第2電源電圧用配線とが設けられ、これら第1電源電圧用配線と第2電源電圧用配線との間にコンデンサが設けられている半導体装置において、
上記第1電源電圧用配線が、上記半導体チップとは直接に接続されることなく上記コンデンサの一方の電極に接続されたバイパス用配線と、上記半導体チップに直接接続された直接配線とを備え、これらバイパス用配線と直線配線のそれぞれに電圧入力端子が設けられていることを特徴とする半導体装置。 - 電気的選別テスト時、上記第1電源電圧用配線のバイパス用配線がオープンとなり、上記第1電源電圧用配線の直接配線に第1電源電圧が印加され、第2電源電圧用配線に第2電源電圧が印加されるようになっていることを特徴とする請求項1に記載の半導体装置。
- 通常動作時、上記第1電源電圧用配線におけるバイパス用配線と直接配線とには第1電源電圧が印加されるようになっていることを特徴とする請求項1に記載の半導体装置。
- 請求項1に記載の半導体装置の電気的検査方法であって、
第1電源電圧用配線のバイパス用配線をオープンとした状態で、第1電源電圧用配線の直接配線より第1電源電圧を半導体チップに供給し、第2電源電圧用配線より第2電源電圧を半導体チップに供給することを特徴とする半導体装置の電気的検査方法。 - 請求項1に記載の半導体装置が搭載されてなる電子機器であって、
上記半導体装置における上記第1電源電圧用配線のバイパス用配線と直接配線とには第1電源電圧が印加されるようになっていることを特徴とする電子機器。 - 半導体チップを搭載するテープキャリアに、上記半導体チップに第1電源電圧を供給するための第1電源電圧用配線と、上記半導体チップに第2電源電圧を供給するための第2電源電圧用配線と、第3電源電圧を供給するための第3電源電圧用配線とが設けられ、これら第1電源電圧用配線と第2電源電圧用配線との間、及び第2電源電圧用配線と第3電源電圧用配線との間に、コンデンサがそれぞれ設けられている半導体装置において、
上記第1電源電圧用配線が、上記半導体チップとは直接に接続されることなく、上記第2電源電圧用配線との間に配された上記コンデンサの一方の電極に接続されたバイパス用配線と、上記半導体チップに直接接続された直接配線とを備え、これらバイパス用配線と直線配線のそれぞれに電圧入力端子が設けられる一方、
上記第2電源電圧用配線が、上記半導体チップとは直接に接続されることなく、上記第3電源電圧用配線との間に配された上記コンデンサの一方の電極に接続されたバイパス用配線と、上記半導体チップに直接接続されると共に上記第1電源電圧用配線との間に配された上記コンデンサの一方の電極にも接続された直接配線とを備え、これらバイパス用配線と直線配線のそれぞれにも電圧入力端子が設けられていることを特徴とする半導体装置。 - 電気的選別テスト時、上記第1電源電圧用配線及び第2電源電圧用配線の各バイパス用配線がオープンとなり、上記第1電源電圧用配線の直接配線に第1電源電圧が印加され、上記第2電源電圧用配線の直接配線に第2電源電圧が印加され、第3電源電圧用配線に第3電源電圧が印加されるようになっていることを特徴とする請求項6に記載の半導体装置。
- 通常動作時、上記第1電源電圧用配線におけるバイパス用配線と直接配線とには第1電源電圧が印加され、上記第2電源電圧用配線におけるバイパス用配線と直接配線とには第2電源電圧が印加されるようになっていることを特徴とする請求項6に記載の半導体装置。
- 請求項6に記載の半導体装置の電気的検査方法であって、
第1電源電圧用配線及び第2電源電圧用配線の各バイパス用配線をオープンとした状態で、第1電源電圧用配線の直接配線より第1電源電圧を半導体チップに供給し、第2電源電圧用配線の直接配線より第2電源電圧を半導体チップに供給し、第3電源電圧用配線より第3電源電圧を半導体チップに供給することを特徴とする半導体装置の電気的検査方法。 - 請求項6に記載の半導体装置が搭載されてなる電子機器であって、
上記半導体装置における上記第1電源電圧用配線のバイパス用配線と直接配線とには第1電源電圧が印加され、上記第2電源電圧用配線のバイパス用配線と直接配線とには第2電源電圧が印加されるようになっていることを特徴とする電子機器。
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JP2004105765A JP3943096B2 (ja) | 2004-03-31 | 2004-03-31 | 半導体装置、及びその電気的検査方法、並びにそれを備えた電子機器 |
US11/091,851 US7122888B2 (en) | 2004-03-31 | 2005-03-29 | Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device |
KR1020050026417A KR100655341B1 (ko) | 2004-03-31 | 2005-03-30 | 반도체 장치, 및 그 전기적 검사 방법, 및 그것을 포함한 전자 기기 |
TW094110034A TWI271828B (en) | 2004-03-31 | 2005-03-30 | Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device |
CNB2005100629739A CN100364043C (zh) | 2004-03-31 | 2005-03-31 | 半导体装置、其电检查方法、以及具备它的电子设备 |
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JP2004105765A JP3943096B2 (ja) | 2004-03-31 | 2004-03-31 | 半導体装置、及びその電気的検査方法、並びにそれを備えた電子機器 |
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JP (1) | JP3943096B2 (ja) |
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KR100652519B1 (ko) | 2005-07-18 | 2006-12-01 | 삼성전자주식회사 | 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지 |
KR101535223B1 (ko) | 2008-08-18 | 2015-07-09 | 삼성전자주식회사 | 테이프 배선 기판, 칩-온-필름 패키지 및 장치 어셈블리 |
TWI383235B (zh) * | 2009-03-26 | 2013-01-21 | Chunghwa Picture Tubes Ltd | 主動元件陣列基板 |
JP2011086880A (ja) * | 2009-10-19 | 2011-04-28 | Advantest Corp | 電子部品実装装置および電子部品の実装方法 |
JP2012026845A (ja) * | 2010-07-22 | 2012-02-09 | Sony Corp | 半導体装置、および、積層半導体装置 |
KR101891163B1 (ko) * | 2012-04-04 | 2018-08-24 | 에스케이하이닉스 주식회사 | 테스트 회로 및 이를 포함하는 반도체 장치 |
US20130292819A1 (en) * | 2012-05-07 | 2013-11-07 | Novatek Microelectronics Corp. | Chip-on-film device |
TWI467719B (zh) * | 2012-05-07 | 2015-01-01 | Novatek Microelectronics Corp | 薄膜覆晶裝置 |
CN105493341A (zh) * | 2013-09-02 | 2016-04-13 | 株式会社村田制作所 | 隔离器 |
CN104465432A (zh) * | 2013-09-23 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | 监测寄生电容的结构 |
CN105655298A (zh) * | 2016-01-05 | 2016-06-08 | 深圳市华星光电技术有限公司 | 一种tft液晶显示模组及其封装结构和封装方法 |
TWI744575B (zh) * | 2018-05-11 | 2021-11-01 | 瑞鼎科技股份有限公司 | 應用於顯示器之驅動裝置的封裝結構 |
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FR2550009B1 (fr) * | 1983-07-29 | 1986-01-24 | Inf Milit Spatiale Aeronaut | Boitier de composant electronique muni d'un condensateur |
US5028983A (en) * | 1988-10-28 | 1991-07-02 | International Business Machines Corporation | Multilevel integrated circuit packaging structures |
US5212402A (en) * | 1992-02-14 | 1993-05-18 | Motorola, Inc. | Semiconductor device with integral decoupling capacitor |
JP3214742B2 (ja) * | 1992-11-09 | 2001-10-02 | 大日本印刷株式会社 | 液晶表示装置 |
US5444298A (en) * | 1993-02-04 | 1995-08-22 | Intel Corporation | Voltage converting integrated circuit package |
JPH06334105A (ja) * | 1993-05-24 | 1994-12-02 | Shinko Electric Ind Co Ltd | 多層リードフレーム |
JP2806774B2 (ja) | 1993-12-02 | 1998-09-30 | 日本電気株式会社 | 半導体装置 |
JPH09160674A (ja) * | 1995-12-05 | 1997-06-20 | Hitachi Ltd | 情報処理装置 |
CN1143373C (zh) * | 1998-07-01 | 2004-03-24 | 精工爱普生株式会社 | 半导体装置及其制造方法、电路基板和电子装置 |
US6400576B1 (en) * | 1999-04-05 | 2002-06-04 | Sun Microsystems, Inc. | Sub-package bypass capacitor mounting for an array packaged integrated circuit |
JP3494940B2 (ja) | 1999-12-20 | 2004-02-09 | シャープ株式会社 | テープキャリア型半導体装置、その製造方法及びそれを用いた液晶モジュール |
US6320757B1 (en) * | 2000-07-12 | 2001-11-20 | Advanced Semiconductor Engineering, Inc. | Electronic package |
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KR100655341B1 (ko) | 2006-12-08 |
CN100364043C (zh) | 2008-01-23 |
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JP3943096B2 (ja) | 2007-07-11 |
CN1677614A (zh) | 2005-10-05 |
US7122888B2 (en) | 2006-10-17 |
TW200603347A (en) | 2006-01-16 |
US20050218512A1 (en) | 2005-10-06 |
TWI271828B (en) | 2007-01-21 |
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