JP2005033122A - 光半導体装置 - Google Patents
光半導体装置 Download PDFInfo
- Publication number
- JP2005033122A JP2005033122A JP2003273295A JP2003273295A JP2005033122A JP 2005033122 A JP2005033122 A JP 2005033122A JP 2003273295 A JP2003273295 A JP 2003273295A JP 2003273295 A JP2003273295 A JP 2003273295A JP 2005033122 A JP2005033122 A JP 2005033122A
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- JP
- Japan
- Prior art keywords
- light
- optical semiconductor
- light reflecting
- semiconductor device
- reflecting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- Led Device Packages (AREA)
Abstract
【解決手段】放射状に光を発し、かつ厚み方向に延びる中心軸Cに対して傾斜した方向に進行する光が最も高い光度となる光度分布をもつLEDチップ3と、LEDチップ3を中心軸C廻りに囲む第1および第2の光反射面50a,50bを有するリフレクタ5と、を備えている光半導体装置A1であって、第2の光反射面50bは、LEDチップ3から発せられた光のうち、最も高い光度の光L1bを遮らない高さとされている。
【選択図】 図2
Description
C 中心軸
L,L1a,L1b 光
1 基板
3 LEDチップ(光半導体チップ)
5 リフレクタ
50a 第1の光反射面
50b 第2の光反射面
6 透光部材
Claims (3)
- 放射状に光を発し、かつ厚み方向に延びる中心軸に対して傾斜した方向に進行する光が最も高い光度となる光度分布をもつ光半導体チップと、
上記光半導体チップを上記中心軸廻りに囲む光反射面を有するリフレクタと、
を備えている光半導体装置であって、
上記リフレクタの少なくとも一部は、上記光半導体チップから発せられた光のうち、最も高い光度の光を遮らない高さとされていることを特徴とする、光半導体装置。 - 上記リフレクタは、上記中心軸に直交し、かつ互いに直交する二方向おいて、上記光半導体チップを挟んで互いに対向する一対ずつの第1および第2の光反射面を備えており、かつ上記各第2の光反射面の方が上記各第1の光反射面よりも長くされた長矩形の枠状であって、
上記第2の光反射面は、上記第1の光反射面よりも低くかつ上記最も高い光度の光を遮らない高さとされている、請求項1に記載の光半導体装置。 - 上記光半導体チップおよび上記リフレクタを搭載している基板を備えており、かつこの基板には、上記光半導体チップの複数の電極に電気的に接続された複数の端子が設けられている、請求項1または2に記載の光半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003273295A JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003273295A JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005033122A true JP2005033122A (ja) | 2005-02-03 |
JP4327526B2 JP4327526B2 (ja) | 2009-09-09 |
Family
ID=34210576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003273295A Expired - Fee Related JP4327526B2 (ja) | 2003-07-11 | 2003-07-11 | 光半導体装置 |
Country Status (1)
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JP (1) | JP4327526B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100637476B1 (ko) | 2005-11-09 | 2006-10-23 | 알티전자 주식회사 | 측면발광 다이오드 및 그 제조방법 |
JP2006351708A (ja) * | 2005-06-14 | 2006-12-28 | Toyoda Gosei Co Ltd | 発光ダイオードランプ及び光源装置 |
WO2014194044A1 (en) * | 2013-05-29 | 2014-12-04 | Venntis Technologies LLC | Volumetric light emitting device |
-
2003
- 2003-07-11 JP JP2003273295A patent/JP4327526B2/ja not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006351708A (ja) * | 2005-06-14 | 2006-12-28 | Toyoda Gosei Co Ltd | 発光ダイオードランプ及び光源装置 |
KR100637476B1 (ko) | 2005-11-09 | 2006-10-23 | 알티전자 주식회사 | 측면발광 다이오드 및 그 제조방법 |
WO2007055486A1 (en) * | 2005-11-09 | 2007-05-18 | Alti-Electronics Co., Ltd. | Led of side view type and the method for manufacturing the same |
US7598101B2 (en) | 2005-11-09 | 2009-10-06 | Alti-Electronics Co., Ltd. | LED of side view type and the method for manufacturing the same |
WO2014194044A1 (en) * | 2013-05-29 | 2014-12-04 | Venntis Technologies LLC | Volumetric light emitting device |
US9041286B2 (en) | 2013-05-29 | 2015-05-26 | Venntis Technologies LLC | Volumetric light emitting device |
Also Published As
Publication number | Publication date |
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JP4327526B2 (ja) | 2009-09-09 |
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