JP2004090636A - インクジェットプリントヘッド及びその製造方法 - Google Patents
インクジェットプリントヘッド及びその製造方法 Download PDFInfo
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- JP2004090636A JP2004090636A JP2003284258A JP2003284258A JP2004090636A JP 2004090636 A JP2004090636 A JP 2004090636A JP 2003284258 A JP2003284258 A JP 2003284258A JP 2003284258 A JP2003284258 A JP 2003284258A JP 2004090636 A JP2004090636 A JP 2004090636A
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 claims abstract description 42
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 33
- 239000012790 adhesive layer Substances 0.000 claims description 32
- 239000004642 Polyimide Substances 0.000 claims description 27
- 239000011247 coating layer Substances 0.000 claims description 27
- 229920001721 polyimide Polymers 0.000 claims description 27
- 229910004541 SiN Inorganic materials 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 18
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 18
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000002161 passivation Methods 0.000 claims description 10
- 239000002210 silicon-based material Substances 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 2
- 238000007641 inkjet printing Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- -1 for example Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
- B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
- B41J2/235—Print head assemblies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
【解決手段】 インクチャンバ210及びインクチャンバ210で連結される流路を提供する流路板200と,インクチャンバ210に対応するオリフィス310が形成されたノズル板300とを備え,流路板200とノズル板300はフォトレジストで形成され,流路板200とノズル板300との間には流路板200の工程限界温度以下の工程温度で形成可能なシリコン系の低温蒸着化合物による接着層211が形成されている構造物を有するインクジェットプリントヘッドを提供する。接着層211は流路板200とノズル板300との接着力を確固とし,特にインクチャンバ210の内部にも形成されてインクチャンバ210の内部をインクから保護する。
【選択図】 図3
Description
101 パッシベーション層
102 ヒータ
200 流路板
210 インクチャンバ
211 接着層
300 ノズル板
310 オリフィス
Claims (16)
- インクチャンバ及び前記インクチャンバに連結される流路を提供する流路板と,
前記インクチャンバに対応するオリフィスが形成されたノズル板とを備え,
前記流路板と前記ノズル板とはフォトレジストで形成され,
前記流路板と前記ノズル板との間には前記流路板の性質により制限される工程限界温度以下の工程温度で形成可能なシリコン系の低温蒸着化合物による接着層が形成されていることを特徴とするインクジェットプリントヘッド。 - 前記流路板及び前記ノズル板はポリイミドで形成されることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記接着層はSiN,SiO2,又はSiONのうちいずれか一つの物質で形成されることを特徴とする請求項1または2に記載のインクジェットプリントヘッド。
- 前記接着層はPECVDにより形成されることを特徴とする請求項3に記載のインクジェットプリントヘッド。
- 前記ノズル板の表面にシリコン系の低温蒸着化合物によりコーティング層が形成されていることを特徴とする請求項1〜4のいずれか一つの項に記載のインクジェットプリントヘッド。
- 前記コーティング層はSiN,SiO2,又はSiONのうちいずれか一つの物質で形成されることを特徴とする請求項5に記載のインクジェットプリントヘッド。
- 前記コーティング層は前記インクチャンバの底に延びて形成されていることを特徴とする請求項5または6に記載のインクジェットプリントヘッド。
- a)ヒータ及び前記ヒータを保護するパッシベーション層がその表面に形成された基板を準備する段階と,
b)前記基板上に前記ヒータに対応するインクチャンバ及び前記インクチャンバに連結される流路が設けられた流路板を第1フォトレジストで形成する段階と,
c)前記流路板の表面に低温蒸着シリコン系の物質による接着層を形成する段階と,
d)前記インクチャンバ及び前記流路を第2フォトレジストで充填する段階と,
e)前記流路板上にノズル板を第3フォトレジストで形成する段階と,
f)前記ノズル板に前記インクチャンバに対応するオリフィスを形成する段階と,
g)ウェットエッチングにより前記インクチャンバ内の前記第2フォトレジストを除去する段階とを含むことを特徴とするインクジェットプリントヘッドの製造方法。 - 前記第1フォトレジスト及び前記第3フォトレジストはポリイミドであることを特徴とする請求項8に記載のインクジェットプリントヘッドの製造方法。
- 前記接着層はSiO2,SiN又はSiONのうちいずれか一つの物質で形成されることを特徴とする請求項8または9に記載のインクジェットプリントヘッドの製造方法。
- 前記段階d)は第2フォトレジストの全面コーティング段階と,
前記インクチャンバ内にのみフォトレジストを残留させるためのエッチバック段階とを含むことを特徴とする請求項8〜10のいずれか一つの項に記載のインクジェットプリントヘッドの製造方法。 - 前記SiO2,SiN又はSiONをPECVD法により蒸着することを特徴とする請求項10に記載のインクジェットプリントヘッドの製造方法。
- 前記段階f)と前記段階g)との間に前記インクチャンバ内に存在する前記第2フォトレジストを高温加熱によりアッシングした後,その残留物をウェットエッチング液によりストリップすることを特徴とする請求項8〜12のいずれか一つの項に記載のインクジェットプリントヘッドの製造方法。
- 前記段階g)以後に低温蒸着シリコン系の物質によりコーティング層を前記ノズル板上に形成することを特徴とする請求項8に記載のインクジェットプリントヘッドの製造方法。
- 前記コーティング層はSiO2,SiN又はSiONのうちいずれか一つの物質で形成されることを特徴とする請求項14に記載のインクジェットプリントヘッドの製造方法。
- 前記コーティング層はPECVD法により形成することを特徴とする請求項14又は請求項15に記載のインクジェットプリントヘッドの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0047211A KR100438733B1 (ko) | 2002-08-09 | 2002-08-09 | 잉크 젯 프린트 헤드 및 이의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004090636A true JP2004090636A (ja) | 2004-03-25 |
JP3967301B2 JP3967301B2 (ja) | 2007-08-29 |
Family
ID=31492861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003284258A Expired - Fee Related JP3967301B2 (ja) | 2002-08-09 | 2003-07-31 | インクジェットプリントヘッド及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6846068B2 (ja) |
JP (1) | JP3967301B2 (ja) |
KR (1) | KR100438733B1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100445004B1 (ko) * | 2002-08-26 | 2004-08-21 | 삼성전자주식회사 | 모노리틱 잉크 젯 프린트 헤드 및 이의 제조 방법 |
US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
KR100570822B1 (ko) * | 2004-05-11 | 2006-04-12 | 삼성전자주식회사 | 잉크젯 헤드의 제조방법 및 그에 의해 제조된 잉크젯 헤드 |
KR100654802B1 (ko) | 2004-12-03 | 2006-12-08 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
JP2006205678A (ja) * | 2005-01-31 | 2006-08-10 | Fuji Photo Film Co Ltd | ノズルプレート製造方法及び液体吐出ヘッド並びにこれを備えた画像形成装置 |
JP4800803B2 (ja) * | 2006-03-08 | 2011-10-26 | 富士フイルム株式会社 | 画像形成装置及び画像形成方法 |
CN102015311B (zh) * | 2008-04-29 | 2015-05-20 | 惠普开发有限公司 | 打印装置 |
US20170072692A1 (en) * | 2014-03-25 | 2017-03-16 | Hewlett-Packard Development Company, L.P. | Print fluid passageway thin film passivation layer |
US9469109B2 (en) | 2014-11-03 | 2016-10-18 | Stmicroelectronics S.R.L. | Microfluid delivery device and method for manufacturing the same |
JP6582803B2 (ja) * | 2015-09-25 | 2019-10-02 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド、および、電子デバイスの製造方法 |
IT201600083000A1 (it) * | 2016-08-05 | 2018-02-05 | St Microelectronics Srl | Dispositivo microfluidico per la spruzzatura termica di un liquido contenente pigmenti e/o aromi con tendenza all'aggregazione o al deposito |
EP3962793A4 (en) | 2019-04-29 | 2023-01-04 | Hewlett-Packard Development Company, L.P. | CORROSION TOLERANT MICROELECTRO-MECHANICAL FLUID EJECTION DEVICE |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4882595A (en) | 1987-10-30 | 1989-11-21 | Hewlett-Packard Company | Hydraulically tuned channel architecture |
JPH02219654A (ja) * | 1989-02-20 | 1990-09-03 | Ricoh Co Ltd | インクジェットヘッド及びその製造方法 |
US5016024A (en) * | 1990-01-09 | 1991-05-14 | Hewlett-Packard Company | Integral ink jet print head |
JP2867602B2 (ja) * | 1990-05-08 | 1999-03-08 | セイコーエプソン株式会社 | プレートの接合方法およびインクジェットヘッドの製造方法 |
US5912685A (en) | 1994-07-29 | 1999-06-15 | Hewlett-Packard Company | Reduced crosstalk inkjet printer printhead |
US5850241A (en) * | 1995-04-12 | 1998-12-15 | Eastman Kodak Company | Monolithic print head structure and a manufacturing process therefor using anisotropic wet etching |
JPH08300645A (ja) * | 1995-05-10 | 1996-11-19 | Fuji Electric Co Ltd | インクジェット記録ヘッド |
US5883650A (en) * | 1995-12-06 | 1999-03-16 | Hewlett-Packard Company | Thin-film printhead device for an ink-jet printer |
US6154234A (en) * | 1998-01-09 | 2000-11-28 | Hewlett-Packard Company | Monolithic ink jet nozzle formed from an oxide and nitride composition |
US6387719B1 (en) * | 2001-02-28 | 2002-05-14 | Lexmark International, Inc. | Method for improving adhesion |
-
2002
- 2002-08-09 KR KR10-2002-0047211A patent/KR100438733B1/ko not_active IP Right Cessation
-
2003
- 2003-04-16 US US10/414,301 patent/US6846068B2/en not_active Expired - Fee Related
- 2003-07-31 JP JP2003284258A patent/JP3967301B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3967301B2 (ja) | 2007-08-29 |
US6846068B2 (en) | 2005-01-25 |
US20040027424A1 (en) | 2004-02-12 |
KR100438733B1 (ko) | 2004-07-05 |
KR20040014045A (ko) | 2004-02-14 |
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